CN117991590A - Photosensitive resin composition and photosensitive cured film - Google Patents
Photosensitive resin composition and photosensitive cured film Download PDFInfo
- Publication number
- CN117991590A CN117991590A CN202410037524.1A CN202410037524A CN117991590A CN 117991590 A CN117991590 A CN 117991590A CN 202410037524 A CN202410037524 A CN 202410037524A CN 117991590 A CN117991590 A CN 117991590A
- Authority
- CN
- China
- Prior art keywords
- general formula
- photosensitive
- resin composition
- photosensitive resin
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 32
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 17
- 239000011737 fluorine Substances 0.000 claims abstract description 17
- 238000002834 transmittance Methods 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 15
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003607 modifier Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract 4
- 150000001875 compounds Chemical class 0.000 claims description 37
- 239000010408 film Substances 0.000 claims description 26
- 150000004985 diamines Chemical class 0.000 claims description 24
- -1 fluorine halogen Chemical class 0.000 claims description 16
- 239000000178 monomer Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- 125000004427 diamine group Chemical group 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 125000006159 dianhydride group Chemical group 0.000 claims description 7
- 125000000962 organic group Chemical group 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 230000004580 weight loss Effects 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 claims description 2
- 125000005577 anthracene group Chemical group 0.000 claims description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 239000003759 ester based solvent Substances 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004210 ether based solvent Substances 0.000 claims description 2
- 125000002883 imidazolyl group Chemical group 0.000 claims description 2
- 239000005453 ketone based solvent Substances 0.000 claims description 2
- YXKZOOQDQQINBJ-UHFFFAOYSA-N naphthalene-1,4-dione;azide Chemical group [N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 YXKZOOQDQQINBJ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 125000002971 oxazolyl group Chemical group 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 description 37
- 230000015572 biosynthetic process Effects 0.000 description 34
- 238000003786 synthesis reaction Methods 0.000 description 32
- 239000009719 polyimide resin Substances 0.000 description 25
- 239000000243 solution Substances 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 238000001723 curing Methods 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 12
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 11
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 4
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical class [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 4
- 229940116333 ethyl lactate Drugs 0.000 description 4
- 238000004128 high performance liquid chromatography Methods 0.000 description 4
- 238000013035 low temperature curing Methods 0.000 description 4
- 229940057867 methyl lactate Drugs 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- DQXKOHDUMJLXKH-PHEQNACWSA-N (e)-n-[2-[2-[[(e)-oct-2-enoyl]amino]ethyldisulfanyl]ethyl]oct-2-enamide Chemical compound CCCCC\C=C\C(=O)NCCSSCCNC(=O)\C=C\CCCCC DQXKOHDUMJLXKH-PHEQNACWSA-N 0.000 description 3
- XROLBZOMVNMIFN-UHFFFAOYSA-N 1-(1-benzofuran-4-yl)propan-2-amine Chemical compound CC(N)CC1=CC=CC2=C1C=CO2 XROLBZOMVNMIFN-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 3
- QIKYZXDTTPVVAC-UHFFFAOYSA-N 4-Aminobenzamide Chemical compound NC(=O)C1=CC=C(N)C=C1 QIKYZXDTTPVVAC-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004971 Cross linker Substances 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 101001104570 Homo sapiens Proteasome assembly chaperone 2 Proteins 0.000 description 3
- 102100041008 Proteasome assembly chaperone 2 Human genes 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002808 molecular sieve Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- LDQMZKBIBRAZEA-UHFFFAOYSA-N 2,4-diaminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C(N)=C1 LDQMZKBIBRAZEA-UHFFFAOYSA-N 0.000 description 2
- YQNRVGJCPCNMKT-LFVJCYFKSA-N 2-[(e)-[[2-(4-benzylpiperazin-1-ium-1-yl)acetyl]hydrazinylidene]methyl]-6-prop-2-enylphenolate Chemical compound [O-]C1=C(CC=C)C=CC=C1\C=N\NC(=O)C[NH+]1CCN(CC=2C=CC=CC=2)CC1 YQNRVGJCPCNMKT-LFVJCYFKSA-N 0.000 description 2
- UHIDYCYNRPVZCK-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(N)=CC=1C(C)(C)C1=CC=C(O)C(N)=C1 UHIDYCYNRPVZCK-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 101000838335 Homo sapiens Dual specificity protein phosphatase 2 Proteins 0.000 description 2
- 101001080401 Homo sapiens Proteasome assembly chaperone 1 Proteins 0.000 description 2
- 229960005552 PAC-1 Drugs 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 102100027583 Proteasome assembly chaperone 1 Human genes 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 229920003210 poly(4-hydroxy benzoic acid) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OJASMMNWWIJWFK-KUSCCAPHSA-N (3r)-1-[[4-[[(3r)-3-(diethylcarbamoyl)piperidin-1-yl]methyl]phenyl]methyl]-n,n-diethylpiperidine-3-carboxamide;dihydrobromide Chemical compound Br.Br.C1[C@H](C(=O)N(CC)CC)CCCN1CC(C=C1)=CC=C1CN1C[C@H](C(=O)N(CC)CC)CCC1 OJASMMNWWIJWFK-KUSCCAPHSA-N 0.000 description 1
- LOCTYHIHNCOYJZ-UHFFFAOYSA-N (4-aminophenyl) 4-aminobenzoate Chemical compound C1=CC(N)=CC=C1OC(=O)C1=CC=C(N)C=C1 LOCTYHIHNCOYJZ-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 1
