CN118032797A - Chip pin measuring method and device based on self-adaptive measuring rectangular frame - Google Patents

Abstract

The invention discloses a chip pin method and device based on a self-adaptive measurement rectangular frame, wherein the method comprises the following steps: acquiring a picture of a chip to be measured; determining a first interest area based on the acquired picture of the chip to be measured, and solving the minimum circumscribed rectangle of the first interest area; calculating four corner points of the minimum circumscribed rectangle, and sequencing the four corner points in sequence, wherein pins on any peripheral side of the first interest area correspond to two corner points in the sequenced four corner points respectively; selecting all target pins on any peripheral side of the first interest region, and drawing an adaptive measurement rectangular frame of the target pins based on the positions of two corner points corresponding to the target pins and the reference parameter values of the target pins; determining a second interest area based on the self-adaptive measurement rectangular frame, and solving the edge of the pin in the second interest area; based on the edge of the pin, data of the target pin is obtained. The measuring difficulty can be reduced, the calculated amount is reduced, and the reliability and stability of the measuring result are improved.

Description

Chip pin measuring method and device based on self-adaptive measuring rectangular frame

Technical Field

The invention relates to the technical field of chip detection, in particular to a chip pin measuring method and device based on a self-adaptive measuring rectangular frame.

Background

After the packaging process, the chip is required to be subjected to electrical performance test and chip appearance test, especially a chip packaged by adopting a square flat package (QFP) technology, the distance between pins of the chip packaged by the technology is small, the pins are very thin, and the pin number is generally more than 100. In the past, a great deal of manpower is required to measure the pins of the QFP chip, the manpower cost is high, the precision and the accuracy of detection data cannot be guaranteed, along with the development of industrial technology, the technology for measuring the pins of the QFP chip by utilizing an image processing mode is gradually applied, but the technology needs to be fitted for many times, the calculated amount is large, and the calculation is complicated.

Disclosure of Invention

The technical problem to be solved by the embodiment of the invention is to provide the chip pin measuring method and device based on the self-adaptive measuring rectangular frame, which can reduce the measuring difficulty, reduce the calculated amount and improve the reliability and stability of the measuring result.

In order to solve the technical problems, the invention provides a chip pin measuring method based on a self-adaptive measuring rectangular frame, which comprises the following steps:

Acquiring a picture of a chip to be measured, wherein the chip to be measured comprises a chip main body and pins on the periphery of the chip main body;

determining a first interest area based on an acquired picture of a chip to be measured, and solving a minimum circumscribed rectangle of the first interest area;

Calculating four corner points of the minimum circumscribed rectangle, and sequentially sequencing the four corner points, wherein pins on any peripheral side of the first interest area correspond to two corner points in the four corner points after sequencing respectively;

Selecting all target pins on any one peripheral side of a first interest region, and drawing an adaptive measurement rectangular frame of the target pins based on the positions of two corner points corresponding to the target pins and reference parameter values of the target pins;

determining a second interest area based on the self-adaptive measurement rectangular frame, and solving the edge of a pin in the second interest area;

and acquiring data of the target pin based on the pin edge.

In one possible implementation manner, the step of drawing the adaptive measurement rectangular frame of the detection area based on the positions of the two corner points corresponding to the target pin and the reference parameter value of the target pin includes:

Taking two corner points corresponding to the target pin as references, and respectively translating a certain offset along the first direction by the two corner points to obtain two first offset points;

Taking a connecting line with the two first offset points as endpoints as a central line of the self-adaptive measurement rectangular frame;

Taking a preset first threshold value as the width of the self-adaptive measurement rectangular frame;

and drawing the self-adaptive measurement rectangular frame according to the midline and the width.

In one possible implementation manner, the first direction is from the two corner points to two other corner points of the minimum bounding rectangle along two sides of the minimum bounding rectangle passing through the two corner points respectively and being parallel to each other.

In one possible implementation, the offset is half the reference length L of the target pin.

In a possible implementation, the preset first threshold is less than half the reference length L of the target pin.

In one possible implementation manner, after the capturing the picture of the chip to be measured, the method includes:

Converting the acquired picture of the chip to be measured into a gray scale;

reading a reference parameter value of the pin, wherein the reference parameter value comprises a reference width W of the pin, a reference length L of the pin and a distance P between adjacent pins;

And carrying out threshold segmentation on the gray level map, and filling the non-connected region in the gray level map to obtain the first region of interest.

In a possible implementation, the step of sequentially ordering the four corner points includes:

Based on the four corner points of the minimum circumscribed rectangle, according to a judgment formula A (X) < C (X), A (Y) < C (Y), the four corner points are ordered clockwise and marked as an A corner point, a B corner point, a C corner point and a D corner point.

In a possible implementation manner, the step of determining a second interest area based on the adaptive measurement rectangular box and solving for a pin edge in the second interest area includes:

intercepting the self-adaptive measurement rectangular frame and a pin part in the self-adaptive measurement rectangular frame, and obtaining the second region of interest by bilinear interpolation amplification;

solving the intersection point of the self-adaptive measurement rectangular frame and the pin part;

and connecting corresponding intersection points by adopting an extremum method to obtain the pin edge.

In a possible implementation manner, the step of acquiring the data of the target pin based on the pin edge includes:

traversing the pin edges in the second interest area, forming a pair of edge pairs by every two adjacent pin edges, and calculating the distance between two edges in the edge pairs and the distance between the adjacent edge pairs;

Judging whether the distance between two edges in the pair exceeds a preset reference value W+/-2/3P, if so, discarding the pair of edges, and setting the distance between the two edges in the pair of edges to be zero;

And storing data, wherein the interval between two edges of the edge pairs is recorded as the width of the pins, and the interval between the adjacent edge pairs is recorded as the interval between every two adjacent pins.

In a second aspect of the present application, there is provided a chip pin measurement device based on an adaptive measurement rectangular frame, including:

the acquisition module is used for acquiring pictures of a chip to be measured, and the chip to be measured comprises a chip main body and pins on the periphery of the chip main body;

The first processing module is used for determining a first interest area based on the acquired picture of the chip to be measured and solving the minimum circumscribed rectangle of the first interest area;

The calculation module is used for calculating four corner points of the minimum circumscribed rectangle and sequencing the four corner points in sequence, and pins on any one peripheral side of the first interest area correspond to two corner points in the four corner points after sequencing respectively;

The self-adaptive measurement rectangular frame forming module is used for selecting a target pin and drawing the self-adaptive measurement rectangular frame of the target pin based on the positions of two corner points corresponding to the target pin and the reference parameter value of the target pin;

The second processing module is used for determining a second interest area based on the self-adaptive measurement rectangular frame and solving the edge of a pin in the second interest area;

And the determining module is used for acquiring the data of the target pin based on the edge of the pin.

The implementation of the invention has the following beneficial effects:

The application provides a chip pin method and device based on a self-adaptive measurement rectangular frame, which are characterized in that the acquired picture of a chip to be measured is subjected to correlation processing, the minimum circumscribed rectangle of a first interest area is determined and solved, and four corner points of the minimum circumscribed rectangle are calculated and sequenced, so that pins on any one peripheral side of the first interest area correspond to the corresponding two corner points respectively, a target pin and the corresponding two corner points can be quickly found during calculation, the self-adaptive measurement rectangular frame is drawn based on the corresponding two corner points and reference parameter values of the target pin, the edge of the pin is obtained based on the self-adaptive measurement rectangular frame, the related data of the target pin is acquired, the pin of the chip can be measured through the self-adaptive measurement rectangular frame, the rotation of the chip to be measured is adapted while the measurement precision is ensured, the data fitting is reduced, the calculation amount is reduced, and the reliability and the stability of a measurement result are improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application and do not constitute a undue limitation on the application.

FIG. 1 is a schematic flow chart of a chip pin method based on an adaptive measurement rectangular frame according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of respectively corresponding pins on any one peripheral side of the first region of interest to two corner points of the four corner points after sorting according to an embodiment of the present invention;

FIGS. 3, 6, 7, 8 are flow diagrams of specific implementation of one of the steps in FIG. 1, respectively;

FIG. 4 is a schematic drawing of a midline of an adaptively measured rectangular box in accordance with one embodiment of the present invention;

FIG. 5 is a schematic diagram of an adaptive measurement rectangular box drawn according to an embodiment of the present invention;

fig. 9 is a schematic block diagram of a chip pin device based on an adaptive measurement rectangular frame according to the present invention.

