CN117878040A

CN117878040A - Vacuum equipment for chip packaging

Info

Publication number: CN117878040A
Application number: CN202410058458.6A
Authority: CN
Inventors: 张延忠; 赵永先; 文爱新; 赵登宇
Original assignee: Taimurui Beijing Precision Technology Co ltd
Current assignee: Taimurui Beijing Precision Technology Co ltd
Priority date: 2024-01-15
Filing date: 2024-01-15
Publication date: 2024-04-12

Abstract

The invention relates to the technical field of chip processing, and provides vacuum equipment for chip processing, which comprises a plurality of vacuum devices and a two-way vacuum sealing gate valve, wherein the vacuum devices comprise a first vacuum device and a second vacuum device which are sequentially arranged along the direction from a feed inlet to a discharge outlet; the vacuum cavity of the first vacuum device is communicated with or disconnected from the vacuum cavity of the second vacuum device through a two-way vacuum sealing door valve. The vacuum device comprises a shell, a carrying platform, a heating device and a first lifting device. A vacuum cavity is arranged in the shell, and at least one of the first side wall and the second side wall of the shell is provided with a material supporting device; the carrying platform is arranged in the vacuum cavity; the heating device is fixedly connected with the bottom wall of the shell; the first lifting device is connected with the lower part of the carrying platform so as to control the carrying platform to lift relative to the heating device and the material supporting device. The vacuum equipment of this application includes a plurality of vacuum devices, and vacuum devices is provided with feed inlet and discharge gate, and vacuum equipment can be applied to in-line production equipment.

Description

Vacuum equipment for chip packaging

Technical Field

The invention relates to the technical field of chip processing equipment, in particular to vacuum equipment for chip packaging.

Background

The vacuum device provides a clean and stable environment for chip packaging, and ensures the quality, performance and reliability of chips. Taking a vacuum eutectic furnace as an example, the vacuum eutectic furnace adopts a vacuum cavity, a chip is placed on a heating table in the cavity, and the welding of the chip is completed by utilizing the heating and cooling processes of the heating table.

In the related art, the vacuum device still needs to be fed and discharged manually, the degree of automation of the vacuum device is not high, the vacuum device is difficult to connect with an actual production line and realize continuous operation, and the generating capacity is low. Meanwhile, the heating table generally includes a stage and a heating device, and the elevating movement of the stage is correlated with the elevating movement of the heating device, and such correlation may cause the existence of safety risks due to the charged state in the movement.

Disclosure of Invention

The present invention is directed to solving at least one of the technical problems existing in the related art. The invention provides vacuum equipment for chip packaging, which is used for solving the defect of low automation degree of a vacuum device in the prior art.

The present invention provides a vacuum apparatus for chip packaging, comprising:

the vacuum devices are arranged along the direction from the feeding hole to the discharging hole, and comprise a first vacuum device and a second vacuum device which are sequentially arranged;

the two-way vacuum sealing door valve is positioned between the first vacuum device and the second vacuum device, and the vacuum cavity of the first vacuum device is communicated with or disconnected from the vacuum cavity of the second vacuum device through the two-way vacuum sealing door valve;

the vacuum apparatus includes:

the vacuum cavity is arranged in the shell, the shell comprises a first side wall and a second side wall which are oppositely arranged, the first side wall is provided with a feed inlet, the second side wall is provided with a discharge outlet, at least one of the first side wall and the second side wall is provided with a material supporting device, and the material supporting device is used for supporting materials so that the materials can move along the feed inlet towards the direction of the discharge outlet;

the carrier is arranged in the vacuum cavity;

the heating device is fixedly connected with the bottom wall of the shell and is used for heating the carrying platform;

and the first lifting device is connected with the lower part of the carrying platform so as to control the carrying platform to lift relative to the heating device and the material supporting device.

According to one embodiment of the invention, the bottom of the material is in contact with the wheel surface of the roller based on the two-way vacuum sealing door valve communicating the first vacuum device and the second vacuum device, so that the transportation from the first vacuum device to the second vacuum device is realized, and the top surface of the roller and the supporting surface of the material supporting device are in the same plane.

According to one embodiment of the invention, the material is transported into the vacuum chamber of the second vacuum device, the vacuum chamber of the first vacuum device being disconnected from the vacuum chamber of the second vacuum device by the bi-directional vacuum tight gate valve.

According to one embodiment of the invention, the carrier is switchable between a first position and a second position,

in the first position, the top surface of the carrying platform is higher than the roller, and the top surface of the carrying platform is in contact with the material so as to heat the material;

in the second position, the top surface of the carrying platform is lower than the roller, and the wheel surface of the roller is in contact with the material so as to realize the transportation of the material;

the rollers are arranged on two sides of the carrier, or the carrier is provided with avoidance holes, and the avoidance holes can avoid the rollers.

According to one embodiment of the invention, the height limiting device is arranged in the shell, the height limiting device comprises a limiting plate and a first elastic element, the first elastic element is connected with the limiting plate and extends out of the lower end face of the limiting plate, in the first position, the first elastic element abuts against the carrying platform, and the carrying platform is limited on the lower end face.

According to one embodiment of the invention, the heating device further comprises a control device, wherein the control device is electrically connected with the heating device so as to adjust the heating temperature of the heating device;

and/or the heating temperature of the first vacuum device is less than or equal to the heating temperature of the second vacuum device.

According to one embodiment of the invention, the stopping device is arranged at one end of the discharging hole and is used for stopping materials;

the position sensor is electrically connected with the control device and is arranged at least one end of the shell at the feed inlet and the discharge outlet, and the position sensor is used for detecting the position information of the materials;

the position sensor detects that the material is stopped by the stopping device, and the control device controls the two-way vacuum sealing door valve to disconnect the first vacuum device and the second vacuum device.

According to one embodiment of the invention, the vacuum system further comprises a third vacuum device, wherein the third vacuum device is connected with the second vacuum device through a two-way vacuum sealing door valve, and is provided with a first cooling pipeline for adjusting the cooling temperature of the materials.

According to one embodiment of the invention, at least one of the first vacuum device and the second vacuum device is provided with the first cooling line for adjusting the heating temperature of the material.

According to one embodiment of the invention, the bidirectional vacuum sealing door valve comprises a valve body, a valve plate and a driving device, wherein the valve body is provided with a through valve hole, the valve hole corresponds to one of the feeding hole and the discharging hole, and the driving device is suitable for driving the valve plate to move to open the valve hole or close the valve hole.

The above technical solutions in the embodiments of the present invention have at least one of the following technical effects:

(1) The vacuum equipment (hereinafter referred to as vacuum equipment for short) for chip packaging provided by the embodiment of the invention comprises a plurality of vacuum devices, wherein the vacuum devices are provided with a feed inlet and a discharge outlet, and the vacuum devices can be connected through a two-way vacuum sealing door valve to realize the connection of adjacent vacuum devices. The inlet and outlet of the vacuum equipment can be used for being integrated with other online equipment to form a more complex system, and the vacuum equipment can be applied to online production equipment to realize more functions and services.

(2) The vacuum device is provided with a feed inlet and a discharge outlet, a plurality of vacuum devices are assembled, and the feed inlet and the discharge outlet between the adjacent vacuum devices correspond to each other, so that the material is transported between the adjacent vacuum devices. This application accessible a plurality of vacuum devices carries out the module equipment in order to satisfy the processing condition of different materials, and the modularization installation equipment is free, can realize that installation quantity freely combines, can adapt to the processing demand of different materials in a flexible way.

(3) The heating device is fixedly connected with the shell, the carrying platform can be lifted relative to the heating device, and the heating device is prevented from being driven to move in the lifting process of the carrying platform, so that the stability and safety of the operation process are ensured. The carrier and the heating device are in split design, so that the carrier is convenient to assemble and disassemble when being assembled and maintained, and the assembly difficulty and maintenance cost of the whole device are reduced.

In addition to the technical problems, features of the structural solutions and advantages brought by the technical solutions with these technical features described above, other technical features of the present invention and advantages brought by these technical features will be further described with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a vacuum apparatus for chip packaging according to an embodiment of the present invention;

FIG. 2 is a schematic view of a vacuum apparatus according to an embodiment of the present invention;

FIG. 3 is an enlarged view at A in FIG. 2;

fig. 4 is an enlarged view at B in fig. 2;

FIG. 5 is a schematic side view of a vacuum apparatus according to an embodiment of the present invention;

FIG. 6 is an enlarged view at C in FIG. 5;

FIG. 7 is a schematic view of a housing according to an embodiment of the present invention;

FIG. 8 is a side view of a housing provided by an embodiment of the present invention;

FIG. 9 is a side view of a vacuum apparatus provided with an upper cover according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of a structure of a stage and a temperature sensor according to an embodiment of the present invention;

fig. 11 is an enlarged view of D in fig. 10;

FIG. 12 is identical to the structure of FIG. 11, and FIG. 12 does not illustrate the material;

Fig. 13 is a schematic view of another vacuum apparatus according to an embodiment of the present invention.

