CN118068090A - Capacitance test structure and capacitance test system - Google Patents

Capacitance test structure and capacitance test system Download PDF

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Publication number
CN118068090A
CN118068090A CN202410038036.2A CN202410038036A CN118068090A CN 118068090 A CN118068090 A CN 118068090A CN 202410038036 A CN202410038036 A CN 202410038036A CN 118068090 A CN118068090 A CN 118068090A
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China
Prior art keywords
capacitance
devices
contact hole
metal piece
capacitor
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CN202410038036.2A
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Chinese (zh)
Inventor
张旭
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Maxscend Microelectronics Co ltd
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Maxscend Microelectronics Co ltd
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Priority to CN202410038036.2A priority Critical patent/CN118068090A/en
Publication of CN118068090A publication Critical patent/CN118068090A/en
Pending legal-status Critical Current

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Abstract

The application discloses a capacitance test structure and a capacitance test system, and belongs to the technical field of capacitance devices. A capacitance test structure comprising: a plurality of capacitor devices, each capacitor device comprising a stacked lower plate, a dielectric layer and an upper plate; the first metal piece is respectively connected with the lower polar plate of each capacitor in a conductive way; the second metal piece is respectively connected with the upper polar plates of the capacitors in a conductive manner; the first metal piece and the second metal piece are used for connecting capacitance testing equipment. According to the capacitance test structure, the first metal piece and the second metal piece are utilized to connect a plurality of capacitors to be tested in parallel, so that the capacitance of the capacitance test structure is increased, the influence of parasitic capacitance of the capacitance test equipment can be reduced, the interference of the parasitic capacitance of the capacitance test equipment on the capacitance test is eliminated, and the test accuracy is improved.

Description

Capacitance test structure and capacitance test system
Technical Field
The application belongs to the technical field of capacitance devices, and particularly relates to a capacitance testing structure and a capacitance testing system.
Background
Conventional MIM (metal-insulator-metal) capacitor test structures are susceptible to parasitic capacitance interference from test equipment, thereby affecting the accuracy of the test results. For the test structure of MIM capacitor, the smaller the size (smaller the capacitance value) is, the larger the influence of the test system is.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides the capacitance test structure and the capacitance test system, which increase the capacitance of the capacitance test structure, reduce the influence of parasitic capacitance of capacitance test equipment and improve the test accuracy.
In a first aspect, the present application provides a capacitance test structure comprising:
A plurality of capacitor devices, each capacitor device comprising a stacked lower plate, a dielectric layer and an upper plate;
the first metal piece is respectively connected with the lower polar plate of each capacitor in a conductive way;
the second metal piece is respectively connected with the upper polar plates of the capacitors in a conductive manner;
The first metal piece and the second metal piece are used for connecting capacitance testing equipment.
According to the capacitance test structure, the first metal piece and the second metal piece are utilized to connect a plurality of capacitors to be tested in parallel, so that the capacitance of the capacitance test structure is increased, the influence of parasitic capacitance of the capacitance test equipment can be reduced, the interference of the parasitic capacitance of the capacitance test equipment on the capacitance test is eliminated, and the test accuracy is improved.
According to one embodiment of the application, the plurality of capacitive devices are divided into a plurality of capacitive groups, and lower plates of the capacitive devices in the capacitive groups are integrally connected.
According to one embodiment of the application, the capacitive devices are arranged in an array, the capacitive devices within each capacitive group being arranged along a first direction.
According to one embodiment of the application, the lower electrode plate in each capacitor group is provided with at least one first contact hole arranged along a first direction; the first metal piece comprises a first main part and at least one first branch part extending from the first main part, wherein the first main part is arranged along a second direction, each first branch part is arranged along a first direction and is electrically connected with each lower polar plate through a first contact hole, and the first direction is perpendicular to the second direction.
According to one embodiment of the application, the lower electrode plates in each capacitor group are provided with at least one first contact hole arranged along a second direction, the first metal piece is arranged along the second direction and is electrically connected with each lower electrode plate through the first contact hole, and the first direction is perpendicular to the second direction.
According to one embodiment of the present application, the first contact hole is disposed at one of both ends of each lower plate in the first direction.
According to one embodiment of the application, the capacitive devices are arranged in an array, and each capacitive group comprises at least one row and at least one column of capacitive devices.
