CN117996410A

CN117996410A - Electronic equipment

Info

Publication number: CN117996410A
Application number: CN202211351598.XA
Authority: CN
Inventors: 蔡国胤
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2024-05-07
Also published as: WO2024093544A1

Abstract

An embodiment of the present application provides an electronic device, including: the NFC chip is used for providing NFC excitation current; the NFC radiator is electrically connected with the NFC chip; the NFC chip comprises a frame, a first radiator and a second radiator, wherein the first radiator and the second radiator are arranged on different sides of the frame, and are electrically connected with the NFC chip; the NFC radiator, the first radiator and the second radiator are all used for transmitting NFC excitation current so as to support the transmission and/or the reception of NFC signals. In the electronic device, the NFC radiator, the first radiator and the second radiator can support the emission and/or the reception of NFC signals, and as the first radiator and the second radiator are arranged on different sides of the frame, the NFC radiator, the first radiator and the second radiator can form a surrounding antenna, so that a surrounding NFC communication area is formed, and compared with a conventional NFC antenna scheme, the communication range of NFC can be enlarged.

Description

Electronic equipment

Technical Field

The application relates to the technical field of communication, in particular to electronic equipment.

Background

NFC (NEAR FIELD Communication) antennas are typically provided in electronic devices such as smartphones to implement NFC functionality. Conventional NFC antennas excite a magnetic field through an NFC coil, which is concentrated inside and outside edges of the coil.

In this NFC antenna scheme, the NFC communication range is limited by the area of the NFC coil. The smaller the coil area, the smaller the communication range. Increasing the coil area, while capable of increasing the communication range, has limited increased communication range and may result in increased costs.

Disclosure of Invention

The embodiment of the application provides electronic equipment, which can form a surrounding NFC communication area and enlarge the NFC communication range.

An embodiment of the present application provides an electronic device, including:

the NFC chip is used for providing NFC excitation current;

the NFC radiator is electrically connected with the NFC chip;

the NFC chip comprises a frame, wherein the frame is provided with a first radiator and a second radiator, the first radiator and the second radiator are arranged on different sides of the frame, and the first radiator and the second radiator are electrically connected with the NFC chip;

the NFC radiator, the first radiator and the second radiator are all used for transmitting the NFC excitation current so as to support the emission and/or the reception of NFC signals.

In the electronic device provided by the embodiment of the application, the NFC radiator, the first radiator and the second radiator can support the emission and/or the reception of NFC signals, and because the first radiator and the second radiator are arranged on different sides of the frame, the NFC radiator, the first radiator and the second radiator can form a surrounding type antenna, thereby forming a surrounding type NFC communication area.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a first structure of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a second structure of an electronic device according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a third structure of an electronic device according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a fourth structure of an electronic device according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a fifth structure of an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of an NFC radiator in an electronic device according to an embodiment of the present application.

Fig. 7 is a schematic diagram of an electronic device generating an NFC radiation field according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a sixth structure of an electronic device according to an embodiment of the present application.

Fig. 9 is a schematic diagram of a seventh structure of an electronic device according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram of a frame of an electronic device according to an embodiment of the present application.

Fig. 11 is a schematic structural diagram of a foldable electronic device according to an embodiment of the present application.

Fig. 12 is a schematic view of the foldable electronic device of fig. 11 in a folded state.

Fig. 13 is a schematic rear view of the foldable electronic device of fig. 12.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or a game device, an AR (Augmented Reality ) device, an automobile, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device, or the like.

Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of an electronic device 100 according to an embodiment of the present application. The electronic device 100 comprises an NFC (NEAR FIELD Communication) chip 10, an NFC radiator 20 and a bezel 30. In some embodiments, the electronic device 100 further includes a camera module 40 and a battery 50.

Wherein the NFC chip 10 is configured to provide an NFC excitation current. The frequency of the NFC excitation current is typically 13.56MHz. It is understood that the electronic device 100 may include a motherboard, and the NFC chip 10 may be disposed on the motherboard. In other embodiments, the NFC chip 10 may also be provided on a separate circuit board.