- KKTUQAYCCLMNOA-UHFFFAOYSA-N 2,3-diaminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1N KKTUQAYCCLMNOA-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- KECOIASOKMSRFT-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC(S(=O)(=O)C=2C=C(N)C(O)=CC=2)=C1 KECOIASOKMSRFT-UHFFFAOYSA-N 0.000 description 1
- GPNNOCMCNFXRAO-UHFFFAOYSA-N 2-aminoterephthalic acid Chemical compound NC1=CC(C(O)=O)=CC=C1C(O)=O GPNNOCMCNFXRAO-UHFFFAOYSA-N 0.000 description 1
- IYUOYLLVOZNGKW-UHFFFAOYSA-N 2-azidonaphthalene-1,4-dione Chemical compound C1=CC=C2C(=O)C(N=[N+]=[N-])=CC(=O)C2=C1 IYUOYLLVOZNGKW-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- XRAPKIOOHSMBKO-UHFFFAOYSA-N 3-amino-2-phenylbenzamide Chemical compound NC(=O)C1=CC=CC(N)=C1C1=CC=CC=C1 XRAPKIOOHSMBKO-UHFFFAOYSA-N 0.000 description 1
- GSCPDZHWVNUUFI-UHFFFAOYSA-N 3-aminobenzamide Chemical compound NC(=O)C1=CC=CC(N)=C1 GSCPDZHWVNUUFI-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- WOYZXEVUWXQVNV-UHFFFAOYSA-N 4-phenoxyaniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1 WOYZXEVUWXQVNV-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical class [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- 101710199430 TATA-box-binding protein 2 Proteins 0.000 description 1
- CXISKMDTEFIGTG-UHFFFAOYSA-N [4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxyphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(OC=2C=CC(OC(=O)C=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)=O)=C1 CXISKMDTEFIGTG-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- LBDSXVIYZYSRII-IGMARMGPSA-N alpha-particle Chemical compound [4He+2] LBDSXVIYZYSRII-IGMARMGPSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000011097 chromatography purification Methods 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
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- NQZRCIDIBNDQCG-UHFFFAOYSA-N n-[5-[3-[(1,3-dioxo-2-benzofuran-5-carbonyl)amino]-4-hydroxyphenyl]sulfonyl-2-hydroxyphenyl]-1,3-dioxo-2-benzofuran-5-carboxamide Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(=O)NC=2C(O)=CC=C(C=2)S(=O)(=O)C2=CC=C(C(=C2)NC(=O)C=2C=C3C(=O)OC(=O)C3=CC=2)O)=C1 NQZRCIDIBNDQCG-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- GRJJQCWNZGRKAU-UHFFFAOYSA-N pyridin-1-ium;fluoride Chemical compound F.C1=CC=NC=C1 GRJJQCWNZGRKAU-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- XHFLOLLMZOTPSM-UHFFFAOYSA-M sodium;hydrogen carbonate;hydrate Chemical class [OH-].[Na+].OC(O)=O XHFLOLLMZOTPSM-UHFFFAOYSA-M 0.000 description 1
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Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention relates to the field of high polymer materials, and provides a photosensitive resin composition and a photosensitive curing film, wherein the photosensitive resin composition comprises (a) alkali-soluble resin, (b) a photosensitive agent, (c) a crosslinking agent (d) a bonding modifier and (e) a solvent; wherein the (c) cross-linking agent comprises a cross-linking agent (c 1) with a structure shown in the general formula (1), and the (c 1) accounts for 1-20% of the total mass of the cross-linking agent (c). The invention adopts a certain proportion of cross-linking agent (c 1) in the cross-linking agent to obtain the photosensitive resin composition capable of being cured at low temperature (the curing temperature is less than or equal to 250 ℃), and further, the photosensitive cured film with good light transmittance and heat resistance can be obtained under the condition of not adding fluorine element by optimizing the structure of the alkali-soluble resin.
Description
Technical Field
The invention relates to the field of high polymer materials, in particular to a photosensitive resin composition and a photosensitive cured film.
Background
Polyimide has excellent heat resistance, high insulativity, chemical resistance and mechanical property due to the special aromatic ring conjugation and imide ring structure, and is widely applied to surface passivation layers, stress buffer layers and interlayer insulating layers of semiconductor devices; the method has important application value in the aspects of signal wire distribution, alpha-particle shielding layer, micro solder ball process, stress buffer layer of plastic package circuit, flexible package substrate and the like of advanced semiconductor package (BGA, CSP, siP, WLP and the like); meanwhile, in display devices such as organic EL display devices or liquid crystal display devices, photosensitive polyimide resins are widely used for flat layers and pixel definition layers of display devices to improve interlayer insulation and reduce display color differences.
Because the formation of intramolecular and intermolecular Charge Transfer Complexes (CTCs) is caused by the unique aromatic ring conjugated structure in polyimide structures, the requirement of polyimide materials (PI) requires higher curing temperatures, further limiting their application in more fields such as display devices for organic EL display or liquid crystal display, fan-out wafer packaging (FO-WLP), etc., and how to achieve low-temperature curing is still a problem to be solved.
Disclosure of Invention
The invention provides a photosensitive resin composition and a photosensitive curing film, which solve the problems existing in the prior art.
In a first aspect, the present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a photosensitive compound, (c) a crosslinking agent, (d) an adhesion modifier, and (e) a solvent;
wherein the (c) cross-linking agent comprises a cross-linking agent (c 1) with a structure shown in a general formula (1), and the (c 1) accounts for 1-20% of the total mass of the cross-linking agent (c);
Wherein R 1 represents one of phenyl, naphthalene ring, anthracene ring, imidazole ring, and oxazole ring; r 2＝-R3-NH2 or-R 3-COOH,R3 represents an organic group having 1 to 12 carbon atoms.
