CN117984230A - Polishing pad recycling and processing device - Google Patents
Polishing pad recycling and processing device Download PDFInfo
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- CN117984230A CN117984230A CN202310164703.7A CN202310164703A CN117984230A CN 117984230 A CN117984230 A CN 117984230A CN 202310164703 A CN202310164703 A CN 202310164703A CN 117984230 A CN117984230 A CN 117984230A
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- 238000005498 polishing Methods 0.000 title claims abstract description 283
- 238000012545 processing Methods 0.000 title claims abstract description 151
- 238000004064 recycling Methods 0.000 title claims abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000005520 cutting process Methods 0.000 claims abstract description 36
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 230000009969 flowable effect Effects 0.000 claims abstract description 3
- 238000009991 scouring Methods 0.000 claims abstract description 3
- 239000012530 fluid Substances 0.000 claims description 32
- 238000003754 machining Methods 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 32
- 230000008569 process Effects 0.000 abstract description 13
- 238000006073 displacement reaction Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000012958 reprocessing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
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- 239000002184 metal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
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- 230000036425 denaturation Effects 0.000 description 1
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- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a polishing pad recycling and processing device, which comprises: a polishing pad having grooves on an upper surface thereof; the workbench is attached to the lower surface of the polishing pad to support the polishing pad and can rotate circumferentially; a bracket with a processing head which can extend into the groove; a liquid delivery unit for delivering liquid to the polishing pad, the liquid being flowable into the grooves; the polishing pad is arranged on the workbench, the workbench or/and the bracket or/and the processing head are movable, the processing head and the groove are relatively displaced along the extending direction of the groove, so that the deepening cutting of the groove by the processing head is realized, the depth of the groove is increased, and at the moment, the liquid wets the surface of the polishing pad or forms scouring and cleaning on the surface of the polishing pad. The invention realizes the online processing of the polishing pad; the inherent structure of the polishing pad is not changed, and the stability of the original process is not affected; the utilization rate of the polishing pad is improved, and the cost of the polishing pad is reduced; the liquid conveying unit can realize the internal cleaning of the grooves of the polishing pad and wash and clean the surface scraps of the polishing pad.
Description
Technical Field
The invention belongs to the field of semiconductor integrated circuit chip manufacturing, and particularly relates to a polishing pad recycling and processing device.
Background
Thinning and planarization techniques are indispensable processes in wafer processing, and in Integrated Circuit (IC) fabrication, they have become an essential technique that is important and interdependent with techniques such as photolithography and etching, and are critical techniques for global planarization of wafers to improve production efficiency and reduce cost. There are a number of thinning techniques such as grinding, polishing, dry polishing, electrochemical etching, wet etching, plasma assisted chemical etching, atmospheric pressure plasma etching, and the like. Planarization techniques include chemical mechanical planarization, electrochemical mechanical planarization, and the like.
The polishing apparatus may be used for thinning and planarization techniques. The mainstream technology of polishing equipment is to apply mechanical polishing or to combine mechanical polishing with other methods such as chemical, electrochemical, etc. to finish the wafer polishing operation. In the polishing process, the wafer is continuously polished under the combined action of the polishing head, the polishing pad, the polishing liquid and the like, so that the polishing head, the polishing pad and the polishing liquid belong to long-term main consumables and can directly influence the polishing yield of the wafer.
In the mass production of semiconductors, improvement of yield and reduction of consumption cost are two conditions of most important importance to enterprises. The polishing pad is the subject of the key discussion of the patent, and at present, the polishing pad on the polishing equipment is still a key part with high replacement frequency, high consumption, low utilization rate and influence on the production cost.
Typically, the upper surface of the polishing pad has grooves, and the polishing process relies on the grooves on the polishing pad to fill with a polishing liquid and other media. When the depth of the groove becomes shallow, the liquid medium in the groove of the polishing pad becomes small, which may cause the functional failure of the polishing head or the deterioration of the stability of the polishing process during polishing, and the stability of the attachment and detachment of the polishing head becomes poor. If the depth of the trench is too large in the initial state, there is a problem in that the process stability is poor and impurities fall into the trench to be difficult to discharge. Therefore, in the practical application process, the equipment man can determine the service life of the polishing pad by a method of determining the machining amount or the depth of the groove, and perform the operation of replacing the new polishing pad.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a polishing pad recycling processing device which can realize processing recycling without detaching a polishing pad from a working platform.
The technical scheme adopted for solving the technical problems is as follows: a polishing pad recycling processing apparatus comprising:
a polishing pad having grooves on an upper surface thereof;
The workbench is attached to the lower surface of the polishing pad to support the polishing pad and can rotate circumferentially;
a bracket with a processing head which can extend into the groove;
a liquid delivery unit for delivering liquid to the polishing pad, the liquid being flowable into the grooves;
The polishing pad is arranged on the workbench, the workbench or/and the bracket or/and the processing head are movable, the processing head and the groove are relatively displaced along the extending direction of the groove, so that the processing head can deepen and cut the groove, the depth of the groove is increased, and at the moment, the liquid wets the surface of the polishing pad or forms scouring and cleaning on the surface of the polishing pad.
Further, the workbench is a polishing bench.
Further, the table tends to be placed horizontally.
Further, the length direction of the support forms a horizontal sliding rail which tends to be parallel to the workbench, and the processing head can translate in the horizontal sliding rail.
Further, the processing head comprises a base, a lifting rail arranged on the base and a movable tool bit capable of translating along the lifting rail.
Further, the movable cutter head rotates to cut the groove.
Further, the maximum outer diameter of the movable cutter head is equivalent to the minimum width of the groove.
Further, the movable tool bit comprises a tool for processing the groove, the tool utilizes mechanical force or the cooperation of the mechanical force and high-pressure impact force to realize the cutting deepening of the groove, or the tool utilizes high-energy burning to cut and deepen the groove, or the tool utilizes high-frequency vibration and mechanical force to cut and deepen the groove.