Reference numerals:

100. a housing; 110. A vacuum chamber;

120. a first sidewall; 121. A feed inlet;

130. a second sidewall; 131. a discharge port;

140. a third sidewall; 150. a fourth sidewall;

160. a material supporting device;

171. a first mating hole; 172. a second mating hole; 173. a third mating hole; 174. a fourth mating hole;

180. an upper cover; 181. a gas injection port;

190. a height limiting device; 191. a limiting plate; 192. a first elastic element;

200. a carrier; 210. avoidance holes; 220. a mounting hole; 240. a material;

300. a heating device; 310. a mounting part; 320. a heater;

410. a first guide device; 420. a stage supporting device; 421. a plate body; 430. a first driving device; 431. a housing; 432. a lifting rod; 440. a sealing device;

450. a temperature sensor; 451. a detection end; 452. a temperature sensor body; 453. a first sleeve; 454. a lifting channel; 455. a second sleeve; 456. a second elastic element; 457. a first fitting hole;

511. a roller; 512. a vacuum sealing structure; 520. a second driving device;

600. a two-way vacuum sealing gate valve; 610. a valve body; 611. a valve hole; 620. a valve plate; 630. a third driving device; 640. a flange; 650. mounting through holes;

710. A second guide device; 711. a guide plate;

800. a first cooling line; 810. a water inlet; 820. a water outlet; 830. a process port; 840. plugging;

910. a stopping device; 920. a position sensor.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.

In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Next, a vacuum apparatus for chip packaging according to the present invention will be described with reference to fig. 1 to 13.

Referring to fig. 1, 2 and 5, an embodiment of the present invention provides a vacuum apparatus for chip packaging (hereinafter referred to as vacuum apparatus), including a plurality of vacuum devices and a bi-directional vacuum sealing gate valve 600. Along the direction of feed inlet 121 to discharge gate 131, the vacuum device is located between first vacuum device and the second vacuum device, including first vacuum device and the second vacuum device that sets gradually. The vacuum chamber 110 of the first vacuum apparatus and the vacuum chamber 110 of the second vacuum apparatus are connected or disconnected by the two-way vacuum sealing gate valve 600.

The vacuum apparatus includes a housing 100, a stage 200, a heating apparatus 300, and a first elevating apparatus.

The vacuum cavity 110 is arranged in the shell 100, the shell 100 comprises a first side wall 120 and a second side wall 130 which are oppositely arranged, the first side wall 120 is provided with a feed inlet 121, the second side wall 130 is provided with a discharge outlet 131, at least one of the first side wall 120 and the second side wall 130 is provided with a material supporting device 160, and the material supporting device 160 is used for supporting a material 240 so that the material 240 can move along the feed inlet 121 towards the discharge outlet 131. The stage 200 is disposed in the vacuum chamber 110. The heating device 300 is fixedly connected to the bottom wall of the housing 100, and the heating device 300 is used for heating the carrier 200. The first lifting device is connected below the carrier 200 to control the carrier 200 to lift and lower relative to the heating device 300 and the material supporting device 160.

In this embodiment, the vacuum apparatus includes a plurality of vacuum devices, and the vacuum devices are provided with a feed inlet 121 and a discharge outlet 131, and the plurality of vacuum devices may be connected through a two-way vacuum sealing gate valve 600, so as to realize connection between adjacent vacuum devices. The inlet and outlet of the vacuum equipment can be used for being integrated with other online equipment to form a more complex system, and the vacuum equipment can be applied to online production equipment to realize more functions and services. The inlet of the vacuum apparatus may be understood as the inlet of material 240 into one end of the vacuum apparatus and the outlet of the vacuum apparatus may be understood as the outlet of material 240 out of the other end of the vacuum apparatus.

In-line production equipment is understood to mean equipment that can be connected to a production line directly involved in the process, and can be tried out for material 240 handling and processing operations. Compared with off-line equipment which is independently operated outside a production line, the off-line equipment needs to take the material 240 out of the production line for independent treatment, and the vacuum device can be applied to on-line equipment, can be connected with the production line, responds and processes the material 240 in real time, and is in seamless connection with the whole production flow, so that the degree of automation is greatly improved.

Wherein, the feeding hole 121 and the discharging hole 131 between the adjacent vacuum devices correspond to each other, so as to realize the transportation of the material 240 between the adjacent vacuum devices. It can be appreciated that the processing conditions required by different materials 240 (such as chips) are different, and the module assembly can be performed by a plurality of vacuum devices to meet the processing conditions of different materials 240, so that the modular installation and assembly are free, the free combination of the installation quantity can be realized, and the processing requirements of different materials 240 can be flexibly adapted. Such as: the arrangement of a plurality of heating zones can be realized by assembling a plurality of vacuum devices. Meanwhile, a plurality of processing tasks can be simultaneously carried out through the assembly of a plurality of vacuum devices, the production efficiency can be greatly improved, the production period is reduced, each vacuum device can independently work and is not influenced by other modules (vacuum devices), and therefore the production efficiency is improved.

A plurality of vacuum apparatuses are assembled, and adjacent vacuum apparatuses are connected by a two-way vacuum sealing door valve 600. Referring to fig. 1, a bi-directional vacuum-tight gate valve 600 is disposed between adjacent vacuum apparatuses, and a plurality of vacuum apparatuses are assembled to form a vacuum apparatus. The upstream end of the vacuum apparatus (i.e., the left end in the drawing) is the inlet of the vacuum apparatus for the entry of material 240; the downstream end of the vacuum apparatus (i.e., the right end in the drawing) is the outlet of the vacuum apparatus for the output of material 240. The two-way vacuum sealing door valve 600 may also be disposed at the inlet and outlet of the vacuum apparatus, ensuring the tightness of the inlet and outlet of the vacuum apparatus, and improving the vacuum sealing performance of the vacuum apparatus.

It should be noted that, regarding the bidirectional vacuum sealing door valve 600, the bidirectional vacuum sealing door valve 600 may realize bidirectional sealing, and the bidirectional sealing may be understood that the bidirectional vacuum sealing door valve 600 not only can realize a sealing effect in a vacuum pumping state, but also can realize a sealing effect in a micro-positive pressure state, so that the technical problem that the vacuum valve in the related art is unidirectional sealing and has micro-positive pressure and can leak air can be solved. The vacuum equipment provided in this embodiment performs vacuum pumping and replacement in the process, and in the process of vacuum pumping, the bidirectional vacuum sealing door valve 600 ensures the low-oxygen content environment of the cavity, that is, the vacuum sealing process environment is achieved, so that the interior of the shell 100 is maintained in the state of the vacuum cavity 110; then, protective gas can be filled into the vacuum cavity 110 to achieve a micro positive pressure environment, so that the chip can be protected in the processing process, the heating or cooling rate of the processing can be improved, and the positive pressure process requirement is met.

In this embodiment, the heating device 300 is fixedly connected to the housing 100, and the carrier 200 can be lifted relative to the heating device 300, so that the heating device 300 is prevented from being driven to move during the lifting process of the carrier 200, and thus the stability and safety of the operation process are ensured. The carrier 200 and the heating device 300 are designed in a split type, so that the carrier 200 is convenient to assemble and disassemble during assembly and maintenance, and the assembly and maintenance difficulty and maintenance cost of the whole device are reduced.

Wherein, the casing 100 is provided with feed inlet 121 and discharge gate 131, and material 240 passes in and out casing 100 from feed inlet 121 and discharge gate 131 and realizes the processing of material 240, and material strutting arrangement 160 can guarantee the stability of material 240 in the transmission process, and through the lift of first elevating gear control carrier 200 for heating device 300 and material strutting arrangement 160, carrier 200 can rise to the position of material 240 and heat, can avoid material 240 to place on carrier 200 along with the problem that carrier 200 motion caused material 240 skew.

With reference to fig. 2, the material supporting device 160 is disposed on the first side wall 120, and can support the material 240 at the feeding hole 121; the material supporting device 160 is arranged on the second side wall 130 and can support the material 240 at the discharge hole 131; of course, the first side wall 120 and the second side wall 130 may be provided with the material supporting device 160, so as to optimize the supporting of the material 240, ensure the stability of the material 240 in the transportation process, prevent the material 240 from shifting, and further improve the production efficiency and the stability of the process control through stable material 240 transportation.

