CN117995737A

CN117995737A - Substrate position calibration device, method, system, equipment and storage medium

Info

Publication number: CN117995737A
Application number: CN202211337507.7A
Authority: CN
Inventors: 邢玉芝
Original assignee: Changxin Memory Technologies Inc
Current assignee: Changxin Memory Technologies Inc
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2024-05-07

Abstract

The present disclosure relates to a substrate position calibration apparatus, a method, a system, a device, and a storage medium, the substrate position calibration apparatus including a bracket and an image pickup device. The bracket is used for being arranged on the substrate processing machine. The camera device is connected with the bracket, and the camera device is used for being arranged above the top of the process chamber, and is provided with a lens which is used for facing the perspective window of the process chamber. After the robot moving arm moves the substrate into the process chamber, the lens faces the perspective window, so that a detection image of a gap area defined by the edge of the substrate and the datum line of the datum unit can be shot, and the deviation value of the central axis of the substrate and the central axis of the datum unit can be calculated according to the detection image.

Description

Substrate position calibration device, method, system, equipment and storage medium

Technical Field

The present disclosure relates to the field of semiconductor devices, and in particular, to a device, a method, a system, a device, and a storage medium for calibrating a substrate position.

Background

In the conventional technology, a chemical vapor deposition (CVD, chemical vapor deposition) machine is required to move a robot arm to carry a substrate into a process chamber during a substrate transfer operation. However, the substrate placement accuracy in the conventional technology is low, and the robot moving arm needs to carry the substrate repeatedly into the process chamber for observation by naked eyes, so that the operation is complicated.

Disclosure of Invention

Based on this, it is necessary to overcome the defects of the prior art, and to provide a substrate position calibration device, a method, a system, a device and a storage medium, which are convenient for the mutual alignment and calibration of the central axis of the substrate and the central axis of the reference unit, and can improve the accuracy of the substrate placement position and the uniformity of the film thickness in the subsequent process.

The technical scheme is as follows: a substrate position calibration device, the substrate position calibration device comprising:

The bracket is arranged on the substrate processing machine; and

The camera device is connected with the support, the camera device is arranged above the top of the process chamber of the substrate processing machine, the camera device is provided with a lens, and the lens is arranged towards the perspective window of the process chamber.

In one embodiment, the lens is a magnifying lens.

In one embodiment, the image capture device comprises a camera, which is an industrial camera.

In one embodiment, the image pickup device further includes a lens barrel, and a mirror group provided in the lens barrel; the opposite ends of the lens barrel are respectively connected with the camera and the lens, and the reflecting mirror group is used for reflecting the image of the lens to the camera.

In one embodiment, the camera is connected to the bracket, the camera is disposed above a center position of a top of the process chamber, and the lens barrel is rotatably connected to the camera.

In one embodiment, the mirror group includes a first mirror and a second mirror; the lens barrel comprises a first barrel section, a second barrel section and a third barrel section which are sequentially connected; the first barrel section is connected with the camera, the third barrel section is connected with the lens, the first barrel section and the second barrel section are arranged at an included angle, and the second barrel section and the third barrel section are arranged at an included angle; the first reflecting mirror is arranged at the connection part of the first cylinder section and the second cylinder section, and the second reflecting mirror is arranged at the connection part of the second cylinder section and the third cylinder section.

In one embodiment, the second barrel section is a telescopically adjustable barrel section.

In one embodiment, the support includes a sleeve for detachable connection with the substrate processing tool and a support arm coupled to the sleeve, the support arm coupled to the image capture device.

In one embodiment, the stand includes a mounting plate for detachable connection with the substrate processing tool, and a support arm coupled to the mounting plate, the support arm coupled to the image capture device.

In one embodiment, the support arm is provided with a telescopically adjustable arm section.

The substrate processing system comprises a substrate position calibration device, a substrate processing machine table, a robot moving arm and a controller, wherein the substrate processing machine table is provided with a process chamber and a cache chamber, the controller is respectively and electrically connected with the image pick-up device and the robot moving arm, the substrate is arranged on a reference unit of the process chamber, the controller obtains a deviation value of a central axis of the substrate and a central axis of the reference unit according to a detection image of the image pick-up device, adjusts a motion parameter of the robot moving arm according to the deviation value, and controls the robot moving arm to act according to the motion parameter, and the robot moving arm is used for sending the substrate into the process chamber from the inside of the cache chamber or moving the substrate out of the process chamber to the inside of the cache chamber.

In one embodiment, the lens faces the gap area defined by the edge of the substrate and the datum line of the datum unit, and is capable of rotating to a plurality of detection positions around the central axis of the process chamber, the plurality of detection positions are circumferentially arranged in the gap area, and the controller is used for obtaining the deviation value of the central axis of the substrate and the central axis of the datum unit according to the detection images of the plurality of detection positions.