According to one embodiment of the application, at least one first contact hole arranged along the first direction is arranged between two adjacent capacitor device sets arranged along the first direction on each lower polar plate; the first metal piece comprises a first main part and a plurality of first branch parts extending from the first main part, wherein the first main part is arranged along a second direction, and each first branch part is arranged along the first direction and is electrically connected with each lower polar plate through a first contact hole.
According to one embodiment of the application, the lower plates of all the capacitive devices are integrally connected.
According to one embodiment of the application, the capacitor devices are arranged in an array, and the lower polar plate is provided with at least one first contact hole arranged along a first direction; the first metal piece comprises a first main part and a first branch part, wherein the first main part is arranged along the second direction, the first branch part is arranged along the first direction and is in conductive connection with the lower polar plate through a first contact hole, and the first direction is perpendicular to the second direction.
According to one embodiment of the present application, the first contact hole is disposed at one of both ends of the lower plate in the second direction.
According to one embodiment of the application, the capacitor devices are arranged in an array, the upper polar plate of each capacitor device is provided with at least one second contact hole, the second metal piece comprises a second main part and at least one second branch part extending from the second main part, and each second branch part is arranged along the first direction and is electrically connected with each upper polar plate through each second contact hole.
In a second aspect, the application provides a capacitance testing system, which comprises capacitance testing equipment and a capacitance testing structure according to the foregoing, wherein the capacitance testing equipment is electrically connected with the capacitance testing structure.
According to the capacitance test system, the influence of the parasitic capacitance of the capacitance test equipment can be reduced due to the fact that the capacitance of the capacitance test structure is larger, so that interference of the parasitic capacitance of the capacitance test equipment on capacitance test is eliminated, and test accuracy is improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a capacitive test structure according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a capacitive device according to an embodiment of the present application;
FIG. 3 is a second schematic diagram of a capacitive test structure according to an embodiment of the present application;
FIG. 4 is a third schematic diagram of a capacitive test structure according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a capacitive test structure according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a capacitive test structure according to an embodiment of the present application;
Fig. 7 is a schematic structural diagram of a capacitive test structure according to an embodiment of the present application.
Reference numerals:
The capacitor device comprises a capacitor device 10, a lower electrode plate 11, a dielectric layer 12, an upper electrode plate 13, a first contact hole 14, a second contact hole 15, a first metal piece 20, a first main part 21, a first branch part 22, a second metal piece 30, a second main part 31, a second branch part 32 and a capacitor test device 40.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings. In the drawings, the size of layers, regions, elements and their relative sizes may be exaggerated for clarity. Wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
It will be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure. When a second element, component, region, layer or section is discussed, it does not necessarily mean that the first element, component, region, layer or section is present in the present disclosure.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1, fig. 1 shows a capacitance test structure. One embodiment of the present application provides a capacitance test structure. In the present embodiment, the capacitance test structure includes a plurality of capacitance devices 10, a first metal piece 20, and a second metal piece 30. Each capacitor device 10 comprises a lower polar plate 11, a dielectric layer 12 and an upper polar plate 13 which are stacked, and the first metal piece 20 is respectively connected with the lower polar plate 11 of each capacitor 10 in a conductive way; the second metal piece 30 is respectively connected with the upper electrode plate 13 of each capacitor in a conductive way; wherein the first metal piece 20 and the second metal piece 30 are used for connecting a capacitance testing device 40.
The capacitive device 10 may be a MIM capacitor. The area of the lower electrode plate 11 may be larger than the area of the upper electrode plate 13, the area of the dielectric layer 12 is equal to the area of the upper electrode plate 13, and the capacitance value of the capacitor device 10 depends on the area of the upper electrode plate 13. The area of the upper plate 13 of each capacitive device 10 is the same.
The side of the lower plate 11 facing the upper plate 13 has an exposed area not covered by the dielectric layer. The exposed area may facilitate connection of the first metal piece 20. Thus, the first metal piece 20 and the second metal piece 30 can be connected to the same side of the capacitive device 10, reducing the space occupied by the test structure in the thickness direction of the capacitive device 10.
Referring to fig. 2, fig. 2 shows a schematic diagram of a test of a capacitive device. The capacitive device 10 may further be provided with at least one first contact hole 14 and at least one second contact hole 15, the first contact hole 14 being for connecting the first metal piece 20 and the lower plate 11, and the second contact hole 15 being for connecting the second metal piece 30 and the upper plate 13. The more the contact holes are, the smaller the contact resistance between the metal piece and the polar plate is, and the higher the test accuracy is. The number of contact holes may be set according to the area of the electrode and the test requirements, which is not limited in this embodiment.
