CN118102145A

CN118102145A - Optical module, control method of optical module and optical communication equipment

Info

Publication number: CN118102145A
Application number: CN202211490546.0A
Authority: CN
Inventors: 陈冠儒; 郭珊山; 任正良
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2024-05-28

Abstract

The application provides an optical module, a control method of the optical module and optical communication equipment, wherein the temperature of an optical chip is reflected by multiplexing the measured resistance value of a heating resistor, so that the accurate temperature control of the optical chip can be realized. The optical module comprises a heating resistor, a first resistor, an optical chip, a lifting pressure module and a control module, wherein the heating resistor is integrated on the optical chip, the first resistor, the optical chip and the lifting pressure module are connected in series, and the control module is electrically connected with the first resistor and the lifting pressure module, and the method comprises the following steps: the control module obtains the resistance value of the heating resistor through the voltage of the first resistor; the control module compares the resistance value of the heating resistor with a first range, determines whether to adjust the output voltage of the buck-boost module according to the comparison result, wherein the first range is determined according to the working wavelength of the optical chip, namely the measured resistance value of the heating resistor is multiplexed to control the heating value of the heating resistor, so that the temperature of the optical chip is controlled.

Description

Optical module, control method of optical module and optical communication equipment

Technical Field

The present application relates to the field of optical communications, and in particular, to an optical module, a control method of the optical module, and an optical communication device.

Background

Semiconductor refrigerators (thermo electric cooler, TEC) are components that operate using the peltier effect of semiconductor materials and can generate heat, and are therefore used less commonly as temperature control elements for optical devices where precise wavelength control is required. However, TEC is costly and eliminating TEC is known as an effective means of cost reduction. However, the transceiving wavelength of the optical chip is related to the temperature, so that the temperature of the optical chip needs to be known to realize accurate monitoring of the transceiving wavelength of the optical chip. Therefore, how to realize accurate temperature measurement of the optical device after removing the TEC becomes a problem to be solved.

Disclosure of Invention

The application provides an optical module, a control method of the optical module and optical communication equipment, wherein the temperature of an optical chip is reflected by multiplexing the measured resistance value of a heating resistor, so that the accurate temperature control of the optical chip can be realized.

In view of this, in a first aspect, the present application provides a control method of an optical module, where the optical module includes a heating resistor, a first resistor, an optical chip, a buck-boost module, and a control module, the heating resistor is integrated in the optical chip, the first resistor, the heating resistor and the buck-boost module are electrically connected, and specifically may include connection in series, parallel, or a combination of series and parallel, and the control module is electrically connected with the first resistor and the buck-boost module, and the method includes: the control module obtains the resistance value of the heating resistor through the voltage of the first resistor, wherein the resistance value of the heating resistor is related to the working wavelength of the optical chip; the control module compares the resistance value of the heating resistor with a first range, and determines whether to adjust the output voltage of the buck-boost module according to the comparison result, wherein the first range is determined according to the working wavelength of the optical chip, for example, the working wavelength of the optical chip is generally related to temperature, and the resistance value of the heating resistor is related to temperature, so that after the working wavelength of the optical chip is determined, the corresponding temperature range can be determined, and the temperature range in which the resistance value of the heating resistor needs to be maintained can be determined according to the temperature range and the relation between the resistance value of the heating resistor and the temperature.

In the embodiment of the application, the control module can calculate the resistance value of the heating resistor by reading the voltage value of the series resistor, and the resistance value of the heating resistor can reflect the temperature condition of the optical chip, so that whether the voltage value of the input voltage of the optical chip is regulated by controlling the voltage-increasing and decreasing chip based on the resistance value of the heating resistor can be determined, thereby regulating the heating value of the heating resistor, further controlling the temperature of the optical chip, namely realizing the temperature control of the optical chip by multiplexing devices in the optical module, avoiding the need of arranging additional temperature measuring devices and reducing the realization cost of the temperature-controllable optical module.

In one possible implementation manner, the determining whether to adjust the output voltage of the buck-boost module according to the comparison result may include: if the resistance of the heating resistor is smaller than the first range, the control module controls the voltage-boosting module to increase the value of the output voltage; and if the resistance value of the heating resistor is larger than the first range, the control module controls the voltage boosting and reducing module to reduce the value of the output voltage. In the embodiment of the application, when the value of the heating resistor is small, the corresponding temperature is low, and the voltage value of the output voltage of the voltage boosting and reducing module can be increased, so that the heating value of the heating resistor is increased, and the temperature of the optical chip is increased.

In one possible implementation manner, the optical module further comprises a shell temperature sensor, the shell is arranged outside the optical module, the shell temperature sensor is connected with the shell through a heat conducting material, and the shell temperature sensor is used for detecting the temperature of the shell; before the control module obtains the resistance value of the heating resistor, the method provided by the application can further comprise the following steps: the control module acquires a temperature value detected by the shell temperature sensor; and if the temperature value detected by the shell temperature sensor is lower than the second range, the control module controls the starting of the heating resistor.

In the embodiment of the application, when the shell temperature sensor is arranged, before the temperature of the optical chip is controlled, whether the heating resistor is started or not can be judged by the temperature detected by the shell temperature sensor. When the temperature of the shell is high, the temperature of the optical module is high, and at the moment, a heating resistor is not required to be started for heating; when the temperature of the shell is low, the temperature of the optical module is low, and the heating resistor can be started to heat at the moment, so that the temperature of the optical chip is increased. Therefore, when the temperature is in a high-temperature scene, the heating resistor is not required to be directly started, the energy can be saved, and the efficiency of controlling the temperature of the optical chip is improved.

