CN118003534B - Tetrafluoro plate processing molding press - Google Patents

Tetrafluoro plate processing molding press Download PDF

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Publication number
CN118003534B
CN118003534B CN202410416754.9A CN202410416754A CN118003534B CN 118003534 B CN118003534 B CN 118003534B CN 202410416754 A CN202410416754 A CN 202410416754A CN 118003534 B CN118003534 B CN 118003534B
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China
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plate
die
lifting
heat
heat exchange
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CN202410416754.9A
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CN118003534A (en
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王吉祥
黄涔
陈慧
李永华
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Jiangsu Hongfu New Material Technology Co ltd
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Jiangsu Hongfu New Material Technology Co ltd
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Abstract

The invention belongs to the technical field of tetrafluoro plate processing, and in particular relates to a tetrafluoro plate processing forming die press, which comprises a main seat, wherein a lifting mechanism is arranged at one end of the main seat, a forming mechanism is arranged at the lower end of the lifting mechanism, a heat exchange mechanism is arranged at the other end of the main seat, and the heat exchange mechanism is connected with the forming mechanism through a pipeline; the problem to be solved in the scheme is that materials are heated to become liquid during compression molding, then the space in a die is filled for molding, and the materials cannot be rapidly dispersed due to accumulation during processing, so that the heating molding efficiency of the tetrafluoro plate is reduced; through the forming mechanism of design, through last mould and lower mould block to tetrafluoro plate material centre gripping when using, stir the material through rotating electrical machines drive rotor plate rotation simultaneously and disperse fast to the vibration of cooperation bobbing machine makes dispersion effect better, thereby guarantees that efficiency is higher when hot briquetting.

Description

Tetrafluoro plate processing molding press
Technical Field
The invention belongs to the technical field of tetrafluoro plate processing, and particularly relates to a tetrafluoro plate processing molding press.
Background
The polytetrafluoroethylene plate is subjected to mould pressing and turning; the product has wide application and extremely excellent comprehensive performance: high and low temperature resistance, corrosion resistance, weather resistance, high insulation, high lubrication, no adhesion, no toxicity and the like; the working principle of the molding press mainly relates to that heated raw materials are placed into a stressed mold, and the raw materials are compressed into a required molding piece under the action of high temperature and high pressure; this process typically includes the following steps: the raw materials are firstly pretreated by cutting, material dividing and the like, and then enter a processing area of a die; in the mold, the raw material is positioned and clamped; the pressing head moves downwards, and force is applied to squeeze and shape the raw materials to achieve the required shape; the pressure head moves upwards, the die is opened, and the one-time compression molding process is completed;
When the tetrafluoro plate is produced and processed, the molding press is adopted for hot press molding, materials are heated to be liquid during press molding, then the space in the mold is filled for molding, and the tetrafluoro plate can be heated and molded with reduced efficiency due to the fact that the materials are accumulated and cannot be dispersed rapidly during processing, so that the tetrafluoro plate processing molding press is required to be designed to solve the problems.
Disclosure of Invention
The invention aims to provide a tetrafluoro plate processing and molding press for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the tetrafluoro plate processing forming die press comprises a main seat, wherein a lifting mechanism is arranged at one end of the main seat, a forming mechanism is arranged at the lower end of the lifting mechanism, a heat exchange mechanism is arranged at the other end of the main seat, and the heat exchange mechanism is connected with the forming mechanism through a pipeline;
The forming mechanism comprises a lower die, a lower pressing plate and an upper die, wherein the lower die is arranged on a main seat through a spring buffer column, the lower pressing plate is arranged on a lifting mechanism, the upper die is arranged on the lower side of the lower pressing plate through a spring buffer column, a support column is fixedly arranged at one end of the main seat, and the lower pressing plate is slidably arranged on the support column through a linear bearing;
The vibrating machine is installed to the downside of lower mould, go up the mould and include outer template and slidable mounting at the inboard interior template of outer template, the middle part fixed mounting of outer template has the rotating electrical machines, the inboard middle part rotation of interior template is installed the rotor plate, the output shaft and the rotor plate of rotating electrical machines are connected.