In one embodiment, the substrate processing system further comprises a driving mechanism electrically connected to the controller, the driving mechanism being connected to the image pickup device, the driving mechanism being configured to drive the lens to rotate about a central axis of the process chamber.

In one embodiment, the substrate processing system further comprises an alarm electrically connected to the controller.

A substrate position calibration method, the substrate position calibration method comprising:

Shooting a gap area defined by the edge of the substrate and a datum line of the datum unit to obtain a detection image;

calculating a gap value between the edge of the substrate and a datum line of the datum unit according to the detection image, and determining a deviation value between the central axis of the substrate and the central axis of the datum unit according to the gap value;

when the deviation value is larger than a preset value, moving the substrate in the process chamber out of the buffer chamber by a robot moving arm, and adjusting the motion parameters of the robot moving arm according to the deviation value;

And controlling the robot moving arm to send the substrate into the processing chamber according to the adjusted motion parameters.

In one embodiment, the capturing the gap area defined by the edge of the substrate and the reference line of the reference unit to obtain the detection image includes: rotating the lens around the central axis of the processing chamber to a plurality of detection positions, wherein the plurality of detection positions are circumferentially arranged in the gap area, and respectively shooting at the plurality of detection positions to obtain detection images;

the step of calculating a gap value between the edge of the substrate and the datum line of the datum unit according to the detection image, and the step of determining a deviation value between the central axis of the substrate and the central axis of the datum unit according to the gap value comprises the following steps: and respectively calculating a plurality of clearance values according to the plurality of detection images, and determining a deviation value of the central axis of the substrate and the central axis of the reference unit according to the plurality of clearance values.

In one embodiment, the substrate position calibration method further includes an alarm step: and when the deviation value is larger than a preset value, alarm operation is carried out.

A computer device comprising a memory storing a computer program and a processor implementing the steps of the method when the processor executes the computer program.

A computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of the method.

According to the substrate position calibration device, the method, the substrate processing system, the computer equipment and the computer readable storage medium, after the robot moving arm moves the substrate into the processing chamber, the lens faces the perspective window of the processing chamber, so that a detection image of a gap area defined by the edge of the substrate and the datum line of the datum unit can be shot, the deviation between the central axis of the substrate and the central axis of the datum unit can be calculated according to the detection image, and compared with the mode of observing by naked eyes, the acquired deviation data is more accurate and reliable, and further the reading of the data and the mutual alignment and calibration of the central axis of the substrate and the central axis of the datum unit are facilitated, and the accuracy of the substrate placement position and the film thickness uniformity in the subsequent processing can be improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate and explain the exemplary embodiments of the disclosure and together with the description serve to explain the disclosure, and do not constitute an undue limitation on the disclosure.

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic diagram of a substrate position calibration apparatus according to an embodiment of the disclosure;

FIG. 2 is a schematic diagram of a substrate position calibration apparatus according to another embodiment of the disclosure;

FIG. 3 is a schematic view of a substrate position calibration apparatus according to another embodiment of the disclosure;

FIG. 4 is a schematic view of a substrate position calibration apparatus according to another embodiment of the disclosure;

FIG. 5 is a schematic top view of a substrate placed on a reference unit according to an embodiment of the disclosure;

fig. 6 is a schematic cross-sectional view of fig. 5 at A-A.

10. A bracket; 11. a sleeve; 12. a support arm; 121. an arm segment; 13. a mounting plate; 20. an image pickup device; 21. a lens; 22. a camera; 23. a lens barrel; 231. a first barrel section; 232. a second barrel section; 233. a third barrel section; 24. a mirror group; 241. a first mirror; 242. a second mirror; 25. a bearing; 30. a substrate processing tool; 40. a substrate; 50. a reference unit.

Detailed Description

In order that the above-recited objects, features and advantages of the present disclosure will become more readily apparent, a more particular description of the disclosure will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. The present disclosure may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the disclosure, and therefore the disclosure is not to be limited to the specific embodiments disclosed below.

It should be noted that the substrate in this embodiment may be a semiconductor wafer at any stage in the process of forming semiconductor devices, such as integrated circuits or discrete devices (DISCRETE DEVICES), on a substrate. In one embodiment, the substrate includes an extremely low dielectric constant dielectric layer and a metal layer on a semiconductor substrate. The substrate may be a photomask, semiconductor wafer, or other workpiece known to those of ordinary skill in the art of electronic device manufacturing. In at least some embodiments, the substrate comprises any material used to fabricate any integrated circuit, passive (e.g., capacitor, inductor), and active (e.g., transistor, photodetector, laser, diode) microelectronic elements. The substrate may contain an insulating material (e.g., a dielectric material) that separates such active and passive microelectronic elements from one or more conductive layers formed on top of them. In one embodiment, the substrate is a semiconductor substrate comprising one or more dielectric layers, such as silicon, gallium nitride, gallium arsenide, silicon dioxide, silicon nitride, sapphire, and other dielectric materials. In one embodiment, the substrate is a wafer stack including one or more layers. The wafer of one or more layers may include a conductive layer, a semiconductor layer, an insulating layer, or any combination of the preceding.