The bi-directional vacuum-tight door valve 600 is used to connect or disconnect a first vacuum device and a second vacuum device, i.e., the bi-directional vacuum-tight door valve 600 can be used to connect or disconnect the vacuum chambers 110 of adjacent vacuum devices.

In the connected state, the material 240 may be transported from an upstream vacuum apparatus (i.e., a first vacuum apparatus) to a downstream vacuum apparatus (i.e., a second vacuum apparatus). In the disconnected state, the two-way vacuum sealing gate valve 600 disconnects the adjacent vacuum cavity 110, and the vacuum cavity 110 where the material 240 is located can maintain the vacuum environment through the two-way vacuum sealing gate valve 600, so as to ensure the vacuum environment of the material 240 package.

Next, the first vacuum apparatus and the second vacuum apparatus are described in a communication state.

Based on the two-way vacuum sealing gate valve 600 communicating the first vacuum device and the second vacuum device, the bottom of the material 240 is in contact with the tread of the roller 511 to effect transportation from the first vacuum device to the second vacuum device.

Referring to fig. 2 and 3, the rollers 511 are disposed on the left and right sides of the interior of the housing 100, and the rollers 511 may be disposed along the direction from the inlet 121 to the outlet 131, so as to ensure the stability of the transportation process of the material 240. When the material 240 enters the vacuum cavity 110 from the feed inlet 121, the bottom of the material 240 is in contact with the wheel surface of the roller 511, and the roller 511 rotates to realize the conveying of the material 240 from the feed inlet 121 to the discharge outlet 131.

In this embodiment, the top surface of the roller 511 is preferably coplanar with the supporting surface of the material supporting device 160. It will be appreciated that the material supporting device 160 is disposed at the feeding port 121 and the discharging port 131 to support the material 240, which is helpful to ensure the stability of the conveying of the material 240 between the first vacuum device and the second vacuum device and improve the conveying reliability. The top surface of the roller 511 and the supporting surface of the material supporting device 160 are in the same plane, so that the material 240 cannot move in the height direction in the transportation process, the stability of the material 240 in the transportation process can be further improved, the material 240 is prevented from shifting due to jolt in the transportation process, and the processing quality of the material 240 is improved.

Of course, in other embodiments, the top surface of the roller 511 and the supporting surface of the material supporting device 160 may be parallel to each other, that is, the top surface of the roller 511 and the supporting surface of the material supporting device 160 are not located on the same plane, so as to meet other transportation or processing requirements.

The material 240 may be a workpiece containing a chip, a jig containing a chip, or a workpiece containing a chip, which is transported on a transportation track (that is, a transportation channel formed by the plurality of rollers 511) of the housing 100 by the jig.

Next, the first elevating device will be described.

Referring to fig. 5, the first elevating device includes a stage supporting device 420 and a first driving device 430, wherein the stage supporting device 420 is fixedly connected with the stage 200 through a first fitting hole 171 at the bottom of the housing 100; the first driving device 430 drives the stage supporting device 420 to move in relation to the first matching hole 171, so as to drive the stage supporting device 420 to drive the stage 200 to lift. By driving the stage 200 to be lifted by the first driving device 430, accurate lifting control can be provided for lifting the stage 200, so that the lifting process of the stage 200 is stabilized.

Referring to fig. 5, the first lifting device further includes a first guiding device 410, a plate 421 and a sealing device 440, wherein the first guiding device 410 is fixedly connected to the housing 100, and the first guiding device 410 is fixedly connected to the housing 100; the plate 421 is slidably connected to the first guiding device 410, the plate 421 is fixedly connected to the plurality of stage supporting devices 420, the axis of the stage supporting devices 420 is parallel to the axis of the first guiding device 410, and the output end of the first driving device 430 is slidably connected to the plate 421.

It is understood that the first guiding device 410 is slidably connected to the plate 421, and the first guiding device 410 can provide a stable guiding effect for the plate 421, so as to ensure that the carrier 200 can stably move on a preset path, and the preset path can be understood as a lifting path of the carrier 200.

The plurality of carrier support devices 420 are arranged to provide more stable support for the carrier 200, the plurality of carrier support devices 420 are fixedly connected through the plate 421, the axes of the carrier support devices 420 are parallel to the axes of the first guide devices 410, the cooperative work of the plurality of carrier support devices 420 can be realized, the bearing capacity and the working efficiency of the carrier support devices 420 can be improved, and the stability of the carrier 200 in the lifting process can be ensured.

In some embodiments, referring to fig. 5, the first driving device 430 includes a housing 431, a motor and a lifting rod 432, and the housing 431 fixes the connection plate body 421; the motor is arranged in the shell 431, one end of an output shaft of the motor is connected with the transmission gear, and the output shaft rotates to drive the transmission gear to rotate; one end of the lifting rod 432 is fixedly connected with the shell 100, the other end of the lifting rod 432 is provided with a threaded section meshed with a transmission gear, the threaded section penetrates through a connecting hole of the transmission gear, and the transmission gear rotates to drive the lifting rod 432 to move, so that the lifting rod 432 drives the plate body 421 to lift, and the plate body 421 is used for lifting the carrier support device 420 to lift the carrier 200.

Referring to fig. 5, an output shaft of the motor is perpendicular to the driven rod, and is connected with the transmission gear, and the output shaft rotates to drive the transmission gear to rotate. One end of the driven rod is fixedly connected with the shell 100, and the other end of the driven rod is provided with a threaded section which penetrates through a connecting hole of the transmission gear. It is understood that the connecting hole is provided with a groove body matched with the thread section; the transmission gear rotates, and the groove body drives the thread section to move so as to drive the driven rod to move. One end of the driven rod is fixedly connected with the shell 100, the other end of the driven rod can be understood as connecting the plate body 421 through the shell 431, and the driven rod can be lifted and lowered by the shell 100 to drive the plate body 421 to lift and lower; the plate 421 is fixedly connected with the carrier support device 420, and the plate 421 can drive the carrier support device 420 to lift; the carrier support device 420 is connected with the carrier 200, and the carrier support device 420 is lifted to drive the carrier 200 to lift.

The transmission mode of the motor output shaft of the first driving device 430 and the lifting rod 432 is simple and reliable, the reliability and stability of the lifting adjustment of the carrier 200 can be improved, the carrier 200 is directly driven to lift, namely, the carrier 200 is lifted and adjusted in the vertical direction, and the stability of the movement process of the carrier 200 can be effectively improved.

The sealing device 440 is connected to the stage support device 420 and disposed at the first fitting hole 171, and the stage support device 420 and the housing 100 are dynamically sealed by the sealing device 440. The sealing device 440 may be a dynamic seal made of sealing materials such as a sealing ring, a sealing gasket, etc.; also, a flexible resilient seal 440 is possible, such as: expansion joints, elastic sleeves and the like, the sealing device 440 can stretch and retract within a certain range so as to adapt to the lifting of the carrier support device 420 and ensure the dynamic sealing of the carrier support device 420 in the lifting process. Compared with sealing materials such as a sealing ring, the adoption of the telescopic elastic sealing device 440 is stronger in adaptability, can adapt to the movement of the carrier support device 420, can better fill the sealing contact surface, reduces the sealing gap, and can also avoid the sealing failure possibly caused by long-term friction of the sealing ring.

When a plurality of carrier support devices 420 are provided, the corresponding housing 100 is provided with a plurality of first matching holes 171, and further, the sealing device 440 is also provided with a plurality of sealing devices, so that dynamic sealing of each carrier support device 420 in the moving process can be ensured, vacuum effect of the vacuum cavity 110 is ensured, and processing quality of the material 240 is ensured.

Next, the first vacuum apparatus and the second vacuum apparatus are described in an off state.

The material 240 is transported into the vacuum chamber 110 of the second vacuum apparatus, and the vacuum chamber 110 of the first vacuum apparatus is disconnected from the vacuum chamber 110 of the second vacuum apparatus by the bi-directional vacuum sealing gate valve 600. It will be appreciated that after the material 240 is processed in the first vacuum apparatus, the two-way vacuum sealing gate valve 600 communicates with the vacuum chambers 110 of the first vacuum apparatus and the second vacuum apparatus, and the material 240 is transferred from the first vacuum apparatus to the second vacuum apparatus until the material 240 is completely located in the vacuum chambers 110 of the second vacuum apparatus, the two-way vacuum sealing gate valve 600 disconnects the vacuum chambers 110 of the first vacuum apparatus and the second vacuum apparatus, so as to ensure that the processing environment of the material 240 in the vacuum chambers 110 of the second vacuum apparatus is a vacuum environment, and ensure the processing quality.