The NFC radiator 20 may be a radiator in the form of an FPC (Flexible Printed Circuit, flexible circuit board). The NFC radiator 20 is electrically connected with the NFC chip 10. The NFC radiator 20 is configured to transmit an NFC excitation current provided by the NFC chip 10, so as to support emission and/or reception of an NFC signal, and implement an NFC communication function. In addition, the NFC radiator 20 may also increase the self inductance. It will be appreciated that in practical applications, the NFC radiator 20 may be another radiator, such as a coil, a conductor, or the like, which is not particularly limited in the embodiment of the present application.

In practical applications, the shape of the NFC radiator 20 may be set according to the requirements and the overall layout of the electronic device 100. For example, in one possible example, the NFC radiator 20 may be shaped as an "L" as shown in fig. 1. In another possible example, the NFC radiator 20 may also be elongated.

The bezel 30 forms an outer periphery of the electronic device 100. The frame 30 is provided with a first radiator 31 and a second radiator 32. The first radiator 31 and the second radiator 32 are disposed on different sides of the frame 30, for example, may be disposed on opposite sides or disposed on adjacent sides. The first radiator 31 and the second radiator 32 may be radiators formed by conductors such as metal structures and metal wires.

The first radiator 31 and the second radiator 32 are electrically connected to the NFC chip 10. The first radiator 31 and the second radiator 32 are both used for transmitting the NFC excitation current provided by the NFC chip 10 to support the transmission and/or reception of NFC signals.

The camera module 40 may be a rear camera module. The camera module 40 includes one or more cameras, for example, may include a plurality of cameras such as a main camera, a tele camera, a macro camera, etc., to achieve different photographing effects.

It will be appreciated that typically the camera module 40 includes metal components that affect the NFC signal. Meanwhile, in order to achieve both the light weight and the miniaturization of the electronic device 100, it is necessary to reasonably utilize the layout space inside the electronic device 100, and generally, the camera module 40 and the NFC radiator 20 are both disposed on the upper portion of the electronic device 100. Therefore, in order to reduce the influence of the camera module 40 on the NFC signal, and also consider the overall spatial layout, the NFC radiator 20 and the camera module 40 may be disposed adjacent to each other, and a certain distance may be maintained between the two, where the size of the distance may be determined according to the requirements in practical applications, for example, in a feasible example, the distance may be 10cm.

The battery 50 is used to provide power to the electronic device 100. The battery 50 also includes metal devices, so that in the overall stacked layout of the electronic device 100, a certain distance needs to be kept between the NFC radiator 20 and the battery 50, so as to reduce the influence of the battery 50 on the NFC signal.

In the electronic device 100 of the embodiment of the present application, the NFC radiator 20, the first radiator 31 and the second radiator 32 can support the emission and/or the reception of NFC signals, and since the first radiator 31 and the second radiator 32 are disposed on different sides of the frame 30, the NFC radiator 20, the first radiator 31 and the second radiator 32 can form a loop antenna, so as to form a loop type NFC communication area, and compared with the conventional NFC antenna scheme, the communication range of NFC can be increased.

In some embodiments, referring to fig. 2 and fig. 3, fig. 2 is a second structural schematic diagram of the electronic device 100 according to the embodiment of the present application, and fig. 3 is a third structural schematic diagram of the electronic device 100 according to the embodiment of the present application.

The NFC chip 10 includes a first differential signal terminal 111 and a second differential signal terminal 112. For example, the first differential signal terminal 111 may be a positive (+) port of the NFC chip 10, and the second differential signal terminal 112 may be a negative (-) port of the NFC chip 10. The NFC excitation current provided by the NFC chip 10 is a differential signal, which is a balanced signal, comprising a first NFC excitation current and a second NFC excitation current. The first NFC excitation current is the same amplitude as the second NFC excitation current and is opposite in phase or understood to be 180 degrees out of phase. The first differential signal terminal 111 is configured to provide the first NFC excitation current, and the second differential signal terminal 112 is configured to provide the second NFC excitation current.

The first radiator 31 is electrically connected to the first differential signal terminal 111 and grounded as shown in fig. 2. For example, the first radiator 31 may be electrically connected to the first differential signal terminal 111 through a metal spring. In one possible embodiment, as shown in fig. 3, the first radiator 31 may be grounded by a rib 33. In practical applications, the portion where the first radiator 31 is electrically connected to the first differential signal end 111 may be located at the end portion or a portion other than the end portion of the first radiator 31, and the grounding portion of the first radiator 31 may also be located at the end portion or a portion other than the end portion, and both are located at different portions. Accordingly, the first NFC excitation current provided by the first differential signaling terminal 111 may be fed to the first radiator 31, and transmitted through the first radiator 31, thereby supporting the transmission and/or reception of NFC signals.