Just as the background art, the problem that the precision of base plate placement position is lower and the operation of counterpoint is comparatively loaded down with trivial details among the prior art, wherein, the robot motion arm bears the weight of the whole flow that the base plate sent into the inside process chamber in the prior art includes:

Step S110, a robot moves an arm to bear a substrate, enters the process chamber, places the substrate on a reference unit of the process chamber, and then retreats to the inside of the buffer chamber;

step S120, checking the position of the substrate on the reference unit with naked eyes through a perspective window at the top of the process chamber;

step S130, when deviation exists, estimating the deviation between the center of the substrate and the center of the reference unit;

Step S140, the robot moves the arm to take out the substrate in the process chamber, readjusts the motion parameters at the machine end, and calculates the adjustment value of each motion parameter in millimeter units;

and step S150, repeating the steps S110 to S140 until the center of the substrate is judged to be at the center of the reference unit by naked eyes.

It has been found that the reason for this problem arises is that the positional information acquired in step S120 of the conventional technique is prone to error, and the deviation data in step S130 has no quantization parameter, resulting in insufficient accuracy of the deviation data. In addition, since the adjustment value of the motion parameter is small and repeated confirmation is required. Thus, labor and time are greatly consumed. In addition, if the final alignment position of the substrate center and the heater center is not accurate, parameters such as film thickness of the product will be affected.

Based on the reasons, the invention provides the substrate position calibration device, the method, the system, the equipment and the storage medium, which are convenient for data reading and mutual alignment and calibration of the central axis of the substrate and the central axis of the reference unit, and can improve alignment accuracy and film thickness uniformity.

Referring to fig. 1 to 6, fig. 1 to 4 respectively show structural diagrams of four different embodiments of a substrate position calibration device, fig. 5 shows a schematic top view of a substrate 40 placed on a reference unit 50 according to an embodiment of the present disclosure, and fig. 6 shows a schematic cross-sectional view of fig. 5 at A-A. An embodiment of the present disclosure provides a substrate position calibration device, including: the cradle 10 and the imaging device 20. The support frame 10 is mounted on a substrate processing tool 30. The image pickup device 20 is connected to the support 10, the image pickup device 20 is disposed above the top of a process chamber (not shown in the figure) of the substrate processing machine 30, the image pickup device 20 is provided with a lens 21, and the lens 21 is disposed towards a perspective window (not shown in the figure) of the process chamber, so that the substrate 40 and the reference unit 50 are exposed through the perspective window of the process chamber, and can be photographed by the lens 21 located outside the process chamber to obtain a relevant detection image. Optionally, the see-through window includes, but is not limited to, a transparent cover plate disposed on top of the process chamber. The see-through windows are disposed at the peripheral portion of the process chamber, and may be one, two, three, four, or another number. In addition, the shape of the see-through window includes, but is not limited to, various regular shapes and irregular shapes such as a circle, an ellipse, a polygon, and the like, as long as a gap region between the edge of the substrate 40 and the reference line of the reference unit 50 can be exposed. Wherein polygons include, but are not limited to, triangles, quadrilaterals, pentagons, hexagons, and the like.

In the above-mentioned substrate position calibration device, after the robot moving arm moves the substrate 40 into the process chamber, since the lens 21 faces the perspective window of the process chamber, a detection image of a gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 (i.e. the area of the virtual coil shown in fig. 5) can be captured, and a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the detection image, so that the obtained deviation data is more accurate and reliable compared with a mode of observing by naked eyes, thereby facilitating data reading and mutual alignment and calibration of the central axis of the substrate 40 and the central axis of the reference unit 50, and improving alignment accuracy and film thickness uniformity.

It should be noted that the reference unit includes, but is not limited to, a heater, etc., and may be flexibly adjusted and set according to actual requirements. The reference line of the reference unit 50 may be an edge line of the inner ring of the heater.

In an embodiment of the disclosure, when there is a deviation between the central axis of the substrate and the central axis of the reference unit, the Rng of the thermal image of the substrate is 4.8%, and when the central axis of the substrate and the central axis of the reference unit are aligned with each other, the Rng of the thermal image of the substrate is 2.1%. That is, after the center axis of the substrate 40 and the center axis of the reference unit 50 are aligned with each other, the uniformity of heating of each portion on the surface of the substrate 40 is better, so that the uniformity of film thickness can be improved, and the processing quality of the substrate 40 can be ensured.