Next, the roller 511 and a driving method of the roller 511 will be described.

Referring to fig. 2, the vacuum apparatus includes a transporting device and a second driving device 520, the transporting device includes a roller 511 and a vacuum sealing structure 512, the roller 511 is disposed in the housing 100 to drive the feed inlet 121 toward the discharge outlet 131, and the wheel surface of the roller 511 is used for transporting the material 240; the outer side of the housing 100 is connected with the vacuum sealing structure 512 and the second driving device 520, the housing 100 is provided with a second matching hole 172, and an output shaft of the second driving device 520 penetrates through the second matching hole 172 and is connected with the roller 511, and the vacuum sealing structure 512 is connected with the housing 100 and the second driving device 520 in a sealing manner. The vacuum sealing structure 512 can seal the second mating hole 172 and the output shaft, and can ensure that the housing 100 maintains a vacuum environment during the material 240 transferring process, thereby helping to prevent external air from entering the housing 100, maintaining the housing 100 at a desired vacuum level, and further improving the stability of the chip package.

The vacuum sealing structure 512 can realize that the roller 511 can ensure the sealing of the vacuum cavity 110 while rotating and conveying the material 240. May be a mechanical seal, such as by a seal ring, packing, or rotary seal face, etc.; the magnetic sealing can be realized, and the magnetic sealing layer is formed by a magnet and a magnetic material (such as magnetic fluid), so that the vacuum sealing is realized, and the requirements of rotation and high vacuum can be met; the vacuum rotary seal can also be a liquid seal, a sealing layer is formed by liquid in the rotary process, the sealing gap is filled with the liquid, and the vacuum rotary seal is realized by the viscosity and the surface tension of the liquid.

The second driving device 520 is connected to the casing 100 and is located at the outer side of the casing 100, so that the damage to the second driving device 520 caused by the high-temperature and high-pressure environment generated during the processing of the casing 100 can be prevented, the maintenance of the second driving device 520 can be facilitated, the second driving device 520 drives the conveying device to convey the materials 240, and the process efficiency is improved.

Correspondingly, the casing 100 is provided with a plurality of second matching holes 172, and a plurality of output shafts of the second driving device 520 are provided, and the plurality of output shafts are in one-to-one transmission connection with the plurality of rollers 511, so that the rollers 511 can rotate. The second driving device 520 further includes a driving motor, which may be disposed on the left side of the housing 100 and located on the outer side of the housing 100, and may be in transmission connection with the output shafts on both sides of the housing 100, and drive the output shafts to drive the rollers 511 to rotate through transmission. The motion control of the plurality of transmission shafts can be realized through the driving motor, the synchronism and the coordination among the plurality of transmission shafts can be realized, and the transportation efficiency is improved.

The driving mode of the driving motor and the driving shaft may be gear driving, belt driving or chain driving, and the driving mode of the driving motor and the driving shaft may be set according to actual needs, that is, the setting of the second driving device 520 may be selected according to the needs of practice.

When a plurality of rollers 511 are provided, a plurality of second matching holes 172 are correspondingly provided on the housing 100, a plurality of output shafts of the second driving device 520 are provided, and the plurality of output shafts are in one-to-one transmission connection with the plurality of rollers 511, so as to realize rotation of the rollers 511. The second driving device 520 may be a driving motor, which may be disposed on the left side of the housing 100 and located on the outer side of the housing 100, and may be in transmission connection with the output shafts on both sides of the housing 100, and drive the output shafts to drive the rollers 511 to rotate through transmission. The motion control of the plurality of transmission shafts can be realized through the driving motor, the synchronism and the coordination among the plurality of transmission shafts can be realized, and the transportation efficiency is improved.

In some embodiments, referring to fig. 2 and 3, the vacuum apparatus provided in the embodiments of the present invention further includes a second guiding device 710, where the second guiding device 710 is disposed between the roller 511 and the housing 100, the second guiding device 710 may be installed and positioned inside the housing 100 through a guiding plate 711, and the second guiding device 710 may provide accurate positioning and guiding effects for the material 240 when transported in the housing 100, which helps to improve the production efficiency and the product quality.

The rollers 511 are disposed in the housing 100, and the rollers 511 may be disposed at both sides of the stage 200; the carrier 200 may be provided with an avoidance hole 210, the avoidance hole 210 may avoid the roller 511, and the roller 511 may transport the material 240 in the avoidance hole 210.

Next, the stage 200 and the roller 511 will be described.

The switching of the stage 200 between the first position and the second position is understood to mean that the stage 200 is adjustable between the first position and the second position.

In combination with 3, in the first position, the top surface of the carrier 200 is higher than the roller 511, and the top surface of the carrier 200 contacts with the material 240, that is, the carrier 200 can jack up the material 240, the material 240 fully contacts with the carrier 200, and under the heating action of the heating device 300 on the carrier 200, the required heating treatment can be fully provided for the material 240, so as to realize the heating function. In the second position, the top surface of the carrier 200 is lower than the rollers 511, and the surfaces of the rollers 511 contact the material 240 to enable transportation of the material 240.

In the second position, the material 240 contacts the surface of the roller 511, so that the carrier 200 does not interfere with the transporting process of the material 240, and the material 240 can be transported stably until being removed from the discharge hole 131. The vacuum device integrates a heating function and a transportation function, has high integration level, strong reliability and good practicability, and is suitable for various application scenes.

The first elevating device can drive the stage 200 to elevate, and can position the stage 200 at the first position, the stage 200 at the second position, and the stage 200 between the first position and the second position.

Wherein, combining 3, the carrier 200 is provided with an avoiding hole 210, and the avoiding hole 210 can avoid the roller 511, so as to ensure that the carrier 200 is stably switched between the first position and the second position. Of course, the rollers 511 may be disposed at two sides of the carrier 200, and the carrier 200 may not be provided with the avoiding holes 210, so that the area of the carrier 200 is larger, and the contact area with the material 240 is larger, which is helpful for fully contacting with the material 240.

In the first position, the carrier 200 contacts the material 240, and the carrier 200 is spaced apart from the heating device 300. It will be appreciated that the heating device 300 heats the carrier 200, i.e. the heat of the heating device 300 is transferred to the carrier 200, which in turn heats the material 240 through the carrier 200. In this embodiment, the carrier 200 and the heating device 300 are disposed at intervals, so that the problem that the material 240 (such as a chip) is directly heated by the heating device 300 in the related art, and processing is difficult to achieve when the bottom of the material 240 is uneven can be solved.

Referring to fig. 2 and 3, the vacuum apparatus further includes a height limiting device 190, the height limiting device 190 is disposed in the housing 100, the height limiting device 190 includes a limiting plate 191 and a first elastic element 192, the first elastic element 192 is connected with the limiting plate 191, the first elastic element 192 extends out of a lower end surface of the limiting plate 191, in the first position, the first elastic element 192 abuts against the carrier 200, and the carrier 200 is limited on the lower end surface. In this embodiment, the limiting plate 191 may provide a limiting effect for lifting the carrier 200, the limiting plate 191 is disposed above the carrier 200, and when the carrier 200 is lifted to the first position, the limiting plate 191 will be limited on the lower end surface of the limiting plate 191, so that the carrier 200 is prevented from lifting beyond a specified height range by the existence of the limiting plate 191, stability and mountability of the carrier 200 are improved, and meanwhile, by limiting the lifting range of the carrier 200, materials on the carrier 200 can be ensured to be in a required operation position, and accurate processing on chips can be realized at the operation position.

Wherein, the first elastic element 192 is connected to the limiting plate 191, and the existence of the first elastic element 192 allows the carrier 200 to rise to realize a buffering effect, absorb vibration or impact, and reduce the vibration generated when the carrier 200 rises to the lower end surface of the limiting plate 191, thereby reducing the risk of damaging the carrier 200 and prolonging the service life of the carrier 200. Meanwhile, the presence of the elastic member can help to smoothly adjust the height of the stage 200, thereby improving the adjustment accuracy of the stage 200 and further improving the reliability of the processing. Of course, the carrier 200 may be limited to the lower end surface of the limiting plate 191, and when a material, such as a jig or a workpiece with a chip placed thereon, is disposed on the carrier 200, the jig or the workpiece may be limited to the lower end surface of the limiting plate 191.

