CN118067778A - Verification device and method for verifying air-cooled heat exchange coefficient of mold surface - Google Patents
Verification device and method for verifying air-cooled heat exchange coefficient of mold surface Download PDFInfo
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- CN118067778A CN118067778A CN202311422236.XA CN202311422236A CN118067778A CN 118067778 A CN118067778 A CN 118067778A CN 202311422236 A CN202311422236 A CN 202311422236A CN 118067778 A CN118067778 A CN 118067778A
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- 238000012795 verification Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 121
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 238000004321 preservation Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 230000008859 change Effects 0.000 claims description 81
- 238000009413 insulation Methods 0.000 claims description 20
- 238000004088 simulation Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 8
- 238000013500 data storage Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
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- 238000005266 casting Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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Abstract
The invention provides a verification device and a method for verifying an air-cooled heat exchange coefficient of a mold surface, wherein the verification device comprises the following components: the heat preservation module is used for coating the die; the temperature acquisition module is used for acquiring temperature data of the die; a heating module for heating the mold; a cooling module for cooling a cooling zone of the mold; the method adopts the verification device. The verification device and the verification method provided by the invention can evaluate the accuracy of the air cooling heat exchange coefficient of the surface of the die.
Description
Technical Field
The invention relates to the technical field of intelligent manufacturing, in particular to a verification device and a verification method for verifying an air cooling heat exchange coefficient of a mold surface.
Background
With the deep research and application of intelligent manufacturing technology, the effect of casting simulation in the casting process is more and more obvious, and the guiding significance on product manufacturing is more and more important. In casting simulation analysis, the heat exchange coefficient of the surface of the die is an important input parameter, and the accuracy of the parameter directly influences the accuracy of a casting simulation model. Based on the existing calculation model of the air cooling heat exchange coefficient of the low-pressure casting die, the value of the heat exchange coefficient of the die surface corresponding to the ring diameter of any air pipe, the number of air holes and the air flow can be calculated, but the accuracy of the value is not evaluated by a specific method at present, and can only be evaluated by comparing the casting process simulation model with die temperature data and production results in the actual casting process, but because the number of influencing factors in the casting process is too many, including heat exchange between die assemblies, heat exchange between castings and dies, influence of environmental temperature, change of production beats and the like, the accuracy of the calculated value of the air cooling heat exchange coefficient is difficult to evaluate singly.
Therefore, how to accurately evaluate the accuracy of the air-cooling heat exchange coefficient of the mold surface has become a subject to be studied and overcome.
Disclosure of Invention
The invention aims to provide a verification device and a verification method for verifying an air cooling heat exchange coefficient of a mold surface, so as to evaluate the accuracy of the air cooling heat exchange coefficient of the mold surface.
In order to achieve the above purpose, the present invention provides the following technical scheme:
The utility model provides a verifying attachment for verifying mould surface forced air cooling heat transfer coefficient for use with the mould cooperation, the mould includes adjacent cooling zone and heat preservation, verifying attachment include:
the heat preservation module is used for coating the die;
The temperature acquisition module is used for acquiring temperature data of the die;
The heating module is used for heating the heat preservation area of the die;
and the cooling module is used for cooling the cooling area of the die.
In some embodiments of the invention, the insulation module comprises:
The heat preservation medium is used for coating the die, and is provided with a through hole which is arranged corresponding to the cooling area of the die;
The heat-insulating cover block is used for covering the through holes so as to isolate the die from the external environment;
and the fixing mechanism is detachably connected with the heat preservation medium and used for fixing the relative position between the heat preservation medium and the die.
In some embodiments of the invention, the temperature acquisition module comprises:
a first temperature sensor for monitoring temperature data of the mold via the through-hole;
a display for displaying temperature data of the mold;
a data storage for storing temperature data of the mold;
And the data transmission line is connected among the first temperature sensor, the display and the data storage device so as to transmit the temperature data of the die.
In some embodiments of the invention, the heating module comprises:
A second temperature sensor for monitoring temperature data of the mold via the through-hole;
a heating assembly for heating the mold;
and the temperature controller is used for controlling the heating power of the heating component according to the temperature data measured by the second temperature sensor.
