CN118033301B - Intelligent detection system and method for detecting conductive back adhesive performance - Google Patents
Intelligent detection system and method for detecting conductive back adhesive performance Download PDFInfo
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 143
- 239000000853 adhesive Substances 0.000 title claims abstract description 142
- 238000001514 detection method Methods 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000012360 testing method Methods 0.000 claims abstract description 88
- 238000011056 performance test Methods 0.000 claims abstract description 53
- 230000000694 effects Effects 0.000 claims abstract description 43
- 230000008569 process Effects 0.000 claims abstract description 29
- 238000012544 monitoring process Methods 0.000 claims abstract description 17
- 230000005672 electromagnetic field Effects 0.000 claims description 128
- 230000005856 abnormality Effects 0.000 claims description 48
- 238000009826 distribution Methods 0.000 claims description 39
- 238000004458 analytical method Methods 0.000 claims description 27
- 239000013598 vector Substances 0.000 claims description 18
- 239000006185 dispersion Substances 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 11
- 230000001629 suppression Effects 0.000 claims description 11
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000011156 evaluation Methods 0.000 claims description 10
- 230000003044 adaptive effect Effects 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 9
- 238000011835 investigation Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 6
- 230000005764 inhibitory process Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Abstract
The invention discloses an intelligent detection system and method for detecting conductive back adhesive performance, which relate to the technical field of conductive back adhesive performance detection and comprise the following steps: determining the testing purpose of the conductive adhesive back sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the testing purpose of the conductive adhesive back sample to be tested so as to simulate the actual electromagnetic interference condition. According to the invention, the invisible faults of the electromagnetic shielding chamber can be timely found in the performance test process of the conductive back adhesive, so that the misjudgment rate of the test result is effectively reduced, and by monitoring the electromagnetic shielding chamber in real time, under the condition of finding the invisible faults, an inaccurate sample can be timely marked and re-detected, and the accuracy of the test result is ensured, so that the risk brought by overestimation or underestimation of the actual shielding effect of the conductive back adhesive can be avoided.
Description
Technical Field
The invention relates to the technical field of conductive back adhesive performance detection, in particular to an intelligent detection system and method for conductive back adhesive performance detection.
Background
The conductive back adhesive is a special adhesive, contains conductive filler (such as metal powder or carbon black) and adhesive matrix (such as polymer), has conductive performance, and is commonly used for connection, fixation, shielding and the like in electronic equipment. The adhesive has the characteristics of excellent conductivity, adhesive property, high temperature resistance, corrosion resistance and shielding property, the method is widely applied to the welding, packaging, fixing and shielding treatment of the circuit board and the connection between electronic elements. The detection of the performance of the conductive adhesive refers to the process of testing and evaluating various performances of the conductive adhesive. These properties include electrical conductivity, adhesion, high temperature resistance, corrosion resistance, shielding properties, and the like. Through performance detection, the normal use of the conductive back adhesive in the electronic equipment can be ensured, the good conductive connection, stable adhesiveness and high temperature and corrosion resistance of the conductive back adhesive are ensured, and effective electromagnetic shielding protection is provided, so that the reliability and stability of the equipment are ensured.
The electromagnetic shielding chamber plays a vital role in detecting the performance of the conductive adhesive back, and has the function of simulating various electromagnetic environments and providing a controlled test scene so as to evaluate the electromagnetic interference suppression effect and the shielding effect of the conductive adhesive back on external electromagnetic fields. In the electromagnetic shielding chamber, the intensity and frequency of external electromagnetic radiation can be controlled, so that the test environment is more real and reliable. The shielding performance of the conductive back adhesive can be comprehensively evaluated by measuring the electromagnetic wave absorption, reflection and transmission conditions of the conductive back adhesive under different frequencies, so that the internal circuit of the electronic equipment is not influenced by external electromagnetic interference, and the normal operation and reliability of the equipment are ensured.
The prior art has the following defects:
when the electromagnetic shielding chamber detects the suppression effect of the conductive back adhesive on electromagnetic interference and the shielding effect of the conductive back adhesive on an external electromagnetic field, if the electromagnetic shielding chamber has invisible faults, the faults of the electromagnetic shielding chamber may cause inaccurate test results, misjudging the shielding effect of the conductive back adhesive, which can cause overestimate or underestimate the actual shielding effect, if the actual shielding effect of the conductive back adhesive is overestimated, namely the test results consider that the shielding performance is better, but in fact, the shielding effect is poorer, the internal circuit of the electronic equipment may be influenced by external electromagnetic interference, which may cause unstable operation, frequent faults or performance decline of the equipment, thereby affecting the reliability and stability of the whole system, even serious data loss or system collapse, causing serious economic loss and user trust problem, on the contrary, if the actual shielding effect of the conductive back adhesive is underestimated, namely the test results consider that the shielding performance is poorer, and in fact, the shielding effect is better, which may cause improper worry about the electromagnetic interference, which may cause unnecessary equipment design adjustment, additional shielding measures or unnecessary increase in cost, thereby increasing the production cost and reducing the market competition period and the market competition period;
Invisible faults of an electromagnetic shielding chamber refer to faults or problems which cannot be directly observed or identified in appearance, and the faults can exist in structures, materials, electromagnetic shielding systems or other key components of the electromagnetic shielding chamber, but are difficult to detect in external inspection or common operation, the invisible faults can seriously influence the performance and working effects of the electromagnetic shielding chamber, the inaccuracy or unreliability of a test result is caused, and further the inhibition effect of conductive back glue on electromagnetic interference and the accurate evaluation of the shielding effect on an external electromagnetic field are influenced, so that timely finding and removing the invisible faults are very important for ensuring the accuracy and reliability of the test result.
The above information disclosed in the background section is only for enhancement of understanding of the background of the disclosure and therefore it may include information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide an intelligent detection system and method for detecting conductive back adhesive performance, which can timely find out the invisible faults of an electromagnetic shielding chamber in the conductive back adhesive performance test process, thereby effectively reducing the misjudgment rate of a test result.
