CN117966982A - Heat preservation layer based on silicon substrate heat preservation material and laying method thereof - Google Patents
Heat preservation layer based on silicon substrate heat preservation material and laying method thereof Download PDFInfo
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- CN117966982A CN117966982A CN202410363347.6A CN202410363347A CN117966982A CN 117966982 A CN117966982 A CN 117966982A CN 202410363347 A CN202410363347 A CN 202410363347A CN 117966982 A CN117966982 A CN 117966982A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 121
- 239000010703 silicon Substances 0.000 title claims abstract description 121
- 238000004321 preservation Methods 0.000 title claims abstract description 72
- 239000000463 material Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 239000012774 insulation material Substances 0.000 claims abstract description 65
- 238000009413 insulation Methods 0.000 claims abstract description 54
- 239000011810 insulating material Substances 0.000 claims abstract description 42
- 239000000499 gel Substances 0.000 claims description 117
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 114
- 239000000377 silicon dioxide Substances 0.000 claims description 57
- 230000007613 environmental effect Effects 0.000 claims description 26
- 230000011218 segmentation Effects 0.000 claims description 19
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 16
- 239000004965 Silica aerogel Substances 0.000 claims description 10
- -1 amino modified graphene Chemical class 0.000 claims description 10
- 239000011734 sodium Substances 0.000 claims description 10
- 229910052708 sodium Inorganic materials 0.000 claims description 10
- 238000010586 diagram Methods 0.000 claims description 9
- 239000011325 microbead Substances 0.000 claims description 9
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 8
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 8
- 229920000388 Polyphosphate Polymers 0.000 claims description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 8
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 8
- 239000000839 emulsion Substances 0.000 claims description 8
- 229920003063 hydroxymethyl cellulose Polymers 0.000 claims description 8
- 229940031574 hydroxymethyl cellulose Drugs 0.000 claims description 8
- 229920000570 polyether Polymers 0.000 claims description 8
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 8
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 8
- 239000001205 polyphosphate Substances 0.000 claims description 8
- 235000011176 polyphosphates Nutrition 0.000 claims description 8
- 229920001909 styrene-acrylic polymer Polymers 0.000 claims description 8
- 239000002562 thickening agent Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000080 wetting agent Substances 0.000 claims description 8
- 239000013530 defoamer Substances 0.000 claims description 6
- 239000010426 asphalt Substances 0.000 claims description 4
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 4
- 239000002210 silicon-based material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 25
- 239000004566 building material Substances 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 69
- 238000005336 cracking Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011490 mineral wool Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010451 perlite Substances 0.000 description 2
- 235000019362 perlite Nutrition 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- HUWSZNZAROKDRZ-RRLWZMAJSA-N (3r,4r)-3-azaniumyl-5-[[(2s,3r)-1-[(2s)-2,3-dicarboxypyrrolidin-1-yl]-3-methyl-1-oxopentan-2-yl]amino]-5-oxo-4-sulfanylpentane-1-sulfonate Chemical compound OS(=O)(=O)CC[C@@H](N)[C@@H](S)C(=O)N[C@@H]([C@H](C)CC)C(=O)N1CCC(C(O)=O)[C@H]1C(O)=O HUWSZNZAROKDRZ-RRLWZMAJSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
Landscapes
- Building Environments (AREA)
Abstract
The invention relates to the technical field of building materials, and discloses a heat preservation layer based on a silicon substrate heat preservation material and a paving method thereof, wherein the heat preservation layer comprises the following components: the moisture-absorbing heat-insulating material is arranged at a preset position of the area to be insulated; the first silicon-based gel is filled in the joint area between the current area to be insulated and other areas to be insulated; the second silicon-based gel is filled in the areas except the joint area in the current area to be insulated, the moisture-absorbing insulation material is covered below the second silicon-based gel, the height of the moisture-absorbing insulation material is larger than the distance between the top of the moisture-absorbing insulation material and the top surface of the second silicon-based gel, and the thermal expansion coefficient of the first silicon-based gel is smaller than that of the second silicon-based gel; and the joint filling material is arranged in a gap between the first silicon-based gel and the second silicon-based gel. The combination mode of the heat insulation materials and the paving mode thereof are optimized and improved, so that the heat insulation effect is ensured to the maximum extent, the service life of the heat insulation system is prolonged, and the actual requirements are met.
Description
Technical Field
The invention relates to the technical field of building materials, in particular to a heat preservation layer based on a silicon-based heat preservation material and a paving method of the heat preservation layer based on the silicon-based heat preservation material.
Background
Due to the increasing number of buildings in recent years, the building technology is improved continuously, and the requirements of the buildings are higher and higher, wherein the requirements of the building thermal insulation technology are included.
In the prior art, in order to realize the requirements of heat preservation, energy conservation and the like, people lay heat preservation materials on the surface of a building, such as the outer wall or the ground of the building. Common thermal insulation materials include organic thermal insulation materials and inorganic thermal insulation materials, and due to the defects of inflammability (release of toxic gas), easy aging, environmental influence, high cost and the like of the organic thermal insulation materials, people increasingly use the inorganic thermal insulation materials.