In some embodiments of the invention, the cooling module comprises:
The air compressor is used for generating compressed air;
The air outlet of the cooling air pipe is used for aligning with the cooling area of the die through the through hole;
the air supply pipeline is communicated between the air compressor and the air outlet of the cooling air pipe;
The flowmeter is connected with the air supply pipeline and is used for measuring the flow of compressed air flowing through the air supply pipeline;
the control valve is connected with the air supply pipeline and used for controlling the flow of compressed air flowing through the air supply pipeline;
The through holes are arranged corresponding to at least one air outlet, and the air outlet of the air outlet corresponding to each through hole blows from the through hole to one cooling area corresponding to the through hole, and then is back-flushed from the through hole to the external environment, so that the local cooling of each cooling area on the die is realized.
In order to achieve the above purpose, the present invention also provides the following technical solutions:
a method for verifying the air-cooled heat transfer coefficient of a mold surface for use with a mold, said method comprising the steps of:
s1, establishing a temperature finite element model for the die, and substituting a heat exchange coefficient to be verified into the temperature finite element model;
s2, acquiring a simulation temperature change curve of the die from the temperature finite element model;
s3, establishing the verification device according to any one of claims 1 to 6;
S4, acquiring an actually measured temperature change curve of the die from the verification device;
s5, comparing the simulated temperature change curve with the actually measured temperature change curve to evaluate the accuracy of the heat exchange coefficient.
In some embodiments of the present invention, in the step S1, a 3D model is built for the mold, and the heat exchange coefficient is substituted into the 3D model, so as to build and obtain the temperature finite element model.
In some embodiments of the present invention, in the step S2, according to the temperature finite element model, a temperature change of the mold in a cooling stage is simulated, so as to obtain the simulated temperature change curve.
In some embodiments of the present invention, in the step S4, the heat-preserving area of the mold is subjected to heat-preserving treatment, the mold is heated to a preset temperature, and a first temperature change curve of the mold is collected after a preset period of natural cooling, and further, the mold is heated to the preset temperature again, and a second temperature change curve of the mold is collected after the preset period of cooling the cooling area of the mold.
In some embodiments of the present invention, in the step S5, data processing is performed on the first temperature change curve and the second temperature change curve to obtain the measured temperature change curve;
In the step S5, the simulated temperature change curve and the actually measured temperature change curve are compared, and if the simulated temperature change curve and the actually measured temperature change curve have a consistent change trend and the difference value of the two is within an allowable range, the calculated value of the surface heat exchange coefficient to be verified is accurate;
Wherein the first temperature change curve is f 1 (x), the second temperature change curve is f 2 (x), the measured temperature change curve is f (x), the time change in the cooling stage is x, the preset temperature is a, wherein f (x) =f 2(x)-f1 (x) +a; and
The simulation temperature curve is g (x), and |f| x＝t(x)-g|x＝t (x) |=b, and when B is less than or equal to C, the accuracy of the heat exchange coefficient is high, wherein C is a permissible simulation and actual measured temperature difference value, and t is a constant value within the range of x.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
The invention provides a verification device and a verification method for verifying an air cooling heat exchange coefficient of a mold surface, which are used for respectively obtaining a simulated temperature change curve and an actually measured temperature change curve in a mode of combining simulation and experimental data together and judging the accuracy of the air cooling heat exchange coefficient of the mold surface by comparing the consistency of the two curves.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a verification device for verifying an air-cooled heat exchange coefficient of a mold surface according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the verification device of FIG. 1 in another operating state;
fig. 3 is a flow chart of a method for verifying an air-cooled heat transfer coefficient of a mold surface according to an embodiment of the present invention.