In order to achieve the above object, the present invention provides the following technical solutions: an intelligent detection method for detecting the performance of conductive back adhesive comprises the following steps:
Determining the testing purpose of a conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the testing purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
Placing a conductive adhesive-backed sample to be tested in an electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and test data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using an electromagnetic field detector;
The method comprises the steps of monitoring an electromagnetic shielding chamber in real time when a conductive adhesive-backed sample to be tested is subjected to performance test, marking a non-standard sample detected during normal operation of the electromagnetic shielding chamber, a standard sample and a sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, a non-qualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
When a sample to be determined exists in the detection process of the electromagnetic shielding chamber, carrying out hidden fault type analysis on the electromagnetic shielding chamber, determining whether the hidden fault type is accidental abnormality, if so, carrying out repeated detection on the sample to be determined, if not, stopping continuous detection on the conductive adhesive-backed sample, and closing the electromagnetic shielding chamber for hidden fault investigation;
And analyzing test data of the qualified sample, evaluating the shielding effect of the qualified conductive adhesive-backed sample, comparing the shielding effect with expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive adhesive-backed sample according to the test result.
Preferably, electromagnetic shielding efficiency information and electromagnetic field distribution information of the conductive adhesive-backed sample to be tested when performance test is carried out through the electromagnetic shielding chamber are obtained, after the electromagnetic shielding efficiency information and the expected electromagnetic shielding efficiency are obtained, expected deviation of the electromagnetic shielding efficiency is generated after comparison, and an electromagnetic field distribution discrete index is generated after the electromagnetic field distribution information is processed.
Preferably, the logic for the electromagnetic shielding effectiveness expected deviation acquisition is as follows:
setting an initial adaptive filtering weight vector And an initial estimated electromagnetic shielding effectiveness；
In a window with fixed duration, recording real-time input power and real-time output power in the electromagnetic shielding chamber, and respectively using functions of the real-time input power and the real-time output power in the electromagnetic shielding chamber according to time sequencesAndRepresenting;
Constructing input vectors Here, the number of the first and second electrodes, in this case,For a system comprising real-time input powerElemental and real-time output powerVectors of elements, namely:；
Calculating an estimated value of electromagnetic shielding efficiency at time t Adaptive filtering weight vector according to time tAnd the input vector at time tIs calculated as an estimate of the inner product:；
According to the prediction error formula: in which, in the process, The prediction error is represented by a prediction error,Representing expected electromagnetic shielding efficiency, updating adaptive filtering weight vectors using recursive least squaresThe formula according to is: in which, in the process, In the form of a covariance matrix,In order to forget the factor,；
Using estimated electromagnetic shielding effectivenessAnd expected electromagnetic shielding efficiencyCalculating an expected deviation in electromagnetic shielding efficiencyThe formula according to is:， Representing a time period within a window of fixed duration, I.e.And (3) withThe difference value is the duration of the fixed duration window.
Preferably, the logic for obtaining the dispersion index of the electromagnetic field distribution is as follows:
Acquiring the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back adhesive shielding performance detection at the same time, and using the actual electromagnetic field intensity The method is represented by x, wherein x is the number of the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back glue shielding performance detection at the same time, and x=1, 2,3, 4, … …, p and p are positive integers;
for obtaining the actual electromagnetic field strength by the same moment Calculating the standard deviation of the electromagnetic field intensity at the moment, and calibrating the standard deviation of the electromagnetic field intensity as；
Acquiring standard deviations of electromagnetic field intensity of an electromagnetic shielding chamber for conducting back adhesive shielding performance detection at different moments in a fixed duration window, and recalibrating the standard deviations of electromagnetic field intensity into the standard deviations according to time sequence。
Preferably, the standard deviation of the electromagnetic field strength obtained in the fixed duration windowCollecting and measuring the standard deviation of the collected electromagnetic field intensityEstablishing a data set, and calibrating the data set as F, thenWherein k represents the number of standard deviation of electromagnetic field intensity in the data set, k=1, 2, 3, 4, … …, m being a positive integer;
The standard deviation of the electromagnetic field intensity in the data set is sequenced in sequence, and then the maximum value of the standard deviation of the electromagnetic field intensity is screened out, and the maximum value of the standard deviation of the electromagnetic field intensity is calibrated as By the maximum value of the standard deviation of the electromagnetic field intensityCalculating an electromagnetic field distribution dispersion index, wherein the calculated expression is: in which, in the process, Representing the electromagnetic field distribution dispersion index.
Preferably, the expected deviation of the electromagnetic shielding efficiency generated in a fixed time window when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested is obtainedAnd an electromagnetic field distribution dispersion indexThen, comprehensively analyzing the two by adopting a weighted summation mode to generate the hidden fault occurrence probability coefficientAnd evaluating the hidden danger of the accuracy of the conductive adhesive-backed sample performance test of the electromagnetic shielding chamber through the hidden fault occurrence probability coefficient.
Preferably, the electromagnetic shielding chamber is used for carrying out performance test on the conductive back adhesive sample to be tested, the generated invisible fault occurrence probability coefficient in the fixed time window is compared with a preset invisible fault occurrence probability coefficient reference threshold value, the detection condition of the product is determined, and the comparison analysis result is as follows:
If the occurrence probability coefficient of the invisible faults is larger than or equal to the reference threshold value of the occurrence probability coefficient of the invisible faults, the electromagnetic shielding chamber is used for performing performance test on the conductive back adhesive sample, if the invisible faults exist, the corresponding detected conductive back adhesive sample is marked as a sample to be determined, and the sample to be determined is screened out;
If the probability coefficient of occurrence of the invisible faults is smaller than the reference threshold value of the probability coefficient of occurrence of the invisible faults, the electromagnetic shielding chamber is indicated to normally operate, the corresponding detected unqualified samples and standard samples are marked as qualified samples, unqualified samples and samples to be determined respectively, and the unqualified samples are screened out.