The inorganic heat-insulating materials commonly used at present comprise hollow vitrified microbeads, expanded perlite, closed-cell perlite, rock wool and the like, and in the use process, a certain inorganic heat-insulating material is often uniformly paved on the surface of a building so as to achieve the heat-insulating effect. However, in the practical application process, the technical personnel find that the existing inorganic heat insulation material has at least the following technical problems:
On one hand, the surface of the building is inevitably wetted due to natural environment and human factors, so that the heat insulation material is wetted, the heat insulation effect of the heat insulation material is greatly reduced due to the wetting, and the user is puzzled; on the other hand, the surface of the building is also subjected to day-night temperature difference, especially for the area with larger day-night temperature difference, the temperature difference of the surface of the building can reach 80-100 ℃ in a short period, and the heat insulation material can crack due to uneven thermal expansion effect and further cause failure or weakening of the heat insulation effect.
Disclosure of Invention
In order to overcome the technical problems in the prior art, the embodiment of the invention provides the heat preservation layer based on the silicon-based heat preservation material and the paving method thereof, and the combination mode of the heat preservation material and the paving mode thereof are optimized and improved, so that the heat preservation effect is ensured to the maximum extent, the service life of the heat preservation system is prolonged, and the actual requirements are met.
In order to achieve the above object, an embodiment of the present invention provides an insulation layer based on a silicon substrate insulation material, the insulation layer including: the moisture-absorbing heat-insulating material is arranged at a preset position of the area to be insulated and has preset moisture-absorbing performance; the first silicon-based gel is filled in the joint area between the current area to be insulated and other areas to be insulated; the second silicon-based gel is filled in the areas except the joint area in the current area to be insulated, the moisture-absorbing insulation material is covered below the second silicon-based gel, the height of the moisture-absorbing insulation material is larger than the distance between the top of the moisture-absorbing insulation material and the top surface of the second silicon-based gel, the thermal expansion coefficient of the first silicon-based gel is smaller than that of the second silicon-based gel, and the difference between the thermal expansion coefficients of the first silicon-based gel and the second silicon-based gel is smaller than a preset threshold; and the joint filling material is arranged in a gap between the first silicon-based gel and the second silicon-based gel.
Preferably, the first silicon-based gel and the second silicon-based gel are both silicon-based thermal insulation materials.
Preferably, the mass ratio of the first silicon-based gel is as follows: 70 parts of styrene-acrylic emulsion, 10 parts of nano ceramic microbeads, 1-3 parts of asphalt intermediate phase, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution, 7-12 parts of amino modified graphene oxide-sodium alginate-silica aerogel and 30 parts of water;
The mass ratio of the second silicon-based gel is as follows: 70 parts of styrene-acrylic emulsion, 5 parts of inorganic silicate, 10 parts of nano ceramic microbeads, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 30 parts of water, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution and 7-12 parts of amino modified graphene oxide-sodium alginate-silica aerogel.
Preferably, before laying the moisture-absorbing insulation material, it comprises: determining the damp data of the region to be insulated according to the environmental information of the region to be insulated; determining the arrangement density of the moisture-absorbing heat-insulating material in the area to be insulated based on the moisture-receiving data; and determining the preset position of the moisture-absorbing heat-insulating material in the region to be insulated based on the arrangement density.
Preferably, before filling and disposing the first silicon-based gel, it comprises: determining temperature difference information of the region to be insulated according to the environmental information; analyzing the deformation of the first silicon-based gel and the second silicon-based gel based on the damp information and the temperature difference information to generate deformation analysis information; and determining the volume size of the first silicon-based gel based on the deformation analysis information.
On the other hand, the embodiment of the invention provides a method for paving an insulation layer based on a silicon-based insulation material, which comprises the following steps: acquiring a region to be insulated of a current building; acquiring environmental temperature data and damp data of the area to be insulated; performing temperature difference segmentation on the region to be insulated based on the environmental temperature data to generate a first segmented region; carrying out damp segmentation on each region in the first segmented region based on the damp data to generate a region to be paved; and paving the heat preservation layer based on the silicon substrate heat preservation material in the area to be paved.
Preferably, the method further comprises: obtaining the maximum laying unit area of the heat preservation layer based on the silicon substrate heat preservation material; judging whether an oversized area larger than the maximum paving unit area exists in the area to be paved; and if so, re-dividing the oversized region based on the maximum paving unit area to generate a new region to be paved.
Preferably, the performing temperature difference segmentation on the region to be insulated based on the environmental temperature data to generate a first segmented region includes: determining a temperature difference gradient of any unit space in the region to be insulated based on the environmental temperature data; drawing a corresponding temperature difference gradient map based on the temperature difference gradient; and performing temperature difference segmentation on the temperature gradient map based on a preset temperature difference threshold value to generate a first segmented region.
Preferably, the generating the area to be paved by performing the damp division on each area in the first divided area based on the damp data includes: carrying out moisture content analysis on any unit space in the region to be insulated based on the moisture content data to generate a corresponding moisture content estimated value; carrying out damp grade division on the region to be insulated based on a preset damp grading rule and the damp pre-estimated value to generate a damp grade diagram; and carrying out damp segmentation on each region in the first segmented region according to the damp grade diagram, and generating a region to be paved.
