CN118039620B - Power module and electronic equipment - Google Patents
Power module and electronic equipment Download PDFInfo
- Publication number
- CN118039620B CN118039620B CN202410430634.4A CN202410430634A CN118039620B CN 118039620 B CN118039620 B CN 118039620B CN 202410430634 A CN202410430634 A CN 202410430634A CN 118039620 B CN118039620 B CN 118039620B
- Authority
- CN
- China
- Prior art keywords
- power module
- chip
- substrate
- connection
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 210000000746 body region Anatomy 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a power module and electronic equipment, wherein the power module comprises a substrate, a central area and an edge area; the connecting terminals are distributed at intervals around the central area in the edge area of the substrate; a chip set including at least two chips stacked on each other and connected to the substrate, each chip including a first surface and a second surface facing each other in a stacking direction; the connecting pieces are alternately arranged with the chips in a laminated way, one end of each connecting piece is connected with the second surface of the chip, and the other end of each connecting piece is connected with one connecting terminal through the substrate; the power module is provided with more than two conductive pieces, one end of each conductive piece is connected with the second surface of the chip and is adjacent to one end of the corresponding connecting piece, and the other end of each conductive piece is connected with the connecting terminal through the substrate so as to form more than two circuits of the power module. The power module can shorten the current loop, reduce stray inductance and line resistance and increase packaging power density.
Description
Technical Field
The application belongs to the technical field of semiconductor devices, and particularly relates to a power module and electronic equipment.
Background
The power module is formed by combining different power electronic devices according to a certain function. In a power module with a conventional planar structure, a plurality of chips with different functions are generally soldered on a surface of a substrate in a scattered manner, and the chips are connected with terminals soldered on the surface of the substrate through connection wires, so as to form a complete current loop, and the chips can control current in the whole circuit. However, the multiple chips are arranged in a planar structure, so that the whole power module has a longer current loop, and stray inductance and line resistance of the power module are overlarge, so that the packaging power density is limited.
Disclosure of Invention
The application provides a power module and electronic equipment, wherein the power module can shorten a current loop, reduce stray inductance and line resistance and increase packaging power density.
The application provides a power module, which comprises: a substrate including a central region and an edge region surrounding the central region; the connecting terminals are distributed at intervals around the central area in the edge area of the substrate; the chip set comprises more than two chips which are arranged in a stacking way, one side of the chip set along the stacking direction of the chips is connected to the substrate, and each chip comprises a first surface and a second surface which are opposite along the stacking direction; the connecting pieces are alternately arranged with more than two chips in a laminated way, one end of each connecting piece is connected with the second surface of the chip, and the other end of each connecting piece is connected with one connecting terminal through the substrate to form more than two circuits of the power module; the power module is provided with more than two conductive pieces, one end of each conductive piece is connected with the second surface of the chip and is adjacent to one end of the corresponding connecting piece, and the other end of each conductive piece is connected with the connecting terminal through the substrate so as to form more than two circuits of the power module.
The power module comprises a substrate and a plurality of second block units, wherein the plurality of block units are distributed independently, the plurality of block units comprise a first block unit and a plurality of second block units, the first block unit comprises a main body area and a branch area, the main body area forms a central area, the branch area is formed by extending and protruding the main body area along a first direction, the chip group is arranged in the main body area, one connecting terminal is arranged in the branch area, the other connecting terminals are arranged in the second block unit, a part of the second block units are distributed adjacent to the branch area along a second direction, and the other part of the second block units are distributed on the other side of the main body area along the first direction and are distributed side by side along the second direction.
In the power module, the area of the chip set in the direction away from the substrate is gradually reduced, and the second surface of each chip is at least partially uncovered by the corresponding connecting piece to form the exposed part.
In the power module, one end of the conductive member corresponding to each chip is connected to the exposed portion.
The power module above, wherein the connecting piece includes a first connecting portion, a second connecting portion and a third connecting portion, the first connecting portions of more than two connecting pieces and more than two chips are stacked and alternately arranged, one side surface of each first connecting portion is electrically connected with the second surface of the corresponding chip, the other side surface of each first connecting portion is used for supporting the first surface of the adjacent chip, and the third connecting portion of each connecting piece is electrically connected with the corresponding connecting terminal.