Preferably, when a sample to be determined exists in the electromagnetic shielding chamber detection process, that is, when the performance test is performed on the conductive adhesive back sample to be tested by the electromagnetic shielding chamber, and the occurrence probability coefficient of the invisible fault generated in the fixed time window is greater than or equal to the reference threshold value of the invisible fault occurrence probability coefficient, a data set is built by a plurality of invisible fault occurrence probability coefficients generated in the subsequent fixed time window, the invisible fault occurrence probability coefficient in the data set is compared with the reference threshold value of the invisible fault occurrence probability coefficient, an abnormal index is calculated after analysis, and the abnormal index is calibrated as follows；
Abnormality indexThe calculated expression of (2) is: in which, in the process, Representing the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, B represents the number of the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, b=1, 2,3, 4, … …, M is a positive integer,And representing the hidden fault occurrence probability coefficient reference threshold.
Preferably, the electromagnetic shielding chamber is used for comparing and analyzing an abnormality index generated when the electromagnetic shielding chamber is used for carrying out performance test on the conductive back adhesive sample to be tested with a preset abnormality index reference threshold value, and the comparison and analysis result is as follows:
If the abnormality index is greater than or equal to the abnormality index reference threshold, generating a non-accidental signal, stopping continuously detecting the conductive adhesive back sample when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested to generate the non-accidental signal, and closing the electromagnetic shielding chamber for hidden fault investigation;
If the abnormality index is smaller than the abnormality index reference threshold, generating an accidental signal, and repeatedly detecting the sample to be determined when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested to generate the accidental signal, so that the efficiency of the electromagnetic shielding chamber in performance test on the conductive adhesive back sample to be tested is improved.
An intelligent detection system for detecting conductive back adhesive performance comprises a test purpose determining module, a test module, a real-time monitoring module, a hidden fault checking module and a qualified sample analysis and evaluation module;
The test purpose determining module is used for determining the test purpose of the conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the test purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
the testing module is used for placing a conductive adhesive-backed sample to be tested in the electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and testing data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using the electromagnetic field detector;
The real-time monitoring module is used for monitoring the electromagnetic shielding chamber in real time when the conductive adhesive-backed sample to be tested is subjected to performance test, marking the unqualified sample detected during normal operation of the electromagnetic shielding chamber, the unqualified sample and the sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, an unqualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
The hidden fault checking module is used for analyzing the type of the hidden fault of the electromagnetic shielding chamber when the sample to be determined exists in the detection process of the electromagnetic shielding chamber, determining whether the type of the hidden fault is accidental abnormality, repeatedly detecting the sample to be determined if the type of the hidden fault is accidental abnormality, stopping continuously detecting the conductive adhesive-backed sample if the type of the hidden fault is not accidental abnormality, and closing the electromagnetic shielding chamber for hidden fault checking;
the qualified sample analysis and evaluation module is used for analyzing the test data of the qualified sample, evaluating the shielding effect of the qualified conductive back adhesive sample, comparing the shielding effect with the expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive back adhesive sample according to the test result.
In the technical scheme, the invention has the technical effects and advantages that:
The intelligent detection method provided by the invention can timely find the invisible faults of the electromagnetic shielding chamber in the conductive back adhesive performance test process, so that the misjudgment rate of the test result is effectively reduced, and through real-time monitoring of the electromagnetic shielding chamber, an inaccurate sample can be timely marked and re-detected under the condition of finding the invisible faults, and the accuracy of the test result is ensured, so that the risk brought by overestimation or underestimation of the actual shielding effect of the conductive back adhesive can be avoided;
According to the invention, through comprehensive analysis of the expected deviation of electromagnetic shielding efficiency and the discrete index of electromagnetic field distribution, the probability coefficient of occurrence of invisible faults is generated, the hidden danger of accuracy of the electromagnetic shielding chamber is further evaluated, the performance of the electromagnetic shielding chamber can be more comprehensively known by the comprehensive analysis mode, so that the reliability of a test result can be more accurately judged, the accuracy and the reliability of performance test of the conductive back adhesive sample by the electromagnetic shielding chamber can be effectively improved by timely finding and removing the invisible faults, the product quality is further ensured, and the competitiveness and market opportunity of enterprises are improved;
According to the method, accidental abnormality and non-accidental abnormality of the electromagnetic shielding chamber can be accurately distinguished by means of calculation and comparison analysis of the abnormality indexes, so that more targeted countermeasures are adopted, the working state of the electromagnetic shielding chamber can be thinned to a more specific degree by calculating the abnormality indexes, hidden faults which possibly exist are further identified, instead of detection results which are merely remained on the surface, the highly accurate abnormality index analysis method effectively avoids misjudgment of the normal working state of the electromagnetic shielding chamber, and meanwhile, the sensitivity to the real abnormality condition is improved, and therefore, reliability and high efficiency of performance test of a conductive back adhesive sample are guaranteed, more scientific and accurate guidance is provided for maintenance of the electromagnetic shielding chamber, stability and reliability of the whole test system are further improved, maintenance cost is saved for enterprises, and production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for those skilled in the art.
FIG. 1 is a flow chart of a method of the intelligent detection system and method for detecting the performance of conductive adhesive back.
FIG. 2 is a schematic block diagram of an intelligent detection system and method for detecting the performance of conductive adhesive back according to the present invention.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.
The invention provides an intelligent detection method for detecting the performance of conductive back glue, which is shown in figure 1, and comprises the following steps:
Determining the testing purpose of a conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the testing purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
the testing purpose comprises the steps of evaluating the electromagnetic interference inhibition effect and the shielding effect on an external electromagnetic field of a conductive adhesive-backed sample to be tested;
The purpose of determining the conductive adhesive-backed sample to be tested is to indicate the target and expected result of the test, which may include verifying the shielding performance of the conductive adhesive-backed, evaluating its suppression effect on electromagnetic interference in a specific frequency range, or confirming its shielding effect under a specific electromagnetic field strength, etc. Determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the test purpose of the conductive adhesive-backed sample to be tested means selecting a proper electromagnetic frequency range and electromagnetic intensity level according to the test purpose so as to simulate the electromagnetic interference situation possibly encountered in the actual environment and ensure the comprehensiveness and reliability of the test. For example, if the conductive adhesive backing is used primarily to shield high frequency electromagnetic wave interference, the test range may be important to cover the high frequency range and proper electromagnetic field strength levels need to be set to ensure that electromagnetic interference conditions in a real operating environment can be simulated.