Preferably, the output shaft of the rotating motor is fixedly provided with a rotating shaft, the middle part of the rotating plate is fixedly provided with a sliding sleeve, the sliding sleeve is in sliding connection with the rotating shaft through a sliding groove and a sliding strip, and the sliding sleeve is rotatably arranged on the inner template through a bearing.
Preferably, a lifting cylinder is fixedly arranged on the upper side of the outer template, and a piston rod of the lifting cylinder penetrates through the outer template to be fixedly connected with the inner template.
Preferably, the lower surface of the rotating plate is provided with a groove corresponding to the lifting cylinder and the rotating motor, the upper side of the rotating plate is provided with a guide sliding block, the inner side of the inner template is provided with a guide sliding groove, and the guide sliding block is slidably arranged in the guide sliding groove.
Preferably, the lower die comprises a main die frame, a heat insulation plate is fixedly arranged on the lower side of the main die frame, a supporting plate is fixedly arranged on the lower side of the heat insulation plate, the vibrator and the spring buffer column are fixedly arranged on the supporting plate, a heat conduction plate is arranged at the bottom of the inner side of the main die frame, a heat exchange tube is arranged on the inner side of the heat insulation plate, and the heat exchange tube is attached to the heat conduction plate.
Preferably, the heat exchange mechanism comprises a heating box fixedly installed on the main seat, a partition plate installed on the upper side of the heating box and a cooling box installed on the upper side of the partition plate, one side of the partition plate is connected with a cooling pump through a fixing plate, one side of the heating box is connected with the heating pump, the heating pump and the cooling pump are communicated with a heat exchange tube through a three-way electromagnetic valve and a pipeline, and a semiconductor refrigerating sheet is installed in the partition plate.
Preferably, the drain pipe and the feed liquor pipe are all installed to one side of cooling tank and heating tank, the drain pipe is located the lower extreme of cooling tank and heating tank, the feed liquor pipe is located the upper end of cooling tank and heating tank.
Preferably, the heat conduction graphite film and the heat transfer plate are all installed on the both sides surface of baffle, heat conduction graphite film laminating is at the surface of semiconductor refrigeration piece, the heat transfer plate laminating is installed in the outside of heat conduction graphite film, the heat transfer plate of baffle both sides is located cooling tank bottom and baffle top respectively, the internally mounted of heating cabinet has the heat conduction pole, the upper end and the heat transfer plate fixed connection of heat conduction pole.
Preferably, the lifting mechanism comprises a mounting frame fixedly mounted on the supporting column, a lifting column fixedly mounted on the lower pressure plate and a lifting motor fixedly mounted at the inner top of the mounting frame, the lifting column is slidably mounted on the mounting frame, an output shaft of the lifting motor is fixedly provided with a lifting screw rod, the lower end of the lifting screw rod is rotatably mounted at the bottom of the mounting frame through a bearing, the upper end of the lifting column is fixedly provided with a lifting frame, the middle part of the lifting frame is fixedly provided with a screw nut, and the screw nut is sleeved with the lifting screw rod.
Preferably, the outside of mounting bracket fixed mounting has the reinforcing plate, the lower extreme fixed mounting of reinforcing plate is on the main seat.
Compared with the prior art, the invention has the beneficial effects that:
1. Through the forming mechanism of design, through last mould and lower mould block to tetrafluoro plate material centre gripping when using, stir the material through rotating electrical machines drive rotor plate rotation simultaneously and disperse fast to the vibration of cooperation bobbing machine makes dispersion effect better, thereby guarantees that efficiency is higher when hot briquetting.
2. Through the heat exchange mechanism of design, the operation through the semiconductor refrigeration piece cools off respectively and heats both sides cooler bin and heating cabinet when using, firstly get into the lower mould through heating pump extraction hot liquid when using, after the tetrafluoro board shaping, take out liquid, the liquid of rethread cooling pump to the cooling down lets in the lower mould in the cooling, need not to heat and cool off two sets of equipment when using, more convenient and save the cost.