Reference numerals: 1-first peripheral side pins, 2-second peripheral side pins, 3-third peripheral side pins, 4-fourth peripheral side pins.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the foregoing figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the disclosure described herein may be capable of operation in sequences other than those illustrated or described herein. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a flowchart of a chip pin measurement method based on an adaptive measurement rectangular frame according to an embodiment of the present application is provided, and method steps defined by a flow related to the chip pin measurement method may be implemented by an electronic device having an image processing, analyzing and processing function. The specific flow shown in fig. 1 will be described in detail.

S101, obtaining a picture of a chip to be measured, wherein the chip to be measured comprises a chip main body and pins on the periphery of the chip main body.

S102, determining a first region of interest based on the acquired picture of the chip to be measured, and solving the minimum circumscribed rectangle of the first region of interest.

S103, calculating four corner points of the minimum circumscribed rectangle, and sequencing the four corner points in sequence, wherein pins on any peripheral side of the first interest area correspond to two corner points in the sequenced four corner points respectively.

S104, selecting all target pins on any peripheral side of the first region of interest, and drawing an adaptive measurement rectangular frame of the target pins based on the positions of two corner points corresponding to the target pins and the reference parameter values of the target pins.

S105, determining a second interest area based on the self-adaptive measurement rectangular frame, and solving the edge of the pin in the second interest area.

S106, acquiring data of the target pins based on the edges of the pins.

In this embodiment, an image of the chip to be measured may be acquired by using the image acquisition device. The image capturing device may include a CMOS industrial area camera, and in addition, in order to improve the effect of capturing the obtained image, the image capturing device may further include devices such as a three-color spherical light source, a camera stand, and the like. The chip to be measured may be any one chip or any plurality of chips constituting an integrated circuit. The chip to be measured includes a chip body and a plurality of pins, wherein each peripheral side of the chip body may be connected with a plurality of pins, for example, a left side, a right side, an upper side and a lower side, or may be connected with a plurality of pins only on the left side and the right side of the chip body, respectively. The obtained orientation of the chip to be measured may be correct or not correct, in this embodiment, rotation processing is not required to be performed on the chip to be measured, as long as the first region of interest is determined according to the picture of the chip to be measured, where the first region of interest only includes information of pins on the periphery of the chip main body and the chip main body, no background area in the picture of the chip to be measured is available, the outer edge of the first region of interest can be fitted by a minimum circumscribed rectangle fitting method, the minimum circumscribed rectangle of the first region of interest is solved, four corners of the minimum circumscribed rectangle are calculated and sequenced in sequence, in order to respectively correspond pins on any periphery of the first region of interest to two of the sequenced four corners, as shown in fig. 2, then A, B, C and D four corners are respectively obtained, where the a corner and B correspond to the pins 1 on the fourth periphery, the B corner and the C corner correspond to the pins 2 on the second periphery, the C corner and the D corner correspond to the pins 3 on the fourth periphery, the a corner and the D corner correspond to the pins 4 on the fourth periphery, when the fourth corner 4 is selected as the target, the four corners 4 can be drawn according to the measured value of the four corners and the peripheral frame, and the peripheral frame size of the four corners 4 can be adapted to the measured value and the peripheral frame size.

In one possible implementation, as shown in fig. 3, the step of drawing the adaptive measurement rectangular frame of the detection area based on the positions of the two corner points corresponding to the target pin and the reference parameter value of the target pin includes:

s301, taking two corner points corresponding to a target pin as references, and respectively translating a certain offset by the two corner points along a first direction to obtain two first offset points.

And S303, taking a connecting line taking the two first offset points as endpoints as a central line of the self-adaptive measurement rectangular frame.

S305, taking a preset first threshold value as the width of the self-adaptive measurement rectangular frame.

S307, drawing an adaptive measurement rectangular frame according to the center line and the width.