In a possible implementation manner, the optical module may further include a second resistor, the second resistor is connected with the first resistor through a switch, a resistance value of the second resistor is greater than a resistance value of the first resistor, and the first resistor works after the optical module is powered on, and the method provided by the present application may further include: the control module calculates and obtains the temperature value of the optical chip according to the resistance value of the heating resistor; and if the temperature value of the optical chip is higher than the first threshold value, the control module controls the switch to switch and start the second resistor, and the second resistor is used as a new first resistor to work.

In the embodiment of the application, when the temperature is too high, the resistance value of the heating resistor is too high, the output voltage of the buck-boost module is too small at the moment, and the second resistor with larger starting resistance value can be switched at the moment, so that the voltage acquisition precision can be improved.

In one possible implementation manner, the aforementioned control module obtains the resistance value of the heating resistor through the voltage of the first resistor, and includes: the control module reads the voltage value of the first resistor and acquires a current value according to the voltage of the first resistor; the control module combines the voltage value and the current value of the voltage source of the optical chip to obtain the resistance value of the heating resistor.

In the embodiment of the application, after the voltage value of the series resistor is read, the current value of the circuit can be calculated according to the voltage value and the resistance value of the series resistor, and the resistance value of the heating resistor is calculated according to the current value and the input voltage of the optical module, for example, the resistance value of the heating resistor can be obtained by subtracting the load occupied by other elements after the load of the whole optical module is calculated, so that the temperature of the optical chip is reflected by the resistance value of the heating resistor.

In a second aspect, the present application provides an optical module comprising:

The optical chip comprises a heating resistor, a first resistor, an optical chip, a lifting pressure module and a control module;

the heating resistor is integrated on the optical chip, the first resistor and the heating resistor are electrically connected with the lifting pressure module, the control module is electrically connected with the first resistor and the lifting pressure module, the heating resistor is used for heating, and the lifting pressure module uses the voltage value of the voltage which is regulated and input to the optical module;

The control module is used for obtaining the resistance value of the heating resistor through the voltage of the first resistor, wherein the resistance value of the heating resistor is related to the working wavelength of the optical chip;

The control module is also used for comparing the resistance value of the heating resistor with a first range, determining whether to adjust the output voltage of the buck-boost module according to the comparison result, and determining the first range according to the working wavelength of the optical chip.

In one possible implementation, the control module is specifically configured to: if the resistance of the heating resistor is smaller than the first range, controlling the voltage-boosting module to increase the value of the output voltage; and if the resistance value of the heating resistor is larger than the first range, controlling the voltage boosting and reducing module to reduce the value of the output voltage.

In one possible implementation manner, the optical module may further include a shell temperature sensor, wherein the shell is further arranged outside the optical module, the shell temperature sensor is connected with the shell through a heat conducting material, and the shell temperature sensor is used for detecting the temperature of the shell;

the control module may also be configured to: before the control module obtains the resistance value of the heating resistor, obtaining the temperature value detected by the shell temperature sensor; and if the temperature value detected by the shell temperature sensor is lower than the second range, controlling to start the heating resistor.

In one possible implementation manner, the optical module further comprises a second resistor, the second resistor is connected with the first resistor through a switch, and the first resistor works after the optical module is powered on;

The control module may also be configured to: calculating according to the resistance value of the heating resistor to obtain the temperature value of the optical chip; and if the temperature value of the optical chip is higher than the first threshold value, the control switch switches and starts the second resistor, and the second resistor is used as a new first resistor to work.

In one possible implementation, the control module may be specifically configured to: reading the voltage value of the first resistor, and acquiring a current value according to the voltage value of the first resistor; and combining the voltage value and the current value of the voltage source of the optical chip to obtain the resistance value of the heating resistor.

In a third aspect, the present application provides an optical communication device, which may comprise a printed circuit board (Printed Circuit Board, PCB) input interface, an output interface and an optical module, the input interface and the output interface and the optical module being fixed on the PCB, the optical module may comprise an optical module as in the foregoing second aspect or any optional embodiment of the second aspect.

In a fourth aspect, the present application provides an optical communication system, which may comprise an optical communication device as in the third aspect. In addition, the optical communication system may further include other devices, such as a router or a switch, which is not described in detail in the present application.

In a fifth aspect, embodiments of the present application provide a computer readable storage medium comprising instructions which, when run on a computer, cause the computer to perform the method of the first aspect or any of the alternative embodiments of the first aspect.

In a sixth aspect, embodiments of the present application provide a computer program product comprising instructions which, when run on a computer, cause the computer to perform the method of the first aspect or any of the alternative embodiments of the first aspect.

Drawings

Fig. 1 is a schematic diagram of an optical communication system according to the present application;

fig. 2 is a schematic diagram of another optical communication system according to the present application;

Fig. 3 is a schematic structural diagram of an optical communication device according to the present application;

Fig. 4 is a schematic structural diagram of another optical communication device according to the present application;

fig. 5 is a schematic structural diagram of an optical module provided by the present application;

fig. 6 is a schematic structural diagram of another optical module provided by the present application;

Fig. 7 is a schematic structural diagram of another optical module provided by the present application;

fig. 8 is a schematic flow chart of a control method of an optical module according to the present application;

Fig. 9 is a flow chart of another control method of an optical module provided by the present application.

Detailed Description

The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The present application provides an optical module, an optical communication apparatus, and a control method of the optical module, which can be applied to various optical communication systems, including but not limited to: any one or a combination of a plurality of optical transport networks (optical transport network, OTN), optical access networks (optical access network, OAN), metropolitan area networks (Metropolitan Area Network, MAN), synchronous digital hierarchy (synchronous DIGITAL HIERARCHY, SDH), passive optical networks (passive optical network, PON), ethernet (Ethernet), or flexible Ethernet (flex Ethernet, flexE), wavelength division multiplexing (WAVELENGTH DIVISION MULTIPLEXING, WDM) networks, and the like.