3. Through the lift cylinder and the interior template of design, outer template presses on the main die carrier when using, and lift cylinder drive interior template slides in the main die carrier to adjust the thickness of suppression tetrafluoro board, thereby conveniently press out the tetrafluoro board of different thickness as required.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a lifting structure according to the present invention;
FIG. 3 is a schematic view of a lifting top view structure of the present invention;
FIG. 4 is a schematic view of a heat exchange mechanism according to the present invention;
FIG. 5 is a schematic view of the lower die structure of the present invention;
FIG. 6 is a schematic view of the upper die structure of the present invention;
FIG. 7 is a schematic view of a rotary plate according to the present invention;
In the figure: 1. a main seat; 2. a forming mechanism; 21. a lower die; 211. a heat exchange tube; 212. a heat conductive plate; 213. a heat insulating plate; 214. a support plate; 215. a main die frame; 22. an upper die; 221. an outer template; 222. an inner template; 223. a rotating plate; 224. a guide slide block; 225. a guide chute; 226. a rotating electric machine; 227. a lifting cylinder; 228. a sliding sleeve; 229. a rotation shaft; 23. a lower pressing plate; 24. a spring buffer column; 25. a vibrator; 26. a support column; 3. a lifting mechanism; 30. a reinforcing plate; 31. a mounting frame; 32. a lifting motor; 33. lifting the screw rod; 34. a screw nut; 35. a lifting frame; 36. lifting columns; 4. a heat exchange mechanism; 41. a three-way electromagnetic valve; 42. heating the pump; 43. a cooling pump; 44. a cooling box; 45. a partition plate; 451. a semiconductor refrigeration sheet; 452. a thermally conductive graphite film; 453. a heat transfer plate; 46. a heating box; 461. a heat conduction rod; 47. a liquid outlet pipe; 48. a liquid inlet pipe.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one: referring to fig. 1 to 7, the present invention provides a technical solution: a tetrafluoro plate processing forming die press comprises a main seat 1, wherein a lifting mechanism 3 is arranged at one end of the main seat 1, a forming mechanism 2 is arranged at the lower end of the lifting mechanism 3, a heat exchange mechanism 4 is arranged at the other end of the main seat 1, and the heat exchange mechanism 4 is connected with the forming mechanism 2 through a pipeline; the forming mechanism 2 comprises a lower die 21 arranged on the main seat 1 through a spring buffer column 24, a lower pressing plate 23 arranged on the lifting mechanism 3 and an upper die 22 arranged on the lower side of the lower pressing plate 23 through the spring buffer column 24, wherein a support column 26 is fixedly arranged at one end of the main seat 1, and the lower pressing plate 23 is slidably arranged on the support column 26 through a linear bearing; the lower side of lower mould 21 installs the bobbing machine 25, upper mould 22 includes outer template 221 and slidable mounting at the inboard interior template 222 of outer template 221, the middle part fixed mounting of outer template 221 has rotating electrical machines 226, the inboard middle part rotation of interior template 222 is installed rotor plate 223, rotating electrical machines 226's output shaft and rotor plate 223 are connected, rotating electrical machines 226 drive rotor plate 223 rotates and carries out tiling to the tetrafluoro sheet material, and the support of cooperation spring buffer post 24 and the tiling effect of the vibration assurance material of bobbing machine 25 are better, lower mould 21 includes main die carrier 215, the downside fixed mounting of main die carrier 215 has heat insulating board 213, the downside fixed mounting of heat insulating board 213 has backup pad 214, bobbing machine 25 and spring buffer post 24 are all fixed mounting on backup pad 214, the inboard bottom of main die carrier 215 is provided with heat-conducting plate 212, the inboard of heat insulating board 213 is installed and is heat exchanger tube 211, heat exchanger tube 211 laminating is on heat-conducting plate 212, the tetrafluoro sheet material in the convenient to heat and cool down main die carrier 215.