In one possible implementation, the first direction is from two corner points to two other corner points of the smallest bounding rectangle along two sides passing through the two corner points respectively and being parallel to each other. Taking the fourth peripheral side pin 4 as a target pin as an example, translating the a corner along the AB side of the first circumscribed rectangle by a certain offset, translating the D corner along the DC side of the first circumscribed rectangle by a certain offset, wherein the direction from the a corner along the AB side to the B corner and the direction from the D corner along the DC side to the C corner is the first direction, respectively obtaining an a 'offset point and a D' offset point, taking the connection line of the a 'offset point and the D' offset point as the central line of the self-adaptive measurement rectangular frame of the fourth peripheral side pin 4, taking the preset first threshold as the width of the self-adaptive measurement rectangular frame, and drawing the self-adaptive measurement rectangular frame according to the central line and the width, as shown in fig. 5. Similarly, when the first peripheral pin 1 is taken as a target pin, the corner A and the corner B translate by a certain offset amount along the AD side and the BC side to the corner D and the corner C respectively, wherein the corner A points to the corner D along the AD side and the corner B points to the corner C along the BC side as the first directions. Likewise, the specific steps of targeting the second peripheral side pin 2 and targeting the third peripheral side pin 3 are not repeated. In a possible implementation manner, the offset is half of the reference length L of the target pin, so that the center line of the adaptive measurement rectangular frame is located in the middle of the target pin as much as possible, and accuracy of actually detected data of the target pin is improved. In one possible implementation manner, the preset first threshold value is smaller than half of the reference length L of the target pin, and similarly, the adaptive measurement rectangular frame can be located at the middle position of the target pin as much as possible, so that accuracy of actually detected data of the target pin is improved, operation memory can be reduced, and calculation speed is increased.

In one possible implementation, as shown in fig. 6, after acquiring a picture of the chip to be measured (i.e. S601), the method includes:

s603, converting the acquired picture of the chip to be measured into a gray scale.

S605, reading reference parameter values of the pins, wherein the reference parameter values comprise reference width W of the pins, reference length L of the pins and interval P between adjacent pins.

S607, carrying out threshold segmentation on the gray level diagram, and filling the non-connected region in the gray level diagram to obtain a first interest region.

In this embodiment, the obtained image of the chip to be measured includes the information of the chip main body and the pins on the peripheral side of the chip main body, and the information of the background area in the image of the chip to be measured, the gray scale image includes the information of the chip main body, the pins on the peripheral side of the chip main body, and the information of the background area in the image of the chip to be measured, after the image is subjected to gray scale conversion, the reference parameter values of the pins are read and stored, when the reference parameter values of the pins are needed, the gray scale image can be called, the threshold segmentation can be performed on the gray scale image, and the threshold segmentation of the gray scale image can be realized by adopting the Otsu image segmentation method. For the threshold segmentation processing of the gray scale image, a threshold may be set, a pixel value of a pixel having a gray scale value greater than the threshold in the gray scale image may be set to 255, or else, a pixel value of the pixel may be set to 0. The foreground of the gray level map can be extracted from the background through threshold segmentation processing, and the non-connected region is refilled to obtain the first region of interest.

In one possible implementation, the step of sequentially ordering the four corner points includes:

Based on four corners of the minimum circumscribed rectangle, according to a judgment formula A (X) < C (X), A (Y) < C (Y), the four corners are ordered clockwise and marked as an A corner, a B corner, a C corner and a D corner. The four corner points are ordered, so that when target pins on any peripheral side of the chip main body need to be detected, corresponding corner points can be selected rapidly, and offset is carried out based on the corner points, so that a self-adaptive measurement rectangular frame of the corresponding target pins is drawn, and the detection speed of the pins can be improved.

In one possible implementation, as shown in fig. 7, the step of determining the second region of interest based on the adaptive measurement rectangular box and finding the edge of the pin in the second region of interest includes:

S701, intercepting the self-adaptive measurement rectangular frame and a pin part in the self-adaptive measurement rectangular frame, and obtaining a second interest area by bilinear interpolation amplification.

S703, solving the intersection point of the adaptive measurement rectangular frame and the pin part.

And S705, connecting corresponding intersection points by adopting an extremum method to obtain the edge of the pin.

By adopting the bilinear interpolation method, the image quality of the second region of interest is higher, the definition is improved, the condition that the pixel value is discontinuous does not occur, and then the intersection point of the lead part and the self-adaptive measurement rectangular frame is solved.

In one possible implementation, as shown in fig. 8, the step of acquiring data of the target pin based on the edge of the pin includes:

S801, traversing the pin edges in the second interest area, forming a pair of edge pairs by every two adjacent pin edges, and calculating the distance between the two edges in the edge pairs and the distance between the adjacent edge pairs.

