CN117884992A - Grinding and polishing device and method for single crystal blade - Google Patents
Grinding and polishing device and method for single crystal blade Download PDFInfo
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- CN117884992A CN117884992A CN202410229569.9A CN202410229569A CN117884992A CN 117884992 A CN117884992 A CN 117884992A CN 202410229569 A CN202410229569 A CN 202410229569A CN 117884992 A CN117884992 A CN 117884992A
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- 238000005498 polishing Methods 0.000 title claims abstract description 166
- 239000013078 crystal Substances 0.000 title claims abstract description 151
- 238000000227 grinding Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000012546 transfer Methods 0.000 claims abstract description 182
- 230000003287 optical effect Effects 0.000 claims abstract description 92
- 239000002699 waste material Substances 0.000 claims abstract description 31
- 238000004891 communication Methods 0.000 claims abstract description 9
- 238000009826 distribution Methods 0.000 claims description 37
- 238000007599 discharging Methods 0.000 claims description 5
- 238000007517 polishing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000012549 training Methods 0.000 description 5
- 238000002591 computed tomography Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 210000000707 wrist Anatomy 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000601 superalloy Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Abstract
The application provides a single crystal blade grinding and polishing device and method, the device includes: the single crystal blade grinding and polishing device comprises a controller, a feeding frame, a transferring manipulator, optical scanning equipment, a middle rotating frame, a grinding and polishing manipulator, grinding and polishing equipment and a waste frame, wherein the controller is respectively in communication connection with the transferring manipulator, the optical scanning equipment, the grinding and polishing manipulator and the grinding and polishing equipment, when single crystal blades are required to be ground and polished, the transferring manipulator can transfer the single crystal blades to the middle rotating frame, and then the grinding and polishing manipulator transfers the single crystal blades on the middle rotating frame to the grinding and polishing equipment for grinding and polishing. After polishing, the polishing manipulator can transfer the monocrystalline blade to the transfer frame, and then the transfer manipulator transfers the monocrystalline blade to the upper material frame. The single crystal blade polishing device realizes automatic identification, transfer and polishing of the single crystal blade, reduces the dependence on operators, effectively reduces the polishing cost of the single crystal blade, and is beneficial to improving the polishing consistency and efficiency of the single crystal blade.
Description
Technical Field
The application belongs to the technical field of single crystal superalloy manufacturing, and particularly relates to a grinding and polishing device and method for single crystal blades.
Background
Throughout the recent decades of development history of advanced aeroengines, the development of single crystal blades with complex air cooling channels has become an effective means and a necessary trend to continue to improve the overall performance of critical hot-end components of advanced aeroengines. However, the aero-engine single crystal blade is cast, the size of the single crystal blade is changed due to metal shrinkage in the thermal process, the casting process is easy to generate defects such as sand holes and redundant metal, the surface of the blade can be recrystallized after vacuum heat treatment, and uneven quality of the superalloy blade can be caused by removing the defects, so that the single crystal blade is particularly important to polish.
At present, equipment for grinding and polishing single crystal blades in the industry is manual equipment, and grinding and polishing operations are manually controlled.
However, manual polishing has particularly strong dependence on manual skill, physical and psychological states, is relatively high in labor cost, and tends to result in poor consistency and inefficiency in polishing of single crystal blades.
Disclosure of Invention
In view of the above problems, the present application proposes a polishing device and method for single crystal blades, in order to reduce cost and improve polishing consistency and efficiency of single crystal blades, the specific scheme is as follows:
a single crystal blade polishing apparatus, the apparatus comprising: the device comprises a controller, a feeding frame, a transferring manipulator, optical scanning equipment, a middle rotating frame, a polishing manipulator, polishing equipment and a waste frame, wherein the controller is respectively in communication connection with the transferring manipulator, the optical scanning equipment, the polishing manipulator and the polishing equipment;
the feeding frame, the optical scanning equipment, the transfer frame and the waste frame are all arranged in the transfer range of the transfer manipulator;
the middle rotating frame and the polishing equipment are both arranged in the transferring range of the polishing mechanical arm.
Optionally, the feeding frame comprises a feeding part and a discharging part.
Optionally, the controller, the feeding frame, the transferring manipulator, the optical scanning device, the transferring frame, the polishing manipulator, the polishing device and the waste frame are all arranged in an integral frame, and an operation station is arranged outside the integral frame.
Optionally, the polishing device applied to the single crystal blade of any one of the above steps includes:
the controller controls the transfer manipulator to transfer the monocrystalline blade placed in the feeding frame to the optical scanning equipment;
the optical scanning device scans the single crystal blade and sends a scanning result to the controller;
the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame according to the scanning result;
the controller controls the polishing mechanical arm to transfer the monocrystalline blades placed in the transfer frame to the polishing equipment for polishing, and transfers the monocrystalline blades polished by the polishing equipment to the transfer frame;
and the controller controls the transfer manipulator to transfer the polished single crystal blade placed in the transfer frame to the optical scanning equipment.
Optionally, the feeding frame comprises a feeding part and a discharging part,
the controller controls the transfer robot to transfer the single crystal blade placed in the loading rack to the optical scanning device, comprising: the controller controls the transfer manipulator to transfer the monocrystalline blade placed in the feeding part of the feeding frame to the optical scanning equipment;
the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame according to the scanning result, and the controller comprises:
the controller determines the residual quantity distribution of the single crystal blade according to the scanning result, and judges whether the residual quantity distribution is in a preset range, wherein the preset range is a range from a preset minimum value to a preset maximum value;
if the allowance is distributed in the preset range, the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to the blanking part of the feeding frame;
if the margin distribution is larger than the preset maximum value, the controller controls the transfer manipulator to transfer the single crystal blade at the optical scanning device to the transfer frame;
and if the margin distribution is smaller than the preset minimum value, the controller controls the transfer manipulator to transfer the single crystal blade at the optical scanning device to the waste frame.
Optionally, after the controller determines the residual distribution of the single crystal blade according to the scan result, the method further includes:
the controller determines the motion trail of the polishing manipulator according to the allowance distribution;
the controller controls the polishing mechanical arm to transfer the monocrystalline blade placed in the transfer frame to the polishing equipment for polishing, and the polishing mechanical arm comprises:
and the controller controls the grinding and polishing manipulator to transfer the monocrystalline blades placed in the transfer frame to the grinding and polishing equipment so as to grind and polish according to the motion trail of the grinding and polishing manipulator.
Optionally, the optical scanning device scans the single crystal blade and sends a scanning result to the controller, including:
the optical scanning device scans by adopting a scanning mode matched with the type of the single crystal blade.
Optionally, the optical scanning device scans by adopting a scanning mode matched with the type of the single crystal blade, including:
if the type of the single crystal blade is a hollow single crystal blade, the optical scanning device scans the profile and thickness of the single crystal blade;
if the type of the single crystal blade is a non-hollow single crystal blade, the optical scanning device scans the profile of the single crystal blade.
Optionally, the controller determines a margin distribution of the single crystal blade according to the scan result, including:
and the controller inputs the scanning result to a preset single crystal residual quantity distribution determining model to obtain the residual quantity distribution of the single crystal blade.
Optionally, the polishing method of the polishing device includes: abrasive belt grinding and polishing, grinding wheel grinding and polishing and various grinding heads.