Further, when the cutter utilizes mechanical force to deepen the cutting of the groove, the fluid spraying device is used in an auxiliary mode so as to remove impurities generated by machining.
Further, the support can be lifted up and down to be close to or far away from the upper surface of the polishing pad.
Further, the support may be rotatable about an axis of the table, the rotatable portion being disposed near a center of the table or radially outward of the table.
Further, the device also comprises a positioning device for determining the position of the processing head relative to the groove.
Further, the positioning device is a feature recognition system.
Further, the feature recognition system is an image recognition system.
Further, a spraying device is included for spraying fluid to the direction of the polishing pad to form a fluid cushion layer between the processing head and the polishing pad.
Further, the fluid is a gas and the fluid cushion is a gas cushion.
Further, a pad conditioner is included that is liftable up and down to be close to or away from the polishing pad, and is at least partially rotatable oscillatable to condition the activated polishing pad.
Further, the pad conditioner has a protective cover with a negative pressure suction port, and when the pad conditioner conditions the activated pad, impurities are sucked from the negative pressure suction port.
Further, the fluid unit and the support are integrally arranged, or the fluid unit is a fluid supply arm, or the fluid unit and the polishing fluid arm are integrally arranged, or the fluid unit and the polishing pad trimmer are integrally arranged.
Further, the outlet of the fluid unit includes an injection port directed toward the upper surface of the polishing pad.
Further, the liquid is deionized water.
Further, the polishing pad processing node acquisition unit is further included and is used for monitoring whether the difference value between the current thickness and the initial thickness of the polishing pad reaches a set threshold value.
The invention also discloses a polishing pad recycling processing method, which comprises the following steps:
monitoring the arrival of the polishing pad at the replacement node;
The polishing pad is kept in a state of being attached to the workbench;
at least a portion of the processing head enters a groove in the surface of the polishing pad;
The workbench is movable, or/and the bracket is movable, or/and the processing head is movable;
the processing head and the groove are relatively displaced along the extending direction of the groove;
The processing head deepens the grooves so that the depth of the grooves increases.
Further, the polishing pad maintains the upper surface in a wet state.
Further, the processing head rotates around the axis of the processing head to deepen and cut the groove.
Further, in the step of the processing head entering the groove on the surface of the polishing pad, the support can be lifted up and down, or the part of the processing head can be lifted up and down.
Further, the support moves in a plane which tends to be parallel to the polishing pad, and the translation of the processing head along the length direction of the support is overlapped, so that the relative displacement of the processing head and the groove along the extending direction of the groove is realized.
Further, the support is movable including rotating circumferentially about the central axis of the table, while the table is rotating or stationary, to effect relative displacement of the processing head and the groove along the direction of extension of the groove.
Further, the groove comprises a circular pattern, the table rotates, and the length direction of the support is relatively static, so that the processing head and the groove are relatively displaced.
Further, the processing head enters a groove in the surface of the polishing pad and descends to a target height.
Further, the processing head enters the groove on the surface of the polishing pad, and the spraying device sprays fluid in the direction of the polishing pad so as to keep the processing head at the target height relative to the groove.
Further, the trench includes a plurality of concentric circle patterns;
The method also comprises the following steps of,
After finishing deepening and cutting a circle of circular pattern grooves, the processing head moves upwards to be separated from the grooves;
the processing head translates to the upper part of the other circle of circular pattern groove and moves downwards to enter the groove;
the processing head and the groove are relatively displaced, so that deepened cutting of the groove is realized;
Repeating the steps until the deepening cutting of all the circular pattern grooves is completed.
Further, the grooves are in strip patterns;
The support moves in a plane which tends to be parallel to the polishing pad, or/and the processing head translates along the length direction of the support so as to realize the relative displacement of the processing head and the strip pattern groove;
and the processing head deepens and cuts the strip pattern grooves.
Further, the grooves are in any pattern;
And establishing a plane coordinate system to realize deepening cutting of grooves with any pattern.
Further, the plane coordinate system is a polar coordinate system taking the workbench as a rotation center, and the workbench rotates or adjusts the processing head to move on the workbench through the rotation adjustment angle theta of the workbench so as to realize deepening cutting of grooves with any pattern.
Further, the plane coordinate system is an xy rectangular coordinate system with an arbitrary origin, and deepened cutting of grooves with arbitrary patterns is realized through movement of the support and the processing head.
The invention has the advantages that 1) the online processing of the polishing pad is realized, and the processing operation can be realized without detaching the polishing pad from the polishing platform; 2) The inherent structure principle of the polishing pad is not changed, the original simple structure is recycled, and the stability of the original process is not affected; 3) The method for realizing the deepened cutting of the groove is simple, quick and effective, and besides the support structure, the original functions and configuration of the workbench can be utilized, including the original mechanical rotation of the workbench, an electric power device, a gas supply device, a liquid supply device, a waste liquid treatment device, software and the like, and the mechanical movement of the auxiliary support and the processing head is used for reprocessing the pattern of the groove on the polishing pad; 4) In the processing process, the original liquid flow device can be utilized to flow liquid to the upper surface of the polishing pad, so that the polishing pad is kept moist, the performance of the polishing pad is kept, the failure of the polishing pad is prevented, the problems of material denaturation, dimensional deformation, performance change and the like caused by excessive temperature rise during reprocessing of the polishing pad are avoided, and meanwhile, the continuous liquid on the upper surface of the polishing pad can clean or remove scraps or impurities generated during cutting reprocessing of the polishing pad; 5) The utilization rate of the polishing pad is improved, and the cost of the polishing pad is reduced; 6) The surface of the wet polishing pad reduces flying of processed scraps into the air while processing the polishing pad, and reduces pollution of processing splash and dust to the polishing environment; 7) Once the liquid outflow of the liquid flowing unit is large, the outflow pressure is large, the water pressure reaches the degree of flushing the polishing pad, the inside of the groove of the polishing pad can be cleaned, the surface scraps of the polishing pad can be flushed and cleaned, and finally the polishing pad can directly enter the recycling working condition without leaving the polishing table; 8) The design of protection casing and negative pressure suction port can in time take out impurity such as piece, water away the polishing pad, and the foreign matter in the polishing pad is got rid of to great degree.