The main reference numerals in the drawings of the present specification are explained as follows:
0-die; 01-a cooling zone; 02-a heat preservation area;
11-a heat preservation medium; 110-a through hole; 12-a heat-preserving cover block;
21-a first temperature sensor; 22-a display; 23-a data holder;
31-a second temperature sensor; 32-a heating assembly; 33-temperature controller
41-An air compressor; 42-cooling air pipes; 43-an air supply pipeline; 44-a flow meter; 45-control valve.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The technical scheme of the invention provides a verification device and a verification method for verifying an air-cooled heat exchange coefficient of a mold surface, and the verification device and the verification method are respectively described in detail below. It should be noted that the following description order of the embodiments is not intended to limit the preferred order of the embodiments of the present invention. In the following embodiments, the descriptions of the embodiments are focused on, and for the part that is not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
First aspect
Referring to fig. 1 and 2, in some embodiments of the present invention, a verification apparatus for verifying an air-cooled heat exchange coefficient of a mold surface is used in cooperation with a mold 0, where the mold 0 includes a cooling area 01 and a heat preservation area 02 that are adjacent to each other, and the verification apparatus includes: the heat preservation module is used for coating the die 0; the temperature acquisition module is used for acquiring temperature data of the die 0; a heating module for heating the mold 0; a cooling module for cooling the cooling zone 01 of the mould 0.
Specifically, referring to fig. 1 and 2, when the verification device and the mold 0 are used to verify the air-cooled heat exchange coefficient of the mold surface, the heat insulation module is coated on the outer surface of the mold 0, so that the mold 0 is prevented from contacting with the external environment as much as possible, and the heat insulation condition in the simulation experiment is simulated as much as possible; then, the heating module is used for heating the die 0 and the heat preservation module simultaneously until reaching a set temperature; then cooling the cooling area 02 of the die 0 through a cooling module, wherein the area, which is not directly cooled by the cooling module, on the die 0 is the heat preservation area 02; in the process of cooling the cooling zone 02 by the cooling module, the temperature change conditions of the cooling zone 01 and the heat preservation zone 02 of the die 0 are continuously monitored by the temperature acquisition module, wherein the temperature change conditions of the cooling zone 02 and the cooling zone 01 of the die 0 are also included, and the temperature acquisition module is used for monitoring and collecting the temperature change data and is used for evaluating and verifying the air cooling heat exchange coefficient of the surface of the die and providing necessary experimental data support for evaluating the air cooling heat exchange coefficient.
It should be noted that, in some embodiments of the present invention, the mold 0 may be an integral part of a certain assembly, that is, the mold is separate, and may specifically be a top mold, a bottom mold, or a side mold of the assembly; when the verification device provided by the invention is used for collecting experimental data, the split molds in the assembly body assembly can be respectively and sequentially tested, and correspondingly, the shape, the size parameters and the like of the heat preservation module can be matched and adjusted with the split molds so as to expand the universality of the verification device.
In some embodiments of the present invention, any one of the temperature collecting module, the heating module and the cooling module may be connected to the heat insulation module through a physical direct or indirect contact manner, or may perform signal interaction with the heat insulation module through a wireless signal transmission manner.
Referring to fig. 1 and 2, in some embodiments of the present invention, the heat preservation module is detachably connected to the temperature collection module, the heating module and the cooling module, respectively, so as to facilitate assembling and matching between the verification device and the mold 0.
For example, in some embodiments of the present invention, when the mold 0 and the heat preservation module are heated by using a resistance furnace, the temperature collecting module and the cooling module cannot be fed into the resistance furnace together to be heated, which would destroy the internal circuit structure of the temperature collecting module and the cooling module, so that the temperature collecting module and the cooling module are configured to be in contact with the mold 0 only after the mold 0 and the heat preservation module are heated and just before the mold 0 and the heat preservation module begin to be cooled, thereby performing the functions of cooling, temperature monitoring and data collection.
In addition, fig. 1 is a schematic structural diagram of the verification device when the mold 0 is heated in some embodiments, and fig. 2 is a schematic structural diagram of the verification device when the mold 0 is cooled in some embodiments.
