CN117977250A - Miniature high-integration compressible cable assembly, processing method thereof and interconnection array - Google Patents
Miniature high-integration compressible cable assembly, processing method thereof and interconnection array Download PDFInfo
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- CN117977250A CN117977250A CN202410157158.3A CN202410157158A CN117977250A CN 117977250 A CN117977250 A CN 117977250A CN 202410157158 A CN202410157158 A CN 202410157158A CN 117977250 A CN117977250 A CN 117977250A
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- 238000003672 processing method Methods 0.000 title abstract description 9
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 239000012212 insulator Substances 0.000 claims description 51
- 229920006335 epoxy glue Polymers 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 15
- 229920002379 silicone rubber Polymers 0.000 claims description 15
- 238000002788 crimping Methods 0.000 claims description 10
- 239000011229 interlayer Substances 0.000 claims description 8
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention provides a miniature high-integration compressible cable assembly, a compressible multi-point interconnection array and a processing method thereof. The cable assembly includes a flexible connection portion; and hard connecting parts connected to both ends of the soft connecting part. The hard connecting parts at the two ends can float and stretch in a preset range, so that the floating requirement of the electric connector in the subsequent use process is met. The hard connecting part at one end of the soft connecting part is a connector for plugging an external universal interface. The hard connecting part at the other end of the soft connecting part is a nonmetal connecting body embedded with a miniature printed board. The I end of the nonmetallic connector is connected with the flexible connecting part; the II end of the non-metal connector is output as a plurality of pins, and the pins are inserted into the printed circuit board and welded. According to the invention, the printed board is innovatively introduced into the cable assembly, the printed board is used as a switching medium to realize switching of 8 hole sites of the cable assembly corresponding to 2 hole sites of the wiring terminal, and the conductor bundles of the cable assembly are preformed to realize compressibility.
Description
Technical Field
The invention belongs to the field of cable connection, and particularly relates to a miniature high-integration compressible cable assembly, a processing method thereof and an interconnection array.
Background
At present, the connector installed on the equipment panel is more and more miniaturized and densely packed, how to realize 4-to-1 or 2-to-1 of electric signals in a short space (such as in a height range less than 5 mm), and has compressibility is a very troublesome problem, and conventional switching modes, such as branching ring switching, U-shaped lap joint and other switching modes, have certain difficulties in realizing switching and compression functions in the space, and the specific difficulties are as follows: 1. the wire-dividing ring is adopted for switching, the space required by switching the wire-dividing ring is about 30mm due to the length of the wire-dividing ring, the existing space requirement cannot be met, and the wire-dividing ring cannot meet the requirement of compressibility due to the fact that the wire-dividing ring does not have compressibility; 2. the U-shaped lap joint is adopted for switching, the space required by the U-shaped lap joint is about 30mm, the existing space requirement cannot be met, the cable assembly is required to have compressibility, the welding spots are likely to be damaged in the compression and stretching process, and the requirement of the compressibility cannot be met.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a miniature high-integration compressible cable assembly, a processing method thereof and an interconnection array, wherein a printed board is introduced into the cable assembly, the printed board is used as a switching medium to realize switching of 8 hole sites of the cable assembly corresponding to 2 hole sites of a connecting terminal, and a wire bundle of the cable assembly is preformed to realize compressibility.
The invention relates to a miniature high-integration compressible cable assembly, which comprises a wire soft connecting part and hard connecting parts connected with two ends of the wire soft connecting part, wherein the hard connecting parts can float and stretch in a preset range; the hard connecting part positioned at one end of the soft connecting part of the lead is a connector for plugging an external universal interface; the hard connecting part at the other end of the soft connecting part of the lead is a nonmetal connecting body embedded with a miniature printed board; the I end of the nonmetal connector is connected with the flexible lead connecting part, the II end of the nonmetal connector is output into a plurality of pins, and the pins are inserted into the printed circuit board and welded.