Drawings
FIG. 1 is a schematic view of a polishing system of the present invention.
FIG. 2 is a schematic view of a polishing system of the present invention provided with a polishing pad recycling process apparatus.
Fig. 3 is a cross-sectional view of the polishing pad in an initial state.
Fig. 4 is a cross-sectional view of the polishing pad as it reaches the replacement node.
Fig. 5 is a schematic view of a processing head reworking grooves of a polishing pad.
Fig. 6 is a cross-sectional view of the polishing pad after finishing the reprocessing.
FIG. 7 is a schematic view of a polishing pad recycling apparatus according to a first embodiment of the present invention.
Fig. 8 is a schematic view of a partial structure of a processing head and a horizontal sliding rail in accordance with a first embodiment of the present invention.
Fig. 9 is a schematic top view of a third embodiment of the present invention.
Fig. 10 is a schematic top view of a fourth embodiment of the present invention.
Fig. 11 is a schematic view of a positioning device for a processing head according to a seventh embodiment of the invention.
Fig. 12 is a schematic diagram of a processing head with a liquid flow unit in accordance with an eighth embodiment of the present invention.
Fig. 13 is a top view of a polishing pad according to a ninth embodiment of the invention.
Fig. 14 is a top view of a polishing pad according to a tenth embodiment of the invention.
Fig. 15 is a top view of a polishing pad according to an eleventh embodiment of the invention.
Fig. 16 is a partially enlarged schematic illustration of a pad conditioner in accordance with a sixth embodiment of the invention.
Fig. 17 is a flow chart of a method of controlling the trench trimming in real time.
The device comprises a 1-polishing pad, a 101-lower polishing pad, a 102-upper polishing pad, a 11-groove, a 2-workbench, a 3-support, a 31-horizontal sliding rail, a 4-processing head, a 41-base, a 42-lifting rail, a 43-movable tool bit, a 431-tool, a 6-positioning device, a 7-spraying device, a 81-polishing head, a 82-polishing pad trimmer, a 821-protective cover, a 822-negative pressure suction port and a 83-liquid supply arm.
Detailed Description
In order to make the present invention better understood by those skilled in the art, the following description will make clear and complete descriptions of the technical solutions of the embodiments of the present invention with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
A polishing pad recycling apparatus includes a polishing head 81, a polishing pad conditioner 82, a liquid supply arm 83, a table 2, a polishing pad 1 placed on the table 2, and a holder 3. Wherein the polishing head 81 loads the wafer and applies pressure to the wafer and the polishing pad 1 to perform polishing work. The table 2 is horizontally placed and rotatable in the circumferential direction. The upper surface of the polishing pad 1 is provided with a groove 11, the polishing pad 1 is arranged on the upper surface of the workbench 2 and rotates along with the workbench 2, namely, the lower surface of the polishing pad 1 is attached to the top surface of the workbench 2, so that the workbench 2 plays a role in supporting the polishing pad 1; the liquid supply arm 83 supplies polishing liquid to the polishing pad 1 and fills the upper surface of the polishing pad 1 and the grooves 11; the pad conditioner 82 conditions and activates the upper surface of the polishing pad 1. As shown in fig. 1, the polishing head 81, the pad conditioner 82, the liquid supply arm 83, and the table 2 together complete the entire polishing operation.
In this embodiment, the platen 2 is a polishing platen, and in other embodiments, other polishing pad reworking platforms are also possible.
The longitudinal direction of the support 3 forms a horizontal slide 31, which horizontal slide 31 is parallel to the table 2 or not exactly parallel, but tends to be parallel. The processing head 4 can translate within the horizontal slide 31 so that the processing head 4 can translate radially along the table 2.
Under the combined action of the polishing liquid, the polishing head 81, the wafer, and the pad conditioner 82, the polishing pad 1 is continuously worn down and thinned, and the depth of the groove 11 becomes gradually shallower. Typically, the polishing pad 1 is bonded to the top surface of the platen 2; when the polishing pad 1 reaches the replacement node, the polishing head 81, the polishing pad conditioner 82 and the liquid supply arm 83 do avoiding actions to make room for removing the polishing pad 1; the operator tears the polishing pad 1 from the edge and replaces the polishing pad 1 with a new one.
In the present invention, as shown in fig. 2, a holder 3 and a processing head 4 provided on the holder 3 are introduced, and the processing head 4 can be extended into the groove 11. Therefore, in the state that the polishing pad 1 is placed on the workbench 2, the workbench 2 is moved, or the support 3 is moved, or the processing head 4 is moved, or any two parts of the workbench 2, the support 3 and the processing head 4 are moved, or the workbench 2, the support 3 and the processing head 4 are moved together, so that the processing head 4 and the groove 11 are relatively displaced along the extending direction of the groove 11, and finally the deepening cutting of the processing head 4 on the groove 11 is realized, and the depth of the groove 11 is increased. Therefore, the polishing pad 1 can be reused without tearing off the table 2, and the polishing pad 1 can be put into use again after finishing the processing.
The polishing pad 1 includes an upper polishing pad 102, a lower polishing pad 101, and grooves 11, and the thickness is referred to in describing the polishing pad recycling process with respect to deepening cutting of the grooves 11. As shown in fig. 3, in the initial state, the depth of the groove 11 is h0. As shown in fig. 4, when the polishing pad 1 is worn out by the polishing work, the upper surface gradually descends, so that the overall thickness descends, and the depth of the grooves 11 descends to h1. The depth of the grooves 11 of the polishing pad 1 becomes shallow, affecting the stability of the polishing process, and possibly causing failure of the wafer loading function of the polishing head 81. In general, when the polishing pad 1 reaches the replacement node, it needs to be removed and replaced, and this embodiment provides a processing method for reusing the polishing pad 1, as shown in fig. 5. The polishing pad 1 is kept on the table 2, and the processing head 4 is moved into the groove 11 of the polishing pad 1, thereby deepening the groove 11. By the groove 11 reworking operation, the depth of the groove 11 of the polishing pad 1 is again brought to h0, and the characteristics of the polishing pad 1 are changed to become smaller in overall thickness, unchanged in thickness of the lower polishing pad 101, smaller in thickness of the upper polishing pad 102, and h0 in depth of the groove 11, as shown in fig. 6.