The invention adopts a certain proportion of cross-linking agent (c 1) in the cross-linking agent to obtain a photosensitive resin composition which can be cured at low temperature (the curing temperature is less than or equal to 250 ℃); the cross-linking agent (c 1) is a multi-functionality small molecular monomer, can play a role in improving the curing cross-linking degree in the curing process, and is matched with a conventional cross-linking agent to realize low-temperature cross-linking curing; the proportion of the cross-linking agent (c 1) is not easy to be too low, the cross-linking density is too low, and good low-temperature curing characteristics are difficult to realize; too high results in a high curing crosslinking degree and a low heat resistance.
Preferably, the crosslinking agent (c 1) represented by the general formula (1) is selected from the group consisting of:
The crosslinking agent (c) includes, in addition to the crosslinking agent (c 1), a conventional crosslinking agent in the art, that is, a thermally crosslinkable compound capable of undergoing a crosslinking reaction with the alkali-soluble resin. Specifically, the epoxy compound, alkoxymethylol compound and alkoxymethylol triazine compound can be selected from one or more of epoxy compounds, alkoxymethylol compounds and alkoxymethylol triazine compounds; the functionality of the above compound is preferably 2 or more.
Wherein the epoxy group compound is selected from one or more of bisphenol A epoxy resin, bisphenol F epoxy resin and propylene glycol diglycidyl ether.
The alkoxymethylol compound is selected from polyalkoxymethylol phenolic hydroxyl compounds, wherein the phenolic hydroxyl compounds are selected from one or more of Bis-Z、BisP-EZ、BisOPP-Z、BisP-CP、BisP-EZ、TekP-4HBPA、TrisP-HAP、TrisP-PA、Tris-PHBA、TrisP-SA、TrisOCR-PA、BisOCHP-Z、BisP-MZ、BisP-PZ( trade names, manufactured by chemical industry, inc.
The alkoxyl hydroxymethyl triazine ring compound is selected from one or more of compounds shown in a general formula (6);
Wherein R 9 and R 10 each independently represent H, CH 2OCH3 or CH 2OCH2CH3, and are not all H.
According to the photosensitive resin composition provided by the invention, the (a) alkali-soluble resin comprises a compound shown in a general formula (2) and a compound shown in a general formula (3),
Wherein Ar 1 in the general formula (2) represents a dianhydride residue; ar 2 represents a diamine residue, ar 1 and Ar 2 contain at least one phenolic hydroxyl group or one sulfonyl group (-S (=O) 2-);R4 represents H or a fluorine-free organic group with the number of C atoms of 1-10, m is an integer of 10-10000, and r is an integer of 0-2;
Wherein Ar 3 in the general formula (3) represents a dianhydride residue; ar 4 represents a diamine residue, wherein the diamine residue Ar 4 comprises at least two structural units, and one structural unit is shown as a general formula (4) or a general formula (5);
Wherein R 5、R6 in the general formula (4) are the same or different and each independently represents- (CH 2) -or- (CH 2CH2)-;L1、L2、L3、L4) is the same or different and each independently represents H or a non-fluorine halogen element;
Wherein R 7、R8 in the general formula (5) are the same or different and each independently represents- (CH 2) -or- (CH 2CH2)-;L5、L6、L7、L8) is the same or different and each independently represents H or a non-fluorine halogen element;
Ar 1、Ar2、Ar3 and Ar 4 do not contain fluorine.
The "non-fluorine halogen element" mentioned in the above technical scheme means chlorine, bromine or iodine.
The dianhydride residues (Ar 1 and Ar 3) are residues obtained by removing 2 anhydride groups from dianhydride. Such dianhydrides include, but are not limited to, dianhydrides such as pyromellitic dianhydride (PMDA), 3',4' -biphenyl tetracarboxylic dianhydride (s-BPDA), 2, 3',4' -biphenyltetracarboxylic dianhydride (alpha-BPDA), 4' -oxydiphthalic anhydride (ODPA), 3',4' -Benzophenone Tetracarboxylic Dianhydride (BTDA), p-phenylene-bis-trimellitate dianhydride (TAHQ), 3',4,4' -diphenyl sulfone tetracarboxylic dianhydride (BSDA), cyclobutanetetracarboxylic dianhydride (CBDA), cyclohexanedicarboxylic dianhydride (HPMDA), N- [5- [3- [ (1, 3-dioxo-2-benzofuran-5-carbonyl) amino ] -4-hydroxyphenyl ] sulfonyl-2-hydroxyphenyl ] -1, 3-dioxo-2-benzofuran-5-carboxamide and 3, 4-diphenyl sulfone tetracarboxylic dianhydride (DSDA).