For example, the optical module, the optical communication device, and the method for controlling the optical module provided by the present application may be applied to a PON system, as shown in fig. 1, where the PON system may include an OLT, an ODN, and at least one ONU, and the optical communication device provided by the present application may include the OLT, the ODN, or the ONU as shown in fig. 1.

The ODN may comprise at least one optical splitting device and may further comprise an optical Fiber, in particular, the optical Fiber may further comprise a main Fiber (feed Fiber), a distribution Fiber (distribution Fiber) and a drop Fiber (drop Fiber). The trunk optical fiber, i.e., the optical fiber to which the OLT is connected with the ODN, and the distribution optical fiber and the branching optical fiber may also be referred to as a branch optical fiber. The branching optical fiber is an optical fiber connected between the optical splitting device and the accessed ONU, and the distribution optical fiber is an optical fiber connected between the optical splitting devices in the ODN. And, when only one spectroscopic device is included in the ODN, there is no distribution fiber.

The ONU is configured to receive data sent by the OLT, respond to a management command of the OLT, buffer ethernet data of the user, and send the data in an upstream direction in a sending window allocated by the OLT, and so on. The OLT is configured to provide data to one or more ONUs that are accessed, provide management, and so on. The OLT may be configured to send an optical signal to at least one ONU, receive information fed back by the ONU, and process information fed back by the ONU, or other data, etc.

In addition, the PON system may establish a connection with a network or a device such as a public switched telephone network (public telephone switching network, PTSN), the internet (internet), or cable television (CATV).

The PON may specifically include a Gigabit passive optical network (Gigabit passive optical network, GPON), an Ethernet Passive Optical Network (EPON), a 10G Gigabit passive optical network (10 GGigabit-capable passive optical network, XGPON), a 10G ethernet passive optical network (10G ethernet passive optical network,10G EPON), and the like.

It should be understood that at least one ONU in fig. 1 of the present application may include an optical network terminal (optical network termination, ONT) or a multiplexing unit (MXU), etc., and the at least one ONU may also be replaced by at least one optical network terminal (optical network termination, ONT), or may include both an ONU and an ONT in at least one device that is connected to the ODN.

For another example, the optical module, the optical communication device and the control method of the optical module provided by the application can be applied to a MAN. A MAN is typically interposed between a local area network and a wide area network and covers an area, such as a city, for interconnecting local area networks within the same area. Because of the local area network technology with active exchange element, the transmission delay in the network is small, the transmission medium mainly adopts optical cable, and the transmission rate is more than l00 megabit/s. An important use of MAN is as a backbone network by which hosts, databases, LANs, etc. located at different sites within the same-city are interconnected.

For example, as shown in fig. 2. First, the MAN architecture provided by the present application may be divided into a plurality of layers, such as a backbone layer, a convergence layer, and an access layer as shown in fig. 2, and the backbone layer may also be referred to as a core layer.

Backbone routers can be arranged in the backbone layer, and the backbone routers usually have large bandwidth, can realize high-capacity data throughput, such as gigabit or terabit line speed routers, or high-capacity asynchronous transfer mode (asynchronous transfer mode, ATM) switches, or high-capacity Synchronous digital transmission physical (Synchronous DIGITAL HIERARCHY, SDH) cross-point multiplexing equipment and the like, so as to realize large-capacity data throughput. For example, an optical communication network may be established between multiple cities, and a sub-network covering each city may be understood as a MAN, where multiple MANs are interconnected, and nodes interconnecting the multiple MANs may form a backbone layer, where devices in the backbone layer need to have a capability of implementing a large amount of data throughput.

The convergence layer may include one or more routes such as ATM switches, centralized multiplexers, local area network switches, broadband access servers (broadband ACCESS SERVER, BAS) or SDH multiplexing devices, etc., which may enable substantial data throughput. The convergence layer is arranged between the access layer and the backbone layer and is used for transmitting the data between the backbone layers by the equipment in the transmission access layer.

The access layer may be provided with various devices that enable access to the user equipment, such as digital subscriber line access multiplexers (digital subscriber LINE ACCESS multiplexers, DSLAMs) or other routers or switches. The access layer may use 10M/100M/1000M ethernet access, and may be interconnected with a local area network (local area network, LAN), provide and area multipoint transmission services (local multipoint distribution services, LMDS), etc., and may use Asymmetric Digital Subscriber Line (ADSL) or Very high-bit-RATE DIGITAL Subscriber line (VDSL) or Cable Modem, etc.

In the optical communication network described above, it is necessary to perform reception and transmission of optical signals at each node. In the process of receiving and transmitting optical signals, the temperature of the optical chip in each optical communication device has a great influence on the receiving and transmitting wavelength of the optical chip.

TEC is a component that operates using the peltier effect of semiconductor materials. The semiconductor material used as TEC is mainly heavily doped N-type and P-type bismuth telluride, and the bismuth telluride element generates heat in an electric series connection mode. TEC includes P-type and N-type pairs (sets) that are connected together by electrodes and sandwiched between two ceramic electrodes; when current flows from the TEC, the current causes heat to transfer from one side of the TEC to the other, creating a "hot side" and a "cold side", which is the heating and cooling principle of the TEC.