Referring to fig. 1 and 2, in some embodiments of the invention, the insulation module includes: a heat-insulating medium 11 for covering the mold 0, wherein the heat-insulating medium 11 is provided with a through hole 110, and the through hole 110 is arranged corresponding to the cooling area 01 of the mold 0; a thermal insulation cover block 12 for covering the through-hole 110 to insulate the mold 0 from the external environment; and a fixing mechanism (not shown) detachably connected with the heat-insulating medium 11 for fixing the relative position between the heat-insulating medium 11 and the mold 0.
Specifically, before heating the mold 0, wrapping the mold 0 with the heat-insulating medium 11, and covering the through holes 110 of the heat-insulating medium 11 with the heat-insulating cover block 12 to realize that the whole of the mold 0 can be fully covered by the heat-insulating module; when the mold 0 is cooled by the cooling module after the heating is completed, the heat-insulating cover block 12 may be removed to expose the through-holes 110 so that the cooling module can directly cool the cooling region 01 of the mold 0 through the through-holes 110.
In some embodiments of the present invention, the thermal insulation cover 12 can be plugged into the through-hole 110 like a bottle plug, and the thermal insulation cover 12 can be fixed with the thermal insulation medium 11 by interference fit.
In some embodiments of the present invention, the heat insulation medium 11, the heat insulation cover block 12 and the mold 0 are heated by adopting a resistance furnace, and the fixing mechanism specifically adopted at this time may be a material with high temperature resistance and certain strength, such as iron sheet; in other embodiments, the electromagnetic induction coil is used to heat the heat insulation medium 11, the heat insulation cover block 12 and the mold 0, and a binding belt with high temperature resistance and better strength can be used as a specific embodiment of the fixing mechanism to wind and fix the heat insulation medium 11 and the mold 0.
Referring to fig. 1 and 2, in some embodiments of the invention, the temperature acquisition module includes: a first temperature sensor 21 for monitoring temperature data of the die 0 via the through hole 110; a display 22 for displaying temperature data of the mold 0; a data storage 23 for storing temperature data of the mold 0; a data transmission line (not numbered) connected between the first temperature sensor 21, the display 22 and the data storage 23 to transmit temperature data of the mold 0.
Specifically, after the mold 0 is heated, the heat-insulating cover block 12 is removed to expose the through hole 110, and the first temperature sensor 21 can be inserted into the cavity formed by the heat-insulating medium 11 (in which the mold 0 is accommodated) through the through hole 110, so as to monitor and obtain the temperature change data of the mold 0 during the cooling stage of the mold 0.
It should be noted that the number of the first temperature sensors 21 may be more than one, and that different first temperature sensors may be respectively provided in the cooling zone 01 and the heat-retaining zone 02 of the mold 0; further, even in the same cooling zone 01 (there may be a plurality of cooling zones 01 directly cooled by the corresponding cooling modules on the same mold 0 in each actual measurement experiment), a plurality of first temperature sensors 21 may be provided; obviously, the above scheme aims at acquiring more real and sufficient experimental data so as to provide sufficient experimental data support for verifying the accuracy of the air cooling heat exchange coefficient of the surface of the die.
Referring to fig. 1 and 2, in some embodiments of the invention, the heating module includes: a second temperature sensor 31 for monitoring temperature data of the die 0 via the through hole 110; a heating assembly 32 for heating the mold 0; the temperature controller 33 is connected between the second temperature sensor 31 and the heating component 32, the temperature controller 33 is used for controlling the heating power of the heating component 32 according to the temperature data measured by the second temperature sensor 31, and in addition, the temperature controller 33 can enable an operator to know the current temperature condition of the die 0 so as to make further operation decisions.
Specifically, the second temperature sensor 31 is configured to monitor the temperature change of the mold 0 in real time during the heating process, so as to ensure the accuracy of the heating effect; in some embodiments, the heating element 32 may be a resistance furnace, in particular, while in other embodiments an electromagnetic coil may be used. It will be appreciated that the temperature controller 33 and the second temperature sensor 31 and the heating assembly 32 may be in electrical or signal connection relationship for signal transmission.
