CN117897455A - 碳基导电油墨 - Google Patents
碳基导电油墨 Download PDFInfo
- Publication number
- CN117897455A CN117897455A CN202280059364.XA CN202280059364A CN117897455A CN 117897455 A CN117897455 A CN 117897455A CN 202280059364 A CN202280059364 A CN 202280059364A CN 117897455 A CN117897455 A CN 117897455A
- Authority
- CN
- China
- Prior art keywords
- nanoplatelets
- film
- liquid composition
- carbon nanotubes
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/159—Carbon nanotubes single-walled
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/02—Single-walled nanotubes
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/34—Length
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/36—Diameter
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/04—Specific amount of layers or specific thickness
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Carbon And Carbon Compounds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21194844.3 | 2021-09-03 | ||
| EP21194844 | 2021-09-03 | ||
| PCT/EP2022/074424 WO2023031383A1 (en) | 2021-09-03 | 2022-09-02 | Carbon-based conducting inks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117897455A true CN117897455A (zh) | 2024-04-16 |
Family
ID=77640478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280059364.XA Pending CN117897455A (zh) | 2021-09-03 | 2022-09-02 | 碳基导电油墨 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20240384123A1 (enExample) |
| EP (2) | EP4748788A2 (enExample) |
| JP (1) | JP2024533149A (enExample) |
| KR (1) | KR20240055037A (enExample) |
| CN (1) | CN117897455A (enExample) |
| AU (1) | AU2022338190A1 (enExample) |
| CA (1) | CA3230227A1 (enExample) |
| ES (1) | ES3074607T3 (enExample) |
| PL (1) | PL4396296T3 (enExample) |
| TW (1) | TW202323186A (enExample) |
| WO (1) | WO2023031383A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4301697B1 (en) * | 2021-03-04 | 2024-06-12 | Advanced Material Development Limited | Devices with low thermal emissivity |
| DE202024103283U1 (de) * | 2024-06-18 | 2025-09-25 | Exentis Knowledge Gmbh | Druckpaste |
| DE202024103284U1 (de) * | 2024-06-18 | 2025-09-25 | Exentis Knowledge Gmbh | Druckpaste |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6638328B1 (en) * | 2002-04-25 | 2003-10-28 | Taiwan Semiconductor Manufacturing Co. Ltd | Bimodal slurry system |
| CN101421338A (zh) * | 2006-04-14 | 2009-04-29 | 阿克马法国公司 | 导电的碳纳米管-聚合物复合材料 |
| WO2013074712A1 (en) * | 2011-11-14 | 2013-05-23 | Vorbeck Materials | Graphene containing compositions |
| US20140212656A1 (en) * | 2011-08-22 | 2014-07-31 | Dispersion Comprising Carbon Nanotubses And Graphe Platelets Bayer Intellectual Property Gmbh | Dispersion comprising carbon nanotubes and graphene platelets |
| US20140345863A1 (en) * | 2013-05-21 | 2014-11-27 | Schlumberger Technology Corporation | Electromagnetically active slurries and methods |
| CN104768872A (zh) * | 2012-09-28 | 2015-07-08 | Ppg工业俄亥俄公司 | 含石墨烯碳颗粒的导电涂料 |
| CN109689943A (zh) * | 2016-09-08 | 2019-04-26 | Ppg工业俄亥俄公司 | 涂覆导电基材的方法和相关的包含石墨烯碳颗粒的可电沉积的组合物 |
| US20210107793A1 (en) * | 2016-04-11 | 2021-04-15 | Celtig, Llc | Manufacture of Graphene and Graphene Composition of Matte |