The diamine residues (Ar 2 and Ar 4) are residues obtained by removing two amino groups from diamine. Such diamines include, but are not limited to, diamines such as 2, 2-bis (4-hydroxy-3-aminophenyl) propane (BAP), 3 '-diamino-4, 4' -dihydroxydiphenyl sulfone (BAHS), N, N '- [ (1-methylethylene) bis (6-hydroxy-3, 1-phenylene) ] bis [ 3-aminobenzamide, 4' -bis (3-aminophenoxy) diphenylsulfone, 2-bis [3- (4-aminobenzamide) -4-hydroxyphenyl ] propane, 2-bis [3- (4-aminobenzamide) -4-hydroxyphenyl ] sulfone, 2-bis [3- (4-aminobenzamide) -4-hydroxyphenyl ] ether, N- (2-hydroxy-5-amino) phenyl-3-aminobenzamide, N- (5-amino-2-hydroxyphenyl) -4- [2- [4- [ (4-aminophenyl) carbamoyl ] phenyl ] -propan-2-yl ] benzamide, N- (5-amino-2-hydroxyphenyl) -4- [2- [4- [ (4-aminophenyl) carbamoyl ] phenyl ] -sulfone-2-yl ] benzamide, one or more of N- (5-amino-2-hydroxyphenyl) -4- [2- [4- [ (4-aminophenyl) carbamoyl ] phenyl ] -ether-2-yl ] benzamide, 1, 4-p-Phenylenediamine (PDA), m-phenylenediamine (m-PDA), o-phenylenediamine (o-PDA), 4 '-diaminodiphenyl ether (ODA), 4' -diamino-p-terphenyl (DATP), 4 '-diaminodiphenylmethane (MDA), 2' -dimethyl-4, 4 '-diaminobiphenyl (m-TB), p-aminophenyl p-aminobenzoate (APAB), 1, 4-bis (4' -aminophenoxy) benzene (1, 4-APB), 1,3,4-APB:1, 3-bis (4 '-aminophenoxy) benzene (1, 3, 4-APB), 1, 3-bis (3' -aminophenoxy) benzene (1, 3-APB) and 2, 2-bis (4- (4-aminophenoxy) phenyl) propane (BAPP).
Ar 1 and Ar 2 contain at least one phenolic hydroxyl group or one sulfonyl group (-S (=O) 2 -); in particular, the starting dianhydride and diamine used in the formation of the general formula (2) have at least one phenolic hydroxyl group-containing or sulfonyl group-containing (-S (=o) 2 -) structure, and may have both structures, which may be present on one monomer at the same time or on different monomers. In the process of preparing the compound shown in the general formula (2), the mass ratio of the monomer containing phenolic hydroxyl groups and sulfonyl groups or the combination of the phenolic hydroxyl groups and sulfonyl groups to the total monomer is more than or equal to 30 percent.
When R 4 represents H, the alkali-soluble resin is a polyamic acid soluble in an alkali aqueous solution; when R 4 represents an organic group having 1 to 10C atoms, the alkali-soluble resin is an alkali aqueous solution-soluble polyamide ester, and preferably the organic group is an alkyl group.
Due to the special aromatic ring conjugated structure in the polyimide structure, intramolecular and intermolecular Charge Transfer Complexes (CTC) are formed, the light transmittance of a Polyimide (PI) film is greatly influenced, the light transmittance is brown yellow and poor, and the development of the PI film in the photoelectric field is limited; to achieve good solubility in organic solvents and excellent optical properties (e.g., transmittance), improvement in optical properties is often achieved by introducing fluorine or fluorine-containing structures to break the conjugation in the polyimide structure; however, with the increasing environmental awareness, the demand for fluorine-free materials is increasingly emerging.
According to the invention, when the structure contains phenolic hydroxyl, the alkali-soluble resin has better alkali solubility; when the structure contains sulfonyl (-S (=O) 2 -) and alicyclic structure, the organic solvent of the obtained alkali-soluble resin has better solubility and better optical transmittance.
In the specific embodiment of the invention, good alkali solubility is realized by adjusting the structural proportion of the general formula (2) and the general formula (3); by introducing a phenolic hydroxyl group, a sulfonyl group (-S (=o) 2 -) or a combination of both, and a structural unit represented by the general formula (4) or the general formula (5) into the alkali-soluble resin structure, an alkali-soluble resin having good organic solvent solubility is obtained without fluorine.
Specifically, the alkali-soluble resin has good organic solvent solubility, and is soluble in one or more of N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, propylene glycol methyl ether, propylene glycol monoethyl ether, ethylene glycol monomethyl ether, gamma-butyrolactone, methyl lactate, ethyl lactate, propyl lactate and butyl lactate.
In some embodiments of the present invention, the ratio of the compound of formula (2) to the sum of the mass of the compound of formula (2) and the mass of the compound of formula (3) is 10% to 40%.
The research of the invention shows that the compound shown in the general formula (2) is not higher in specific gravity and better in alkali-soluble resin, and the organic solvent solubility and the light transmittance are difficult to be simultaneously achieved when the specific gravity is too high, and alkali dissolution is difficult to be achieved when the specific gravity is too low.
In order to further improve the light transmittance and realize low-temperature curing, the proportion of the diamine monomer forming the general formula (4) and the diamine monomer forming the general formula (5) in the total mass of the diamine monomer is more than or equal to 60 percent in the process of preparing the compound shown in the general formula (3).
In some embodiments of the present invention, the diamine forming formula (4) is selected from the group consisting of:
in some embodiments of the present invention, the diamine structure forming formula (5) is as follows:
The preparation method of the alkali-soluble resin comprises the following steps:
(1) Preparing required diamine (diamine with two ends connected with two amino groups in the general formula (4) or (5)) according to a self-designed structure and process, and performing post-treatment such as purification for later use;
(2) Under the protection of inert gas, sequentially dissolving materials such as phenolic hydroxyl group, sulfonyl (-S (=O) 2 -) monomers, other diamine (optionally added), dianhydride (optionally added) and the like in an organic solvent, obtaining polyimide precursor solution 1 with the solid content of 10-50% through polymerization reaction or obtaining diester solution through esterification of dianhydride and alcohols, and further obtaining polyimide precursor solution 1 with the solid content of 10-50% through further reaction with diamine after acyl chlorination or DCC treatment; materials such as alicyclic diamine (diamine with two ends connected with two amino groups in the general formula (3) or (4)), other diamines (selectively added), dianhydride (selectively added) and the like are sequentially dissolved in an organic solvent, and polyimide solution 2 with the solid content of 10-50% is obtained through high-temperature polymerization reaction; mixing the two materials, and stirring the mixture at room temperature to react to obtain polyimide resin solution (a small amount of copolymerization occurs under normal temperature blending);
(3) And (3) performing resin precipitation by using a precipitant, and filtering, washing and drying to obtain the target alkali-soluble resin.