The movement of the table 2 mainly means circumferential rotation of the table 2 around the axis thereof. The movement of the bracket 3 mainly means that the bracket 3 rotates around the axis of the workbench 2, and the rotating part of the bracket is positioned above the workbench 2 and is close to the center of the workbench 2; alternatively, the holder 3 rotates around the axis of the table 2, but its rotating portion is radially outside the table 2. The movement of the processing head 4 mainly means that the processing head 4 translates along the support 3 in a parallel plane above the worktable 2, or that the processing head 4 rotates circumferentially above the worktable 2, or that the processing head 4 moves in another track above the worktable 2.
A polishing pad recycling process comprising the steps of:
monitoring the arrival of the polishing pad 1 at the replacement node; the depth of the grooves 11 of the polishing pad 1 may be used as a monitoring factor, or the polishing time may be used as a monitoring factor;
the polishing pad 1 is kept attached to the table 2; that is, the polishing pad 1 is not required to be removed from the table 2, and the polishing head 81, the pad conditioner 82, and the liquid supply arm 83 are required to be rotated so as not to form a barrier to the polishing pad 1;
A portion of the processing head 4 enters a groove 11 in the surface of the polishing pad 1;
The workbench 2 is movable, the bracket 3 is movable, the processing head 4 is movable, or any two parts of the workbench 2, the bracket 3 and the processing head 4 are movable, or the workbench 2, the bracket 3 and the processing head 4 are jointly movable;
so that the processing head 4 and the groove 11 are relatively displaced along the extending direction of the groove 11;
So that the processing head 4 makes a deepened cut of the groove 11 so that the depth of the groove 11 increases.
The working table 2 is movable, the support 3 is movable, the processing head 4 is movable, or any two parts of the working table 2, the support 3 and the processing head 4 are movable, or in the step of jointly moving the working table 2, the support 3 and the processing head 4, 1) the polishing pad 1 is adhered to the top surface of the working table 2, and the working table 2 can rotate to drive the polishing pad 1 to rotate; 2) The horizontal moving mechanism, namely the arrangement of the horizontal sliding rail 31, can realize the horizontal feeding of the processing head 4; 3) The longitudinal moving mechanism, namely the arrangement of the lifting rail 42, can realize the longitudinal feeding of the part of the processing head 4; the combination of the three degrees of freedom of movement can realize the processing of the grooves 11 of the polishing pad 1 along a certain track by the processing head 4. The working operation can be performed without removing the polishing pad 1 from the table 2.
Example 1
In this embodiment, the deepened cutting of the groove 11 by the machining head 4 is achieved by the movement of the table 2 and the movement of the machining head 4, while the support 3 remains relatively stationary.
Specifically, as shown in fig. 7, the length direction of the bracket 3 forms a horizontal slide rail 31 that is parallel to the table 2, or not completely parallel, but tends to be parallel. The processing head 4 can translate within the horizontal slide 31.
As shown in fig. 8, the machining head includes a base 41, a lifting rail 42 disposed along a height direction of the base 41, and a movable cutter head 43, where the base 41 can translate along the horizontal rail 31, so as to drive the lifting rail 42 and the movable cutter head 43 to translate horizontally in synchronization, the movable cutter head 43 can translate up and down along the lifting rail 42, and the movable cutter head 43 can cut the groove 11 by rotating itself. Specifically, the part of the cutter 431 of the movable cutter 43 may rotate, and the maximum outer diameter of the movable cutter 43 corresponds to the minimum width of the groove 11, specifically, the maximum outer diameter of the cutter 431 corresponds to the minimum width of the groove 11, so that the cutter 431 can smoothly extend into the groove 11.
In order to facilitate the placement of the movable cutter head 43 in the groove 11, the support 3 is designed to be of a structure capable of lifting up and down, so that the movable cutter head 43 is driven by the structure to lift up and down to achieve the purpose of approaching to or keeping away from the upper surface of the polishing pad 1, and the lifting structure of the support 3 can be realized in the prior art and is not repeated. In other embodiments, the movable cutter 43 may be manually inserted into the groove 11, or may be otherwise used, and is not limited to the lifting structure using the stand 3.
In this embodiment, the cutter 431 may be a combination of a conventional cutter (such as a milling cutter, a turning tool, a grinding wheel, etc.) for removing materials by using mechanical force and a fluid spraying device (typically a high-pressure water jet device), that is, the combination of mechanical force and high-pressure impact force is used to remove burrs and burrs generated by processing in real time, especially when the gap between grooves of a polishing pad is narrow and the cutting is easy to generate unevenness, the fluid spraying device can be used for trimming and spraying edges to ensure the flatness of the polishing pad, or an energy applying device (such as a high-energy laser beam, a plasma beam, etc.) for removing materials by using high-energy burning, or a cutter with high-frequency vibration, typically an ultrasonic cutter, is used to realize deepening removal of materials at the bottom of the groove and removal of burrs by using the high-frequency vibration and mechanical external force of the cutter. In the present embodiment, the groove 11 includes a plurality of concentric circle patterns.
The polishing pad processing node acquisition unit is used for monitoring whether the difference value between the current thickness and the initial thickness of the polishing pad reaches a set threshold value or not.