It should be noted that, in some embodiments of the present invention, the first temperature sensor 21 and the second temperature sensor 31 may be the same for cost saving purposes.
It will be appreciated that in some embodiments of the invention, the two temperature sensors may be used to measure temperature data of the mold by "directly physically contacting the mold" or may be used to measure temperature data of the mold without directly contacting the mold, such as by infrared temperature detection.
Referring to fig. 1 and 2, in some embodiments of the present invention, a temperature controller 33 is electrically or signally connected to the data holder 23 and the heating assembly 32 via data transmission lines to effect control of the data holder 23 and the heating assembly 32.
Referring to fig. 1 and 2, in some embodiments of the invention, the cooling module includes: an air compressor 41 for generating compressed air; a cooling air duct 42 having an air outlet for aligning with the cooling area 01 of the mold 0 via the through hole 110; an air supply pipeline 43 communicated between the air compressor 41 and an air outlet of the cooling air duct 42; a flow meter 44 connected to the air supply line 43 for measuring the flow rate of the compressed air flowing through the air supply line 43; and a control valve 45 connected to the air supply line 43 for controlling the flow rate of the compressed air flowing through the air supply line 43.
Specifically, after the mold 0 is heated, and when the cooling area 01 is to be cooled directly by the cooling module, the air compressor 41 generates compressed air, and the compressed air passes through the through holes 110 corresponding to the cooling area 01 of the mold 0 via the air supply pipeline 43 to directly blow the cooling area 01, so as to achieve the purpose of directly cooling the cooling area 01 of the mold 0; meanwhile, the first temperature sensor 21 in the temperature acquisition module continuously acquires the temperature change condition of the cooling zone 01 and the indirectly cooled heat preservation zone 02 under the heat conduction in real time, so as to provide a reliable experimental data support for verifying the air cooling heat exchange coefficient of the surface of the die.
In some embodiments of the present invention, the air outlet of the cooling air duct 42 may be placed at a position about 8mm above the cooling area 01 of the mold 0, and of course, the placement position may be adjusted according to the actual application scenario and design criteria.
In some embodiments of the present invention, for at least part of the through holes 110, the through holes 110 are disposed corresponding to at least one of the air outlets, and the air outlet of the air outlet corresponding to each through hole 110 blows from the through hole 110 to one of the cooling areas 01 corresponding to the through hole 110, and then backflushes from the through hole 110 into the external environment, so as to achieve local cooling of each cooling area 01 on the mold 0. In other words, in the verification device provided by the present invention, when the verification device blows to a cooling area 01 corresponding to the through hole 110 through the through hole 110, the part of the air-out will be back-flushed from the same through hole 110 to the external environment after touching the cooling area 01; that is, the through holes 110 in the verification device are not connected through the inner cavity enclosed by the heat insulation medium 11, in other words, the air blown from one through hole 110 to the mold 0 is not blown to the external environment through the other through hole 110, otherwise, the air is blown to a larger area on the mold 0, which results in a transition area on the mold 0 that is indirectly cooled (the present invention only requires the cooling area 01 on the mold 0 that is locally directly blown with air and does not require the transition area that is indirectly blown with air).
In addition, in some embodiments of the present invention, the cooling area 01 of the mold 0 may be any one or a combination of two or more of pits, blind holes, bumps, grooves, and ridges, and of course, the cooling area 01 may also be planar. Illustratively, in some embodiments of the invention, it is distributed as an array of 5-30 circumferentially distributed around the mold 0 on the surface of the mold 0.
In some embodiments of the present invention, the through hole 110 may be a through hole having a diameter of 4 to 6mm and a depth of 10 to 30mm; illustratively, the diameter may be 4.5mm, 5mm, or 5.5mm, and the depth may be 15mm, 20mm, or 25mm.
In some embodiments of the present invention, the cooling zone 01 of the mold 0 is a region through which cooling air blows, and the geometric feature may be a circular pit of 16mm in diameter and 8mm in depth on the surface of the mold 0, which is distributed as a circular array of 20 each around the center of the mold 0, and the radius of the array may be 120mm.
