CN117977246A - Integrated busbar and manufacturing process thereof - Google Patents
Integrated busbar and manufacturing process thereof Download PDFInfo
- Publication number
- CN117977246A CN117977246A CN202410160951.9A CN202410160951A CN117977246A CN 117977246 A CN117977246 A CN 117977246A CN 202410160951 A CN202410160951 A CN 202410160951A CN 117977246 A CN117977246 A CN 117977246A
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- CN
- China
- Prior art keywords
- circuit board
- row
- cable body
- aluminum
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 102
- 238000003466 welding Methods 0.000 claims abstract description 73
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 67
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 67
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 51
- 238000005476 soldering Methods 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000004411 aluminium Substances 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 238000002788 crimping Methods 0.000 claims description 5
- 230000035515 penetration Effects 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 21
- 239000011889 copper foil Substances 0.000 abstract description 20
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000005070 sampling Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The application relates to the technical field of integrated busbar, and discloses an integrated busbar, which comprises a conductive busbar, wherein the conductive busbar comprises an aluminum busbar and a supporting frame, a flexible circuit is arranged on the aluminum busbar, the flexible circuit comprises a cable body and a circuit board, a welding hole is formed in the circuit board, a nickel sheet is arranged between the circuit board and the aluminum busbar, and the nickel sheet is used for sealing one side of the welding hole facing the aluminum busbar. The nickel sheet and the aluminum bar are subjected to laser welding through the welding holes, so that the copper foil in the circuit board cannot be influenced during laser welding, and the melted copper foil cannot be damaged during laser welding, so that the copper foil cannot be damaged.
Description
Technical Field
The application relates to the technical field of integrated bus bars, in particular to an integrated bus bar and an integrated bus bar manufacturing process.
Background
The integrated busbar is also called CCS, mainly comprises a signal acquisition component (FPC, PCB, FFC and the like), a plastic structural component, a copper aluminum bar, a flexible Flat Cable Circuit (FCC) and the like, is connected into a whole through a hot pressing or riveting process and the like, realizes the functions of high-voltage serial-parallel connection of the battery cells, temperature sampling of the battery cells and voltage sampling of the battery cells, provides temperature and voltage for the BMS system through the FPC/PCB and a connector component, and belongs to a part of the BMS system.
In the related art, a nickel sheet is arranged between a flexible circuit in the integrated busbar and the aluminum busbar, and is fixed by adopting laser welding.
Flexible circuit (FCC) comprises cable body (FFC) and a plurality of circuit board (FPC), wherein have the copper foil in the circuit board, when laser welding, nickel piece and aluminium row carry out welded fastening, because the copper foil is thinner, and the fusing point of nickel piece is higher than the fusing point of copper foil for the condition that melts easily appears in the copper foil in the circuit board, thereby influences the normal use of circuit board.
Disclosure of Invention
In order to solve the problem of melting of copper foil in a circuit board during laser welding, the application provides an integrated busbar and a manufacturing process of the integrated busbar.
The application provides an integrated busbar and an integrated busbar manufacturing process, which adopts the following technical scheme:
The utility model provides an integrated busbar, includes the electrically conductive row, the electrically conductive row includes aluminium row and support frame, the aluminium row sets up on the support frame, be equipped with flexible line on the aluminium row, flexible line includes cable body and circuit board, the circuit board sets up on the circuit body, the welding hole has been seted up on the circuit board, be equipped with the nickel piece between circuit board and the aluminium row, the nickel piece is towards one side shutoff of aluminium row to the welding hole.
Through adopting the technical scheme, the nickel sheet is arranged between the circuit board and the aluminum row, so that a worker can weld the nickel sheet and the aluminum row by laser through the welding holes, and the nickel sheet does not need to protrude the circuit board to weld the aluminum row, thereby reducing the volume of the nickel sheet and the cost of the circuit board and the aluminum row during laser welding; the nickel sheet and the aluminum bar are subjected to laser welding through the welding holes, so that the copper foil in the circuit board cannot be influenced during laser welding, and the melted copper foil cannot be damaged during laser welding, so that the copper foil cannot be damaged.
Optionally, the nickel sheet has a thickness of between 1 and 10 mm.
Optionally, the circuit board includes first fixed part, connecting portion and second fixed part, first fixed part sets up on the aluminium row, connecting portion set up between first fixed part and second fixed part, the second fixed part sets up on the cable body, connecting portion bending.