Referring to fig. 1, in one embodiment, the lens 21 is an magnifying lens. In this way, since the gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 is small, the gap area is enlarged by the magnifying lens, so that the detection accuracy can be improved. Alternatively, the magnification of the magnifying lens includes, but is not limited to, 10 times, 50 times, 100 times, 500 times, 1000 times, and the like. The diameter size of the lens 21 is, for example, 20mm to 100mm, and is specifically, for example, 50mm. In addition, the lens 21 is provided with an LED light source, and the definition of the detection image can be ensured by irradiating the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50 with the LED light source. The magnifying lens can magnify the gap of the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50, significantly improving accuracy.

In one embodiment, the camera device 20 comprises a camera 22, the camera 22 being an industrial camera, such as an industrial vision positioning camera, i.e. an industrial camera with vision positioning functionality, such as a CCD camera. Thus, when the lens 21 is aligned to the perspective window of the process chamber, the camera 22 captures the edge arc of the substrate 40 and the reference arc of the reference unit 50, then performs a photographing operation, obtains a detection pitch according to the edge arc of the substrate 40 and the reference arc of the reference unit 50 in the photo, and compares the detection pitch with a preset pitch to obtain a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 (i.e. between the center of the substrate 40 and the center of the reference unit 50).

The size of the industrial vision positioning camera in this embodiment is 60mm x 45mm x 20mm, and the pixels are, for example, above 2000 ten thousand pixels, specifically 3800 ten thousand pixels. The field width and the diameter of the lens barrel 23 are kept uniform with the lens 21, for example, 50mm, and the resolution is 3840×2748. Thus, the industrial vision positioning camera can shoot high-definition images.

Referring to any one of fig. 1 to 4, in one embodiment, the image pickup device 20 further includes a lens barrel 23, and a mirror group 24 provided in the lens barrel 23. The opposite ends of the lens barrel 23 are respectively connected with the camera 22 and the lens 21, and the reflector group 24 is used for reflecting the image of the lens 21 to the camera 22. In this way, the image acquired by the lens 21 is reflected by the mirror group 24 and then input to the camera 22.

Referring to any one of fig. 1 to 4, in one embodiment, a camera 22 is connected to the bracket 10, the camera 22 is disposed above a center position of a top of the process chamber, and a lens barrel 23 is rotatably connected to the camera 22. In this way, the lens 21 can be driven to rotate around the central axis of the process chamber, so that the lens 21 can rotate to a plurality of different positions, the detection images of the gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 can be respectively shot at the plurality of different positions, and the deviation between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the plurality of detection images, so that the calibration precision can be improved.

Referring to any one of fig. 1 to 4, specifically, one end of a lens barrel 23 is connected to a lens 21, and the other end is connected to a camera 22 through a bearing 25. The bearing 25 plays a supporting role, and realizes that the other end of the lens barrel 23 and the camera 22 can freely rotate at 360 degrees.

Alternatively, the lens barrel 23 is made of magnesium aluminum alloy material, so that the lens barrel is light, difficult to deform and low in cost. In addition, the bearing 25 is made of ceramic materials, is light in weight, is little affected by expansion caused by heat and contraction caused by cold, and is not easy to deform, so that the detection precision can be ensured.

Referring to any one of fig. 1 to 4, in one embodiment, the mirror assembly 24 includes a first mirror 241 and a second mirror 242. The lens barrel 23 includes a first barrel section 231, a second barrel section 232, and a third barrel section 233, which are sequentially connected. The first barrel section 231 is connected with the camera 22, the third barrel section 233 is connected with the lens 21, the first barrel section 231 and the second barrel section 232 are arranged at an included angle, and the second barrel section 232 and the third barrel section 233 are arranged at an included angle. The first reflecting mirror 241 is disposed at a connection portion between the first barrel section 231 and the second barrel section 232, and the second reflecting mirror 242 is disposed at a connection portion between the second barrel section 232 and the third barrel section 233. In this way, the second mirror 242 reflects the image obtained by the lens 21 to the first mirror 241, and the first mirror 241 reflects the image and vertically irradiates the image to the camera 22, so that the camera 22 captures a detection image.

It should be noted that, the included angle between the first barrel section 231 and the second barrel section 232 is the same as the included angle between the second barrel section 232 and the third barrel section 233, so as to ensure that the first barrel section 231 and the third barrel section 233 are disposed parallel to each other. Optionally, the included angles of the first barrel section 231 and the second barrel section 232 and the included angles of the second barrel section 232 and the third barrel section 233 are, for example, 0 ° to 180 °, specifically, for example, 30 °, 45 °, 60 °, 75 °, 90 °, 120 °, 135 °, 150 °, 160 °, 170 °, and the like, which can be flexibly adjusted and set according to actual requirements, and are not limited herein.

In one embodiment, the angle between the first barrel section 231 and the second barrel section 232, and the angle between the second barrel section 232 and the third barrel section 233 are all obtuse angles. This is advantageous in that the lens 21 is positioned close to the process chamber, and the photographing of the detection image of the gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 is ensured to be clear and reliable.

Referring to fig. 2, in one embodiment, the second barrel section 232 is a telescopically adjustable barrel section, the direction of which is indicated by the double arrow M in fig. 2. In this way, since the second barrel section 232 is telescopically adjustable, the second barrel section 232 is adjusted to hold the lens 21 opposite to the position of the gap region of the edge of the substrate 40 and the reference line of the reference unit 50, so that it is possible to apply to support chambers different in size.

It should be noted that, the "first barrel section 231, the third barrel section 233" may be a part of the "second barrel section 232", that is, the "first barrel section 231, the third barrel section 233" and the "other part of the second barrel section 232" are integrally formed; or a separate component which is separable from the other parts of the second barrel section 232, namely, the first barrel section 231 and the third barrel section 233 can be manufactured independently and then combined with the other parts of the second barrel section 232 into a whole.

Referring to fig. 4, in one embodiment, the bracket 10 includes a sleeve 11 for detachably coupling with a substrate processing tool 30, and a support arm 12 coupled to the sleeve 11. The support arm 12 is connected to the image pickup device 20. In this way, after the bracket 10 is connected to the substrate processing machine 30 by the sleeve 11 in a sleeved manner, the central axis of the sleeve 11 and the central axis of the process chamber are mutually coincident, so that the central axis of the camera 22 on the bracket 10 and the central axis of the reference unit 50 can be ensured to be mutually coincident. In addition, since the sleeve 11 is detachably connected to the substrate processing machine 30, the bracket 10 can be subjected to replacement, maintenance, and the like according to actual demands.

Referring to fig. 1 or 2, in one embodiment, the bracket 10 includes a mounting plate 13 for detachable connection with a substrate processing station 30, and a support arm 12 connected to the mounting plate 13. The support arm 12 is connected to the image pickup device 20. Specifically, the mounting plate 13 is detachably and fixedly mounted to the substrate processing tool 30 using fasteners such as screws, bolts, pins, rivets, magnetic blocks, clips, and the like.

Referring to fig. 3, as an alternative, the mounting plate 13 and the sleeve 11 in the above embodiment may be omitted, and the bracket 10 includes a support arm 12 and is directly detachably connected to the substrate processing apparatus 30 through the bottom end of the support arm 12.

It should be noted that, the "mounting plate 13" may be a "portion of the support arm 12", that is, the "mounting plate 13" is integrally formed with "other portion of the support arm 12"; or a separate component which is separable from the rest of the support arm 12, i.e. the mounting plate 13 may be manufactured separately and then integrated with the rest of the support arm 12.

It should be noted that, the "sleeve 11" may be a "portion of the support arm 12", that is, the "sleeve 11" is integrally formed with "other portion of the support arm 12"; or a separate component which is separable from the rest of the support arm 12, i.e. the sleeve 11 may be manufactured separately and then integrated with the rest of the support arm 12.

Referring to fig. 2, in one embodiment, the support arm 12 is provided with a telescopically adjustable arm segment 121, the direction of which is indicated by the double arrow N in fig. 2. In this way, the length of the support arm 12 can be flexibly adjusted according to the actual requirement by adjusting the length of the arm segment 121 in a telescopic manner, so that the center position of the camera 22 is located right above the center position of the process chamber, that is, coincides with the center axis of the reference unit 50, and can be suitable for being mounted in support chambers with different sizes.

Optionally, the shape of the support arm 12 may be flexibly adjusted and set according to practical requirements, including but not limited to a bent shape, specifically, various regular shapes and irregular shapes such as a C shape, an L shape, and the like.

Referring to fig. 4 to 6, in one embodiment, a substrate processing system includes the substrate position calibration apparatus of any of the above embodiments, and further includes a substrate processing station 30, a robot moving arm, and a controller. The substrate processing tool 30 is provided with a process chamber and a buffer chamber. The controller is respectively and electrically connected with the image pick-up device 20 and the robot moving arm, the substrate is arranged on the reference unit of the process chamber, the controller obtains a deviation value of the central axis of the substrate 40 and the central axis of the reference unit 50 according to the detection image of the image pick-up device 20, adjusts the motion parameter of the robot moving arm according to the deviation value, and controls the robot moving arm to act according to the motion parameter, and the robot moving arm is used for sending the substrate 40 into the process chamber from the inside of the buffer chamber or moving out of the process chamber into the inside of the buffer chamber.

In the above substrate processing system, after the robot moving arm moves the substrate 40 into the process chamber, since the lens 21 faces the perspective window of the process chamber, a detection image of a gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 can be captured, and a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the detection image.