Further, referring to fig. 1 and 2, the lifting mechanism 3 includes a mounting frame 31 fixedly mounted on the support column 26, a lifting column 36 fixedly mounted on the lower pressure plate 23, and a lifting motor 32 fixedly mounted on the top of the inner side of the mounting frame 31, the lifting column 36 is slidably mounted on the mounting frame 31, a lifting screw rod 33 is fixedly mounted on an output shaft of the lifting motor 32, a lower end of the lifting screw rod 33 is rotatably mounted at the bottom of the mounting frame 31 through a bearing, a lifting frame 35 is fixedly mounted at an upper end of the lifting column 36, a screw rod nut 34 is fixedly mounted in the middle of the lifting frame 35, the screw rod nut 34 is sleeved on the lifting screw rod 33, the lifting screw rod 33 is driven to rotate by the lifting motor 32, the lifting screw rod 33 drives the screw rod nut 34, the lifting frame 35 and the lifting column 36 to descend, and simultaneously drives the lower pressure plate 23 and the upper die 22 to descend, so that the upper die 22 is pressed on the lower die 21, and the upper die 22 is driven to rise when the lifting motor 32 reversely rotates; the outside fixed mounting of mounting bracket 31 has reinforcing plate 30, and the lower extreme fixed mounting of reinforcing plate 30 is on main seat 1, guarantees that mounting bracket 31 is stably installed and is used on main seat 1 when using.
From the above description, the present invention has the following advantageous effects: when the hot press forming machine is used, the tetrafluoro plate material is clamped through the clamping of the upper die 22 and the lower die 21, and meanwhile, the rotating plate 223 is driven to rotate through the rotating motor 226 to stir the material to be rapidly dispersed, and the dispersing effect is better through the cooperation of the vibration of the vibrating machine 25, so that the efficiency is higher during hot press forming.
Further, referring to fig. 1 to 7, a lifting cylinder 227 is fixedly installed on the upper side of the outer mold plate 221, a piston rod of the lifting cylinder 227 passes through the outer mold plate 221 to be fixedly connected with the inner mold plate 222, the inner mold plate 222 is pushed to be pressed down by the lifting cylinder 227, materials are tightly pressed together, a rotating shaft 229 is fixedly installed on an output shaft of the rotating motor 226, a sliding sleeve 228 is fixedly installed in the middle of the rotating plate 223, the sliding sleeve 228 is in sliding connection with the rotating shaft 229 through a sliding groove and a sliding strip, the sliding sleeve 228 is rotatably installed on the inner mold plate 222 through a bearing, the lifting cylinder 227 is convenient to drive the inner mold plate 222 to lift and slide through the sliding of the sliding sleeve 228 and the rotating shaft 229, and the rotating motor 226 is not influenced to drive the rotating plate 223 to rotate through the sliding sleeve 228 and the rotating shaft 229; the lower surface of rotor plate 223 corresponds the position of lift cylinder 227 and rotating electrical machines 226 and is provided with the recess, and the upside of rotor plate 223 is provided with direction slider 224, and direction spout 225 has been seted up to the inboard of interior template 222, and direction slider 224 slidable mounting makes rotor plate 223 more stable when rotating in direction spout 225, and rotor plate 223 surface is provided with the arc strip, conveniently promotes the tiling of material.
By adopting the lifting air cylinder 227 and the inner template 222 in the technical scheme, the outer template 221 is pressed on the main template frame 215 when the lifting air cylinder 227 drives the inner template 222 to slide in the main template frame 215, so that the thickness of the pressed tetrafluoro plate is adjusted, and the tetrafluoro plates with different thicknesses can be conveniently pressed according to the needs.