Preferably, the thermal insulation layer based on the silicon-based thermal insulation material comprises a first silicon-based gel and a second silicon-based gel, and the thermal insulation layer based on the silicon-based thermal insulation material is paved in the area to be paved, and the thermal insulation layer based on the silicon-based thermal insulation material comprises: determining the volume ratio of the first silicon-based gel to the second silicon-based gel according to the temperature difference gradient; preparing a heat preservation layer which is required to be paved in each area to be paved and is based on a silicon-based heat preservation material based on the volume ratio; and paving the heat preservation layer based on the silicon substrate heat preservation material.
Through the technical scheme provided by the invention, the invention has at least the following technical effects:
The traditional single heat-insulating material is combined and configured by optimizing the existing heat-insulating material, so that the defects of the single heat-insulating material are effectively weakened or avoided on the basis of combining the heat-insulating properties of a plurality of heat-insulating materials, and the optimal heat-insulating property and the optimal temperature difference resistance are realized; meanwhile, the laying mode of the heat preservation layer is adjusted and optimized according to the actual condition of the area to be insulated, so that the optimal heat preservation performance is realized in an optimal laying mode, the service life of the heat preservation layer is prolonged, and the actual requirements of users are met.
Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain, without limitation, the embodiments of the invention. In the drawings:
Fig. 1 is a schematic structural diagram of an insulation layer based on a silicon-based insulation material according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thermal insulation layer based on a silicon-based thermal insulation material according to a second embodiment of the present invention;
FIG. 3 is a schematic view of the arrangement of the moisture-absorbing insulation material according to the embodiment of the present invention;
fig. 4 is a flowchart of a specific implementation of a method for paving an insulation layer based on a silicon-based insulation material according to an embodiment of the present invention.
Description of the reference numerals
10. First silicon-based gel of moisture-absorbing thermal insulation material 20
30. Second silicon-based gel 40 caulking material
Detailed Description
The following describes the detailed implementation of the embodiments of the present invention with reference to the drawings. It should be understood that the detailed description is presented by way of example only and is not intended to limit the embodiments of the invention, but rather, all other embodiments that may be derived by one of ordinary skill in the art without undue burden are within the scope of the present invention.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the term "plurality" means two or more, and thus, in the embodiments of the present invention, the term "plurality" may also be understood as "at least two". "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/", unless otherwise specified, generally indicates that the associated object is an "or" relationship. In addition, it should be understood that in the description of embodiments of the present invention, the words "first," "second," and the like are used merely for distinguishing between the descriptions and not be construed as indicating or implying a relative importance or order. The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements.
Example 1: referring to fig. 1, an embodiment of the present invention provides an insulation layer based on a silicon substrate insulation material, where the insulation layer includes: the moisture-absorbing heat-insulating material 10 is arranged at a preset position of the area to be insulated, and the moisture-absorbing heat-insulating material 10 has preset moisture-absorbing performance; the first silica-based gel 20 fills the joint area between the current area to be insulated and other areas to be insulated; the second silicon-based gel 30 is filled in the areas except the joint area in the current area to be insulated, the moisture-absorbing insulation material 10 is covered below the second silicon-based gel 30, the height of the moisture-absorbing insulation material 10 is larger than the distance between the top of the moisture-absorbing insulation material 10 and the top surface of the second silicon-based gel 30, the thermal expansion coefficient of the first silicon-based gel 20 is smaller than that of the second silicon-based gel 30, and the difference between the thermal expansion coefficients of the first silicon-based gel 20 and the second silicon-based gel 30 is smaller than a preset threshold; and a caulking material 40 disposed in a gap between the first and second silicon-based gels 20 and 30.
In one possible implementation manner, the area to be insulated is a rectangular area (or a rectangular area when projected onto a plane, for example, when an insulating layer is arranged on a certain pipeline, the area to be arranged is a rectangular area when projected onto the plane), when the insulating layer based on the silicon-based insulating material provided by the embodiment of the invention is arranged, firstly, the moisture-absorbing insulating material 10 is arranged at a preset position of the rectangular area, and the moisture-absorbing insulating material 10 is preferably in a cuboid shape, and the preset position can be determined according to a preset arrangement proportion relation of the moisture-absorbing insulating material 10, or can be determined according to actual needs of a field environment. For example, in this embodiment, the moisture-absorbing thermal insulation material 10 is disposed in the second silica-based gel 30 at a fixed interval (for example, one is disposed every 0.5 m), and specifically, the moisture-absorbing thermal insulation material 10 is sequentially adhered to the surface of the building at the fixed interval.
Preferably, the moisture-absorbing insulation 10 includes, but is not limited to, rock wool, polystyrene, polyurethane foam, glass wool, mineral wool board, etc., and further preferably, the moisture-absorbing insulation 10 is rock wool. The moisture-absorbing thermal insulation material 10 has preset moisture-absorbing performance, specifically, the moisture-absorbing performance is 1% -10%.
