CN117912841A - Novel power module and motor controller - Google Patents

Abstract

The invention discloses a novel power module and a motor controller, wherein the novel power module comprises a power module and an integrated heat dissipation capacitor, and the integrated heat dissipation capacitor is arranged on one side of the power module and is connected with the power module; the integrated heat dissipation capacitor comprises a bus capacitor and a heat dissipation module. The bus capacitor is connected with the power module; the heat dissipation module is sleeved outside the bus capacitor and comprises a containing part, one side of the containing part, which is close to the power module, is provided with a heat dissipation flow channel, and the side part of the containing part is provided with a transition flow channel communicated with the heat dissipation flow channel; the heat dissipation runner and the transition runner are positioned on different sides of the accommodating part, and are used for accommodating cooling liquid in the heat dissipation runner and the transition runner so as to dissipate heat of the bus capacitor. According to the invention, the busbar capacitor can be subjected to multi-surface heat dissipation through the cooling liquid in the heat dissipation flow channel and the transition flow channel, and the problem of poor heat dissipation capacity of the existing busbar capacitor is solved.

Description

Novel power module and motor controller

Technical Field

The invention relates to the technical field of new energy automobiles, in particular to a novel power module and a motor controller.

Background

The bus capacitor in the new energy automobile motor controller is generally used for smoothing bus voltage, weakening bus peak voltage, absorbing bus high pulse current, reducing inductance and the like.

In the prior art, in order to ensure that the bus capacitor of the new energy motor controller works at a proper temperature, an indirect heat dissipation or natural heat dissipation mode is often adopted, and in order to increase the heat dissipation area of the bus capacitor, the capacitance and the volume of the bus capacitor also need to be increased, which is not beneficial to improving the reliability and the power density of the motor controller, and increasing the manufacturing cost of the new energy automobile.

Based on this, a new solution is needed.

Disclosure of Invention

In view of this, the embodiment of the invention provides a novel power module and a motor controller, so as to at least solve the problem that the existing bus capacitor has poor heat dissipation.

The embodiment of the invention provides the following technical scheme:

The embodiment of the invention provides a novel power module, which comprises a power module, and further comprises an integrated heat dissipation capacitor, wherein the integrated heat dissipation capacitor is arranged on one side of the power module and is connected with the power module;

the integrated heat dissipation capacitor includes:

the bus capacitor is connected with the power module;

The heat dissipation module is sleeved outside the bus capacitor and comprises a containing part, a heat dissipation flow channel is arranged on one side, close to the power module, of the containing part, and a transition flow channel communicated with the heat dissipation flow channel is arranged on the side part of the containing part;

the heat dissipation runner and the transition runner are positioned on different sides of the accommodating part, and the heat dissipation runner and the transition runner are used for accommodating cooling liquid so as to dissipate heat of the bus capacitor.

Further, the accommodating portion includes:

The heat dissipation cavity is arranged on one side of the accommodating part, close to the power module, and is communicated with the transition flow passage and used for accommodating the cooling liquid;

And the cover plate covers the accommodating part and is matched with the heat dissipation cavity to form the heat dissipation flow channel.

Further, the heat dissipation cavities are multiple and are arranged at intervals and used for being matched with the cover plate to form multiple heat dissipation flow channels.

Further, the transition flow channel is of a grid structure and is connected with the cooling liquid inlet and the cooling liquid outlet.

Further, the manufacturing material of the heat dissipation module comprises one or more of metal materials or plastics.

Further, the heat dissipation module further includes:

and the laminated busbar is connected with the busbar capacitor through an input port and connected with the power module through an output port.

Further, the connection mode of the laminated busbar and the power module comprises at least one of bolt connection, resistance welding and laser welding.

Further, the power module includes:

The circuit board is arranged on the side part of the heat dissipation module;

the power semiconductor device is arranged on the circuit board and is connected with the bus capacitor through the laminated bus.

Further, the power semiconductor period is at least one of a direct liquid cooling three-phase module, a direct liquid cooling half-bridge module, an indirect liquid cooling three-phase module and an indirect liquid cooling half-bridge module.

The embodiment of the invention provides a motor controller, which comprises:

The novel power module as described in any one of the above;

the transition flow channel of the novel power module is respectively communicated with the cooling liquid inlet and the cooling liquid outlet of the motor controller;

And the bus capacitor of the novel power module is connected with the direct-current copper bar of the motor controller through the laminated bus bar.