Embodiment two: referring to fig. 1 to 7, on the basis of the first embodiment, the present invention provides a technical solution: the heat exchange mechanism 4 comprises a heating box 46 fixedly arranged on the main seat 1, a partition board 45 arranged on the upper side of the heating box 46 and a cooling box 44 arranged on the upper side of the partition board 45, wherein one side of the partition board 45 is connected with a cooling pump 43 through a fixed plate, one side of the heating box 46 is connected with a heating pump 42, the heating pump 42 and the cooling pump 43 are communicated with a heat exchange tube 211 through a three-way electromagnetic valve 41 and a pipeline, a semiconductor refrigeration piece 451 is arranged in the partition board 45, and the cooling box 44 and the heating box 46 can absorb heat and dissipate heat simultaneously through the characteristics of simultaneous heat dissipation and heat absorption of the two sides of the semiconductor refrigeration piece 451 when in use, and tetrafluoro plate materials are heated and pressed into the heat exchange tube 211 through the cooling pump 43 and the heating pump 42 when in use, and then are cooled and formed without two groups of heating and cooling devices in turn when in use; a liquid outlet pipe 47 and a liquid inlet pipe 48 are arranged on one side of the cooling box 44 and one side of the heating box 46, the liquid outlet pipe 47 is positioned at the lower ends of the cooling box 44 and the heating box 46, and the liquid inlet pipe 48 is positioned at the upper ends of the cooling box 44 and the heating box 46, so that liquid can flow back and forth for recycling during use; the heat conduction graphite film 452 and the heat transfer plate 453 are all installed on the both sides surface of baffle 45, heat conduction graphite film 452 laminating is in the surface of semiconductor refrigeration piece 451, the heat transfer plate 453 laminating is installed in the outside of heat conduction graphite film 452, even absorb heat and dispel the heat in cooling tank 44 and the heating tank 46, the heat transfer plate 453 of baffle 45 both sides is located cooling tank 44 bottom and baffle 45 top respectively, the internally mounted of heating tank 46 has heat conducting rod 461, heat conducting rod 461's upper end and heat transfer plate 453 fixed connection for the internal heating to heating tank 46.
By adopting the heat exchange mechanism 4 of the technical scheme, the two side cooling boxes 44 and the heating boxes 46 are respectively cooled and heated through the operation of the semiconductor refrigerating piece 451 when the heat exchange mechanism is used, hot liquid is firstly extracted through the heating pump 42 and enters the lower die 21 for heating when the heat exchange mechanism is used, after the tetrafluoro plate is formed, the liquid is extracted, the cooled liquid is introduced into the lower die 21 for cooling through the cooling pump 43, and two sets of equipment are not needed for heating and cooling when the heat exchange mechanism is used, so that the heat exchange mechanism is more convenient and saves the cost.
The working principle and the using flow of the invention are as follows: when the molding machine is used, according to the thickness of the tetrafluoro plate and the size of the lower die 21, a corresponding quantity of tetrafluoro plate materials are selected, the materials are poured into the lower die 21, then the lifting motor 32 drives the lifting screw rod 33 to rotate, the lifting screw rod 33 drives the screw nut 34, the lifting frame 35 and the lifting column 36 to descend, simultaneously, the lower pressing plate 23 and the upper die 22 are driven to descend, the upper die 22 is pressed on the lower die 21, simultaneously, the rotating motor 226 is driven to slowly rotate through the transmission of the sliding sleeve 228 and the rotating shaft 229, thereby stirring the tetrafluoro plate materials to move all around, simultaneously, the elasticity of the spring buffer column 24 and the vibration of the vibration machine 25 are matched, the materials in the upper die 22 and the lower die 21 are uniformly vibrated, the materials are paved in the lower die 21, the lifting cylinder 227 pushes the inner die plate 222 to continuously downwards to keep the materials pressed together, meanwhile, the semiconductor refrigerating plate 451 operates to face the heating box 46, the heat conducting rod 461 is matched with the heat conducting rod 461 to rapidly guide the heat into the heat exchange liquid in the heating box 46, the heat exchange liquid in the cooling box 44 is cooled, the heat exchange liquid in the cooling box 452 is matched with the graphite film 452 to uniformly act on the heat conducting rod, the heat exchange plate 223 to slowly rotate, the tetrafluoro plate materials are stirred to move all around, the tetrafluoro plate materials are stirred and the materials are uniformly vibrated and evenly in the lower die 21, the heat exchange plate materials are heated by the heat exchange liquid and heated by the heat exchange liquid, the heat exchange liquid is completely in the heating box and heated by the heat exchange liquid and the heat exchange liquid, after the heat exchange liquid is cooled in the heating box is cooled by the heat pump and heated by the heat pump and the heat exchange liquid film, and the heat pipe is cooled by the heat pipe and heated by the heat exchange film, and the heat pipe heat and the heat material in the heat pipe heat and the heat material is heated.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely illustrative of the present invention and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present invention.