Second aspect
Referring to fig. 1 to 3, a method for verifying the air-cooled heat transfer coefficient of a mould surface for use with a mould 0, the method comprising the steps of: s1, establishing a temperature finite element model for the die 0, and substituting a heat exchange coefficient to be verified into the temperature finite element model; s2, acquiring a simulation temperature change curve of the die 0 from the temperature finite element model; s3, establishing the verification device as described in the embodiment 1; s4, acquiring an actually measured temperature change curve of the die 0 from the verification device; s5, comparing the simulated temperature change curve with the actually measured temperature change curve to evaluate the accuracy of the heat exchange coefficient.
Referring to fig. 3, in some embodiments of the present invention, in the step S1, a 3D model is built for the mold 0, and the heat exchange coefficient is substituted into the 3D model to build the temperature finite element model. It can be understood that the 3D model includes various shapes and sizes of the object to be monitored, that is, the mold 0, including xyz position information on each point of the mold 0; the temperature finite element model is based on the 3D model of the mold 0, and adds temperature information and time information of each point on the mold 0.
Specifically, in some embodiments of the present invention, the 3D model of the mold 0 may be subjected to a meshing process; furthermore, in some embodiments, the initial temperature of the mold 0 may be set to 500 ℃, the cooling zone 01 is set to a convection boundary condition, and the heat transfer coefficient is set to a calculated surface heat transfer coefficient value 530W/(k·m 2) of the mold 0; the other areas are set as adiabatic conditions; the heat exchange coefficient can represent the heat exchange capacity between the solid surface and the external medium, and the physical meaning of the heat exchange coefficient is that when the temperature difference between the external medium and the solid surface is 1K, the heat can be transferred in unit area of unit time, W in the unit W/(K.m 2) of the heat exchange coefficient is a power unit, K is a temperature unit, and m is a length unit.
Referring to fig. 3, in some embodiments of the present invention, in the step S2, according to the temperature finite element model, a temperature change of the mold 0 in a cooling stage is simulated, so as to obtain the simulated temperature change curve; it will be appreciated that the present invention aims to obtain a simulated temperature profile of a mould 0 by means of a simulated model and an actual temperature profile of the same mould 0 by means of the verification device provided in example 1, by comparing the two profiles to assess the accuracy of the surface air-cooled heat transfer coefficient.
Referring to fig. 3, in some embodiments of the present invention, in the step S4, the heat-preserving region 02 of the mold 0 is subjected to heat-preserving treatment, the mold 0 is heated to a preset temperature, and after a preset period of natural cooling, a first temperature change curve of the mold 0 is acquired, and further, the mold 0 is heated to the preset temperature again, and after the preset period of cooling the cooling region 01 of the mold 0, a second temperature change curve of the mold 0 is acquired.
It is to be reminded that the two heating in the above scheme are both required to be heated to the same preset temperature so as to ensure that the two obtained second temperature change curves have better comparability, and the two temperature change curves are also convenient to integrate so as to obtain the actually measured temperature change curve.
It should be noted that, when the first temperature change curve is obtained, the thermal insulation cover block 12 is covered on the through hole 110, so as to simulate the thermal insulation scene in the simulation model in the actual experimental scene; when the second temperature change curve is obtained, the heat-insulating cover block 12 is removed, and the cooling area 01 of the mold 0 can be directly connected with the external environment through the through hole 110. The purpose of this scheme is: because the setting condition of the heat preservation area 02 in the finite element model is an adiabatic condition, the heat preservation medium 11 in the verification device provided by the invention cannot be completely insulated in practice, in order to ensure that the temperature change curves in the finite element model and the verification device have comparability, the temperature decrease caused by the heat dissipation of the heat preservation medium 11 needs to be compensated in the verification device, so that two cooling working conditions are designed, the first cooling is to measure the temperature change curve of the mold 0 naturally cooled under the condition that the heat preservation medium 11 is completely wrapped, then the second cooling is to measure the temperature change curve of the mold 0 under the condition of normal air cooling, the second measurement result comprises the temperature change caused by the heat dissipation carried away by the air cooling and the temperature change caused by the heat dissipation of the heat preservation medium 11, and the temperature change curve which is obtained by compensating the temperature decrease obtained by the first measurement into the temperature change curve obtained by the second measurement is obtained, so that the temperature change curve obtained in the finite element model can be compared with the temperature change curve which is counteracted by the heat dissipation influence of the heat preservation medium 11, and whether the cooling coefficient input into the finite element model can be evaluated accurately.