A polishing pad recycling process comprising the steps of:
the polishing pad processing node acquiring unit monitors that the polishing pad 1 reaches the replacement node;
The polishing pad 1 is kept attached to the table 2;
A portion of the processing head 4 enters a groove 11 in the surface of the polishing pad 1; specifically, the stand 3 is swung to the target position and kept at the target position, the base 41 is moved to the position right above the target groove 11 along the horizontal rail 31, and the movable cutter head 43 is translated downward along the elevating rail 42 until the cutter 431 enters the groove 11 and descends to the target height; the target height here refers to the depth to which the final trench 11 is to be reached; the purpose that the machining head 4 enters the groove 11 on the surface of the polishing pad 1 is achieved by lifting the machining head 4 up and down, and in other embodiments, the purpose that the machining head 4 enters the groove 11 on the surface of the polishing pad 1 is achieved by lifting the support 3 up and down, and the movable cutter head 43 does not need to be lifted at this time; the step of lowering the cutter 431 into the groove 11 to the target height may be performed after the table 2 rotates, and it may be gradually lowered to the target depth;
The workbench 2 rotates, the movable cutter head 43 is fixed relative to the bracket 3, but forms relative displacement with the groove 11, namely, the movable cutter head 43 traverses one circle of the circular pattern groove 11, so that deepening cutting of the circle of the groove 11 is realized, and the depth of the groove 11 is increased; in the above process, the movable cutter 43 can realize deepening cutting of the groove 11 without rotating, and can also rotate around the axis of the movable cutter to realize deepening cutting of the groove 11;
after completing the deepening cutting of the round pattern groove 11, the processing head 3 moves upwards to be separated from the groove 11 at the position; at this time, the movable cutter 43 may be kept rotating or may be stopped rotating;
The processing head 4 moves to the position right above the other circle of grooves 11 along the horizontal rail 31, and the movable cutter head 43 moves downwards along the lifting rail 42 until the cutter 431 enters the circle of circular pattern grooves 11 and descends to the target height;
The workbench 2 rotates, the movable cutter head 43 is fixed relative to the bracket 3, but forms relative displacement with the groove 11, namely the movable cutter head 43 traverses one circle of radial circular pattern grooves 11, so that deepening cutting of the groove 11 of the other circle is realized, and the depth of the groove 11 is increased;
The above steps are repeated until the deepened cutting of all the circular pattern grooves 11 is completed.
Example two
In this embodiment, the deepened cutting of the groove 11 by the processing head 4 is achieved by the movement of the table 2, and the relative positions of the support 3 and the processing head 4 are not changed. Here, the machining head 4 is not completely stationary, the tool 431 rotates, and the movable tool bit 43 translates up and down along the elevating rail 42. The length direction of the support 3 is relatively stationary. In this embodiment, the trench 11 includes a graphic pattern.
A polishing pad recycling process comprising the steps of:
Monitoring the arrival of the polishing pad 1 at the replacement node;
The polishing pad 1 is kept attached to the table 2;
A portion of the processing head 4 enters a groove 11 in the surface of the polishing pad 1; specifically, the stand 3 is swung to the target position and kept at the target position, the base 41 is moved to the position right above the target groove 11 along the horizontal rail 31, and the movable cutter head 43 is translated downward along the elevating rail 42 until the cutter 431 enters the groove 11 and descends to the target height; the target height here refers to the depth to which the final trench 11 is to be reached; the movable cutter head 43 translates downwards along the lifting track 42 to enter the groove 11, and can also be realized by lifting the workbench 2;
The workbench 2 rotates, the movable cutter 43 is fixed relative to the bracket 3, but forms relative displacement with the groove 11, namely, the movable cutter 43 traverses one circle of the circular pattern groove 11, so that deepening cutting of the circle of the groove 11 is realized, and the depth of the groove 11 is increased.
Other structures are the same as those of the first embodiment, and will not be described again.
The groove 11 may also be not a complete circular pattern, but an open semi-circular or circular arc.
Example III
In this embodiment, the deepened cutting of the groove 11 by the processing head 4 is achieved by the movement of the support 3 and the movement of the processing head 4, while the table 2 remains relatively stationary.
More specifically, the support 3 moves in a plane that tends to be parallel to the polishing pad 1, and the translation of the processing head 4 along the length direction of the support 3 is superimposed, so that the relative displacement of the processing head 4 and the groove 11 along the extending direction of the groove 11 is achieved.
In the present embodiment, the groove 11 includes a plurality of concentric circle patterns, or is one circular pattern.
Specifically, as shown in fig. 9, the support 3 may rotate around the axis of the workbench 2, the rotating part is disposed near the center of the workbench 2, or the rotating part of the support 3 is vertically connected to the center of the workbench 2, the connection point between the support 3 and the workbench 2 is also located at the center, one end of the support 3 far away from the axis is suspended, and an auxiliary wheel or an auxiliary track may be added, and the specific structure is not limited, so that the relative displacement between the processing head 4 and the groove 11 along the extending direction of the groove 11 is realized.
When the grooves 11 include a plurality of concentric circular patterns, the processing head 4 is translated along the horizontal rail 31 to the grooves 11 of the target radius, completing the deepened cutting of all the grooves 11.
At this time, the table 2 is relatively stationary, and may be rotated in a direction opposite to the rotation direction of the bracket 3.
In other embodiments, the rotating portion of the support 3 may be disposed not in the center but radially outside the table 2, i.e., the other end of the support 3 is rotated around the outer periphery of the table 2 by a large amount, to achieve relative displacement of the processing head 4 and the groove 11.
The deepened cutting of the circular pattern by the processing head 4 can be realized as long as the rotating part of the support 3 rotates around the axis of the table 2.
In other embodiments, a plurality of processing heads 4 may be simultaneously disposed on the horizontal sliding rail 31 of the support 3, and the distance between two adjacent processing heads 4 is adapted to the radial distance between two concentric circles, so that the processing heads 4 do not need to translate along the horizontal sliding rail 31, and the deepening and cutting of the plurality of concentric circle grooves can be completed at one time through the rotation of the workbench.
In other embodiments, the number of the brackets 3 may be increased to two or more, and the brackets 3 may be cut with different positions of the groove deepening.
