CN118092615A - Electronic equipment control method and electronic equipment - Google Patents

Electronic equipment control method and electronic equipment Download PDF

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Publication number
CN118092615A
CN118092615A CN202410233780.8A CN202410233780A CN118092615A CN 118092615 A CN118092615 A CN 118092615A CN 202410233780 A CN202410233780 A CN 202410233780A CN 118092615 A CN118092615 A CN 118092615A
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power consumption
frequency point
temperature
chip
electronic equipment
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马荣强
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202410233780.8A priority Critical patent/CN118092615A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206Monitoring of events, devices or parameters that trigger a change in power modality

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Sources (AREA)

Abstract

The application discloses a control method of electronic equipment and the electronic equipment, and belongs to the technical field of electronic equipment. The method comprises the following steps: acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature; determining a first power consumption reduction amount of the electronic device; determining a working frequency point of the electronic equipment according to the first running power consumption, the estimated power consumption and the first power consumption reduction; the second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.

Description

Electronic equipment control method and electronic equipment
Technical Field
The application belongs to the technical field of electronic equipment, and particularly relates to a control method of electronic equipment and the electronic equipment.
Background
With the popularization of electronic devices, users have increasingly higher performance requirements for the electronic devices. In order to realize high performance of the electronic equipment, the operating frequency points supported by the electronic equipment are higher and higher. However, high frequency point operation brings high performance and high power consumption and high temperature rise, and when the electronic device is always operated at the high frequency point, the electronic device is liable to generate heat.
At present, in order to prevent the temperature of the electronic equipment from being too high, the following modes are adopted: and controlling the electronic equipment to work at a high frequency point at low temperature, and controlling the electronic equipment to work at a low frequency point at high Wen Shikong. However, when the electronic device is controlled to operate at a low frequency point, the performance of the electronic device is reduced, and the use smoothness of the electronic device is affected.
Disclosure of Invention
The embodiment of the application aims to provide a control method of electronic equipment and the electronic equipment, which can solve the problem that the use smoothness of the electronic equipment is affected due to the fact that the performance of the electronic equipment is reduced by adjusting the working frequency point in the electronic equipment.
In a first aspect, an embodiment of the present application provides a method for controlling an electronic device, where the method includes:
acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature;
determining a first power consumption reduction amount of the electronic device;
Determining a working frequency point of the electronic equipment according to the first running power consumption, the estimated power consumption and the first power consumption reduction;
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
In a second aspect, an embodiment of the present application provides a control apparatus for an electronic device, where the apparatus includes:
The first acquisition module is used for acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature;
A first determining module configured to determine a first power consumption reduction amount of the electronic device;
the second determining module is used for determining the working frequency point of the electronic equipment according to the first running power consumption, the estimated power consumption and the first power consumption reduction;
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
In a third aspect, an embodiment of the present application provides an electronic device comprising a processor and a memory storing a program or instructions executable on the processor, which when executed by the processor, implement the steps of the method as described in the first aspect.
In a fourth aspect, embodiments of the present application provide a readable storage medium having stored thereon a program or instructions which when executed by a processor perform the steps of the method according to the first aspect.
In a fifth aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and where the processor is configured to execute a program or instructions to implement a method according to the first aspect.
In a sixth aspect, embodiments of the present application provide a computer program product stored in a storage medium, the program product being executable by at least one processor to implement the method according to the first aspect.
In the embodiment of the application, under the condition that the operation temperature of the electronic equipment is greater than or equal to the first temperature, the first operation power consumption and the estimated power consumption of the electronic equipment can be obtained, and the first power consumption reduction amount of the electronic equipment is determined; then, the working frequency point of the electronic device can be determined according to the first operation power consumption, the estimated power consumption and the first power consumption reduction. The second power consumption reduction amount corresponding to the determined working frequency point is larger than or equal to the first power consumption reduction amount, namely, after the electronic equipment works at the working frequency point, the power consumption expected to be reduced by the electronic equipment is larger than or equal to the power consumption required to be reduced by the electronic equipment, so that the purpose of temperature control can be achieved. The operation temperature corresponding to the second operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the determined working frequency point, namely, after the electronic equipment works at the working frequency point, the operation power consumption of the electronic equipment can meet the power consumption requirement of the electronic equipment, so that the performance requirement of the electronic equipment can be ensured. Therefore, the embodiment of the application can realize the balance of the performance and the temperature, maximize the performance of the electronic equipment while achieving the temperature control, and eliminate the influence of the temperature control on the use smoothness of the electronic equipment.
Drawings
Fig. 1 is one of flowcharts of a control method of an electronic device provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of a CPU and energy efficiency model provided by an embodiment of the present application;
FIG. 3 is a schematic illustration of the computational power provided by an embodiment of the present application;
FIG. 4 is a second flowchart of a control method of an electronic device according to an embodiment of the present application;
fig. 5 is a block diagram of a control device of an electronic apparatus according to an embodiment of the present application;
FIG. 6 is one of the block diagrams of the electronic device provided by the embodiment of the application;
Fig. 7 is a second block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions of the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the present application, fall within the scope of protection of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or otherwise described herein, and that the objects identified by "first," "second," etc. are generally of a type not limited to the number of objects, for example, the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The principle of temperature increase of the electronic device will be described below.
The differential equation of temperature rise of the surface of the uniform temperature sphere is shown in formula (1):
m×C×Ts=P-h×S×(Ts-Ta) (1)
Wherein P is self-heating power of the temperature-equalizing sphere, and can also be called heat consumption or power consumption; m is the mass of the uniform temperature sphere; c is the specific heat capacity of the uniform temperature sphere; s is the surface area of the uniform temperature sphere; h is the heat exchange coefficient of the uniform temperature sphere; t a is the ambient temperature of the temperature-uniformizing sphere; t s is the surface temperature of the sphere, which may also be referred to as the shell temperature. In the general expression (1), mxcχ s is a temperature increase term; p is a heating item; h×s× (T s-Ta) is a heat sink.
The calculation formula of T s derived from the equation (1) is shown in the formula (2):
Wherein, at t=0, T s=Ta.
In addition, the heat radiation capability a can be expressed by the formula (3), and the time constant B can be expressed by the formula (4):
A=h×S (3)
the time constant B may indicate the rate of temperature increase.
Combining the formulas (2) to (4), the temperature increase formula (5) can be derived:
where ΔT 0 is the initial temperature rise, i.e., the initial temperature.
Compared with Wen Qiuti, the heat dissipation structure of the electronic device is more complex and the temperature is not uniform, but the temperature rising formula is consistent with the temperature rising formula of Wen Qiuti.
As can be seen from the disclosure (5), the temperature rise of the electronic device mainly comprises two parts, namely the attenuation of the initial temperature rise and the temperature rise increment of the heat consumption. The temperature of an electronic device is mainly affected by the following parameters: ambient temperature, initial temperature rise, heat dissipation capacity of the electronic device, heat consumption, and time constant.