However, since the application environments of the heat insulating material may be greatly different, for example, there may be a great gap between the application of the heat insulating material in the northern area and the application of the environment humidity faced by the application of the heat insulating material in the southern area, the moisture-absorbing heat insulating material 10 is only arranged according to the fixed interval, so that the requirements of all application scenes cannot be met, and the heat insulating effect is reduced.
In an embodiment of the present invention, before the moisture-absorbing insulation material 10 is laid, it includes: determining the damp data of the region to be insulated according to the environmental information of the region to be insulated; determining the arrangement density of the moisture-absorbing heat-insulating material in the area to be insulated based on the moisture-receiving data; and determining the preset position of the moisture-absorbing heat-insulating material in the region to be insulated based on the arrangement density.
Specifically, before the moisture-absorbing heat-insulating material 10 is laid, firstly, the moisture-absorbing information is determined according to the environmental information of the current area to be heat-insulating, for example, in one embodiment, the heat-insulating material is laid on the outer wall of a certain building, the relevant data of the external moisture is estimated according to the geographical environment where the heat-insulating material is located, then the relevant data of the internal moisture is estimated according to the building information (including but not limited to building materials, construction height, house use and the like) of the building, then the moisture-absorbing data of the current heat-insulating area are comprehensively estimated, the arrangement density of the moisture-absorbing heat-insulating material 10 in the area to be heat-insulating is determined according to the moisture-absorbing data, and specifically, when the moisture-absorbing data is larger than a certain value, the moisture-absorbing condition of the area to be heat-insulating material 10 is considered to be more serious, so that the moisture-absorbing heat-insulating material 10 is laid in a denser mode to enhance the moisture-absorbing capacity and reduce the influence of moisture on the whole heat-insulating layer; when the moisture data is smaller than a certain value, the moisture condition of the area to be insulated is considered to be smaller, so that the moisture-absorbing insulation material 10 is arranged in a sparse mode, the consistency of the insulation layer is ensured to the maximum extent, and the insulation effect is improved. And determining the preset position of the moisture-absorbing heat-insulating material 10 in the region to be insulated according to the different arrangement modes, and then arranging the moisture-absorbing heat-insulating material 10.
In the embodiment of the invention, the distribution density of the moisture-absorbing heat-insulating material 10 is configured according to the actual environment of the area to be insulated, so that the overall consistency of the heat-insulating layer is maximally maintained on the basis of meeting the maximum moisture-absorbing performance and guaranteeing the optimal heat-insulating effect, and the heat-insulating effect is maximized.
At this time, the current region to be insulated is further filled with the first silica-based gel 20, the first silica-based gel 20 is filled in the joint region of the current region to be insulated in other regions to be insulated, the first silica-based gel 20 is preferably rectangular, and in order to be fully spliced with the second silica-based gel 30 and the insulating materials of the other regions to be insulated, a certain compensation effect is provided for thermal expansion and contraction of the second silica-based gel 30, and the thermal expansion coefficient of the first silica-based gel 20 is smaller than that of the second silica-based gel 30. The volume of the first silica-based gel 20 may be predetermined according to a fixed parameter, or may be determined according to the field environment of the current region to be insulated.
In an embodiment of the present invention, before filling and disposing the first silica-based gel 20, the method includes: determining temperature difference information of the region to be insulated according to the environmental information; analyzing deformation of the first and second silicon-based gels 20 and 30 based on the moisture information and the temperature difference information to generate deformation analysis information; the volume size of the first silicon-based gel 20 is determined based on the deformation analysis information.
In one possible implementation manner, the temperature difference information is determined according to the environmental information of the current area to be insulated, and in the embodiment of the invention, since the thermal expansion coefficient of the silica-based gel is often low, the deformation amount generated by the silica-based gel along with the thermal expansion and contraction of the temperature is small, and the deformation is slow, the temperature difference information is macroscopic temperature difference information, for example, the temperature difference information within one day in a short period. For a part of the silica-based gel, deformation of the silica-based gel may be affected by the degree of moisture, so in this embodiment, deformation of the first silica-based gel 20 and the second silica-based gel 30 is analyzed based on the moisture information and the temperature difference information at the same time, corresponding deformation analysis information is generated, and then the volume of the first silica-based gel 20 is determined according to the deformation analysis information, specifically, for a region with larger deformation of the silica-based gel due to larger temperature difference in a short period, the volume of the first silica-based gel 20 is relatively larger, so as to satisfy a larger deformation compensation effect, and ensure the overall heat preservation effect of the heat preservation layer; for the region with smaller temperature difference in the short term and smaller deformation of the silicon-based gel, the volume of the first silicon-based gel 20 is relatively smaller, so that the overall consistency of the heat preservation layer is better kept, and the consistency of the heat preservation effect is ensured.
In the embodiment of the invention, the volume of the first silica-based gel 20 accounts for 1/20-1/10 of the total volume of the heat insulation layer.