The specific number of the carriers 3 and the processing heads 4 is not limited.
Example IV
In this embodiment, the deepened cutting of the groove 11 by the processing head 4 is achieved by the movement of the support 3, or by the movement of the processing head 4, or by the overlapping movement of the support 3 and the processing head 4, while the table 2 may be kept relatively stationary or may be rotated.
In this embodiment, the grooves 11 are stripe patterns, as shown in fig. 10.
A polishing pad recycling process comprising the steps of:
Monitoring the arrival of the polishing pad 1 at the replacement node;
The polishing pad 1 is kept attached to the table 2;
A portion of the processing head 4 enters a groove 11 in the surface of the polishing pad 1;
The bracket 3 moves to drive the processing head 4 to translate along the strip-shaped groove 11; or the bracket 3 is placed to a position parallel to the strip-shaped groove 11, and the processing head 4 translates along the length direction of the bracket 3; or the track of the strip-shaped groove 11 is obtained by fitting through the simultaneous movement of the bracket 3 and the processing head 4; realizing the relative displacement of the processing head 4 and the strip pattern groove 11; at the moment, the workbench 2 can be stationary or can rotate, and finally, the strip-shaped track can be obtained through fitting;
the processing head 4 performs deepening cutting on the strip pattern grooves 11.
Example five
The grooves 11 may be formed in any pattern. And establishing a plane coordinate system to realize deepening cutting of grooves with any pattern. In the present embodiment, the planar coordinate system is a polar coordinate system with the table 2 as the rotation center.
By implementing two basic degrees of freedom, namely, the rotation of the worktable 2 and the horizontal movement of the processing head 4, a polar coordinate system with the worktable 2 as a rotation center can be established. The machining track of any graph can be parametrically fitted by adjusting the angle theta through the rotation of the workbench 2 and adjusting the distance R from the machining head 4 to the rotation center O of the workbench 2 through horizontal movement. The optional machining head 4 can be horizontally moved along the horizontal sliding rail 31 and can be adjusted by the support 3, and the R value can be adjusted, so that deepening and cutting of any pattern groove 11 can be realized.
In other embodiments, the planar coordinate system is an xy rectangular coordinate system with an arbitrary origin, and the worktable 2 rotates or adjusts the processing head 4 to move on the worktable 2, so as to realize deepened cutting of the grooves with arbitrary patterns.
Example six
The polishing pad recycling apparatus further comprises a liquid flowing unit, wherein an outlet of the liquid flowing unit faces the upper surface of the polishing pad 1, and the liquid flowing unit is used for flowing liquid to the upper surface of the polishing pad, keeping the upper surface of the polishing pad 1 moist, or allowing the liquid to flow into the grooves. The outlet of the fluid flow unit can comprise a jet orifice, the liquid is jetted to the upper surface of the polishing pad 1, the impact force of the liquid is larger at the moment, the surface of the polishing pad 1 is washed and cleaned, and impurities in the grooves and the surface of the polishing pad can be washed away. The liquid is typically deionized water.
The above-mentioned fluid unit may be independently provided, or may be integrally provided with the bracket 3, and the specific structure is not limited.
The wet polishing pad surface reduces flying of processed scraps into the air while processing the polishing pad 1, and reduces pollution of processing splash and flying dust to polishing environment; meanwhile, the amount of liquid supply and the water pressure for flushing the polishing pad are increased, so that the cleaning of the inside of the groove of the polishing pad can be realized, the surface scraps of the polishing pad can be flushed and cleaned, and finally, the polishing pad can directly enter the recycling working condition without leaving a polishing table.
When the polishing pad 1 is processed or after processing is finished, the phenomenon of flash and trace exists on the groove edge of the polishing pad, and the surface problems such as flash, burr and processing trace can be removed by flattening under the polishing pad trimmer 82. In the present embodiment, the pad conditioner 82 can be lifted up and down so as to be close to or away from the polishing pad 1, and it can swing integrally and the front end is rotated, realizing the conditioning of the polishing pad 1. When the polishing pad 1 is more chipped or the cleaning operation is performed, the dressing head is lifted up, so that a pollution source on the polishing pad 1 can be avoided.
In order to timely discharge the foreign matter generated by flushing the polishing pad, a protective cover 821 for preventing the dust from splashing may be further provided in the region of the processing head 4, and as shown in fig. 16, a negative pressure suction port 822 is provided on the protective cover 821. The negative pressure suction port 822 is closer to the polishing pad 1, and when the debris on the polishing pad 1 is peeled off the polishing pad 1, the negative pressure suction port 822 starts the negative pressure suction function to suck the debris, water and other impurities away from the polishing pad 1, so that the foreign matters in the polishing pad 1 are removed to a large extent.
Example seven
As shown in fig. 11, a polishing pad recycling apparatus further includes a positioning device 6 for determining a position of the processing head 4 with respect to the groove 11, in accordance with any one of the first to sixth embodiments. The position of the processing head 4 relative to the groove 11 may also include a depth position, in other words, a determination as to whether the tool 431 is lowered to a target height after entering the groove 11.
Since the dimensions of the polishing pad 1 such as the mounting position on the table 2 and the distribution position of the grooves 11 have a certain tolerance, the position of the grooves 11 and the movement path of the processing head 4 need to be preferably checked by the processing head 4. In this embodiment, a positioning device 6 may be placed on the processing head 4, where the positioning device 6 is a feature recognition system, which may be an image recognition system, and specifically may be a camera or a groove detection device, which is connected to an optical fiber, and outputs a depth relative value outwards by using image recognition.
When the camera feeds back the track and position information of the groove 11, the current position of the processing head 4 relative to the polishing pad 1 and the groove 11 can be identified after image processing, so that the position of the groove 11 and the moving position of the processing head 4 can be confirmed in real time. Meanwhile, a groove depth detection device can be arranged on the processing head 4, so that the longitudinal feed amount and the moving distance of the processing groove can be accurately judged.