Placing a conductive adhesive-backed sample to be tested in an electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and test data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using an electromagnetic field detector;
The electromagnetic field absorption, reflection and transmission conditions of the conductive back adhesive sample are measured to evaluate the electromagnetic interference inhibition effect and the external electromagnetic field shielding effect of the conductive back adhesive, and the response characteristics of the conductive back adhesive under different frequencies can be known by measuring the electromagnetic wave absorption, reflection and transmission conditions of the sample, so that the electromagnetic interference inhibition capability and the electromagnetic field shielding effect of the conductive back adhesive are evaluated, and an important basis is provided for the accurate evaluation of the performance of the conductive back adhesive.
The method comprises the steps of monitoring an electromagnetic shielding chamber in real time when a conductive adhesive-backed sample to be tested is subjected to performance test, marking a non-standard sample detected during normal operation of the electromagnetic shielding chamber, a standard sample and a sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, a non-qualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
The process of monitoring the electromagnetic shielding chamber in real time when the performance of the conductive adhesive-backed sample to be tested is as follows: the method comprises the steps of obtaining electromagnetic shielding efficiency information and electromagnetic field distribution information when a conductive adhesive-backed sample to be tested is subjected to performance test through an electromagnetic shielding chamber, comparing the electromagnetic shielding efficiency information with expected electromagnetic shielding efficiency after obtaining the electromagnetic shielding efficiency information and the electromagnetic shielding efficiency, generating expected deviation of the electromagnetic shielding efficiency, and processing the electromagnetic field distribution information to generate an electromagnetic field distribution discrete index.
The higher the electromagnetic shielding efficiency, i.e., the effect of the electromagnetic shielding chamber in suppressing external electromagnetic interference, generally in decibels, the stronger the electromagnetic shielding capability of the shielding chamber. The electromagnetic field distribution information refers to the intensity and distribution of the electromagnetic field measured in the electromagnetic shielding chamber. Through the electromagnetic field distribution information, the electromagnetic wave absorption, reflection and transmission conditions of the conductive adhesive backed at different positions and different frequencies can be known, so that the electromagnetic interference suppression effect and the external electromagnetic field shielding effect of the conductive adhesive backed are evaluated.
The existence of a deviation between the electromagnetic shielding efficiency of the electromagnetic shielding chamber and the expected electromagnetic shielding efficiency may lead to inaccurate detection results of the conductive adhesive back performance, for the following reasons:
First, even though the design and construction of the electromagnetic shielding chamber are performed according to certain standards and expectations, the actual electromagnetic shielding efficiency of the electromagnetic shielding chamber may be different from the expected value due to various factors, such as material characteristics, construction process, equipment aging, etc. This difference may gradually accumulate during long-term use, resulting in an increasing deviation between the electromagnetic shielding efficiency and the expected value, thereby affecting the accuracy of the detection of the conductive adhesive back property. Second, since there is a deviation between the electromagnetic shielding efficiency and the expected value, the detected electromagnetic interference suppression effect and the shielding effect of the external electromagnetic field may not be the same as the actual situation when the conductive adhesive back performance is detected in the electromagnetic shielding chamber. Such deviation can introduce data distortion, so that the detection result is inaccurate, and the actual performance of the conductive adhesive back in an electromagnetic environment cannot be truly reflected. Finally, conductive backsize is commonly used for shielding and protecting electronic equipment, and performance detection results directly influence design, production and application of the electronic equipment. If the electromagnetic shielding efficiency of the electromagnetic shielding chamber is greatly deviated from the expected value, the detection result is inaccurate, and wrong decision and application can be caused, so that the risk of the electronic equipment in an electromagnetic environment is increased, and even the normal operation of the equipment can be influenced.
Therefore, ensuring that the electromagnetic shielding efficiency of the electromagnetic shielding chamber is as close as possible to the expected value is one of important measures for ensuring the accuracy of the detection result of the conductive adhesive-backed property, so that the electromagnetic shielding efficiency of the electromagnetic shielding chamber and the expected electromagnetic shielding efficiency are monitored in real time, and the problem of deviation between the electromagnetic shielding efficiency of the electromagnetic shielding chamber and the expected electromagnetic shielding efficiency can be found in time.
The logic for the expected deviation of electromagnetic shielding effectiveness is as follows:
setting an initial adaptive filtering weight vector And an initial estimated electromagnetic shielding effectiveness；
In a window with fixed duration, recording real-time input power and real-time output power in the electromagnetic shielding chamber, and respectively using functions of the real-time input power and the real-time output power in the electromagnetic shielding chamber according to time sequencesAndRepresenting;
Constructing input vectors Here, the number of the first and second electrodes, in this case,For a system comprising real-time input powerElemental and real-time output powerVectors of elements, namely:；
Calculating an estimated value of electromagnetic shielding efficiency at time t Adaptive filtering weight vector according to time tAnd the input vector at time tIs calculated as an estimate of the inner product:；
According to the prediction error formula: in which, in the process, The prediction error is represented by a prediction error,Representing expected electromagnetic shielding efficiency, updating adaptive filtering weight vectors using recursive least squaresThe formula according to is: in which, in the process, In the form of a covariance matrix,In order to forget the factor,；
Using estimated electromagnetic shielding effectivenessAnd expected electromagnetic shielding efficiencyCalculating an expected deviation in electromagnetic shielding efficiencyThe formula according to is:， Representing a time period within a window of fixed duration, I.e.And (3) withThe difference value is the duration of the fixed duration window.
According to the calculation expression of the expected deviation of the electromagnetic shielding efficiency, the larger the performance value of the expected deviation of the electromagnetic shielding efficiency generated in a fixed time window by performing performance test on the conductive adhesive back sample to be tested by the electromagnetic shielding chamber is, the larger the hidden danger that the conductive adhesive back performance detection result is inaccurate is indicated, and otherwise, the smaller the hidden danger that the conductive adhesive back performance detection result is inaccurate is indicated.