S803, judging whether the distance between two edges in the edge pair exceeds a preset reference value W+/-2/3P, if so, discarding the pair of edges, and setting the distance between the two edges in the pair of edges to be zero.

S805, storing data, wherein the interval between two edges in an edge pair is recorded as the width of a pin, and the interval between adjacent edge pairs is recorded as the interval between every two adjacent pins.

The traversing sequence can be from top to bottom or from bottom to top, two adjacent pin edges form a pair of edge pairs, when the distance between the two edges in the edge pairs is not within a reference value W+/-2/3P, the two edges in the edge pairs are unqualified, so that the distance between the two edges in the edge pairs is set to be zero, and when the distance between the two edges in the edge pairs is within the reference value W+/-2/3P, the two edges in the edge pairs are qualified, and finally, the data of the distance between all the edges are summarized, so that the data of the actually measured target pins are obtained.

In an embodiment of the present invention, as shown in fig. 9, there is further provided a chip pin measurement device based on an adaptive measurement rectangular frame, including:

the obtaining module 901 is configured to obtain a picture of a chip to be measured, where the chip to be measured includes a chip body and pins on a peripheral side of the chip body.

It will be appreciated that the acquisition module 901 may be adapted to perform step S101 described above, and reference may be made to the details of step S101 described above with respect to the detailed implementation of the acquisition module 901.

The first processing module 902 is configured to determine a first region of interest based on the acquired picture of the chip to be measured, and solve a minimum bounding rectangle of the first region of interest.

It will be appreciated that the first processing module 902 may be used to perform step S102 described above, and reference may be made to the details of implementation of the first processing module 902 regarding step S102 described above.

The calculating module 903 is configured to calculate four corner points of the minimum bounding rectangle and sequentially order the four corner points, where pins on any one peripheral side of the first interest area respectively correspond to two corner points of the four corner points after ordering.

It will be appreciated that the calculation module 903 may be used to perform step S103 described above, and reference may be made to the details of implementation of the calculation module 903 regarding step S103 described above.

The forming module 904 of the adaptive measurement rectangular frame is configured to select a target pin, and draw the adaptive measurement rectangular frame of the target pin based on the positions of two corner points corresponding to the target pin and the reference parameter value of the target pin.

It will be appreciated that the adaptive measurement rectangular frame forming module 904 may be used to perform step S104 described above, and reference may be made to the details of the implementation of the adaptive measurement rectangular frame forming module 904 described above with respect to step S104.

The second processing module 905 is configured to determine a second region of interest based on the adaptive measurement rectangular frame, and calculate a pin edge in the second region of interest.

It is understood that the second processing module 905 may be used to perform the step S105 described above, and reference may be made to the details of the implementation of the second processing module 905 regarding the step S105 described above.

A determining module 906, configured to obtain data of the target pin based on the edge of the pin.

It is understood that the determining module 906 may be configured to perform the step S106 described above, and reference may be made to the details of the implementation of the determining module 906 regarding the step S106 described above.

The process flow of each module in the apparatus and the interaction flow between the modules may be described with reference to the related descriptions in the above method embodiments, which are not described in detail herein.

Further, the embodiment of the application also provides a computer readable storage medium, which stores machine executable instructions, and the machine executable instructions when executed implement the chip pin measurement method provided by the embodiment. In particular, the computer readable storage medium can be a general purpose storage medium, such as a removable disk, a hard disk, etc., and the computer program on the computer readable storage medium can execute the chip pin measurement method described above when executed. With respect to the processes involved in the computer readable storage medium and when executed as executable instructions thereof, reference is made to the relevant descriptions of the method embodiments described above and will not be described in detail herein.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. The chip pin measuring method based on the self-adaptive measuring rectangular frame is characterized by comprising the following steps of:

Acquiring a picture of a chip to be measured, wherein the chip to be measured comprises a chip main body and pins on the periphery of the chip main body;

determining a first interest area based on an acquired picture of a chip to be measured, and solving a minimum circumscribed rectangle of the first interest area;

Calculating four corner points of the minimum circumscribed rectangle, and sequentially sequencing the four corner points, wherein pins on any peripheral side of the first interest area correspond to two corner points in the four corner points after sequencing respectively;

Selecting all target pins on any one peripheral side of a first interest region, and drawing an adaptive measurement rectangular frame of the target pins based on the positions of two corner points corresponding to the target pins and reference parameter values of the target pins;

determining a second interest area based on the self-adaptive measurement rectangular frame, and solving the edge of a pin in the second interest area;

and acquiring data of the target pin based on the pin edge.

2. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, wherein the step of drawing the adaptive measurement rectangular frame of the detection area based on the positions of the two corner points corresponding to the target pin and the reference parameter value of the target pin comprises:

Taking two corner points corresponding to the target pin as references, and respectively translating a certain offset along the first direction by the two corner points to obtain two first offset points;

Taking a connecting line with the two first offset points as endpoints as a central line of the self-adaptive measurement rectangular frame;

Taking a preset first threshold value as the width of the self-adaptive measurement rectangular frame;

and drawing the self-adaptive measurement rectangular frame according to the midline and the width.

3. The method for measuring chip pins based on an adaptive measurement rectangular frame according to claim 2, wherein the first direction is from the two corner points to the other two corner points of the minimum bounding rectangle along two sides of the minimum bounding rectangle passing through the two corner points respectively and being parallel to each other.

4. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 3, wherein the offset is half of a reference length L of the target pin.

5. The method for measuring chip pins based on an adaptive measurement rectangular frame according to claim 4, wherein the preset first threshold is less than half of the reference length L of the target pin.

6. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, comprising, after the obtaining of the picture of the chip to be measured:

Converting the acquired picture of the chip to be measured into a gray scale;

reading a reference parameter value of the pin, wherein the reference parameter value comprises a reference width W of the pin, a reference length L of the pin and a distance P between adjacent pins;

And carrying out threshold segmentation on the gray level map, and filling the non-connected region in the gray level map to obtain the first region of interest.

7. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, wherein the step of sequentially ordering the four corner points comprises:

Based on the four corner points of the minimum circumscribed rectangle, according to a judgment formula A (X) < C (X), A (Y) < C (Y), the four corner points are ordered clockwise and marked as an A corner point, a B corner point, a C corner point and a D corner point.

8. The method for measuring pins of a chip based on an adaptive measurement rectangular frame according to claim 1, wherein the steps of determining a second interest area based on the adaptive measurement rectangular frame and finding edges of pins in the second interest area include:

intercepting the self-adaptive measurement rectangular frame and a pin part in the self-adaptive measurement rectangular frame, and obtaining the second region of interest by bilinear interpolation amplification;

solving the intersection point of the self-adaptive measurement rectangular frame and the pin part;

and connecting corresponding intersection points by adopting an extremum method to obtain the pin edge.

9. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, wherein the step of acquiring the data of the target pin based on the pin edge comprises:

traversing the pin edges in the second interest area, forming a pair of edge pairs by every two adjacent pin edges, and calculating the distance between two edges in the edge pairs and the distance between the adjacent edge pairs;

Judging whether the distance between two edges in the pair exceeds a preset reference value W+/-2/3P, if so, discarding the pair of edges, and setting the distance between the two edges in the pair of edges to be zero;

And storing data, wherein the interval between two edges of the edge pairs is recorded as the width of the pins, and the interval between the adjacent edge pairs is recorded as the interval between every two adjacent pins.

10. Chip pin measuring device based on self-adaptation measurement rectangle frame, characterized in that includes:

the acquisition module is used for acquiring pictures of a chip to be measured, and the chip to be measured comprises a chip main body and pins on the periphery of the chip main body;

The first processing module is used for determining a first interest area based on the acquired picture of the chip to be measured and solving the minimum circumscribed rectangle of the first interest area;

The calculation module is used for calculating four corner points of the minimum circumscribed rectangle and sequencing the four corner points in sequence, and pins on any one peripheral side of the first interest area correspond to two corner points in the four corner points after sequencing respectively;

The self-adaptive measurement rectangular frame forming module is used for selecting a target pin and drawing the self-adaptive measurement rectangular frame of the target pin based on the positions of two corner points corresponding to the target pin and the reference parameter value of the target pin;

The second processing module is used for determining a second interest area based on the self-adaptive measurement rectangular frame and solving the edge of a pin in the second interest area;

And the determining module is used for acquiring the data of the target pin based on the edge of the pin.