Based on the above technical scheme, the polishing device and method for single crystal blade provided by the application, the device comprises: the device comprises a controller, a feeding frame, a transferring manipulator, optical scanning equipment, a middle rotating frame, a polishing manipulator, polishing equipment and a waste frame, wherein the controller is respectively in communication connection with the transferring manipulator, the optical scanning equipment, the polishing manipulator and the polishing equipment. The device comprises a feeding frame, optical scanning equipment, a transfer frame and a waste frame, wherein the feeding frame, the optical scanning equipment, the transfer frame and the waste frame are all arranged in the transfer range of the transfer manipulator, the transfer frame and the polishing equipment are both arranged in the transfer range of the polishing manipulator, the device can optically scan single crystal blades through the optical scanning equipment, and a controller can control the transfer manipulator to transfer the single crystal blades among the feeding frame, the optical scanning equipment, the transfer frame and the waste frame according to the optical scanning result. When the monocrystalline blade is required to be polished, the transfer manipulator can transfer the monocrystalline blade to the transfer frame, and then the polishing manipulator transfers the monocrystalline blade on the transfer frame to polishing equipment for polishing. After polishing, the polishing manipulator can transfer the monocrystalline blade to the transfer frame, and then the transfer manipulator transfers the monocrystalline blade to the upper material frame. The single crystal blade polishing device realizes automatic identification, transfer and polishing of the single crystal blade, reduces the dependence on operators, effectively reduces the polishing cost of the single crystal blade, and is beneficial to improving the polishing consistency and efficiency of the single crystal blade.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic diagram of a single crystal blade polishing apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of another single crystal blade polishing apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic flow chart of a method for polishing a single crystal blade according to an embodiment of the present disclosure;
fig. 4 is a process schematic diagram of a method for controlling a transfer robot to transfer a single crystal blade at an optical scanning device to one of a transfer rack, a reject rack, and a loading rack according to a scanning result by a manufacturing machine disclosed in the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and are merely illustrative of the manner in which the embodiments of the application described herein have been described for objects of the same nature. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In order to reduce the cost and improve the polishing consistency and efficiency of the single crystal blade, the application provides a single crystal blade polishing device, and the single crystal blade polishing device provided by the application is further described in detail below with reference to the accompanying drawings and the specific embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a polishing apparatus for single crystal blades according to an embodiment of the present application, where the apparatus includes: the device comprises a controller 1, a feeding frame 2, a transferring manipulator 3, an optical scanning device 4, a transferring frame 5, a polishing manipulator 6, a polishing device 7 and a waste frame 8, wherein the controller 1 is respectively in communication connection with the transferring manipulator 3, the optical scanning device 4, the polishing manipulator 6 and the polishing device 7.
The controller 1, the feeding rack 2, the transferring manipulator 3, the optical scanning device 4, the transferring rack 5, the polishing manipulator 6, the polishing device 7 and the waste rack 8 are all arranged in the integral frame.
In the present application, the controller 1 may be an MCU (Microcontroller Unit, microcontroller) or a PLC (Programmable Logic Controller ).
The feeding frame 2, the transferring frame 5 and the waste frame 8 are provided with frames with single crystal blade adapting structures, and a plurality of single crystal blades can be placed at one time, wherein the feeding frame 2 comprises a feeding part and a discharging part, the single crystal blades which are processed can be placed on the feeding part, and the processed single crystal blades can be placed on the discharging part.
Both the transfer robot 3 and the polishing robot 6 may include a hand, a wrist, and an arm portion. The hand is a part directly contacted with the workpiece, and generally has the function of rotation or translation, so that the grabbing and carrying of workpieces with different shapes and sizes can be realized; the wrist is a part for connecting the hand and the arm, has independent freedom degree and can adjust the direction and the position of the hand; the arm is a support part for supporting the wrist and the hand, and can spatially move the hand and the wrist to realize the carrying function of the manipulator.
The optical scanning device 4 may be an optical three-dimensional scanner, a laser scanner, or the like, and may optically scan the single crystal blade.
The grinding and polishing device 7 can comprise a rough grinding station, a fine grinding station, a polishing station and a station for specially processing the blade transfer R angle and the blade edge plate, wherein each station has a specific purpose and an operation method, and realizes surface treatment such as grinding, polishing and the like on the single crystal blade.
The feeding frame 2, the optical scanning device 4, the transfer frame 5 and the waste frame 8 are all arranged in the transfer range of the transfer manipulator 3.
