CN118042726A - Circuit board processing and manufacturing method and circuit board - Google Patents
Circuit board processing and manufacturing method and circuit board Download PDFInfo
- Publication number
- CN118042726A CN118042726A CN202410350181.4A CN202410350181A CN118042726A CN 118042726 A CN118042726 A CN 118042726A CN 202410350181 A CN202410350181 A CN 202410350181A CN 118042726 A CN118042726 A CN 118042726A
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- China
- Prior art keywords
- circuit
- circuit board
- electroplating
- plating layer
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 50
- 238000009713 electroplating Methods 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 230000008719 thickening Effects 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 7
- 238000003754 machining Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052802 copper Inorganic materials 0.000 abstract description 23
- 239000010949 copper Substances 0.000 abstract description 23
- 239000000047 product Substances 0.000 description 12
- 238000000151 deposition Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board processing and manufacturing method and a circuit board, wherein the method comprises the following steps: primary electroplating: thickening surface copper and hole copper of a designated area on the surface of a material to form a first copper plating layer of a circuit; manufacturing an electroplating lead: manufacturing an electroplating lead wire for conducting a product area circuit and a process area circuit of a material; secondary electroplating: the current flows to the product area circuit through the process area circuit and the electroplating lead, so that a second copper plating thickening coating is formed on the surface of the first copper plating layer to form a second copper plating layer; disconnecting the electroplated lead: and cutting off or removing the electroplating lead wire to prevent the circuit short circuit of the finished circuit board. The secondary electroplating is used for additionally coating a layer of plating layer on the outer side of the circuit obtained by the primary electroplating, so that the copper thickness of the circuit is increased, and the copper thickness of the circuit is widened, so that the circuit board with large cross-sectional area and small space of the wire is obtained, the advantage of small resistance of the wire is achieved, and the higher requirement of a user on the thrust of Coil motor Coil products can be met.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board processing and manufacturing method and a circuit board.
Background
Coil motor Coil products now require increasingly greater thrust and correspondingly lower wire resistance. It is derived from ohm's law that the resistance of a wire can only be reduced by increasing the cross-sectional area of the wire without changing the length of the wire. The increased cross-sectional area of the wires means that the wire spacing is reduced, and the conventional SAP addition process cannot meet the requirement of the wire spacing.
The prior art generally increases the cross-sectional area of the wire by increasing the aspect ratio of the wire, for example, a method for improving the aspect ratio of a PCB circuit is disclosed in chinese patent application No. 201710224120.3 (application publication No. CN 106961803A), which effectively improves the copper thickness of the circuit by applying a photosensitive material, exposing, developing, surface treating and electroplating copper twice or more. However, the process of secondary film pressing, exposure and development has unavoidable alignment tolerance with the previous process, and the width of the developed dry film has limitation, and still cannot break through smaller line spacing, and the cross section of the wire can only be increased in a heightened manner.
Therefore, a more precise circuit processing method is needed to manufacture a circuit board with large cross-sectional area and small pitch of the wires.
Disclosure of Invention
The first technical problem to be solved by the present invention is to provide a processing and manufacturing method for manufacturing a circuit board with large cross-sectional area and small pitch of a wire.
The second technical problem to be solved by the invention is to provide a circuit board with large cross-sectional area and small space of the conducting wire manufactured by the method.
The technical scheme adopted for solving the technical problems is as follows: a circuit board processing and manufacturing method comprises the following steps of
Primary electroplating: thickening conductors in a designated area on the surface of the material to form a first coating of the circuit;
characterized by further comprising the following steps of
Manufacturing an electroplating lead: manufacturing an electroplating lead wire for conducting a product area circuit and a process area circuit of a material;
secondary electroplating: the current emitted by the electrode flows to the product area circuit through the process area circuit and the electroplating lead, so that a second coating is formed by thickening the coating on the surface of the first coating through secondary electroplating;
Disconnecting the electroplated lead: and cutting off or removing the electroplating lead wire to prevent the circuit short circuit of the finished circuit board.
As a scheme of the invention, the step of manufacturing the electroplating lead wire and the step of primary electroplating are synchronously carried out, so that the circuit board processing step is simplified.
Further, as an alternative to implementing the simultaneous production of the plated leads and the primary plating, the present invention further includes the step of exposing: transferring the circuit pattern and the lead pattern to the surface of the material after film pressing, and exposing the dry film of the non-circuit and non-lead area; developing: removing the dry film of the unexposed area; step exposure and step development before the step primary electroplating, the designated area in the step primary electroplating is the exposed circuit and lead area after the step exposure and development.
Further, the invention also comprises the steps of contour machining: removing the process area and cutting into a shape and a size meeting the requirements; the step of disconnecting the electroplating lead wire and the step of processing the appearance are synchronously carried out, and the electroplating lead wire is cut off while the process area is removed.