Referring to fig. 5, in one embodiment, the lens 21 faces a gap area (an area shown by a dotted circle in fig. 5) defined by an edge of the substrate 40 and a reference line of the reference unit 50, and is capable of rotating around a central axis of the process chamber to a plurality of detection positions circumferentially disposed in the gap area, and the controller is configured to obtain a deviation value of the central axis of the substrate 40 and the central axis of the reference unit 50 according to detection images of the plurality of detection positions. In this way, the detection images of the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50 are captured at the plurality of different detection positions, and the deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 is calculated from the plurality of detection images, so that the calibration accuracy can be improved. When the reference unit 50 is a heater, the reference line of the reference unit 50 refers to an inner ring edge line of the heater.

Alternatively, the number of detection positions is, for example, two, three, four, five, six or other numbers, and when the number of detection positions is greater, the calibration accuracy is higher, and the single calibration period is correspondingly increased. In the present embodiment, the detection positions are, for example, four, and the four detection positions are arranged at equal intervals so that the rotation angle of the adjacent two detection positions with respect to the lens 21 is 90 °.

Referring to fig. 4 to 6, alternatively, the lens 21 obtains four detection images at four detection positions (respectively shown by four dotted circles in fig. 5), and by analyzing the width values of the gap area defined by the edges of the substrate 40 of the four detection images and the reference line of the reference unit 50, the four width values are respectively denoted as D1, D2, D3 and D4, and determining whether the width values D1, D2, D3 and D4 are equal, if equal, or if the difference ratio of any two width values is less than 0.01%, it indicates that the center position of the substrate 40 and the center position of the heater 50 coincide with each other in the vertical direction; otherwise, it indicates that there is a deviation between the center position of the substrate 40 and the center position of the heater 50 in the vertical direction.

In one embodiment, the substrate processing system further comprises a drive mechanism (not shown). The driving mechanism is electrically connected with the controller, and is connected with the image pickup device 20, and the driving mechanism is used for driving the lens 21 to rotate around the central axis of the process chamber. Specifically, the driving mechanism is, for example, a motor, and is mounted on the support 10 or the substrate processing machine 30, a rotation shaft of the motor is connected to the image pickup device 20 through a transmission element, and when the rotation shaft of the motor rotates, the lens barrel 23 is driven to rotate around a central axis of the process chamber through the transmission element. In this way, under the control of the controller, the driving mechanism drives the lens 21 to rotate around the central axis of the process chamber to a plurality of detection positions, and shooting actions are performed at the plurality of detection positions, so that the degree of automation is high.

It should be noted that, as some alternative solutions, the driving mechanism may be omitted, and a worker directly pushes the lens barrel 23 manually to rotate the lens 21 around the central axis of the process chamber according to the actual requirement.

In one embodiment, the substrate processing system further comprises an annunciator (not shown). The alarm is electrically connected with the controller. Thus, after the controller calculates the deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 according to the detected image, the controller also correspondingly controls the alarm to act, so as to prompt the staff in time. Alerts include, but are not limited to, voice prompts, audible and visual alerts, light alerts, vibration alerts, displays, and the like.

In one embodiment, a substrate position calibration method includes:

Step S210, shooting a gap area defined by the edge of the substrate 40 and a datum line of the datum unit 50 to obtain a detection image;

step S220, calculating a gap value between the edge of the substrate 40 and the reference line of the reference unit 50 according to the detected image, and determining a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 according to the gap value;

step S230, when the deviation value is larger than a preset value, the substrate 40 in the process chamber is moved out to the inside of the buffer chamber by the robot moving arm, and the motion parameters of the robot moving arm are adjusted according to the deviation value;

step S240, controlling the robot moving arm to feed the substrate 40 into the process chamber according to the adjusted motion parameters.

In the above-mentioned substrate position calibration method, after the robot moving arm moves the substrate 40 into the process chamber, since the lens 21 faces the perspective window of the process chamber, a detection image of the gap area defined by the edge of the substrate 40 and the reference line of the reference unit 50 can be captured, and the deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the detection image, so that the obtained deviation data is more accurate and reliable compared with the way of observing by naked eyes, thereby facilitating the reading of the data and the mutual alignment and calibration of the central axis of the substrate 40 and the central axis of the reference unit 50, and improving the alignment accuracy and the uniformity of the film thickness.

In one embodiment, capturing the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50 to obtain the detection image includes: rotating the lens 21 around the central axis of the process chamber to a plurality of detection positions circumferentially arranged in the gap region, and capturing detection images at the plurality of detection positions respectively; calculating a gap value between the edge of the substrate 40 and the reference line of the reference unit 50 from the detected image, and determining a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 from the gap value includes: a plurality of gap values are calculated from the plurality of detection images, respectively, and a deviation value between the center axis of the substrate 40 and the center axis of the reference unit 50 is determined from the plurality of gap values.