According to the photosensitive resin composition provided by the invention, the (b) photosensitizer is an azide naphthoquinone type photosensitizer.
The azido naphthoquinone type sensitizer is an esterification combination product of a phenolic hydroxyl group-containing compound and azido naphthoquinone sulfonyl chloride. Wherein the phenolic hydroxyl group-containing compound is selected from one or more of Bis-Z、BisP-EZ、BisOPP-Z、BisP-CP、BisP-EZ、TekP-4HBPA、TrisP-HAP、TrisP-PA、Tris-PHBA、TrisP-SA、TrisOCR-PA、BisOCHP-Z、BisP-MZ、BisP-PZ( trade names, manufactured by chemical industry, n.t.).
According to the photosensitive resin composition provided by the invention, the (d) adhesion modifier comprises, but is not limited to, one or more of the following: gamma-glycidoxypropyl trimethoxysilane (KH 560), gamma-aminopropyl triethoxysilane (KH 550), gamma-aminopropyl trimethoxysilane, vinyl triethoxysilane, p-aminophenyl trimethoxysilane, 3- (m-aminophenoxy) trimethoxysilane, 3-mercaptomethyl trimethoxysilane, 3-mercaptopropyl triethoxysilane.
According to the photosensitive resin composition provided by the invention, the solvent (e) is one or more of ketone solvents, ester solvents, ether solvents, aromatic hydrocarbon solvents and other solvents.
By way of example and not limitation, the ketone solvent is one of acetone, methyl ethyl ketone, methyl propyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone.
The ester solvent is one or more of ethyl acetate, butyl acetate, n-propyl acetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, propylene glycol methyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate and gamma-butyrolactone.
The ether solvent is one or more of propylene glycol methyl ether, propylene glycol monoethyl ether and ethylene glycol monomethyl ether.
The aromatic solvent may be one or more of toluene and xylene.
The other solvent is one or more of N-methylpyrrolidone, tetrahydrofuran, dioxane, N-dimethylformamide, N-dimethylacetamide and dimethyl sulfoxide.
It is understood that, in order to achieve the non-fluorine content of the entire photosensitive resin composition, when the alkali-soluble resin does not contain fluorine, the remaining components do not contain fluorine element either.
In some embodiments of the present invention, the amount of (b) the sensitizer is 0.05 to 50 parts, the amount of (c) the crosslinking agent is 1 to 50 parts, the amount of (d) the adhesion modifier is 0.01 to 10 parts, and the amount of (e) the solvent is appropriately selected according to the solid content of 5 to 40%, with respect to 100 parts of (a) the alkali-soluble resin.
In a second aspect, the present invention provides a photosensitive cured film formed by curing any one of the photosensitive resin compositions described above.
It will be appreciated by those skilled in the art that curing the above-described photosensitive resin composition to form a cured film typically includes some pre-treatment, such as conventionally performed by coating, hot plate baking, exposure to light, development, and then curing. Wherein each step adopts the conventional operation means in the field. For example, coating is performed using a rotational viscometer, and drying is performed using a hot plate to cure under nitrogen.
The photosensitive cured film has good light transmittance and heat resistance due to the specific structure of the alkali-soluble resin in the photosensitive resin composition; the average light transmittance of the photosensitive curing film at 380-780nm is more than or equal to 70%; the thermal weight loss temperature T5 percent is more than or equal to 300 ℃.
The photosensitive cured film of the present invention can be applied to a surface protective film and an interlayer insulating film of a semiconductor element, an insulating layer of an organic electroluminescent element, and an insulating layer of a thin film transistor.
The invention provides a photosensitive resin composition and a photosensitive cured film, wherein a certain proportion of cross-linking agent (c 1) is adopted in the cross-linking agent to obtain the photosensitive resin composition capable of being cured at a low temperature (the curing temperature is less than or equal to 250 ℃), and further, the structure of alkali-soluble resin is optimized, so that the photosensitive cured film with good light transmittance and heat resistance can be obtained under the condition of no fluorine addition.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless specifically indicated, the technical means used in the embodiments of the present invention are conventional means well known to those skilled in the art. Materials and reagents used in the examples of the present invention are available from regular commercial sources unless otherwise specified.
Abbreviations for compounds are referred to in the following examples:
PDA: para-phenylenediamine
BAP 2, 2-bis (4-hydroxy-3-aminophenyl) propane
BAHS 3,3 '-diamino-4, 4' -dihydroxydiphenyl sulfone
ODPA 4,4' -Oxyphthalic anhydride
DSDA 3, 4-diphenyl sulfone tetracarboxylic dianhydride
DMFDEA: n, N' -dimethylformamide diethyl acetal
MAP: m-aminophenol
TrisP-HAP:1, 1-tris (4-hydroxyphenyl) ethane
Synthesis example 1 Synthesis of diamines (I-1) and (I-2)
The synthetic route is as follows:
(1) Synthesis of Compound I-1
Adding 25.4g of compound I-1-1 and 200ml of tetrahydrofuran into a reaction kettle, introducing ammonia gas at room temperature until the pressure is 0.5-1.0 MPa, heating to 200 ℃ for reaction for 6 hours, cooling and decompressing, quenching the reaction by saturated sodium bicarbonate water solution, performing conventional post-treatment, recrystallizing n-heptane to obtain 25.1g of white solid (compound I-1), and performing HPLC:99.6% and yield 87.2%.