TEC is used as the only element capable of precisely controlling temperature in the field of optical communication, is relatively expensive, and is mainly used for optical devices needing precisely controlling wavelength. To further reduce the cost of the optical device, the TEC is eliminated, however, the temperature drift effect exists in the optical chip under the InP/GaAs system, that is, the working wavelength of the optical chip is related to temperature, for example, the temperature drift coefficient of the optical chip of the distributed feedback laser (Distributed Feed Back, DFB) is 0.1nm/°c, which makes it difficult to operate the module in a wider working temperature range, and the possibility that the wavelength is out of range at low temperature and high temperature exists. In order to solve the problem of excessive wavelength shift at low temperature, compensation is needed by heating.

The heating efficiency of integrating the heating unit onto the optical chip is generally highest compared to the existing various heating modes, but this introduces new problems: the heating unit has small area and large power consumption, which results in high temperature and large temperature gradient in the heating area of the optical chip. If the temperature monitoring is not performed, the temperature can not be accurately sensed, and further the effective control of the temperature of the active area of the optical chip can not be realized, and finally the wavelength is beyond the protocol range. Taking 10G PON OLT as an example, the operating wavelength is specified to be in the range 1575-1580nm, with a wavelength fluctuation range of 5nm being much smaller than that of ONU 20 nm. Based on the above analysis, it follows that: the temperature monitoring not only affects the wavelength regulation and control, but also affects the reliability of the product, and how to measure the temperature of the heating area is a core problem to be solved by the TEC scheme.

For example, in the TEC-retaining scheme, the optical chip is bonded to the ceramic substrate by gold-tin solder, the substrate is bonded to the heat sink by solder, and the heat sink is bonded to the TEC by silver paste. The thermistor is arranged at a position far away from the optical chip, and the monitored temperature is the temperature of a certain position of the cold face of the TEC. Because the optical chip itself has smaller power consumption and relatively fixed temperature difference with the surrounding, the monitoring of the TEC cold face to represent the temperature of the optical chip can meet the use requirement of the current product. However, the cost of TEC is high, resulting in a high cost of optical communication devices.

For another example, after removing the TEC, in order to solve the wavelength shift problem caused by the temperature drift effect of the optical chip in the low-temperature application scenario, a heating resistor is usually plated on the ceramic substrate, and the ceramic substrate is heated to drive the optical chip to raise the temperature. The optical chip temperature monitoring thought of the scheme is similar to that of the traditional TEC scheme, and the temperature of the optical chip is represented by monitoring the temperature of a certain position of the tube seat or the ceramic substrate. However, after the TEC is removed, the wavelength drift in the low-temperature environment is compensated by a heating mode, and the temperature gradient in the heating area is too large, so that the monitoring point is far away from the active area of the optical chip, and the temperature cannot be accurately represented.

Compared with the heat source on the ceramic substrate, the heating efficiency can be improved by enabling the heat source to be closer to the optical chip, and one scheme is that an external heating unit is used and is arranged on the optical chip; another approach is to integrate a thin film heating resistor onto the optical chip closer to the active area of the laser, thus achieving high heating efficiency with lower power consumption. However, in both schemes, the integration level is high, and the assembly space is small, so that it is difficult to realize temperature measurement. And the size of the thermistor is larger than that of the optical chip, so that the thermistor cannot be assembled on the optical chip for temperature monitoring, and the thermistor is made of metal oxide and cannot be integrated on the optical chip due to the influence of factors such as lattice matching.

Therefore, the application provides the optical module, the control method of the optical module and the optical communication equipment, which can realize the accurate temperature measurement of the optical chip even in the scheme of removing the TEC, thereby realizing the accurate temperature control of the optical chip in time.

The following describes an optical module, a control method of the optical module, and an optical communication device according to the present application with reference to the accompanying drawings.

First, the structure of the optical communication apparatus provided by the present application will be described.

The optical communication device provided by the application can comprise an optical module, an optical input/output interface and a shell, the main view structure of the optical communication device can be shown as a figure 3 and can be used for receiving or transmitting optical signals, for example, the optical communication device can comprise an optical communication device such as a laser transmitter, a laser receiver, an ONU or an OLT.

More specifically, as shown in fig. 4, the present application provides a schematic cross-sectional view of an optical communication device.

The optical communication device may include an optical module 30, an optical interface 31, an electrical interface 33, a housing 32, and the like.

The optical interface 31, the electrical interface 33, and the optical module 30 may be directly connected or may be fixed on the same PCB. The housing is arranged outside the optical module, and the optical input/output interface 31 may be embedded in the housing, and the optical input/output interface may be used to receive an optical signal or transmit an optical signal generated by the optical module 30. An electrical interface 33 may be used to power the devices in the optical module.

Referring to fig. 5, a schematic structural diagram of an optical module is provided in the present application.

The optical module may include a heating resistor 301, a first resistor 303, an optical chip 302, a buck-boost module 304, and a control module 305.

The heating resistor 301 is integrated with the optical chip, and is used for generating heat after power-on, so as to raise the temperature of the optical chip. In general, the heating resistor has a thermal property, and the resistance of the heating resistor is related to temperature, for example, the resistance of the heating resistor and the temperature can be in positive correlation or in negative correlation.

The first resistor and the heating resistor are electrically connected with the voltage boosting and reducing module, and the specific connection mode can be cable connection or printed circuit connection, and can comprise series connection, parallel connection or combination of series connection and parallel connection.

The control module is electrically connected with the first resistor and the lifting pressure module. The control module and the buck-boost module may be connected through communication, for example, may be connected through a two-wire serial bus (inter-INTEGRATED CIRCUIT, I2C) or a digital-to-analog converter (DAC) interface, so that the control module may control the output voltage of the buck-boost module through the I2C interface or the DAC interface.

The control module may include a device with computing functionality, such as may include one or more of the following: a microcontroller unit (micro controller unit, MCU), a central processing unit (central processing unit, CPU), a digital signal processor (DIGITAL SIGNAL processor, DSP), an Application SPECIFIC INTEGRATED Circuit (ASIC) or field programmable gate array (field programmable GATE ARRAY, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. The general purpose processor may be a microprocessor or may be any conventional processor or the like.