In order to ensure the total thickness after plating, the width of the wires and the spacing between the wires, the step of secondary plating thickens the circuit plating by 5-7 μm is preferable.
The circuit board is characterized by being processed by the circuit board manufacturing and processing method, the circuit board comprises an insulating layer and circuits on the upper surface and the lower surface of the insulating layer, the circuits comprise a seed layer and a plating layer, the seed layer is clung to the insulating layer, the plating layer is coated on the outer surface of the seed layer, the plating layer comprises a first plating layer and a second plating layer, the first plating layer is formed by primary electroplating processing in the circuit board manufacturing and processing method, and the second copper plating layer is formed by secondary electroplating processing in the step.
Further, the circuit of the circuit board is used for manufacturing a motor coil.
Preferably, the thickness of the circuit second plating layer of the circuit board is preferably 5-7 μm.
Finally, the circuit thickness of the circuit board is 20-60 mu m, the width of the conductor is 20-100 mu m, and the interval between the conductors is 5-10 mu m.
Compared with the prior art, the invention has the advantages that: the invention enables the current to be communicated with the circuit of the product area during secondary plating by manufacturing the plating lead wire for conducting the circuit of the product area and the circuit of the process area, thereby enabling the current to pass through the plating lead wire during secondary plating and thickening the circuit during secondary plating. The secondary electroplating is used for additionally coating a layer of coating on the outer side of the circuit obtained by the primary electroplating, so that the thickness of the circuit is increased, the width of a circuit conductor is widened, and therefore, the circuit board with large cross-sectional area and small space of the wire is obtained.
Drawings
FIGS. 1 to 3 are schematic cross-sectional views of a circuit board according to an embodiment of the present invention, wherein steps 1 to 13 are sequentially corresponding to (a) to (m);
fig. 4 to 6 are plan views of a circuit board according to an embodiment of the present invention, wherein (a) to (m) correspond to steps 1 to 13 in order;
fig. 7 is a top view of a circuit board before outline processing according to a second embodiment of the present invention;
fig. 8 is a top view of a circuit board manufactured according to the second embodiment of the invention after the outline processing.
Detailed Description
The invention is described in further detail below with reference to the embodiments of the drawings.
Example 1
The circuit board processing and manufacturing method of the embodiment, as shown in fig. 1 to 6, includes the following steps:
Step 1, cutting: according to the product design size, the substrate is fed, the thickness direction of the substrate comprises an insulating layer 1 and conductor layers 2 on the upper surface and the lower surface of the insulating layer 1, and the plane direction of the substrate can be defined into a product area 10 for manufacturing the product and a process area 20 for assisting in manufacturing;
step 2, drilling: the product area 10 is drilled with a via hole 3 for conducting two layers of lines, which can be mechanical drilling and laser drilling, and the preferred mechanical drilling is adopted in the embodiment;
step3, etching: etching and removing the conductor layer 2 on the surface of the material;
Step4, depositing a seed layer: depositing a conductive seed layer 4 with the thickness of about 0.3-1.0 mu m on the upper surface and the lower surface of the material and the wall of the via hole 3;
step 5, film pressing: pressing photosensitive dry films 5 on the upper and lower surfaces of the material;
step 6, exposure: transferring the circuit pattern and the lead pattern to the surface of the material after film pressing, and exposing the dry film 5 in the non-circuit and non-lead area to change the dry film into an exposed dry film 6;
Step 7, developing: removing unreacted dry film 5 in the unexposed areas;
step 8, primary electroplating: thickening the developed and leaked circuit, lead area surface copper and hole copper to form a first plating layer 7 of the circuit;
Step 9, removing the film: removing the dry film 6 which has been subjected to the exposure reaction;
step 10, copper reduction: removing the seed layer 4 between the lines to prevent the short circuit of the lines;
Step 11, secondary electroplating: the current flows to the circuit of the product area 10 through the circuit of the process area 20 and the electroplating lead 9, so that the surface of the first plating layer 7 is plated with copper for the second time to thicken the plating layer, and a second plating layer 8 is formed;
step 12, disconnecting the electroplating lead: the electroplating lead wire part is leaked out through the (film pressing, exposure and development) process, and then the etching process is used for removing the electroplating lead wire 9 to prevent short circuit;
Step 13, appearance processing: the process field 20 is removed and cut to the desired shape and size.
The final product circuit board comprises an insulating layer 1 and circuits on the upper surface and the lower surface of the insulating layer 1.
The material of the insulating layer 1 may be a material having a high insulation resistance such as epoxy (PP) or Polyimide (PI), and is preferably epoxy (PP). The conductive layer process on the surface of the material of the insulating layer 1 may be a chemical deposition (copper deposition), lamination of ultra-thin copper foil, atomic sputtering, etc., and is preferably a chemical deposition (copper deposition) used in step 4 of this embodiment.