In the power module, the first connection portion has a plate-shaped structure, and projections of the first connection portion all fall within projection ranges of the corresponding chips in a preset plane perpendicular to the stacking direction.
In the above power module, in the preset plane, the projection area of the first connection portion is S1, the projection area of the corresponding chip is S2, and the projection area of the first connection portion and the projection area of the corresponding chip have a relationship: s1=50%s2 to 80%s2.
The power module comprises a connecting piece, a corresponding chip and a substrate, wherein the connecting piece is in a plate-shaped structure, the connecting piece is connected with the corresponding chip and the substrate in a welding mode, and the connecting piece is connected with the corresponding chip and the substrate in a welding mode.
The power module above, wherein the conductive member is a linear structure, the connection member is connected with the corresponding chip and the substrate by welding, and the conductive member is connected with the corresponding chip and the substrate by wire bonding.
On the other hand, the application also provides electronic equipment, which comprises the power module.
The power module comprises a substrate, connecting terminals, a chipset, connecting pieces and conducting pieces, wherein the substrate comprises a central area and an edge area surrounding the central area, the connecting terminals are distributed at intervals around the central area in the edge area of the substrate, the chipset comprises more than two chips which are arranged in a stacking mode, the more than two connecting pieces and the more than two chips are alternately arranged in a stacking mode, one end of each connecting piece is connected with the second surface of the chip, the other end of each connecting piece is connected with one connecting terminal through the substrate, the arrangement area of the chips and the connecting pieces on the surface of the substrate can be reduced, the chips and the connecting pieces are mostly concentrated in the central area, the whole packaging volume of the power module is reduced, one end of each conducting piece is connected with the second surface of the chips and is adjacent to one end of the corresponding connecting piece, the other end of each conducting piece is connected with the connecting terminal through the substrate, and more than two complete circuits of the power module are formed, and the reduction of the arrangement area of the chips and the connecting pieces shortens more than two current loops of the power module, so that stray inductance and circuit resistance are reduced, and packaging power density is increased.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
FIG. 1 is an isometric view of a power module according to an embodiment of the present application;
FIG. 2 is a side view of a power module according to an embodiment of the application;
FIG. 3 is an isometric view of a power module according to another embodiment of the application;
fig. 4 is a side view of a power module according to another embodiment of the application.
Reference numerals illustrate:
10. A substrate; 11. a central region; 12. an edge region; 13. a block unit; 131. a first block unit; 132. a second block unit; 133. a body region; 134. a branching region; 20. a connection terminal; 30. a chipset; 31. a chip; 311. a first surface; 312. a second surface; 313. an exposed portion; 40. a connecting piece; 41. a first connection portion; 42. a second connecting portion; 43. a third connecting portion; 50. a conductive member;
x, a first direction; y, second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
As shown in fig. 1 to 4, an embodiment of the present application provides a power module, including: a substrate 10 including a central region 11 and an edge region 12 surrounding the central region 11; the connection terminals 20, the plurality of connection terminals 20 are spaced apart from each other around the central region 11 at the edge region 12 of the substrate 10; a chip set 30 including two or more chips 31 stacked on each other, the chip set 30 being connected to the substrate 10 along one side of the chip 31 in the stacking direction, each chip 31 including a first surface 311 and a second surface 312 facing away from each other in the stacking direction; the connection members 40, more than two connection members 40 are stacked alternately with more than two chips 31, and one end of each connection member 40 is connected with the second surface 312 of the chip 31, and the other end is connected with one connection terminal 20 through the substrate 10 to constitute more than two circuits of the power module; the power module has more than two conductive members 50, one end of each conductive member 50 is connected to the second surface 312 of the chip 31 and is disposed adjacent to one end of the corresponding connection member 40, and the other end is connected to the connection terminal 20 through the substrate 10 to form more than two circuits of the power module. The stacking direction is the vertical direction in fig. 2.
