CN118073367A - Display panel and display device - Google Patents

Abstract

The disclosure provides a display panel and a display device, belongs to the technical field of display, and can solve the problem that short circuit is easy to occur between adjacent signal leads in the existing display panel, and the display effect is affected. The utility model discloses a have the display area and set gradually in fan-out district and the binding area of display area one side, display panel includes: a substrate, a plurality of signal leads on the substrate; the signal leads extend from the fan-out region to the binding region; each signal lead includes: a first sub-signal lead and a second sub-signal lead which are arranged in a stacked manner; the display panel further includes: an organic insulating layer between the first and second sub-signal leads; the organic insulating layer is cut off at the junction of the fan-out area and the binding area and forms an edge part; the orthographic projection of the first sub-signal lead wire on the substrate is not overlapped with the orthographic projection of the edge part on the substrate; the orthographic projection of the second sub-signal lead on the substrate overlaps with the orthographic projection of the edge portion on the substrate.

Description

Display panel and display device

Technical Field

The disclosure belongs to the technical field of display, and particularly relates to a display panel and a display device.

Background

Along with the continuous improvement of the sensory pursuit of users on display screens and the continuous progress of display technologies, display products such as four-sided curves, folds, reels and the like gradually enter a display market, and meanwhile, the demand for the flexibility of the display products is further improved, so that the display products have better bending forms and become indispensable technical stores. In the Touch display panel (Touch SCREEN PANEL, TSP), because the inorganic insulating layer has higher hardness, the conventional product has the problem of lamination cracks (cracks) generated by extrusion when the Touch display panel enters into the arc surfaces of four corners in the multi-form bending process. Compared with an inorganic insulating layer, the organic insulating layer has better stretchability and ductility and can be better suitable for various bending modes, so that the interlayer insulating layer in the touch display panel is generally an organic insulating layer.

Because the thickness of the organic insulating layer is thicker, generally more than 2.4 micrometers, the gradient angle of the edge is larger, an undercut structure (Undercut) is easy to form at the edge, and when the metal conducting layer is deposited on the organic insulating layer, optical adhesive residues are easy to cause due to the structural limitation of the edge of the organic insulating layer, and finally the metal conducting layer on the organic insulating layer is caused to remain, so that short circuit occurs between adjacent metal wires, and the display effect is affected.

Disclosure of Invention

The disclosure aims to at least solve one of the technical problems in the prior art, and provides a display panel and a display device.

In a first aspect, an embodiment of the present disclosure provides a display panel having a display area and a fan-out area and a binding area sequentially disposed on one side of the display area, the display panel including: a substrate, a plurality of signal leads on the substrate; the signal leads extend from the fan-out region to the binding region; each of the signal leads includes: a first sub-signal lead and a second sub-signal lead which are arranged in a stacked manner; the display panel further includes: an organic insulating layer between the first and second sub-signal leads; the organic insulating layer is cut off at the junction of the fan-out area and the binding area and forms an edge part;

The orthographic projection of the first sub-signal lead wire on the substrate is not overlapped with the orthographic projection of the edge part on the substrate; the orthographic projection of the second sub-signal lead on the substrate overlaps with the orthographic projection of the edge portion on the substrate.

In some embodiments, the first sub-signal lead is cut off at the fan-out region; the second sub-signal leads extend the bonding region from the fan-out region.

In some embodiments, a distance between a cutoff of the first sub-signal lead and an interface of the fan-out region and the bonding region is greater than 10 microns.

In some embodiments, the first sub-signal leads and the second sub-signal leads each extend from the fan-out region to the bonding region, and the first sub-signal leads are disconnected at the edge portions corresponding positions.

In some embodiments, the distances between the breaks of the first sub-signal leads and the interfaces of the fan-out and bonding regions are each greater than 10 microns.

In some embodiments, the first sub-signal lead and the second sub-signal lead are electrically connected by a via penetrating the organic insulating layer.

In some embodiments, the display panel further comprises: pins positioned on the substrate and arranged in the binding area;

The pin is electrically connected with the first sub-signal lead and the second sub-signal lead.

In some embodiments, the display panel further comprises: a flexible circuit board;

and the flexible circuit board is connected with the pins in a binding way.

