CN117931782A - Method, system and storage medium for sorting lithography rule inspection results - Google Patents

Method, system and storage medium for sorting lithography rule inspection results Download PDF

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CN117931782A
CN117931782A CN202311866052.2A CN202311866052A CN117931782A CN 117931782 A CN117931782 A CN 117931782A CN 202311866052 A CN202311866052 A CN 202311866052A CN 117931782 A CN117931782 A CN 117931782A
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defect
file
defects
layout
information
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张卓
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Shenzhen Jingyuan Information Technology Co Ltd
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Shenzhen Jingyuan Information Technology Co Ltd
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Abstract

The invention relates to the technical field of computational lithography, in particular to a lithography rule inspection result sorting method, a system and a storage medium, wherein the lithography rule inspection result sorting method comprises the following steps: providing a layout, and performing photoetching rule inspection on the layout to generate a database, wherein the database comprises corresponding defect information of all defects of the layout; screening defects based on defect information to obtain an initial defect file; acquiring a corresponding defect image in the layout based on the corresponding defect information in the initial defect file; creating a text file, associating the defects in the initial defect file with the corresponding defect images, and storing the associated defects in the text file to obtain a target defect file. The technical problems of complicated process and low accuracy in the sorting process of the detection result of the photolithography rule in the prior art are solved.

Description

Method, system and storage medium for sorting lithography rule inspection results
[ Field of technology ]
The invention relates to the technical field of computational lithography, in particular to a lithography rule inspection result sorting method, a system and a storage medium.
[ Background Art ]
Photolithography rule checking (LRC) refers to knowing in advance manufacturability issues that the chip may face in the future through a photolithography imaging model before performing a photolithography process, thereby minimizing the probability of integrated circuit failure. After Optical Proximity Correction (OPC) is carried out, quick and accurate rule hot spot detection is carried out on the full-chip photomask layout, and layout errors possibly occurring are found, so that the fault risk of devices in the later production process flow is reduced. Inspection results often include: layout defect images, defect coordinates, critical process window sizes, defect sizes, exposure imaging conditions and the like.
The inspection result data stored in the general computer system are stored in the background database in a structured way, and in the layout file, the existing inspection report is manually arranged by an engineer, the original inspection data is manually input into the inspection report according to a fixed format after being converted, the work efficiency is reduced due to complicated flow, and the accuracy is lower due to a large number of repeated works.
[ Invention ]
The invention provides a method, a system and a storage medium for sorting a photoetching rule inspection result, which are used for solving the technical problems of complicated process and low accuracy of sorting the photoetching rule inspection result in the prior art.
The technical problem to be solved by the invention is that a photoetching model establishment method comprises the following steps:
Providing a layout, and performing photoetching rule inspection on the layout to generate a database, wherein the database comprises all defects and corresponding defect information of the layout;
screening defects based on defect information to obtain an initial defect file;
acquiring a corresponding defect image in the layout based on the corresponding defect information in the initial defect file;
Creating a text file, associating the defects in the initial defect file with the corresponding defect images, and storing the associated defects in the text file to obtain a target defect file.
Further, the generating the database by performing lithography rule check on the layout includes:
performing photoetching rule inspection on the layout to obtain all defects in the layout and defect information corresponding to the defects;
acquiring a layout range in which a defect is located based on defect information, wherein the layout range comprises a plurality of line segments;
calculating the positions of the midpoints of the line segments where the defects are located relative to all the line segments, and sequencing to obtain hash values of the defects;
Grouping all defects based on the hash value of the defects to obtain a plurality of defect groups, marking all the defects to obtain defect marks, and forming a database by all the defect groups and the defect marks corresponding to the defect pairs.
Further, the defect information includes defect coordinates, line width measurement marks, cross-sectional lengths, pitches, negative exposure doses, and defect error values.
Further, the obtaining screens the defects, and the obtaining the initial defect file specifically includes:
sorting all defects in the same defect group from large to small based on the defect error value of each defect;
And obtaining and storing defect information and defect identifiers of the first N values in all the defect groups to obtain an initial defect file, wherein N is more than or equal to 1, and N is a natural number.