Through adopting above-mentioned technical scheme, when the group battery acting, the group battery can take place the drum of different degree and rise for the group battery stretches from the center to vertical both sides, and the position of aluminium row and circuit board can be along with the change, because first fixed part sets up on the aluminium row, and the second fixed part sets up on the circuit body, and connecting portion is located between first fixed part and the second fixed part, makes connecting portion can produce deformation in order to adapt to the relative movement of first fixed part and second fixed part, and connecting portion bending in addition makes connecting portion can produce deformation more easily, avoids connecting portion to produce the fracture, prevents the condition that the damage appears to the circuit board.
Optionally, the connecting portion has at least two bending positions, and the connecting portion is S-shaped.
By adopting the technical scheme, when the battery pack does work, the battery pack can bulge to different degrees, so that the battery pack stretches from the center to the two vertical sides, the positions of the aluminum row and the circuit board can change along with the change, the first fixing part moves towards one side, the second fixing part moves towards the other side, two bending parts are arranged on the connecting part, the connecting part is S-shaped, the first fixing part drives one bending part to move towards one side, the second fixing part drives the other bending part to move towards the other side, stress points of the connecting part are different, the situation that the connecting part is broken due to stress concentration is avoided, and the stability of the connecting part is further enhanced; when moving towards the direction away from the connecting portion through first fixed part and second fixed part, the connecting portion produces the deformation of horizontal direction promptly, and the indirect contact position atress between two kinks, and then lets the connecting portion different in the stress point when horizontal and vertical direction deformation, reduces the connecting portion and damages the possibility because of deformation, extension connecting portion's life.
Optionally, the circuit board and the cable body are independent components and are fixedly connected.
By adopting the technical scheme, the circuit board and the cable body are usually integrally formed, so that the circuit board and the cable body need a specific die for manufacturing; the cable body and the cable body are independent components, so that the cable body and different circuit boards can be assembled at will, workers can assemble different flexible circuits, the workers can assemble the flexible circuits conveniently, and customized manufacturing of the flexible circuits can be realized.
An integrated busbar manufacturing process comprises the following steps:
assembling a flexible circuit, an aluminum row and a support frame, and installing the aluminum row and the flexible circuit on the support frame;
welding aluminum bars and flexible circuits, wherein welding holes for welding nickel plates and the aluminum bars are pre-formed in the flexible circuits, and the nickel plates are added between the aluminum bars and the flexible circuits and are welded at the welding holes by laser.
By adopting the technical scheme, the nickel sheet and the aluminum bar are subjected to laser welding through the welding holes, so that the copper foil in the circuit board on the flexible circuit is not influenced during laser welding, the copper foil is not melted during laser welding, and the copper foil is not damaged; the staff can weld the nickel sheet and the aluminum row by laser through the welding holes, so that the nickel sheet does not need to protrude the circuit board to weld the aluminum row, thereby reducing the volume of the nickel sheet and reducing the cost of the circuit board and the aluminum row during laser welding; meanwhile, the nickel sheet is positioned between the flexible circuit and the aluminum row, so that the resistance precision of the flexible circuit and the aluminum row after welding can be controlled, and the busbar can be conveniently integrated to control the circuit more accurately.
Optionally, in the step of welding the aluminum bar and the flexible circuit, the flexible circuit is cooled by placing a heat conducting block on the flexible circuit.
Through adopting above-mentioned technical scheme, when laser welding, the nickel piece will be temperature-transferred to the flexible line on, can heat up between leading to nickel piece and the flexible line, owing to have tin material in the flexible line, probably can lead to tin to melt after the heat up, cause the secondary welding between flexible line and the nickel piece, set up on the flexible line through the heat conduction piece for the temperature of flexible line passes through the heat conduction piece and conveys away, thereby reduces the temperature in the flexible line, avoids tin in the flexible line to melt, avoids producing the secondary welding between flexible line and the nickel piece.
Optionally, in the step of assembling the flexible circuit, the aluminum row and the support frame, the method further comprises:
and connecting the circuit board and the cable body by using Hotbar tin soldering, ACF glue crimping or reflow soldering through a positioning tool, and forming a flexible circuit.
Through adopting above-mentioned technical scheme, the circuit board of different quantity is through the Hotbar soldering of location frock, ACF glue crimping or reflow soldering's mode installation on the cable body, realizes the equipment of flexible circuit different length, different quantity circuit board, lets the staff assemble different flexible circuit to the staff realizes the equipment to flexible circuit, can realize flexible circuit's customization preparation.