Fig. 17 is a flow chart of a method for controlling the trench trimming in real time. The workbench 2 stops rotating, the polishing pad trimmer 82 is started, the camera at the top starts recording the pattern of the polishing pad groove 11, the outline of a certain circular groove 11 and the coordinate positions of all pixel points of the outline are calculated through image processing, and further, the coordinate of the center position of the groove 11 which is intersected with the vertical projection of the bracket 3 is calculated to be the tool dropping point of the tool 431. The cutter 431 moves to the cutter-falling position and descends into the groove 11, and whether the cutter 431 bottoms out or not is judged according to force feedback of the lifting rail 42, and the cutter 431 moves downward by a preset depth to be cut. The table 2 starts to rotate, the camera calculates the position of the groove 11 in the field of view in real time, marks the position of 5x5 pixel groups on the groove 11 that is about to reach the tool 431, and calculates the average position of these pixels. The difference between the position coordinates of the tool 431 and the average position point of the pixel point group to be reached is the position to be moved at the next moment of the tool 431. The motion of the tool 431 is controlled by the PID algorithm to reach the corresponding pixel position. After the position of the tool 431 is adjusted, the above steps are circulated until the finishing of the groove is completed.
Example eight
As shown in fig. 12, a polishing pad recycling apparatus further includes, in addition to any of the first to seventh embodiments, a spraying device 7 for spraying a fluid toward the direction in which the polishing pad 1 is located, thereby forming a fluid cushion layer between the processing head 4 and the polishing pad 1.
The fluid injected may be a gas and the corresponding fluid cushion may be a gas cushion.
When the processing head 4 enters the groove 11 on the surface of the polishing pad 1, the spraying device 7 continuously outputs fluid close to the nozzle of the polishing pad 1, the fluid can be gas, namely, the fluid cushion layer is a gas cushion layer, at the moment, a stable airflow space is formed between the processing head 4 and the polishing pad 1, so that the processing head 4 is similar to an air cushion suspension state and is stably kept at a certain height, and the processing head 4 is kept at a target height relative to the groove 11, namely, the fluid cushion layer supports the processing head 4 upwards. And meanwhile, the stable height can be adjusted by adjusting the output quantity of the fluid, the metal processing head 4 and the polishing pad 1 can be isolated, and other metal pollution and the like are avoided.
Example nine
As shown in fig. 13, in the present embodiment, the grooves 11 on the polishing pad 1 include a plurality of concentric circle patterns.
In this case, the deepening cutting may be performed by any one method or a combination of methods of the first to eighth embodiments, for example, the polar coordinate system of the fifth embodiment, which is not particularly limited.
Examples ten
As shown in fig. 14, in the present embodiment, the grooves 11 on the polishing pad 1 include a plurality of concentric circular patterns, and a stripe pattern extending outward from the center of the table 2.
In this case, the deepening cutting may be performed by any one method or a combination of methods of the first to eighth embodiments, for example, the polar coordinate system of the fifth embodiment, which is not particularly limited.
Example eleven
As shown in fig. 15, in the present embodiment, the grooves 11 on the polishing pad 1 include a plurality of stripe patterns arranged in a zigzag intersecting manner.
In this case, the deepening cutting may be performed by any one method or a combination of methods of the above-described embodiment one to embodiment eight, for example, the xy rectangular coordinate system of embodiment five, and is not particularly limited.
The foregoing detailed description is provided to illustrate the present invention and not to limit the invention, and any modifications and changes made to the present invention within the spirit of the present invention and the scope of the appended claims fall within the scope of the present invention.
Claims (22)
1. A polishing pad recycling apparatus, comprising:
a polishing pad having grooves on an upper surface thereof;
The workbench is attached to the lower surface of the polishing pad to support the polishing pad and can rotate circumferentially;
a bracket with a processing head which can extend into the groove;
a liquid flow unit for delivering liquid to the polishing pad, the liquid being flowable into the grooves;
The polishing pad is arranged on the workbench, the workbench or/and the bracket or/and the processing head are movable, the processing head and the groove are relatively displaced along the extending direction of the groove, so that the processing head can deepen and cut the groove, the depth of the groove is increased, and at the moment, the liquid wets the surface of the polishing pad or forms scouring and cleaning on the surface of the polishing pad.
2. The polishing pad recycling apparatus according to claim 1, wherein: the workbench is a polishing bench.
3. The polishing pad recycling apparatus according to claim 1 or 2, wherein: the table tends to lie horizontally.
4. The polishing pad recycling apparatus according to claim 1, wherein: the length direction of the support forms a horizontal sliding rail which tends to be parallel to the workbench, and the processing head can translate in the horizontal sliding rail.
5. The polishing pad recycling apparatus according to claim 1 or 4, wherein: the processing head comprises a base, a lifting rail arranged on the base and a movable tool bit capable of translating along the lifting rail.
6. The polishing pad recycling apparatus according to claim 5, wherein: the movable cutter head rotates to cut the groove.
7. The polishing pad recycling apparatus according to claim 5, wherein: the maximum outer diameter of the movable cutter head is equivalent to the minimum width of the groove.
8. The polishing pad recycling apparatus according to claim 5, wherein: the movable cutter head comprises a cutter for processing the groove, the cutter utilizes mechanical force or the cooperation of the mechanical force and high-pressure impact force to realize the cutting deepening of the groove, or the cutter utilizes high-energy burning to cut the groove, or the cutter utilizes high-frequency vibration and the mechanical force to cut the groove deepen.
9. The polishing pad recycling apparatus according to claim 8, wherein: when the cutter utilizes mechanical force to realize deepening of the groove, the fluid injection device is used in an auxiliary mode so as to remove impurities generated by machining.
10. The polishing pad recycling apparatus according to claim 1 or 2, wherein: the support can be lifted up and down to be close to or far away from the upper surface of the polishing pad.
11. The polishing pad recycling apparatus according to claim 1 or 2, wherein: the support is rotatable about an axis of the table, the rotatable portion being disposed near a center of the table or radially outward of the table.