In particular, in the power module of the present application, the substrate 10 includes a central region 11 and an edge region 12 surrounding the central region 11, the plurality of connection terminals 20 are distributed around the central region 11 in the edge region 12 of the substrate 10, the chipset 30 includes two or more chips 31 stacked and arranged alternately, and one end of each connection member 40 is connected with the second surface 312 of the chip 31, and the other end is connected with one connection terminal 20 through the substrate 10, so that the arrangement area of the chip 31 and the connection member 40 on the surface of the substrate 10 can be reduced, the chip 31 and the connection member 40 are mostly concentrated in the central region 11, the overall packaging volume of the power module is reduced, one end of each connection member 50 is connected with the second surface 312 of the chip 31 and is arranged adjacent to one end of the corresponding connection member 40, and the other end is connected with the connection terminal 20 through the substrate 10, thereby forming two or more chips 31 of the power module, the whole circuit of the power module is reduced, and the stray current density of the power circuit is reduced, and the stray current circuit is reduced, and the power circuit is packaged and the stray current density is reduced. In addition, the phenomena of voltage overshoot and excitation oscillation can be reduced, the electric stress and loss of the chip 31 can be reduced, and parasitic parameters can be reduced.
Specifically, the chip 31 of the power module has a source connection port and a gate connection port, one end of the connection member 40 is electrically connected to the source connection port, one end of the conductive member 50 is electrically connected to the gate connection port, and since the conductive member 50 is used for transmitting a signal for controlling the chip, the connection member 40 is used for transmitting a current for driving the control chip, and thus the intensity of the current transmitted in the conductive member 50 is smaller than that in the connection member 40, and the cross-sectional area of the conductive member 50 is also smaller than that of the connection member 40.
As shown in fig. 1 to 4, in the power module according to the embodiment of the application, the substrate 10 includes a plurality of block units 13, the plurality of block units 13 are distributed independently, the plurality of block units 13 includes a first block unit 131 and a plurality of second block units 132, the first block unit 131 includes a main body region 133 and a branch region 134, the main body region 133 forms the central region 11, the branch region 134 is formed by extending and protruding the main body region 133 along a first direction X, the chipset 30 is disposed in the main body region 133, one connection terminal 20 is disposed in the branch region 134, the other connection terminals 20 are disposed in the second block unit 132, a part of the second block units 132 are distributed adjacent to the branch region 134 along a second direction Y, and another part of the second block units 132 are distributed on the other side of the main body region 133 along the first direction X and are distributed side by side along the second direction Y.
In implementation, the first block unit 131 and the second block units 132 can enable the chipset 30 and the plurality of connection terminals 20 to have block units 13 which are independently arranged, each block unit 13 has a connection circuit, the chipset 30 and the plurality of connection terminals 20 can be electrically connected through the connection circuits in the corresponding block units 13 under the connection of the connection member 40 and the conductive member 50, thereby forming a complete circuit, and the independently arranged block units 13 can reduce the overall area of the substrate 10, thereby reducing the manufacturing cost of the power module; a portion of the second block units 132 and the branching region 134 are adjacently disposed on one side of the chipset 30, and another portion of the second block units 132 are adjacently disposed on the other side of the chipset 30, and such a distributed arrangement can reduce the overall planar area of the plurality of block units 13, thereby reducing the packaging volume of the power module, shortening the current loop, reducing the stray inductance and the line resistance, and increasing the packaging power density.
Specifically, the power module of the present application includes two chips 31, one first block unit 131 and three second block units 132 are included in the plurality of block units 13, one second block unit 132 and the branching region 134 are adjacently disposed on one side of the chipset 30, the other two second block units 132 are adjacently disposed on the other side of the chipset 30, and the four connection terminals 20 are respectively disposed on the branching region 134 and the three second block units 132.
As shown in fig. 1, in the power module according to the embodiment of the application, the area of the chipset 30 in the direction away from the substrate 10 is reduced, and the second surface 312 of each chip 31 is at least partially uncovered by the corresponding connecting member 40 to form the exposed portion 313.
In specific implementation, the exposed portion 313 can connect other ports of the chip 31 with the connectors in the power module to form different complete loops, so as to avoid the situation that the connectors 40 cover all the connection ports of the chip 31 and other connectors cannot be connected.