In practical applications, as shown in fig. 3, the electronic device 100 may include a motherboard 60, and a system ground may be disposed on the motherboard 60. The first radiator 31 may be electrically connected to the system on the main board 60 through the rib 33 so that the first radiator 31 is grounded.

The NFC radiator 20 and the second radiator 32 are electrically connected to the second differential signal terminal 112. Accordingly, the second NFC excitation current provided by the second differential signaling terminal 112 may be fed to the NFC radiator 20 and the second radiator 32, and transmitted through the NFC radiator 20 and the second radiator 32, thereby supporting the transmission and/or reception of the NFC signal.

In some embodiments, as shown in fig. 2, the second radiator 32 is in series with the NFC radiator 20 and is electrically connected with the second differential signal terminal 112. Specifically, one end of the NFC radiator 20 is electrically connected to the second differential signal end 112, the other end of the NFC radiator 20 is electrically connected to the second radiator 32, and the second radiator 32 is grounded. The portion where the second radiator 32 is electrically connected to the NFC radiator 20 may be located at the end portion or the portion other than the end portion of the second radiator 32, and the ground portion of the second radiator 32 may be located at the end portion or the portion other than the end portion, and both may be located at different portions. In practical applications, as shown in fig. 3, the second radiator 32 may be electrically connected to the system on the motherboard 60 through the rib 34, so that the second radiator 32 is grounded. Therefore, the second radiator 32, the NFC radiator 20 and the NFC chip 10 can form a loop, so that the NFC radiator 20, the second radiator 32 can transmit the second NFC excitation current provided by the second differential signal terminal 112.

In this embodiment, the second radiator 32 is connected in series with the NFC radiator 20, so that when the second NFC excitation current is transmitted, the magnitude of the current in the second radiator 32 is the same as the magnitude of the current in the NFC radiator 20 and the magnitude of the second NFC excitation current provided by the second differential signaling terminal 112 is the same.

In other embodiments, referring to fig. 4 and fig. 5, fig. 4 is a fourth structural schematic diagram of an electronic device 100 according to an embodiment of the present application, and fig. 5 is a fifth structural schematic diagram of the electronic device 100 according to an embodiment of the present application.

As shown in fig. 4, the second radiator 32 is connected in parallel with the NFC radiator 20 and is electrically connected to the second differential signal terminals 112 respectively. Specifically, one end of the NFC radiator 20 is electrically connected to the second differential signal end 112, and the other end of the NFC radiator 20 is grounded, for example, electrically connected to the system on the motherboard 60 through a metal spring sheet to realize grounding. Therefore, the NFC radiator 20 and the NFC chip 10 can form a loop, so that the NFC radiator 20 can transmit the second NFC excitation current provided by the second differential signal terminal 112. The second radiator 32 is electrically connected to the second differential signal terminal 112 and grounded. For example, as shown in fig. 5, the second radiator 32 may be electrically connected to the system on the motherboard 60 through the rib 34 to achieve ground. The portion where the second radiator 32 is electrically connected to the second differential signal terminal 112 may be located at the end portion or a portion other than the end portion of the second radiator 32, and the ground portion of the second radiator 32 may be located at the end portion or a portion other than the end portion, and both are located at different portions. Therefore, the second radiator 32 and the NFC chip 10 can also form a loop, so that the second radiator 32 can transmit the second NFC excitation current provided by the second differential signal terminal 112.

In practical applications, the second NFC excitation current provided by the second differential signaling terminal 112 may be fed to the NFC radiator 20 and the second radiator 32 through devices such as a power divider, a multiplexer, and the like, respectively. Thus, in this embodiment, the magnitude of the current in the second radiator 32 may be the same as or different from the magnitude of the current in the NFC radiator 20 when the second NFC excitation current is transmitted, and both may be less than the magnitude of the second NFC excitation current provided by the second differential signaling terminal 112.

Therefore, in practical applications, when the second radiator 32 is connected in series with the NFC radiator 20, the current between the second radiator 32 and the NFC radiator 20 is large, so that a stronger magnetic field can be generated, and a larger communication area is covered, thereby increasing the communication range of NFC. When the second radiator 32 is parallel to the NFC radiator 20, the second radiator 32 and the NFC radiator 20 are relatively independent, so that the second radiator 32 and the NFC radiator 20 can be respectively and independently impedance-matched, and impedance matching and adjustment are facilitated, so that the overall antenna design can be simplified.

In some embodiments, referring to fig. 6 together, fig. 6 is a schematic structural diagram of an NFC radiator 20 in an electronic device according to an embodiment of the present application. The NFC radiator 20 includes a first strip 21 and a second strip 22. The first strip portion 21 and the second strip portion 22 are both elongated. The first strip portion 21 is connected to the second strip portion 22 and is perpendicular to each other. The first stripe portion 21 is electrically connected to the second differential signal terminal 112 of the NFC chip 10, and the second stripe portion 22 is connected to the second radiator 32 (as shown in fig. 2 and 3) or grounded (as shown in fig. 4 and 5). The first strip 21 is parallel to the second radiator 32. The second strip 22 is located between the second radiator 32 and the first strip 21. Therefore, in practical application, the portion of the NFC radiator 20 parallel to the second radiator 32, that is, the first strip portion 21, can be far away from the second radiator 32, so as to avoid that the first strip portion 21 and the second radiator 32 form reverse currents to generate reverse NFC radiation fields, which results in reduced NFC performance.

It will be appreciated that if the first radiator 31 and the second radiator 32 are disposed on opposite sides of the frame 30, for example, the first radiator 31 is disposed on the right side of the frame 30, and the second radiator 32 is disposed on the left side of the frame 30, when the first strip portion 21 is far from the second radiator 32, the first radiator 31 is close to the second radiator, and at this time, a reverse current is formed in the first strip portion 21 and the first radiator 31 to generate a reverse NFC radiation field, so that the NFC performance is reduced.

Therefore, in practical applications, when the NFC radiator 20 with the structure shown in fig. 6 is adopted, the first radiator 31 and the second radiator 32 may be disposed on adjacent sides of the frame 30. For example, in one example, the first radiator 31 may be disposed on top of the bezel 30, and the second radiator 32 may be disposed on the left side of the bezel 30.

In some embodiments, referring to fig. 7, fig. 7 is a schematic diagram of generating an NFC radiation field by the electronic device 100 according to an embodiment of the present application.

Wherein, upon transmitting the NFC excitation current provided by the NFC chip 10, the NFC radiator 20 supports the emission and/or reception of the NFC signal to generate the first NFC radiation field A1, the first radiator 31 supports the emission and/or reception of the NFC signal to generate the second NFC radiation field A2, and the second radiator 32 supports the emission and/or reception of the NFC signal to generate the third NFC radiation field A3. The first NFC radiation field A1, the second NFC radiation field A2, and the third NFC radiation field A3 shown in fig. 7 are only schematic, and do not represent the actual radiation field range and form, and therefore do not constitute limitations on the actual radiation field range, form, and the like.

In practical applications, the positions, shapes, sizes, etc. of the NFC radiator 20, the first radiator 31, and the second radiator 32 may be designed in the design stage of the electronic device 100 to adjust the areas and the ranges of the first NFC radiation field A1, the second NFC radiation field A2, and the third NFC radiation field A3.

In some embodiments, the first NFC radiation field A1 may be at least partially overlapped with each of the second NFC radiation field A2 and the third NFC radiation field A3 to enhance the NFC field strength of the overlapped area. Therefore, the NFC communication range of the electronic device 100 can be increased, and the NFC communication stability of the electronic device 100 can be improved.

For example, in practical applications, the overlapping area of the first NFC radiation field A1 and the second NFC radiation field A2, and the third NFC radiation field A3 may be located in the area where the display screen of the electronic device 100 is located, so that the NFC communication range of the area where the display screen and the battery cover (the battery cover is opposite to the display screen, and the battery cover may also be referred to as a back cover) are located can be increased, the card swiping area and the card swiping distance of the NFC function are increased, and the stability of NFC communication is improved.

In other embodiments, the second NFC radiation field A2 and the third NFC radiation field A3 may be at least partially overlapped, and the NFC field strength of the overlapped area may be enhanced, so as to increase the NFC communication range and the communication stability.

For example, in practical applications, the overlapping area of the second NFC radiation field A2 and the third NFC radiation field A3 may also be located in the area where the display screen of the electronic device 100 is located, so that the NFC communication range of the area where the display screen and the battery cover are located can be increased, and the NFC communication stability is improved.

In one example of a practical application, NFC radiator 20 may be located in the motherboard area of electronic device 100 and in close proximity to battery 50; the first radiator 31 may be located at one end of the electronic device 100, for example, the top; the second radiator 32 may be located at one side, for example, the left side, of the electronic device 100. The first NFC radiation field A1 and the third NFC radiation field A3 may be a main radiation field, and the second NFC radiation field A2 may be a sub-radiation field, so that two main and one sub NFC radiation fields can be formed. The first NFC radiation field A1 can effectively increase the communication range of the display screen area, the battery cover area and the right side of the electronic device. The third NFC radiation field A3 can effectively increase the communication range of the display screen area, the battery cover area, the left side and the bottom of the electronic device. The second NFC radiation field A2 can effectively increase the communication range of the display screen area, the battery cover area, and the top of the electronic device. Therefore, a surrounding NFC communication area can be formed around the electronic device 100, so as to greatly increase the communication range and further improve the user experience.

In some embodiments, referring to fig. 8, fig. 8 is a schematic diagram of a sixth structure of an electronic device 100 according to an embodiment of the present application.

The electronic device 100 further includes a first communication module 70, and the first communication module 70 may be disposed on the motherboard 60, for example. The first communication module 70 is configured to provide a first non-NFC exciting current. The first non-NFC excitation current is an excitation current of other communication means than NFC, and may include any one of a cellular communication excitation current, a Wi-Fi communication excitation current, a GPS communication excitation current, and a bluetooth communication excitation current, for example. Accordingly, the first communication module 70 may be a cellular communication module, a Wi-Fi communication module, a GPS communication module, a bluetooth communication module, etc.

The first radiator 31 is electrically connected to the first communication module 70. The first radiator 31 is also used for transmitting a first non-NFC excitation current to support the transmission and/or reception of a first non-NFC signal. For example, the first non-NFC excitation current may be a cellular communication excitation current, and then the first radiator 31 may be capable of transmitting and/or receiving cellular signals when transmitting the cellular communication excitation current, implementing a cellular communication function.

In an example of practical application, the first non-NFC excitation current is a medium-high frequency (Medium and high band, MHB) excitation current of cellular communication, and may be, for example, an excitation current in a frequency band such as B40 (2.3 GHz-2.4 GHz), B41 (2.496 GHz-2.69 GHz), or the like.

The first radiator 31 can transmit NFC excitation current to realize an NFC function, and can transmit first non-NFC excitation current to realize a corresponding communication function, for example, to realize a medium-high frequency cellular communication function, so that multiplexing of the first radiator 31 can be realized, and the total number of antennas can be reduced when different communication functions are realized, so that the overall antenna design of the electronic device 100 can be simplified.

In some embodiments, with continued reference to fig. 8, the electronic device 100 further includes a second communication module 80, and the second communication module 80 may also be disposed on the motherboard 60, for example. The second communication module 80 is configured to provide a second non-NFC exciting current. The second non-NFC activation current is also an activation current of other communication means than NFC, and may include any one of a cellular communication activation current, a Wi-Fi communication activation current, a GPS communication activation current, and a bluetooth communication activation current, for example. Correspondingly, the second communication module 80 may be a cellular communication module, a Wi-Fi communication module, a GPS communication module, a bluetooth communication module, etc. It should be noted that the second communication module 80 and the first communication module 70 may be different types of communication modules, or may be the same type of communication module, for example, may be cellular communication modules.

Wherein the second radiator 32 is electrically connected to the second communication module 80. The second radiator 32 is also used to transmit a second non-NFC excitation current to support the transmission and/or reception of a second non-NFC signal. For example, the second non-NFC excitation current may also be a cellular communication excitation current, and the second radiator 32 is then capable of transmitting and/or receiving cellular signals when transmitting the cellular communication excitation current, thereby implementing a cellular communication function.

In an example of practical application, the second non-NFC excitation current is a low-frequency (Lowband, LB) excitation current of cellular communication, and may be, for example, an excitation current of a frequency band such as B5 (uplink frequency 824 MHz-849 MHz, downlink frequency 869 MHz-894 MHz), B20 (uplink frequency 832 MHz-862 MHz, downlink frequency 791 MHz-821 MHz), etc.

The second radiator 32 can transmit NFC excitation current to realize an NFC function, and can transmit second non-NFC excitation current to realize a corresponding communication function, for example, to realize a low-frequency cellular communication function, so that multiplexing of the second radiator 32 can be realized, and the total number of antennas can be reduced when different communication functions are realized, so that the overall antenna design of the electronic device 100 can be further simplified.

In some embodiments, referring to fig. 9, fig. 9 is a schematic diagram of a seventh structure of an electronic device 100 according to an embodiment of the present application, in fig. 9, an NFC chip 10 is denoted by an NFC IC, a first communication module 70 is denoted by an IC1, and a second communication module 80 is denoted by an IC 2.

The electronic device 100 further comprises a first inductance L1 and a first capacitance C1. The first inductor L1 is connected in series between the NFC chip 10 and the first radiator 31, and the first capacitor C1 is connected in parallel with the first inductor L1 and grounded. The first inductor L1 and the first capacitor C1 may form a first isolation circuit, which is configured to isolate the NFC excitation current from the first non-NFC excitation current, so as to ensure that the NFC excitation current and the first non-NFC excitation current do not interfere with each other, thereby improving the communication stability of NFC and the communication stability of the first communication module 70.

In practical applications, the first inductor L1 is a loss device for the NFC excitation current, so the smaller the first inductor L1 is, the better the NFC excitation current is, but the smaller the first inductor L1 is, which leads to poor isolation effect, so that the first radiator 31 has clutter and cannot even be tuned when transmitting the first non-NFC excitation current, and the larger the first inductor L1 is, the larger the NFC excitation current is. Therefore, it is important to select an appropriate first inductance L1. In addition, the selection of the first inductance L1 is related to a specific frequency band of the first non-NFC excitation current. In one possible example, the first inductance L1 may have a magnitude of 10nH.

In one possible example, the first capacitance C1 has a size of 100pF.

In some embodiments, with continued reference to fig. 9, the electronic device 100 further includes a second inductance L2 and a second capacitance C2. The second inductor L2 is connected in series between the NFC chip 10 and the NFC radiator 20, and the second capacitor C2 is connected in parallel with the second inductor L2 and is grounded. The second inductor L2 and the second capacitor C2 may form a second isolation circuit, which is configured to isolate the NFC excitation current from the second non-NFC excitation current, so as to ensure that the NFC excitation current and the second non-NFC excitation current do not interfere with each other, thereby improving the communication stability of NFC and the communication stability of the second communication module 80.

In practical applications, the second inductor L2 is selected in relation to a specific frequency band of the second non-NFC exciting current. In one possible example, the second inductance L2 may have a magnitude of 10nH.

In one possible example, the second capacitance C2 has a size of 100pF.

In some embodiments, referring to fig. 10, fig. 10 is a schematic structural diagram of a frame 30 of an electronic device according to an embodiment of the present application.

The frame 30 is a metal frame, and may be made of, for example, aluminum alloy, magnesium alloy, or the like. The metal frame 30 is provided with a plurality of slits to form a first metal branch 34 and a second metal branch 35 on the metal frame 30. The lengths of the first metal branch 34 and the second metal branch 35 can be set according to the actual requirements and the overall layout of the electronic device 100. Wherein the first metal branch 34 forms the first radiator 31 and the second metal branch 35 forms the second radiator 32. Therefore, the metal bezel 30 can be multiplexed to form the first radiator 31 and the second radiator 32, and no separate radiator is required, so that the overall antenna design can be simplified.

In some embodiments, as shown in fig. 10, the metal bezel 30 includes a first side 301, a second side 302, and a third side 303. The first side 301 is opposite the second side 302, and the third side 303 is connected between the first side 301 and the second side 302. In practical applications, the first side 301 and the second side 302 may be long sides, and the third side 303 may be short sides.

Wherein, the first metal branch 34 is formed on the third side 303. For example, a first slit 331 and a second slit 332 may be formed in the third side 303, and a portion between the first slit 331 and the second slit 332 forms the first metal branch 34.

The second metal knob 35 is formed on the first side 301 or the second side 302. For example, a third slit 333 and a fourth slit 334 may be opened at the first side 301, and a portion between the third slit 333 and the fourth slit 334 forms the second metal knob 35.

It should be noted that the manner of forming the first radiator 31 and the second radiator 32 is only one possible example. In other embodiments, the first radiator 31 and the second radiator 32 may be other types of radiators, for example, the first radiator 31 and the second radiator 32 may be FPC type radiators.

In some embodiments, the electronic device 100 is a foldable electronic device. Referring to fig. 11 and 12, fig. 11 is a schematic structural diagram of a foldable electronic device 100 according to an embodiment of the present application, and fig. 12 is a schematic diagram of the foldable electronic device 100 shown in fig. 11 in a folded state.

The foldable electronic device 100 comprises a first part 101, a second part 102 and a hinge 103. The first portion 101 is connected to the second portion 102 by a rotation shaft 103. The first portion 101 and the second portion 102 can be relatively rotated to a folded state or an unfolded state to fold or unfold the electronic device 100. Fig. 12 is a schematic view showing the electronic device 100 rotated to a folded state along the rotation axis 103.

The NFC chip 10, the NFC radiator 20, the first radiator 31, and the second radiator 32 may be disposed on the first portion 101 or the second portion 102. For example, in the example of fig. 11, the frame 30 is located in the first portion 101, the first radiator 31 and the second radiator 32 are both formed on the frame 30 of the first portion 101, and the NFC chip 10 and the NFC radiator 20 may be both disposed on the first portion 101. The battery 50 may be disposed in the second portion 102. For details of the implementation of each portion, reference may be made to the descriptions in the foregoing embodiments of the electronic device 100, which are not repeated herein.

In some embodiments, referring to fig. 13, fig. 13 is a schematic rear view of the foldable electronic device 100 of fig. 12. The electronic device 100 also includes a secondary display 90. The secondary display 90 may be used to display information when the electronic device 100 is in a collapsed state. The secondary display 90 and the NFC chip 10, the NFC radiator 20, the first radiator 31, and the second radiator 32 are disposed in different parts of the electronic device 100. For example, in one example, when the NFC chip 10, the NFC radiator 20, the first radiator 31, and the second radiator 32 are all disposed on the first portion 101, the sub display 90 is disposed on the second portion 102, as shown in fig. 13. In another example, when the NFC chip 10, the NFC radiator 20, the first radiator 31, and the second radiator 32 are all disposed on the second portion 102, the secondary display screen 90 is disposed on the first portion 101.

In practical applications, in order to avoid that the NFC radiator 20 affects the display performance of the secondary display screen 90, the shape and size of the NFC radiator 20 may be adapted according to the size of the secondary display screen 90.

Compared with the conventional NFC antenna scheme, the antenna design mode of the embodiment of the application can improve the NFC performance by 60% -70% when the electronic equipment 100 is in an unfolding state and can improve the NFC performance by 90% -100% when the electronic equipment 100 is in a folding state for the foldable electronic equipment 100. When the electronic device 100 is in the folded state, as shown in fig. 12 and 13, NFC communication can be implemented on the top, bottom, left side, right side, side of the electronic device 100 where the auxiliary display screen 90 is located, and side opposite to the auxiliary display screen 90, so that six NFC card swiping functions can be supported, and further 360 ° NFC card swiping can be implemented. Therefore, the NFC performance of the electronic device 100 can be greatly improved, the performance is more excellent, and the direction and angle of the handheld device are unlimited when the user swipes the NFC card by the handheld electronic device 100, so that the user can use the handheld device more conveniently and flexibly.

In the description of the present application, it should be understood that terms such as "first," "second," and the like are used merely to distinguish between similar objects and should not be construed to indicate or imply relative importance or implying any particular order of magnitude of the technical features indicated.

It should be noted that, in the embodiment of the present application, the "electrical connection" may be a direct connection between two electrical components to implement electrical connection, or may be an indirect connection to implement electrical connection. For example, the electrical connection between a and B may be a direct connection between a and B, or an indirect connection between a and B via one or more other electrical components.

The electronic device provided by the embodiment of the application is described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application and are provided to aid in the understanding of the present application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims

1. An electronic device, comprising:

the NFC chip is used for providing NFC excitation current;

the NFC radiator is electrically connected with the NFC chip;

2. The electronic device of claim 1, wherein:

The NFC chip comprises a first differential signal end and a second differential signal end, wherein the first differential signal end is used for providing a first NFC excitation current, and the second differential signal end is used for providing a second NFC excitation current;

the first radiator is electrically connected with the first differential signal end and grounded, so that the first radiator transmits the first NFC excitation current;

the NFC radiator and the second radiator are electrically connected with the second differential signal end so as to transmit the second NFC excitation current.

3. The electronic device of claim 2, wherein one end of the NFC radiator is electrically connected to the second differential signal terminal, and the other end of the NFC radiator is electrically connected to the second radiator, and the second radiator is grounded such that the NFC radiator and the second radiator both transmit the second NFC excitation current.

4. The electronic device of claim 2, wherein:

One end of the NFC radiator is electrically connected with the second differential signal end, and the other end of the NFC radiator is grounded so that the NFC radiator transmits the second NFC excitation current;

The second radiator is electrically connected with the second differential signal end and grounded, so that the second radiator transmits the second NFC excitation current.

5. The electronic device of any one of claims 1 to 4, wherein:

The NFC radiator generates a first NFC radiation field, the first radiator generates a second NFC radiation field, and the second radiator generates a third NFC radiation field;

wherein, the first NFC radiation field, the second NFC radiation field and the third NFC radiation field are all at least partially overlapped.

6. The electronic device of claim 5, wherein the second NFC radiation field at least partially overlaps the third NFC radiation field.

7. The electronic device of any one of claims 1 to 4, wherein the NFC radiator is a radiator in the form of an FPC.

8. The electronic device of claim 7, wherein the NFC radiator is elongated or L-shaped.

9. The electronic device of any one of claims 2 to 4, wherein:

The first radiator and the second radiator are arranged on the adjacent side edges of the frame;

The NFC radiator comprises a first strip-shaped part and a second strip-shaped part, the first strip-shaped part is connected with the second strip-shaped part and is perpendicular to the second strip-shaped part, the first strip-shaped part is electrically connected with the second differential signal end, the first strip-shaped part is parallel to the second radiator, and the second strip-shaped part is located between the second radiator and the first strip-shaped part.

10. The electronic device of any one of claims 1-4, further comprising:

the first communication module is used for providing a first non-NFC excitation current;

The first radiator is electrically connected with the first communication module, and the first radiator is further used for transmitting the first non-NFC excitation current so as to support the transmission and/or the reception of a first non-NFC signal.

11. The electronic device of claim 10, wherein the first non-NFC excitation current is an MHB excitation current.

12. The electronic device of claim 10, further comprising a first inductance and a first capacitance, the first inductance being in series between the NFC chip and the first radiator, the first capacitance being in parallel with the first inductance and connected to ground.

13. The electronic device of any one of claims 1-4, further comprising:

the second communication module is used for providing a second non-NFC excitation current;

The second radiator is electrically connected with the second communication module, and the second radiator is further used for transmitting the second non-NFC excitation current so as to support the transmission and/or the reception of a second non-NFC signal.

14. The electronic device of claim 13, wherein the second non-NFC activation current is an LB activation current.

15. The electronic device of claim 13, further comprising a second inductance and a second capacitance, the second inductance being in series between the NFC chip and the NFC radiator, the second capacitance being in parallel with the second inductance and connected to ground.

16. The electronic device of any one of claims 1-4, wherein the bezel is a metal bezel, the metal bezel is provided with a plurality of slits to form a first metal branch and a second metal branch on the metal bezel, the first metal branch forms the first radiator, and the second metal branch forms the second radiator.

17. The electronic device of claim 16, wherein:

the metal frame comprises a first side edge, a second side edge and a third side edge, the first side edge is opposite to the second side edge, and the third side edge is connected between the first side edge and the second side edge;

The first metal branch is formed on the third side edge, and the second metal branch is formed on the first side edge or the second side edge.

18. The electronic device of any one of claims 1-4, further comprising a camera module, wherein the NFC radiator is disposed adjacent to the camera module.

19. The electronic device of any one of claims 1-4, wherein the electronic device is a foldable electronic device comprising a first portion and a second portion, the first portion and the second portion being relatively rotatable to a folded state or an unfolded state;

the NFC radiator, the first radiator and the second radiator are all arranged on the first part or the second part.

20. The electronic device of claim 19, further comprising a secondary display screen;

the NFC radiator, the first radiator and the second radiator are all arranged on the first part, and the auxiliary display screen is arranged on the second part; or alternatively

The NFC radiator, the first radiator and the second radiator are all arranged on the second part, and the auxiliary display screen is arranged on the first part.