The non-uniform electromagnetic field distribution in the electromagnetic shielding chamber may lead to inaccurate detection results of conductive adhesive back performance, and is mainly expressed in the following aspects:
Firstly, the electromagnetic field distribution is uneven, which causes different electromagnetic interference degrees at different positions, so that when the conductive adhesive is tested at different positions in the electromagnetic shielding chamber, the external electromagnetic interference suffered by the conductive adhesive is also different. This can lead to differences in test results between different locations, such that repeatability and comparability of the results is affected, thereby reducing the accuracy of the test. Second, the non-uniform electromagnetic field distribution may result in the conductive adhesive backing being subjected to stronger electromagnetic interference in some locations and weaker electromagnetic interference in other locations. In this case, the evaluation of the conductive adhesive back performance may be excessively exaggerated or underestimated, and its performance in the actual working environment may not be truly reflected. Therefore, the test results may be distorted, affecting an accurate assessment of the conductive adhesive back properties. Finally, the non-uniform electromagnetic field distribution in the electromagnetic shielding chamber may cause different electromagnetic shielding effects at different positions, and if the influence of the non-uniform electromagnetic field distribution is not considered in evaluating the shielding effect of the conductive adhesive back on the external electromagnetic field, the evaluation of the shielding performance of the conductive adhesive back may be inaccurate.
Therefore, the electromagnetic field distribution in the electromagnetic shielding chamber is monitored in real time, and the problem that the electromagnetic field distribution in the electromagnetic shielding chamber is uneven to influence the detection accuracy of the conductive back adhesive shielding performance can be found in time.
The logic for acquiring the dispersion index of the electromagnetic field distribution is as follows:
Acquiring the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back adhesive shielding performance detection at the same time, and using the actual electromagnetic field intensity The method is represented by x, wherein x is the number of the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back glue shielding performance detection at the same time, and x=1, 2,3, 4, … …, p and p are positive integers;
The distributed sensor network is deployed in the electromagnetic shielding chamber, the electromagnetic field intensity at different positions is monitored in real time by using sensors, and the sensors can acquire data and transmit the data to a central control system or a data acquisition device, so that the real-time monitoring and analysis of electromagnetic field distribution are realized;
Second, the sensors should be installed uniformly, which can improve the accuracy of electromagnetic field strength measurement.
For obtaining the actual electromagnetic field strength by the same momentCalculating the standard deviation of the electromagnetic field intensity at the moment, and calibrating the standard deviation of the electromagnetic field intensity as；
Acquiring standard deviations of electromagnetic field intensity of an electromagnetic shielding chamber for conducting back adhesive shielding performance detection at different moments in a fixed duration window, and recalibrating the standard deviations of electromagnetic field intensity into the standard deviations according to time sequence；
Standard deviation of electromagnetic field intensity to be obtained in fixed time windowCollecting and measuring the standard deviation of the collected electromagnetic field intensityEstablishing a data set, and calibrating the data set as F, thenWherein k represents the number of standard deviation of electromagnetic field intensity in the data set, k=1, 2, 3, 4, … …, m being a positive integer;
The standard deviation of the electromagnetic field intensity in the data set is sequenced in sequence, and then the maximum value of the standard deviation of the electromagnetic field intensity is screened out, and the maximum value of the standard deviation of the electromagnetic field intensity is calibrated as By the maximum value of the standard deviation of the electromagnetic field intensityCalculating an electromagnetic field distribution dispersion index, wherein the calculated expression is: in which, in the process, Representing the electromagnetic field distribution dispersion index.
According to the calculation expression of the electromagnetic field distribution discrete index, the larger the electromagnetic shielding chamber is used for carrying out performance test on the conductive adhesive back sample to be tested, the larger the expression value of the electromagnetic field distribution discrete index generated in the fixed time window is, the larger the hidden danger that the conductive adhesive back performance detection result is inaccurate is indicated, and otherwise, the smaller the hidden danger that the conductive adhesive back performance detection result is inaccurate is indicated.
The expected deviation of the electromagnetic shielding efficiency generated in a fixed time window when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested is obtainedAnd an electromagnetic field distribution dispersion indexThen, comprehensively analyzing the two by adopting a weighted summation mode to generate the hidden fault occurrence probability coefficientAnd evaluating the hidden danger of the accuracy of the conductive adhesive-backed sample performance test of the electromagnetic shielding chamber through the hidden fault occurrence probability coefficient.
The specific implementation of the weighted sum is not particularly limited herein, and the expected deviation of the electromagnetic shielding efficiency can be realizedAnd an electromagnetic field distribution dispersion indexThe weighting summation mode of comprehensive analysis can be carried out, and in order to realize the technical scheme of the invention, the invention provides a specific implementation mode;
Probability coefficient of occurrence of invisible fault The generated calculation formula is as follows: in which, in the process, 、Respectively, the expected deviation of electromagnetic shielding efficiencyAnd an electromagnetic field distribution dispersion indexIs a preset proportionality coefficient of (1), and、Are all greater than 0.
According to a calculation formula, the larger the expression value of the expected deviation of the electromagnetic shielding efficiency generated in the fixed duration window by the performance test of the conductive back adhesive sample to be tested by the electromagnetic shielding chamber is, the larger the expression value of the electromagnetic field distribution dispersion index is, namely the invisible fault occurrence probability coefficient generated in the fixed duration window by the performance test of the conductive back adhesive sample to be tested by the electromagnetic shielding chamber isThe larger the expression value of the conductive adhesive back performance detection result is, the larger the hidden danger that the conductive adhesive back performance detection result is inaccurate is, and the smaller the hidden danger that the conductive adhesive back performance detection result is inaccurate is otherwise indicated.