Further, the soft wire connecting part is a wire bundle consisting of a plurality of wires; the connector includes a housing, a first insulator fitted within the housing, and a first contact fitted within the first insulator; the first contact is in pressure connection with the wire bundle; and pouring glue solution in the inner cavity of the shell.
Further, the nonmetallic connector comprises a second insulator, a second contact and a miniature printed board; the second insulator is provided with an inner cavity A and an inner cavity B, the second contact is in crimping connection with the wire bundle, and then the second contact after crimping is installed in the inner cavity A of the second insulator; the second contact piece is led into N wires in the wire bundle and led out of N pins; the miniature printed board is welded with the wire bundle, and is fixed in the inner cavity B; the miniature printed board comprises eight small hole sites and two large hole sites; the internal links of every four small hole sites are communicated with one large hole site, and the eight small hole sites are respectively connected with the corresponding hole sites of the connector through conductor bundles, so that the switching of the four small hole sites of the connector to the single hole site of the nonmetallic connector is realized; the inner cavity B is led into eight wires in the wire bundle, the eight wires are divided into positive and negative groups, each group of four wires are homopolar wires, each group of four wires is led out of 1 stitch, and 2 stitches are all arranged.
Further, the wire harness is shaped in a U-shape, a wave shape, an S-shape or a C-shape such that a predetermined range of floating space exists between the connector and the nonmetallic connector.
The processing method of the miniature high-integration compressible cable assembly comprises the following steps:
And step one, crimping the first contact piece with the wire bundle to form the first contact piece in the first state.
And step two, assembling the first contact piece in the first state into the first insulator to form the first insulator in the first state.
And step three, assembling the first insulator in the first state into the shell to form the shell in the first state.
And fourthly, encapsulating glue solution in the inner cavity of the shell in the first state to form the connector in the first state.
And fifthly, crimping the second contact piece with the wire bundle led out by the connector in the first state to form the second contact piece in the first state.
Step six, assembling the second contact piece in the first state into the inner cavity A of the second insulator; and welding the miniature printed board with the tail end of the wire bundle, and fixedly installing the miniature printed board in the inner cavity B of the second insulator to form the second insulator in the first state.
And step seven, pouring sealant in the second insulator in the first state to form a nonmetal connector embedded with the miniature printed board.
And step eight, correspondingly inserting the lead wire of the nonmetal connector embedded with the miniature printed board and the four fine wires into the printed circuit board by changing the four fine wires into one thick wire, and welding.
And step six, welding the miniature printed board with the tail ends of the wire bundles, coating the front and back sides of each wire of the wire bundles with single-component silicone rubber after being wrapped by solder, and then placing the wire bundles into the inner cavity B of the second insulator, and filling and leveling the wire bundles by epoxy glue.
In the eighth step, the lead wire of the nonmetal connector embedded with the miniature printed board is correspondingly inserted into the printed circuit board and welded, the welding temperature is 250-260 ℃, and the welding time is 1-2 seconds; and after welding, adopting silicon rubber to isolate epoxy glue for encapsulation and fixation.
Further, before sealing and fixing by adopting epoxy glue, arranging an interlayer on two sides of the printed circuit board, wherein the interlayer is used for resisting stress generated after the epoxy glue is solidified; the interlayer is made of silicon rubber; the silicon rubber is respectively coated on the two sides of the printed circuit board with the thickness of 0.8-1 mm, and is put into the nonmetallic cavity after being cured for 24 hours at room temperature; before the silicone rubber is put into the nonmetallic cavity, half-height epoxy glue is filled and sealed in the cavity, the epoxy glue is filled and sealed at normal temperature, a hot air gun is set at 50 ℃, hot air is blown to promote the epoxy glue to flow during glue filling, and the heating is stopped until the nonmetallic cavity is sealed and flattened, and the epoxy glue is solidified at room temperature for 24 hours.
The invention discloses a compressible multi-point interconnection array, which comprises a multi-layer composite PCB substrate and miniature high-integration compressible cable components arranged on the PCB substrate in an array manner.