In this application, the controller 1 is communicatively connected to the transfer robot 3 and the optical scanning device 4, respectively. Therefore, the controller 1 can control the transfer robot 3 to transfer the single crystal blade between the feeding rack 2, the optical scanning device 4, the transfer rack 5, and the reject rack 8 according to the scanning result of the optical scanning device 4.
The transfer frame 5 and the polishing equipment 7 are both arranged in the transfer range of the polishing mechanical arm 6.
In the application, the controller 1 is respectively in communication connection with the polishing mechanical arm 6 and the polishing equipment 7, and the middle rotating frame 5 and the polishing equipment 7 are both arranged in the transferring range of the polishing mechanical arm 6. Thus, the controller 1 can control the polishing robot 6 to transfer the single crystal blade between the polishing apparatus 7 and the relay frame 5.
In practical applications, the controller 1 may be used to control the transfer robot 3 to transfer the single crystal blade placed in the loading rack 2 to the optical scanning device 4.
The controller may also be used to control the transfer robot 3 to transfer the single crystal blade at the optical scanning device 4 to one of the transfer rack 5, the reject rack 8, and the loading rack 2 according to the scanning result obtained by the optical scanning device 4.
The controller can also be used for controlling the grinding and polishing mechanical arm 6 to transfer the monocrystalline blade placed in the intermediate rotating frame 5 to the grinding and polishing equipment 7 for grinding and polishing, and transferring the monocrystalline blade ground and polished by the grinding and polishing equipment 7 to the intermediate rotating frame 5.
The controller may also be used to control the transfer robot 3 to transfer the polished single crystal blade placed in the intermediate turret 5 to the optical scanning device 4.
In summary, the present application provides a single crystal blade polishing apparatus, which includes: the device comprises a controller, a feeding frame, a transferring manipulator, optical scanning equipment, a middle rotating frame, a polishing manipulator, polishing equipment and a waste frame, wherein the controller is respectively in communication connection with the transferring manipulator, the optical scanning equipment, the polishing manipulator and the polishing equipment. The device comprises a feeding frame, optical scanning equipment, a transfer frame and a waste frame, wherein the feeding frame, the optical scanning equipment, the transfer frame and the waste frame are all arranged in the transfer range of the transfer manipulator, the transfer frame and the polishing equipment are both arranged in the transfer range of the polishing manipulator, the device can optically scan single crystal blades through the optical scanning equipment, and a controller can control the transfer manipulator to transfer the single crystal blades among the feeding frame, the optical scanning equipment, the transfer frame and the waste frame according to the optical scanning result. When the monocrystalline blade is required to be polished, the transfer manipulator can transfer the monocrystalline blade to the transfer frame, and then the polishing manipulator transfers the monocrystalline blade on the transfer frame to polishing equipment for polishing. After polishing, the polishing manipulator can transfer the monocrystalline blade to the transfer frame, and then the transfer manipulator transfers the monocrystalline blade to the upper material frame. The single crystal blade polishing device realizes automatic identification, transfer and polishing of the single crystal blade, reduces the dependence on operators, effectively reduces the polishing cost of the single crystal blade, and is beneficial to improving the polishing consistency and efficiency of the single crystal blade.
Further, the controller 1, the feeding frame 2, the transferring manipulator 3, the optical scanning device 4, the transferring frame 5, the polishing manipulator 6, the polishing device 7 and the waste frame 8 are all arranged in the integral frame, and an operation station 9 can be further arranged outside the integral frame, and specific reference can be made to fig. 2. Fig. 2 is a schematic structural view of another single crystal blade polishing apparatus according to an embodiment of the present application.
The foregoing embodiments of the present disclosure describe various forms of methods applicable to the apparatus of the present disclosure, and thus the following detailed description of the method for representing implicit orders in trade scenarios provided by the present disclosure will be given with reference to the accompanying drawings and the detailed description.
Referring to fig. 3, fig. 3 is a schematic flow chart of a polishing method for a single crystal blade according to an embodiment of the present application. The method may comprise the steps of:
step S101: the controller controls the transfer manipulator to transfer the monocrystalline blade placed in the feeding frame to the optical scanning device.
In the application, the controller can control the transfer manipulator to transfer the single crystal blade placed in the feeding part of the feeding frame to the optical scanning device.
Step S102: the optical scanning device scans the single crystal blade and sends the scanning result to the controller.
In this application, the optical scanning device may scan in a scanning manner matching the type of single crystal blade to verify the size of the single crystal blade. Among them, types of single crystal blades include hollow single crystal blades and non-hollow single crystal blades.
If the type of the single crystal blade is a hollow single crystal blade, the optical scanning device scans the profile and the thickness of the single crystal blade to obtain profile results and wall thickness data. The profile results and wall thickness data may be used as scan results.
When the optical scanning device cannot scan to obtain the wall thickness data of the single crystal blade or it is desired to obtain more accurate wall thickness data of the single crystal blade, a special CT (Computed Tomography ) device can be used for measuring the single crystal blade. The controller can receive the wall thickness data of the monocrystalline blade sent by the CT equipment, and can comprehensively analyze the profile result of the monocrystalline blade scanned by the optical scanning equipment and the wall thickness data of the monocrystalline blade measured by the CT equipment to determine the allowance distribution of the monocrystalline blade, so as to determine the motion trail of the grinding and polishing manipulator.
If the type of single crystal blade is a non-hollow single crystal blade, the optical scanning device scans the profile of the single crystal blade, and a profile result can be obtained. The contour result may be taken as a scan result.
Step S103: and the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame according to the scanning result.
In the application, the controller can determine the residual quantity distribution of the single crystal blade according to the scanning result, and control the transfer manipulator to transfer the single crystal blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame based on the residual quantity distribution.
Further, the controller may determine a motion profile of the polishing robot based on the margin distribution. The motion track of the polishing mechanical arm can influence the polishing track of the polishing equipment.
Step S104: the controller controls the grinding and polishing mechanical arm to transfer the monocrystalline blade placed in the transfer frame to the grinding and polishing equipment for grinding and polishing, and transfers the monocrystalline blade polished by the grinding and polishing equipment to the transfer frame.
Note that, the present invention is not limited to the above-described embodiments. The grinding and polishing mode of the grinding and polishing equipment can comprise abrasive belt grinding and polishing, grinding wheel grinding and polishing and various grinding heads.
In the application, the controller can control the grinding and polishing manipulator to transfer the monocrystalline blades placed in the transfer frame to the grinding and polishing equipment according to the motion track of the grinding and polishing manipulator so as to grind and polish, and transfer the monocrystalline blades polished by the grinding and polishing equipment to the transfer frame.
Step S105: the controller controls the transfer manipulator to transfer the polished single crystal blade placed in the transfer frame to the optical scanning equipment.
In the application, after the controller controls the transfer manipulator to transfer the polished single crystal blade placed in the transfer frame to the optical scanning equipment, the optical scanning equipment continues to scan the single crystal blade to check the size of the polished single crystal blade, and sends the scanning result to the controller, and the controller controls the transfer manipulator to transfer the single crystal blade at the optical scanning equipment to one of the transfer frame, the waste frame and the feeding frame according to the scanning result, and repeats the operation until the single crystal blade is only placed in one of the waste frame and the feeding frame.
On the basis of the embodiment disclosed in the application, in still another embodiment of the application, a specific implementation manner of controlling the transfer manipulator to transfer the single crystal blade at the optical scanning device to one of the transfer frame, the reject frame and the loading frame according to the scanning result by the controller is described in detail.