The resulting white solid compound I-1 was analyzed by GC-MS, and the M/z of the product was 246.2 (M+).
(2) Synthesis of Compound I-2
The compound I-2 is prepared by adopting the same mechanism, and the yield is low, so that the subsequent synthesis example 9 is currently in a laboratory stage.
Synthesis example 2 Synthesis of diamine (I-3)
The synthetic route is as follows:
(1) Synthesis of Compound I-3-2
Under the protection of nitrogen, 36.0g of compound I-3-1 and 200ml of tetrahydrofuran are added into a reaction bottle, 68.3g of hydrogen fluoride pyridine is added dropwise at the temperature of minus 10-0 ℃, the reaction is carried out for 2 hours after the dropwise addition, saturated sodium bicarbonate aqueous solution is added for quenching reaction, conventional post-treatment is carried out, n-heptane is recrystallized to obtain 30.5g of pale yellow solid (compound I-3-2), and HPLC (high performance liquid chromatography): 99.3% and yield 72.6%.
(2) Synthesis of Compound I-3
Under the protection of nitrogen, 14.2g of ammonium formate, 200ml of methanol, 30.0g of compound I-3-2, 10ml of acetic acid and 0.001g of iridium catalyst (Ir-3) are added into a reaction bottle, reflux reaction is carried out for 8 hours, the temperature is 75 ℃, the temperature is reduced to room temperature, saturated sodium hydroxide aqueous solution is added for quenching, then the conventional post-treatment operation is carried out, dichloromethane dissolution and liquid separation are carried out, chromatographic purification is carried out, and the mixed solution with the volume ratio of n-heptane to toluene being 3:1 is recrystallized, thus obtaining white solid (23.7 g of compound I-3, HPLC:99.8 percent and the yield is 78.5 percent.
The resulting white solid compound I-3 was analyzed by GC-MS, and the M/z of the product was 246.2 (M+).
Synthesis example 3 Synthesis of photosensitizer (PAC-1)
The reaction vessel was purged with nitrogen gas in advance for 30 minutes, then 260g of dioxane (water was removed by molecular sieve in advance for 24 hours), 10.60g (0.025 mol) TrisP-PA (trade name, manufactured by Benzhou chemical) and 20.1g (0.075 mol) azidonaphthoquinone sulfonyl chloride were added, and a mixed solution of triethylamine (6.3 g) -dioxane (20 g) was slowly added dropwise, and the temperature was controlled within 30 ℃; preserving the temperature for 2 hours at 30 ℃ after the dripping is completed; filtering, washing with deionized water for 3 times, washing with dilute hydrochloric acid and deionized water for 3 times respectively, and vacuum drying at 60 ℃ for 24 hours.
Synthesis example 4 Synthesis of photosensitizer (PAC-2)
The sensitizer PAC-2 was prepared by a similar synthesis method to synthesis example 3, substituting TrisP-PA (trade name, manufactured by the state chemistry) with Trisp-HAP (trade name, manufactured by the state chemistry).
Synthesis example 5 Synthesis of crosslinker (C-2-1)
The reaction vessel is exhausted in advance by using nitrogen, after 30min, 200g of water is added, 20g (0.5 mol) of NaOH and 25.8g (0.1 mol) of 1, 1-tris (4-hydroxyphenyl) ethane are respectively added, after the mixture is fully dissolved, 18eq of formaldehyde solution is slowly added dropwise, and the temperature is controlled within 20 ℃; preserving heat for 24 hours at 20 ℃ after the dripping is completed; adding sulfuric acid and water for neutralization to obtain a white product, washing with deionized water for 3 times, and vacuum drying at 50 ℃ for 72 hours;
And (3) reacting the dried white product with methanol at room temperature for 24 hours, and distilling the methanol under reduced pressure to remove the methanol to obtain the cross-linking agent C-2-1.
Synthesis example 6 Synthesis of crosslinker (C-2-2)
Cross-linker C-2-2 was prepared by a similar synthesis as in Synthesis example 5, substituting Trisp-HAP (trade name, manufactured by Benzhou chemical Co., ltd.).
Synthesis example 7 Synthesis of polyimide resin A-1
The reaction vessel was purged with nitrogen in advance, after 30min, 62.62g N-methylpyrrolidone (NMP, water removed by molecular sieves 24h in advance) was added, 3.88g (0.015 mol) BAP was added, respectively, and stirred at 25℃until complete dissolution; 7.17g (0.02 mmol) of DSDA was added thereto, and the mixture was stirred at room temperature for reaction for 12 hours, 1.09g (0.01 mol) of MAP was added thereto, and the mixture was allowed to stand for reaction for 12 hours; adding DMFDEA9.33g, heating to 60 ℃, preserving heat for 4 hours, and cooling to room temperature to obtain resin solution A-1-1;
The reaction vessel was previously vented with nitrogen for 30 minutes, 94.60g N-methylpyrrolidone (NMP, water was removed by molecular sieve 24 hours in advance), 7.39g (0.03 mol) of I-1 was added, stirred at 25℃until completely dissolved, 9.30g (0.03 mmol) of ODPA was added, stirred at room temperature for reaction for 12 hours, 16g of toluene was added, heated to 160℃for refluxing water separation, heat preservation was performed for 4 hours, and cooled to room temperature to obtain resin solution A-1-2;
Blending the resin solution A-1-1 and the resin solution A-1-2 at room temperature, stirring and reacting for 12 hours to obtain polyimide resin solution A-1, putting into 3L deionized water, precipitating, filtering and washing for three times; and (3) drying in vacuum at 80 ℃ for 72 hours to obtain polyimide resin A-1.