The buck-boost module can be a set buck-boost chip, an integrated buck-boost circuit or the like, and can be specifically determined according to actual application scenes. May be used to regulate the input voltage to the light module, such as boosting or dropping.

In addition, in fig. 5, by taking the optical module deployment provided by the application as a coaxial-type emission component (TO) as an example for an introduction, the optical chip and the heating resistor can be integrated on the TO tube seat or the ceramic substrate, and the heating resistor can be particularly integrated on the optical chip, so that the heating resistor can effectively raise the temperature of the optical chip, and the temperature of the optical chip can be reflected more accurately through the resistance value.

In general, there is a temperature drift effect in the operating wavelength of the optical chip, i.e., the operating wavelength of the optical chip is temperature dependent. The operating wavelength of the optical chip is required to be in a fixed band, so that the operating wavelength of the optical chip can be maintained in the fixed band by controlling the temperature of the optical chip in order to make the operating wavelength of the optical chip be in the fixed band. In order to reduce the cost, the resistance of the heating resistor is usually related to the temperature without the need of a temperature measuring device in the optical chip or in the vicinity of the optical chip, the resistance of the heating resistor can be calculated by the control module through the voltage of the first resistor, the resistance can reflect the temperature of the heating resistor, the control module can compare the resistance of the heating resistor with the first range, and whether to adjust the output voltage of the buck-boost module or not is determined according to the comparison result so as to adjust the heating value of the heating resistor.

In the embodiment of the application, the resistance value of the heating resistor can be calculated by reading the information of the series resistance, and the resistance value can reflect the temperature of the optical chip, and the temperature of the optical chip is related to the working wavelength. Therefore, the temperature of the heating resistor, namely the temperature of the optical chip, can be monitored by monitoring the resistance value of the series resistor, and the temperature of the optical chip is controlled by adjusting the output voltage of the buck-boost module, so that the working wavelength of the optical chip is kept in a fixed wave band, and the optical module can work normally. The method is equivalent to multiplexing the existing devices in the optical module to realize accurate temperature measurement and temperature control of the optical chip, does not need to set an additional temperature measurement sensor, reduces the cost of the optical module, and realizes accurate temperature measurement and temperature control of the optical chip by using simple low-cost devices.

Further, alternatively, in order to improve the accuracy of the control module to read the voltage value of the first resistor, the operational amplifier may be connected in parallel to both ends of the first resistor, such as the operational amplifier 306 connected in parallel to the first resistor in fig. 5, so as to improve the detection sensitivity for the first resistor.

In one possible implementation, the control module may be specifically configured to: when the resistance value of the heating resistor and the temperature are in positive correlation, if the resistance value of the heating resistor is smaller than the first range, controlling the voltage raising and lowering module to increase the value of the output voltage, namely modulating the voltage value of the input voltage of the optical chip through the voltage raising and lowering control module; and if the resistance value of the heating resistor is larger than the first range, controlling the voltage boosting and reducing module to reduce the value of the output voltage, namely reducing the voltage value of the input voltage of the optical chip through the voltage boosting and reducing module. In the embodiment of the application, the temperature of the optical chip can be reflected through the resistance value of the heating resistor, and the resistance value and the temperature are in positive correlation, so that when the resistance value is too high, the output voltage of the buck-boost module can be reduced, the voltage of the heating resistor is reduced, the heating value of the heating resistor is reduced, and the temperature is reduced; when the resistance is too low, the output voltage of the voltage reduction module can be increased, so that the voltage of the heating resistor is increased, and the heating value of the heating resistor is increased, so that the temperature is increased. Therefore, the real-time control of the temperature of the optical chip can be realized through the real-time monitoring of the resistance value of the heating resistor by the control module.

In one possible implementation manner, the control module may specifically read the voltage value of the first resistor, calculate the current value in the circuit of the optical module according to the voltage value, i.e. obtain the current value of the heating resistor, and then combine the current value with the voltage value of the voltage source of the optical chip to calculate the resistance value of the heating resistor. The resistance of the heating resistor is generally related to the temperature, so that the temperature can be calculated after the resistance of the heating resistor is obtained, a temperature measuring sensor is not required to be additionally arranged, and the temperature measuring cost is reduced.

In one possible embodiment, as shown in fig. 6, a housing temperature sensor 307 may also be provided in the optical module, the housing temperature sensor 307 being connectable to the housing by a thermally conductive material for monitoring the housing temperature. Alternatively, the case temperature sensor may be provided on the PCB when the PCB is provided in the optical module. The control module is further used for acquiring a temperature value detected by the shell temperature sensor before acquiring the resistance value of the heating resistor, and if the temperature value is lower than a second range, the heating resistor can be started. Normally, when the optical chip is powered on, the heating resistor is not directly started, so that whether the starting heating resistance value is triggered or not can be judged through the temperature detected by the shell temperature sensor.

In one possible implementation, as shown in fig. 7, the optical module may further include a second resistor 308, where the second resistor may be connected to the first resistor through a switch, and a specific connection manner may include a series connection or a parallel connection through a single pole double throw switch, where the second resistor has a resistance value greater than that of the first resistor, and typically the second resistor has a resistance value far greater than that of the first resistor, and the switch may be used to switch between the first resistor and the second resistor to adjust the resistance value of the series resistor in the optical module. The control module can calculate the temperature value of the optical chip according to the resistance value of the heating resistor, when the temperature value is too high, if the temperature value is higher than a first threshold value, the second resistor can be started through switching, the second resistor is used as a new first resistor to carry out subsequent steps, so that the control module can calculate based on larger resistance value when calculating the voltage, the sensitivity of collecting the voltages at two ends of the resistor is improved, and a more accurate voltage value is obtained. Generally, when the temperature of the optical chip is high, the resistance value of the heating resistor is larger, the output voltage of the buck-boost module is smaller, and when the resistance value of the first resistor is smaller, the corresponding read voltage value is smaller, so that the second resistor can be switched at the moment, the voltage value readable by the control module is improved, the reading sensitivity is improved, and the accuracy of calculating the resistance value of the heating resistor is improved.