As shown in fig. 1, in the power module according to the embodiment of the application, one end of the conductive member 50 corresponding to each chip is connected to the exposed portion 313, and the exposed portion 313 provides a connection space for the conductive member 50, so that the conductive member 50 is not affected by the connection member 40 when connected to the chip 31.
As shown in fig. 1, in the power module according to the embodiment of the application, the connecting member 40 includes a first connecting portion 41, a second connecting portion 42 and a third connecting portion 43, the first connecting portion 41 of more than two connecting members 40 and more than two chips 31 are stacked and alternately arranged, one side surface of each first connecting portion 41 is electrically connected to the second surface 312 of the corresponding chip 31, the other side surface of each first connecting portion 41 is used for supporting the first surface 311 of the adjacent chip 31, and the third connecting portion 43 of each connecting member 40 is electrically connected to the corresponding connecting terminal 20.
In particular, the first connection portion 41 of each connection member 40 can be electrically connected to the corresponding chip 31 and stacked, so as to perform the function of connection and support, and the second connection portion 42 and the third connection portion 43 protrude from the first connection portion 41 and are electrically connected to the corresponding connection terminal 20, thereby forming a complete circuit.
As shown in fig. 1 and 2, in the power module according to the embodiment of the application, the first connection portion 41 has a plate-like structure, and the projections of the first connection portion 41 all fall within the projection range of the corresponding chip 31 in a preset plane perpendicular to the stacking direction.
In particular, when the first connection portion 41 of the plate-like structure is stacked with the chip 31, the chip 31 and the first connection portion 41 of the plate-like structure have a sufficient contact area, so that the heat dissipation effect of the chip 31 can be improved, thereby effectively improving temperature fluctuation and prolonging the service life of the power module.
As shown in fig. 1 and fig. 2, in the power module according to the embodiment of the present application, in a preset plane, a projection area of the first connection portion 41 is S1, a projection area of the corresponding chip 31 is S2, and the projection area of the first connection portion 41 and the projection area of the corresponding chip 31 have a relationship: s1=50%s2 to 80%s2.
In particular, in this area relationship, it is possible to ensure that the area of the first connection portion 41 is not too small to reduce the heat dissipation effect, and it is also possible to avoid a situation in which the area of the first connection portion 41 is too large to cause the area of the exposed portion 313 to be too small, so that the conductive member 50 is not convenient to connect with the exposed portion 313. The heat dissipation effect of the power module and the connectivity between the chip 31 and the conductive member 50 can be ensured at the same time within this range.
As shown in fig. 1 and fig. 2, in the power module according to the embodiment of the application, the conductive member 50 has a plate-shaped structure, the connecting member 40 is connected to the corresponding chip 31 and the substrate 10 by a welding manner, and the conductive member 50 is connected to the corresponding chip 31 and the substrate 10 by a welding manner.
In particular, the conductive member 50 is the same connecting bridge as the connecting member 40, is made of metal material such as copper, and is connected with the chip 31 and the substrate 10 by means of a welded connection mode, so that the power module can be assembled only by welding operation in the manufacturing process, the operation steps are reduced, and the production efficiency of the power module is improved.
As shown in fig. 3 and 4, in the power module according to another embodiment of the present application, the conductive member 50 is a wire structure, the connection member 40 is connected to the corresponding chip 31 and the substrate 10 by soldering, and the conductive member 50 is connected to the corresponding chip 31 and the substrate 10 by wire bonding.
In particular, the conductive member 50 is a wire-shaped binding wire, which is lighter in weight than the bridge structure of the connecting member 40, so that the overall weight of the power module employing the binding wire is lighter.
The embodiment of the application also provides electronic equipment, which comprises the power module.
In particular, the electronic device of the present application includes a power module, the power module includes a substrate 10, connection terminals 20, a chipset 30, connection members 40 and conductive members 50, the substrate 10 includes a central region 11 and an edge region 12 surrounding the central region 11, the plurality of connection terminals 20 are distributed around the central region 11 in the edge region 12 of the substrate 10, the chipset 30 includes two or more chips 31 stacked and arranged alternately, one end of each connection member 40 is connected with the second surface 312 of the chip 31, the other end is connected with one connection terminal 20 through the substrate 10, the stacked arrangement mode can reduce the arrangement area of the chip 31 and the connection members 40 on the surface of the substrate 10, so that the chip 31 and the connection members 40 are mostly concentrated in the central region 11, the overall packaging volume of the power module is reduced, one end of each conductive member 50 is connected with the second surface 312 of the chip 31 and is arranged adjacent to one end of the corresponding connection member 40, and the other end is connected with the connection terminals 20 through the substrate 10, thereby forming two or more chips 31 and the circuit of the power module, the stray current density of the circuit is reduced, and the circuit area of the power module is reduced, and the stray current density of the circuit is reduced, and the circuit is also the circuit is reduced.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.