The capacitance testing device 40 has an input and an output. The input may be electrically connected to the first metal piece 20 and the output to the second metal piece 30. Or the input may be electrically connected to the second metal member 30 and the output to the first metal member 20. The capacitance test device 40 may output a current to the capacitance test structure for capacitance testing. The capacitance test may include a test of capacitance, performance parameters, such as capacitance value test, and the like.
The parasitic capacitance of the capacitive test device 40 is connected in parallel with the capacitive device 100 to be tested, so that the parasitic capacitance of the capacitive test device 40 will affect the capacitive test result. In the present embodiment, the lower electrode plates 11 of the respective capacitance devices 10 are connected to each other by the first metal member 20, the upper electrode plates 13 of the respective capacitance devices 10 are connected to each other by the second metal member 30, and the respective capacitance devices 10 are connected in parallel to each other, whereby the capacitance of the capacitance test structure increases. Since the parasitic capacitance of the capacitance test device 40 is relatively fixed, the larger the capacitance of the capacitance test structure, the smaller the ratio of the parasitic capacitance to the capacitance of the capacitance test structure, and thus the smaller the impact.
In other embodiments, the first metal member 20 may be connected to the side of the lower electrode plate 11 facing away from the upper electrode plate 13, i.e., the first metal member 20 and the second metal member 30 may be connected to two sides of the capacitive device 10 in the thickness direction.
According to the capacitance test structure, the first metal piece 20 and the second metal piece 30 are utilized to connect a plurality of capacitors to be tested in parallel, so that the capacitance of the capacitance test structure is increased, the influence of parasitic capacitance of the capacitance test equipment can be reduced, the interference of the parasitic capacitance of the capacitance test equipment on the capacitance test is eliminated, and the test accuracy is improved.
With continued reference to fig. 1, the capacitive devices 10 are arranged in an array. The first metal member 20 includes a first trunk portion 21 and at least one first branch portion 22 extending from the first trunk portion 21, the first trunk portion 21 being arranged in the second direction, each first branch portion 22 being arranged in the first direction and being electrically connected to each lower electrode plate 11 through the first contact hole 14. The second metal member 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, the second trunk portion 31 being arranged in the second direction, each second branch portion 32 being arranged in the first direction and being electrically connected to each upper electrode plate 13 through each second contact hole 15.
The following description will take the first direction as a column direction and the second direction as a row direction as an example.
The first metal member 20 may be disposed below the lowermost row of the capacitive devices 10 in the row direction, and the second metal member 30 may be disposed above the uppermost row of the capacitive devices 10 in the row direction, so that the space between the capacitive devices 10 of each row may be smaller and the structure may be more compact.
The number of first branch portions 22 and second branch portions 32 is the same as the number of columns of the capacitive device 10. The lower plates 11 in the capacitive devices 10 of each column are electrically connected to the same first branch 22 and the upper plates 13 in the capacitive devices 10 of each column are electrically connected to the same second branch 32. The contact holes on the capacitor devices 10 of each column are aligned in the column direction so that the respective branch portions connect the capacitor devices 10 in a straight line, and the respective branch portions may extend in a straight line.
In another embodiment, the capacitive devices 10 may also be arranged in only columns, or only rows. Wherein the alignment direction of the first contact hole 14 and the second contact hole 15 in the capacitive device 10 is perpendicular to the arrangement direction, whereby the first metal piece 20 and the second metal piece 30 may not require a branching portion. Of course, the capacitive devices 10 may also be arranged in an irregular track.
In some embodiments, the plurality of capacitive devices 10 are divided into a plurality of capacitive groups, and the lower plates 11 of the capacitive devices 10 in the capacitive groups are integrally connected.
In the present embodiment, the plurality of capacitor devices 10 share the same lower plate 11, and the pitch between the capacitor devices 10 can be reduced, thereby improving the arrangement density of the capacitor devices 10. Further, since the capacitance value of the capacitor device 10 depends on the facing area between the lower plate 11 and the upper plate 13, the lower plate 11 of each capacitor device 10 is integrally connected without changing the upper plate 13, and the capacitance value of each capacitor device 10 is not affected.
In some embodiments, the capacitive devices 10 are arranged in an array, with the capacitive devices 10 within each capacitive group being arranged along a first direction.