It will be appreciated that after the electronic device is shipped, both its heat dissipation capacity and its time constant are already fixed, while the ambient temperature and the initial temperature depend on the environment in which the electronic device is used, based on which the temperature of the electronic device can be controlled by controlling the heat consumption of the electronic device. The heat consumption of the electronic equipment is related to the working frequency point of the electronic equipment, so that the power consumption of the electronic equipment can be controlled by controlling the working frequency point of the electronic equipment, and the temperature of the electronic equipment can be further controlled.
The control method of the electronic device provided by the embodiment of the application is described in detail below through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Fig. 1 is one of flowcharts of a control method of an electronic device according to an embodiment of the present application. As shown in fig. 1, the control method of the electronic device according to the embodiment of the present application may include:
step 101, acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature.
In the embodiment of the present application, in order to prevent the operation temperature of the electronic device from being too high, a first temperature for determining whether to trigger temperature control may be set, and thus, the first temperature may also be referred to as a trigger temperature (trip temperature). The first temperature may be set based on actual requirements, which is not limited in the embodiment of the present application.
In particular, the operation temperature of the electronic device may be detected first, and in the embodiment of the present application, the operation temperature of the electronic device is the surface temperature of the electronic device, that is, the shell temperature. The embodiment of the application does not limit the detection mode of the running temperature of the electronic equipment. In some embodiments, a thermistor may be integrated at a different location of the electronic device, and the temperature detected by the thermistor may be used to determine the surface temperature of the electronic device. The thermistor may be a negative temperature coefficient (Negative Temperature Coefficient, NTC) thermistor, but is not limited thereto. In some embodiments, the temperature read by the thermistor at a plurality of moments can be multiplied by a weight coefficient to be fitted to obtain the surface temperature of the electronic device, and the weight coefficient can be obtained by a least square method.
After detecting the operating temperature of the electronic device, the operating temperature may be compared to the first temperature.
In some embodiments, it may be determined whether to trigger temperature control to reduce the operating temperature of the electronic device directly based on a comparison of the operating temperature and the first temperature. If the operation temperature of the electronic equipment is greater than or equal to the first temperature, the operation temperature of the electronic equipment is higher, and the temperature control can be triggered. If the operating temperature of the electronic device is lower than the first temperature, the operating temperature of the electronic device is lower, and the condition of overhigh temperature cannot occur temporarily, so that the temperature control can not be triggered.
In other embodiments, after the operation temperature of the electronic device is detected, the detected operation temperature may be further compared with the operation temperature detected last time to determine a temperature change trend of the electronic device, and in particular, if the detected operation temperature is greater than the operation temperature detected last time, the temperature change trend may be determined to be rising; if the detected operating temperature is lower than the operating temperature detected last time, it is determined that the temperature change trend is decreasing.
And then determining whether to trigger temperature control based on the comparison result of the detected operation temperature and the first temperature and the temperature change trend of the electronic equipment.
When the operating temperature is greater than or equal to the first temperature and the temperature change trend is rising, if no measures are taken, the temperature of the electronic equipment can continuously rise according to the temperature change trend, and the electronic equipment is easy to have the over-high temperature condition. Therefore, in this case, the temperature control may be triggered to reduce the temperature of the electronic device, preventing the electronic device from becoming too hot.
When the operation temperature is smaller than the first temperature, the operation temperature of the electronic equipment is lower, and the condition that the temperature is too high is avoided temporarily, so that the temperature control can not be triggered.
In the case where the operating temperature is greater than or equal to the first temperature, but the temperature change tendency is a decrease, even if no measures are taken, the temperature of the electronic device decreases according to the temperature change tendency, and an excessive temperature condition does not occur, so that the temperature control may not be triggered.
Under the condition of triggering temperature control, the first running power consumption and the estimated power consumption of the electronic equipment can be obtained through the step 101, the first power consumption reduction amount of the electronic equipment is obtained through the step 102, and then the working frequency point of the electronic equipment is determined through the step 103 based on the power consumption obtained through the step 101 and the step 102, so that the power consumption of the electronic equipment is reduced, and the temperature of the electronic equipment is further reduced.
The first operating power consumption may be understood as the current operating power consumption of the electronic device. The embodiment of the application does not limit the acquisition mode of the first operation power consumption of the electronic equipment. In some embodiments, the first operating power consumption of the electronic device may be determined using parameters of a current utilization rate, a current load, and the like of each chip in the electronic device. In other embodiments, the first operating power consumption of the electronic device may be determined using an application currently operating by the electronic device.
The estimated power consumption of the electronic device is the power consumption of the electronic device at a future time. In some embodiments, the electronic device may periodically detect its own temperature and a temperature variation trend to determine whether to trigger temperature control, and in this embodiment, the estimated power consumption of the electronic device may be understood as: the electronic device consumes power in the next cycle.
The embodiment of the application does not limit the acquisition mode of the estimated power consumption of the electronic equipment. In some embodiments, the electronic device may predict the power consumption at the future time based on the first operation power consumption, to obtain the estimated power consumption. In other embodiments, the electronic device may predict the power consumption at a future time based on the current usage of the electronic device, to obtain the estimated power consumption.
Step 102, determining a first power consumption reduction amount of the electronic device.
The first power consumption reduction amount can be understood as: to reduce the operating temperature of an electronic device, the electronic device requires reduced power consumption.
In step 102, a first power consumption reduction amount of the electronic device may be determined using a temperature difference between an operating temperature of the electronic device and a third temperature.
The third temperature may also be referred to as a target temperature (Target temperature) that is the lowest temperature that characterizes the electronic device as being too hot. If the temperature of the electronic equipment is higher than or equal to the third temperature, the electronic equipment is excessively high; if the temperature of the electronic equipment is less than the third temperature, the temperature of the electronic equipment is within a reasonable range. The third temperature may be set based on actual requirements, which is not limited in the embodiment of the present application. The third temperature may be greater than or equal to the first temperature.
In specific implementation, a temperature difference (may be simply referred to as a temperature difference) between the operating temperature and the third temperature may be calculated. Thereafter, it may be determined that the electronic device needs a reduced minimum power consumption (Δpower) to avoid the temperature of the electronic device reaching the third temperature, and the first power consumption reduction amount may be greater than or equal to the minimum power consumption.
In some embodiments, the electronic device may pre-store a conversion relation of the temperature difference and the minimum power consumption that the electronic device needs to reduce. In this embodiment, after the temperature difference between the operating temperature and the third temperature is calculated, the temperature difference may be input into the conversion relation, the minimum power consumption corresponding to the temperature difference is calculated, and then the first power consumption reduction amount is determined using the minimum power consumption.