As an embodiment, please refer to fig. 4, which is a process schematic diagram of a method for controlling a transfer robot to transfer a single crystal blade at an optical scanning device to one of a transfer rack, a reject rack, and a loading rack according to a scanning result by a manufacturing machine disclosed in the present application. The method may comprise the steps of:
the controller determines the residual distribution of the single crystal blade according to the scanning result, and judges whether the residual distribution is in a preset range, wherein the preset range is a range from a preset minimum value to a preset maximum value.
In the present application, the controller may input the scan result to a preset single crystal margin distribution determination model, to obtain a margin distribution of the single crystal blade.
Wherein the training process of the single crystal margin distribution determination model may include: first, a plurality of first training samples marked with allowance distribution are obtained, and each first training sample comprises a scanning result of a single crystal blade. And training the initial single crystal residual quantity distribution determining model based on a plurality of first training samples to obtain a single crystal residual quantity distribution determining model, wherein the input of the initial single crystal residual quantity distribution determining model is a scanning result of the single crystal blade, and the output of the initial single crystal residual quantity distribution determining model is the residual quantity distribution of the single crystal blade.
Under the condition that the allowance is distributed in a preset range, the controller can control the transfer manipulator to transfer the monocrystalline blade at the optical scanning equipment to the blanking part of the upper material frame.
In the application, the allowance is distributed in a preset range, so that the size of the single crystal blade accords with the standard, and the controller can control the transfer manipulator to transfer the single crystal blade at the optical scanning equipment to the blanking part of the upper material frame for use.
Under the condition that the allowance distribution is larger than the preset maximum value, the controller can control the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to the transfer frame.
In the application, if the margin distribution is greater than the preset maximum value, it is indicated that the single crystal blade needs to be polished to remove the redundant part, and the controller can control the transfer manipulator to transfer the single crystal blade at the optical scanning device to the transfer frame so as to perform polishing.
And under the condition that the allowance distribution is smaller than a preset minimum value, the controller can control the transferring manipulator to transfer the single crystal blade at the optical scanning device to the waste frame.
In the application, if the margin distribution is smaller than the preset minimum value, which indicates that the single crystal blade is partially absent, the controller can control the transfer manipulator to transfer the single crystal blade at the optical scanning device to the waste rack for scrapping.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
It should be further noted that the above-described apparatus embodiments are merely illustrative, and that the units described as separate units may or may not be physically separate, and that units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. In addition, in the drawings of the embodiment of the device provided by the application, the connection relation between the modules represents that the modules have communication connection therebetween, and can be specifically implemented as one or more communication buses or signal lines. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the present application may be implemented by means of software plus necessary general purpose hardware, or of course may be implemented by dedicated hardware including application specific integrated circuits, dedicated CPUs, dedicated memories, dedicated components and the like. Generally, functions performed by computer programs can be easily implemented by corresponding hardware, and specific hardware structures for implementing the same functions can be varied, such as analog circuits, digital circuits, or dedicated circuits. However, a software program implementation is a preferred embodiment in many cases for the present application. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a readable storage medium, such as a floppy disk, a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random-access Memory (RAM, random Access Memory), a magnetic disk or an optical disk of a computer, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the embodiments of the present application.
In summary, the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same. Although the present application has been described in detail with reference to the above embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the above embodiments can be modified or some of the technical features can be replaced equivalently. Such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (10)
1. A single crystal blade polishing apparatus, comprising: the device comprises a controller, a feeding frame, a transferring manipulator, optical scanning equipment, a middle rotating frame, a polishing manipulator, polishing equipment and a waste frame, wherein the controller is respectively in communication connection with the transferring manipulator, the optical scanning equipment, the polishing manipulator and the polishing equipment;
the feeding frame, the optical scanning equipment, the transfer frame and the waste frame are all arranged in the transfer range of the transfer manipulator;
the middle rotating frame and the polishing equipment are both arranged in the transferring range of the polishing mechanical arm.
2. The single crystal blade grinding and polishing apparatus of claim 1, wherein the loading frame comprises a loading portion and a unloading portion.