Further, the array arrangement mode includes but is not limited to rectangular array, circular array and irregular array.
The invention has the beneficial effects that
1. The cable assembly is divided into two parts of soft connection and hard connection (hard needle), and the wire part can ensure that the electric connector head of the cable assembly can float and stretch after the hard needle part of the electric connector is welded with the printed circuit board assembly, thereby meeting the floating requirement of the electric connector in the subsequent use process.
2. The miniature printed board is embedded in the narrow space on the left side in the nonmetallic connector below the electric connection, so that every four thin wires in the electric connector are welded and converted into one thick wire to be led out through the miniature printed circuit board, namely four holes are changed into single holes, and the two groups are shared. The printed circuit board is fixed in the nonmetal connecting cavity by adopting epoxy glue for encapsulation and fixation. Before the epoxy glue is filled, silicon rubber is used as an interlayer on two sides of the printed circuit board, so that damage to welding spots on the printed circuit board caused by stress generated after the epoxy glue is solidified can be prevented.
Drawings
Fig. 1 is a finished view of the cable assembly of the present invention.
Fig. 2 is a cross-sectional view of the connector of the present invention.
Fig. 3 is a cross-sectional view of a non-metallic interconnect of the present invention.
Fig. 4 is a schematic view of a printed board according to the present invention.
Fig. 5 is a process flow diagram.
Fig. 6 is a schematic diagram of a compressible multi-point interconnect array.
The reference numerals in the drawings are as follows: the connector 1, the wire bundle 2, the nonmetallic connector 3, the housing 4, the first insulator 5, the first contact 6, the second insulator 7, the second contact 8, the miniature printed board 9 and the printed circuit board 10.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The normal 25-core rectangular electric connector is characterized in that after wires (the sectional area of each wire is 0.12 square) are in pressure connection with electric connector pins (also called inner conductors), the wires are arranged in a row and are placed in a shell, the lower end faces of the wires are aligned, and epoxy glue is poured into the shell for curing, so that the conventional method is adopted. The above method has certain difficulties:
1. Adopt the branch line ring to carry out the switching, because of the reason of branch line ring self length, the space of adoption branch line ring switching demand is about 30mm, can't satisfy current space requirement, because the branch line ring does not possess the compressibility, can't satisfy the requirement of compressibility.
2. The U-shaped lap joint is adopted for switching, the space required by the U-shaped lap joint is about 30mm, the existing space requirement cannot be met, the cable assembly is required to have compressibility, the welding spots are likely to be damaged in the compression and stretching process, and the requirement of the compressibility cannot be met.
The invention provides a miniature highly-integrated compressible cable assembly and a processing method thereof, wherein an insulator is additionally arranged on the finished cable assembly, the arrangement sequence of the insulator is still led out according to the original arrangement in a connector 1, at present, wires between the connector 1 and the insulator are enabled to float (the wires can be formed into U-shaped, wave-shaped, S-shaped, C-shaped and the like), and the subsequent connector 1 can be assembled with a module in a better alignment way. The original 25-core wires are led out in a one-to-one correspondence manner, but the left 8 wires (4 wires are positive electrodes or describe the same function, the other 4 wires are negative electrodes or describe the same function) are easy to be welded with the printed board, and the rest wires are all led out by hard needles. When the insulator is attached to the printed board, the original 8 wires (each wire has a cross section of 0.12 square) are in blind installation with the printed board, and when the wires are welded and threaded with the corresponding pad holes of the printed board, the insulating skin of the wires is easy to break or the wires are broken. The post-improvement process processing method is that the printed board designed in fig. 4 is embedded in the insulator, namely the left part of fig. 3, and every 4 wires are welded and connected with the miniature printed board 9 to lead out one 0.35 square wire, 2 wires are totally, so that the problems are avoided, the corresponding design of the rear end connection module is reduced, and four wires and one wire are realized on the cable assembly.
