CN117874944A

CN117874944A - Cable heat evaluation method, device, computer equipment and storage medium

Info

Publication number: CN117874944A
Application number: CN202311783090.1A
Authority: CN
Inventors: 郭霖徽; 雷超平; 夏铭聪; 童家鹏; 陈忠文; 彭伟骏; 周启浩; 吴奇洛
Original assignee: Guangzhou Power Supply Bureau of Guangdong Power Grid Co Ltd
Current assignee: Guangzhou Power Supply Bureau of Guangdong Power Grid Co Ltd
Priority date: 2023-12-22
Filing date: 2023-12-22
Publication date: 2024-04-12

Abstract

The application relates to a cable heat assessment method, a device, computer equipment and a storage medium, and relates to the field of cable analysis. The method comprises the following steps: carrying out line analysis on the cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected; determining node parameters of each model node in the multi-core cable hot-path model; and carrying out thermal evaluation treatment on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected. The method and the device can realize accurate thermal evaluation of the cable to be detected, and improve the accuracy of thermal evaluation of the cable to be detected.

Description

Cable heat evaluation method, device, computer equipment and storage medium

Technical Field

The present disclosure relates to the field of cable analysis, and in particular, to a cable thermal assessment method, apparatus, computer device, and storage medium.

Background

With the wide access of new energy sources such as solar energy, wind energy and the like to the power distribution network, the optimized management and safe operation of the power distribution network are more and more paid attention. The multi-core cable is used as a main cable line in the power distribution network, and in order to ensure the service life and the operation reliability of the cable line, the multi-core cable needs to be subjected to thermal evaluation.

However, the internal structure of the multi-core cable is complex (for example, the three-core cable contains a three-phase conductor heat source, and the shape of a filling layer in the three-core cable is irregular), so that the existing method has the problem of low accuracy when performing heat evaluation on the multi-core cable, and cannot accurately reflect the actual heating situation of the multi-core cable.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a cable heat assessment method, apparatus, computer device, and storage medium capable of improving the assessment accuracy of cable heat assessment.

In a first aspect, the present application provides a method of cable thermal assessment. The method comprises the following steps:

carrying out line analysis on the cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected;

determining node parameters of each model node in the multi-core cable hot-path model;

and carrying out thermal evaluation treatment on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected.

In one embodiment, determining node parameters of each model node in the multi-core cable thermal circuit model includes:

performing first parameter analysis on the insulator and the outer protective layer of the multi-core cable thermal circuit model to obtain first parameters in node parameters;

And carrying out second parameter analysis on the conductor and the filling layer of the multi-core cable thermal path model to obtain a second parameter in the node parameters.

In one embodiment, performing a first parameter analysis on an insulator and an outer jacket of a multi-core cable thermal circuit model to obtain a first parameter of node parameters, including:

performing thermal resistance analysis on an insulator of the multi-core cable thermal path model to obtain an insulator thermal resistance parameter in the first parameters;

and carrying out thermal resistance analysis on the outer sheath of the multi-core cable thermal path model to obtain the thermal resistance parameter of the outer sheath in the first parameter.

In one embodiment, performing a second parameter analysis on the conductor and the filler layer of the multi-core cable thermal path model to obtain a second parameter of the node parameters, including:

determining a filling layer shape factor corresponding to the cable to be detected;

performing thermal resistance analysis on the filling layer of the multi-core cable thermal circuit model according to the filling layer shape factor to obtain a filling layer thermal resistance parameter in the second parameter;

and carrying out heat productivity analysis on the conductor of the multi-core cable heat path model to obtain the conductor heat parameter in the second parameter.

In one embodiment, performing line analysis on a cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected, including:

Carrying out line analysis on the cable to be detected to obtain structural parameters and cable operation parameters of the cable to be detected;

and constructing a multi-core cable thermal circuit model corresponding to the cable to be detected according to the structural parameters and the cable operation parameters.

In one embodiment, constructing a multi-core cable thermal path model corresponding to a cable to be detected according to a structural parameter and a cable operation parameter includes:

according to the structural parameters and the cable operation parameters, carrying out internal temperature analysis on the cable to be detected to obtain cable temperature information of the cable to be detected;

and constructing a multi-core cable thermal circuit model corresponding to the cable to be detected according to the cable temperature information.

In a second aspect, the present application also provides a cable heat assessment device. The device comprises:

the model determining module is used for carrying out line analysis on the cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected;

the parameter determining module is used for determining node parameters of each model node in the multi-core cable hot-path model;

and the thermal evaluation module is used for carrying out thermal evaluation treatment on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected.

In a third aspect, the present application also provides a computer device. The computer device comprises a memory storing a computer program and a processor which when executing the computer program performs the steps of:

In a fourth aspect, the present application also provides a computer-readable storage medium. A computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:

In a fifth aspect, the present application also provides a computer program product. Computer program product comprising a computer program which, when executed by a processor, realizes the steps of:

According to the cable heat evaluation method, the device, the computer equipment and the storage medium, the multi-core cable heat path model corresponding to the cable to be detected is obtained by carrying out line analysis on the cable to be detected, the node parameters of each model node in the multi-core cable heat path model are determined, and then the cable to be detected is subjected to heat evaluation according to the node parameters, so that the heat evaluation result of the cable to be detected is obtained. According to the above, before performing heat evaluation treatment on the cable to be detected, the method performs line analysis on the cable to be detected to obtain a multi-core cable heat path model, so that the internal structure of the cable to be detected is obtained according to the multi-core cable heat path model, and further, the heat evaluation treatment on the cable to be detected is realized according to node parameters of each model node in the multi-core cable heat path model; because the multi-core cable thermal circuit model can accurately reflect the internal structure of the cable to be detected, and the node parameters can reflect the actual heating value and the thermal resistance condition of the cable to be detected of each model node in the multi-core cable thermal circuit model, when the cable to be detected is subjected to thermal evaluation processing, the influence of the internal structure of the cable to be detected on the thermal evaluation result is considered, the influence of each model node in the multi-core cable thermal circuit model on the thermal evaluation result of the cable to be detected is fully considered, the thermal evaluation result of the cable to be detected can accurately reflect the actual heating condition of the cable to be detected, and the evaluation accuracy of the thermal evaluation result is improved.

Drawings

Fig. 1 is a flowchart of a cable heat assessment method according to an embodiment of the present application;

FIG. 2 is a flowchart illustrating steps for determining node parameters according to an embodiment of the present application;

FIG. 3 is a flowchart illustrating steps for determining a second parameter according to an embodiment of the present disclosure;

FIG. 4 is a diagram of an area example provided in an embodiment of the present application;

FIG. 5 is a flowchart of steps for determining a thermal circuit model of a multi-core cable according to an embodiment of the present disclosure;

FIG. 6 is an exemplary diagram of a multi-core cable thermal circuit model provided in an embodiment of the present application;

FIG. 7 is a flow chart of another method for evaluating cable heat provided in an embodiment of the present application;

FIG. 8 is a block diagram of a first cable heat assessment device according to an embodiment of the present disclosure;

FIG. 9 is a block diagram of a second cable heat assessment device according to an embodiment of the present disclosure;

FIG. 10 is a block diagram of a third cable heat assessment device according to an embodiment of the present disclosure;

FIG. 11 is a block diagram of a fourth cable heat assessment device according to an embodiment of the present disclosure;

FIG. 12 is a block diagram of a fifth cable heat assessment device according to an embodiment of the present disclosure;

FIG. 13 is a block diagram of a sixth cable heat assessment device according to an embodiment of the present disclosure;

Fig. 14 is an internal structural diagram of a computer device in one embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application. In the description of the present application, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

In one embodiment, as shown in fig. 1, an electric field strength detection method is provided, where the method is applied to a terminal for illustration, it is understood that the method may also be applied to a server, and may also be applied to a system including the terminal and the server, and implemented through interaction between the terminal and the server. The terminal can be, but not limited to, various personal computers, notebook computers, smart phones, tablet computers, internet of things equipment and portable wearable equipment, and the internet of things equipment can be smart speakers, smart televisions, smart air conditioners, smart vehicle-mounted equipment and the like. The portable wearable device may be a smart watch, smart bracelet, headset, or the like. The server may be implemented as a stand-alone server or as a server cluster composed of a plurality of servers. In this embodiment, the method includes the steps of:

in an exemplary embodiment, as shown in fig. 1, fig. 1 is a flowchart of a cable heat assessment method according to an embodiment of the present application, and a cable heat assessment method is provided, which includes the following steps 101 to 103. Wherein:

and 101, carrying out line analysis on the cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected.

It should be noted that, because the circuit structures, circuit materials, input currents and the like of different cables to be detected may have differences, the multi-core cable thermal circuit models corresponding to different cables to be detected also have differences, and in the process of determining the multi-core cable thermal circuit model corresponding to the cables to be detected, circuit analysis needs to be performed on the cables to be detected to obtain model parameters of the circuit structures, the circuit materials, the input currents and the like of the cables to be detected, and further, the multi-core cable thermal circuit model corresponding to the cables to be detected is constructed according to the model parameters.

Further, the cable types of the cable to be tested can be classified into: the multi-core cable thermal circuit model corresponding to the cable to be detected can be a two-core cable thermal circuit model, a three-core cable thermal circuit model, a four-core cable thermal circuit model, a five-core cable thermal circuit model and the like, and the cable type of the cable to be detected is not limited.

In an embodiment of the present application, according to a structural parameter and a cable operation parameter of a cable to be detected, a multi-core cable thermal path model corresponding to the cable to be detected may be obtained, which specifically may include the following contents: the method comprises the steps of carrying out line analysis on a cable to be detected to obtain structural parameters (such as the inner diameter, the outer diameter and the material property of the cable to be detected) and cable operation parameters (such as conductor input current and thermodynamic boundary conditions) of the cable to be detected, further, analyzing the internal temperature distribution condition of the cable to be detected according to the structural parameters and the cable operation parameters of the cable to be detected to obtain cable temperature distribution of the cable to be detected, and further, setting model nodes of a multi-core cable thermal path model corresponding to the cable to be detected and comprising model nodes according to the cable temperature distribution of the cable to be detected so as to realize construction of the multi-core cable thermal path model corresponding to the cable to be detected.

Wherein the model nodes are used for characterizing each structural element in the cable to be tested, further, the structural elements can include, but are not limited to: at least one insulator, conductor and filling layer corresponding to the cable cell in the cable to be detected, and an outer protective layer corresponding to the cable to be detected.

Step 102, determining node parameters of each model node in the multi-core cable hot-path model.

The node parameters comprise a first parameter and a second parameter, wherein the first parameter comprises an insulator thermal resistance parameter and an outer protection layer thermal resistance parameter in the multi-core cable thermal path model, and the second parameter comprises a filling layer thermal resistance parameter and a conductor heat parameter in the multi-core cable thermal path model.

It should be noted that, because the node parameters can accurately reflect the heating condition of each part of the structure in the cable to be detected, the node parameters of each model node in the multi-core cable thermal path model have a key role in the thermal evaluation process of the cable to be detected, and in order to ensure that the thermal evaluation result of the cable to be detected can be accurately obtained later, the node parameters of each model node in the multi-core cable thermal path model need to be determined so that the accurate thermal evaluation of the cable to be detected can be performed later according to the node parameters.

In another embodiment of the present application, when it is required to obtain node parameters of each model node in the multi-core cable thermal path model, the following may be specifically included: performing thermal resistance analysis and calculation on the insulator of the multi-core cable thermal circuit model through an insulator thermal resistance calculation formula to obtain an insulator thermal resistance parameter of a first parameter in node parameters; further, performing thermal resistance analysis and calculation on the outer sheath according to an outer sheath thermal resistance calculation formula to obtain an outer sheath thermal resistance parameter of a first parameter in the node parameters; further, performing thermal resistance analysis and calculation on each phase of filling layer of the multi-core cable thermal circuit model according to a filling layer thermal resistance calculation formula to obtain each corresponding filling layer thermal resistance parameter of the second parameter in the node parameters; further, the conductor of the core cable thermal circuit model is subjected to heat productivity analysis and calculation according to a conductor heat calculation formula, and the conductor heat parameter of the second parameter in the node parameters is obtained.

And 103, performing thermal evaluation treatment on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected.

It should be noted that the thermal evaluation result refers to the conductor temperature of each phase conductor in the cable to be detected, and the thermal evaluation result can be used for guiding optimization of future cable route planning and improvement of the cable utilization rate.

In an embodiment of the present application, if the cable to be detected is a three-core cable, the three-core cable includes three-phase conductors, and the three-phase conductors are an a-phase conductor, a B-phase conductor, and a C-phase conductor, respectively, so when a thermal evaluation result of the cable to be detected needs to be obtained, the following may be specifically included: the cable to be detected can be subjected to heat evaluation treatment according to the node parameters, the node parameters are substituted into a conductor temperature calculation formula to obtain the conductor temperature of each phase of conductor in the cable to be detected, namely the heat evaluation result of the cable to be detected, wherein the conductor temperature calculation formula is shown as formula (1):

（1）

wherein,indicating the conductor temperature of the a-phase conductor of the cable to be tested,/->Indicating the conductor temperature of the B-phase conductor of the cable to be tested,/->Representing the conductor temperature, W, of the C-phase conductor of the cable to be tested _1A Representing conductor heat parameters, W, corresponding to A-phase conductors of cables to be detected in unit length _1B Representing the conductor heat parameter, W, corresponding to the B-phase conductor of the cable to be detected in unit length _1C Representing conductor heat parameters corresponding to C-phase conductors of cables to be detected in unit length, T ₁ Representing the insulator thermal resistance parameter, T, in the first parameter _2A A filling layer thermal resistance parameter representing an A-phase filling layer of the cable to be detected, T _2B A filling layer thermal resistance parameter representing a B-phase filling layer of the cable to be detected, T _2C A filling layer thermal resistance parameter representing a C-phase filling layer of the cable to be detected, T ₃ Representing the outer sheath in the first parameterThermal resistance parameter->Indicating the temperature of the outer jacket of the cable to be tested.

According to the cable heat evaluation method, the multi-core cable heat path model corresponding to the cable to be detected is obtained through line analysis of the cable to be detected, the node parameters of the model nodes in the multi-core cable heat path model are determined, and further, heat evaluation processing is carried out on the cable to be detected according to the node parameters, so that a heat evaluation result of the cable to be detected is obtained. According to the above, before performing heat evaluation treatment on the cable to be detected, the method performs line analysis on the cable to be detected to obtain a multi-core cable heat path model, so that the internal structure of the cable to be detected is obtained according to the multi-core cable heat path model, and further, the heat evaluation treatment on the cable to be detected is realized according to node parameters of each model node in the multi-core cable heat path model; because the multi-core cable thermal circuit model can accurately reflect the internal structure of the cable to be detected, and the node parameters can reflect the actual heating value and the thermal resistance condition of the cable to be detected of each model node in the multi-core cable thermal circuit model, when the cable to be detected is subjected to thermal evaluation processing, the influence of the internal structure of the cable to be detected on the thermal evaluation result is considered, the influence of each model node in the multi-core cable thermal circuit model on the thermal evaluation result of the cable to be detected is fully considered, the thermal evaluation result of the cable to be detected can accurately reflect the actual heating condition of the cable to be detected, and the evaluation accuracy of the thermal evaluation result is improved.

In order to ensure the service life and the operation reliability of a cable line, the problem of low accuracy exists when the prior art carries out heat evaluation on the multi-core cable, and the actual heating condition of the multi-core cable cannot be accurately reflected. In order to solve the above technical problem, the computer device of the present application may determine node parameters of each model node in the multi-core cable thermal path model in a manner as shown in fig. 2, including the following steps 201 and 202. Wherein:

and step 201, performing first parameter analysis on the insulator and the outer protective layer of the multi-core cable thermal circuit model to obtain a first parameter in the node parameters.

The first parameters comprise insulator thermal resistance parameters and outer protection layer thermal resistance parameters in the multi-core cable thermal circuit model.

It should be noted that, since the multi-core cable thermal circuit model includes the insulator and the outer sheath, and the insulator and the outer sheath have different thermal resistances, the insulator thermal resistance parameter corresponding to the insulator and the outer sheath thermal resistance parameter corresponding to the outer sheath have different effects in the thermal evaluation process of the cable to be detected, so in order to accurately analyze the effects generated in the thermal evaluation process of the insulator and the outer sheath of the multi-core cable thermal circuit model, thermal resistance analysis needs to be performed on the insulator and the outer sheath of the multi-core cable thermal circuit model, respectively, to obtain the insulator thermal resistance parameter and the outer sheath thermal resistance parameter in the first parameter.

Further, when the first parameter of the node parameters needs to be obtained, the following may be specifically included: performing thermal resistance analysis on an insulator of the multi-core cable thermal path model to obtain an insulator thermal resistance parameter in the first parameters; and carrying out thermal resistance analysis on the outer sheath of the multi-core cable thermal path model to obtain the thermal resistance parameter of the outer sheath in the first parameter.

In an embodiment of the present application, when the insulator thermal resistance parameter and the outer sheath thermal resistance parameter in the first parameter need to be obtained, thermal resistance analysis and calculation may be performed on the insulator and the outer sheath of the multi-core cable thermal path model according to a thermal resistance calculation formula, so as to obtain the insulator thermal resistance parameter and the outer sheath thermal resistance parameter in the first parameter, where the thermal resistance calculation formula is shown in formula (2):

（2）

wherein T is _i Represents the insulator thermal resistance parameter or the outer sheath thermal resistance parameter in the first parameter,insulation thermal coefficient representing multi-core cable thermal circuit model or exterior of multi-core cable thermal circuit modelThermal coefficient of sheath, d _i An insulator inner diameter of the multi-core cable heat circuit model or an outer sheath inner diameter of the multi-core cable heat circuit model is represented, t _i The thickness of the insulator of the multi-core cable heat circuit model or the thickness of the outer sheath of the multi-core cable heat circuit model is shown.

For example, when the insulator thermal resistance parameter in the first parameter needs to be obtained, the insulator thermal resistance analysis calculation can be performed on the insulator according to an insulator thermal resistance calculation formula to obtain the insulator thermal resistance parameter in the first parameter, wherein the insulator thermal resistance calculation formula is shown in formula (3):

（3）

wherein T is ₁ Representing the insulator thermal resistance parameter in the first parameter,insulator thermal resistance coefficient d representing multi-core cable thermal circuit model ₁ Insulator inner diameter, t, representing multi-core cable thermal circuit model ₁ The insulator thickness of the multi-core cable thermal circuit model is shown.

Further, when the thermal resistance parameter of the outer sheath in the first parameter needs to be obtained, thermal resistance analysis calculation can be performed on the outer sheath according to a thermal resistance calculation formula of the outer sheath to obtain the thermal resistance parameter of the outer sheath in the first parameter, wherein the thermal resistance calculation formula of the outer sheath is shown as formula (4):

（4）

wherein T is ₃ Representing the thermal resistance parameter of the outer sheath in the first parameter,external sheath thermal resistivity coefficient d representing multi-core cable thermal path model ₃ The inner diameter t of the outer sheath of the multi-core cable thermal path model ₃ The thickness of the outer sheath of the multi-core cable thermal circuit model is shown.

And 202, performing second parameter analysis on the conductor and the filling layer of the multi-core cable thermal circuit model to obtain second parameters in the node parameters.

The second parameter comprises a thermal resistance parameter of the filling layer and a conductor heat parameter in a multi-core cable thermal circuit model.

It should be noted that, since the multi-core cable thermal circuit model includes the conductor and the filling layer, and the conductor thermal parameter corresponding to the conductor and the filling layer thermal resistance parameter corresponding to the filling layer have different effects in the thermal evaluation process of the cable to be detected, in order to accurately analyze the effects generated in the thermal evaluation process of the conductor and the filling layer of the multi-core cable thermal circuit model, it is necessary to respectively perform second parameter analysis on the conductor and the filling layer of the multi-core cable thermal circuit model, so as to obtain the filling layer thermal resistance parameter and the conductor thermal parameter in the second parameter.

In an embodiment of the present application, if the multi-core cable thermal path model is a three-core cable thermal path model, the cable to be detected includes a three-phase filling layer and a three-phase conductor, wherein the three phases are a phase, a B phase and a C phase, respectively, so when the second parameter of the node parameters needs to be obtained, the following may be specifically included: according to a shape factor calculation formula, analyzing and calculating each phase of filling layer contained in the cable to be detected to obtain a filling layer shape factor corresponding to each phase of filling layer of the cable to be detected; further, thermal resistance analysis is carried out on each phase of filling layer of the multi-core cable thermal circuit model according to the filling layer shape factors corresponding to each phase of filling layer, so that filling layer thermal resistance parameters corresponding to each phase of filling layer in the second parameters are obtained; further, the heat generation amount analysis is performed on each phase conductor contained in the multi-core cable heat circuit model, and the conductor heat parameters of each phase conductor in the second parameters are obtained.

According to the cable heat evaluation method, the insulator, the outer protective layer, the conductor and the filling layer of the multi-core cable heat circuit model are subjected to heat evaluation to obtain the first parameter and the second parameter in the node parameters, the influence degree of different structures in the multi-core cable heat circuit model on the cable to be detected in the heat evaluation process is measured through the first parameter and the second parameter, and the evaluation accuracy of the heat evaluation result of the cable to be detected is guaranteed.

In an exemplary embodiment, when the second parameter of the node parameters needs to be obtained, the following steps 301 to 303 may be included in the manner shown in fig. 3. Wherein:

step 301, determining a filling layer shape factor corresponding to the cable to be detected.

In an embodiment of the present application, if the cable to be detected is a three-core cable, the three-core cable includes three-phase conductors, the three-phase conductors are a-phase conductors, B-phase conductors, and C-phase conductors, and the cable to be detected includes three-phase filling layers and three-phase conductors, so that each phase of filling layer included in the cable to be detected can be analyzed and calculated according to a shape factor calculation formula, to obtain a filling layer shape factor corresponding to each phase of filling layer of the cable to be detected, where the shape factor calculation formula is shown in formula (5):

（5）

Wherein S is _i The filling layer shape factor corresponding to the i-phase filling layer of the cable to be detected is represented, wherein the i-phase filling layer can be a filling layer corresponding to an A-phase conductor, a filling layer corresponding to a B-phase conductor and a filling layer corresponding to a C-phase conductor, S _in Representing the area from the i-phase conductor to the region formed by the copper shielding tape, S _iw The area of the region formed by the copper shielding tape, the armor layer and the heat insulation surface corresponding to i is shown, wherein an example of the area is shown in fig. 4.

The area S under different load unbalance degrees can be obtained by the image recognition method _in And S is _iw Further, S is _in And S is _iw Substituting the filling layer shape factors into a shape factor calculation formula to obtain the filling layer shape factors corresponding to the filling layers of each phase under different load unbalance degrees.

And step 302, performing thermal resistance analysis on the filling layer of the multi-core cable thermal circuit model according to the filling layer shape factor to obtain the filling layer thermal resistance parameter in the second parameter.

In an embodiment of the present application, if the multi-core cable thermal path model is a three-core cable thermal path model, the cable to be detected includes a three-phase filling layer and a three-phase conductor, where the three-phase conductor is an a-phase conductor, a B-phase conductor, and a C-phase conductor, respectively, a thermal resistance analysis may be performed on the filling layer of the multi-core cable thermal path model according to a filling layer shape factor to obtain a filling layer thermal resistance parameter in a second parameter, and specifically, the filling layer shape factor is substituted into a filling layer thermal resistance calculation formula to implement thermal resistance analysis and calculation on the filling layer of the multi-core cable thermal path model, and further, obtain a filling layer thermal resistance parameter in the second parameter, where the filling layer thermal resistance calculation formula is shown in formula (6):

（6）

Wherein T is _2i The thermal resistance parameter of the i-phase filling layer of the cable to be detected is represented, wherein the i-phase filling layer can be a filling layer corresponding to an A-phase conductor, a filling layer corresponding to a B-phase conductor and a filling layer corresponding to a C-phase conductor, lambda represents the thermal conductivity coefficient of a filling layer material, S _i Representing the filling layer shape factor corresponding to the i-phase filling layer of the cable to be detected, S _in Representing the area from the i-phase conductor to the region formed by the copper shielding tape, S _iw And i represents the area of the region formed by the copper shielding tape, the armor layer and the heat insulation surface corresponding to i.

And step 303, analyzing the heat productivity of the conductor of the multi-core cable heat circuit model to obtain the conductor heat parameter in the second parameter.

In an embodiment of the present application, if the multi-core cable thermal path model is a three-core cable thermal path model, the cable to be detected includes a three-phase filling layer and three-phase conductors, wherein the three phases are a phase a, a phase B and a phase C, and the conductor of the core cable thermal path model can be analyzed and calculated according to a conductor heat calculation formula to obtain a conductor heat parameter in the second parameter, where the conductor heat calculation formula is shown in formula (7):

（7）

wherein W is _1i The value of I phase conductor (I) of the cable to be detected can be the conductor heat parameter corresponding to A, B and C, I _i Representing the i-phase conductor current of the cable to be tested, R ₂₀ Representing the corresponding direct current resistance of the conductor in the unit length of the cable to be detected at 20 ℃,indicating the temperature coefficient of the copper shielding tape, +.>Representing the conductor temperature of the i-phase conductor of the cable to be tested, Y _S Representing skin effect factor, Y _P Indicating a proximity effect factor.

According to the cable heat evaluation method, the filling layer thermal resistance of the multi-core cable thermal circuit model is analyzed through the filling layer shape factor, so that the filling layer thermal resistance parameter in the second parameter is obtained, the heat transfer capacity of the filling layer of the cable to be detected under different load unbalance degrees can be accurately reflected by the filling layer thermal resistance parameter, an accurate heat evaluation result can be obtained when the cable to be detected is subjected to heat evaluation by utilizing the filling layer thermal resistance parameter, and the fact that the real current carrying capacity of the cable to be detected is accurately reflected by the heat evaluation result is further guaranteed.

In an exemplary embodiment, when a multi-core cable thermal path model corresponding to the cable to be detected needs to be obtained, the following steps 501 and 502 may be included in a manner as shown in fig. 5. Wherein:

step 501, performing line analysis on the cable to be detected to obtain structural parameters and cable operation parameters of the cable to be detected.

The structure parameter is used for representing information such as an inner diameter, an outer diameter, material properties and the like of the cable to be detected, the cable operation parameter is used for representing input current of each phase of conductor of the conductor in the cable to be detected and thermodynamic boundary conditions, and the thermodynamic boundary conditions further comprise: the temperature value on the boundary of the cable to be detected, the heat flux density on the boundary of the cable to be detected, the surface heat transfer coefficient between the boundary of the cable to be detected and the surrounding fluid and the temperature of the surrounding fluid.

It should be noted that there are many methods for determining the structural parameters and the cable operation parameters of the cable to be detected, for example, the structural parameters and the cable operation parameters of the cable to be detected may be obtained by analyzing the cable to be detected according to an experienced expert; or detecting and analyzing the cable to be detected according to the detector to obtain the structural parameters and the cable operation parameters of the cable to be detected. It will be appreciated that there are many methods for determining the structural parameters and the cable operating parameters of the cable to be detected, and the method for determining the structural parameters and the cable operating parameters of the cable to be detected is not limited.

Step 502, constructing a multi-core cable thermal path model corresponding to the cable to be detected according to the structural parameters and the cable operation parameters.

In an embodiment of the present application, when a multi-core cable thermal path model corresponding to a cable to be detected needs to be constructed, the following may be specifically included: according to the structural parameters and the cable operation parameters of the cable to be detected, carrying out internal temperature analysis on the cable to be detected to obtain cable temperature information of the cable to be detected; and constructing a multi-core cable thermal circuit model corresponding to the cable to be detected according to the cable temperature information.

Further, the internal temperature analysis can be performed on the cable to be detected through the magneto-thermal coupling numerical calculation model to obtain the cable temperature information of the cable to be detected, which specifically comprises the following contents: constructing a geometric model of the cable to be detected according to structural parameters of the cable to be detected, wherein the structural parameters are used for representing information such as the inner diameter, the outer diameter and the material property of the cable to be detected; further, thermodynamic boundary conditions of the cable to be detected and input currents of all phases of conductors of the cable to be detected are set, structural parameters in a geometric model of the cable to be detected, thermodynamic boundary conditions of the cable to be detected and input currents of all phases of conductors of the cable to be detected are used as input parameters of a magneto-thermal coupling numerical calculation model, the input parameters are input into the magneto-thermal coupling numerical calculation model, and an output result of the magneto-thermal coupling numerical calculation model is obtained, wherein the output result is cable temperature information of the cable to be detected.

For example, as shown in fig. 6, if the multi-core cable thermal path model is a three-core cable thermal path model, the cable to be tested includes a three-phase conductor, a copper shielding tape, an armor layer, a filling layer, an insulator, and an outer protection layer, wherein the three-phase conductor is an a-phase conductor, a B-phase conductor, and a C-phase conductor. Further illustratively, in fig. 6,、/>and->The conductor temperatures of the A-phase conductor, the B-phase conductor and the C-phase conductor of the cable to be tested are respectively +.>、/>And->Copper shielding tape temperatures of A phase conductor, B phase conductor and C phase conductor of cable to be detected respectively, < ->And->The temperature of the armor layer and the temperature of the outer protective layer of the cable to be detected are respectively W _1A 、W _1B 、W _1C The heat parameters of the conductors corresponding to the A phase conductor, the B phase conductor and the C phase conductor of the cable to be detected in unit length are respectively T ₁ Representing the insulator thermal resistance parameter, T, in the first parameter ₃ Representing the thermal resistance parameter of the outer protective layer in the first parameter, T _2A A filling layer thermal resistance parameter representing an A-phase filling layer of the cable to be detected, T _2B Representing the B-phase filling layer of the cable to be testedThermal resistance parameter of filling layer, T _2C And the filling layer thermal resistance parameter of the C-phase filling layer of the cable to be detected is represented.

According to the cable heat evaluation method, the multi-core cable heat path model corresponding to the cable to be detected is constructed through the structural parameters and the cable operation parameters of the cable to be detected, so that the actual heating condition of the cable to be detected can be reflected when the cable to be detected is subjected to heat evaluation treatment according to the node parameters of the multi-core cable heat path model, and a calculation basis is provided for obtaining the heat evaluation result of the cable to be detected.

In an exemplary embodiment, when a thermal evaluation result of the cable to be detected needs to be obtained, the following flow may be specifically included, as shown in fig. 7:

and 701, carrying out line analysis on the cable to be detected to obtain the structural parameters and the cable operation parameters of the cable to be detected.

And step 702, carrying out internal temperature analysis on the cable to be detected according to the structural parameters and the cable operation parameters to obtain cable temperature information of the cable to be detected.

And 703, constructing a multi-core cable thermal circuit model corresponding to the cable to be detected according to the cable temperature information.

And step 704, performing thermal resistance analysis on the insulator of the multi-core cable thermal circuit model to obtain an insulator thermal resistance parameter in the first parameters.

And step 705, performing thermal resistance analysis on the outer sheath of the multi-core cable thermal circuit model to obtain the thermal resistance parameter of the outer sheath in the first parameters.

Step 706, determining a filling layer shape factor corresponding to the cable to be detected.

And step 707, performing thermal resistance analysis on the filling layer of the multi-core cable thermal circuit model according to the filling layer shape factor to obtain a filling layer thermal resistance parameter in the second parameters.

And 708, analyzing the heat productivity of the conductor of the multi-core cable heat circuit model to obtain the conductor heat parameters in the second parameters.

Step 709, performing thermal evaluation processing on the cable to be detected according to the node parameters, and obtaining a thermal evaluation result of the cable to be detected.

It should be understood that, although the steps in the flowcharts related to the above embodiments are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.

Based on the same inventive concept, the embodiment of the application also provides a cable heat evaluation device for realizing the cable heat evaluation method. The implementation of the solution provided by the device is similar to the implementation described in the above method, so the specific limitation in the embodiments of the cable heat assessment device or devices provided below may be referred to the limitation of the cable heat assessment method hereinabove, and will not be repeated here.

In one embodiment, as shown in fig. 8, there is provided a cable heat evaluation device including: a model determination module 10, a parameter determination module 20, and a thermal assessment module 30, wherein:

the model determining module 10 is configured to perform line analysis on the cable to be detected, and obtain a multi-core cable thermal path model corresponding to the cable to be detected.

And the parameter determining module 20 is used for determining node parameters of each model node in the multi-core cable hot-path model.

And the thermal evaluation module 30 is used for performing thermal evaluation processing on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected.

According to the cable heat evaluation device, the multi-core cable heat path model corresponding to the cable to be detected is obtained by carrying out line analysis on the cable to be detected, the node parameters of the model nodes in the multi-core cable heat path model are determined, and further, heat evaluation processing is carried out on the cable to be detected according to the node parameters, so that a heat evaluation result of the cable to be detected is obtained. According to the above, before performing heat evaluation treatment on the cable to be detected, the method performs line analysis on the cable to be detected to obtain a multi-core cable heat path model, so that the internal structure of the cable to be detected is obtained according to the multi-core cable heat path model, and further, the heat evaluation treatment on the cable to be detected is realized according to node parameters of each model node in the multi-core cable heat path model; because the multi-core cable thermal circuit model can accurately reflect the internal structure of the cable to be detected, and the node parameters can reflect the actual heating value and the thermal resistance condition of the cable to be detected of each model node in the multi-core cable thermal circuit model, when the cable to be detected is subjected to thermal evaluation processing, the influence of the internal structure of the cable to be detected on the thermal evaluation result is considered, the influence of each model node in the multi-core cable thermal circuit model on the thermal evaluation result of the cable to be detected is fully considered, the thermal evaluation result of the cable to be detected can accurately reflect the actual heating condition of the cable to be detected, and the evaluation accuracy of the thermal evaluation result is improved.

In one embodiment, as shown in fig. 9, there is provided a cable heat evaluation device in which a parameter determination module 20 includes: a first determination unit 21 and a second determination unit 22, wherein:

the first determining unit 21 is configured to perform a first parameter analysis on the insulator and the outer jacket of the multi-core cable thermal circuit model, so as to obtain a first parameter of the node parameters.

And the second determining unit 22 is configured to perform a second parameter analysis on the conductor and the filling layer of the multi-core cable thermal path model, so as to obtain a second parameter in the node parameters.

In one embodiment, as shown in fig. 10, there is provided a cable heat evaluating apparatus in which a first determining unit 21 includes: a first determination subunit 211 and a second determination subunit 212, wherein:

the first determining subunit 211 is configured to perform thermal resistance analysis on an insulator of the thermal path model of the multi-core cable, so as to obtain an insulator thermal resistance parameter in the first parameter.

The second determining subunit 212 is configured to perform thermal resistance analysis on the outer sheath of the thermal path model of the multi-core cable, so as to obtain a thermal resistance parameter of the outer sheath in the first parameter.

In one embodiment, as shown in fig. 11, there is provided a cable heat evaluating apparatus in which the second determining unit 22 includes: a third determination subunit 221, a fourth determination subunit 222, and a fifth determination subunit 223, wherein:

A third determining subunit 221, configured to determine a filling layer shape factor corresponding to the cable to be detected.

And a fourth determining subunit 222, configured to perform thermal resistance analysis on the filling layer of the thermal path model of the multi-core cable according to the filling layer shape factor, to obtain a filling layer thermal resistance parameter in the second parameter.

And a fifth determining subunit 223, configured to perform a heating value analysis on the conductor of the multi-core cable thermal path model, so as to obtain a conductor heat parameter in the second parameter.

In one embodiment, as shown in fig. 12, there is provided a cable heat assessment apparatus in which a model determination module 10 includes: a third determination unit 11 and a fourth determination unit 12, wherein:

and the third determining unit 11 is configured to perform line analysis on the cable to be detected, so as to obtain a structural parameter and a cable operation parameter of the cable to be detected.

And the fourth determining unit 12 is configured to construct a multi-core cable thermal path model corresponding to the cable to be detected according to the structural parameter and the cable operation parameter.

In one embodiment, as shown in fig. 13, there is provided a cable heat evaluating apparatus in which the fourth determining unit 12 includes: a sixth determination subunit 121 and a seventh determination subunit 122, wherein:

The sixth determining subunit 121 is configured to perform internal temperature analysis on the cable to be detected according to the structural parameter and the cable operation parameter, so as to obtain cable temperature information of the cable to be detected.

The seventh determining subunit 122 is configured to construct a multi-core cable thermal path model corresponding to the cable to be detected according to the cable temperature information.

The respective modules in the above-described cable heat evaluation device may be implemented in whole or in part by software, hardware, and a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.

In one embodiment, a computer device is provided, which may be a terminal, and the internal structure thereof may be as shown in fig. 14. The computer device includes a processor, a memory, an input/output interface, a communication interface, a display unit, and an input means. The processor, the memory and the input/output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input/output interface. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input/output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a cable thermal assessment method. The display unit of the computer device is used for forming a visual picture, and can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be a key, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by those skilled in the art that the structure shown in fig. 14 is merely a block diagram of a portion of the structure associated with the present application and is not limiting of the computer device to which the present application applies, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.

In one embodiment, a computer device is provided comprising a memory and a processor, the memory having stored therein a computer program, the processor when executing the computer program performing the steps of:

In one embodiment, the processor when executing the computer program further performs the steps of:

In one embodiment, a computer readable storage medium is provided having a computer program stored thereon, which when executed by a processor, performs the steps of:

In one embodiment, the computer program when executed by the processor further performs the steps of:

In one embodiment, a computer program product is provided comprising a computer program which, when executed by a processor, performs the steps of:

It should be noted that, the user information (including, but not limited to, user equipment information, user personal information, etc.) and the data (including, but not limited to, data for analysis, stored data, presented data, etc.) referred to in the present application are information and data authorized by the user or sufficiently authorized by each party, and the collection, use and processing of the related data are required to comply with the related laws and regulations and standards of the related countries and regions.

Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, data blocks, or other media used in the various embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The data blocks referred to in various embodiments provided herein may comprise at least one of relational data blocks and non-relational data blocks. The non-relational data blocks may include, but are not limited to, blockchain-based distributed data blocks, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic units, quantum computing-based data processing logic units, etc., without being limited thereto.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples represent only a few embodiments of the present application, which are described in more detail and are not thereby to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.

Claims

1. A method of cable thermal assessment, the method comprising:

carrying out line analysis on a cable to be detected to obtain a multi-core cable thermal path model corresponding to the cable to be detected;

and carrying out heat evaluation treatment on the cable to be detected according to the node parameters to obtain a heat evaluation result of the cable to be detected.

2. The method of claim 1, wherein determining node parameters for each model node in the multi-core cable thermal circuit model comprises:

performing first parameter analysis on the insulator and the outer protective layer of the multi-core cable thermal circuit model to obtain a first parameter in the node parameters;

and carrying out second parameter analysis on the conductor and the filling layer of the multi-core cable thermal circuit model to obtain a second parameter in the node parameters.

3. The method of claim 2, wherein the performing a first parameter analysis on the insulator and the outer jacket of the multi-core cable thermal circuit model to obtain a first parameter of the node parameters comprises:

performing thermal resistance analysis on the insulator of the multi-core cable thermal circuit model to obtain an insulator thermal resistance parameter in the first parameters;

and carrying out thermal resistance analysis on the outer sheath of the multi-core cable thermal circuit model to obtain the thermal resistance parameter of the outer sheath in the first parameter.

4. The method according to claim 2, wherein the performing a second parameter analysis on the conductor and the filler layer of the multi-core cable thermal circuit model to obtain a second parameter of the node parameters comprises:

5. The method of claim 1, wherein the performing the line analysis on the cable to be detected to obtain the multi-core cable thermal path model corresponding to the cable to be detected includes:

6. The method according to claim 5, wherein the constructing the multi-core cable thermal path model corresponding to the cable to be detected according to the structural parameter and the cable operation parameter includes:

7. A cable heat assessment device, the device comprising:

the model determining module is used for carrying out line analysis on the cable to be detected to obtain a multi-core cable hot-line model corresponding to the cable to be detected;

and the thermal evaluation module is used for carrying out thermal evaluation processing on the cable to be detected according to the node parameters to obtain a thermal evaluation result of the cable to be detected.

8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any of claims 1 to 6 when the computer program is executed.

9. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.

10. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.