Compared with the prior art, the beneficial effects achieved by the at least one technical scheme adopted by the embodiment of the invention at least comprise:

According to the novel power module, the bus capacitor is arranged in the accommodating part of the heat dissipation module, the heat dissipation flow channels and the transition flow channels are arranged on different side parts of the accommodating part, and the cooling liquid is arranged in the heat dissipation flow channels and the transition flow channels, so that the bus capacitor can be subjected to multi-surface heat dissipation through the cooling liquid in the heat dissipation flow channels and the transition flow channels, and the problem of poor heat dissipation capacity of the existing bus capacitor is solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a novel power module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a power module and an integrated heat dissipation capacitor according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an integrated heat dissipation capacitor according to an embodiment of the invention;

FIG. 4 is an exploded view of an integrated heat dissipating capacitor according to an embodiment of the present invention;

Fig. 5 is a side view of an integrated heat dissipation capacitor according to an embodiment of the invention.

The reference numerals of the present invention are as follows:

10. a power module; 11. a circuit board; 12. a power semiconductor device;

20. An integrated heat dissipation capacitor; 21. a bus capacitor; 22. a heat dissipation module; 221. a housing part; 2211. a heat dissipation cavity; 2212. a cover plate; 222. a heat dissipation flow channel; 223. a transition flow passage; 23. and laminating the busbar.

Detailed Description

Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.

In the prior art, an indirect heat dissipation manner is often adopted to ensure that the bus capacitor 21 works at a proper temperature, and the capacity and the volume of the bus capacitor 21 need to be increased, which is not beneficial to improving the reliability of the bus capacitor 21 and the power density of a motor controller.

Based on this, the embodiment of the invention provides a processing scheme: as shown in fig. 1-2, by arranging the bus capacitor 21 in the accommodating portion 221 of the heat dissipation module 22, and arranging the heat dissipation flow channel 222 and the transition flow channel 223 at different sides of the accommodating portion 221, and arranging the cooling liquid in the heat dissipation flow channel 222 and the transition flow channel 223, the bus capacitor 21 can be subjected to multi-surface heat dissipation through the cooling liquid in the heat dissipation flow channel 222 and the transition flow channel 223, so that the bus capacitor 21 is ensured to work at a proper temperature, and the problems that the capacity and the volume of the bus capacitor 21 are required due to the existing indirect heat dissipation, the reliability of the bus capacitor 21 and the power density of a motor controller are not beneficial to improvement are solved.

The following describes the technical scheme provided by each embodiment of the present application with reference to the accompanying drawings.

Example 1

As shown in fig. 1, a novel power module according to an embodiment of the present invention includes a power module 10 and an integrated heat dissipation capacitor 20, where the integrated heat dissipation capacitor 20 is disposed at one side of the power module 10 and is connected to the power module 10.

As shown in fig. 2, the power module 10 includes a circuit board 11 and a power semiconductor device 12. The circuit board 11 is disposed at a side portion of the integrated heat dissipation capacitor 20; the power semiconductor period is disposed on the circuit board 11 and is connected to the integrated heat dissipation capacitor 20.

The connection relationship between the circuit board 11 and the power semiconductor device 12 is the same as that of the prior art, and will not be described herein.

As shown in fig. 3 to 5, the integrated heat dissipation capacitor 20 includes a bus capacitor 21 and a heat dissipation module 22. Wherein, the bus capacitor 21 is connected with the power module 10; the heat dissipation module 22 is sleeved outside the bus capacitor 21, and the heat dissipation module 22 is used for dissipating heat of the bus capacitor 21.

The bus capacitor 21 is sleeved inside the heat dissipation module 22, so that the heat dissipation module 22 can absorb heat generated by the bus capacitor 21, and the heat dissipation module 22 can be maintained to work at a proper temperature.

Specifically, the heat dissipation module 22 includes a housing 221, a heat dissipation flow channel 222 is disposed on a side of the housing 221 near the power module 10, and a transition flow channel 223 communicating with the heat dissipation flow channel 222 is disposed on a side of the housing 221; the heat dissipation flow channel 222 and the transition flow channel 223 are located at different sides of the accommodating portion 221, and the heat dissipation flow channel 222 and the transition flow channel 223 are used for accommodating cooling liquid so as to dissipate heat of the bus capacitor 21.

Wherein the cooling liquid is used to absorb heat generated by the bus bar capacitance 21 through the receiving portion 221 to maintain the bus bar capacitance 21 to a proper temperature.

In some of these embodiments, the heat dissipation runner 222 is connected to an external coolant inlet, a coolant outlet through a transition runner 223, such that the coolant flows in the heat dissipation runner 222 and the transition runner 223.

The heat dissipation flow channel 222 is disposed on one side of the accommodating portion 221 near the power module 10, so that the heat dissipation flow channel 222 is near the power module 10 to dissipate heat of the power module 10, that is, the cooling liquid in the heat dissipation flow channel 222 can dissipate heat of the power module 10 and the bus capacitor 21 at the same time, so as to control the overall temperature rise of the novel power module.

In some of these embodiments, the receptacle 221 includes a heat dissipation cavity 2211 and a cover plate 2212. The heat dissipation cavity 2211 is disposed at one side of the accommodating portion 221 near the power module 10, and is communicated with the transition flow passage 223, for accommodating the cooling liquid; the cover plate 2212 covers the accommodating portion 221, and forms a heat dissipation flow passage 222 in cooperation with the heat dissipation cavity 2211.

The heat dissipation cavity 2211 is disposed on a side wall of the accommodating portion 221.

The cover plate 2212 is cooperatively connected with the accommodating portion 221, and seals the heat dissipation cavity 2211, so that the heat dissipation cavity 2211 cooperates with the cover plate 2212 to form a heat dissipation flow channel 222, and the cooling liquid can flow in the heat dissipation flow channel 222.

Further, the heat dissipation cavities 2211 are multiple and spaced apart, and are used to form multiple heat dissipation channels 222 in cooperation with the cover plate 2212.

By providing a plurality of heat dissipation chambers 2211, the flow rate of the coolant and the heat dissipation area can be increased, and the heat dissipation capability of the heat dissipation module 22 can be improved.

Preferably, the heat dissipation cavities 2211 are two and are oppositely arranged.

In some of these embodiments, the heat dissipation chamber 2211 extends from one end of the accommodation portion 221 to the other end of the accommodation portion 221 and communicates with the transition flow passage 223.

In some of these embodiments, the transition flow path 223 is a grid-like structure and is connected to the coolant inlet and the coolant outlet.

In this case, the transition flow path 223 is provided in communication with the heat dissipation flow path 222, so that the coolant supplied from the transition flow path 223 can enter the heat dissipation flow path 222.

Specifically, the two transition flow passages 223 are disposed on two sides of the accommodating portion 221, and the two transition flow passages 223 are respectively communicated with the heat dissipation flow passage 222, wherein one side of the transition flow passage 223 is communicated with the cooling liquid inlet, and the other side of the transition flow passage 223 is communicated with the cooling liquid outlet, so that after the cooling liquid enters the transition flow passage 223 through the cooling liquid inlet, the cooling liquid can enter the heat dissipation flow passage 222 and enter the cooling liquid outlet through the other transition flow passage 223, thereby forming a cooling liquid circulation to dissipate heat of the accommodating portion 221, and the accommodating portion 221 can maintain a proper temperature.

In some of these embodiments, the heat dissipating module 22 is made of a material including one or more of a metal material or a plastic.

Preferably, in order to increase the heat radiation capability of the receiving portion 221, the receiving portion 221 may be made of a metal material.

In some of these embodiments, the heat dissipation module 22 further includes a stacked busbar 23, the stacked busbar 23 being connected to the busbar capacitance 21 through an input port, and the stacked busbar 23 being connected to the power module through an output port.

The laminated busbar 23 can be directly connected with the power module through an input port and an output port, so that stray parameters of the busbar capacitor 21 are reduced, the number of bridging copper bars and the cost of the copper bars are reduced, and the power density of the motor controller is improved.

Further, the connection mode of the laminated busbar 23 and the power module comprises at least one of bolting, resistance welding and laser welding.

The laminated busbar 23 is connected to the power semiconductor device 12 by one or more of bolting, resistance welding or laser welding.

In some of these embodiments, the circuit board 11 is disposed on the side of the heat dissipation module 22; the power semiconductor device 12 is disposed on the circuit board 11 and is connected to the bus capacitor 21 through the laminated bus bar 23.

Further, the circuit board 11 may be a driving circuit board or a driving control circuit board.

The bus capacitor 21 is connected to the power semiconductor device 12 via the laminated bus bar 23.

By providing the heat dissipation flow path 222 on the side of the accommodating portion 221 close to the power module 10, the heat dissipation flow path 222 can dissipate heat from the bus bar capacitor 21, the stacked bus bar 23, and the power semiconductor device 12 at the same time.

Further, the power semiconductor device 12 is at least one of a direct liquid-cooled three-phase module, a direct liquid-cooled half-bridge module, an indirect liquid-cooled three-phase module, and an indirect liquid-cooled half-bridge module.