Referring to fig. 3, fig. 3 shows a capacitance test structure. The lower plates 11 of the capacitive devices 10 of each column are integrally connected. The lower plate 11 of each column is provided with a plurality of first contact holes 14, and the number of the first contact holes 14 may be greater than or equal to the number of the capacitor devices 10 of each column, for example, the number of the first contact holes 14 is twice the number of the capacitor devices 10 of each column.
The first contact holes 14 are arranged along the column direction, the second contact holes 15 are also arranged along the column direction, and the two columns of contact holes are staggered. The first metal piece 20 includes a first trunk portion 21 and at least one first branch portion 22 extending from the first trunk portion 21, the first trunk portion 21 being arranged in the row direction, each first branch portion 22 being arranged in the column direction. The second metal member 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, each second branch portion 32 being arranged in the column direction. Each first branch portion 22 is arranged in the column direction and is electrically connected to the lower electrode plate 11 through the corresponding first contact hole 14, and each second branch portion 32 is also arranged in the column direction and is electrically connected to the upper electrode plate 13 through the corresponding second contact hole 15.
Referring to fig. 4, fig. 4 shows a capacitance test structure. The lower plates 11 of the capacitive devices 10 of each column are integrally connected. A plurality of first contact holes 14 are provided on the lower plate 11 of each column. The plurality of first contact holes 14 are arranged in the row direction, and the first contact holes 14 on each column of the lower plates 11 are aligned in the row direction, whereby the first metal member 20 is arranged in the row direction, directly in conductive connection with each lower plate 11 through each first contact hole 14.
In some embodiments, the first contact hole 14 is disposed at one of both ends of each lower plate 11 in the first direction.
In the present embodiment, the first contact hole 14 is disposed with an end portion of the lower plate 11 of each column, such as an upper end of the first row of the capacitor devices 10, or a lower end of the last row of the capacitor devices 10. Thus, the capacitor devices 10 can be prevented from being inserted between the two rows of capacitor devices 10, the space between the two rows of capacitor devices 10 is reduced, and the arrangement density of the capacitor devices 10 is improved.
The second contact holes 15 provided on each column of the capacitive devices 10 are also arranged in the column direction. The second metal piece 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, the second trunk portion 31 being arranged in the row direction. Each second branch portion 32 is arranged in the column direction and is electrically connected to the upper plate 13 through the corresponding second contact hole 15.
Compared with fig. 3, the arrangement positions of the first contact holes 14 on the lower plate 11 and the capacitor devices 10 are arranged along the column direction, and the distance between the two columns of capacitor devices 10 is lower because the first contact holes 14 do not need to be arranged, so that the arrangement density of the capacitor devices 10 is further improved.
Referring to fig. 5, fig. 5 shows a capacitance test structure. In some embodiments, the capacitive devices 10 are arranged in an array, and all of the capacitive devices 10 are a capacitor group.
In the present embodiment, all the lower plates 11 of the capacitor devices 10 are integrally connected. Thereby, the pitch between all the capacitance devices 10 can be smaller, thereby improving the arrangement density of the capacitance devices 10.
In the present embodiment, the lower plate 11 is provided with at least one first contact hole 14 arranged in the column direction; the first metal member 20 includes a first trunk portion 21 and a first branch portion 22, the first trunk portion 21 being arranged in the row direction, the first branch portion 22 being arranged in the column direction and being electrically connected to the lower plate 11 through the first contact hole 14.
Since the lower electrode plates 11 of the capacitor devices 10 are integrally connected, the arrangement of the first contact holes 14 can realize conductive connection between the lower electrode plates 11 and the first metal piece 20, and can also reduce the number of the first branch parts 22 and the consumable materials of the first metal piece 20.
The second contact holes 15 provided on each column of the capacitive devices 10 are also arranged in the column direction. The second metal piece 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, the second trunk portion 31 being arranged in the row direction. Each second branch portion 32 is arranged in the column direction and is electrically connected to the upper plate 13 through the corresponding second contact hole 15.
In some embodiments, the first contact hole 14 is disposed at one of both ends of the lower plate in the second direction.
The first contact hole 14 may be disposed at the left or right side of the array formed by the capacitive device 10, as shown at the right side of fig. 5. Thereby, the space between the adjacent two columns of the capacitor devices 10 can be made smaller, and the arrangement density of the capacitor devices 10 can be improved.