Claims (10)
1. A power module, comprising:
A substrate (10) comprising a central region (11), an edge region (12) surrounding the central region (11) and a plurality of block units (13), wherein a plurality of block units (13) are distributed independently of each other, the plurality of block units (13) comprise a first block unit (131) and a plurality of second block units (132), the first block unit (131) comprises a main body region (133) and a branch region (134), the main body region (133) forms the central region (11), and the branch region (134) is formed by extending and protruding the main body region (133) along a first direction (X);
-connection terminals (20), wherein a plurality of said connection terminals (20) are spaced apart from each other around said central area (11) in said edge area (12) of said substrate (10), one of said connection terminals (20) being provided in said branch area (134) and the remaining connection terminals (20) being provided in said second block unit (132);
A chip set (30), wherein the chip set (30) is arranged in the main body region (133), and comprises more than two chips (31) which are arranged in a stacked manner, the chip set (30) is connected to the substrate (10) along one side of the stacking direction of the chips (31), each chip (31) comprises a first surface (311) and a second surface (312) which are opposite to each other along the stacking direction, and the chip (31) is provided with a source connection port and a gate connection port;
A connecting member (40) for electrically connecting to the source connection port, wherein two or more of the connecting members (40) are stacked alternately with two or more of the chips (31), and one end of each of the connecting members (40) is connected to the second surface (312) of the chip (31) and the other end is connected to one of the connecting terminals (20) through the substrate (10) to constitute two or more circuits of the power module;
And the power module is provided with more than two conductive pieces (50), one end of each conductive piece (50) is connected with the second surface (312) of the chip (31) and is arranged adjacent to one end of the corresponding connecting piece (40), and the other end of each conductive piece is connected with the connecting terminal (20) through the substrate (10) so as to form more than two circuits of the power module.
2. The power module according to claim 1, characterized in that a part of the second block units (132) are distributed adjacent to the branching region (134) in a second direction (Y), and another part of the second block units (132) are distributed on the other side of the body region (133) in the first direction (X) and are distributed side by side in the second direction (Y).
3. The power module according to claim 1, characterized in that the chipset (30) has a decreasing area of two or more chips (31) in a direction thereof away from the substrate (10), and the second surface (312) of each chip (31) is at least partially uncovered by the connection (40) corresponding to itself to constitute an exposed portion (313).
4. A power module according to claim 3, wherein one end of the conductive member (50) corresponding to each of the chips (31) is connected to the exposed portion (313).
5. The power module according to claim 1, wherein the connecting member (40) includes a first connecting portion (41), a second connecting portion (42) and a third connecting portion (43), the first connecting portion (41) of two or more of the connecting members (40) and two or more of the chips (31) are stacked alternately, one side surface of each of the first connecting portions (41) is electrically connected to the second surface (312) of the corresponding chip (31), the other side surface of each of the first connecting portions (41) is for supporting the first surface (311) of the adjacent chip (31), and the third connecting portion (43) of each of the connecting members (40) is electrically connected to the corresponding connecting terminal (20).
6. The power module according to claim 5, characterized in that the first connection portions (41) are plate-like structures, the projections of which first connection portions (41) all fall within the projection range of their corresponding chips (31) in a preset plane perpendicular to the stacking direction.
7. The power module according to claim 6, characterized in that, in the preset plane, the projected area of the first connection portion (41) is S1, the projected area of the corresponding chip (31) is S2, and the projected area of the first connection portion (41) and the projected area of the corresponding chip (31) have a relation: s1=50%s2 to 80%s2.