12. The polishing pad recycling apparatus according to claim 1 or 2, wherein: and the positioning device is used for determining the position of the processing head relative to the groove.
13. The polishing pad recycling apparatus according to claim 12, wherein: the positioning device is a feature recognition system.
14. The polishing pad recycling apparatus according to claim 13, wherein: the feature recognition system is an image recognition system.
15. The polishing pad recycling apparatus according to claim 1 or 2, wherein: and a spraying device for spraying fluid to the direction of the polishing pad so as to form a fluid cushion layer between the processing head and the polishing pad.
16. The polishing pad recycling apparatus according to claim 15, wherein: the fluid is a gas and the fluid cushion is a gas cushion.
17. The polishing pad recycling apparatus according to claim 1, wherein: also included is a pad conditioner that is liftable up and down to be closer to or farther from the polishing pad, and is at least partially rotatable oscillatable to condition the activated polishing pad.
18. The polishing pad recycling apparatus according to claim 17, wherein: the polishing pad conditioner also comprises a protective cover, wherein the protective cover is provided with a negative pressure suction port, and impurities are sucked from the negative pressure suction port when the polishing pad conditioner trims and activates the polishing pad.
19. The polishing pad recycling apparatus according to claim 1, wherein: the liquid flowing unit and the support are integrally arranged, or the liquid flowing unit is a liquid supply arm, or the liquid flowing unit and the polishing liquid arm are integrally arranged, or the liquid flowing unit and the polishing pad trimmer are integrally arranged.
20. The polishing pad recycling apparatus according to claim 1, wherein: the outlet of the fluid unit includes an injection port facing the upper surface of the polishing pad.
21. The polishing pad recycling apparatus according to claim 1, wherein: the liquid is deionized water.
22. The polishing pad recycling apparatus according to claim 1, wherein: a polishing pad processing node acquisition unit is also included for monitoring whether the difference between the current thickness and the initial thickness of the polishing pad reaches a set threshold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2023/130138 WO2024099302A1 (en) | 2022-11-07 | 2023-11-07 | Polishing pad recycling processing device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222989909 | 2022-11-07 | ||
| CN2022229899097 | 2022-11-07 |
Publications (1)
| Publication Number | Publication Date |
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| CN117984230A true CN117984230A (en) | 2024-05-07 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310164703.7A Pending CN117984230A (en) | 2022-11-07 | 2023-02-10 | Polishing pad recycling and processing device |
| CN202311293600.7A Pending CN117245557A (en) | 2022-11-07 | 2023-10-08 | Method for finishing grooves of polishing pad of CMP (chemical mechanical polishing) equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311293600.7A Pending CN117245557A (en) | 2022-11-07 | 2023-10-08 | Method for finishing grooves of polishing pad of CMP (chemical mechanical polishing) equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN117984230A (en) |
| WO (2) | WO2024099302A1 (en) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004342985A (en) * | 2003-05-19 | 2004-12-02 | Nec Yamagata Ltd | Polishing device and method for dressing polishing pad |
| CN102554788B (en) * | 2010-12-23 | 2015-01-07 | 中芯国际集成电路制造(北京)有限公司 | Dressing method of polishing pad |
| JP2014054719A (en) * | 2012-09-14 | 2014-03-27 | Toho Engineering Kk | Polishing pad reproduction processing apparatus |
| US20140273752A1 (en) * | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Pad conditioning process control using laser conditioning |
| CN103240675B (en) * | 2013-05-20 | 2015-07-01 | 湘能华磊光电股份有限公司 | Disc trimming cutter and disc trimming method based on same |
| US9486893B2 (en) * | 2014-05-22 | 2016-11-08 | Applied Materials, Inc. | Conditioning of grooving in polishing pads |
| CN207448221U (en) * | 2017-11-14 | 2018-06-05 | 德淮半导体有限公司 | Grinding mat trimmer and chemical mechanical polishing device |
| TWI820308B (en) * | 2019-03-21 | 2023-11-01 | 美商應用材料股份有限公司 | Monitoring of polishing pad texture in chemical mechanical polishing |
| CN114126803A (en) * | 2019-05-07 | 2022-03-01 | Cmc材料股份有限公司 | Chemical mechanical planarization pad with fixed trench volume |
| CN110303426A (en) * | 2019-06-25 | 2019-10-08 | 德淮半导体有限公司 | Improve the method and grinding device of grinding efficiency |
| CN112975749A (en) * | 2019-12-17 | 2021-06-18 | 大量科技股份有限公司 | Method for instantly reconditioning polishing pad |
| CN111230723B (en) * | 2020-02-25 | 2022-02-08 | 上海华虹宏力半导体制造有限公司 | Real-time detection system, real-time detection method and chemical mechanical polishing equipment |
| CN111775044A (en) * | 2020-07-02 | 2020-10-16 | 长江存储科技有限责任公司 | Polishing pad dressing apparatus and polishing pad dressing method |
| CN112207877B (en) * | 2020-09-07 | 2022-04-26 | 中国工程物理研究院激光聚变研究中心 | Method for generating spiral groove on surface of asphalt polishing disc in annular polishing |
| CN114083427B (en) * | 2022-01-24 | 2022-05-17 | 杭州众硅电子科技有限公司 | Polishing pad surface condition online detection method and detection system |
-
2023
- 2023-02-10 CN CN202310164703.7A patent/CN117984230A/en active Pending
- 2023-10-08 CN CN202311293600.7A patent/CN117245557A/en active Pending
- 2023-11-07 WO PCT/CN2023/130138 patent/WO2024099302A1/en unknown
- 2023-11-07 WO PCT/CN2023/130157 patent/WO2024099307A1/en unknown
Also Published As
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|---|---|
| WO2024099307A1 (en) | 2024-05-16 |
| CN117245557A (en) | 2023-12-19 |
| WO2024099302A1 (en) | 2024-05-16 |
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