The foregoing describes the structure of the optical communication device and the optical module provided by the present application, and the following describes the control method of the optical module provided by the present application with reference to the foregoing structure of the optical communication device and the optical module.

The present application provides a method for controlling an optical module, which can be used for controlling the optical module shown in fig. 5-7, and the method provided by the present application can be executed by the foregoing control module, or can be executed by other modules with processing functions, and the method is described by taking the control module as an example.

Specifically, the control module obtains the resistance value of the heating resistor through the voltage of the first resistor, wherein the resistance value of the heating resistor is related to the working wavelength of the optical chip; the control module compares the resistance value of the heating resistor with a first range, determines whether to adjust the output voltage of the buck-boost module according to the comparison result, and the first range can be determined according to the working wavelength of the optical chip.

Referring to fig. 8, a flow chart of a control method of an optical module according to the present application is shown as follows.

801. The voltage value of the first resistor is read.

The control module can be electrically connected with the first resistor, for example, the control module can be connected with two ends of the first resistor through an operational amplifier, so that the voltage value of the first resistor can be read through the operational amplifier.

802. And calculating the resistance value of the heating resistor.

After the voltage value of the first resistor is read, the current value of the optical module can be obtained through calculation according to the resistance value of the first resistor, the voltage value of the heating resistor can be obtained through calculation according to the input voltage of the optical module, and the resistance value of the heating resistor can be obtained through calculation according to the current value and the voltage value of the heating resistor.

803. Comparing the resistance value of the heating resistor with the first range, if the resistance value is smaller than the first range, executing step 805, if the resistance value is larger than the first range, executing step 804, and if the resistance value is within the first range, continuing to execute step 801.

The resistance of the heating resistor is generally related to temperature, for example, the resistance of the heating resistor may be positively related to temperature, i.e., the greater the resistance of the heating resistor, the higher the temperature, and the smaller the resistance of the heating resistor, the lower the temperature. The temperature of the photo chip can be reflected by the resistance value of the heating resistor.

In general, the resistance values of different heating resistors may have different relations with the temperature, and the temperature of the optical chip may be reflected by the resistance values of the heating resistors. The operating wavelength of the optical chip is generally affected by the temperature of the optical chip, for example, when the optical chip is at different temperatures, the wavelengths of the optical signals transmitted or received by the optical chip are also different, and the mapping relationship between the specific wavelengths and the temperatures can be determined according to the structure or the manufacturing process of the optical chip. Therefore, if the optical chip is required to be kept at a fixed working wavelength, the temperature of the optical chip can be kept within a fixed range, that is, the resistance value of the heating resistor is kept within a first range. The first range may be calculated according to a temperature value corresponding to an operating wavelength of the optical chip. For example, if the operating wavelength of the optical chip has a positive correlation with temperature, after the operating wavelength of the optical chip is determined, the temperature range in which the optical chip needs to be held can be determined. If the resistance value of the heating resistor and the temperature are in a positive correlation linear relation, after the temperature range of the optical chip to be maintained is determined, the range of the resistance value of the heating resistor to be maintained, namely a first range, can be calculated.

If the resistance of the heating resistor is within the first range, the monitoring of the resistance of the heating resistor may be continued, i.e. step 801 may be continued, if the resistance of the heating resistor is lower than the first range, step 805 may be executed by controlling the step-up/step-down module to increase the resistance of the heating resistor, and if the resistance of the heating resistor is greater than the first range, step 804 may be executed by controlling the step-up/step-down module to decrease the resistance of the heating resistor.

804. The voltage boosting and reducing module is controlled to reduce the value of the output voltage.

If the resistance of the heating resistor is greater than the first range, that is, the temperature of the heating resistor is high, the heating value of the heating resistor can be reduced, so that the temperature of the heating resistor can be reduced. The voltage value of the input voltage of the optical module can be reduced through the buck-boost control module, so that the voltage and the current value of the heating resistor are reduced, the heating value of the heating resistor is reduced, the resistance value of the heating resistor is reduced, and the temperature of the heating resistor is further reduced.

805. The voltage boosting and reducing module is controlled to increase the value of the output voltage.

If the resistance of the heating resistor is smaller than the first range, that is, the temperature of the heating resistor is lower, the heating value of the heating resistor can be increased, so that the temperature of the heating resistor can be increased. The input voltage of the optical module can be improved through the buck-boost control module, so that the voltage value and the current value of the heating resistor are improved, the resistance value of the heating resistor is increased, the heating value of the heating resistor is increased, and the temperature of the heating resistor is improved.

In the embodiment of the application, the control module can calculate the resistance value of the heating resistor by reading the voltage value of the series resistor. The resistance value of the heating resistor can reflect the temperature of the optical chip, so that the temperature of the optical chip can be adjusted by controlling and adjusting the resistance value of the heating resistor, and the temperature of the optical chip is kept in a temperature range corresponding to the working wavelength of the optical chip. Therefore, an additional temperature measuring device is not required to be arranged, the voltage value of the series resistor can be reused to reflect the temperature of the optical chip on the side face, and the cost of the optical module can be reduced.