In some embodiments of the present invention, the preset temperature may be any value from 200 to 400 ℃, and the specific value manner may be selected and adjusted according to the actual application scenario; the preset temperature may be any one or a range of values between any two values of 250 ℃, 300 ℃ or 350 ℃.
Referring to fig. 3, in the step S5, data processing is performed on the first temperature change curve and the second temperature change curve to obtain the actually measured temperature change curve, so that the actually measured temperature change curve and the simulated temperature change curve may be compared to verify the accuracy of the air-cooling heat exchange coefficient of the mold surface.
Referring to fig. 3, in some embodiments of the present invention, in the step S5, the simulated temperature change curve and the measured temperature change curve are compared, and if the simulated temperature change curve and the measured temperature change curve have a consistent trend, and the difference value between the two is within an allowable range, the calculated value of the surface heat exchange coefficient to be verified is accurate.
Referring to fig. 3, in some embodiments of the present invention, the first temperature change curve is f1 (x), the second temperature change curve is f2 (x), the measured temperature change curve is f (x), the time change in the cooling phase is x, and the preset temperature is a, where f (x) =f 2(x)-f1 (x) +a.
Referring to fig. 3, in some embodiments of the present invention, the simulated temperature curve is g (x), and |f| x＝t(x)-g|x＝t (x) |=b, where B is equal to or less than C, where C is a temperature difference value between allowable simulation and actual measurement, and t is a constant value within the range of x; it will be appreciated that the allowable simulated and measured temperature difference C is within an allowable range.
In some embodiments of the present invention, the simulated treatment for the cooling zone 01 may be to set it to a convective heat transfer boundary condition, while the other zones are set to an adiabatic condition.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. Furthermore, the foregoing description of the principles and embodiments of the invention has been provided for the purpose of illustrating the principles and embodiments of the invention and for the purpose of providing a further understanding of the principles and embodiments of the invention, and is not to be construed as limiting the invention.
Claims (10)
1. The utility model provides a verifying attachment for verifying mould surface forced air cooling heat transfer coefficient for use with mould (0), mould (0) are including cooling zone (01) and heat preservation district (02) that adjoin, its characterized in that, verifying attachment include:
the heat preservation module is used for coating the die (0);
the temperature acquisition module is used for acquiring temperature data of the die (0);
a heating module for heating the mould (0);
and a cooling module for cooling the cooling zone (01) of the mould (0).
2. The authentication device of claim 1, wherein the insulation module comprises:
The heat preservation medium (11) is used for coating the die (0), the heat preservation medium (11) is provided with a through hole (110), and the through hole (110) is arranged corresponding to a cooling area (01) of the die (0);
a thermal insulation cover block (12) for covering the through hole (110) to insulate the mold (0) from the external environment;
The fixing mechanism is detachably connected with the heat preservation medium (11) and used for fixing the relative position between the heat preservation medium (11) and the die (0).
3. The authentication device of claim 2, wherein the temperature acquisition module comprises:
a first temperature sensor (21) for monitoring temperature data of the mold (0) via the through-hole (110);
A display (22) for displaying temperature data of the mold (0);
a data storage (23) for storing temperature data of the mold (0);
And a data transmission line connected among the first temperature sensor (21), the display (22) and the data storage (23) so as to transmit the temperature data of the die (0).
4. The authentication device of claim 2, wherein the heating module comprises:
A second temperature sensor (31) for monitoring temperature data of the mold (0) via the through-hole (110);
-a heating assembly (32) for heating the mould (0);
And a temperature controller (33) for controlling the heating power of the heating assembly (32) according to the temperature data measured by the second temperature sensor (31).