It should be noted that, the heating device 300 may be a radiation heating device for heating the carrier 200, and compared with the heating device 300 in the related art for directly heating the material 240, the heat conduction efficiency is better, and the heating effect is better. Of course, induction heating or the like may be used.

In some embodiments, heating device 300 heats material 240 by infrared radiation heating. For example, the heating device 300 includes an infrared heater 320, and the infrared heater 320 heats the stage 200 by radiating heat energy. At this time, the carrier 200 may be a light-transmitting structure, so that the infrared rays can directly act on the material 240 through the carrier 200, and the heating effect of the material 240 is good.

Next, the heating device 300 will be described.

Referring to fig. 5 and 6, the heating apparatus 300 includes a mounting portion 310 and a heater 320, the mounting portion 310 is hermetically connected to the housing 100, the heater 320 does not participate in sealing, the heater 320 is detachably connected to the mounting portion 310, and the detachment and reinstallation of the heater 320 are facilitated, simplifying maintenance and replacement processes, thereby reducing apparatus downtime and costs. It will be appreciated that different packaging processes may require different types of heaters 320, and that the heaters 320 may be detachably connected to the mounting portion 310 to replace the heaters 320 of different specifications, powers or types as needed to accommodate different packaging processes and requirements, and to improve flexibility and adaptability.

The heater 320 may be detachably connected to the mounting portion 310, and the heater 320 may be inserted into the mounting portion 310, so that maintenance and replacement are facilitated.

It can be understood that, referring to fig. 7, the housing 100 is provided with a third fitting hole 173, and the mounting portion 310 is mounted in the third fitting hole 173 and fixedly connected to the housing 100.

As shown in fig. 2 and 7, along the direction from the feed inlet 121 to the discharge outlet 131, the installation part 310 is provided with a plurality of heaters 320, and the plurality of heaters 320 can fully cover the corresponding heating areas, so that the carrier 200 is fully heated, the temperature of the carrier 200 is more uniform, and the quality and performance of chips in the packaging process can be promoted.

Wherein the plurality of heaters 320 may be uniformly controlled. The plurality of heaters 320 can be independently controlled respectively, and the temperature and the power can be adjusted according to the requirement, so as to meet the heat requirements of different packaging areas in the vacuum cavity 110, control the heat distribution more accurately, optimize the packaging process and improve the reliability.

The mounting part 310 includes a quartz sleeve, which has high thermal stability and high temperature resistance, and can withstand high temperature and maintain a stable heating state; the heater 320 includes an infrared heater 320, and the infrared heater 320 heats the carrier 200 in a radiation heat energy manner, so that a certain distance between the carrier 200 and the heater 320 in a lifting process can be avoided, the influence of the reduction of the heating effect of the heater 320 can be avoided, and the heating control can be accurately realized. The infrared heater 320 is inserted into the quartz sleeve, so that the infrared heater 320 is convenient to assemble and disassemble, meanwhile, the quartz sleeve is high in light transmittance, infrared rays generated by the infrared heater 320 can pass through the quartz sleeve with high transmittance, loss of the infrared rays is reduced, and heating effect is guaranteed.

In some embodiments, referring to fig. 9, the case 100 may include an upper cover 180, and the heating device 300 is disposed at an upper side of the case 100, and may be assembled by the upper cover 180. In the case that the shell portion includes the upper cover 180, the upper cover 180 may be provided with a gas injection port 181, and a specific gas may be introduced into the vacuum chamber 110 through the gas injection port 181, thereby realizing a gas environment requirement of the chip in the process and satisfying a specific process requirement.

It should be noted that, in some embodiments, referring to fig. 9, in the case that the housing 100 includes the upper cover 180, the housing 100 further includes the lower housing, and a flange structure may be disposed at the top of the lower housing, where the flange structure is used to seal the upper cover 180 and the lower housing, so as to seal the upper cover 180 and the lower housing, ensure a sealing effect in a chip packaging process, and have strong reliability in a processing process. Meanwhile, the upper cover 180 is arranged to enable the lower shell to form an open cavity structure, so that the carrier 200 is convenient to maintain and replace, and the manufacturing process is simple, the manufacturing cost is low, and the production efficiency is high.

It is understood that the stage 200 is disposed inside the housing 100, and the heating device 300 is disposed below the stage 200. It may also be understood that the carrier 200 is disposed above the heater 320, and the workpiece or the jig or other foreign matters are isolated from the heater 320 by the carrier 200, so that the carrier 200 can avoid the risk that the workpiece or the jig and other structures fall on the heater 320 to break or damage the heater 320, thereby ensuring a vacuum environment.

Of course, in some embodiments, in conjunction with FIG. 13, it is also possible to dispense with the carrier 200 and to raise the carrier support 420 into direct contact with the material 240 to lift the material 240 from the rollers 511.

Taking the material 240 as a chip, the chip is transported by the workpiece, and the bottom of the workpiece is uneven, which is understood to mean that the bottom surface of the workpiece is not flat, but has an irregular shape, uneven or not completely flat. In the related art, the heating device 300 is directly contacted with the workpiece to heat the chip, and the bottom of the workpiece is uneven, so that the position of the chip is easy to change, which not only makes it difficult to complete the procedures of heating welding or packaging, but also causes uneven heating and affects the processing quality of the chip.

The vacuum apparatus provided in the embodiment of the present invention adopts a method of heating the heating device 300 and the material 240 (which may also be understood as a chip or a workpiece for holding a chip) in a non-contact manner, and the stage support device 420 is lifted, where the stage 200 is not provided in the embodiment, and the stage support device 420 may be lifted until the stage support device contacts the material 240, so as to lift the material 240 from the end surface of the roller 511. In this embodiment, the carrier support device 420 is used for supporting the material 240, and can adapt to the material 240 with uneven bottom, so as to ensure that the material 240 can be uniformly heated for processing, thereby ensuring reliable and stable processing quality of the product. In some embodiments, referring to fig. 10 to 12, the vacuum apparatus further includes a temperature sensor 450, and the temperature sensor 450 is connected to the stage 200.

In the second position (in conjunction with fig. 12), the detection end 451 of the temperature sensor 450 protrudes out of the carrier 200; in the first position (in conjunction with fig. 10 and 11), the detection end 451 is adapted to contact the material 240. In the first position, the sensing end 451 of the temperature sensor 450 contacts the material 240, enabling real-time monitoring of the temperature of the material 240, thereby ensuring that the temperature remains within a desired range during heating. The temperature sensor 450 provides real-time feedback on the process temperature of the material 240, which helps the operator adjust the heating device 300 to meet specific process requirements (e.g., the process temperature required for different products may be different). At the same time, the temperature sensor 450 is configured to avoid heating the material 240 to a temperature that may cause overheating or burning. By means of the temperature sensor 450, the processing temperature can be better controlled, thereby improving the consistency and quality of the product, which is important for applications requiring a high degree of reliability, such as the manufacture of semiconductor chips.

The carrier 200 is provided with the mounting hole 220, and the detection end 451 is worn to locate the mounting hole 220, and detection end 451 can follow the mounting hole 220 and move, and detection end 451 can be in the mounting hole 220 lift adjustment, and detection end 451 and carrier 200's mounting means is simple.

In the second position, the top surface of the detection end 451 is higher than the top surface of the mounting hole 220. When the stage 200 is lifted up to contact with the material 240, since the top surface of the detection end 451 is higher than the top surface of the mounting hole 220, i.e., the top surface of the detection end 451 exceeds the upper surface of the stage 200, the detection end 451 is contacted with the material 240 first, then the detection end 451 is lowered down in the mounting hole 220, and then the stage 200 is contacted with the material 240 again.

In this embodiment, in the second position, the top surface of the detection end 451 is higher than the top surface of the mounting hole 220, so that the detection end 451 can be ensured to contact the material 240, the reliability of the contact between the detection end 451 and the material 240 is improved, and the problem of inaccurate detection result caused by the fact that the detection end 451 cannot contact the material 240 is avoided. Meanwhile, the manner that the material 240 is contacted with the detection end 451 first, the detection end 451 descends, and finally contacts with the carrier 200 is beneficial to reducing vibration or impact possibly caused by contact, and is beneficial to ensuring the stability of the working procedure and the reliability of detection.

Referring to fig. 11, in the first position, the detection end 451 is positioned within the mounting aperture 220. It will be appreciated that during the lifting of the stage 200, the detection end 451 is in contact with the material 240 first, and then the stage 200 continues to lift, and the detection end 451 receives downward pressure from the material 240 and descends (i.e. moves downward) in the mounting hole 220 until the stage 200 is in the second position and contacts the material 240, at this time, the detection end 451 is limited to the mounting hole 220, and the bottom of the detection end 451 contacts the bottom of the mounting hole 220.

In this embodiment, the detection end 451 positioned in the mounting hole 220 can better maintain a fixed position, and cannot accidentally move or swing, which helps to ensure that the position of the temperature sensor 450 and the manner of contacting the material 240 are stable during operation, thereby improving the repeatability of measurement. Meanwhile, in the first position, since the detection end 451 is located in the mounting hole 220, protection of the detection end 451 is facilitated, and the problem that the detection structure is inaccurate due to the fact that the detection end 451 is affected by other factors is avoided.

It should be noted that, when the detecting end 451 contacts the material 240, the detecting end 451 may be limited to the mounting hole 220 just when the detecting end 451 contacts the material 240, and at this time, it may be understood that the length of the detecting end 451 in the vertical direction is the same as the length of the mounting hole 220 in the vertical direction.

Of course, the length of the detection end 451 may be longer than the length of the mounting hole 220 in the vertical direction. At this time, the detection end 451 may be an elastic contact. After the detecting end 451 is contacted with the material 240, the detecting end 451 is lowered, and after the lower end of the detecting end 451 is abutted against the bottom wall of the mounting hole 220, since the carrier 200 is not contacted with the material 240 at this time, the carrier 200 is further raised, the material 240 is pressed down against the detecting end 451, the detecting end 451 is further lowered, and the detecting end 451 is pressed to be elastically deformed until the carrier 200 is contacted with the material 240. In this embodiment, the contact pressure between the detection end 451 and the material 240 can be increased by the cooperation of the mounting hole 220 and the elastic contact element, so that the detection end 451 and the material 240 can be always in close contact, and the detection effect is improved.

In other embodiments, the detecting end 451 may contact the material 240, and in the first position, the bottom of the detecting end 451 is higher than the limiting hole, and the detecting end 451 contacts the material 240 to detect the temperature of the material 240.

In other embodiments, the temperature sensor 450 can be lifted by the second lifting device, so that the control precision of the contact between the temperature sensor 450 and the material 240 can be improved.

Next, the structure of the temperature sensor 450 will be described.

Referring to fig. 11, the temperature sensor 450 includes: a temperature sensor body 452, a first sleeve 453, and a second sleeve 455.

The temperature sensor body 452 is provided with a detection end 451. The first sleeve 453 is fixedly connected with the carrier 200, and a lifting channel 454 is arranged in the first sleeve 453. The second sleeve 455 is disposed in the lifting channel 454, the second sleeve 455 is fixedly connected to the temperature sensor body 452, the temperature sensor body 452 is disposed through the second sleeve 455, and the second sleeve 455 can lift in the lifting channel 454 to realize lifting of the detection end 451.

In this embodiment, the first sleeve 453 is fixedly connected to the carrier 200, the second sleeve 455 is slidably connected to the first sleeve 453, and the second sleeve 455 is slidably disposed in the first sleeve 453. The second sleeve 455 is fixedly connected to the temperature sensor body 452, and the temperature sensor body 452 is provided with a detection end 451, and the detection end 451 is used for contacting the material 240 to detect the temperature of the material 240.

When the material 240 contacts the detecting end 451, the detecting end 451 descends, and the detecting end 451 is fixedly connected with the second sleeve 455, so as to drive the second sleeve 455 to descend in the lifting channel 454. It may also be understood that the temperature sensor body 452 is connected to the carrier 200 through the second sleeve 455, the temperature sensor 450 has a simple structure, the lifting of the detection end 451 is realized by lifting the second sleeve 455 in the lifting channel 454, and the height adjustment of the detection end 451 is simple.

The first sleeve 453 is provided with a first fitting hole 457, the stage 200 is provided with a second fitting hole, and the first sleeve 453 is connected to the stage 200 via a connector penetrating through the first fitting hole 457 and the second fitting hole. The first sleeve 453 is connected with the carrier 200 through the connecting piece, so that the connection strength of the first sleeve 453 and the carrier 200 can be ensured, the connection strength of the temperature sensor 450 and the carrier 200 is improved, and reliable support is provided for the temperature sensor 450 in the lifting adjustment and temperature adjustment processes.

The first assembly hole 457 and the second assembly hole can provide positioning for connection of the first sleeve 453 and the carrier, so that the first sleeve 453 can be accurately fixed on the carrier 200, assembly of the first sleeve 453 and the carrier 200 is simple and convenient, assembly difficulty is reduced, and assembly efficiency is improved.

Wherein, the connecting piece can be screw, double-screw bolt etc. and first mounting hole 457 and second mounting hole are provided with the screw thread section that meshes with it, and connecting piece threaded connection first mounting hole 457 and second mounting hole. The connecting piece can also be a bolt, and the second assembly hole is provided with a clamping groove, and the first sleeve 453 is connected with the carrier 200 by penetrating the bolt into the first assembly hole 457 and inserting the bolt into the clamping groove, so that the connecting mode is simple. Of course, the connecting piece can also be a bayonet lock, and the structure of the connecting piece can be selected according to actual requirements, and is not limited herein.

The temperature sensor 450 further includes a second elastic member 456, the second elastic member 456 being disposed between the first sleeve 453 and the second sleeve 455. The second elastic member 456 can reduce vibration and mechanical shock from the elevating movement of the detection end 451, and the adjustment of the detection end 451 is reliably stabilized, thereby helping to maintain the detection stability of the temperature sensor 450.

In some embodiments, referring to fig. 13, the vacuum device may not be provided with a stage 200, and the vacuum device may lift the material 240 from the rollers 511 by adjusting the elevation of the stage support 420. At this time, the temperature sensor 450 may be disposed at an end of the stage supporting device 420 contacting the material 240. When the stage supporting device 420 contacts the material 240, the detecting end 451 of the temperature sensor 450 also contacts the material 240, so as to detect the temperature of the material 240.

Regarding the first vacuum device and the second vacuum device:

the first vacuum device and the second vacuum device have the same structure, and the heating temperatures of the first vacuum device and the second vacuum device can be the same so as to meet the requirement that the material 240 is processed for a plurality of times at the same temperature. The heating temperatures of the first heating device 300 and the second heating device 300 may be different to meet the requirements of the material 240 for different processing temperatures.

In some embodiments, the vacuum apparatus further comprises a control device electrically connected to the heating device 300 to adjust the heating temperature of the heating device 300, so as to precisely control the processing temperature of the material 240, and ensure that the desired temperature range is obtained under the vacuum condition to be a temperature range satisfying the processing condition of the material 240. Meanwhile, temperature control is helpful for maintaining the stability of the vacuum device, and avoiding the influence of temperature fluctuation on processing, thereby influencing the processing quality of the material 240.

The heating temperature of the first vacuum device is less than or equal to the heating temperature of the second vacuum device. It is understood that the first vacuum device is disposed upstream of the second vacuum device, and that the heating temperature of the first vacuum device is less than or equal to the heating temperature of the second vacuum device. The first vacuum device may be understood as a preheating zone of the material 240 and the second vacuum device may be understood as a heating zone of the material 240.

In this embodiment, the first vacuum device is used as a preheating zone of the material 240, so that the material 240 can be preheated to a preset temperature, which can help to reduce the heating time required by the material 240 to reach the heating temperature in the second vacuum device, and save time, thereby improving the heating efficiency of the second vacuum device and the production efficiency of the vacuum equipment. The preset temperature is understood to be a temperature range equal to or less than the heating temperature of the second vacuum device.

It will be appreciated that preheating followed by heating, by preheating the material 240 in the first vacuum device, reduces the damage to the second vacuum device and the material 240 from sudden high temperature impact (i.e., heating directly using the heating temperature of the heating zone), prolongs the life of the apparatus and reduces maintenance costs, as compared to direct heating.

In this embodiment, the first vacuum device and the second vacuum device are set to different functional areas, the first vacuum device is a preheating area, the second vacuum device is a heating area, and it can also be understood that the heating process of the material 240 is divided into a plurality of processes, which is helpful for more precisely and accurately controlling each area. Meanwhile, the preheating and heating of the material 240 can be simultaneously performed through the first vacuum device and the second vacuum device, so that a continuous production process can be realized, the downtime is reduced, and the degree of automation of the vacuum equipment is effectively improved.

The heating temperatures of the first vacuum apparatus and the second vacuum apparatus may be the same or different, and are not limited herein. Meanwhile, the number of the first vacuum devices and the second vacuum devices can be set according to actual demands, one vacuum device can be set, and a plurality of vacuum devices can be set according to actual demands, and the method is not limited herein.