After determining the volume of the first silica-based gel 20, the first silica-based gel 20 is prepared, and in the embodiment of the present invention, both the first silica-based gel 20 and the second silica-based gel 30 are silica-based thermal insulation materials. Preferably, the mass ratio of the first silica-based gel 20 is: 70 parts of styrene-acrylic emulsion, 10 parts of nano ceramic microbeads, 1 part of asphalt intermediate phase, 0.5 part of polyphosphate type dispersing agent, 0.5 part of polyether type defoaming agent, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution, 7 parts of amino modified graphene oxide-sodium alginate-silica aerogel and 30 parts of water; the mass ratio of the second silicon-based gel 30 is as follows: 70 parts of styrene-acrylic emulsion, 5 parts of inorganic silicate, 10 parts of nano ceramic microbeads, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 30 parts of water, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution and 7 parts of amino modified graphene oxide-sodium alginate-silica aerogel. In the embodiment of the invention, the amino modified graphene oxide-sodium alginate-silica aerogel is an aerogel provided by the prior art, for example, please refer to a preparation method of the amino modified graphene oxide-sodium alginate-silica aerogel disclosed in patent CN 117229678B.
By differential design of the first silica-based gel 20 and the second silica-based gel 30, different materials are applied to the detailed material components in the first silica-based gel 20 and the second silica-based gel 30 so as to change the thermal expansion coefficients of the materials, and the compensation and buffering effects of shrinkage or expansion of the materials at different temperatures are realized; meanwhile, the main components of the heat insulation material are kept similar, so that the heat insulation material is better attached, the compatibility of the heat insulation material is improved, the gap problem caused by incompatibility or rejection of different materials is reduced, and the heat insulation effect is ensured.
After the first silica-based gel 20 is set, a second silica-based gel 30 is filled in the remaining area of the current heat insulation area, wherein the second silica-based gel 30 covers the moisture-absorbing heat insulation material 10 below the second silica-based gel to ensure consistency of the heat insulation material as much as possible, and in the embodiment of the invention, the height of the moisture-absorbing heat insulation material 10 is greater than the distance between the top of the moisture-absorbing heat insulation material 10 and the top surface of the second silica-based gel 30, i.e. the height of the moisture-absorbing heat insulation material 10 is greater than half of the total height of the heat insulation layer, so as to ensure sufficient moisture-absorbing performance and buffering performance.
Finally, the caulking material 40 is disposed in the gap between the first silica-based gel 20 and the second silica-based gel 30 so as to effectively splice the first silica-based gel and the second silica-based gel together, in the embodiment of the present invention, the caulking material 40 is any one of a polyurethane caulking agent, a silicone caulking agent and a rubber caulking material, preferably, the caulking material 40 is a silicone caulking agent, and by using the silicone caulking agent, on one hand, the first silica-based gel 20 and the second silica-based gel 30 can be tightly adhered together, and on the other hand, the extensibility of the caulking material 40 can perform better filling when the first silica-based gel 20 and the second silica-based gel 30 generate gaps due to thermal expansion and contraction, thereby preventing the generation of intermediate gaps and guaranteeing the integrity of heat insulation performance.
In the embodiment of the invention, the heat-insulating layer is formed by adopting the combined materials based on the silicon-based gel and other materials with buffering and moisture absorbing properties, so that the influence of the reduction of the heat-insulating effect caused by moisture and the cracking of the heat-insulating layer caused by larger temperature difference can be effectively reduced on the basis of ensuring the heat-insulating effect to the greatest extent, the optimal heat-insulating effect of the heat-insulating layer and the duration of the heat-insulating effect of the heat-insulating layer are integrally ensured, and the user experience is improved.
Example 2: referring to fig. 2, another embodiment of a thermal insulation layer based on a silicon-based thermal insulation material according to an embodiment of the present invention is provided. In this embodiment, the area to be insulated is a circular area, and when the insulation layer is laid, the layout position of the moisture-absorbing insulation material 10 is first determined. Specifically, the placement can be performed according to a predetermined fixed position, or the optimal placement position of the moisture-absorbing and heat-insulating material 10 can be determined according to the moisture information of the current area to be insulated, for example, the moisture-absorbing and heat-insulating material 10 is placed every 90 degrees with the circle of the current heat-insulating area as the center.
In order to provide a better thermal expansion buffering effect for the second silica-based gel 30, a gap of 0.5-3mm is provided between the moisture-absorbing thermal insulation material 10 and the second silica-based gel 30, for example, see fig. 3, to prevent the silica-based gel from arching up the building materials (including but not limited to thermal insulation materials, adhesive materials, aesthetic materials, etc.) of the building surfaces due to thermal expansion and further causing loss or reduction of thermal insulation performance.
After the moisture-absorbing thermal insulation material 10 is bonded, a first silica-based gel 20 is further disposed, and in the embodiment of the present invention, preferably, the mass ratio of the first silica-based gel 20 is: 70 parts of styrene-acrylic emulsion, 10 parts of nano ceramic microbeads, 3 parts of asphalt intermediate phase, 0.5 part of polyphosphate type dispersing agent, 0.5 part of polyether type defoaming agent, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution, 12 parts of amino modified graphene oxide-sodium alginate-silica aerogel and 30 parts of water; the mass ratio of the second silicon-based gel 30 is as follows: 70 parts of styrene-acrylic emulsion, 5 parts of inorganic silicate, 10 parts of nano ceramic microbeads, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 30 parts of water, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution and 12 parts of amino modified graphene oxide-sodium alginate-silica aerogel. The first silica-based gel 20 is arranged on the periphery of the current heat preservation area in a ring shape, after the arrangement is completed, the second silica-based gel 30 is further arranged on the rest area of the current heat preservation area, and finally the first silica-based gel 20 and the second silica-based gel 30 are effectively bonded together through the joint compound 40.
Further, referring to fig. 4, an embodiment of the present invention further provides a method for paving an insulation layer based on a silicon substrate insulation material according to an embodiment of the present invention, where the method includes:
S10) obtaining a region to be insulated of a current building;
s20) acquiring environmental temperature data and damp data aiming at the area to be insulated;
S30) carrying out temperature difference segmentation on the region to be insulated based on the environmental temperature data to generate a first segmented region;
S40) carrying out damp division on each area in the first divided areas based on the damp data to generate areas to be paved;
S50) paving the heat preservation layer based on the silicon-based heat preservation material in the area to be paved.
In one possible implementation, an insulation layer needs to be laid on a designated area of a building, and in order to achieve optimal insulation performance, an optimal laying mode needs to be determined according to actual situations. In the embodiment of the invention, firstly, the area to be insulated of the current building is obtained, namely, the shape, the size, the position in the three-dimensional space and the like of the designated area are determined, so that the area to be insulated is determined. And then acquiring the environmental temperature data and the humidifying data of the area to be insulated. And carrying out temperature difference segmentation on the region to be insulated according to the environmental temperature data so as to generate a first segmented region.
In the embodiment of the present invention, the performing temperature difference segmentation on the region to be insulated based on the environmental temperature data to generate a first segmented region includes: determining a temperature difference gradient of any unit space in the region to be insulated based on the environmental temperature data; drawing a corresponding temperature difference gradient map based on the temperature difference gradient; and performing temperature difference segmentation on the temperature gradient map based on a preset temperature difference threshold value to generate a first segmented region.
Specifically, the temperature gradient of any unit space in the area to be insulated is determined according to the environmental temperature data, the temperature gradient can be an estimated value of the environmental temperature according to the planning information of the current building, then a corresponding temperature gradient map is drawn according to the temperature gradient, and specifically, the temperature gradient of each unit space is projected into the area to be insulated to form the temperature gradient map of the area to be insulated. At this time, the temperature gradient map is subjected to temperature difference segmentation based on a preset temperature difference threshold (for example, ±1 ℃) so as to generate a first segmented region, namely, when the temperature gradient of one region differs from the temperature gradient of other regions by more than 1 ℃, the first segmented region is segmented into two different regions. Of course, the technician can adopt different preset temperature difference thresholds according to the actual situation so as to meet the actual application situation, and redundant description is omitted here.
At this time, each region in the first divided regions is further divided into damp-proof segments based on the damp-proof data to generate a region to be laid. In an embodiment of the present invention, the generating the to-be-paved area by performing the moisture segmentation on each area in the first segmented area based on the moisture data includes: carrying out moisture content analysis on any unit space in the region to be insulated based on the moisture content data to generate a corresponding moisture content estimated value; carrying out damp grade division on the region to be insulated based on a preset damp grading rule and the damp pre-estimated value to generate a damp grade diagram; and carrying out damp segmentation on each region in the first segmented region according to the damp grade diagram, and generating a region to be paved.
In one possible embodiment, firstly, a moisture content analysis is performed on any unit space in the region to be insulated based on the moisture content data, and the moisture content analysis is estimated and determined based on the application environment of the region to be insulated and the planning information (such as the planned use type of the current building, and the estimated moisture content in the use process can be estimated according to the planned use type). After the moisture predicted value in each unit space is determined, the moisture classification is carried out on the area to be insulated according to the preset moisture classification rule and the moisture predicted value, so as to generate a moisture classification chart. For example, the preset moisture grading rule is: the classified areas are classified according to their degree of dryness, for example, they are classified into one degree of dryness for every 10% increase in the degree of dryness, such as 1-grade dryness (dryness < 10%), 2-grade dryness (dryness. Gtoreq.10% and < 20%), … and so on. And at the moment, further carrying out damp segmentation on each area in the first segmented areas according to the damp grade diagram so as to generate the areas to be paved.
At the moment, the heat preservation layer based on the silicon substrate heat preservation material provided by the embodiment of the invention is paved according to the area to be paved. However, in the practical application process, because the moisture content of the larger area may be consistent and the temperature difference is smaller in the same environment, the larger area exists in the area to be paved, and at this time, if the paving of the heat insulation layer based on the silicon-based heat insulation material is directly performed, the heat insulation effect may be reduced.
In an embodiment of the present invention, the method further includes: obtaining the maximum laying unit area of the heat preservation layer based on the silicon substrate heat preservation material; judging whether an oversized area larger than the maximum paving unit area exists in the area to be paved; and if so, re-dividing the oversized region based on the maximum paving unit area to generate a new region to be paved.