Further, the obtaining the corresponding defect image in the layout based on the corresponding defect information in the initial defect file specifically includes:
acquiring a corresponding defect area in the layout based on the defect coordinates;
Setting a preset area, wherein the preset area completely covers the defect area;
And rendering the preset area into a defect image.
Further, the obtaining the target file further includes:
And providing a readable interface, and calling the readable interface with the defect identifiers, the defect information and the defect images corresponding to all defects in the target defect file to obtain the readable file.
Further, the readable file includes any one of PPT, EXCEL, DOCX and PDF.
The invention also provides a lithography rule inspection result sorting system for solving the technical problems, which comprises:
and a data generation module: the method comprises the steps of providing a layout, and performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information of all defects of the layout;
The calculation module: the method comprises the steps of screening defects based on defect information to obtain an initial defect file;
An image acquisition module: the method comprises the steps of obtaining a corresponding defect image in a layout based on corresponding defect information in an initial defect file;
And a storage module: and the method is used for creating a text file, and storing the initial defect file and the corresponding defect image into the text file to obtain the target defect file.
Further, the lithography rule inspection result finishing system further comprises a conversion module, wherein the conversion module comprises a readable interface, and the conversion module is used for acquiring the target defect file and calling the readable interface to obtain the readable file.
The invention also provides a storage medium for solving the technical problems, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor realizes the lithography rule inspection result sorting method when executing the computer program.
Compared with the prior art, the method, the system and the storage medium for sorting the lithography rule inspection results provided by the invention have the following advantages:
1. The method for arranging the photoetching rule checking results comprises the following steps of providing a layout, carrying out photoetching rule checking on the layout to generate a database, wherein the database comprises all defects and corresponding defect information of the layout, and screening the defects based on the defect information to obtain an initial defect file; it should be noted that, because the defect data in the database is more, the data can be simplified by screening the defects, so as to facilitate the optimization of engineers; furthermore, the corresponding defect image is acquired in the layout based on the corresponding defect information in the initial defect file, and it is to be noted that compared with the prior art that the defect image in the layout where the defect is located is saved by manually capturing the images through an engineer, the invention reduces the burden of the engineer and improves the working efficiency by automatically acquiring the defect image in the layout where the defect is located, and further, a text file is created, the defect in the initial defect file and the corresponding defect image are associated and then saved in the text file, so that the target defect file is obtained, and the defect information and the defect image corresponding to the defect are saved, thereby being convenient for the engineer to review.
2. In the method for sorting the photoetching rule checking result provided by the embodiment of the invention, performing photoetching rule checking on the layout to generate a database comprises performing photoetching rule checking on the layout to obtain all defects in the layout and defect information corresponding to the defects; acquiring a layout range of the defect based on the defect information, wherein the layout range comprises a plurality of line segments; the method comprises the steps of calculating positions of midpoints of line segments where defects of all line segments are located relative to each other, sorting the positions to obtain hash values of the defects, grouping all the defects based on the hash values of the defects to obtain a plurality of defect groups, and marking all the defects to obtain defect marks.
3. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, the defect information comprises defect coordinates, line width measurement marks, cross section length, spacing, negative exposure dose and defect error values, and by acquiring all information about the defects, engineers can conveniently optimize and modify the defects based on the defect information.
4. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, the steps of obtaining and screening the defects and obtaining the initial defect file specifically comprise: sorting all defects in the same defect group from large to small based on the defect error value of each defect; and obtaining and storing defect information and defect identifiers of the first N values in all the defect groups to obtain an initial defect file, wherein N is more than or equal to 1, and N is a natural number. In this way, defects with a large influence on the final lithography result are screened out, so that engineers can optimize the defects in the follow-up process, and the working efficiency is improved.
5. In the method for sorting the inspection result of the lithography rule provided by the embodiment of the invention, the obtaining of the corresponding defect image in the layout based on the corresponding defect information in the initial defect file specifically comprises the following steps: acquiring a corresponding defect area in the layout based on the defect coordinates; setting a preset area which completely covers the defect area; the method provided by the invention greatly improves the working efficiency and reduces the workload of engineers compared with the method of manually searching and screenshot preservation by engineers.
6. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, after the target file is obtained, the method further comprises the following steps: acquiring all defects in a target file; providing a readable interface, calling a readable interface with a defect identifier, defect information and defect image corresponding to the defect to obtain a readable file; it should be noted that the readable file includes PPT, EXCEL, DOCX and any one of PDF, and the target defect file is further inspected to be more beneficial to the engineer to review, so that the time of the engineer to review is saved, and the working efficiency is improved.
7. The system for sorting the inspection results of the photoetching rules provided by the embodiment of the invention comprises the following components: and a data generation module: providing a layout, performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information of all defects of the layout; the calculation module: screening defects based on defect information to obtain an initial defect file; an image acquisition module: acquiring a corresponding defect image in the layout based on the corresponding defect information in the initial defect file; and a storage module: a text file is created, the initial defect file and the corresponding defect image are stored in the text file, and the target defect file is obtained, so that the method has the same beneficial effects as the method for sorting the inspection results of the photoetching rules, and the description is omitted here.
8. The storage medium provided in the embodiment of the invention comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, and when the processor executes the computer program, the processor realizes a lithography rule inspection result arrangement method, which has the same beneficial effects as the lithography rule inspection result arrangement method, and is not described herein.
[ Description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for sorting inspection results of lithography rules according to an embodiment of the present invention.
FIG. 2 is a schematic flow chart of generating a database by performing lithography rule inspection on a layout according to an embodiment of the present invention.
Fig. 3 is a schematic flow chart of obtaining an initial defect file according to an embodiment of the present invention.
Fig. 4 is a schematic flow chart of acquiring a defect image according to an embodiment of the present invention.
FIG. 5 is a schematic diagram of a system for sorting results of inspection of photolithography rules according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a storage medium according to an embodiment of the present invention.
The attached drawings are used for identifying and describing:
1. A lithography rule inspection result sorting system; 2. a storage medium;
11. A data generation module; 12. a computing module; 13. an image acquisition module; 14. a storage module; 15. a conversion module; 21. a memory; 22. a processor; 23. computer program.
[ Detailed description ] of the invention
The present invention will be described in further detail with reference to the accompanying drawings and examples of implementation in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1, a first embodiment of the present invention provides a method for sorting inspection results of lithography rules, comprising the following steps:
S1: providing a layout, performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information corresponding to all defects of the layout;
S2: screening defects based on defect information to obtain an initial defect file;
s3: acquiring a corresponding defect image in the layout based on defect information in the initial defect file;
S4: creating a text file, associating the defects in the initial defect file with the corresponding defect images, and storing the associated defects in the text file to obtain a target defect file.
It should be noted that, after performing photolithography rule inspection on a layout, defect information of all defects in the layout is obtained and stored in a database, in the prior art, if an engineer needs to know the photolithography rule inspection result, the engineer needs to find and sort out the corresponding defects and the corresponding defect information in the database, meanwhile, in order to further know the defects, the area where the defects corresponding to the layout are located needs to be found based on the defect information for capturing, and the database generally includes thousands of defects, so that the workload of the engineer is increased. It can be appreciated that by arranging the defect information and automatically acquiring the defect image, the method reduces the steps of manually arranging the lithography inspection results by engineers, and can also avoid the problem of inaccurate data caused by error of the engineers due to a large amount of repeated and redundant workload.
Further, referring to fig. 2, step S1 specifically includes:
s11: performing photoetching rule inspection on the layout to obtain all defects in the layout and defect information corresponding to the defects;
s12: acquiring a layout range in which the defect is positioned based on the defect information, wherein the layout range comprises a plurality of line segments;
s13: calculating the positions of all the line segments relative to the midpoints of the line segments where the defects are located, and sequencing to obtain hash values of the defects;
S14: grouping all defects based on the hash value of the defects to obtain a plurality of defect groups, marking all the defects to obtain defect marks, and forming a database by all the defect groups and the defect marks corresponding to the defect pairs.
Specifically, in step S12, the defect itself may have a defect area, and a pattern may also have a region near the defect in the layout, where the pattern includes a plurality of line segments, so that a specific position of the layout where the defect is located is found in the layout through defect information, and a layout range is defined, where it is to be noted that the layout range needs to be greater than the defect range, and generally, the layout range corresponding to the defect is specifically M times (M >1, where M is a natural number), such as 5 times, 10 times, and the like.
Specifically, in step S13, by obtaining all line segments in the layout range corresponding to the defect, calculating positions of all the searched line segments in the forward direction relative to the midpoint of the line segment where the defect is located and sorting the positions to obtain a forward hash value, and calculating positions of all the searched line segments in the reverse direction relative to the midpoint of the line segment where the defect is located and sorting the positions to obtain a reverse hash value; and adding the forward hash value and the reverse hash value to obtain the hash value of the defect.
In step S14, all defects in the database are grouped, specifically, defects with equal hash values are in the same group, so as to obtain a plurality of defect groups.
It should be noted that, after classifying the plurality of defects in steps S11 to S14, all defects in the same defect group have the same defect type and defect environment, wherein the defect type specifically includes EPE (edge placement error), CDU (critical dimension uniformity), MEEF (mask error enhancement factor), PVB (process widening), and the like, it can be understood that the defects are classified into the plurality of defect groups based on defect information after the layout is subjected to the photolithography rule detection, and all the defects are named, so that a database is formed, each defect has a unique defect identifier, and the engineer can find and analyze the defects conveniently.
In some embodiments, after the photolithography rule is detected, all defects are divided into a plurality of defect groups based on different exposure imaging conditions and different defect types, and all defects in all defect groups are identified, which has the same beneficial effects as the present embodiment, and the present embodiment is not described here in detail.
Further, the defect information includes defect coordinates (x, y), line width measurement identifier (cd_id), cross-section length (width), pitch (space), negative exposure dose (NC), defect Error value (Error), layout area (Image) where the defect is located, and the like. It can be appreciated that by acquiring these data, it is beneficial for the engineer to know the specific situation of the defect, and at the same time, in step S12, the specific location and area of the corresponding defect in the layout are acquired through the defect coordinates (x, y) and the area (Image) where the defect is located.
Further, referring to fig. 3, step S2 specifically includes:
s21: sorting all defects in the same defect group from large to small based on the defect error value of each defect;
S22: and obtaining and storing defect information and defect identifiers of the first N values in all the defect groups to obtain an initial defect file, wherein N is more than or equal to 1, and N is a natural number.
After the layout is checked by the photoetching rule, the database contains a large amount of defect information, and as the same defect type and defect environment exist in the same group of defects, the representative defects of each defect group are obtained, the optimization is reduced, the working efficiency of engineers can be greatly improved, and the influence of redundant data is reduced.
Specifically, N may be 3, that is, 3 defects with larger defect errors in the same defect group, and defect information and defect identifiers corresponding to the 3 defects may be obtained and stored, and N may be 5, 10, etc., which is not limited in this embodiment.
In some embodiments, the value of N is 1, that is, the defect with the largest error of each defect group, the related defect information and the defect identifier are obtained and stored in the initial file, so that the data is greatly reduced, the situation of the whole defect can be better understood by paying attention to the most serious defect, the effect and the speed of correcting the defect can be improved in the subsequent defect treatment, and the working efficiency of engineers is further improved.
Further, referring to fig. 4, step S3 specifically includes:
S31: acquiring a corresponding defect area in the layout based on the defect coordinates;
s32: setting a preset area which completely covers the defect area;
s33: and rendering the preset area into a defect image.
It should be noted that, in step S32, in order to ensure that the output defect image can completely represent the shape and position of the defect, all the preset areas must completely cover the defect area, that is, the preset area needs to be larger than the defect area.
It should be noted that, the size of the preset area may be more practically required to be customized, and in this embodiment, a preferred embodiment is that the preset area is a square with a side length of 2000 nm.
It should be noted that in step S33, the defect image may be in a format of JPEG, TIFF, RAW, BMP, GIF, PNG, etc., and the preset area is rendered as a picture to be output, so that the engineer can more directly understand the specific situation of the defect.
It should be noted that, referring to fig. 1, in step S2, the initial defect file includes the screened defects, the corresponding defect information and the defect identifier, in step S3, the defect image corresponding to the defects after further screening is stored in the target file in step S4, when the engineer searches the result of the layout after the photolithography rule detection, the finished photolithography rule detection result including the defects with larger error value, the defect image and the like can be directly obtained from the target file, compared with the existing calculation that the engineer is required to manually re-screen from the redundant photolithography rule detection result and gather and store based on the defect information screenshot, the method provided in the embodiment solves the technical problems of complicated finishing process and low accuracy of the photolithography rule detection result in the prior art.
The method for sorting the detection results of the photolithography rule according to the second embodiment of the present invention includes the first embodiment of the method for providing the obtained target defect file through steps S1 to S4, and further includes:
s5: and providing a readable interface, and calling the readable interface with the defect identifiers, the defect information and the defect images corresponding to all defects in the target defect file to obtain the readable file.
Further, the readable file includes any one of PPT, EXCEL, DOCX and PDF.
It should be noted that, the data in the target defect file provided in the first embodiment is not intuitive enough, so that in this embodiment, by summarizing defect information, defect identifier and defect image corresponding to the defect in the target defect file and outputting any one of the bit PPT, EXCEL, DOCX and PDF, engineers can easily understand the specific data of the defect intuitively.
It should be noted that, in this embodiment, the readable interface includes any interface of operation PPT, EXCEL, DOCX and PDF, which is in the prior art, and the data in the target file may be converted into the corresponding readable file by calling the readable interface.
If the readable file is in the PPT format, the readable interface is called to obtain all data in the target defect file, the number of pages and the number of defects of the corresponding pages are set, and the defect information, the defect identifier and the defect image corresponding to the defects are generated into the PPT file through the readable interface and stored. The specific process is as follows;
Data reading and processing: calling a system readable interface, reading all data in a target defect file, and cutting corresponding defect information and defect identifiers of defects into different defect arrays according to an 'n' separator, wherein the first defect array represents defect coordinates, the second defect array represents line width measurement identifiers, the third defect array represents defect error values, the fourth defect array represents defect identifiers and the like, so that a plurality of defect arrays are obtained, and the length of each defect array is the total number of various different defect information.
Creating a PPT: importing pptx data packets, wherein the data packets are in the prior art, three defect data amounts are specified to be displayed by PPT of each page by default, and the total number of PPT (point to point) pages which are required to be generated together = total number of defects/defect data amount of each page are calculated; the total page number of the PPT is circularly traversed, and the following operation is carried out in each cycle:
creating a PPT page: calling file=presentation to take a file handle of the PPT, and calling add_slide to create a PPT page;
creating a table: simultaneously calling add_table to create a table in a page to acquire all defect arrays, calling split to acquire all data corresponding to each defect array through space division;
Adding information: calling a table.cell (row, colum, txet) to add corresponding characters into a table;
adding a defect image: and calling table.picture (IMAGE PATH), adding a defect curve corresponding to the defect into the PPT table, and calling file.save (path) to store the PPT file. And finally, correspondingly obtaining the PPT file.
It can be understood that the data in the target defect file is converted, a readable file is automatically generated, and the readable file can be used for a result report of the layout after the photoetching rule is detected, so that the work of checking defects and making the result report by engineers is further reduced, the working efficiency is improved, and the photoetching result is more visual and accurate.
Referring to fig. 5, the present invention further provides a lithography rule inspection result sorting system 1, including:
The data generation module 11: the method comprises the steps of providing a layout, performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information of all defects of the layout;
The calculation module 12: the method comprises the steps of screening defects based on defect information to obtain an initial defect file;
The image acquisition module 13: the method comprises the steps of obtaining a corresponding defect image in a layout based on corresponding defect information in an initial defect file;
Storage module 14: and the method is used for creating a text file, and storing the initial defect file and the corresponding defect image into the text file to obtain the target defect file.
It should be noted that, through the above module, defects in the result after the photolithography rule detection are screened, identified, and corresponding defect images are obtained, and finally, a target defect file is obtained.
Further, the lithography rule inspection result sorting system 1 further includes a conversion module 15, where the conversion module 15 includes a readable interface, and the conversion module 15 is configured to obtain a target defect file and call the readable interface to obtain a readable file.
The data in the target file is converted into a readable file through the conversion module 15, so that the inspection result of the photoetching defect is more visual, and the analysis and the reference of engineers are facilitated.
The lithography rule inspection result sorting system 1 has the same advantageous effects as a lithography rule inspection result sorting method, and will not be described in detail herein.
Referring to fig. 6, a storage medium is further provided in the fourth embodiment of the present invention, which includes a memory 21, a processor 22 and a computer program 23 stored in the memory 21 and capable of running on the processor 22, wherein the processor 22 implements a method for sorting the result of checking the lithography rule according to the first or second embodiment when executing the computer program 23.
The storage medium 2 has the same advantageous effects as the above-described method for sorting the inspection results of the photolithography rule, and will not be described in detail herein.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may also determine B from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art will also appreciate that the embodiments described in the specification are alternative embodiments and that the acts and modules referred to are not necessarily required for the present invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the foregoing processes do not imply that the execution sequences of the processes should be determined by the functions and internal logic of the processes, and should not be construed as limiting the implementation of the embodiments of the present invention.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, with the determination being made based upon the functionality involved. It will be noted, in particular, that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Compared with the prior art, the method, the system and the storage medium for sorting the lithography rule inspection results provided by the invention have the following advantages:
1. The method for arranging the photoetching rule checking results comprises the following steps of providing a layout, carrying out photoetching rule checking on the layout to generate a database, wherein the database comprises all defects and corresponding defect information of the layout, and screening the defects based on the defect information to obtain an initial defect file; it should be noted that, because the defect data in the database is more, the data can be simplified by screening the defects, so as to facilitate the optimization of engineers; furthermore, the corresponding defect image is acquired in the layout based on the corresponding defect information in the initial defect file, and it is to be noted that compared with the prior art that the defect image in the layout where the defect is located is saved by manually capturing the images through an engineer, the invention reduces the burden of the engineer and improves the working efficiency by automatically acquiring the defect image in the layout where the defect is located, and further, a text file is created, the defect in the initial defect file and the corresponding defect image are associated and then saved in the text file, so that the target defect file is obtained, and the defect information and the defect image corresponding to the defect are saved, thereby being convenient for the engineer to review.
2. In the method for sorting the photoetching rule checking result provided by the embodiment of the invention, performing photoetching rule checking on the layout to generate a database comprises performing photoetching rule checking on the layout to obtain all defects in the layout and defect information corresponding to the defects; acquiring a layout range of the defect based on the defect information, wherein the layout range comprises a plurality of line segments; the method comprises the steps of calculating positions of midpoints of line segments where defects of all line segments are located relative to each other, sorting the positions to obtain hash values of the defects, grouping all the defects based on the hash values of the defects to obtain a plurality of defect groups, and marking all the defects to obtain defect marks.
3. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, the defect information comprises defect coordinates, line width measurement marks, cross section length, spacing, negative exposure dose and defect error values, and by acquiring all information about the defects, engineers can conveniently optimize and modify the defects based on the defect information.
4. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, the steps of obtaining and screening the defects and obtaining the initial defect file specifically comprise: sorting all defects in the same defect group from large to small based on the defect error value of each defect; and obtaining and storing defect information and defect identifiers of the first N values in all the defect groups to obtain an initial defect file, wherein N is more than or equal to 1, and N is a natural number. In this way, defects with a large influence on the final lithography result are screened out, so that engineers can optimize the defects in the follow-up process, and the working efficiency is improved.
5. In the method for sorting the inspection result of the lithography rule provided by the embodiment of the invention, the obtaining of the corresponding defect image in the layout based on the corresponding defect information in the initial defect file specifically comprises the following steps: acquiring a corresponding defect area in the layout based on the defect coordinates; setting a preset area which completely covers the defect area; the method provided by the invention greatly improves the working efficiency and reduces the workload of engineers compared with the method of manually searching and screenshot preservation by engineers.
6. In the method for sorting the inspection results of the lithography rule provided by the embodiment of the invention, after the target file is obtained, the method further comprises the following steps: acquiring all defects in a target file; providing a readable interface, calling a readable interface with a defect identifier, defect information and defect image corresponding to the defect to obtain a readable file; it should be noted that the readable file includes PPT, EXCEL, DOCX and any one of PDF, and the target defect file is further inspected to be more beneficial to the engineer to review, so that the time of the engineer to review is saved, and the working efficiency is improved.
7. The system for sorting the inspection results of the photoetching rules provided by the embodiment of the invention comprises the following components: and a data generation module: providing a layout, performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information of all defects of the layout; the calculation module: screening defects based on defect information to obtain an initial defect file; an image acquisition module: acquiring a corresponding defect image in the layout based on the corresponding defect information in the initial defect file; and a storage module: a text file is created, the initial defect file and the corresponding defect image are stored in the text file, and the target defect file is obtained, so that the method has the same beneficial effects as the method for sorting the inspection results of the photoetching rules, and the description is omitted here.