In one embodiment, the substrate position calibration method further comprises an alarm step: and when the deviation value is larger than a preset value, alarm operation is also carried out.

In one embodiment, a computer device comprises a memory storing a computer program and a processor that when executing the computer program performs the steps of:

Step S230, when the deviation value is larger than a preset value, the substrate 40 in the process chamber is moved out into the buffer chamber by the robot moving arm, and the motion parameters of the robot moving arm are adjusted according to the deviation value;

In one embodiment, the processor when executing the computer program further performs the steps of:

Photographing the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50 to obtain a detection image includes: rotating the lens 21 around the central axis of the process chamber to a plurality of detection positions circumferentially arranged in the gap region, and capturing detection images at the plurality of detection positions respectively;

Calculating a gap value between the edge of the substrate 40 and the reference line of the reference unit 50 from the detected image, and determining a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 from the gap value includes: a plurality of gap values are calculated from the plurality of detection images, respectively, and a deviation value between the center axis of the substrate 40 and the center axis of the reference unit 50 is determined from the plurality of gap values.

In one embodiment, the processor when executing the computer program further performs the steps of: the substrate position calibration method further comprises the alarm step of: and when the deviation value is larger than a preset value, alarm operation is also carried out.

In one embodiment, a computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:

In one embodiment, the computer program when executed by the processor further performs the steps of:

Photographing the gap region of the edge of the substrate 40 and the reference line of the reference unit 50 to obtain a detection image includes: rotating the lens 21 around the central axis of the process chamber to a plurality of detection positions circumferentially arranged in the gap region, and capturing detection images at the plurality of detection positions respectively;

In one embodiment, the computer program when executed by the processor further performs the steps of: the substrate position calibration method further comprises the alarm step of: and when the deviation value is larger than a preset value, alarm operation is also carried out.

Those skilled in the art will appreciate that implementing all or part of the above-described methods may be accomplished by way of a computer program, which may be stored on a non-transitory computer readable storage medium and which, when executed, may comprise the steps of the above-described embodiments of the methods. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory. By way of illustration, and not limitation, RAM can be in various forms such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc.

In summary, the substrate position calibration apparatus, the substrate position calibration method, the substrate processing system, the computer device and the computer readable storage medium of the present embodiment have at least the following advantages:

1. After the robot moving arm moves the substrate 40 into the process chamber, since the lens 21 faces the perspective window of the process chamber, a detection image of a gap area (i.e., an area of a virtual coil as shown in fig. 5) defined by the edge of the substrate 40 and the reference line of the reference unit 50 can be captured, and a deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the detection image.

2. Since the gap area between the edge of the substrate 40 and the reference line of the reference unit 50 is small, the lens 21 employs the magnifying lens 21, and the gap area is magnified by the magnifying lens 21, so that the detection accuracy can be improved.

3. When the camera 22 captures the edge arc of the substrate 40 and the reference arc of the reference unit 50 when the lens 21 faces the perspective window of the process chamber, a photographing operation is performed, a detection pitch is obtained according to the edge arc of the substrate 40 and the reference arc of the reference unit 50 in the photo, and a deviation between the center of the substrate 40 and the center of the reference unit 50 can be obtained by comparing the detection pitch with a preset pitch.

4. The lens 21 can be driven to rotate around the central axis of the process chamber, so that the lens 21 can rotate to a plurality of different positions, detection images of the gap region between the edge of the substrate 40 and the reference line of the reference unit 50 can be respectively shot at the plurality of different positions, and the deviation between the central axis of the substrate 40 and the central axis of the reference unit 50 can be calculated according to the plurality of detection images, so that the calibration accuracy can be improved.

5. Since the second barrel section 232 is telescopically adjustable, the lens 21 is disposed toward the gap region defined by the edge of the substrate 40 and the reference line of the reference unit 50 by adjusting the second barrel section 232, so that it can be applied to support chambers different in size. The support arm 12 is provided with an arm section 121 of adjustable length, the direction of extension and retraction of which is indicated by the double arrow N in fig. 2. In this way, the length of the support arm 12 can be flexibly adjusted according to the actual requirement by adjusting the length of the arm segment 121 in a telescopic manner, so that the central axis of the camera 22 is located right above the central axis of the process chamber, that is, coincides with the central axis of the reference unit 50, and thus the camera is suitable for being installed in support chambers with different sizes.

6. After the bracket 10 is connected to the substrate processing machine 30 in a sleeved mode through the sleeve 11, the central axis of the sleeve 11 and the central axis of the process chamber are mutually overlapped, so that the central axis of the camera 22 on the bracket 10 and the central axis of the reference unit 50 can be mutually overlapped. In addition, since the sleeve 11 is detachably connected to the substrate processing machine 30, the bracket 10 can be subjected to replacement, maintenance, and the like according to actual demands.