The method for embedding the printed board assembly in the insulator is characterized in that the lead is welded with the miniature small printed board 9, the welding point is slightly higher than the printed board, the front side and the back side of the printed board are coated by single-component silicone rubber after being wrapped by solder, and then the printed board assembly is put into the insulator, and the printed board assembly is filled and sealed with epoxy glue. This is done because the solder joints cannot be directly contacted with epoxy glue.
The technical scheme is specifically described below with reference to the accompanying drawings.
Fig. 1 shows a schematic diagram of a miniature highly integrated compressible cable assembly in this embodiment, where the cable assembly is divided into two parts, namely a soft connection part and a hard connection part (hard pin), and the wire part can ensure that the head of the cable assembly electrical connector 1 can float and stretch after the hard pin part of the electrical connector 1 is welded with the printed circuit board 10 assembly, so as to meet the floating requirement of the electrical connector 1 in the subsequent use process.
Specifically, the miniature highly integrated compressible cable assembly in this embodiment includes a connector 1, a wire harness 2 and a nonmetallic connector 3, wherein the connector 1 and the nonmetallic connector 3 are connected by the wire harness 2.
As shown in fig. 2, the connector 1 includes four parts, namely a housing 4, a first insulator 5, a first contact 6 and a wire bundle 2, wherein the first insulator 5 is assembled to the housing 4, the wire bundle 2 is crimped with the first contact 6, then the first contact 6 after crimping is assembled into the first insulator 5, then potting adhesive is filled in an inner cavity of the housing 4 to fix the first insulator 5 and the first contact 6, and a glue filling groove is formed in a glue filling cavity of the housing 4, so that glue can be effectively fixed and prevented from falling out.
As shown in fig. 3, the nonmetallic connector 3 comprises four parts, namely a second insulator 7, a second contact 8, a miniature printed board 9 and a wire bundle 2, wherein the second contact 8 is in pressure connection with the wire bundle 2, then the second contact 8 after pressure connection is installed in an inner cavity a of the second insulator 7, the miniature printed board 9 is welded with the wire bundle 2, then the printed board is assembled in an inner cavity B of the second insulator 7 by adopting glue solution, glue solution is filled in the inner cavity a and the inner cavity B of the second insulator 7 respectively, and glue solution grooves are formed in the inner cavity of the second insulator 7, so that glue solution can be effectively fixed and prevented from falling out.
Fig. 4 is a schematic diagram of the micro printed board 9, wherein a, b, c, d is conducted with the internal links of the I hole site and e, f, g, h is conducted with the internal links of the J hole site, so as to realize the switching of the non-metal connector 3 from multiple hole sites to single hole sites by the connector 1. The miniature printed board 9 is embedded in the narrow space on the left side in the nonmetallic connector 3 below the electric connection, so that every four fine wires in the connector 1 are welded and converted into one thick wire to be led out through the miniature printed circuit board 10, namely four holes are changed into single holes, and two groups are formed. The printed circuit board 10 is fixed in the nonmetal connecting cavity by adopting epoxy glue for encapsulation and fixation (silicon rubber is used as an interlayer on two sides of the printed circuit board 10 before the epoxy glue is encapsulated so as to prevent the stress generated after the epoxy glue is solidified from damaging welding spots on the printed circuit board).
In one embodiment, the thickness of the glue coated on the two sides of the printed circuit board 10 is 0.8-1 mm, and the silicon rubber is put into the nonmetal cavity after being cured for 24 hours at room temperature; before the silicone rubber is put into the nonmetallic cavity, half-height epoxy glue is filled and sealed in the cavity, the epoxy glue is filled and sealed at normal temperature, a hot air gun is set at 50 ℃, hot air is blown to promote the epoxy glue to flow during glue filling, and the heating is stopped until the nonmetallic cavity is sealed and flattened, and the epoxy glue is solidified at room temperature for 24 hours.
In one embodiment, the miniature highly-integrated compressible cable assembly and the processing method thereof can be used for assembling the miniature highly-integrated compressible cable assembly provided by the embodiment, and the specific steps are as follows:
step one, the first contact 6 is pressed against the wire harness 2 to form the first contact 6 in the first state.
Step two, the first contact 6 in the first state is assembled into the first insulator 5, so as to form the first insulator 5 in the first state.
Step Cheng San, assembling the first insulator 5 in the first state into the housing 4 to form the housing 4 in the first state.
And fourthly, pouring sealant in the inner cavity of the shell 4 in the first state to form the connector 1 in the first state.
And fifthly, crimping the second contact 8 with the wire bundle 2 led out from the connector 1 in the first state to form the second contact 8 in the first state.
Step six, assembling the second contact 8 in the first state into the inner cavity A of the second insulator 7; the miniature printed board 9 is soldered to the end of the wire harness 2 and fixedly mounted in the inner cavity B of the second insulator 7, forming the second insulator 7 in the first state.
And step seven, pouring sealant in the second insulator 7 in the first state to form the nonmetal connector 3 embedded with the miniature printed board 9.
Step eight, correspondingly inserting the lead wire of the nonmetal connector 3 embedded with the miniature printed board 9 into the printed circuit board 10 and welding, wherein the welding temperature is 250-260 ℃ and the welding time is 1-2 seconds.
In one embodiment, a compressible multi-drop interconnect array is presented, as shown in FIG. 6. The compressible multi-point interconnection array comprises a PCB substrate and miniature high-integration compressible cable components arranged on the PCB substrate in an array mode.
In this embodiment, the array arrangement manner includes, but is not limited to, rectangular array, circumferential array, irregular array, etc., and the purpose of the array is to implement rapid switching in large batches according to some special scene requirements.
The present invention is not limited to the above-described specific embodiments, and various modifications and variations are possible. Any modification, equivalent replacement, improvement, etc. of the above embodiments according to the technical substance of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A miniature highly integrated compressible cable assembly characterized by: the flexible cable comprises a flexible cable connecting part and hard connecting parts connected to two ends of the flexible cable connecting part, wherein the hard connecting parts can float and stretch in a preset range;
Wherein, the hard connecting part at one end of the soft connecting part of the lead is a connector for plugging an external universal interface; the hard connecting part at the other end of the soft connecting part of the lead is a nonmetal connecting body embedded with a miniature printed board; the I end of the nonmetal connector is connected with the flexible lead connecting part, the II end of the nonmetal connector is output into a plurality of pins, and the pins are inserted into the printed circuit board and welded.
2. A miniature highly integrated compressible cable assembly according to claim 1, wherein: the soft connecting part of the lead is a lead bundle consisting of a plurality of leads; the connector includes a housing, a first insulator fitted within the housing, and a first contact fitted within the first insulator; the first contact is in pressure connection with the wire bundle; and pouring glue solution in the inner cavity of the shell.
3. The miniature highly integrated compressible cable assembly of claim 2, wherein the non-metallic connector comprises a second insulator, a second contact and a miniature printed board; the second insulator is provided with an inner cavity A and an inner cavity B, the second contact is in crimping connection with the wire bundle, and then the second contact after crimping is installed in the inner cavity A of the second insulator; the second contact piece is led into N wires in the wire bundle and led out of N pins; the miniature printed board is welded with the wire bundle, and is fixed in the inner cavity B; the miniature printed board comprises eight small hole sites and two large hole sites; the internal links of every four small hole sites are communicated with one large hole site, and the eight small hole sites are respectively connected with the corresponding hole sites of the connector through conductor bundles, so that the switching of the four small hole sites of the connector to the single hole site of the nonmetallic connector is realized; the inner cavity B is led into eight wires in the wire bundle, the eight wires are divided into positive and negative groups, each group of four wires are homopolar wires, each group of four wires is led out of 1 stitch, and 2 stitches are all arranged.
4. A miniature highly integrated compressible cable assembly according to claim 3 wherein the wire bundles are shaped in a U-shape, wave-shape, S-shape or C-shape such that a predetermined range of floating spaces exists between the connector and the non-metallic connector.
5. A method of manufacturing a miniature highly integrated compressible cable assembly of any one of claims 1-5, characterized by: the method comprises the following steps:
step one, crimping a first contact piece and a wire bundle to form a first contact piece in a first state;
step two, assembling the first contact piece in the first state into the first insulator to form the first insulator in the first state;
Step three, assembling a first insulator in a first state into the shell to form the shell in the first state;
Pouring glue solution into the inner cavity of the shell in the first state to form a connector in the first state;
step five, crimping the second contact piece with a wire bundle led out by the connector in the first state to form the second contact piece in the first state;
Step six, assembling the second contact piece in the first state into the inner cavity A of the second insulator; the miniature printed board is welded with the tail end of the wire bundle and is fixedly arranged in an inner cavity B of the second insulator, so that the second insulator in the first state is formed;
step seven, pouring sealant in the second insulator in the first state to form a nonmetal connector embedded with the miniature printed board;
and step eight, correspondingly inserting the lead wire of the nonmetal connector embedded with the miniature printed board and the four fine wires into the printed circuit board by changing the four fine wires into one thick wire, and welding.
6. The method of manufacturing a miniature highly integrated compressible cable assembly of claim 5, wherein: in the sixth step, the miniature printed board is welded with the tail ends of the wire bundles, and after each wire of the wire bundles is wrapped by solder, the front and back sides of the wire bundles are coated by single-component silicone rubber and then placed into the inner cavity B of the second insulator, and the wire bundles are filled and leveled by epoxy glue.
7. The method of manufacturing a miniature highly integrated compressible cable assembly of claim 6, wherein: in the eighth step, the lead wire of the nonmetal connector embedded with the miniature printed board is correspondingly inserted into the printed circuit board and welded, the welding temperature is 250-260 ℃, and the welding time is 1-2 seconds; and after welding, adopting silicon rubber to isolate epoxy glue for encapsulation and fixation.
8. The process according to claim 7, wherein: before sealing and fixing by epoxy glue, arranging an interlayer on two sides of the printed circuit board, wherein the interlayer is used for resisting stress generated after the epoxy glue is solidified; the interlayer is made of silicon rubber;
the silicon rubber is respectively coated on the two sides of the printed circuit board with the thickness of 0.8-1 mm, and is put into the nonmetallic cavity after being cured for 24 hours at room temperature;
Before the silicone rubber is put into the nonmetallic cavity, half-height epoxy glue is filled and sealed in the cavity, the epoxy glue is filled and sealed at normal temperature, a hot air gun is set at 50 ℃, hot air is blown to promote the epoxy glue to flow during glue filling, and the heating is stopped until the nonmetallic cavity is sealed and flattened, and the epoxy glue is solidified at room temperature for 24 hours.
9. A compressible multi-point interconnect array comprising a multi-layer composite PCB substrate and a miniature highly integrated compressible cable assembly fabricated according to any one of claims 5 to 8 arranged in an array on said PCB substrate.
10. A compressible multi-point interconnect array according to claim 9, wherein: the array arrangement mode comprises but is not limited to rectangular array, circumference array and irregular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410157158.3A CN117977250A (en) | 2024-02-02 | 2024-02-02 | Miniature high-integration compressible cable assembly, processing method thereof and interconnection array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410157158.3A CN117977250A (en) | 2024-02-02 | 2024-02-02 | Miniature high-integration compressible cable assembly, processing method thereof and interconnection array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117977250A true CN117977250A (en) | 2024-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410157158.3A Pending CN117977250A (en) | 2024-02-02 | 2024-02-02 | Miniature high-integration compressible cable assembly, processing method thereof and interconnection array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117977250A (en) |
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2024
- 2024-02-02 CN CN202410157158.3A patent/CN117977250A/en active Pending
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