In some embodiments, the vacuum apparatus further comprises a third vacuum device connected to the second vacuum device through a bi-directional vacuum sealing gate valve 600, the third vacuum device being provided with a first cooling line 800, the first cooling line 800 being used to adjust the cooling temperature of the material 240.

It will be appreciated that a third vacuum device is connected downstream of the second vacuum device, the third vacuum device being provided with a first cooling line 800, the third vacuum device being understood to be a cooling zone. The first cooling line 800 allows for precise cooling control of the material 240, and by adjusting the cooling temperature, it can be ensured that the material 240 reaches a desired cooling temperature range during processing to meet specific process requirements.

Next, the first cooling line 800 will be described with reference to fig. 7 to 8.

Referring to fig. 7, the vacuum apparatus for chip packaging further includes a first cooling pipe 800, where the first cooling pipe 800 is connected to the housing 100 and is located outside the housing 100, and the first cooling pipe 800 can absorb heat of the housing 100, so as to realize heat dissipation and cooling of the housing 100, and effectively control the temperature of the housing 100, so that the temperature of the housing 100 is maintained at a desired set temperature in the chip packaging process. It can be appreciated that in the embodiment of the present invention, a sealing structure is required to be provided to ensure the tightness of the vacuum cavity 110, and the cooling of the first cooling pipeline 800 can also prevent the housing 100 from overheating, so as to avoid phenomena such as hardening and aging that may occur when the sealing structure is in a high-temperature environment for a long time, prevent the problem of reducing the sealing effect, and ensure the stability of the sealing structure in long-term use.

When the first cooling pipeline 800 is connected to the housing 100 and is located outside the housing 100, the first cooling pipeline 800 may be located above the heating device 300, so that adjustability of the cooling speed can be achieved, and rapid cooling or slow cooling of the first cooling pipeline 800 can be achieved by adjusting the heating temperature of the heating device 300, so as to adapt to different process requirements. For example, some chips may cause stress concentration, deformation or crack under the condition of rapid cooling, and the heating of the heating device 300 to the first cooling pipeline 800 may limit the cooling speed, so as to avoid too rapid temperature change, thereby reducing material stress and improving uniformity of the cooling process. Of course, the first cooling circuit 800 may be provided with the heating device 300 alone, and the heating device 300 may heat the first cooling circuit 800 alone.

When casing 100 includes interior casing and shell body, first cooling pipeline 800 locates between interior casing and the shell body, and first cooling pipeline 800 realizes the heat dissipation cooling of casing 100, and interior casing and shell body position first cooling pipeline 800 provide the installation space, need not to set up the installation space of first cooling pipeline 800 again in addition, and overall structure's compactness degree is high, simultaneously, the shell body still can play the effect of protection first cooling pipeline 800.

In this embodiment, with reference to fig. 8, the arrows indicate the direction of water flow, water enters from the water inlet 810, flows rightward, upward, leftward along the first cooling line 800, and finally flows out from the water outlet 820. The first cooling pipeline 800 is arranged in a roundabout manner, so that the cooling area can be effectively increased. The first cooling pipeline 800 is provided with a water inlet 810 and a water outlet 820, the water inlet 810 is used for being connected with an external water source, and circulated cooling water is provided for the first cooling pipeline 800, so that the cooling effect of the shell 100 is effectively improved. In connection with fig. 8, the housing 100 is provided with a process port 830, where the process port 830 is used to process the first cooling pipeline 800, and the first cooling pipeline 800 may be integrally formed with the housing 100. After the first cooling circuit 800 is formed, a seal or sealing material may be used to seal 840 the process port 830 to ensure a sealing effect of the first cooling circuit 800.

The first cooling pipeline 800 is connected with the carrier 200 and is positioned in the carrier 200, the first cooling pipeline 800 is in direct contact with the carrier 200, heat of the carrier 200 can be quickly and effectively absorbed, heat dissipation efficiency is improved, meanwhile, the first cooling pipeline 800 is integrated in the carrier 200, arrangement and connection of external pipelines can be reduced, occupied space of the device is saved, and the whole structure is more compact.

In some embodiments, at least one of the first vacuum device and the second vacuum device is provided with a first cooling line 800 for adjusting the heating temperature of the material 240. The first cooling pipe 800 may be provided in the first vacuum apparatus, the second vacuum apparatus, or both the first vacuum apparatus and the second vacuum apparatus. The arrangement of the first cooling pipe 800 in the first vacuum device and the second vacuum device is consistent with the arrangement of the first cooling pipe in the third vacuum device, and the above may be specifically considered, which is not described herein.

It should be noted that the preheating zone, the heating zone, and the cooling zone may be set according to the requirements of the actual material 240, that is, the first vacuum device, the second vacuum device, and the third vacuum device may be set according to the processing requirements of the actual chips. The preheating zone, the heating zone and the cooling zone can be assembled by a plurality of vacuum devices, and then the vacuum devices in different areas are assembled to form a processing production line. With reference to fig. 1, 4 processing modules are sequentially arranged from left to right, and a preheating zone, a welding zone and a cooling zone are sequentially arranged from left to right; that is, two first vacuum devices, one second vacuum device and one third vacuum device are sequentially provided from left to right. Wherein, the structure of the vacuum device of the preheating zone is identical with that of the heating zone, and the difference is the difference of the heating temperature; the difference between the cooling zones is that a first cooling line 800 is provided, and cooling is achieved by means of the first cooling line 800. Of course, the preheating zone, the heating zone and the cooling zone may be identical in structure.

The vacuum device provided by the embodiment of the invention can realize the freedom of modularized installation and assembly of the vacuum device, can realize the free combination of the installation quantity, and different processing requirements can be met by selecting different quantities and types of vacuum devices (the first cooling pipeline 800 is arranged or the first cooling pipeline 800 is not arranged), so that flexible device configuration and expansibility are provided, and the free combination can be carried out according to the requirements of process steps, thereby improving the processing quality. Of course, the vacuum devices in different areas can be assembled by a plurality of vacuum devices, or each area can be provided with one vacuum device, and the vacuum devices can be arranged according to actual processing requirements.

The first cooling circuit 800 provides the housing 100 for cooling the housing 100 and may also be used to adjust the cooling temperature and cooling rate of the material 240. In some embodiments, the plate 421 is provided based on the first lifting device, and the second cooling line is further provided on the plate 421.

In this embodiment, the second cooling pipe is connected to the plate 421, and it can be also understood that the second cooling pipe is connected to the first lifting device through the plate 421. The plate body 421 is provided with a second cooling pipeline and a driving device, the structure of the plate body 421 is simple, the second cooling pipeline and the driving device are fixed and supported through the plate body 421, fixed parts for the second cooling pipeline and the driving device can be omitted, the structure of the whole system is simplified, the assembly of the second cooling pipeline and the driving device is simple, the assembly efficiency is high, the structure of the second cooling pipeline and the driving device is compact, the occupied space of the whole vacuum device is reduced, and the space utilization rate is improved.

Wherein, the stage supporting device 420 is connected to the stage 200, the heating device 300 is used for heating the stage 200, and the stage supporting device 420 will rise along with the rise of the temperature of the stage 200. The stage support 420 is connected to a driving device, and the temperature of the stage support 420 is transferred to the driving device. Wherein, the driving device is disposed on the plate 421, which can be understood as that the shell 100 of the driving device is connected with the plate 421, the cross-sectional area of the plate 421 is larger than the cross-sectional area of the shell 100 of the driving device, the cooling device is disposed on the plate 421, the cooling area of the cooling device is also larger, the cooling effect of the cooling device on the driving device and the stage supporting device 420 is also better, and the problem of ageing and damage of the stage supporting device 420 and the driving device caused by high temperature can be effectively avoided. The cooling device is arranged on the plate 421, so that the heat dissipation area of the cooling device can be increased, and the cooling efficiency of the cooling device can be improved.

It can be appreciated that the driving device is used to drive the stage supporting device 420 to lift, and the driving device also generates heat during operation, so that the driving device is connected to the plate 421, and the driving device can dissipate heat, and the cooling device absorbs the heat generated by the driving device, so as to further reduce the influence of the heat on the driving device.

Wherein, the second cooling pipeline can be arranged on the surface of the plate 421, can be arranged in the installation cavity inside the plate 421, and can also be arranged on the surface and the installation cavity inside the plate 421, thereby effectively improving the cooling effect.

The second cooling pipeline can be integrated with the plate 421, and integrated into one piece can reduce part quantity, reduces the assembly degree of difficulty, and simultaneously, integrated into one piece can improve the heat transfer efficiency between second cooling pipeline and the plate 421, can improve cooling efficiency, helps reducing the system temperature effectively.

The driving device is connected to the bottom of the plate 421, and the lifting rod 432 penetrates through the mounting hole 220 of the plate 421. Referring to fig. 1 and 5, the driving device is disposed at the lower side of the plate 421, the housing 100 is disposed at the upper side of the plate 421, the plate 421 is provided with a mounting hole 220, and the lifting rod 432 is disposed through the mounting hole 220 to connect with the housing 100. It can be appreciated that the lifting rod 432 can move up and down along the mounting hole 220, the plate body 421 is provided with a second cooling pipeline, the lifting rod 432 penetrates through the mounting hole 220 of the plate body 421, the mounting hole 220 surrounds the lifting rod 432, and the cooling capacity of the second cooling pipeline can be transferred to the surface of the lifting rod 432 through the mounting hole 220, so that efficient cooling is realized, and the temperature of the lifting rod 432 is effectively reduced.

In the present embodiment, compared with connecting the driving device at the top of the plate 421, i.e. between the plate 421 and the housing 100, connecting the driving device at the bottom of the plate 421, the space between the plate 421 and the housing 100 is large, i.e. the adjustable stroke of the stage supporting device 420 is increased, and the adjustable height range of the stage 200 is further increased. Of course, in other embodiments, the driving device may be disposed on the top of the plate 421, and the driving device may be disposed according to actual requirements.

Next, the structure of the two-way vacuum sealing door valve 600 will be described.

Referring to fig. 1, the bi-directional vacuum sealing gate valve 600 is hermetically connected to at least one of the first sidewall 120 and the second sidewall 130, the bi-directional vacuum sealing gate valve 600 includes a valve body 610, a valve sheet 620, and a third driving device 630, the valve body 610 is provided with a valve hole 611 penetrating therethrough, the valve hole 611 corresponds to one of the feed port 121 and the discharge port 131, and the third driving device 630 is adapted to drive the valve sheet 620 to move to open the valve hole 611 or close the valve hole 611. By opening and closing the valve hole 611 of the valve plate 620, communication between the inlet 121 and the outlet 131 and the outside can be achieved, thereby realizing transmission of the material 240 and enabling the material 240 to enter and exit the housing 100. The bi-directional vacuum sealing gate valve 600 is hermetically connected to the first sidewall 120 and the second sidewall 130, and when the valve plate 620 closes the valve hole 611, the housing 100 and the bi-directional vacuum sealing gate valve 600 can stably form a sealing area, thereby providing sealing reliability for chip packaging. The third driving device 630 is used for opening or closing the two-way vacuum sealing door valve 600, so that automation of a process flow can be realized, and the chip processing efficiency can be improved.

The bidirectional vacuum sealing door valve 600 is provided with a flange 640, the flange 640 is arranged at the valve hole 611, and it can be understood that the flange 640 encloses the valve hole 611, the shell 100 is provided with a threaded hole corresponding to the installation through hole 650 of the flange 640, and the connection between the vacuum door body and the shell 100 is realized through a connecting piece penetrating through the threaded hole of the installation through hole 650.

In the present embodiment, an annular seal groove is provided around at least one of the mounting through hole 650 and the screw hole, the annular seal groove being for mounting a seal to achieve sealing of the two-way vacuum sealing door valve 600 with the housing 100. The sealing element can be at least one of a sealing ring and a sealing gasket.

In some embodiments, the two-way vacuum sealing gate valve 600 may be disposed at the inlet 121 and the outlet 131 of one vacuum device, or may be assembled by a plurality of vacuum devices, where the inlet 121 and the outlet 131 of adjacent devices are in corresponding and sealing connection, and the two-way vacuum sealing gate valve 600 is disposed at the head end (one end of the material 240 entering the device) and the tail end (one end of the material 240 exiting the device). That is, the vacuum device for chip packaging in the embodiment of the invention can realize modularized assembly, and a set number of vacuum devices for chip packaging can be selected for assembly according to requirements, so that the processing technology requirements of various chips are met.

In some embodiments, referring to FIG. 4, the vacuum apparatus further includes a stop 910 and a position sensor 920.

The stopping device 910 is disposed at one end of the discharge hole 131, and is used for stopping the material 240, and the stopping device 910 can ensure that the material 240 stops at the material conveying hole and keeps a stable position, so as to avoid sliding and overflowing of the material 240. The position sensor 920 is electrically connected with the control device, the position sensor 920 is arranged at least one end of the shell 100 at the feed inlet 121 and the discharge outlet 131, the position sensor 920 is used for detecting the position information of the material 240, the position sensor 920 can provide real-time monitoring information of the position of the material 240, so that an operator or an automatic control system can acquire the position state of the material 240 in real time, the monitoring process and necessary adjustment are facilitated, and the normal operation and the product quality of the device are ensured.

The position sensor 920 detects that the material 240 is stopped by the stopping device 910, and the control device controls the bi-directional vacuum sealing gate valve 600 to disconnect the first vacuum device and the second vacuum device. The combination of stop device 910 and position sensor 920 can improve production efficiency, and by accurately parking material 240 and monitoring its position in real time, the dwell time and misoperation during processing can be reduced, and the working efficiency of the device can be improved. It is understood that the housing 100 is provided with the fourth fitting hole 174, and the position sensor 920 is provided at the fourth fitting hole 174.

It should be noted that, the housing 100 further includes a third side wall 140 and a fourth side wall 150 disposed opposite to each other, and the third side wall 140 and the fourth side wall 150 connect the first side wall 120 and the second side wall 130, and a position sensor 920 for detecting a position of the material 240 may be disposed on at least one of the first side wall 120, the second side wall 130, the third side wall 140 and the fourth side wall 150.

The stopping device 910 may be a baffle-type device, and a movable baffle is provided to stop the movement of the material 240 and stop the flow thereof, and the baffle may be manually or automatically controlled to move to control the stopping and releasing of the material 240. The stopping device 910 may be a ram-type device, which is composed of one or more rams that move horizontally or vertically, and which can block or release the material 240 by lifting or lowering the rams, and the rams can be controlled by hydraulic, pneumatic, or electric actuation. The stop 910 may also be a mechanical stop 910 that prevents movement of the material 240 by providing a physical barrier or mechanical feature, such as a push rod, pin, or cam.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and those skilled in the art should understand that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum apparatus for chip packaging, comprising:

the vacuum apparatus includes:

the carrier is arranged in the vacuum cavity;

2. The vacuum apparatus for chip packaging according to claim 1, wherein the bottom of the material is in contact with a tread of a roller based on the communication of the first vacuum device and the second vacuum device by the bi-directional vacuum sealing gate valve to effect transportation from the first vacuum device to the second vacuum device, the top surface of the roller being coplanar with a support surface of the material support device.

3. The vacuum apparatus for chip packaging according to claim 2, wherein the material is transported into the vacuum cavity of the second vacuum device, the vacuum cavity of the first vacuum device being disconnected from the vacuum cavity of the second vacuum device by the bi-directional vacuum sealing gate valve.

4. The vacuum apparatus for chip packaging as recited in claim 2, wherein the carrier is switchable between a first position and a second position,

5. The vacuum apparatus for chip packaging according to claim 4, further comprising a height limiting device disposed in the housing, the height limiting device comprising a limiting plate and a first elastic element, the first elastic element being connected to the limiting plate, the first elastic element extending out of a lower end surface of the limiting plate, the first elastic element abutting the stage in the first position, the stage being limited to the lower end surface.

6. The vacuum apparatus for chip packaging according to claim 1, further comprising a control device electrically connected to the heating device to adjust a heating temperature of the heating device;

7. The vacuum apparatus for chip packaging according to claim 6, further comprising:

the stop device is arranged at one end of the discharge hole and is used for stopping materials;

8. The vacuum apparatus for chip packaging according to claim 1, further comprising a third vacuum device connected to the second vacuum device through a bi-directional vacuum-tight door valve, the third vacuum device being provided with a first cooling line for adjusting a cooling temperature of the material.

9. Vacuum apparatus for chip packaging according to claim 8, characterized in that at least one of the first vacuum device and the second vacuum device is provided with the first cooling line for adjusting the heating temperature of the material.

10. Vacuum apparatus for chip packaging according to any one of claims 1 to 9, wherein the bi-directional vacuum sealing gate valve comprises a valve body provided with a through valve hole corresponding to one of the inlet port and the outlet port, a valve plate and a driving means adapted to drive the valve plate to move to open the valve hole or close the valve hole.