In other embodiments, the electronic device may prestore the lowest power consumption corresponding to the unit temperature difference. In this embodiment, after the temperature difference between the operating temperature and the third temperature is calculated, the temperature difference may be multiplied by the lowest power consumption corresponding to the unit temperature difference to obtain the lowest power consumption corresponding to the temperature difference, and then, the first power consumption reduction amount is determined using the lowest power consumption. By way of example, assuming that the lowest power consumption corresponding to 1 degree is 80ma@4v, then the temperature difference between the operating temperature and the third temperature is 2 degrees, then the lowest power consumption corresponding to the temperature difference is 160ma@4v.
Step 103, determining the working frequency point of the electronic device according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount.
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
The power consumption of the electronic equipment is positively correlated with the working frequency point of the electronic equipment, namely, the higher the working frequency point of the electronic equipment is, the higher the power consumption of the electronic equipment is, and otherwise, the lower the power consumption brought by the electronic equipment is. Therefore, the power consumption of the electronic equipment can be controlled by controlling the working frequency point of the electronic equipment in the electronic equipment, so that the operating temperature of the electronic equipment is controlled, and the aim of temperature control is fulfilled.
The determining of the working frequency point of the electronic device may be specifically expressed as: reducing the working frequency point of the electronic equipment; or, maintaining the working frequency point of the electronic equipment unchanged. That is, by performing step 103, the operating frequency point of the electronic device may be lowered, or the operating frequency point of the electronic device may not be changed.
The amount of power consumption reduction corresponding to a certain frequency point can be understood as: after the electronic device operates at the frequency point, the electronic device expects reduced power consumption. The amount of power consumption reduction corresponding to the frequency point may also be referred to as a profit power consumption corresponding to the frequency point. And the power consumption reduction corresponding to the working frequency point is recorded as a second power consumption reduction.
In the embodiment of the application, the second power consumption reduction corresponding to the working frequency point is greater than or equal to the first power consumption reduction, namely: after the electronic device is operated at the operating frequency, the power consumption expected to be reduced by the electronic device may cover the power consumption that the electronic device needs to reduce in order to avoid the situation that the electronic device is too hot. Therefore, the working frequency point of the electronic equipment determined in step 103 can avoid the situation that the temperature of the electronic equipment is too high, and the purpose of temperature control is achieved.
The power consumption of the electronic device is adjusted according to the adjustment of the operating frequency point, and after the electronic device operates at the determined operating frequency point, the operating power consumption of the electronic device may be referred to as the operating power consumption corresponding to the operating frequency point and is referred to as the second operating power consumption. The operation power consumption corresponding to a certain frequency point can be obtained by subtracting the power consumption reduction amount corresponding to the frequency point from the first operation power consumption of the electronic equipment. Based on this, the second operation power consumption may be obtained by subtracting the first power consumption reduction amount from the first operation power consumption. The operation temperature corresponding to the power consumption can be calculated by the formula (5).
In the embodiment of the present application, the operating temperature corresponding to the second operating power consumption is less than or equal to the operating temperature corresponding to the estimated power consumption, that is: after the electronic equipment works at the determined working frequency point, the second operation power consumption corresponding to the working frequency point can meet the power consumption of the electronic equipment required at the future moment, so that the performance requirement of the electronic equipment can be met, and the use smoothness of the electronic equipment is not affected.
According to the control method of the electronic equipment, under the condition that the operation temperature of the electronic equipment is greater than or equal to the first temperature, the first operation power consumption and the estimated power consumption of the electronic equipment can be obtained, and the first power consumption reduction amount of the electronic equipment is determined; then, the working frequency point of the electronic device can be determined according to the first operation power consumption, the estimated power consumption and the first power consumption reduction. The second power consumption reduction amount corresponding to the determined working frequency point is larger than or equal to the first power consumption reduction amount, namely, after the electronic equipment works at the working frequency point, the power consumption expected to be reduced by the electronic equipment is larger than or equal to the power consumption required to be reduced by the electronic equipment, so that the purpose of temperature control can be achieved. The operation temperature corresponding to the second operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the determined working frequency point, namely, after the electronic equipment works at the working frequency point, the operation power consumption of the electronic equipment can meet the power consumption requirement of the electronic equipment, so that the performance requirement of the electronic equipment can be ensured. Therefore, the embodiment of the application can realize the balance of the performance and the temperature, maximize the performance of the electronic equipment while achieving the temperature control, and eliminate the influence of the temperature control on the use smoothness of the electronic equipment.
In some embodiments, the determining the operating frequency point of the electronic device according to the first running power consumption, the estimated power consumption, and the first power consumption reduction amount includes:
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount and the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, of the at least two candidate frequency points of the electronic equipment as the working frequency points.
In this embodiment, candidate frequency points for the electronic device may be determined first. In some embodiments, a part or all of the frequency points of the electronic device lower than the current operating frequency point may be determined as candidate frequency points, but is not limited thereto.
And then, for each candidate frequency point, acquiring the power consumption reduction corresponding to the candidate frequency point, and subtracting the power consumption reduction from the first operation power consumption to obtain the operation power consumption corresponding to the candidate frequency point.
And then, comparing the power consumption reduction amount corresponding to each candidate frequency point with the first power consumption reduction amount, and comparing the operation temperature corresponding to the operation power consumption of each candidate frequency point with the operation temperature corresponding to the estimated power consumption so as to screen out target candidate frequency points meeting the conditions from at least two candidate frequency points based on the two comparison results. Specifically, if the power consumption reduction amount corresponding to a certain frequency point is greater than or equal to the first power consumption reduction amount, and the corresponding operation power consumption is greater than or equal to the estimated power consumption, it may be determined that the frequency point meets the condition.
The target candidate frequency bin may include at least one candidate frequency bin. Under the condition that the number of candidate frequency points included in the target candidate frequency points is 1, the candidate frequency points can be directly used as the working frequency points of the electronic equipment. When the number of candidate frequency points included in the target candidate frequency points is greater than 1, one frequency point can be selected from the target candidate frequency points to serve as a working frequency point of the electronic device.
In this embodiment, the first running power consumption, the estimated power consumption and the first power consumption reduction amount of the electronic device may be used to screen out candidate frequency points meeting the conditions from the candidate frequency points of the electronic device as the working frequency points of the electronic device, so that the performance of the electronic device may be maximized on the basis of achieving the purpose of temperature control.
In the case where the number of candidate frequency points included in the target candidate frequency point is greater than 1, in some embodiments, one frequency point may be randomly selected from the target candidate frequency points as an operating frequency point of the electronic device.
In other embodiments, a frequency point with the smallest running power consumption in the target candidate frequency points can be used as the working frequency point of the electronic device, so that after the working frequency point of the electronic device is adjusted, the power consumption of the electronic device can be reduced, and the service time of the electronic device is prolonged.
In other embodiments, the method may include:
Obtaining the energy efficiency score of each candidate frequency point; the energy efficiency score of the candidate frequency point is positively correlated with the performance index value of the electronic equipment under the candidate frequency point;
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount, of the at least two candidate frequency points of the electronic equipment, the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, and the energy efficiency score meets the preset condition as the working frequency points.
In this embodiment, the operating frequency point may also be determined based on the energy efficiency score of the candidate frequency point.
The energy efficiency score of a frequency point is positively correlated with the performance index value of the electronic equipment under the frequency point. Specifically, the larger the performance index value of the electronic device under the frequency point is, the higher the energy efficiency score of the frequency point is, and conversely, the lower the energy efficiency score of the frequency point is.
The performance index value of the electronic device at a certain frequency point may be regarded as the performance index value corresponding to the frequency point, and may be understood as: and the performance index value when the electronic equipment works at the frequency point. When the electronic equipment works at different frequency points, the performance index values of the electronic equipment are different. The larger the performance index value of the electronic equipment at a certain frequency point is, the better the performance of the electronic equipment when the working frequency point of the electronic equipment works at the frequency point is, and the worse the performance of the electronic equipment is otherwise.
The energy efficiency score meets the preset condition, and can be expressed as follows: the energy efficiency score is higher than a preset score threshold; or the energy efficiency score is higher than the energy efficiency scores of other candidate frequency points in the target candidate frequency points.
The embodiment of the application does not limit the acquisition mode of the energy efficiency score of the frequency point. In some embodiments, a ratio of a performance index value corresponding to a frequency point to an initial power consumption corresponding to the frequency point may be determined as an energy efficiency score of the frequency point. In other embodiments, considering that the performance index value corresponding to the frequency point is related to the energy efficiency of the frequency point, the energy efficiency score of the frequency point may be determined based on the energy efficiency of the frequency point.
Based on the method, the frequency point with the highest energy efficiency score in the target candidate frequency point is selected as the working frequency point of the electronic equipment, so that the performance of the electronic equipment can be maximized, and the performance of the electronic equipment is further improved. Therefore, for the embodiment that the target candidate frequency points meeting the conditions are screened out first and then the working frequency points of the electronic equipment are selected from the target candidate frequency points, the frequency-modulated chip is more beneficial to improving the performance of the electronic equipment.
In other embodiments, for other frequency points smaller than the current operating frequency point in the electronic device, it may be sequentially determined whether the frequency points meet the condition according to the order from the large to the small. After finding out the frequency point meeting the conditions, the frequency point can be directly used as the working frequency point of the electronic equipment. Therefore, the determination efficiency of the working frequency point of the electronic equipment can be improved.
The following describes the acquisition of the power consumption reduction amount corresponding to the frequency bin.
In some embodiments, the power consumption reduction corresponding to the frequency bin may be obtained based on the test data and stored in the electronic device.
In other embodiments, the determining the power consumption reduction corresponding to the candidate frequency point includes:
Acquiring working power consumption and voltage corresponding to the candidate frequency points;
and determining the power consumption reduction corresponding to the candidate frequency point according to the candidate frequency point and the working power consumption and the voltage corresponding to the candidate frequency point.
The working power consumption corresponding to the frequency point can be understood as: power consumption when the electronic device is operating at the frequency bin. The voltage corresponding to the frequency point can be understood as: and the working voltage when the chip works at the frequency point.
The working power consumption and voltage corresponding to each frequency point can be stored in the electronic equipment in advance, when the power consumption reduction amount corresponding to a certain frequency point needs to be determined, the working power consumption and voltage corresponding to the frequency point can be directly extracted, and then the power consumption reduction amount corresponding to the frequency point is determined by utilizing the frequency point and the corresponding working power consumption and voltage.
In some embodiments, the power consumption reduction corresponding to the frequency point may be determined by using a model, in this embodiment, the model may be pre-trained by test data, the input of the model is the working power consumption and voltage corresponding to the frequency point, and the output is the power consumption reduction corresponding to the frequency point.
In other embodiments, the amount of power consumption reduction corresponding to the frequency bin may be calculated by equation (6):
dfc_power=dyn_power_coeff× freq_mhz×voltage× voltage (6)
Wherein freq_mhz represents the frequency bin; dfc _power represents the power consumption reduction corresponding to the frequency point; voltage represents the voltage corresponding to the frequency point. dyn_power_coeff is determined based on the operating power consumption corresponding to the frequency point, and in some implementations dyn_power_coeff may be the operating power consumption corresponding to the frequency point, and in other implementations dyn_power_coeff may be the difference between the operating power consumption corresponding to the frequency point and the operating power consumption corresponding to the current frequency point of the electronic device. Equation (6) can be derived based on the test data.
Therefore, after the working power consumption and the voltage corresponding to the frequency point are obtained, the power consumption reduction corresponding to the frequency point can be determined, and the rate of obtaining the power consumption reduction can be increased.
The voltage corresponding to the frequency point can be detected. And for the working power consumption corresponding to the frequency point, the embodiment of the application does not limit the acquisition mode of the device. In some embodiments, the working power consumption corresponding to the frequency point may be detected. In other embodiments, the method may further comprise:
And for each chip in the electronic equipment, determining the working power consumption corresponding to the chip at the current working frequency point by utilizing the energy efficiency of the chip at the current working frequency point based on an energy-aware Scheduling (ENERGY AWARE Scheduling) (EAS) strategy. In the specific implementation, after the energy efficiency of the chip at each working frequency point is obtained, the working power consumption corresponding to the chip at each working frequency point can be determined through an EAS strategy.
The energy Efficiency (Efficiency) of the chip at each working frequency point can be detected. In one example, the energy efficiency of the frequency point and the working power consumption corresponding to the frequency point may be in negative correlation, that is, the higher the energy efficiency of the frequency point, the lower the working power consumption corresponding to the frequency point, and vice versa.
Further, the chip can be stored in the energy efficiency model of the electronic equipment at each working frequency point and the corresponding working power consumption thereof, so that the energy efficiency model can be directly searched to obtain the corresponding working power consumption of the corresponding frequency point, and the obtaining rate of the corresponding working power consumption of the frequency point is improved.
In some embodiments, different types of chips may be provided with different energy efficiency models. In one example, the relationship of a CPU to its energy efficiency model may be as shown in FIG. 2, with each CPU corresponding to a run queue (runqueue) for managing threads running on that CPU. The CPUs in the same cluster (cluster) perform identically and have the same performance domain (struct perf_domain). The member structem_perf_domain_em_pd of struct perf_domain stores the power consumption corresponding to each frequency point.
In this embodiment, the energy efficiency of the chip at each operating frequency point may be utilized to calculate the operating power consumption of the chip corresponding to each operating frequency point based on the EAS policy. Thus, the acquisition accuracy of the working power consumption corresponding to the frequency point can be improved.
The acquisition of the first operation power consumption of the electronic device is explained below.
In some embodiments, the step of obtaining the first operation power consumption of the electronic device may include:
For each chip in the electronic equipment, calculating the product of the current utilization rate of the chip, the current load of the chip and the working power consumption corresponding to the current working frequency point of the chip to obtain the basic power consumption of the chip;
Calculating the product of basic power consumption of the chip and calculation force corresponding to the working state of the chip to obtain first operation power consumption of the chip;
and summing the first operation power consumption of each chip to obtain the first operation power consumption of the electronic equipment.
In the embodiment of the application, the utilization rate (availability) of the chip can represent the time proportion of task execution on the chip in unit time, and only tasks in running state can be counted. The utilization rate of the chip can be detected.
The Load (Load) of the chip may be the sum of the task loads (task Load) on runqueue of the chip, and the running state and the tasks of the executable (runnable) state may be counted. The load of the chip can be detected.
The computational power (capability) of a chip may characterize the computational power of the chip. After normalization calculation, the maximum computational power of the chip may be 1024 dtex, and dynamic frequency modulation does not change the CPU computational power unless the CPU maximum frequency is changed. As shown in fig. 3, the computing power of the chip may be composed of a computing power (capability_busy) corresponding to the busy state and a computing power (capability_idle) corresponding to the idle state.
Notably, the "operating state of the chip" is different from the "current state of the chip". The current state of the chip can be understood as the actual state of the chip, which can be determined based on whether the chip has task operation, if the chip has task operation, the state of the chip is in an idle (busy) state; otherwise, it is in the busy (idle) state. The working state corresponding to the chip can be understood as the working state corresponding to the chip cluster to which the chip belongs, which can be determined based on the current state of each chip in the chip cluster, specifically, if the current state of one chip in the chip cluster is busy state, the working state corresponding to the chip is busy state; otherwise, the working state corresponding to the chip is idle state.
The corresponding operating state of the chip may be used to determine the computing power of the chip used in calculating the first running power of the chip. Specifically, if the working state corresponding to the chip is busy state, the capability_busy state is used; if the working state corresponding to the chip is idle state, the capability_idle is used.
If the working state corresponding to a certain chip is busy, the first operation power consumption can be recorded as Pbusy, and the calculation power can be recorded as Cbusy; if the working state corresponding to a certain chip is idle, the first operation power consumption can be recorded as Pidle, and the calculation power can be recorded as Cidle. Based on this, the first operating power consumption of the electronic device can be calculated by the formula (7):
E=Pbusy×Cbusy+Pidle×Cidle (7)
Wherein E represents a first operating power consumption of the electronic device; pbusy × Cbusy represents the first operation power consumption of each chip under the busy state chip cluster; pidle XCidle represents the first operating power consumption of each chip under the idle chip cluster.
In this embodiment, when the first operation power consumption of the electronic device is calculated, the working states corresponding to the chips in the electronic device are considered, so that the accuracy of the first operation power consumption of the electronic device can be improved.
In other embodiments, the average load of each chip cluster may be calculated by a PELT formula. In some embodiments, the PELT formula may be as shown in formula (8):
Wherein load_avg_confrib represents the average load of the chip cluster; weight is a Weight value of a scheduling entity of the chip cluster; runnable _avg_sum is the total decay accumulation time in the operational state of the scheduling entity; runnable _avg_period is the total decay accumulation time of the scheduling entity in the scheduling period. The load of the entity, i.e. the chip cluster, is scheduled.
And then, determining the power consumption corresponding to the average load of each chip cluster by utilizing the conversion relation between the load and the power consumption, and summing the power consumption of each chip cluster to obtain the first running power consumption of the electronic equipment.
In this way, the acquisition of the first operating power consumption of the electronic device may be simplified.
The determination of the operating frequency point of the electronic device is explained below.
In some embodiments, before the determining the operating frequency point of the electronic device according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount, the method further includes:
Under the condition that the electronic equipment comprises at least two chip clusters, the load of each chip cluster is obtained;
Determining a chip included in the chip cluster with the smallest load as a first chip;
The determining the operating frequency point of the electronic device according to the first operating power consumption, the estimated power consumption and the first power consumption reduction amount includes:
And determining the working frequency point of the first chip according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount, and taking the working frequency point of the first chip as the working frequency point of the electronic equipment.
In this embodiment, the operating frequency point of the first chip in the electronic device is actually determined. The first chip may comprise at least one chip in an electronic device. The chip may be a central processing unit (Central Processing Unit, CPU) or a graphics processor (Graphics Processing Unit, GPU).
In this embodiment, the load of each chip cluster may be determined first, where the determination of the load of each chip cluster may be determined by summing the operation power consumption of each chip in the chip cluster, or may be calculated by a PELT formula.
Considering that the heavier the load of the chip cluster is, the more tasks it runs, and the influence of the down-conversion on the performance is larger. Thus, the chip in the least loaded chip cluster may be determined as the first chip.
The working frequency points of the chips in the same chip cluster are the same, and the adjustment of the working frequency points of all the chips in the chip cluster can be realized by adjusting the adjustment of the working frequency point of one chip in the chip cluster.
In this embodiment, since the first chip is a chip in the chip cluster with the smallest load in the electronic device, the performance of the first chip is less affected by the frequency reduction, so that the effect of the frequency reduction on the performance of the electronic device can be minimized.
In some embodiments, the method may further comprise:
And resetting the working frequency point of the electronic equipment under the condition that the operating temperature of the electronic equipment is smaller than a second temperature, wherein the second temperature is smaller than or equal to the first temperature.
In this embodiment, after the operating frequency point of the electronic device is adjusted once, the operating temperature of the electronic device may be obtained and compared with the second temperature. The second temperature is a preset temperature that can be used to reset the operating frequency point of the chip, and therefore, may also be referred to as a recovery temperature (HYSTERESIS TEMPERATURE).
If the running temperature is smaller than the second temperature, the temperature of the electronic equipment is effectively controlled, the working frequency point of the electronic equipment can be reset, namely, the working frequency point of the electronic equipment is returned to the working frequency point before adjustment, so that the performance of the electronic equipment is improved.
If the operation temperature is still greater than or equal to the first temperature, the control method of the electronic device according to the embodiment of the application can be repeatedly executed until the temperature of the electronic device is effectively controlled.
In this embodiment, after primary frequency modulation, when the operating temperature of the electronic device is less than the third temperature, the operating frequency point of the electronic device may be reset, so that the performance of the electronic device may be further improved.
In some embodiments, the method may further comprise:
identifying an application scene of the electronic equipment;
And determining the triggering temperature corresponding to the application scene as the first temperature.
In this embodiment, the trigger temperature, the target temperature, and the recovery temperature may be set separately for different usage scenarios. In addition, the number of trigger temperatures corresponding to the same use scenario may be one or more, and different trigger temperatures may correspond to different target temperatures.
In particular, a usage scenario of the electronic device may be identified first. The usage scenario of the electronic device may be a game scenario, a video scenario, a reading scenario, etc. The usage scenario of the electronic device may be determined based on an application running in the foreground of the electronic device, such as: if the application program operated by the foreground of the electronic equipment is a game application program, the use scene of the electronic equipment can be determined to be a game scene.
Thereafter, a trigger temperature corresponding to the usage scenario may be determined as the first temperature. Notably, in the case that the trigger temperature is plural, the second temperature in step 102 is the target temperature corresponding to the first temperature in step 101, such as: assuming that the trigger temperature comprises 35 degrees, 37 degrees and 39 degrees, if the operation temperature of the electronic equipment is less than 35 degrees, the second temperature is a target temperature corresponding to 35 degrees; if the operating temperature of the electronic device is less than 39 degrees, the second temperature is a target temperature corresponding to 39 degrees.
In this embodiment, the temperature for triggering the temperature control is different for different usage scenarios, so that Wen Kongling activities of each usage scenario can be improved.
It should be noted that, the various alternative embodiments described in the embodiments of the present application may be implemented in combination with each other without collision, or may be implemented separately, which is not limited to the embodiments of the present application.
In the embodiment of the application, reasonable temperature parameters can be set according to actual requirements of different scenes based on current hardware configuration and performance requirements, required calculation force is calculated in advance according to current load, then power consumption of each frequency point is calculated according to actual frequency point energy efficiency of a chip, power consumption required to be reduced by the mobile phone is converted according to temperature trend and corresponding temperature difference of the current scene, and then proper frequency points are selected for dynamic adjustment, so that the aim of temperature control is fulfilled, and the performance can be improved maximally on the premise of ensuring temperature rise.
In one example, the control method of the electronic device may be as shown in fig. 4, including the steps of:
In step 401, temperature control parameters are set.
In specific implementation, according to the structure and hardware configuration of the electronic equipment, the power consumption and the temperature control parameters of the electronic equipment under the corresponding use scene can be evaluated. Namely, according to different use scenes, setting corresponding temperature control parameters.
The temperature control parameters may include: trip temperature: multiple gears can be set according to actual scenes; target temperature, cannot exceed; HYSTERESIS TEMPERATURE, when the temperature reaches this requirement, the limit can be restored.
And step 402, obtaining the power consumption and the energy efficiency score of each frequency point.
And calculating the energy efficiency score of each frequency point of the CPU according to the energy efficiency of each frequency point of the CPU.
In some embodiments, energy efficiency score = performance/power consumption, representing the scoring capability per 100 mW.
And calculating the power consumption corresponding to each frequency point according to the energy efficiency of each frequency point based on the EAS.
In step 403, it is determined whether temperature control is triggered.
In specific implementation, a detection period is set according to different use scenes, and whether the current temperature triggers temperature control or not is detected in a fixed period.
Step 404, obtaining a use condition of the electronic device.
The use of an electronic device can be characterized by the following parameters: CPU availability; CPU Load; CPU capability.
Step 405, the current power consumption of the electronic device and the power consumption required for the next cycle are calculated.
In specific implementation, the current Power of the electronic device and the Power required by the next period can be calculated by using the utilization rate, the load and the calculation Power of the CPU acquired in step 404.
The power consumption calculation consists of two states of busy and idle, namely the power consumption of the operating state of the CPU/Cluster, and the calculation capacity in the busy state is multiplied by the power consumption value in the busy state. As does the corresponding idle state.
In step 406, a corresponding temperature control strategy is selected for adjustment according to the temperature rising trend.
In particular, the temperature may be converted to power consumption based on the current temperature according to the hardware simulation result. And selecting a corresponding temperature control strategy for adjustment according to the current temperature and the temperature rise trend.
And acquiring the temperature difference delta temperature between the current temperature and the target temperature, and calculating the power consumption delta power required to be reduced according to the temperature difference. For example, the current temperature difference is 2 degrees, the corresponding power consumption is 160mA@4V, and the power consumption of 160mA@4V is reduced through a temperature control strategy.
And (4) acquiring the load condition of each CPU in the current state through step 404, and selecting a frequency modulation object according to the average load of the Cluster, namely the CPU for frequency modulation. Frequency modulation is started from a CPU with lighter load, the tasks of general running with heavy load are more, and the performance is greatly influenced by frequency reduction.
And calculating the power consumption power of the electronic equipment according to the expected frequency point, and comparing the power consumption power with the delta power to perform frequency point adjustment.
A. when the throttle occurs and the temperature rise trend is rising, the working frequency point is reduced;
b. When the throttle occurs and the temperature rise trend is declining, the working frequency point is not changed;
c. When the throttle is released and the temperature rise trend is reduced, the working frequency point is not changed.
The throttle occurs, i.e. the operating temperature exceeds the trigger temperature. the button is deactivated, i.e., the operating temperature is below the trigger temperature.
Step 407, determining whether the current power consumption satisfies the power consumption expected by the temperature rise.
The power consumption expected for temperature rise may be: power consumption corresponding to the target temperature.
If yes, go to step 408; otherwise, go back to step 406.
Step 408, it is determined whether the current temperature is less than the recovery temperature.
If yes, go to step 409; if not, the temperature is not controlled to be within the temperature rise range, and the process returns to step 405.
Step 409, the current frequency setting is restored.
In the embodiment of the application, the Power required by the electronic equipment can be calculated according to the temperature rising trend and the corresponding temperature difference, so that the Power consumption is dynamically adjusted according to the frequency point energy efficiency, and the performance is maximally improved under the condition of meeting the temperature rising. The embodiment of the application can be used for configuring the temperature threshold and the target value according to the actual requirements of different scenes, and is suitable for various scenes.
According to the control method of the electronic equipment provided by the embodiment of the application, the execution main body can be the control device of the electronic equipment. In the embodiment of the present application, a control device of an electronic device is described by taking a control method of the electronic device performed by the control device of the electronic device as an example.
As shown in fig. 5, the control device 500 of the electronic apparatus may include:
A first obtaining module 501, configured to obtain, when an operation temperature of an electronic device is greater than or equal to a first temperature, first operation power consumption and estimated power consumption of the electronic device;
A first determining module 502, configured to determine a first power consumption reduction amount of the electronic device;
a second determining module 503, configured to determine an operating frequency point of the electronic device according to the first operating power consumption, the estimated power consumption, and the first power consumption reduction amount;
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
In some embodiments, the second determining module 503 is specifically configured to:
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount and the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, of the at least two candidate frequency points of the electronic equipment as the working frequency points.
In some embodiments, the control apparatus 500 of the electronic device may include:
The second acquisition module is used for acquiring the working power consumption and the voltage corresponding to the candidate frequency points;
And the third determining module is used for determining the power consumption reduction corresponding to the candidate frequency point according to the candidate frequency point and the working power consumption and the voltage corresponding to the candidate frequency point.
In some embodiments, the control apparatus 500 of the electronic device may include:
The third acquisition module is used for acquiring the energy efficiency score of each candidate frequency point; the energy efficiency score of the candidate frequency point is positively correlated with the performance index value of the electronic equipment under the candidate frequency point;
And a fourth determining module, configured to use, as the working frequency point, a candidate frequency point whose power consumption reduction amount is greater than or equal to the first power consumption reduction amount, an operation temperature corresponding to the operation power consumption is less than or equal to an operation temperature corresponding to the estimated power consumption, and the energy efficiency score satisfies a preset condition, in the at least two candidate frequency points of the electronic device.
In some embodiments, the first acquisition module 501 may include:
the first computing unit is used for computing the product of the current utilization rate of the chip, the current load of the chip and the working power consumption corresponding to the current working frequency point of the chip for each chip in the electronic equipment to obtain the basic power consumption of the chip;
The second calculation unit is used for calculating the product of the basic power consumption of the chip and the calculation force corresponding to the working state of the chip to obtain the first running power consumption of the chip;
And the third calculation unit is used for summing the first operation power consumption of each chip to obtain the first operation power consumption of the electronic equipment.
In some embodiments, the control apparatus 500 of the electronic device may include:
And a fifth determining module, configured to determine, for each chip in the electronic device, working power consumption corresponding to the current working frequency point by using energy efficiency of the chip at the current working frequency point based on an energy-aware scheduling policy.
In some embodiments, the first acquisition module 501 may include:
a fourth obtaining module, configured to obtain, when the electronic device includes at least two chip clusters, a load of each chip cluster;
A fifth determining module, configured to determine a chip included in the chip cluster with the smallest load as a first chip;
The first determining module is configured to:
And determining the working frequency point of the first chip according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount, and taking the working frequency point of the first chip as the working frequency point of the electronic equipment.
In some embodiments, the first acquisition module 501 may include:
And the resetting module is used for resetting the working frequency point of the electronic equipment under the condition that the operating temperature of the electronic equipment is smaller than a second temperature, wherein the second temperature is smaller than or equal to the first temperature.
In some embodiments, the first acquisition module 501 may include:
the identification module is used for identifying the application scene of the electronic equipment;
and a sixth determining module, configured to determine a trigger temperature corresponding to the application scenario as the first temperature.
The control device of the electronic device in the embodiment of the application can be the electronic device, and also can be a component in the electronic device, such as an integrated circuit or a chip. The electronic device may be a terminal, or may be other devices than a terminal. The electronic device may be a Mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a Mobile internet appliance (Mobile INTERNET DEVICE, MID), an augmented reality (augmented reality, AR)/Virtual Reality (VR) device, a robot, a wearable device, an ultra-Mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a Television (TV), a teller machine, a self-service machine, etc., which are not particularly limited in the embodiments of the present application.
The control device of the electronic device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an ios operating system, or other possible operating systems, and the embodiment of the present application is not limited specifically.
The control device for the electronic equipment provided by the embodiment of the application can realize each process of the method embodiment, and in order to avoid repetition, the description is omitted here.
Optionally, as shown in fig. 6, the embodiment of the present application further provides an electronic device 600, including a processor 601 and a memory 602, where the memory 602 stores a program or an instruction that can be executed on the processor 601, and the program or the instruction implement each step of the embodiment of the control method of the electronic device when executed by the processor 601, and achieve the same technical effect, so that repetition is avoided and no further description is given here.
The electronic device in the embodiment of the application includes the mobile electronic device and the non-mobile electronic device.
Fig. 7 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.
The electronic device 700 includes, but is not limited to: radio frequency unit 701, network module 702, audio output unit 703, input unit 704, sensor 705, display unit 706, user input unit 707, interface unit 708, memory 709, and processor 710.
Those skilled in the art will appreciate that the electronic device 700 may also include a power source (e.g., a battery) for powering the various components, which may be logically connected to the processor 710 via a power management system so as to perform functions such as managing charge, discharge, and power consumption via the power management system. The electronic device structure shown in fig. 7 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than shown, or may combine certain components, or may be arranged in different components, which are not described in detail herein.
Wherein the processor 710 is configured to:
acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature;
determining a first power consumption reduction amount of the electronic device;
Determining a working frequency point of the electronic equipment according to the first running power consumption, the estimated power consumption and the first power consumption reduction;
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
In some embodiments, processor 710 is configured to:
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount and the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, of the at least two candidate frequency points of the electronic equipment as the working frequency points.
In some embodiments, processor 710 is configured to:
Acquiring working power consumption and voltage corresponding to the candidate frequency points;
and determining the power consumption reduction corresponding to the candidate frequency point according to the candidate frequency point and the working power consumption and the voltage corresponding to the candidate frequency point.
In some embodiments, processor 710 is configured to:
Obtaining the energy efficiency score of each candidate frequency point; the energy efficiency score of the candidate frequency point is positively correlated with the performance index value of the electronic equipment under the candidate frequency point;
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount, of the at least two candidate frequency points of the electronic equipment, the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, and the energy efficiency score meets the preset condition as the working frequency points.
In some embodiments, processor 710 is configured to:
For each chip in the electronic equipment, calculating the product of the current utilization rate of the chip, the current load of the chip and the working power consumption corresponding to the current working frequency point of the chip to obtain the basic power consumption of the chip;
Calculating the product of basic power consumption of the chip and calculation force corresponding to the working state of the chip to obtain first operation power consumption of the chip;
and summing the first operation power consumption of each chip to obtain the first operation power consumption of the electronic equipment.
In some embodiments, processor 710 is configured to:
and for each chip in the electronic equipment, based on an energy-aware scheduling strategy, determining the working power consumption corresponding to the chip at the current working frequency point by utilizing the energy efficiency of the chip at the current working frequency point.
In some embodiments, processor 710 is configured to:
Under the condition that the electronic equipment comprises at least two chip clusters, the load of each chip cluster is obtained;
Determining a chip included in the chip cluster with the smallest load as a first chip;
And determining the working frequency point of the first chip according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount, and taking the working frequency point of the first chip as the working frequency point of the electronic equipment.
In some embodiments, processor 710 is configured to:
And resetting the working frequency point of the electronic equipment under the condition that the operating temperature of the electronic equipment is smaller than a second temperature, wherein the second temperature is smaller than or equal to the first temperature.
In some embodiments, processor 710 is configured to:
identifying an application scene of the electronic equipment;
And determining the triggering temperature corresponding to the application scene as the first temperature.
The electronic device 700 provided in the embodiment of the present application can implement each process of the method embodiment, and in order to avoid repetition, a description is omitted here.
It should be appreciated that in embodiments of the present application, the input unit 704 may include a graphics processor (Graphics Processing Unit, GPU) 7041 and a microphone 7042, with the graphics processor 7041 processing image data of still pictures or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The display unit 706 may include a display panel 7061, and the display panel 7061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 707 includes at least one of a touch panel 7071 and other input devices 7072. The touch panel 7071 is also referred to as a touch screen. The touch panel 7071 may include two parts, a touch detection device and a touch controller. Other input devices 7072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and so forth, which are not described in detail herein.
The memory 709 may be used to store software programs as well as various data. The memory 709 may mainly include a first storage area storing programs or instructions and a second storage area storing data, wherein the first storage area may store an operating system, application programs or instructions (such as a sound playing function, an image playing function, etc.) required for at least one function, and the like. Further, the memory 709 may include volatile memory or nonvolatile memory, or the memory 709 may include both volatile and nonvolatile memory. The nonvolatile Memory may be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable EPROM (EEPROM), or a flash Memory. The volatile memory may be random access memory (Random Access Memory, RAM), static random access memory (STATIC RAM, SRAM), dynamic random access memory (DYNAMIC RAM, DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate Synchronous dynamic random access memory (Double DATA RATE SDRAM, DDRSDRAM), enhanced Synchronous dynamic random access memory (ENHANCED SDRAM, ESDRAM), synchronous link dynamic random access memory (SYNCH LINK DRAM, SLDRAM), and Direct random access memory (DRRAM). Memory 709 in embodiments of the application includes, but is not limited to, these and any other suitable types of memory.
Processor 710 may include one or more processing units; optionally, processor 710 integrates an application processor that primarily processes operations involving an operating system, user interface, application programs, and the like, and a modem processor that primarily processes wireless communication signals, such as a baseband processor. It will be appreciated that the modem processor described above may not be integrated into the processor 710.
The embodiment of the application also provides a readable storage medium, on which a program or an instruction is stored, which when executed by a processor, implements each process of the control method embodiment of the electronic device, and can achieve the same technical effects, so that repetition is avoided, and no further description is given here.
Wherein the processor is a processor in the electronic device described in the above embodiment. The readable storage medium includes computer readable storage medium such as computer readable memory ROM, random access memory RAM, magnetic or optical disk, etc.
The embodiment of the application further provides a chip, the chip comprises a processor and a communication interface, the communication interface is coupled with the processor, the processor is used for running programs or instructions, the processes of the control method embodiment of the electronic device can be realized, the same technical effects can be achieved, and the repetition is avoided, and the description is omitted here.
It should be understood that the chips referred to in the embodiments of the present application may also be referred to as system-on-chip chips, chip systems, or system-on-chip chips, etc.
Embodiments of the present application provide a computer program product stored in a storage medium, where the program product is executed by at least one processor to implement the respective processes of the control method embodiments of the electronic device, and achieve the same technical effects, and are not described herein in detail to avoid repetition.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a computer software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method according to the embodiments of the present application.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims (10)

1. A control method of an electronic apparatus, characterized by comprising:
acquiring first operation power consumption and estimated power consumption of the electronic equipment under the condition that the operation temperature of the electronic equipment is greater than or equal to a first temperature;
determining a first power consumption reduction amount of the electronic device;
Determining a working frequency point of the electronic equipment according to the first running power consumption, the estimated power consumption and the first power consumption reduction;
The second power consumption reduction amount corresponding to the working frequency point is greater than or equal to the first power consumption reduction amount, the operation temperature corresponding to the second operation power consumption is less than or equal to the operation temperature corresponding to the estimated power consumption, and the second operation power consumption is the operation power consumption corresponding to the working frequency point.
2. The method of claim 1, wherein the determining the operating frequency point of the electronic device based on the first operating power consumption, the estimated power consumption, and the first power consumption reduction comprises:
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount and the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, of the at least two candidate frequency points of the electronic equipment as the working frequency points.
3. The method according to claim 2, wherein the determining of the power consumption reduction amount corresponding to the candidate frequency point includes:
Acquiring working power consumption and voltage corresponding to the candidate frequency points;
and determining the power consumption reduction corresponding to the candidate frequency point according to the candidate frequency point and the working power consumption and the voltage corresponding to the candidate frequency point.
4. The method according to claim 1, wherein the method further comprises:
Obtaining the energy efficiency score of each candidate frequency point; the energy efficiency score of the candidate frequency point is positively correlated with the performance index value of the electronic equipment under the candidate frequency point;
And taking the candidate frequency points, of which the power consumption reduction amount is larger than or equal to the first power consumption reduction amount, of the at least two candidate frequency points of the electronic equipment, the operation temperature corresponding to the operation power consumption is smaller than or equal to the operation temperature corresponding to the estimated power consumption, and the energy efficiency score meets the preset condition as the working frequency points.
5. The method of claim 1, wherein the step of obtaining the first operating power consumption of the electronic device comprises:
For each chip in the electronic equipment, calculating the product of the current utilization rate of the chip, the current load of the chip and the working power consumption corresponding to the current working frequency point of the chip to obtain the basic power consumption of the chip;
Calculating the product of basic power consumption of the chip and calculation force corresponding to the working state of the chip to obtain first operation power consumption of the chip;
and summing the first operation power consumption of each chip to obtain the first operation power consumption of the electronic equipment.
6. The method of claim 5, wherein the method further comprises:
and for each chip in the electronic equipment, based on an energy-aware scheduling strategy, determining the working power consumption corresponding to the chip at the current working frequency point by utilizing the energy efficiency of the chip at the current working frequency point.
7. The method of claim 1, wherein prior to determining the operating frequency point of the electronic device based on the first operating power consumption, the estimated power consumption, and the first power consumption reduction amount, the method further comprises:
Under the condition that the electronic equipment comprises at least two chip clusters, the load of each chip cluster is obtained;
Determining a chip included in the chip cluster with the smallest load as a first chip;
The determining the operating frequency point of the electronic device according to the first operating power consumption, the estimated power consumption and the first power consumption reduction amount includes:
And determining the working frequency point of the first chip according to the first running power consumption, the estimated power consumption and the first power consumption reduction amount, and taking the working frequency point of the first chip as the working frequency point of the electronic equipment.
8. The method according to claim 1, wherein the method further comprises:
And resetting the working frequency point of the electronic equipment under the condition that the operating temperature of the electronic equipment is smaller than a second temperature, wherein the second temperature is smaller than or equal to the first temperature.
9. The method according to claim 1, wherein the method further comprises:
identifying an application scene of the electronic equipment;
And determining the triggering temperature corresponding to the application scene as the first temperature.
10. An electronic device comprising a processor and a memory storing a program or instructions executable on the processor, which when executed by the processor, implement the steps of the method of controlling an electronic device as claimed in any one of claims 1 to 9.
CN202410233780.8A 2024-02-29 2024-02-29 Electronic equipment control method and electronic equipment Pending CN118092615A (en)

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