In some embodiments, the display panel further comprises: a driving chip;

The driving chip is located on the flexible circuit board and is bent to one side, away from the first sub-signal lead, of the substrate through the flexible circuit board.

In a second aspect, implementations of the present disclosure provide a display device including a display panel as provided above.

Drawings

Fig. 1 is a schematic structural view of an exemplary display panel.

Fig. 2 is an enlarged schematic view of the area M of the display panel shown in fig. 1.

Fig. 3 is a schematic diagram illustrating a manufacturing process of an exemplary display panel.

Fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the disclosure.

Fig. 5 is an enlarged schematic view of the N region of the display panel shown in fig. 4.

Fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the disclosure.

Fig. 7 is an enlarged schematic view of the P region of the display panel shown in fig. 6.

Detailed Description

In order that those skilled in the art will better understand the technical solutions of the present disclosure, the present disclosure will be described in further detail with reference to the accompanying drawings and detailed description. Embodiments may be implemented in a number of different forms. One of ordinary skill in the art can readily appreciate the fact that the manner and content may be varied into a wide variety of forms without departing from the spirit and scope of the present disclosure. Accordingly, the present disclosure should not be construed as being limited to the following description of the embodiments. Embodiments of the present disclosure and features of embodiments may be combined with each other arbitrarily without conflict.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

The scale of the drawings in this disclosure may be referred to in the actual process, but is not limited thereto. For example: the thickness and the interval of each film layer, and the width and the interval of each signal line can be adjusted according to actual needs. The number of pixels in the display panel and the number of sub-pixels in each pixel are not limited to the number shown in the drawings, the drawings described in the present disclosure are only schematic structural drawings, and one mode of the present disclosure is not limited to the shapes or values shown in the drawings, etc.

In the description of the present disclosure, words such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which designate orientation or positional relationship, are used for convenience in describing the positional relationship of the constituent elements with reference to the drawings, are merely for convenience in describing the present description and simplifying the description, and do not designate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus are not to be construed as limiting the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which the respective constituent elements are described. Therefore, the present invention is not limited to the words described in the specification, and may be appropriately replaced according to circumstances.

Fig. 1 is a schematic structural diagram of an exemplary display panel, fig. 2 is an enlarged structural diagram of an area M of the display panel shown in fig. 1, and as shown in fig. 1 and 2, the display panel has a display area AA, and a fan-out area BB and a binding area CC sequentially disposed at one side of the display area AA, and the display panel includes: a substrate 101, a plurality of signal leads 102 on the substrate 101; the signal leads 102 extend from the fan-out regions BB to the bonding regions CC; each signal lead 102 includes: a first sub-signal lead 1021 and a second sub-signal lead 1022 arranged in a stacked manner; the display panel further includes: an organic insulating layer 103 between the first and second sub-signal leads 1021 and 1022; the organic insulating layer 103 is cut off at the interface of the fan-out area BB and the bonding area CC and forms an edge portion 1031. The display panel further includes: a plurality of gate lines 104 and a plurality of data lines 105 disposed on the substrate 101 in the display area AA, and pixel units are formed in crossing regions of the gate lines 104 and the data lines 105. The pixel unit is provided with a structure such as a pixel driving circuit and a light emitting device, and will not be described in detail here.

The pixel unit may be electrically connected to the gate line 104 and the data line 105 to transmit a scan signal and a data signal. The data lines 105 may be connected to the signal leads 102 in a one-to-one correspondence, or the data lines 105 may extend directly to the fan-out regions BB to form the signal leads 102.

In practical applications, the signal lead 102 generally adopts a double-layer or multi-layer structure to reduce the resistance of the signal lead 102, and a double-layer structure in which the signal lead 102 is provided as a stack of a first sub-signal lead 1021 and a second sub-signal impression 1022 will be described in this disclosure.

Fig. 3 is a schematic view illustrating a manufacturing process of an exemplary display panel, in which only partial structures (i.e., the structure shown in fig. 2) such as the substrate 101 and the signal leads 102 in the display panel are shown in fig. 3, as shown in fig. 3, the thickness of the organic insulating layer 103 is thicker, typically more than 2.4 micrometers, the slope angle of the edge is larger, and meanwhile, as the signal leads 102 adopt a double-layer structure, the thickness of the organic insulating layer 103 between adjacent signal leads 102 is greater than the thickness of the organic insulating layer 103 at the positions of the signal leads 102, because the first sub-signal lead 1021 is present below the organic insulating layer 103 at the positions of the signal leads 102, and no first sub-signal lead 1021 is present below the organic insulating layer 103 between the adjacent signal leads 102, i.e., the physical height of the film layer between the adjacent signal leads 102 is greater than the physical height of the film between the adjacent signal leads 102, when the organic insulating material is coated, due to better leveling property of the organic insulating material, so that the organic insulating material flows between the adjacent signal leads 102. When removing the excessive organic insulating material, the undercut structure (Undercut) is easily formed at the edge portion 1031 of the organic insulating layer 103 between the adjacent signal leads 102. Since the gaps between the adjacent signal leads 102 are small, photoresist is easily left between the adjacent second sub-signal leads 1022 when the second sub-signal leads 1022 are formed, and finally, the second sub-signal leads 1022 are partially left, so that short circuits occur between the adjacent second sub-signal leads 1022, and the display effect is affected.

In order to solve at least one of the above technical problems, the embodiments of the present disclosure provide a display panel and a display device, and the display panel and the display device provided by the embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings and detailed description.

In a first aspect, an embodiment of the present disclosure provides a display panel, fig. 4 is a schematic structural diagram of the display panel provided in the embodiment of the present disclosure, fig. 5 is an enlarged schematic structural diagram of an N region in the display panel shown in fig. 4, and as shown in fig. 4 and 5, the display panel has a display area AA, and a fan-out area BB and a binding area CC sequentially disposed on one side of the display area AA, where the display panel includes: a substrate 101, a plurality of signal leads 102 on the substrate 101; the signal leads 102 extend from the fan-out regions BB to the bonding regions CC; each signal lead 102 includes: a first sub-signal lead 1021 and a second sub-signal lead 1022 arranged in a stacked manner; the display panel further includes: an organic insulating layer 103 between the first and second sub-signal leads 1021 and 1022; the organic insulating layer 103 is cut off at the interface of the fan-out area BB and the bonding area CC and forms an edge portion 1031. The display panel further includes: a plurality of gate lines 104 and a plurality of data lines 105 disposed on the substrate 101 in the display area AA, and pixel units are formed in crossing regions of the gate lines 104 and the data lines 105. The pixel unit is provided with a structure such as a pixel driving circuit and a light emitting device, and will not be described in detail here.

The difference from the display panel shown in fig. 1 and 2 described above is that in the display panel shown in fig. 4 and 5, the front projection of the first sub-signal lead 1021 on the substrate 101 does not overlap with the front projection of the edge portion 1031 on the substrate 101; the front projection of the second sub-signal lead 1022 on the substrate 101 overlaps with the front projection of the edge portion 1031 on the substrate 101.

In the display panel provided by the embodiment of the disclosure, the signal lead 102 is made of a double-layer structure of the first sub-signal lead 1021 and the second sub-signal lead 1022, and the organic insulating layer 103 is located between the first sub-signal lead 1021 and the second sub-signal lead 1022, where the front projection of the first sub-signal lead 1021 on the substrate 101 does not overlap with the front projection of the edge portion 1031 on the substrate 101, that is, the edge position of the organic insulating layer 103 is not provided with the first sub-signal lead 1021. When the organic insulating layer 103 is formed on the first sub-signal lead 1021, since the first sub-signal lead 1021 is not disposed in each region under the edge portion 1031 of the organic insulating layer 103, the thickness of the organic insulating layer 103 at the position of the signal lead 102 is the same as the thickness of the organic insulating layer 103 between adjacent signal leads 102, that is, the thicknesses are smaller, so that the gradient of the edge portion 1031 is smaller, and the undercut structure (Undercut) is avoided. When the second sub-signal lead 1022 is formed on the organic insulating layer 103, the photoresist is not easily left at the position of the edge portion 1031, so that the material of the second sub-signal lead 1022 is prevented from being left, and thus, the short circuit between the adjacent second sub-signal leads 1022 is prevented, and the display effect of the display panel is improved.

As shown in fig. 4 and 5, the first sub-signal lead 1021 is cut off at the fan-out area BB; the second sub-signal leads 1022 extend from the fan-out region BB to the bonding region CC.

In the display panel shown in fig. 4 and 5, the first sub-signal lead 1021 is cut off at the fan-out area BB, i.e., corresponds to the removal of the first sub-signal lead 1021 of the bonding area CC, where signals are transmitted only through the second sub-signal lead 1021. When the organic insulating layer 103 is formed on the first sub-signal lead 1021, since the first sub-signal lead 1021 is not disposed in each region under the edge portion 1031 of the organic insulating layer 103, the thickness of the organic insulating layer 103 at the position of the signal lead 102 is the same as the thickness of the organic insulating layer 103 between adjacent signal leads 102, that is, the thicknesses are smaller, so that the gradient of the edge portion 1031 is smaller, and the undercut structure (Undercut) is avoided. When the second sub-signal lead 1022 is formed on the organic insulating layer 103, the photoresist is not easily left at the position of the edge portion 1031, so that the material of the second sub-signal lead 1022 is prevented from being left, and thus, the short circuit between the adjacent second sub-signal leads 1022 is prevented, and the display effect of the display panel is improved.

In practical application, the distance between the cut-off position of the first sub-signal lead 1021 and the junction between the fan-out area BB and the bonding area CC is greater than 10 micrometers, so that a sufficient distance between the first sub-signal lead 1021 and the edge portion 1031 can be ensured, the first sub-signal lead 1021 is prevented from influencing the thickness of the organic insulating layer 103 thereon, the thicknesses of the organic insulating layer 103 in all areas are ensured to be the same, and the edge portion 1031 is prevented from forming an undercut structure (Undercut).

Fig. 6 is a schematic structural view of another display panel according to an embodiment of the present disclosure, fig. 7 is an enlarged structural view of a P region in the display panel shown in fig. 6, and the display panel shown in fig. 6 and fig. 7 is different from the display panel shown in fig. 4 and fig. 5 in that the first sub-signal lead 1021 and the second sub-signal lead 1022 are each extended from the fan-out area BB to the bonding area CC, and the first sub-signal lead 1021 is disconnected at a position corresponding to the edge portion 1031.

In the display panel shown in fig. 6 and 7, the first sub-signal lead 1021 is provided in a disconnected state at a position corresponding to the edge portion 1031, and signals are transmitted only through the second sub-signal lead 1021 at this position. When the organic insulating layer 103 is formed on the first sub-signal lead 1021, since the first sub-signal lead 1021 is not disposed in each region under the edge portion 1031 of the organic insulating layer 103, the thickness of the organic insulating layer 103 at the position of the signal lead 102 is the same as the thickness of the organic insulating layer 103 between adjacent signal leads 102, that is, the thicknesses are smaller, so that the gradient of the edge portion 1031 is smaller, and the undercut structure (Undercut) is avoided. When the second sub-signal lead 1022 is formed on the organic insulating layer 103, the photoresist is not easily left at the position of the edge portion 1031, so that the material of the second sub-signal lead 1022 is prevented from being left, and thus, the short circuit between the adjacent second sub-signal leads 1022 is prevented, and the display effect of the display panel is improved.

In practical applications, the distances between the break of the first sub-signal lead 1021 and the boundary between the fan-out area BB and the bonding area CC are all greater than 10 micrometers. In this way, a sufficient distance between the first sub-signal lead 1021 and the edge portion 1031 can be ensured, the first sub-signal lead 1021 is prevented from affecting the thickness of the organic insulating layer 103 thereon, the thickness of the organic insulating layer 103 in each region is ensured to be the same, and the edge portion 1031 is prevented from forming an undercut structure (Undercut).

In some embodiments, as shown in fig. 5 and 7, the first and second sub-signal leads 1021 and 1022 are electrically connected by a via V that penetrates the organic insulating layer 103.

The first sub-signal lead 1021 and the second sub-signal lead 1022 together form the signal lead 102, so that the signal lead 102 has a double-layer structure, the via hole V can electrically connect the two, which is equivalent to increasing the overall thickness of the signal lead 102, thereby reducing the resistance of the signal lead 102, avoiding the voltage drop caused by overlarge impedance in the signal transmission process, and further improving the display effect of the display panel.