In other embodiments, the first contact holes 14 may also be arranged in the row direction. Thereby, the first metal piece 20 may be arranged in the row direction, directly electrically connected to the lower plate 11 through the first contact hole 14, so that a branch portion does not need to be provided. The arrangement of the first metal piece 20 may be as described with reference to the first metal piece 20 shown in fig. 4. In this embodiment, the first contact holes 14 may be disposed on the upper side or the lower side of the array formed by the capacitive devices 10, so that the interval between two adjacent rows of the capacitive devices 10 is smaller, and the arrangement density of the capacitive devices 10 is improved.
In some embodiments, the capacitive devices 10 are arranged in an array, and within each capacitive group are at least one row and a plurality of columns of capacitive devices 10.
In this embodiment, the number of rows and columns of each capacitor group protection are the same, and the lower electrode plates 11 of each capacitor device 10 are integrally connected to form a small capacitor sub-array, and the plurality of capacitor sub-arrays are arranged to form a large capacitor array. The smaller spacing between the capacitive devices 10 within each sub-array increases the placement density of the capacitive devices 10.
At least one first contact hole 14 arranged along the first direction is arranged between two adjacent capacitor device sets arranged along the first direction. The capacitor device set refers to a column of capacitor devices 10 arranged in a column direction in each group of capacitor devices 10, and at least one first contact hole 14 arranged in the column direction is provided between two adjacent columns of capacitor devices 10.
As an example, referring to fig. 6, fig. 6 shows a capacitance test structure. Every two adjacent rows and two columns of capacitance devices 10 are a capacitance group, and the lower electrode plates 11 of the four capacitance devices 10 are integrally connected. The lower plate 11 of each capacitor bank is provided with at least one first contact hole 14 arranged in the column direction, and the first metal member 20 includes a first trunk portion and 21 at least one first branch portion 22, the first trunk portion 21 being arranged in the row direction, the first branch portion 22 being arranged in the column direction and being electrically connected to the lower plate 11 through the first contact hole 14.
The number of the first contact holes 14 of the lower plate 11 of each capacitor group may be greater than the number of rows of the capacitor devices 10 in each capacitor group, and increasing the number of the first contact holes 14 may reduce the contact resistance. A first contact hole 14 may be disposed between two rows of capacitor devices 10, and the capacitor devices 10 on both sides are provided with second contact holes 15, where the distances between the two rows of second contact holes 15 and the first contact hole 14 are the same, and the structures are symmetrical.
The second metal piece 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, the second trunk portion 31 being arranged in the row direction. Each second branch portion 32 is arranged in the column direction and is electrically connected to the upper plate 13 through the corresponding second contact hole 15. Each capacitive device 10 in adjacent two capacitive groups is aligned in rows and columns. Thus, each of the first branch portions 22 and each of the second branch portions 32 can be linearly extended in the column direction, and connected to the capacitor devices 10 in each of the capacitor groups, and each of the branch portions has a shape that facilitates design.
As an example, referring to fig. 7, fig. 7 shows a capacitance test structure. Every adjacent three rows and three columns of capacitance devices 10 are a capacitance group, and the lower electrode plates 11 of the nine capacitance devices 10 are integrally connected. The lower plate 11 of each capacitor group is provided with at least one first contact hole 14 arranged in the column direction, and the first contact holes 14 are arranged in two columns.
The number of first contact holes 14 per column of the lower plate 11 of each capacitor bank may be greater than the number of rows of the capacitor devices 10 within each capacitor bank, and increasing the number of first contact holes 14 may reduce contact resistance. The two rows of first contact holes 14 can be arranged between every two rows of capacitor devices 10, the capacitor devices 10 are respectively provided with a second contact hole 15, the distances between every two rows of second contact holes 15 and one row of first contact holes 14 between the quanta are the same, and the structure is symmetrical.
The first metal member 20 includes a first trunk portion and 21 at least one first branch portion 22, the first trunk portion 21 being arranged in the row direction, the first branch portion 22 being arranged in the column direction and being electrically connected to the lower plate 11 through the first contact hole 14. The second metal member 30 includes a second trunk portion 31 and at least one second branch portion 32 extending from the second trunk portion 31, the second trunk portion 31 being arranged in the row direction, each second branch portion 32 being arranged in the column direction and being electrically connected to the upper plate 13 through a corresponding second contact hole 15.