According to the embodiment of the invention, the heat dissipation flow channels 222 and the transition flow channels 223 are arranged on different side parts of the accommodating part 221, so that the busbar capacitance 21 is cooled in a multi-side mode, the heat dissipation capacity of the busbar capacitance 21 is enhanced, the capacitance and the volume of the busbar capacitance 21 are reduced, and the reliability and the power density of the motor controller are improved. The cost is reduced.

According to the novel power module, the bus capacitor 21, the laminated copper bars and the integrated heat dissipation capacitor 20 are integrated to form the integrated heat dissipation capacitor 20, so that the integrated heat dissipation capacitor 20, the power module 10 and the like can be assembled in advance by adopting a part-mounting scheme, and can be directly installed in a controller shell after the test is finished, and assembly materials and production and manufacturing costs are reduced.

As can be seen from the above description, the novel power module of the present invention can be assembled as an independent component, the power module 10 is mounted on the integrated heat dissipation device, the heat dissipation flow channel 222 of the heat dissipation module 22 is shared with the bus capacitor 21 during the power semiconductor period, and the power module can be directly mounted in the housing of the motor controller after the test is completed. Therefore, the novel power module provided by the embodiment of the invention has the characteristics of high reliability, high power density, low manufacturing cost and high compatibility and expansibility.

Example 2

The embodiment of the invention also provides a motor controller, which comprises the novel power module as described in any one of the embodiment 1;

Wherein, the transition runner 223 of the novel power module is respectively communicated with the cooling liquid inlet and the cooling liquid outlet of the motor controller;

The busbar capacitor 21 of the novel power module is connected with the direct current copper bar of the motor controller through the laminated busbar 23.

Specifically, the heat dissipation flow channels 222 are respectively communicated with a cooling liquid inlet and a cooling liquid outlet of the motor controller through transition flow channels 223 on two sides.

The connection mode of the laminated busbar 23 and the direct current copper bar of the motor controller can be one or more of bolting, resistance welding or laser welding.

The circuit board 11 of the novel power module can be connected with the control circuit board 11 of the motor controller through a connector.

In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (10)

1. The novel power module comprises a power module and is characterized by further comprising an integrated heat dissipation capacitor, wherein the integrated heat dissipation capacitor is arranged on the side part of the power module and is connected with the power module;

the integrated heat dissipation capacitor includes:

the bus capacitor is connected with the power module;

The heat dissipation module is sleeved outside the bus capacitor and comprises a containing part, a heat dissipation flow channel is arranged on one side, close to the power module, of the containing part, and a transition flow channel communicated with the heat dissipation flow channel is arranged on the side part of the containing part;

the heat dissipation runner and the transition runner are positioned on different sides of the accommodating part, and the heat dissipation runner and the transition runner are used for accommodating cooling liquid so as to dissipate heat of the bus capacitor.

2. The novel power module of claim 1, wherein the receptacle comprises:

The heat dissipation cavity is arranged on one side of the accommodating part, close to the power module, and is communicated with the transition flow passage and used for accommodating the cooling liquid;

And the cover plate covers the accommodating part and is matched with the heat dissipation cavity to form the heat dissipation flow channel.

3. The novel power module of claim 2, wherein the heat dissipation cavities are a plurality of and are arranged at intervals, and are used for forming a plurality of heat dissipation flow channels by matching with the cover plate.

4. The novel power module of claim 1, wherein the transition flow channel is of a grid-type structure and is connected to the coolant inlet and the coolant outlet.

5. The novel power module of claim 1, wherein the housing is made of a material comprising one or more of a metal material or a plastic.

6. The novel power module of any one of claims 1-5, wherein the heat dissipation module further comprises:

and the laminated busbar is connected with the busbar capacitor through an input port and connected with the power module through an output port.

7. The novel power module of claim 6, wherein the connection between the laminated busbar and the power module comprises at least one of bolting, resistance welding, and laser welding.

8. The novel power module of claim 6, wherein the power module comprises:

The circuit board is arranged on the side part of the heat dissipation module;

the power semiconductor device is arranged on the circuit board and is connected with the bus capacitor through the laminated bus.

9. The novel power module of claim 8, wherein the power semiconductor period is at least one of a direct liquid-cooled three-phase module, a direct liquid-cooled half-bridge module, an indirect liquid-cooled three-phase module, and an indirect liquid-cooled half-bridge module.

10. A motor controller, comprising:

The novel power module of any one of claims 1-9;

the transition flow channel of the novel power module is respectively communicated with the cooling liquid inlet and the cooling liquid outlet of the motor controller;

And the bus capacitor of the novel power module is connected with the direct-current copper bar of the motor controller through the laminated bus bar.