The electromagnetic shielding chamber is used for carrying out performance test on the conductive back adhesive sample to be tested, the occurrence probability coefficient of the invisible faults generated in the fixed time window is compared with a preset reference threshold value of the occurrence probability coefficient of the invisible faults, the detection condition of the product is determined, and the comparison and analysis result is as follows:
If the probability coefficient of occurrence of the invisible faults is larger than or equal to the reference threshold value of the probability coefficient of occurrence of the invisible faults, the electromagnetic shielding chamber is used for performing performance test on the conductive back adhesive sample, so that the hidden faults exist, the hidden danger of abnormal testing accuracy appears is large, the corresponding detected conductive back adhesive sample is marked as a sample to be determined, and the sample to be determined is screened out;
If the probability coefficient of occurrence of the invisible faults is smaller than the reference threshold value of the probability coefficient of occurrence of the invisible faults, the electromagnetic shielding chamber is indicated to normally operate, the conductive back adhesive sample can be subjected to efficient and accurate test for the existence of the invisible faults, the corresponding detected unqualified samples and standard-reaching samples are respectively marked as qualified samples, unqualified samples and samples to be determined, the unqualified samples are screened out, and the samples to be determined are detected again.
When a sample to be determined exists in the detection process of the electromagnetic shielding chamber, carrying out hidden fault type analysis on the electromagnetic shielding chamber, determining whether the hidden fault type is accidental abnormality, if so, carrying out repeated detection on the sample to be determined, if not, stopping continuous detection on the conductive adhesive-backed sample, and closing the electromagnetic shielding chamber for hidden fault investigation;
When a sample to be determined exists in the electromagnetic shielding chamber detection process, namely when the invisible fault occurrence probability coefficient generated in the fixed time window by performing performance test on the conductive back adhesive sample to be tested in the electromagnetic shielding chamber is larger than or equal to the invisible fault occurrence probability coefficient reference threshold value, a data set is built by a plurality of invisible fault occurrence probability coefficients generated in the subsequent fixed time window, the invisible fault occurrence probability coefficient in the data set is compared with the invisible fault occurrence probability coefficient reference threshold value, an abnormal index is calculated after analysis, and the abnormal index is calibrated as follows 。
Abnormality indexThe calculated expression of (2) is: in which, in the process, Representing the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, B represents the number of the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, b=1, 2,3, 4, … …, M is a positive integer,And representing the hidden fault occurrence probability coefficient reference threshold.
The abnormality index is used for the purpose ofThe larger the expression value of the conductive back adhesive sample to be tested is, the more the number of times of invisible faults is generated when the electromagnetic shielding chamber performs performance test on the conductive back adhesive sample to be tested is, the larger the hidden trouble that the conductive back adhesive performance detection result is inaccurate is, otherwise, the fewer the number of times of invisible faults is generated when the electromagnetic shielding chamber performs performance test on the conductive back adhesive sample to be tested is, and the smaller the hidden trouble that the conductive back adhesive performance detection result is inaccurate is.
Comparing an abnormality index generated when the electromagnetic shielding chamber performs performance test on the conductive back adhesive sample to be tested with a preset abnormality index reference threshold value, and comparing and analyzing results as follows:
If the abnormality index is greater than or equal to the abnormality index reference threshold, generating a non-accidental signal, when the electromagnetic shielding chamber performs performance test on the conductive back adhesive sample to be tested to generate the non-accidental signal, indicating that the electromagnetic shielding chamber is not accidentally abnormal when the conductive back adhesive sample performs performance test, and stopping continuous detection on the conductive back adhesive sample and closing the electromagnetic shielding chamber for hidden fault investigation if the electromagnetic shielding chamber is abnormal with high probability;
If the abnormality index is smaller than the abnormality index reference threshold, generating an accidental signal, when the electromagnetic shielding chamber performs performance test on the conductive back adhesive sample to be tested to generate the accidental signal, indicating that the electromagnetic shielding chamber is accidentally abnormal when the conductive back adhesive sample performs performance test, repeatedly detecting the sample to be determined can ensure that the electromagnetic shielding chamber continues to perform performance test on the conductive back adhesive sample to be tested, and improving the efficiency of performance test on the conductive back adhesive sample to be tested by the electromagnetic shielding chamber.
And analyzing test data of the qualified sample, evaluating the shielding effect of the qualified conductive adhesive-backed sample, comparing the shielding effect with expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive adhesive-backed sample according to the test result.
The intelligent detection method provided by the invention can timely find the invisible faults of the electromagnetic shielding chamber in the conductive back adhesive performance test process, so that the misjudgment rate of the test result is effectively reduced, and through real-time monitoring of the electromagnetic shielding chamber, an inaccurate sample can be timely marked and re-detected under the condition of finding the invisible faults, and the accuracy of the test result is ensured, so that the risk brought by overestimation or underestimation of the actual shielding effect of the conductive back adhesive can be avoided;
According to the invention, through comprehensive analysis of the expected deviation of electromagnetic shielding efficiency and the discrete index of electromagnetic field distribution, the probability coefficient of occurrence of invisible faults is generated, the hidden danger of accuracy of the electromagnetic shielding chamber is further evaluated, the performance of the electromagnetic shielding chamber can be more comprehensively known by the comprehensive analysis mode, so that the reliability of a test result can be more accurately judged, the accuracy and the reliability of performance test of the conductive back adhesive sample by the electromagnetic shielding chamber can be effectively improved by timely finding and removing the invisible faults, the product quality is further ensured, and the competitiveness and market opportunity of enterprises are improved;
According to the method, accidental abnormality and non-accidental abnormality of the electromagnetic shielding chamber can be accurately distinguished by means of calculation and comparison analysis of the abnormality indexes, so that more targeted countermeasures are adopted, the working state of the electromagnetic shielding chamber can be thinned to a more specific degree by calculating the abnormality indexes, hidden faults which possibly exist are further identified, instead of detection results which are merely remained on the surface, the highly accurate abnormality index analysis method effectively avoids misjudgment of the normal working state of the electromagnetic shielding chamber, and meanwhile, the sensitivity to the real abnormality condition is improved, and therefore, reliability and high efficiency of performance test of a conductive back adhesive sample are guaranteed, more scientific and accurate guidance is provided for maintenance of the electromagnetic shielding chamber, stability and reliability of the whole test system are further improved, maintenance cost is saved for enterprises, and production efficiency is improved.