The circuit comprises a seed layer 4 and a plating layer, wherein the seed layer 4 is tightly attached to the insulating layer 1, and the plating layer is coated on the outer surface of the copper deposition layer 4. The plating layer comprises a first plating layer 7 and a second plating layer 8, wherein the first plating layer 7 is formed by primary electroplating in the step 8 in the circuit board manufacturing and processing method, the second plating layer 8 is formed by secondary electroplating in the step 11, and the thickness of the second plating layer 8 is preferably 5-7 mu m. The material of the wiring and the plating lead can be copper, nickel, titanium or other metal with good conductivity, preferably copper.
The thickness of copper and the gap between conductors can be measured by a 3D microscope or a slicing mode, and the total copper thickness after plating, the width of the conductors, the spacing between the conductors and the like are finally ensured.
The method can be used for manufacturing Coil motor coils, and the manufactured circuit is preferably 20-60 mu m thick in total copper, 20-100 mu m wide in conductor and 5-10 mu m in interval between conductors. The electroplated leads of the product circuit board have various design methods as long as the product area circuit and the power supply path can be satisfied.
It should be noted that, although the circuit board is shown as two-layer circuit in the drawings, the present invention is not limited by the number of circuit layers, and the present invention can be applied to circuit boards with four-layer, six-layer and other circuit layers.
Example two
The difference between this embodiment and the first embodiment is that the step 12 of removing the lead and the step 13 of profiling are combined into the same step, that is, the profiling is performed, and the plated lead 9 is cut off at the same time as the profiling removing process area 20, as shown in fig. 7 and 8, and the top view of the circuit board before and after the profiling step in the process of processing another circuit board is shown.
Claims (10)
1. A circuit board processing and manufacturing method comprises the following steps of
Primary electroplating: thickening conductors in a designated area on the surface of the material to form a first coating of the circuit;
characterized by further comprising the following steps of
Manufacturing an electroplating lead: manufacturing an electroplating lead wire for conducting a product area circuit and a process area circuit of a material;
secondary electroplating: the current flows to the product area circuit through the process area circuit and the electroplating lead, so that a second plating layer is formed by thickening the plating layer through secondary electroplating on the surface of the first plating layer;
Disconnecting the electroplated lead: and cutting off or removing the electroplating lead wire to prevent the circuit short circuit of the finished circuit board.
2. The method of claim 1, wherein the step of fabricating the plated leads is performed simultaneously with the step of primary plating.
3. The method for manufacturing a circuit board according to claim 2, further comprising the step of
Exposure: transferring the circuit pattern and the lead pattern to the surface of the material after film pressing, and exposing the dry film of the non-circuit and non-lead area;
Developing: removing the dry film of the unexposed area;
step exposure and step development before the step primary electroplating, the designated area in the step primary electroplating is the exposed circuit and lead area after the step exposure and development.
4. The circuit board processing method according to claim 1, further comprising the step of: removing the process area and cutting into a shape and a size meeting the requirements;
The step of disconnecting the electroplating lead is synchronously carried out with the step of contour machining, and the electroplating lead is disconnected while the process area is removed.
5. The method for manufacturing a circuit board according to claim 1, wherein the step of secondary plating thickens the circuit plating layer by 5-7 μm.
6. The circuit board is characterized by being processed by the circuit board manufacturing and processing method according to any one of claims 1-6, the circuit board comprises an insulating layer and circuits on the upper surface and the lower surface of the insulating layer, the circuits comprise a seed layer and a plating layer, the seed layer is clung to the insulating layer, the plating layer is coated on the outer surface of the seed layer, the plating layer comprises a first plating layer and a second plating layer, the first plating layer is formed by primary electroplating processing in the circuit board manufacturing and processing method, and the second plating layer is formed by secondary electroplating processing in the step.
7. The circuit board of claim 6, wherein the wiring of the circuit board forms a motor coil.
8. The circuit board of claim 6, wherein the circuit second plating layer of the circuit board has a thickness of 5-7 μm.
9. The circuit board of claim 6, wherein the circuit board has a total circuit thickness of 20-60 μm and a width of 20-100 μm.
10. The circuit board of claim 6, wherein the spacing between conductors of the circuit board is 5-10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410350181.4A CN118042726A (en) | 2024-03-26 | 2024-03-26 | Circuit board processing and manufacturing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410350181.4A CN118042726A (en) | 2024-03-26 | 2024-03-26 | Circuit board processing and manufacturing method and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118042726A true CN118042726A (en) | 2024-05-14 |
Family
ID=90986011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410350181.4A Pending CN118042726A (en) | 2024-03-26 | 2024-03-26 | Circuit board processing and manufacturing method and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118042726A (en) |
-
2024
- 2024-03-26 CN CN202410350181.4A patent/CN118042726A/en active Pending
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