8. The power module according to claim 4, wherein the conductive member (50) has a plate-like structure, the connection member (40) is connected to the corresponding chip (31) and the substrate (10) by soldering, and the conductive member (50) is connected to the corresponding chip (31) and the substrate (10) by soldering.
9. The power module according to claim 4, wherein the conductive member (50) is a wire structure, the connection member (40) is connected to the corresponding chip (31) and the substrate (10) by soldering, and the conductive member (50) is connected to the corresponding chip (31) and the substrate (10) by wire bonding.
10. An electronic device comprising a power module as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410430634.4A CN118039620B (en) | 2024-04-10 | 2024-04-10 | Power module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410430634.4A CN118039620B (en) | 2024-04-10 | 2024-04-10 | Power module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118039620A CN118039620A (en) | 2024-05-14 |
| CN118039620B true CN118039620B (en) | 2024-06-25 |
Family
ID=90989631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410430634.4A Active CN118039620B (en) | 2024-04-10 | 2024-04-10 | Power module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118039620B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115692399A (en) * | 2022-09-19 | 2023-02-03 | 深圳基本半导体有限公司 | Power module and electronic device |
| CN116913910A (en) * | 2022-11-25 | 2023-10-20 | 苏州悉智科技有限公司 | Power module packaging structure of laminated wiring |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112448561B (en) * | 2019-08-30 | 2022-04-15 | 台达电子企业管理（上海）有限公司 | Power module and preparation method thereof |
| CN113035847A (en) * | 2019-12-25 | 2021-06-25 | 株洲中车时代半导体有限公司 | Low-inductance packaging structure and packaging method for power semiconductor module |
| CN114725076A (en) * | 2022-03-23 | 2022-07-08 | 华中科技大学 | Power module and three-phase motor driver |
| CN220233181U (en) * | 2023-07-21 | 2023-12-22 | 江苏涵润汽车电子有限公司 | Power module |
| CN117374040A (en) * | 2023-10-16 | 2024-01-09 | 浙江晶能微电子有限公司 | Power module and vehicle |
-
2024
- 2024-04-10 CN CN202410430634.4A patent/CN118039620B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115692399A (en) * | 2022-09-19 | 2023-02-03 | 深圳基本半导体有限公司 | Power module and electronic device |
| CN116913910A (en) * | 2022-11-25 | 2023-10-20 | 苏州悉智科技有限公司 | Power module packaging structure of laminated wiring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118039620A (en) | 2024-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7663252B2 (en) | Electric power semiconductor device | |
| JP5287359B2 (en) | Semiconductor module | |
| JP7210446B2 (en) | power semiconductor module | |
| CN103155147B (en) | the internal wiring structure of semiconductor device | |
| JPH098192A (en) | Power semiconductor module with connection pin | |
| JP2002231884A (en) | High output power semiconductor module and application thereof | |
| JP2007053371A (en) | Power semiconductor module with line elements | |
| CN112701111B (en) | Three-level circuit silicon carbide power module | |
| CN118039620B (en) | Power module and electronic equipment | |
| CN220492415U (en) | Laser module and laser | |
| JP2020519027A (en) | Semiconductor module | |
| CN116097430A (en) | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | |
| US5420459A (en) | Resin encapsulation type semiconductor device having an improved lead configuration | |
| JPH0397257A (en) | Large power semiconductor device | |
| US6717258B2 (en) | Power semiconductor device | |
| US11935807B2 (en) | Plurality of dies electrically connected to a printed circuit board by a clip | |
| JPH08274228A (en) | Semiconductor mounting board, power semiconductor device and electronic circuit device | |
| CN112687632A (en) | Structural design of power module and implementation method thereof | |
| CN110622286A (en) | Amplifier with a high-frequency amplifier | |
| CN112271164A (en) | Low-inductance silicon carbide module | |
| KR20210041426A (en) | Power Semiconductor Module and the Manufacturing Method thereof | |
| JP4073621B2 (en) | Power module | |
| CN215911425U (en) | Power module and household electrical appliance | |
| CN213583744U (en) | Low-inductance silicon carbide module | |
| KR100646630B1 (en) | Manufacturing process of Printed circuit board for Light Emitting Diode and Printed circuit board for Light Emitting Diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |