CN117966988A - Heating gypsum board - Google Patents
Heating gypsum board Download PDFInfo
- Publication number
- CN117966988A CN117966988A CN202311575323.9A CN202311575323A CN117966988A CN 117966988 A CN117966988 A CN 117966988A CN 202311575323 A CN202311575323 A CN 202311575323A CN 117966988 A CN117966988 A CN 117966988A
- Authority
- CN
- China
- Prior art keywords
- gypsum board
- gypsum
- exothermic
- layer
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052602 gypsum Inorganic materials 0.000 title claims abstract description 126
- 239000010440 gypsum Substances 0.000 title claims abstract description 126
- 238000010438 heat treatment Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000005034 decoration Methods 0.000 claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000011859 microparticle Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 7
- 230000002269 spontaneous effect Effects 0.000 abstract description 3
- 230000002459 sustained effect Effects 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009436 residential construction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Finishing Walls (AREA)
Abstract
The application discloses a heating gypsum board, which comprises a gypsum substrate; the heating layer is arranged in the gypsum substrate and is suitable for electrifying and heating; the power supply component is arranged in the gypsum substrate and is suitable for providing power supply for the heating layer; and the decoration panel is arranged on one side of the gypsum substrate. The application can solve the problem of moisture susceptibility of the traditional gypsum board. The heat-generating layer removes moisture from the gypsum board by sustained spontaneous heating and effectively slows down moisture penetration, thereby maintaining the structural integrity and stability of the gypsum board.
Description
Technical Field
The application relates to the technical field of gypsum boards, in particular to a heating gypsum board.
Background
Gypsum board is a widely used material in construction and interior work and is favored for its lightweight, easy to process, sound, heat and fire insulating properties. However, despite its versatility, gypsum board presents a significant problem in certain environments: is easy to be affected with damp.
Conventional plasterboards are mainly made with a gypsum core sandwiched between paper facers, which makes them prone to absorb moisture under humid conditions. When the gypsum board absorbs moisture, it swells, causing surface cracking and the structure to become weak. This is a significant problem for walls, ceilings and dividing walls for residential construction and commercial use. This problem becomes particularly pronounced in high humidity environments such as kitchens, bathrooms and basements.
Conventional solutions typically involve applying a moisture barrier coating to the surface of the gypsum board to slow down moisture penetration. While these moisture protection measures may improve the moisture resistance of gypsum boards to some extent, they do not completely eliminate the problem because even minor moisture penetration may cause structural problems. In addition, the use of moisture resistant coatings also increases production costs and may limit the wide range of applications for gypsum board. Another conventional approach is to increase the density of the gypsum board making it more difficult to absorb water. However, this also adds weight, making handling and installation more difficult.
Disclosure of Invention
In view of the above, it is necessary to provide a heat-generating gypsum board.
The heating gypsum board comprises:
a gypsum substrate;
The heating layer is arranged in the gypsum substrate and is suitable for electrifying and heating;
The power supply component is arranged in the gypsum substrate and is suitable for providing power supply for the heating layer;
and the decoration panel is arranged on one side of the gypsum substrate.
In some embodiments, the gypsum substrate includes:
The heating device comprises a first gypsum board and a second gypsum board, wherein the first gypsum board is provided with a containing groove which is suitable for containing the heating layer and the power supply assembly.
In some embodiments, the first gypsum board is disposed between the second gypsum board and the decorative panel, and the receiving slot is open on a side of the first gypsum board facing away from the decorative panel.
In some embodiments, a positioning block is arranged on the side surface of the first gypsum board, which is close to the second gypsum board, a positioning groove is arranged on the side surface of the second gypsum board, which is close to the first gypsum board, and the positioning block is connected with the positioning groove in a matching way.
In some embodiments, the power supply assembly comprises:
A plug adapted to be secured in the receiving recess;
The power cord is connected with the plug and is suitable for being fixed in the accommodating groove;
and the conductive belt is connected with the power line and is suitable for being fixed in the accommodating groove.
In some embodiments, the heat generating layer is provided as any one of a heat generating film, a graphene heat generating paste layer, a semiconductor heat generating material, and a carbon crystal microparticle layer, and is adapted to be fixed in the accommodating groove.
In some embodiments, the conductive strips are provided with two strips and are respectively suitable for connecting the power input end and the power output end of the heating layer, and the power lines are provided with two strips and are respectively connected with the two conductive strips.
In some embodiments, further comprising:
The high-temperature-resistant insulating adhesive is arranged in the accommodating groove and is suitable for fixing the heating layer and the power supply assembly.
In some embodiments, a compression block is disposed on a side of the second gypsum board adjacent to the first gypsum board, the compression block being adapted to compress the heat generating layer and the power supply assembly in the receiving slot.
In some embodiments, the decoration panel is provided with a plurality of air flow holes at positions corresponding to the heating layer.
Compared with the prior art, the application has the beneficial effects that:
Moisture resistance: the application has the most remarkable effect of solving the problem of moisture susceptibility of the traditional gypsum board. The heat-generating layer removes moisture from the gypsum board by sustained spontaneous heating and effectively slows down moisture penetration, thereby maintaining the structural integrity and stability of the gypsum board.
Durability: this innovation makes the gypsum board more durable in high humidity environments, extending its life. It will find wide application in wet areas such as kitchen, bathroom, etc. and in various places such as basements.
And the maintenance cost is reduced: due to its moisture barrier properties, the exothermic gypsum board reduces maintenance and replacement requirements and reduces long-term operating costs.
The method is widely applied: the technology can be widely applied to walls, ceilings and dividing walls and other building interior decoration fields, and provides more choices for users.
In a word, this technical scheme provides an innovative solution, has improved the performance of gypsum board notably, has brought more convenience and sustainability for building and interior industry.
Drawings
FIG. 1 is a schematic front view of an exemplary embodiment of the present application;
FIG. 2 is a schematic side view of an exemplary embodiment of the present application;
FIG. 3 is a schematic view of a first gypsum board according to an exemplary embodiment of the application;
FIG. 4 is a schematic diagram of a second gypsum board in accordance with an exemplary embodiment of the present application;
Fig. 5 is a schematic diagram showing a heat generating layer and a power supply assembly according to an exemplary embodiment of the application.
In the figure: 11. a first gypsum board; 111. a receiving groove; 112. a positioning block; 12. a second gypsum board; 121. a compaction block; 122. a positioning groove; 2. a decorative panel; 21. an air flow hole; 3. a heat generating layer; 4. a power supply assembly; 41. a plug; 42. a power line; 43. a conductive tape.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
As described in the background, conventional plasterboards are mainly made with a gypsum core sandwiched between paper faceplates, which makes them prone to absorb moisture under humid conditions. When the gypsum board absorbs moisture, it swells, causing surface cracking and the structure to become weak. This is a significant problem for walls, ceilings and dividing walls for residential construction and commercial use. This problem becomes particularly pronounced in high humidity environments such as kitchens, bathrooms and basements. Conventional solutions typically involve applying a moisture barrier coating to the surface of the gypsum board to slow down moisture penetration. While these moisture protection measures may improve the moisture resistance of gypsum boards to some extent, they do not completely eliminate the problem because even minor moisture penetration may cause structural problems. In addition, the use of moisture resistant coatings also increases production costs and may limit the wide range of applications for gypsum board. Another conventional approach is to increase the density of the gypsum board making it more difficult to absorb water. However, this also adds weight, making handling and installation more difficult.
To solve the above problems, the present application provides a heating gypsum board, referring to fig. 1 and 2, which mainly comprises: a gypsum substrate, a decoration panel 2, a heat generating layer 3 (refer to fig. 5), a power supply module 4, and a high temperature resistant insulating adhesive. Wherein the gypsum substrate, as the primary support structure of the present application, provides strength and stability; the decoration panel 2 is arranged on the outer side of the gypsum base plate and provides additional support and decoration effects; the heating layer 3 is arranged in the gypsum substrate and is suitable for energizing and heating; the power supply component 4 is arranged in the gypsum substrate and is suitable for providing power supply for the heating layer 3; the high-temperature-resistant insulating adhesive is suitable for fixing and connecting the structures.
Specifically, in the exemplary embodiment, referring to fig. 1, the gypsum substrate adopts a multi-layered structure including a first gypsum board 11 and a second gypsum board 12, i.e., the body of the present application is formed as a three-layered structure of the first gypsum board 11-the second gypsum board 12-the decoration panel 2. Further, in the exemplary embodiment, first gypsum board 11 is disposed between second gypsum board 12 and decorative panel 2.
Further, in the exemplary embodiment, referring to fig. 2 and 3, the first gypsum board 11 is provided with a receiving groove 111 adapted to receive the heat generating layer 3 and the power supply assembly 4. The receiving groove 111 is open on the side of the first plasterboard 11 facing away from the decorative panel 2. In contact with the above, the first gypsum board 11 is disposed between the second gypsum board 12 and the decorative panel 2, and thus the first gypsum board 11 provided with the accommodating groove 111 can be protected on both sides, and the situation that the strength is insufficient and the first gypsum board 11 is easily damaged after being grooved can be improved.
Further, in the exemplary embodiment, referring to fig. 3 and 4, a positioning block 112 is disposed on a side surface of the first gypsum board 11, which is close to the second gypsum board 12, the positioning block 112 is formed in a strip shape and integrally connected to a side edge of the first gypsum board 11, a positioning groove 122 is disposed on a side surface of the second gypsum board 12, which is close to the first gypsum board 11, and the positioning block 112 is cooperatively connected with the positioning groove 122. Thereby facilitating positioning and assembly of the gypsum substrate. The positioning groove 122 is formed on the second gypsum board 12, so as to avoid the influence of the re-grooving on the first gypsum board 11 on the strength of the first gypsum board 11, and meanwhile, the setting position strip is added on the first gypsum board 11 to improve the strength reduction of the first gypsum board 11 caused by the forming of the accommodating groove 111.
Further, in the exemplary embodiment, referring to fig. 3 and 4, a pressing block 121 is integrally connected to a side of the second gypsum board 12 adjacent to the first gypsum board 11, and the pressing block 121 is adapted to the receiving groove 111, and is adapted to press the heat generating layer 3 and the power supply assembly 4 in the receiving groove 111. The setting of the pressing block 121 is convenient for positioning the heating layer 3 and the power supply assembly 4 on the one hand, and on the other hand, can supplement the overall strength of the gypsum substrate, and avoids the hollow phenomenon at the inner accommodating groove 111.
Specifically, in the exemplary embodiment, referring to fig. 3 and 5, the heat generating layer 3 is provided as any one of a heat generating film, a graphene heat generating paste layer, a semiconductor heat generating material, and a carbon crystal micro particle layer, and the heat generating layer 3 is adapted to be fixed in the accommodating groove 111.
Specifically, in the exemplary embodiment, referring to fig. 3 and 5, the power supply assembly 4 includes a plug 41, a power cord 42, and a conductive strip 43, all of which are fixed in the above-described accommodation groove 111. Further, the conductive strips 43 are provided in two, and are adapted to be connected to the power input terminal and the power output terminal of the heat generating layer 3, respectively, and the power line 42 is provided in two, and is connected to the two conductive strips 43, respectively.
Specifically, in the exemplary embodiment, a high temperature resistant insulating paste is provided in the accommodation groove 111, and is adapted to fix the heat generating layer 3 and the power supply assembly 4. Further, a high temperature resistant insulating glue is also provided in the positioning groove 122, between the first gypsum board 11 and the second gypsum board 12, and between the first gypsum board 11 and the decorative panel 2. Thereby fixing the plate as a whole.
Specifically, in the exemplary embodiment, referring to fig. 1 and 3, trim panel 2 is typically made of various materials to meet different trim requirements. Common decorative panel 2 materials include wood, synthetic board (e.g., MDF, HDF), plastic, metal, and gypsum board. The design of the decorative panel 2 may vary depending on the application environment. It may have various surface textures, colors, and decorative patterns to meet the aesthetic requirements of the finishing project. Furthermore, the decorative panel 2 may also be coated or printed to achieve different visual effects. The size and shape of the trim panel 2 is generally matched to the size of the gypsum substrate to ensure that it completely covers one side of the gypsum substrate. Further, in the exemplary embodiment, a plurality of air flow holes 21 are formed on the decoration panel 2 at positions corresponding to the heat generating layers 3. The presence of these air flow holes 21 helps to distribute the heat evenly, ensuring a uniform temperature within the exothermic gypsum board, while also facilitating the removal of moisture within the gypsum substrate.
In conclusion, the most remarkable effect of the application is to solve the problem of moisture susceptibility of the traditional gypsum board. The heat-generating layer removes moisture from the gypsum board by sustained spontaneous heating and effectively slows down moisture penetration, thereby maintaining the structural integrity and stability of the gypsum board. This innovation makes the gypsum board more durable in high humidity environments, extending its life. It will find wide application in wet areas such as kitchen, bathroom, etc. and in various places such as basements. Due to its moisture barrier properties, the exothermic gypsum board reduces maintenance and replacement requirements and reduces long-term operating costs. The technology can be widely applied to walls, ceilings and dividing walls and other building interior decoration fields, and provides more choices for users.
In a word, this technical scheme provides an innovative solution, has improved the performance of gypsum board notably, has brought more convenience and sustainability for building and interior industry.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present application, and the present application is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present application has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (9)
1. A heat generating gypsum board, comprising:
The gypsum board comprises a first gypsum board and a second gypsum board, and the first gypsum board is provided with a containing groove which is suitable for containing the heating layer and the power supply component;
the heating layer is arranged in the gypsum substrate and is suitable for being electrified to generate heat;
The power supply component is arranged in the gypsum substrate and is suitable for providing power supply for the heating layer;
and the decoration panel is arranged on one side of the gypsum substrate.
2. The exothermic gypsum board of claim 1 wherein the first gypsum board is disposed between the second gypsum board and the decorative panel, and wherein the receiving slot is open on a side of the first gypsum board facing away from the decorative panel.
3. The exothermic gypsum board of claim 1, wherein a positioning block is disposed on a side of the first gypsum board adjacent to the second gypsum board, a positioning groove is disposed on a side of the second gypsum board adjacent to the first gypsum board, and the positioning block is cooperatively connected with the positioning groove.
4. The exothermic gypsum board of claim 1, wherein the power supply assembly comprises:
A plug adapted to be secured in the receiving recess;
The power cord is connected with the plug and is suitable for being fixed in the accommodating groove;
and the conductive belt is connected with the power line and is suitable for being fixed in the accommodating groove.
5. The exothermic gypsum board of claim 1, wherein the exothermic layer is any one of a exothermic film, a graphene exothermic slurry layer, a semiconductor exothermic material, and a carbon crystal microparticle layer, the exothermic layer being adapted to be secured in the receiving groove.
6. The heating gypsum board of claim 4, wherein the conductive strips are provided in two and are adapted to be connected to a power input and a power output of the heating layer, respectively, and the power line is provided in two and is connected to the two conductive strips, respectively.
7. The exothermic gypsum board of claim 1, further comprising:
The high-temperature-resistant insulating adhesive is arranged in the accommodating groove and is suitable for fixing the heating layer and the power supply assembly.
8. The heat generating gypsum board of claim 1, wherein a compression block is provided on a side of the second gypsum board adjacent to the first gypsum board, the compression block being adapted to the receiving slot and adapted to compress the heat generating layer and the power assembly in the receiving slot.
9. The heating gypsum board of claim 1, wherein the decorative panel is provided with a plurality of air flow holes at positions corresponding to the heating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311575323.9A CN117966988A (en) | 2023-11-23 | 2023-11-23 | Heating gypsum board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311575323.9A CN117966988A (en) | 2023-11-23 | 2023-11-23 | Heating gypsum board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117966988A true CN117966988A (en) | 2024-05-03 |
Family
ID=90862076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311575323.9A Pending CN117966988A (en) | 2023-11-23 | 2023-11-23 | Heating gypsum board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117966988A (en) |
-
2023
- 2023-11-23 CN CN202311575323.9A patent/CN117966988A/en active Pending
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