Claims (5)

1. A tetrafluoro plate processing molding press is characterized in that: the device comprises a main seat (1), wherein a lifting mechanism (3) is arranged at one end of the main seat (1), a forming mechanism (2) is arranged at the lower end of the lifting mechanism (3), a heat exchange mechanism (4) is arranged at the other end of the main seat (1), and the heat exchange mechanism (4) is connected with the forming mechanism (2) through a pipeline;
The forming mechanism (2) comprises a lower die (21) arranged on the main seat (1) through a spring buffer column (24), a lower pressing plate (23) arranged on the lifting mechanism (3) and an upper die (22) arranged on the lower side of the lower pressing plate (23) through the spring buffer column (24), a support column (26) is fixedly arranged at one end of the main seat (1), and the lower pressing plate (23) is slidably arranged on the support column (26) through a linear bearing;
A vibrator (25) is arranged on the lower side of the lower die (21), the upper die (22) comprises an outer die plate (221) and an inner die plate (222) which is slidably arranged on the inner side of the outer die plate (221), a rotating motor (226) is fixedly arranged in the middle of the outer die plate (221), a rotating plate (223) is rotatably arranged in the middle of the inner side of the inner die plate (222), and an output shaft of the rotating motor (226) is connected with the rotating plate (223);
The lower die (21) comprises a main die frame (215), a heat insulation plate (213) is fixedly arranged on the lower side of the main die frame (215), a supporting plate (214) is fixedly arranged on the lower side of the heat insulation plate (213), the vibrator (25) and the spring buffer column (24) are fixedly arranged on the supporting plate (214), a heat conduction plate (212) is arranged at the bottom of the inner side of the main die frame (215), a heat exchange tube (211) is arranged at the inner side of the heat insulation plate (213), and the heat exchange tube (211) is attached to the heat conduction plate (212);
The heat exchange mechanism (4) comprises a heating box (46) fixedly installed on the main seat (1), a partition plate (45) installed on the upper side of the heating box (46) and a cooling box (44) installed on the upper side of the partition plate (45), one side of the partition plate (45) is connected with a cooling pump (43) through a fixed plate, one side of the heating box (46) is connected with a heating pump (42), the heating pump (42) and the cooling pump (43) are communicated with a heat exchange tube (211) through a three-way electromagnetic valve (41) and a pipeline, and a semiconductor refrigerating sheet (451) is installed in the partition plate (45);
a liquid outlet pipe (47) and a liquid inlet pipe (48) are arranged on one side of the cooling box (44) and one side of the heating box (46), the liquid outlet pipe (47) is positioned at the lower ends of the cooling box (44) and the heating box (46), and the liquid inlet pipe (48) is positioned at the upper ends of the cooling box (44) and the heating box (46);
the heat conducting graphite film (452) and the heat transfer plates (453) are arranged on the surfaces of the two sides of the partition plate (45), the heat conducting graphite film (452) is attached to the surface of the semiconductor refrigerating sheet (451), the heat transfer plates (453) are attached to the outer sides of the heat conducting graphite film (452), the heat transfer plates (453) on the two sides of the partition plate (45) are respectively located at the bottom of the cooling box (44) and the top of the partition plate (45), the heat conducting rod (461) is arranged in the heating box (46), and the upper ends of the heat conducting rods (461) are fixedly connected with the heat transfer plates (453);
elevating system (3) are including mounting bracket (31) of fixed mounting on support column (26), fixed mounting lifting column (36) and fixed mounting at lifting motor (32) at the inboard top of mounting bracket (31) on holding down plate (23), lifting column (36) slidable mounting is on mounting bracket (31), the output shaft fixed mounting of lifting motor (32) has lifting screw (33), the lower extreme of lifting screw (33) is installed in the bottom of mounting bracket (31) through the bearing rotation, the upper end fixed mounting of lifting column (36) has crane (35), the middle part fixed mounting of crane (35) has screw nut (34), screw nut (34) cover fixed mounting is on lifting screw (33).
2. A tetrafluoro plate forming die press as claimed in claim 1, wherein: the output shaft of the rotating motor (226) is fixedly provided with a rotating shaft (229), the middle part of the rotating plate (223) is fixedly provided with a sliding sleeve (228), the sliding sleeve (228) is in sliding connection with the rotating shaft (229) through a sliding groove and a sliding strip, and the sliding sleeve (228) is rotatably arranged on the inner template (222) through a bearing.
3. A tetrafluoro plate forming die press as claimed in claim 1, wherein: the upper side of the outer template (221) is fixedly provided with a lifting cylinder (227), and a piston rod of the lifting cylinder (227) penetrates through the outer template (221) to be fixedly connected with the inner template (222).
4. A tetrafluoro plate forming die press as claimed in claim 3, wherein: the lower surface of rotor plate (223) corresponds the position of lift cylinder (227) and rotating electrical machines (226) and is provided with the recess, the upside of rotor plate (223) is provided with direction slider (224), direction spout (225) have been seted up to the inboard of interior template (222), direction slider (224) slidable mounting is in direction spout (225).
5. A tetrafluoro plate forming die press as claimed in claim 1, wherein: the outer side of the mounting frame (31) is fixedly provided with a reinforcing plate (30), and the lower end of the reinforcing plate (30) is fixedly arranged on the main seat (1).
CN202410416754.9A 2024-04-08 2024-04-08 Tetrafluoro plate processing molding press Active CN118003534B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410416754.9A CN118003534B (en) 2024-04-08 2024-04-08 Tetrafluoro plate processing molding press

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Application Number Priority Date Filing Date Title
CN202410416754.9A CN118003534B (en) 2024-04-08 2024-04-08 Tetrafluoro plate processing molding press

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CN118003534A CN118003534A (en) 2024-05-10
CN118003534B true CN118003534B (en) 2024-05-31

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101708655A (en) * 2009-11-24 2010-05-19 曾燕飞 Method for manufacturing expanded polytetrafluoroethylene plate
CN112060552A (en) * 2020-08-25 2020-12-11 东莞市达盛机电设计有限公司 But car roof hot briquetting device of automatic discharge with side cut function
CN112549406A (en) * 2020-11-23 2021-03-26 德清新源恒塑料科技有限公司 High efficiency polytetrafluoroethylene extruded sheet equipment
CN216181244U (en) * 2021-10-25 2022-04-05 深圳市宝明科技股份有限公司 Punching press waste discharge mechanism of FPC waste discharge equipment
CN217073147U (en) * 2021-06-23 2022-07-29 优链新材料科技(上海)有限公司 Simple injection mold with quick-change mold core
WO2022247059A1 (en) * 2021-05-28 2022-12-01 湖南奇秀科技有限公司 Luggage making device based on internet of things
CN117696772A (en) * 2023-12-26 2024-03-15 常熟拓克机械装备制造有限公司 Test die blanking production line of test die press

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101708655A (en) * 2009-11-24 2010-05-19 曾燕飞 Method for manufacturing expanded polytetrafluoroethylene plate
CN112060552A (en) * 2020-08-25 2020-12-11 东莞市达盛机电设计有限公司 But car roof hot briquetting device of automatic discharge with side cut function
CN112549406A (en) * 2020-11-23 2021-03-26 德清新源恒塑料科技有限公司 High efficiency polytetrafluoroethylene extruded sheet equipment
WO2022247059A1 (en) * 2021-05-28 2022-12-01 湖南奇秀科技有限公司 Luggage making device based on internet of things
CN217073147U (en) * 2021-06-23 2022-07-29 优链新材料科技(上海)有限公司 Simple injection mold with quick-change mold core
CN216181244U (en) * 2021-10-25 2022-04-05 深圳市宝明科技股份有限公司 Punching press waste discharge mechanism of FPC waste discharge equipment
CN117696772A (en) * 2023-12-26 2024-03-15 常熟拓克机械装备制造有限公司 Test die blanking production line of test die press

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