3. The single crystal blade grinding and polishing apparatus of claim 1, wherein the controller, the loading frame, the transfer robot, the optical scanning device, the transfer frame, the grinding and polishing robot, the grinding and polishing device, and the reject frame are all disposed within an integral frame, and an operating station is disposed outside the integral frame.
4. A method of grinding and polishing a single crystal blade, characterized by being applied to the single crystal blade grinding and polishing apparatus as claimed in any one of claims 1 to 3, the method comprising:
the controller controls the transfer manipulator to transfer the monocrystalline blade placed in the feeding frame to the optical scanning equipment;
the optical scanning device scans the single crystal blade and sends a scanning result to the controller;
the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame according to the scanning result;
the controller controls the polishing mechanical arm to transfer the monocrystalline blades placed in the transfer frame to the polishing equipment for polishing, and transfers the monocrystalline blades polished by the polishing equipment to the transfer frame;
and the controller controls the transfer manipulator to transfer the polished single crystal blade placed in the transfer frame to the optical scanning equipment.
5. The method for polishing a single crystal blade according to claim 4, wherein the loading frame comprises a loading part and a discharging part,
the controller controls the transfer robot to transfer the single crystal blade placed in the loading rack to the optical scanning device, comprising: the controller controls the transfer manipulator to transfer the monocrystalline blade placed in the feeding part of the feeding frame to the optical scanning equipment;
the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to one of the transfer frame, the waste frame and the feeding frame according to the scanning result, and the controller comprises:
the controller determines the residual quantity distribution of the single crystal blade according to the scanning result, and judges whether the residual quantity distribution is in a preset range, wherein the preset range is a range from a preset minimum value to a preset maximum value;
if the allowance is distributed in the preset range, the controller controls the transfer manipulator to transfer the monocrystalline blade at the optical scanning device to the blanking part of the feeding frame;
if the margin distribution is larger than the preset maximum value, the controller controls the transfer manipulator to transfer the single crystal blade at the optical scanning device to the transfer frame;
and if the margin distribution is smaller than the preset minimum value, the controller controls the transfer manipulator to transfer the single crystal blade at the optical scanning device to the waste frame.
6. The method of grinding and polishing a single crystal blade according to claim 5, further comprising, after the controller determines a margin distribution of the single crystal blade from the scan result:
the controller determines the motion trail of the polishing manipulator according to the allowance distribution;
the controller controls the polishing mechanical arm to transfer the monocrystalline blade placed in the transfer frame to the polishing equipment for polishing, and the polishing mechanical arm comprises:
and the controller controls the grinding and polishing manipulator to transfer the monocrystalline blades placed in the transfer frame to the grinding and polishing equipment so as to grind and polish according to the motion trail of the grinding and polishing manipulator.
7. The method of polishing a single crystal blade according to claim 4, wherein the optical scanning device scans the single crystal blade and transmits a result of the scanning to the controller, comprising:
the optical scanning device scans by adopting a scanning mode matched with the type of the single crystal blade.
8. The method for polishing a single crystal blade according to claim 7, wherein the optical scanning device scans in a scanning manner matching the type of the single crystal blade, comprising:
if the type of the single crystal blade is a hollow single crystal blade, the optical scanning device scans the profile and thickness of the single crystal blade;
if the type of the single crystal blade is a non-hollow single crystal blade, the optical scanning device scans the profile of the single crystal blade.
9. The method of polishing a single crystal blade according to claim 5, wherein the controller determining a margin distribution of the single crystal blade based on the scan result, comprises:
and the controller inputs the scanning result to a preset single crystal residual quantity distribution determining model to obtain the residual quantity distribution of the single crystal blade.
10. The method for polishing a single crystal blade according to claim 4, wherein the polishing apparatus performs polishing by: abrasive belt grinding and polishing, grinding wheel grinding and polishing and various grinding heads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410229569.9A CN117884992A (en) | 2024-02-29 | 2024-02-29 | Grinding and polishing device and method for single crystal blade |
Applications Claiming Priority (1)
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