Synthesis examples 8 to 12 Synthesis of polyimide resins A-2 to A-6
As shown in Table 1, resin solutions A-2-1, A-3-1, A-4-1, A-5-1 and A-6-1 were prepared by replacing 30 parts of BAP with 30 parts BAHS or PDA, respectively, and following the same formulation and procedure as those of resin solution A-1-1;
60 parts of I-1, I-2, I-3, PDA and PDA are used for replacing 60 parts of I-1, 60 parts of ODPA is used for replacing 60 parts of DSDA, and resin solutions A-2-2, A-3-2, A-4-2, A-5-2 and A-6-2 are prepared according to the same formula and process of the resin solution A-2-1;
Respectively blending the polyimide resin A-2 to the polyimide resin A-6 in the same mode as the polyimide resin A-1-2 and the polyimide resin A-2 to the polyimide resin A-6 in sequence, stirring the polyimide resin A-2 to the polyimide resin A-6 at room temperature for reaction for 12 hours, and then sequentially adding the polyimide resin A-2 to 3L of deionized water, precipitating, filtering and washing the polyimide resin A-2 to the polyimide resin A-6 for three times; vacuum drying at 80 deg.c for 72 hr to obtain polyimide resin A-2-A-6.
Synthesis example 13 Synthesis of polyimide resin A-7
As shown in Table 1, resin solution A-7 was prepared by replacing 30 parts of BAP with 90 parts of PDA, replacing 60 parts of ODPA and 40 parts of DSDA with 100 parts of ODPA and following the same recipe and procedure as resin solution A-1-1;
Stirring and reacting for 12 hours at room temperature to obtain polyimide resin A-7 solution, adding into 3L deionized water, precipitating, filtering and washing for three times; and (3) drying in vacuum at 80 ℃ for 72 hours to obtain polyimide resin A-7.
TABLE 1
Example 1
10G of the polyimide resin A-1 produced in Synthesis example 7, 1g of the PAC-1 produced in Synthesis example 3, 2g of the PAC-2 produced in Synthesis example 4, 0.1g of the silane coupling agent gamma-glycidylether oxypropyl trimethoxysilane, 0.2g of 3, 5-diaminobenzoic acid, 0.8g of the crosslinking agent C-2-1 produced in Synthesis example 5 and 0.2g of the crosslinking agent C-2-2 produced in Synthesis example 6 were dissolved in 30g of gamma-butyrolactone, and the mixture was thoroughly and uniformly mixed to obtain a photosensitive resin composition.
Examples 2 to 4
Examples 2 to 4A photosensitive resin composition was prepared in the same manner as in example 1 except that polyimide resins A-2 to A-4 were used in place of polyimide resin A-1 and 2, 4-diaminobenzoic acid, 2, 3-diaminobenzoic acid and 2, 5-dicarboxylaniline were used in place of 3, 5-diaminobenzoic acid.
Comparative examples 1 to 3
Comparative examples 1 to 3 photosensitive resin compositions were prepared in the same manner as in example 1 except that polyimide resins A-5 to A-7 were used in place of the polyimide resin A-1.
Comparative example 4
A photosensitive resin composition was obtained in the same manner as in example 1 except that 3, 5-diaminobenzoic acid was not added.
The resins A-1 to A-7 obtained in Synthesis examples 7 to 13 were subjected to an organic solvent solubility test, 1g of the resin was weighed and dissolved in 9g of the solvent, and the solubility was observed by stirring for 12 hours, and the results are summarized in Table 2. Wherein, amides: n, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide; ethers: propylene glycol methyl ether, propylene glycol monoethyl ether, ethylene glycol monomethyl ether; esters: gamma-butyrolactone, methyl lactate, ethyl lactate, propyl lactate, butyl lactate.
TABLE 2
The photosensitive resin compositions obtained in each of examples and comparative examples were prepared into photosensitive cured films according to the following production methods, and the properties of the obtained photosensitive cured films were measured according to the methods described below, and the results thereof are summarized in table 3.
Manufacturing a photosensitive curing film: wet film coating is carried out by utilizing a rotary viscometer (Mikasa: MS-B150+DA-60S), a hot plate is pre-dried, and then the wet film is transferred to nitrogen drying for further curing after exposure and development, and is cured for 30-180 min at 150-250 ℃, cooled to room temperature and taken out.
(1) Transmittance (T%)
And testing by adopting an Agilent ultraviolet-visible spectrophotometer Cary4000 and adopting a transmission mode.
(2) Weight loss on heat temperature (T5%)
Adopting a thermogravimetric analyzer (model TGA-55) to measure the thermal decomposition temperature, heating up at a rate of 10 ℃/min, and testing 3-5 mg of the sample; the temperature range is R.T. to 500 ℃.
TABLE 3 Table 3
As can be seen from the data in table 2, the alkali-soluble resin provided by the invention has good solubility in organic solvents, can be well dissolved in solvents such as N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, tetrahydrofuran, propylene glycol methyl ether, propylene glycol monoethyl ether, ethylene glycol monomethyl ether, gamma-butyrolactone, methyl lactate, ethyl lactate, propyl lactate and butyl lactate, and is suitable for an alkali-soluble resin solution with good solubility in organic reagents without fluorine; and provides an environmentally friendly photosensitive resin composition solution.