5. The authentication device of claim 2, wherein the cooling module comprises:
An air compressor (41) for generating compressed air;
A cooling air duct (42) with an air outlet for aligning with a cooling zone (01) of the mold (0) through the through hole (110);
An air supply pipeline (43) communicated between the air compressor (41) and an air outlet of the cooling air pipe (42);
a flow meter (44) connected to the air supply line (43) for measuring the flow rate of the compressed air flowing through the air supply line (43);
A control valve (45) connected to the air supply line (43) for controlling the flow rate of the compressed air flowing through the air supply line (43);
The through holes (110) are arranged corresponding to at least one air outlet, and air outlet of the air outlet corresponding to each through hole (110) blows from the through hole (110) to one cooling area (01) corresponding to the through hole (110), and then the air outlet is back-flushed from the through hole (110) to the external environment, so that local cooling of each cooling area (01) on the die (0) is realized.
6. A method for verifying the air-cooled heat transfer coefficient of a mold surface for use with a mold (0), the method comprising the steps of:
s1, establishing a temperature finite element model for the die (0), and substituting a heat exchange coefficient to be verified into the temperature finite element model;
s2, acquiring a simulation temperature change curve of the die (0) from the temperature finite element model;
S3, establishing the verification device according to any one of claims 1 to 5;
s4, acquiring an actually measured temperature change curve of the die (0) from the verification device;
s5, comparing the simulated temperature change curve with the actually measured temperature change curve to evaluate the accuracy of the heat exchange coefficient.
7. The method according to claim 6, wherein in the step S1, a 3D model is built for the mold (0), and the heat exchange coefficient is substituted into the 3D model to build the temperature finite element model.
8. The method according to claim 6, wherein in step S2, the temperature change of the mold (0) in the cooling phase is simulated according to the temperature finite element model, and the simulated temperature change curve is obtained.
9. The method according to claim 6, wherein in the step S4, the heat-preserving region (02) of the mold (0) is subjected to heat-preserving treatment, the mold (0) is heated to a preset temperature, and the first temperature change curve of the mold (0) is acquired after naturally cooling for a preset period of time, and further, the mold (0) is heated to the preset temperature again, and the second temperature change curve of the mold (0) is acquired after cooling the cooling region (01) of the mold (0) for the preset period of time.
10. The method according to claim 9, wherein in the step S5, the first temperature profile and the second temperature profile are subjected to data processing to obtain the measured temperature profile;
In the step S5, the simulated temperature change curve and the actually measured temperature change curve are compared, and if the simulated temperature change curve and the actually measured temperature change curve have a consistent change trend and the difference value of the two is within an allowable range, the calculated value of the surface heat exchange coefficient to be verified is accurate;
Wherein the first temperature change curve is f1 (x), the second temperature change curve is f2 (x), the measured temperature change curve is f (x), the time change in the cooling stage is x, the preset temperature is a, and f (x) =f 2(x)-f1 (x) +a; and
The simulation temperature curve is g (x), and |f| x＝t(x)-g|x＝t (x) |=b, and when B is less than or equal to C, the accuracy of the heat exchange coefficient is high, wherein C is a permissible simulation and actual measured temperature difference value, and t is a constant value within the range of x.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311422236.XA CN118067778A (en) | 2023-10-30 | 2023-10-30 | Verification device and method for verifying air-cooled heat exchange coefficient of mold surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311422236.XA CN118067778A (en) | 2023-10-30 | 2023-10-30 | Verification device and method for verifying air-cooled heat exchange coefficient of mold surface |
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| Publication Number | Publication Date |
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| CN118067778A true CN118067778A (en) | 2024-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311422236.XA Pending CN118067778A (en) | 2023-10-30 | 2023-10-30 | Verification device and method for verifying air-cooled heat exchange coefficient of mold surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118067778A (en) |
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2023
- 2023-10-30 CN CN202311422236.XA patent/CN118067778A/en active Pending
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