In a second aspect, the application provides a capacitance testing system, which comprises capacitance testing equipment and a capacitance testing structure according to the foregoing, wherein the capacitance testing equipment is electrically connected with the capacitance testing structure. The specific structure and principle of the capacitance test structure can refer to the foregoing embodiments, and this embodiment is not repeated herein.
According to the capacitance test system, the influence of the parasitic capacitance of the capacitance test equipment can be reduced due to the fact that the capacitance of the capacitance test structure is larger, so that interference of the parasitic capacitance of the capacitance test equipment on capacitance test is eliminated, and test accuracy is improved.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (13)

1. A capacitance test structure, comprising:
a plurality of capacitive devices, each of the capacitive devices including a stacked lower plate, a dielectric layer, and an upper plate;
the first metal piece is respectively connected with the lower polar plate of each capacitor in a conductive way;
the second metal piece is respectively connected with the upper polar plates of the capacitors in a conductive manner;
The first metal piece and the second metal piece are used for connecting capacitance testing equipment.
2. The capacitance testing structure according to claim 1, wherein the plurality of capacitance devices are divided into a plurality of capacitance groups, and lower plates of the capacitance devices in the capacitance groups are integrally connected.
3. The capacitance testing structure according to claim 2, wherein each of the capacitance devices is arranged in an array, the capacitors in each of the capacitance groups being arranged along a first direction.
4. A capacitance testing structure according to claim 3, wherein the lower plate in each of the capacitor groups is provided with at least one first contact hole arranged along the first direction; the first metal piece comprises a first main part and at least one first branch part extending from the first main part, wherein the first main part is arranged along a second direction, each first branch part is arranged along the first direction and is electrically connected with each lower polar plate through the first contact hole, and the first direction is perpendicular to the second direction.
5. A capacitance testing structure according to claim 3, wherein the lower plates in each of the capacitor groups are provided with at least one first contact hole arranged in a second direction, the first metal member is arranged in the second direction and is electrically connected to each of the lower plates through the first contact hole, and the first direction is perpendicular to the second direction.
6. The capacitance testing structure according to claim 5, wherein the first contact hole is arranged at one of both ends of each of the lower plates in the first direction.
7. The capacitance test structure according to claim 2, wherein each of the capacitance devices is arranged in an array, and each of the capacitance groups includes at least one row and a plurality of columns of the capacitance devices.
8. The capacitance testing structure according to claim 7, wherein at least one first contact hole arranged along the first direction is arranged between two adjacent capacitor device sets arranged along the first direction in each lower electrode plate; the first metal piece comprises a first main part and a plurality of first branch parts extending from the first main part, wherein the first main part is arranged along the second direction, and each first branch part is arranged along the first direction and is electrically connected with each lower polar plate through the first contact hole.
9. The capacitance testing structure according to claim 1, wherein lower plates of all the capacitance devices are integrally connected.
10. The capacitance testing structure according to claim 9, wherein each of the capacitance devices is arranged in an array, and the lower plate is provided with at least one first contact hole arranged along a first direction; the first metal piece comprises a first main part and a first branch part, wherein the first main part is arranged along a second direction, the first branch part is arranged along the first direction and is in conductive connection with the lower polar plate through the first contact hole, and the first direction is perpendicular to the second direction.
11. The capacitance testing structure of claim 10, wherein the first contact hole is arranged at one of both ends of the lower plate in the second direction.
12. The capacitance testing structure according to any one of claims 1 to 11, wherein each of the capacitance devices is arranged in an array, an upper plate of each of the capacitance devices is provided with at least one second contact hole, the second metal member includes a second trunk portion and at least one second branch portion extending from the second trunk portion, each of the second branch portions is arranged along the first direction, and is electrically connected to each of the upper plates through each of the second contact holes.
13. A capacitance testing system comprising a capacitance testing device and a capacitance testing structure according to any of claims 1-12, the capacitance testing device being electrically connected to the capacitance testing structure.
CN202410038036.2A 2024-01-10 2024-01-10 Capacitance test structure and capacitance test system Pending CN118068090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410038036.2A CN118068090A (en) 2024-01-10 2024-01-10 Capacitance test structure and capacitance test system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410038036.2A CN118068090A (en) 2024-01-10 2024-01-10 Capacitance test structure and capacitance test system

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CN118068090A true CN118068090A (en) 2024-05-24

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CN202410038036.2A Pending CN118068090A (en) 2024-01-10 2024-01-10 Capacitance test structure and capacitance test system

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