7. Under the control of the controller, the driving mechanism drives the lens 21 to rotate around the central axis of the process chamber to a plurality of detection positions, shooting actions are respectively carried out at the plurality of detection positions, and the degree of automation is high.

8. After the controller calculates the deviation value between the central axis of the substrate 40 and the central axis of the reference unit 50 according to the detected image, the controller also correspondingly controls the alarm to act, so as to prompt the staff in time.

9. The substrate position calibration device, method, substrate processing system, and the like of the present embodiment may be applied to thin film devices in various semiconductor fields, including, but not limited to AMAT producer GT/GT3/XP tools, and the like.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples merely represent several embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Claims

1. A substrate position calibration device, characterized in that the substrate position calibration device comprises:

The bracket is arranged on the substrate processing machine; and

2. The substrate position calibration device of claim 1, wherein the lens is a magnifying lens.

3. The substrate position calibration apparatus according to claim 1 or 2, wherein the image pickup device includes a camera, the camera being an industrial camera.

4. The substrate position calibration apparatus according to claim 3, wherein the image pickup device further comprises a lens barrel, and a mirror group provided in the lens barrel; the opposite ends of the lens barrel are respectively connected with the camera and the lens, and the reflecting mirror group is used for reflecting the image of the lens to the camera.

5. The substrate position calibration apparatus of claim 4, wherein the camera is coupled to the support, the camera is disposed above a center position of a top of the process chamber, and the lens barrel is rotatably coupled to the camera.

6. The substrate position calibration device according to claim 4, wherein the mirror group includes a first mirror and a second mirror; the lens barrel comprises a first barrel section, a second barrel section and a third barrel section which are sequentially connected; the first barrel section is connected with the camera, the third barrel section is connected with the lens, the first barrel section and the second barrel section are arranged at an included angle, and the second barrel section and the third barrel section are arranged at an included angle; the first reflecting mirror is arranged at the connection part of the first cylinder section and the second cylinder section, and the second reflecting mirror is arranged at the connection part of the second cylinder section and the third cylinder section.

7. The substrate position calibration device of claim 6, wherein the second barrel section is a telescopically adjustable barrel section.

8. The substrate position calibration apparatus according to claim 1, wherein the bracket includes a sleeve for detachable connection with the substrate processing station, and a support arm connected to the sleeve, the support arm being connected to the image pickup device.

9. The substrate position calibration apparatus according to claim 1, wherein the bracket includes a mounting plate for detachable connection with the substrate processing station, and a support arm connected to the mounting plate, the support arm being connected to the image pickup device.

10. Substrate position calibration device according to claim 8 or 9, characterized in that the support arm is provided with telescopically adjustable arm segments.

11. The substrate processing system, characterized in that the substrate processing system comprises the substrate position calibration device according to any one of claims 1to 10, the substrate processing system further comprises a substrate processing machine, a robot moving arm and a controller, the substrate processing machine is provided with a process chamber and a buffer chamber, the controller is respectively and electrically connected with the camera device and the robot moving arm, the substrate is arranged on a reference unit of the process chamber, the controller obtains a deviation value of a central axis of the substrate and a central axis of the reference unit according to a detection image of the camera device, adjusts a motion parameter of the robot moving arm according to the deviation value, and controls the robot moving arm to act according to the motion parameter, and the robot moving arm is used for sending the substrate into the process chamber from the inside of the buffer chamber or moving the substrate out of the process chamber from the inside of the process chamber to the inside of the buffer chamber.

12. The substrate processing system of claim 11, wherein the lens is oriented toward a gap region defined by the substrate edge and a datum line of the datum unit and is rotatable about a central axis of the process chamber to a plurality of detection positions disposed circumferentially in the gap region, the controller configured to derive the deviation value of the substrate central axis from the datum unit central axis based on the detected images of the plurality of detection positions.

13. The substrate processing system of claim 12, further comprising a drive mechanism electrically coupled to the controller, the drive mechanism coupled to the image capture device, the drive mechanism configured to drive the lens to rotate about a central axis of the process chamber.

14. The substrate processing system of any of claims 11 to 13, further comprising an alarm electrically coupled to the controller.

15. A substrate position calibration method, characterized in that the substrate position calibration method comprises:

16. The method according to claim 15, wherein capturing the detection image of the gap area defined by the edge of the substrate and the reference line of the reference unit comprises: rotating the lens around the central axis of the processing chamber to a plurality of detection positions, wherein the plurality of detection positions are circumferentially arranged in the gap area, and respectively shooting at the plurality of detection positions to obtain detection images;

17. The substrate position calibration method according to claim 15 or 16, characterized in that the substrate position calibration method further comprises an alarm step: and when the deviation value is larger than a preset value, alarm operation is carried out.

18. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any of claims 15 to 17 when the computer program is executed.

19. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 15 to 17.