8. The storage medium provided in the embodiment of the invention comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, and when the processor executes the computer program, the processor realizes a lithography rule inspection result arrangement method, which has the same beneficial effects as the lithography rule inspection result arrangement method, and is not described herein.
The above describes in detail a method, a system and a storage medium for sorting inspection results of lithography rules disclosed in the embodiments of the present invention, and specific examples are applied to illustrate the principles and implementation of the present invention, where the above description of the embodiments is only used to help understand the method and core idea of the present invention; meanwhile, as for those skilled in the art, according to the idea of the present invention, there are changes in the specific embodiments and the application scope, and in summary, the present disclosure should not be construed as limiting the present invention, and any modifications, equivalent substitutions and improvements made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A method for sorting a result of a photolithography rule inspection, comprising:
Providing a layout, and performing photoetching rule inspection on the layout to generate a database, wherein the database comprises all defects and corresponding defect information of the layout;
screening defects based on defect information to obtain an initial defect file;
Acquiring a corresponding defect image in the layout based on defect information in the initial defect file;
creating a text file, associating the defects in the initial defect file with the corresponding defect images, and storing the associated defects in the text file to obtain a target defect file.
2. A method for organizing the results of a lithographic rule inspection according to claim 1, wherein said generating a database by the lithographic rule inspection of the layout comprises:
performing photoetching rule inspection on the layout to obtain all defects in the layout and defect information corresponding to the defects;
acquiring a layout range in which a defect is located based on defect information, wherein the layout range comprises a plurality of line segments;
calculating the positions of the midpoints of the line segments where the defects are located relative to all the line segments, and sequencing to obtain hash values of the defects;
Grouping all defects based on hash values of the defects to obtain a plurality of defect groups, marking all the defects to obtain defect marks, and forming a database by all the defect groups and the defect marks corresponding to the defects.
3. The method of claim 2, wherein the defect information includes defect coordinates, line width measurement marks, cross-sectional lengths, pitches, negative exposure doses, and defect error values.
4. A method for sorting the inspection results of a photolithography rule according to claim 3, wherein the obtaining includes:
sorting all defects in the same defect group from large to small based on the defect error value of each defect;
And obtaining and storing defect information and defect identifiers of the first N values in all the defect groups to obtain an initial defect file, wherein N is more than or equal to 1, and N is a natural number.
5. The method for sorting out inspection results of a photolithography rule according to claim 4, wherein the obtaining a corresponding defect image in the layout based on the corresponding defect information in the initial defect file specifically comprises:
acquiring a corresponding defect area in the layout based on the defect coordinates;
Setting a preset area, wherein the preset area completely covers the defect area;
And rendering the preset area into a defect image.
6. The method for sorting out the inspection results of the photolithography rules according to claim 5, wherein the obtaining the target file further comprises:
And providing a readable interface, and calling the readable interface with the defect identifiers, the defect information and the defect images corresponding to all defects in the target defect file to obtain the readable file.
7. The method of claim 6, wherein the readable file includes any one of PPT, EXCEL, DOCX and PDF.
8. A lithography rule inspection result collation system, comprising:
and a data generation module: the method comprises the steps of providing a layout, and performing photoetching rule inspection on the layout to generate a database, wherein the database comprises defect information of all defects of the layout;
The calculation module: the method comprises the steps of screening defects based on defect information to obtain an initial defect file;
An image acquisition module: the method comprises the steps of obtaining a corresponding defect image in a layout based on corresponding defect information in an initial defect file;
And a storage module: and the method is used for creating a text file, and storing the initial defect file and the corresponding defect image into the text file to obtain the target defect file.
9. The system of claim 8, further comprising a conversion module configured to obtain the target defect file and call the readable interface to obtain the readable file.
10. A storage medium comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements a lithography rule inspection result sorting method according to any one of claims 1-7 when executing the computer program.
CN202311866052.2A 2023-12-29 2023-12-29 Method, system and storage medium for sorting lithography rule inspection results Pending CN117931782A (en)

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