As can be seen from the data in table 3, the photosensitive resin composition, after being coated by a rotational viscometer, baked by a hot plate, exposed to light, developed and thermally cured under nitrogen, exhibits excellent light transmittance and good heat resistance even when cured at a temperature of 250 ℃ or less, wherein the composition of example 1 was cured at a lower temperature (200 ℃) to thereby achieve good curing and crosslinking effects, and good transmittance and heat resistance were maintained; the average light transmittance (380-780 nm) is more than or equal to 70 percent; the thermal weight loss temperature T5 percent is more than or equal to 300 ℃; the organic electroluminescent device is suitable for a surface protective film and an interlayer insulating film of a semiconductor element, an insulating layer of an organic electroluminescent element and an insulating layer of a thin film transistor.
By selecting a proper alkali-soluble resin and combining different types and proportions of cross-linking agents (the proportion of cross-linking agents (c 1) and (c 2)) to realize low-temperature curing and simultaneously maintain good heat resistance; in addition, by adjusting the structural proportion of the general formula (2) and the general formula (3), phenolic hydroxyl, sulfonyl (-S (=O) 2 -) or the combination of the phenolic hydroxyl and the sulfonyl (-S (=O) 2 -) as well as the structural unit shown in the general formula (4) or the general formula (5) are introduced into the alkali-soluble resin structure, so that good alkali solubility, organic reagent solubility and light transmittance are realized; can be used for solving the problems of poor solubility, low light transmittance, poor heat resistance and the like of the organic solvent without fluorine in the prior art.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a photosensitive agent, (c) a crosslinking agent (d) a bonding modifier, and (e) a solvent;
wherein the (c) cross-linking agent comprises a cross-linking agent (c 1) with a structure shown in a general formula (1), and the (c 1) accounts for 1-20% of the total mass of the cross-linking agent (c);
Wherein R 1 represents one of a phenyl group, a naphthalene ring, an anthracene ring, an imidazole ring, and an oxazole ring; r 2＝-R3-NH2 or-R 3-COOH,R3 represents an organic group having 1 to 12 carbon atoms.
2. The photosensitive resin composition according to claim 1, wherein the crosslinking agent (c 1) represented by the general formula (1) is selected from the group consisting of:
3. the photosensitive resin composition of claim 1, wherein (a) the alkali-soluble resin comprises a compound represented by the general formula (2) and a compound represented by the general formula (3),
Wherein Ar 1 in the general formula (2) represents a dianhydride residue; ar 2 represents a diamine residue, and at least one of Ar 1 and Ar 2 contains a phenolic hydroxyl group or a sulfonyl group; r 4 represents H or a fluorine-free organic group having 1 to 10 carbon atoms; m is an integer of 10 to 10000, and r is an integer of 0 to 2;
Wherein Ar 3 in the general formula (3) represents a dianhydride residue; ar 4 represents a diamine residue, wherein the diamine residue Ar 4 comprises at least two structural units, and one structural unit is shown as a general formula (4) or a general formula (5);
Wherein R 5、R6 in the general formula (4) are the same or different and each independently represents- (CH 2) -or- (CH 2CH2)-;L1、L2、L3、L4) is the same or different and each independently represents H or a non-fluorine halogen element;
Wherein R 7、R8 in the general formula (5) are the same or different and each independently represents- (CH 2) -or- (CH 2CH2)-;L5、L6、L7、L8) is the same or different and each independently represents H or a non-fluorine halogen element;
Ar 1、Ar2、Ar3 and Ar 4 do not contain fluorine.
4. The photosensitive resin composition according to claim 3, wherein the alkali-soluble resin (a) has a ratio of the compound represented by the general formula (2) to the total mass of the compound represented by the general formula (2) and the compound represented by the general formula (3) of 10% to 40%.
5. The photosensitive resin composition according to claim 3 or 4, wherein in the process of preparing the compound represented by the general formula (2), the mass ratio of the monomers containing the phenolic hydroxyl group, the sulfonyl group or the combination thereof to the total monomers is not less than 30%; and/or the number of the groups of groups,
In the process of preparing the compound shown in the general formula (3), the proportion of the diamine monomer forming the general formula (4) and the diamine monomer forming the general formula (5) accounting for more than or equal to 60 percent of the total mass of the diamine monomer.
6. The photosensitive resin composition according to any one of claims 3 to 5, wherein the diamine forming the general formula (4) is selected from the group consisting of:
And/or, the diamine structure forming formula (5) is as follows:
7. The photosensitive resin composition according to any one of claims 1 to 6, wherein the (b) photosensitive agent is an azide naphthoquinone type photosensitive agent;
And/or, the (d) adhesion modifier is selected from one or more of the following: gamma-glycidoxypropyl trimethoxysilane, gamma-aminopropyl triethoxysilane, gamma-aminopropyl trimethoxysilane, vinyl triethoxysilane, p-aminophenyl trimethoxysilane, 3- (m-aminophenoxy) trimethoxysilane, 3-mercaptomethyl trimethoxysilane, 3-mercaptopropyl triethoxysilane;
And/or the (e) solvent is selected from one or more of ketone solvents, ester solvents, ether solvents, aromatic hydrocarbon solvents, and other solvents.
8. The photosensitive resin composition according to any one of claims 1 to 7, wherein the curing temperature of the photosensitive resin composition is 250 ℃ or less.
9. A photosensitive cured film formed by curing the photosensitive resin composition according to any one of claims 1 to 8;
Preferably, the average light transmittance of the photosensitive cured film is more than or equal to 70% at 380-780 nm; the thermal weight loss temperature T5 percent is more than or equal to 300 ℃.
10. The photosensitive cured film according to claim 9, wherein the photosensitive cured film is suitable for a surface protective film and an interlayer insulating film of a semiconductor element, an insulating layer of an organic electroluminescent element, and an insulating layer of a thin film transistor.
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