The invention provides an intelligent detection system for detecting conductive back adhesive performance, which is shown in fig. 2, and comprises a test purpose determining module, a test module, a real-time monitoring module, a hidden fault checking module and a qualified sample analysis and evaluation module;
The test purpose determining module is used for determining the test purpose of the conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the test purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
the testing module is used for placing a conductive adhesive-backed sample to be tested in the electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and testing data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using the electromagnetic field detector;
The real-time monitoring module is used for monitoring the electromagnetic shielding chamber in real time when the conductive adhesive-backed sample to be tested is subjected to performance test, marking the unqualified sample detected during normal operation of the electromagnetic shielding chamber, the unqualified sample and the sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, an unqualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
The hidden fault checking module is used for analyzing the type of the hidden fault of the electromagnetic shielding chamber when the sample to be determined exists in the detection process of the electromagnetic shielding chamber, determining whether the type of the hidden fault is accidental abnormality, repeatedly detecting the sample to be determined if the type of the hidden fault is accidental abnormality, stopping continuously detecting the conductive adhesive-backed sample if the type of the hidden fault is not accidental abnormality, and closing the electromagnetic shielding chamber for hidden fault checking;
The qualified sample analysis and evaluation module is used for analyzing the test data of the qualified sample, evaluating the shielding effect of the qualified conductive back adhesive sample, comparing the shielding effect with the expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive back adhesive sample according to the test result;
the embodiment of the invention provides an intelligent detection method for detecting conductive back glue performance, which is realized by the intelligent detection system for detecting conductive back glue performance, and a specific method and a flow of the intelligent detection system for detecting conductive back glue performance are detailed in the embodiment of the intelligent detection method for detecting conductive back glue performance, and are not repeated herein.
The above formulas are all formulas with dimensions removed and numerical values calculated, the formulas are formulas with a large amount of data collected for software simulation to obtain the latest real situation, and preset parameters in the formulas are set by those skilled in the art according to the actual situation.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (5)
1. An intelligent detection method for detecting the performance of conductive back adhesive is characterized by comprising the following steps:
Determining the testing purpose of a conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the testing purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
Placing a conductive adhesive-backed sample to be tested in an electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and test data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using an electromagnetic field detector;
The method comprises the steps of monitoring an electromagnetic shielding chamber in real time when a conductive adhesive-backed sample to be tested is subjected to performance test, marking a non-standard sample detected during normal operation of the electromagnetic shielding chamber, a standard sample and a sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, a non-qualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
Acquiring electromagnetic shielding efficiency information and electromagnetic field distribution information when a conductive adhesive-backed sample to be tested performs performance test through an electromagnetic shielding chamber, comparing the electromagnetic shielding efficiency information with expected electromagnetic shielding efficiency after the electromagnetic shielding efficiency information and the expected electromagnetic shielding efficiency are acquired, generating expected deviation of the electromagnetic shielding efficiency, and generating an electromagnetic field distribution discrete index after the electromagnetic field distribution information is processed;
the logic for the expected deviation of electromagnetic shielding effectiveness is as follows:
setting an initial adaptive filtering weight vector And an initial estimated electromagnetic shielding effectiveness；
In a window with fixed duration, recording real-time input power and real-time output power in the electromagnetic shielding chamber, and respectively using functions of the real-time input power and the real-time output power in the electromagnetic shielding chamber according to time sequencesAndRepresenting;
Constructing input vectors Here, the number of the first and second electrodes, in this case,For a system comprising real-time input powerElemental and real-time output powerVectors of elements, namely:；
Calculating an estimated value of electromagnetic shielding efficiency at time t Adaptive filtering weight vector according to time tAnd the input vector at time tIs calculated as an estimate of the inner product:；
According to the prediction error formula: in which, in the process, The prediction error is represented by a prediction error,Representing expected electromagnetic shielding efficiency, updating adaptive filtering weight vectors using recursive least squaresThe formula according to is: in which, in the process, In the form of a covariance matrix,In order to forget the factor,；
Using estimated electromagnetic shielding effectivenessAnd expected electromagnetic shielding efficiencyCalculating an expected deviation in electromagnetic shielding efficiencyThe formula according to is:， Representing a time period within a window of fixed duration, I.e.And (3) withThe difference value is the duration of the fixed duration window;
the logic for acquiring the dispersion index of the electromagnetic field distribution is as follows:
Acquiring the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back adhesive shielding performance detection at the same time, and using the actual electromagnetic field intensity The method is represented by x, wherein x is the number of the actual electromagnetic field intensity of different positions inside the electromagnetic shielding chamber for conducting back glue shielding performance detection at the same time, and x=1, 2,3, 4, … …, p and p are positive integers;
for obtaining the actual electromagnetic field strength by the same moment Calculating the standard deviation of the electromagnetic field intensity at the moment, and calibrating the standard deviation of the electromagnetic field intensity as；
Acquiring standard deviations of electromagnetic field intensity of an electromagnetic shielding chamber for conducting back adhesive shielding performance detection at different moments in a fixed duration window, and recalibrating the standard deviations of electromagnetic field intensity into the standard deviations according to time sequence；
Standard deviation of electromagnetic field intensity to be obtained in fixed time windowCollecting and measuring the standard deviation of the collected electromagnetic field intensityEstablishing a data set, and calibrating the data set as F, thenWherein k represents the number of standard deviation of electromagnetic field intensity in the data set, k=1, 2, 3, 4, … …, m being a positive integer;
The standard deviation of the electromagnetic field intensity in the data set is sequenced in sequence, and then the maximum value of the standard deviation of the electromagnetic field intensity is screened out, and the maximum value of the standard deviation of the electromagnetic field intensity is calibrated as By the maximum value of the standard deviation of the electromagnetic field intensityCalculating an electromagnetic field distribution dispersion index, wherein the calculated expression is: in which, in the process, Representing an electromagnetic field distribution dispersion index;
the expected deviation of the electromagnetic shielding efficiency generated in a fixed time window when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested is obtained And an electromagnetic field distribution dispersion indexThen, comprehensively analyzing the two by adopting a weighted summation mode to generate the hidden fault occurrence probability coefficientEvaluating potential accuracy hazards when conducting back adhesive sample performance test is conducted on the electromagnetic shielding chamber through the hidden fault occurrence probability coefficient;
When a sample to be determined exists in the detection process of the electromagnetic shielding chamber, carrying out hidden fault type analysis on the electromagnetic shielding chamber, determining whether the hidden fault type is accidental abnormality, if so, carrying out repeated detection on the sample to be determined, if not, stopping continuous detection on the conductive adhesive-backed sample, and closing the electromagnetic shielding chamber for hidden fault investigation;
And analyzing test data of the qualified sample, evaluating the shielding effect of the qualified conductive adhesive-backed sample, comparing the shielding effect with expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive adhesive-backed sample according to the test result.