In one possible implementation manner, the maximum laying unit area of the heat insulation layer based on the silicon substrate heat insulation material can be predetermined, after the area to be laid is generated, whether the area to be laid has an oversized area larger than the maximum laying unit area is further judged, if yes, the area to be laid is subjected to re-segmentation operation, so that segmented areas meeting the optimal laying heat insulation effect are obtained, and a new area to be laid is generated.
It should be noted that, each area in the area to be paved, which is obtained by the above method, may be an irregular area, so that trouble is caused to the paving of the insulating layer based on the silicon-based insulating material by the staff, so that the staff can adjust the irregular area to be a regular area corresponding to the regular shape of the insulating layer based on the silicon-based insulating material according to actual needs, so as to be more beneficial to the paving work of the insulating layer based on the silicon-based insulating material, and redundant description is omitted.
In the embodiment of the invention, the optimal laying mode is determined by carrying out moisture content and temperature difference analysis on the area to be insulated of the building, and the optimal laying unit area of the insulating layer based on the silicon-based insulating material is combined to further optimize the laying mode, so that the maximization of the whole insulating effect is ensured, and the actual insulating requirement of a user is met.
In the embodiment of the present invention, the thermal insulation layer based on the silicon thermal insulation material includes a first silicon-based gel 20 and a second silicon-based gel 30, and the paving the thermal insulation layer based on the silicon thermal insulation material in the area to be paved includes: determining the volume fractions of the first and second silicon-based gels 20, 30 from the temperature differential gradient; preparing a heat preservation layer which is required to be paved in each area to be paved and is based on a silicon-based heat preservation material based on the volume ratio; and paving the heat preservation layer based on the silicon substrate heat preservation material.
In a specific paving process, in order to achieve a balance between the optimal thermal insulation performance and the optimal temperature difference resistance performance, the volume ratio of the first silica-based gel 20 to the second silica-based gel 30 is determined according to the temperature gradient of the area to be insulated, and specifically, the volume ratio is 1: 20-1: 10.
In the embodiment of the invention, the heat insulation material is improved, the heat insulation layer based on the silicon substrate is adopted, the combination mode of various materials is comprehensively determined based on the heat insulation and moisture resistance of the heat insulation layer and the environmental moisture and temperature difference factors, and on the basis, the paving mode of the heat insulation layer is dynamically adjusted by further combining the environmental moisture and temperature difference factors, so that the paved heat insulation layer has the optimal heat insulation effect and crack resistance effect, the heat insulation performance of a building is ensured, the service life of a building heat insulation system is prolonged, and the actual requirements of users are met.
On the other hand, the embodiment of the invention also provides a heat preservation system of a building, the heat preservation system comprises a leveling layer, an adhesive layer and an anti-cracking protective layer, the heat preservation system further comprises the heat preservation layer based on the silicon-based heat preservation material, which is provided by the embodiment of the invention, the leveling layer is paved on the surface of the building, the adhesive layer is paved on the surface of the leveling layer, the heat preservation layer based on the silicon-based heat preservation material is adhered on the surface of the adhesive layer, and the anti-cracking protective layer is paved on the surface of the heat preservation layer based on the silicon-based heat preservation material.
When the heat preservation system of the building is paved, for example, the surface of the building can be firstly subjected to preliminary treatment (such as leveling, polishing and the like), then the leveling layers are sequentially arranged to provide a flat surface for subsequent work, the bonding layer is further arranged on the basis of the leveling layers, then the heat preservation layer based on the silicon-based heat preservation material is paved on the surface of the bonding layer, after the heat preservation layer based on the silicon-based heat preservation material is firmly bonded, the anti-cracking protective layer is further paved on the surface of the heat preservation layer based on the silicon-based heat preservation material so as to further protect the heat preservation layer based on the silicon-based heat preservation material from cracking, and finally the attractive material is arranged on the surface of the anti-cracking protective layer so as to form the heat preservation system of the building.
The foregoing details of the optional implementation of the embodiment of the present invention have been described in conjunction with the accompanying drawings, but the embodiment of the present invention is not limited to the specific details of the foregoing implementation, and various simple modifications may be made to the technical solution of the embodiment of the present invention within the scope of the technical concept of the embodiment of the present invention, where all the simple modifications belong to the protection scope of the embodiment of the present invention.
In addition, the specific features described in the above embodiments may be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, various possible combinations of embodiments of the present invention are not described in detail.
Those skilled in the art will appreciate that all or part of the steps in implementing the methods of the embodiments described above may be implemented by a program stored in a storage medium, including instructions for causing a single-chip microcomputer, chip or processor (processor) to perform all or part of the steps of the methods of the embodiments described herein. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In addition, any combination of various embodiments of the present invention may be performed, so long as the concept of the embodiments of the present invention is not violated, and the disclosure of the embodiments of the present invention should also be considered.
Claims (8)
1. An insulation layer based on a silicon substrate insulation material, characterized in that the insulation layer comprises:
the moisture-absorbing heat-insulating material (10) is arranged at a preset position of the area to be insulated, and the moisture-absorbing heat-insulating material (10) has preset moisture-absorbing performance;
The first silica-based gel (20) is filled in the joint area between the current area to be insulated and other areas to be insulated;
the second silicon-based gel (30) is filled in the areas except the joint area in the current area to be insulated, the moisture-absorbing insulation material (10) is covered below the second silicon-based gel (30), the height of the moisture-absorbing insulation material (10) is larger than the distance between the top of the moisture-absorbing insulation material (10) and the top surface of the second silicon-based gel (30), the thermal expansion coefficient of the first silicon-based gel (20) is smaller than that of the second silicon-based gel (30), and the difference between the thermal expansion coefficients of the first silicon-based gel (20) and the second silicon-based gel (30) is smaller than a preset threshold;
a caulking material (40) disposed in a gap between the first silicon-based gel (20) and the second silicon-based gel (30);
The first silicon-based gel (20) and the second silicon-based gel (30) are both silicon-based material insulation materials, and the mass ratio of the first silicon-based gel (20) is as follows: 70 parts of styrene-acrylic emulsion, 10 parts of nano ceramic microbeads, 1-3 parts of asphalt intermediate phase, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5 mol/L aqueous ammonia solution, 7-12 parts of amino modified graphene oxide-sodium alginate-silica aerogel and 30 parts of water;
The mass ratio of the second silicon-based gel (30) is as follows: 70 parts of styrene-acrylic emulsion, 5 parts of inorganic silicate, 10 parts of nano ceramic microbeads, 0.5 part of polyphosphate dispersing agent, 0.5 part of polyether defoamer, 0.5 part of dodecyl polyoxyethylene ether wetting agent, 8 parts of propylene glycol methyl ether film forming auxiliary agent, 30 parts of water, 1 part of hydroxymethyl cellulose thickener, 1 part of 0.5mol/L aqueous ammonia solution and 7-12 parts of amino modified graphene oxide-sodium alginate-silica aerogel.
2. Insulation according to claim 1, characterized in that it comprises, before laying the moisture-absorbing insulation (10):
determining the damp data of the region to be insulated according to the environmental information of the region to be insulated;
determining the arrangement density of the moisture-absorbing heat-insulating material (10) in the area to be insulated based on the moisture-receiving data;
And determining the preset position of the moisture-absorbing heat-insulating material (10) in the area to be insulated based on the arrangement density.
3. Insulation according to claim 2, characterized in that it comprises, before filling the first silica-based gel (20):
determining temperature difference information of the region to be insulated according to the environmental information;
analyzing deformation of the first silicon-based gel (20) and the second silicon-based gel (30) based on the moisture information and the temperature difference information, and generating deformation analysis information;
determining the volume size of the first silicon-based gel (20) based on the deformation analysis information.
4. A method of laying an insulation layer based on a silicon-based insulation material according to any one of claims 1-3, characterized in that the method comprises:
acquiring a region to be insulated of a current building;
acquiring environmental temperature data and damp data of the area to be insulated;
Performing temperature difference segmentation on the region to be insulated based on the environmental temperature data to generate a first segmented region;
carrying out damp segmentation on each region in the first segmented region based on the damp data to generate a region to be paved;
And paving the heat preservation layer based on the silicon substrate heat preservation material in the area to be paved.
5. The method according to claim 4, wherein the method further comprises:
Obtaining the maximum laying unit area of the heat preservation layer based on the silicon substrate heat preservation material;
judging whether an oversized area larger than the maximum paving unit area exists in the area to be paved;
and if so, re-dividing the oversized region based on the maximum paving unit area to generate a new region to be paved.
6. The method of claim 4, wherein the performing temperature differential segmentation on the region to be insulated based on the ambient temperature data to generate a first segmented region comprises:
Determining a temperature difference gradient of any unit space in the region to be insulated based on the environmental temperature data;
drawing a corresponding temperature difference gradient map based on the temperature difference gradient;
And performing temperature difference segmentation on the temperature gradient map based on a preset temperature difference threshold value to generate a first segmented region.
7. The method of claim 4, wherein the generating the area to be paved by the moisture-affected segmentation of each of the first segmented areas based on the moisture-affected data comprises:
Carrying out moisture content analysis on any unit space in the region to be insulated based on the moisture content data to generate a corresponding moisture content estimated value;
Carrying out damp grade division on the region to be insulated based on a preset damp grading rule and the damp pre-estimated value to generate a damp grade diagram;
And carrying out damp segmentation on each region in the first segmented region according to the damp grade diagram, and generating a region to be paved.
8. The method according to claim 6, wherein the insulation layer based on silicon-based insulation material comprises a first silicon-based gel (20) and a second silicon-based gel (30), the laying of the insulation layer based on silicon-based insulation material at the area to be laid comprises:
determining the volume fractions of the first (20) and second (30) silicon-based gels from the temperature difference gradient;
preparing a heat preservation layer which is required to be paved in each area to be paved and is based on a silicon-based heat preservation material based on the volume ratio;
and paving the heat preservation layer based on the silicon substrate heat preservation material.
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