More specifically, referring to fig. 9, a flowchart of another method for controlling an optical module according to the present application is shown below.

901. And acquiring a temperature value detected by the shell temperature sensor.

Wherein, as shown in the foregoing fig. 6, a shell temperature sensor may also be provided on the housing of the optical communication apparatus for detecting the temperature of the housing. The control module can read the temperature value detected by the shell temperature sensor, and the temperature of the shell can be obtained.

902. Judging whether the temperature value detected by the shell temperature sensor is lower than a second range, if yes, executing step 903, and if not, continuing to execute step 901.

Typically, a distance exists between the housing and the optical chip, and the temperature of the housing is usually different from the temperature of the optical chip, for example, the temperature of the housing is usually lower than the temperature of the optical chip, and the temperature of the housing is related to the temperature of the optical chip and the distance between the housing and the optical chip, for example, the further the distance is, the larger the difference between the temperature of the housing and the temperature of the optical chip is, the temperature condition of the optical chip can be reflected by the temperature of the housing. When a case temperature sensor is provided in the case, the temperature of the case can be read from the case temperature sensor, thereby reflecting the temperature of the optical chip by the problem of the case. If the temperature of the shell is read, the temperature of the optical chip can be calculated according to the relation between the temperature of the shell and the temperature of the optical chip.

After the temperature of the shell temperature sensor is read, it may be determined whether the temperature value of the shell temperature sensor is lower than the second range, if yes, that is, the problem of the optical chip is too low, the heating resistor may be started to increase the temperature of the optical chip, that is, step 903 is performed. If not, the temperature value read by the shell temperature sensor can be continuously monitored, that is, the step 901 is continuously executed.

The second range may be calculated according to a relationship between the temperature of the housing and the temperature of the optical chip, and a temperature range in which the optical chip is required to be maintained.

903. The heating resistor is started.

When the temperature of the shell is determined to be lower than the second range, the temperature of the optical chip is excessively low. At this time, the heating resistor may be activated, and heat is generated by the heating resistor, thereby increasing the temperature of the optical chip.

Therefore, in the embodiment of the application, whether the temperature of the optical chip is too low or not can be judged through the temperature of the shell, when the temperature of the optical chip is too low, the heating chip is started, and when the temperature of the optical chip is high, the heating resistor is not required to be started, so that the energy utilization rate is improved, and the heat waste is avoided.

904. The voltage value of the first resistor is read.

905. And calculating the resistance value of the heating resistor.

906. Comparing the resistance value of the heating resistor with the first range, if the heating resistor is in the first range, executing step 904, if the heating resistor is greater than the first range, executing step 907, and if the heating resistor is less than the first range, executing step 908.

907. The voltage boosting and reducing module is controlled to reduce the value of the output voltage.

908. The voltage boosting and reducing module is controlled to increase the value of the output voltage.

Step 904 to step 908 may refer to the related descriptions of step 801 to step 805, which are not described herein.

909. Whether the temperature is higher than the first threshold is determined, if so, step 909 is executed, and if not, step 906 is executed.

In some scenarios, the temperature value of the optical chip may also be calculated by the resistance value of the heating resistor, and if the temperature value is higher than the first threshold, in order to improve the sensitivity of reading the voltage value of the resistor string, a larger resistor string may be started, that is, step 910 is executed.

910. The second resistor is activated.

For example, as shown in fig. 7, a second resistor is further provided and connected to the first resistor through a switch, and when the temperature of the heating resistor is too high, the resistance value of the heating resistor is usually too high, and the resistance value of the heating resistor may be far greater than that of the first resistor. At this time, if the voltage and current of the heating resistor are calculated by the voltage of the first resistor, it may be inaccurate, so that the second resistor may be started to operate, that is, a new first resistor is formed by starting the second resistor. When the first resistor and the second resistor are connected in parallel, the second resistor is switched to the second resistor by switching the light, i.e. the second resistor is used as a new first resistor, and one or more steps from step 901 to step 909 are performed. The resistance value of the second resistor is far greater than that of the first resistor, so that the voltage values at two ends of the second resistor are also greater, the current and the voltage of the heating resistor can be calculated more accurately, and the accuracy of calculating the resistance value of the heating resistor is improved.

The embodiment of the application also provides a digital processing chip. The digital processing chip has integrated therein circuitry and one or more interfaces for implementing the functions of the control modules described above, or control modules. When the memory is integrated into the digital processing chip, the digital processing chip may perform the method steps of any one or more of the preceding embodiments. When the digital processing chip is not integrated with the memory, the digital processing chip can be connected with the external memory through the communication interface. The digital processing chip implements the actions executed by the control module in the above embodiment according to the program codes stored in the external memory.

Embodiments of the present application also provide a computer program product which, when run on a computer, causes the computer to perform the steps described in the previous embodiments shown in fig. 8-9 as being performed by a control module.

The control module provided by the embodiment of the application can be a chip, and the specific chip comprises: a processing unit, which may be, for example, a processor, and a communication unit, which may be, for example, an input/output interface, pins or circuitry, etc. The processing unit may execute the computer-executable instructions stored in the storage unit to cause the chip in the server to perform the method described in the embodiments shown in fig. 8-9. Optionally, the storage unit is a storage unit in the chip, such as a register, a cache, or the like, and the storage unit may also be a storage unit in the wireless access device side located outside the chip, such as a read-only memory (ROM) or other type of static storage device that may store static information and instructions, a random access memory (random access memory, RAM), or the like.

In particular, the aforementioned processing unit or processor may be a central processing unit (central processing unit, CPU), a Network Processor (NPU), a graphics processor (graphics processing unit, GPU), a digital signal processor (DIGITAL SIGNAL processor, DSP), an Application Specific Integrated Circuit (ASIC) or field programmable gate array (field programmable GATE ARRAY, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, etc. The general purpose processor may be a microprocessor or may be any conventional processor or the like.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.