By adopting the positioning tool to connect the circuit board and the cable body through Hotbar tin soldering, the circuit board and the cable body have higher welding efficiency and simultaneously ensure the quality of the circuit board and the cable body during welding;
The circuit board and the cable body are connected through ACF glue compression joint, and as the conductive particles are clamped between the circuit board and the cable body and subjected to certain temperature or pressure, the conductive layers on the surfaces of the conductive particles are flattened, and the conductive particles contact the circuit board and the cable body, the circuit board and the cable body are conducted, so that the circuit board and the cable body have higher conductivity; the circuit board and the cable body are subjected to glue compression joint, so that the circuit board and the cable body have higher adhesiveness, the cracking of the conductive layer can be prevented, and the circuit board and the cable body have better heat resistance;
The circuit board and the cable body are connected through reflow soldering, and as the circuit board and the cable body are integrally heated during temperature rise, the welding quality of the circuit board and the cable body is the same, and the situation that the welding quality is uneven during welding is avoided; realize circuit board and cable body whole welding, for above-mentioned two kinds of connected mode welding speed is faster, adjusts welding efficiency.
Optionally, in the step of connecting the circuit board and the cable body by reflow soldering, the circuit board is fixed by a steel sheet, so as to prevent the circuit board from deforming.
Through adopting above-mentioned technical scheme, when the circuit board is carrying out the reflow soldering, the phenomenon that the circuit board can produce expend with heat and contract with cold leads to the circuit board to probably appear buckling, sets up on the circuit board through the steel sheet, lets the steel sheet fix the circuit board for the circuit board can not produce the phenomenon of buckling when carrying out the reflow soldering, avoids the circuit board to produce the phenomenon of rosin joint with the cable body because of buckling.
Optionally, in the step of connecting the circuit board and the cable body by reflow soldering, a through hole for ventilation and tin penetration is pre-formed in the steel sheet.
By adopting the technical scheme, as the circuit board is provided with the tin material, the tin material can be melted when the circuit board is subjected to reflow soldering, and the redundant tin material can flow out from the through hole, so that the tin material cable body is soldered, the connection strength of the circuit board and the cable body is enhanced, and the circuit board is prevented from being separated from the cable body; meanwhile, air between the circuit board and the steel plate can be discharged from the through hole, and the situation that false welding is caused by the air between the circuit board and the steel plate is avoided.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the nickel sheet is arranged between the circuit board and the aluminum row, so that a worker can weld the nickel sheet and the aluminum row by laser through the welding holes, and the nickel sheet does not need to protrude the circuit board to weld the aluminum row, thereby reducing the volume of the nickel sheet and the cost of the circuit board and the aluminum row during laser welding; the nickel sheet and the aluminum bar are subjected to laser welding through the welding holes, so that the copper foil in the circuit board cannot be influenced during laser welding, and the melted copper foil cannot be damaged during laser welding, so that the copper foil cannot be damaged.
2. When laser welding, can heat up between nickel piece and the flexible line, owing to have tin material in the flexible line, tin material can melt after the heat up and lead to producing secondary welding between flexible line and the nickel piece, set up on the flexible line through the heat conduction piece for flexible line's temperature can be transmitted away by the heat conduction piece, thereby reduces the temperature in the flexible line, avoids tin in the flexible line to melt, and then avoids producing secondary welded problem between flexible line and the nickel piece.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present application;
Fig. 2 is an exploded view of a salient circuit board in an embodiment of the present application.
Reference numerals: 1. an aluminum row; 11. a support frame; 12. a mounting groove; 13. a receiving groove; 14. outputting an anode covering row; 15. outputting a negative electrode covering row; 16. a conductive bar; 2. a flexible circuit; 21. a cable body; 22. a circuit board; 221. a first fixing portion; 222. a connection part; 223. a second fixing portion; 224. a bending part; 225. a temperature-collecting branch component; 226. a pressure-collecting branch component; 227. welding holes; 23. a connector; 24. nickel flakes.
Detailed Description
The application is described in further detail below with reference to fig. 1-2.
The embodiment discloses an integrated busbar and an integrated busbar manufacturing process. Referring to fig. 1, an integrated busbar manufacturing process includes the steps of:
s1, assembling a conductive bar 16, and mounting an aluminum bar 1 on a support frame 11;
s2, assembling the flexible circuit 2, and assembling the circuit board 22 on the cable body 21;
S3, crimping the connector 23;
S4, assembling the flexible circuit 2 on the aluminum row 1;
S5, laser welding, namely adding a nickel sheet 24 between the flexible circuit 2 and the aluminum row 1, pre-opening a welding hole 227 on the circuit board 22, and performing laser welding on the nickel sheet 24 and the aluminum row 1 at the welding hole 227;
S6, performance detection;
Wherein steps S1, S2 or S3 may be in any order.
In step S5, the heat conducting block is placed on the circuit board 22, so that the heat conducting block abuts against a side of the circuit board 22 away from the nickel sheet 24. After the laser welding is completed, the heat conducting block is taken out from the circuit board 22.
In step S2, assembling the cable body 21 and the circuit board 22 into the flexible circuit 2 includes the following steps:
S21, firstly, printing solder paste on the cable body 21, then 3DSPI, and then aligning the circuit board 22 with the cable body 21;
s22, fixing the circuit board 22 and the cable body 21;
S23, detecting welding points;
Wherein step S22 comprises any one of the following methods:
S221, soldering by Hotbar through a positioning tool;
S222, crimping through ACF glue;
s223, realizing the welding of the circuit board 22 on the cable body 21 through an SMT reflow soldering process;
in the S223 method, the circuit board 22 is fixed on the cable body 21 by a steel sheet to prevent the circuit board 22 from deforming, and a plurality of through holes are pre-opened on the steel sheet for ventilation and tin penetration, and the steel sheet is taken out from the circuit board 22 after the reflow soldering is finished.
Referring to fig. 1, an integrated busbar includes a conductive busbar 16, and the conductive busbar 16 includes an aluminum busbar 1 and a supporting frame 11, and the steps in this embodiment take the step of the S223 method as an example. The aluminum row 1 is fixedly connected with a flexible circuit 2, and the flexible circuit 2 is FCC. The flexible circuit 2 includes a cable body 21 and a plurality of circuit boards 22, wherein the plurality of circuit boards 22 are fixedly connected to the cable body 21, the cable body 21 is an FFC main body, and the circuit boards 22 are pressure-collecting branch FPCs or pressure-collecting/NTC branch FPCs. The cable body 21 is a copper conductor, is realized by adopting a rolling and compounding mode, and the circuit board 22 is realized by adopting a chemical etching mode.
The cable body 21 is fixedly connected with a connector 23, and the connector 23 is fixedly connected to the aluminum row 1.
Referring to fig. 1, a supporting frame 11 is fixedly connected to an aluminum row 1, a mounting groove 12 into which a cable body 21 is inserted is formed in the supporting frame 11, and a receiving groove 13 into which a circuit board 22 is inserted is formed in the supporting frame 11. The support frame 11 is fixedly connected with an output positive electrode covering row 14 and an output negative electrode covering row 15, the output positive electrode covering row 14 is positioned at one end of the support frame 11, and the output negative electrode covering row 15 is positioned at the other end of the support frame 11.
Referring to fig. 1 and 2, the circuit board 22 includes a first fixing portion 221, a connecting portion 222, and a second fixing portion 223, and the connecting portion 222 is integrally formed between the first fixing portion 221 and the second fixing portion 223. The first fixing portion 221 is welded to the aluminum busbar 1, and the second fixing portion 223 is welded to the cable body 21. The connecting portion 222 has two bending portions 224, wherein one bending portion 224 is bent toward one end of the supporting frame 11, and the other bending portion 224 is bent toward the other end of the supporting frame 11, so that the connecting portion 222 is formed in an S shape. Because the battery pack can produce different degrees of swelling when doing work, the integrated busbar stretches from the center to the two sides in the vertical direction, and the bending part 224 deforms towards the two different sides, so that the connection part 222 is prevented from being damaged.
Referring to fig. 2, temperature sampling branch members 225 are fixedly connected to three second fixing portions 223, and pressure sampling branch members 226 are fixedly connected to the remaining second fixing portions 223. The temperature-sampling branch part 225 is used for realizing the temperature-sampling process of the circuit board 22, and the pressure-sampling branch part 226 is used for realizing the pressure-sampling process of the circuit board 22.
Referring to fig. 2, a nickel plate 24 is welded on the surface of the first fixing portion 221, and the nickel plate 24 is located between the first fixing portion 221 and the aluminum row 1. The surface of the first fixing portion 221 is provided with a welding hole 227, and the welding hole 227 is square. The first fixing portion 221 is located between the nickel plates 24 and the aluminum row 1, and the nickel plates 24 are used for sealing one side, facing the aluminum row 1, of the welding holes 227, so that a worker can perform laser welding on the nickel plates 24 through the welding holes 227.
Referring to fig. 2, the nickel plate 24 has a thickness of 1-10 mm, and the copper foil in the first fixing portion 221 has a thickness of 0.035 mm. At the time of laser welding, the temperature of the nickel plate 24 is raised by 31.8 degrees celsius, which is less than the melting temperature of the copper foil, to prevent the melting of the copper foil at the time of laser welding.
The implementation principle of the integrated busbar of the embodiment of the application is as follows: the nickel plate 24 is welded by laser through the welding hole 227 by the welding hole 227, so that the nickel plate 24 and the aluminum busbar 1 are fixed, and the circuit board 22 and the aluminum busbar 1 are mutually fixed.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "first," "second," "third," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. The terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, is intended to mean that elements or items that are present in front of "comprising" or "comprising" are included in the word "comprising" or "comprising", and equivalents thereof, without excluding other elements or items. "upper", "lower", "left", "right", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes.
The above embodiments are only preferred embodiments of the present application, and are not intended to limit the present application, and any modifications, equivalent substitutions, improvements, etc. within the design concept of the present application should be included in the scope of the present application.
Claims (10)
1. An integrated busbar, characterized in that: including electric conduction row (16), electric conduction row (16) include aluminium row (1) and support frame (11), aluminium row (1) set up on support frame (11), be equipped with flexible line (2) on aluminium row (1), flexible line (2) include cable body (21) and circuit board (22), circuit board (22) set up on cable body (21), welding hole (227) have been seted up on circuit board (22), be equipped with nickel piece (24) between circuit board (22) and the aluminium row (1), one side shutoff of welding hole (227) orientation aluminium row (1) is welded to nickel piece (24).
2. An integrated busbar according to claim 1, wherein: the nickel sheet (24) has a thickness of between 1 and 10 mm.
3. An integrated busbar according to claim 1, wherein: the circuit board (22) comprises a first fixing portion (221), a connecting portion (222) and a second fixing portion (223), wherein the first fixing portion (221) is arranged on the aluminum row (1), the connecting portion (222) is arranged between the first fixing portion (221) and the second fixing portion (223), the second fixing portion (223) is arranged on the cable body (21), and the connecting portion (222) is formed in a bending mode.
4. An integrated busbar according to claim 3, wherein: the connecting part (222) is provided with at least two bending parts (224), and the connecting part (222) is S-shaped.
5. An integrated busbar according to claim 1, wherein: the circuit board (22) and the cable body (21) are independent components and are fixedly connected.
6. The manufacturing process of the integrated busbar is characterized by comprising the following steps of: the method comprises the following steps:
assembling a flexible circuit (2), an aluminum row (1) and a support frame (11), and installing the aluminum row (1) and the flexible circuit (2) on the support frame (11);
Welding aluminum row (1) and flexible circuit (2), pre-opening welding hole (227) to nickel piece (24) and aluminum row (1) on flexible circuit (2), increasing nickel piece (24) and carrying out laser welding in welding hole (227) department between aluminum row (1) and flexible circuit (2).
7. The integrated busbar manufacturing process of claim 6, wherein: in the step of welding the aluminum bar (1) and the flexible circuit (2), the flexible circuit (2) is radiated by placing the heat conducting block on the flexible circuit (2).
8. The integrated busbar manufacturing process of claim 6, wherein: in the step of assembling flexible circuit (2), aluminium row (1) and support frame (11), still include:
And connecting the circuit board (22) and the cable body (21) by using Hotbar tin soldering, ACF glue crimping or reflow soldering through a positioning tool, and forming a flexible circuit (2).
9. The integrated busbar manufacturing process of claim 8, wherein: in the step of connecting the circuit board (22) and the cable body (21) by reflow soldering, the circuit board (22) is fixed by a steel sheet to prevent the circuit board (22) from being deformed.
10. The integrated busbar manufacturing process of claim 9, wherein: in the step of connecting the circuit board (22) and the cable body (21) by adopting reflow soldering, through holes for ventilation and tin penetration are pre-formed in the steel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410160951.9A CN117977246A (en) | 2024-02-05 | 2024-02-05 | Integrated busbar and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410160951.9A CN117977246A (en) | 2024-02-05 | 2024-02-05 | Integrated busbar and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117977246A true CN117977246A (en) | 2024-05-03 |
Family
ID=90852647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410160951.9A Pending CN117977246A (en) | 2024-02-05 | 2024-02-05 | Integrated busbar and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117977246A (en) |
-
2024
- 2024-02-05 CN CN202410160951.9A patent/CN117977246A/en active Pending
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