In some embodiments, as shown in fig. 4 and 6, the display panel further includes: pins 106 located on the substrate 101 and disposed in the bonding region CC; the pin 106 is electrically connected to the first sub-signal lead 1021 and the second sub-signal lead 1022.

The pins 106 may be formed with a metal conductive layer in the driving circuit, and electrically connected to the first and second sub-signal leads 1021 and 1022 to electrically connect with an external driving chip or the like through the pins 106, so as to transmit driving signals to the data lines 105 through the signal leads 102.

In some embodiments, as shown in fig. 4 and 6, the display panel further includes: a flexible wiring board 107; the flexible wiring board 107 is bonded to the pins 106. The display panel further includes: a driving chip 108; the driving chip 108 is located on the flexible circuit board 107, and is bent to a side of the substrate 101 away from the first sub-signal lead 1021 through the flexible circuit board 107.

The driving chip 108 may provide driving signals and be connected to the pins 106 through the flexible circuit board 107, so that the driving signals provided by the driving chip 108 may be transmitted to the data lines 105 through the signal leads 102. In practical application, the driving chip 108 can be directly arranged on the flexible circuit board 107 and electrically connected with the flexible circuit board 107, and because the flexible circuit board 107 has good bending performance, the flexible circuit board 107 and the driving chip 108 can be directly bent to the back of the substrate 101, thus the occupied area of the flexible circuit board 107 and the driving chip 108 can be reduced, the frame of the display panel can be reduced, the screen occupation ratio of the display panel can be improved, and the display effect can be further improved.

In a second aspect, an embodiment of the present disclosure provides a display device, where the display device includes a display panel provided in any one of the embodiments above, and the display device may be any product or component having a display function, such as a television, a mobile phone, a display, a notebook computer, a digital photo frame, and a navigator. The implementation principle is similar to that of the display panel described above, and will not be described here again.

It is to be understood that the above embodiments are merely exemplary embodiments employed to illustrate the principles of the present disclosure, however, the present disclosure is not limited thereto. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the disclosure, and are also considered to be within the scope of the disclosure.

Claims (10)

1. A display panel having a display area and a fan-out area and a binding area sequentially disposed on one side of the display area, the display panel comprising: a substrate, a plurality of signal leads on the substrate; the signal leads extend from the fan-out region to the binding region; each of the signal leads includes: a first sub-signal lead and a second sub-signal lead which are arranged in a stacked manner; the display panel further includes: an organic insulating layer between the first and second sub-signal leads; the organic insulating layer is cut off at the junction of the fan-out area and the binding area and forms an edge part;

The orthographic projection of the first sub-signal lead wire on the substrate is not overlapped with the orthographic projection of the edge part on the substrate; the orthographic projection of the second sub-signal lead on the substrate overlaps with the orthographic projection of the edge portion on the substrate.

2. The display panel of claim 1, wherein the first sub-signal leads terminate at the fan-out region; the second sub-signal leads extend the bonding region from the fan-out region.

3. The display panel of claim 2, wherein a distance between a cutoff of the first sub-signal lead and an interface of the fan-out region and the bonding region is greater than 10 microns.

4. The display panel of claim 1, wherein the first and second sub-signal leads each extend from the fan-out region to the bonding region, the first sub-signal lead being disposed at a corresponding location of the edge portion.

5. The display panel of claim 4, wherein the distances between the breaks of the first sub-signal leads and the interfaces of the fan-out and bonding regions are each greater than 10 microns.

6. The display panel of claim 1, wherein the first and second sub-signal leads are electrically connected by a via penetrating the organic insulating layer.

7. The display panel of claim 1, further comprising: pins positioned on the substrate and arranged in the binding area;

The pin is electrically connected with the first sub-signal lead and the second sub-signal lead.

8. The display panel of claim 7, further comprising: a flexible circuit board;

and the flexible circuit board is connected with the pins in a binding way.

9. The display panel of claim 8, further comprising: a driving chip;

The driving chip is located on the flexible circuit board and is bent to one side, away from the first sub-signal lead, of the substrate through the flexible circuit board.

10. A display device comprising the display panel according to any one of claims 1 to 9.