In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and are merely illustrative of the manner in which embodiments of the application have been described in connection with the description of the objects having the same attributes. Furthermore, the terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The names of the messages/frames/information, modules or units, etc. provided in the embodiments of the present application are merely examples, and other names may be used as long as the roles of the messages/frames/information, modules or units, etc. are the same.

The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this embodiment of the application, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that in the description of the present application, "/" means that the associated objects are in an "or" relationship, unless otherwise indicated, e.g., A/B may represent A or B; the "and/or" in the present application is merely an association relationship describing the association object, and indicates that three relationships may exist, for example, a and/or B may indicate: there are three cases, a alone, a and B together, and B alone, wherein a, B may be singular or plural.

The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims

1. The utility model provides a control method of optical module, its characterized in that, optical module includes heating resistor, first resistance, optical chip, step-up and step-down voltage module and control module, heating resistor integrated in optical chip, first resistance the heating resistor with step-up and step-down voltage module electricity is connected, control module with first resistance and step-up and step-down voltage module electricity is connected, heating resistor is used for generating heat, step-up and step-down voltage module is used for adjusting the voltage value of the voltage that inputs to optical module, the method includes:

the control module obtains the resistance value of the heating resistor through the voltage of the first resistor, wherein the resistance value of the heating resistor has an association relation with the working wavelength of the optical chip;

The control module compares the resistance value of the heating resistor with a first range, determines whether to adjust the output voltage of the buck-boost module according to a comparison result, and the first range is determined according to the working wavelength of the optical chip.

2. The method of claim 1, wherein the determining whether to adjust the output voltage of the buck-boost module based on the comparison result comprises:

If the resistance of the heating resistor is smaller than the first range, the control module controls the voltage-boosting module to increase the value of the output voltage;

and if the resistance value of the heating resistor is larger than the first range, the control module controls the voltage boosting and reducing module to reduce the value of the output voltage.

3. The method according to claim 1 or 2, characterized in that the light module is further provided with a shell temperature sensor, the outside of the light module is provided with a shell, the shell temperature sensor is connected with the shell through a heat conducting material, and the shell temperature sensor is used for detecting the temperature of the shell;

Before the control module obtains the resistance value of the heating resistor, the method further comprises:

The control module acquires a temperature value detected by the shell temperature sensor;

and if the temperature value detected by the shell temperature sensor is lower than a second range, the control module controls the starting of the heating resistor.

4. A method according to any of claims 1-3, wherein the light module further comprises a second resistor, the second resistor being connected to the first resistor by a switch, the second resistor having a resistance value greater than a resistance value of the first resistor, the first resistor operating after power-up of the light module, the method further comprising:

The control module calculates the temperature value of the optical chip according to the resistance value of the heating resistor;

And if the temperature value of the optical chip is higher than a first threshold value, the control module controls the switch to switch and start the second resistor, and the second resistor is used as a new first resistor to work.

5. The method of any one of claims 1-4, wherein the control module obtaining the resistance value of the heating resistor from the voltage of the first resistor comprises:

The control module reads the voltage value of the first resistor and acquires a current value according to the voltage of the first resistor;

And the control module combines the voltage value of the voltage source of the optical chip and the current value to obtain the resistance value of the heating resistor.

6. An optical module, comprising:

the heating resistor is integrated in the optical chip, the first resistor and the heating resistor are electrically connected with the lifting voltage module, the control module is electrically connected with the first resistor and the lifting voltage module, the heating resistor is used for heating, and the lifting voltage module uses a voltage value of the voltage which is regulated and input to the optical module;

The control module is further used for comparing the resistance value of the heating resistor with a first range, determining whether to adjust the output voltage of the buck-boost module according to a comparison result, and determining the first range according to the working wavelength of the optical chip.

7. The light module of claim 6, wherein the control module is specifically configured to:

if the resistance of the heating resistor is smaller than the first range, controlling the voltage-boosting module to increase the value of the output voltage;

and if the resistance value of the heating resistor is larger than the first range, controlling the voltage-boosting module to reduce the value of the output voltage.

8. The light module of claim 6 or 7, further comprising a housing temperature sensor disposed outside the light module, the housing temperature sensor being connected to the housing by a thermally conductive material, the housing temperature sensor being configured to detect the housing temperature;

The control module is further configured to:

before the control module obtains the resistance value of the heating resistor, obtaining the temperature value detected by the shell temperature sensor;

And if the temperature value detected by the shell temperature sensor is lower than a second range, controlling to start the heating resistor.

9. The optical module according to any one of claims 6-8, further comprising a second resistor, wherein the second resistor is connected with the first resistor through a switch, the resistance value of the second resistor is larger than that of the first resistor, a switch is arranged between the second resistor and the first resistor, and the first resistor works after the optical module is powered on;

The control module is further configured to:

calculating the temperature value of the optical chip according to the resistance value of the heating resistor;

and if the temperature value of the optical chip is higher than a first threshold value, controlling the switch to switch and start the second resistor, and working the second resistor as a new first resistor.

10. The light module according to any one of claims 6-9, characterized in that the control module is in particular adapted to:

Reading the voltage value of the first resistor, and acquiring a current value according to the voltage value of the first resistor;

and combining the voltage value of the voltage source of the optical chip with the current value to obtain the resistance value of the heating resistor.

11. An optical communication device, characterized by comprising an optical input interface, an optical output interface, a printed circuit PCB board and an optical module, said input interface and said output interface and said optical module being fixed on said PCB board, said optical module comprising an optical module according to any of claims 6-10.