2. The intelligent detection method for detecting the performance of the conductive adhesive back according to claim 1, wherein the performance test of the electromagnetic shielding chamber on the conductive adhesive back sample to be tested is performed, the generated invisible fault occurrence probability coefficient in a fixed time window is compared with a preset invisible fault occurrence probability coefficient reference threshold value, the detection condition of the product is determined, and the comparison analysis result is as follows:
If the occurrence probability coefficient of the invisible faults is larger than or equal to the reference threshold value of the occurrence probability coefficient of the invisible faults, the electromagnetic shielding chamber is used for performing performance test on the conductive back adhesive sample, if the invisible faults exist, the corresponding detected conductive back adhesive sample is marked as a sample to be determined, and the sample to be determined is screened out;
If the probability coefficient of occurrence of the invisible faults is smaller than the reference threshold value of the probability coefficient of occurrence of the invisible faults, the electromagnetic shielding chamber is indicated to normally operate, the corresponding detected unqualified samples and standard samples are marked as qualified samples, unqualified samples and samples to be determined respectively, and the unqualified samples are screened out.
3. The intelligent detection method for detecting the performance of the conductive adhesive according to claim 1, wherein when a sample to be determined exists in the detection process of the electromagnetic shielding chamber, namely when the performance test of the conductive adhesive sample to be tested is performed on the electromagnetic shielding chamber, the probability coefficient of occurrence of the invisible fault generated in a fixed time window is larger than or equal to the reference threshold value of the probability coefficient of occurrence of the invisible fault, a plurality of probability coefficients of occurrence of the invisible fault generated in a subsequent fixed time window are built into a data set, the probability coefficient of occurrence of the invisible fault in the data set is compared with the reference threshold value of the probability coefficient of occurrence of the invisible fault, and an abnormality index is calculated after the comparison and analysis, and the abnormality index is calibrated as follows；
Abnormality indexThe calculated expression of (2) is: in which, in the process, Representing the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, B represents the number of the probability coefficient of occurrence of the invisible fault in the data set greater than the reference threshold value of the probability coefficient of occurrence of the invisible fault, b=1, 2,3, 4, … …, M is a positive integer,And representing the hidden fault occurrence probability coefficient reference threshold.
4. The intelligent detection method for detecting the performance of the conductive adhesive according to claim 3, wherein an abnormality index generated when the electromagnetic shielding chamber performs the performance test on the conductive adhesive sample to be tested is compared with a preset abnormality index reference threshold value, and the comparison analysis results are as follows:
If the abnormality index is greater than or equal to the abnormality index reference threshold, generating a non-accidental signal, stopping continuously detecting the conductive adhesive back sample when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested to generate the non-accidental signal, and closing the electromagnetic shielding chamber for hidden fault investigation;
If the abnormality index is smaller than the abnormality index reference threshold, generating an accidental signal, and repeatedly detecting the sample to be determined when the electromagnetic shielding chamber performs performance test on the conductive adhesive back sample to be tested to generate the accidental signal, so that the efficiency of the electromagnetic shielding chamber in performance test on the conductive adhesive back sample to be tested is improved.
5. An intelligent detection system for detecting conductive back glue performance, which is used for realizing the intelligent detection method for detecting conductive back glue performance according to any one of the claims 1-4, and is characterized by comprising a test purpose determining module, a test module, a real-time monitoring module, a hidden fault checking module and a qualified sample analysis and evaluation module;
The test purpose determining module is used for determining the test purpose of the conductive back adhesive sample to be tested, and determining the electromagnetic frequency range and the electromagnetic intensity level of the test according to the test purpose of the conductive back adhesive sample to be tested so as to simulate the actual electromagnetic interference condition;
the testing module is used for placing a conductive adhesive-backed sample to be tested in the electromagnetic shielding chamber for testing, gradually increasing the electromagnetic field intensity in a set frequency range, recording the electromagnetic field intensity and testing data under each frequency, and measuring the electromagnetic field absorption, reflection and transmission conditions of the conductive adhesive-backed sample by using the electromagnetic field detector;
The real-time monitoring module is used for monitoring the electromagnetic shielding chamber in real time when the conductive adhesive-backed sample to be tested is subjected to performance test, marking the unqualified sample detected during normal operation of the electromagnetic shielding chamber, the unqualified sample and the sample detected during invisible fault operation of the electromagnetic shielding chamber as a qualified sample, an unqualified sample and a sample to be determined respectively, and detecting the sample to be determined again;
The hidden fault checking module is used for analyzing the type of the hidden fault of the electromagnetic shielding chamber when the sample to be determined exists in the detection process of the electromagnetic shielding chamber, determining whether the type of the hidden fault is accidental abnormality, repeatedly detecting the sample to be determined if the type of the hidden fault is accidental abnormality, stopping continuously detecting the conductive adhesive-backed sample if the type of the hidden fault is not accidental abnormality, and closing the electromagnetic shielding chamber for hidden fault checking;
the qualified sample analysis and evaluation module is used for analyzing the test data of the qualified sample, evaluating the shielding effect of the qualified conductive back adhesive sample, comparing the shielding effect with the expected performance, and evaluating the electromagnetic interference suppression effect and the shielding effect on an external electromagnetic field of the qualified conductive back adhesive sample according to the test result.
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