| US20230142469A1 (en) * | 2020-03-05 | 2023-05-11 | Advanced Material Development Limited | Carbon-based conducting inks |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106376174B (zh) | 2008-02-05 | 2019-06-07 | 普林斯顿大学理事会 | 电子器件和形成电子器件的方法 |
| WO2014210584A1 (en) * | 2013-06-28 | 2014-12-31 | Graphene 3D Lab Inc. | Dispersions for nanoplatelets of graphene-like materials |
| GB201517737D0 (en) | 2015-10-07 | 2015-11-18 | Cambridge Entpr Ltd | Layered materials and methods for their processing |
| EP3636592A1 (en) | 2018-10-12 | 2020-04-15 | Advanced Material Development Limited | Liquid-exfoliated nanomaterials |
| CN111876025A (zh) * | 2020-08-05 | 2020-11-03 | 深圳市展旺新材料科技有限公司 | 一种石墨烯导电油墨 |
-
2022
- 2022-08-29 TW TW111132521A patent/TW202323186A/zh unknown
- 2022-09-02 CA CA3230227A patent/CA3230227A1/en active Pending
- 2022-09-02 JP JP2024513872A patent/JP2024533149A/ja active Pending
- 2022-09-02 EP EP26164731.7A patent/EP4748788A2/en active Pending
- 2022-09-02 ES ES22773169T patent/ES3074607T3/es active Active
- 2022-09-02 EP EP22773169.2A patent/EP4396296B1/en active Active
- 2022-09-02 PL PL22773169.2T patent/PL4396296T3/pl unknown
- 2022-09-02 WO PCT/EP2022/074424 patent/WO2023031383A1/en not_active Ceased
- 2022-09-02 KR KR1020247010442A patent/KR20240055037A/ko active Pending
- 2022-09-02 US US18/687,122 patent/US20240384123A1/en active Pending
- 2022-09-02 CN CN202280059364.XA patent/CN117897455A/zh active Pending
- 2022-09-02 AU AU2022338190A patent/AU2022338190A1/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6638328B1 (en) * | 2002-04-25 | 2003-10-28 | Taiwan Semiconductor Manufacturing Co. Ltd | Bimodal slurry system |
| CN101421338A (zh) * | 2006-04-14 | 2009-04-29 | 阿克马法国公司 | 导电的碳纳米管-聚合物复合材料 |
| US20140212656A1 (en) * | 2011-08-22 | 2014-07-31 | Dispersion Comprising Carbon Nanotubses And Graphe Platelets Bayer Intellectual Property Gmbh | Dispersion comprising carbon nanotubes and graphene platelets |
| WO2013074712A1 (en) * | 2011-11-14 | 2013-05-23 | Vorbeck Materials | Graphene containing compositions |
| CN104768872A (zh) * | 2012-09-28 | 2015-07-08 | Ppg工业俄亥俄公司 | 含石墨烯碳颗粒的导电涂料 |
| US20140345863A1 (en) * | 2013-05-21 | 2014-11-27 | Schlumberger Technology Corporation | Electromagnetically active slurries and methods |
| US20210107793A1 (en) * | 2016-04-11 | 2021-04-15 | Celtig, Llc | Manufacture of Graphene and Graphene Composition of Matte |
| CN109689943A (zh) * | 2016-09-08 | 2019-04-26 | Ppg工业俄亥俄公司 | 涂覆导电基材的方法和相关的包含石墨烯碳颗粒的可电沉积的组合物 |
| US20230142469A1 (en) * | 2020-03-05 | 2023-05-11 | Advanced Material Development Limited | Carbon-based conducting inks |
Non-Patent Citations (1)
| Title |
|---|
| 邹欣;戴志敏;唐忠锋;: "FLiNaK熔盐高温试验回路电磁感应加热的数值模拟", 核技术, no. 07, 10 July 2013 (2013-07-10) * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023031383A1 (en) | 2023-03-09 |
| ES3074607T3 (es) | 2026-07-22 |
| TW202323186A (zh) | 2023-06-16 |
| US20240384123A1 (en) | 2024-11-21 |
| KR20240055037A (ko) | 2024-04-26 |
| PL4396296T3 (pl) | 2026-06-08 |
| EP4396296B1 (en) | 2026-04-22 |
| EP4748788A2 (en) | 2026-05-27 |
| AU2022338190A1 (en) | 2024-02-22 |
| CA3230227A1 (en) | 2023-03-09 |
| EP4396296C0 (en) | 2026-04-22 |
| JP2024533149A (ja) | 2024-09-12 |
| EP4396296A1 (en) | 2024-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |