CN117867623A - Efficient metal copper electroplating device and electroplating method - Google Patents

Abstract

The invention discloses a high-efficiency metallic copper electroplating device and an electroplating method, wherein the device comprises an electrolytic tank, and an electroplating cavity is arranged in the electrolytic tank; the upper end of the supporting base is provided with a supporting groove, and the metal copper to be electroplated is placed in the supporting groove; through first confession liquid drive assembly and second confession liquid drive assembly, can make support base and the metal copper that waits to electroplate take the flexible bracing piece of bottom to make the lift action about rotation center. The invention can make the metal copper to be electroplated perform circumferential rotation and lifting action, effectively improve the electroplating efficiency, and by utilizing the circumferential lifting action, various components in the electroplating solution are uniform, the stirring action is omitted, the structure is simplified, the metal copper to be electroplated performs reciprocating swinging motion, the bottom and the bottom surface of the supporting groove are obliquely supported and form a line contact point, and further the bottom of the metal copper to be electroplated is alternately contacted with the electroplating solution, thereby realizing no shielding and reducing the later procedures.

Description

Efficient metal copper electroplating device and electroplating method

Technical Field

The invention relates to the field of electroplating, in particular to a high-efficiency metal copper electroplating device and an electroplating method.

Background

The metal copper electroplating is a process for depositing a copper layer on the surface of a metal or other conductor through an electrochemical process, and is mainly used for improving the corrosion resistance, the electrical conductivity, the appearance and the hardness of a product. This technology has wide application in the electronics, aviation, automotive and decorative industries.

Although metallic copper plating has important application value, the current plating efficiency is generally not high. This is mainly due to the following problems:

in conventional electroplating processes, the metallic copper to be electroplated is typically left to stand in an electroplating bath. This static state limits the effective contact of the plating solution with the metal surface, resulting in slow and uneven plating rates.

Electroplating baths typically contain a variety of components such as copper ions, acids, additives, and the like. The uniform distribution of these components is critical to the quality of the plating. However, in the static plating process, these components are easily layered or precipitated in the bath due to lack of effective stirring, affecting the plating effect.

In order to improve the electroplating efficiency, some technologies currently attempt to continuously move metallic copper to be electroplated in an electroplating tank by providing a movement mechanism. Although this method can improve plating uniformity to some extent, it brings about a problem of complicating the device structure. In addition, in order to maintain the uniform distribution of the components of the plating solution, a stirring mechanism is also required, so that the complexity of the equipment is further increased, and the difficulty of maintenance and operation is increased.

In the prior art, contact surfaces inevitably exist between the metallic copper to be electroplated and the inside of the electroplating tank, and the contact areas cannot be fully covered by the electroplating liquid, so that electroplating is uneven, subsequent supplementary electroplating treatment is needed, the production cost is increased, the electroplating period is prolonged, and the overall efficiency is reduced.

Disclosure of Invention

In order to solve the problems, the invention provides a high-efficiency metal copper electroplating device and an electroplating method, which aim to solve the problems of low efficiency and uneven electroplating quality in the traditional metal copper electroplating.

The invention is realized by the following technical scheme: an efficient metallic copper electroplating apparatus comprising:

the electroplating device comprises an electrolytic tank, wherein an electroplating cavity is arranged in the electrolytic tank, electroplating liquid is arranged in the electroplating cavity, metal copper to be electroplated is placed in the electroplating cavity for electroplating, and a controller is arranged outside the electrolytic tank;

the bottom of the support base is rotatably provided with a telescopic support rod, the upper end of the support base is provided with a support groove, and metal copper to be electroplated is placed in the support groove;

the first liquid supply driving assembly and the second liquid supply driving assembly are respectively arranged at two sides of the supporting base and are used for driving the supporting base and the metal copper to be electroplated to do reciprocating circular motion and enabling the supporting base and the metal copper to be electroplated to do up-and-down lifting motion by taking the telescopic supporting rod at the bottom as a rotation center;

a group of liquid spraying holes are respectively formed in the two sides of the support base and close to the opening position of the top of the support groove, the two groups of liquid spraying holes are oppositely arranged, and when the first liquid supply driving assembly and the second liquid supply driving assembly act, one group of liquid spraying holes are in a liquid spraying state, and the other group of liquid spraying holes are in a static liquid spraying state;

when one group of spray holes are in a spray state, the metal copper to be electroplated leans against one side of the support base in a static spray state, and at the moment, the bottom of the metal copper to be electroplated and the bottom of the support base are obliquely supported to form a line contact point.

As an optimized technical scheme, the first liquid supply driving assembly comprises a first driving air cylinder, the output end of an air cylinder rod of the first driving air cylinder is connected with a first driving sliding block through a linkage plate, driving guide rails are fixedly arranged at two sides in the electrolytic tank respectively, the first driving sliding block is slidably arranged on the driving guide rails, the driving guide rails are arranged on one side close to the top of the electrolytic tank, and the height of the driving guide rails is higher than that of the supporting base;

the first liquid supply driving assembly further comprises a first liquid inlet and outlet pipe and a first driving liquid supply rod, one end of the first driving liquid supply rod is provided with a driving piston, the driving piston is movably and hermetically arranged in a liquid supply channel in the first driving liquid supply rod, the other end of the first driving liquid supply rod is fixedly connected with a supporting and fixing block, the bottom of the supporting and fixing block is fixed on a driving guide rail, the first liquid inlet and outlet pipe is communicated with a liquid inlet and outlet cavity in the first driving sliding block, the output end of the first driving sliding block is connected with a first liquid supply hose, and the output end of the first liquid supply hose is communicated with a first liquid spraying hole in the supporting base.

As an optimized technical scheme, a one-way liquid outlet valve is arranged on the first liquid supply hose, a liquid suction pipe is arranged on one side, close to the first driving sliding block, of the first liquid inlet and outlet pipe, and a one-way liquid inlet valve is arranged on the liquid suction pipe;

the first liquid supply hose is used for connecting the first driving sliding block and the supporting base, and the electroplating liquid in the liquid inlet and outlet cavity is input into the supporting base through the first liquid supply hose and sprayed out from the first liquid spraying hole, so that the metal copper to be electroplated leans against one side of the second liquid spraying hole group.

As an optimized technical scheme, the second liquid supply driving assembly comprises a second driving cylinder, wherein the output end of a cylinder rod of the second driving cylinder is connected with a second driving sliding block through a linkage plate, and the second driving sliding block is slidably arranged on a driving guide rail;

the second liquid supply driving assembly further comprises a second liquid inlet and outlet pipe and a second driving liquid supply rod, one end of the second driving liquid supply rod is provided with a driving piston, the driving piston is movably and hermetically arranged in a liquid supply channel in the second driving liquid supply rod, the other end of the second driving liquid supply rod is fixedly connected with a supporting and fixing block, the bottom of the supporting and fixing block is fixed on a driving guide rail, the second liquid inlet and outlet pipe is communicated with a liquid inlet and outlet cavity in a second driving sliding block, the output end of the second driving sliding block is connected with a second liquid supply hose, and the output end of the second liquid supply hose is communicated with a second liquid spraying hole in a supporting base.

As an optimized technical scheme, a one-way liquid outlet valve is arranged on the second liquid supply hose, a liquid suction pipe is arranged on one side, close to the second driving sliding block, of the second liquid inlet and outlet pipe, and a one-way liquid inlet valve is arranged on the liquid suction pipe;

the second liquid supply hose is used for connecting the second driving sliding block and the supporting base, and the electroplating liquid in the liquid inlet and outlet cavity is input into the supporting base through the second liquid supply hose and sprayed out from the second liquid spraying hole, so that the metal copper to be electroplated leans against one side of the first liquid spraying hole group.

As the preferable technical scheme, the bottom of the telescopic supporting rod is provided with a rotating bearing, and the rotating bearing is embedded and installed in the bottom surface of the electroplating cavity.

As a preferable technical scheme, a cover plate is arranged on the top surface of the electrolytic tank, a feeding cavity and a discharging cavity are arranged in the middle of the cover plate, and the metal copper to be electroplated is fed or discharged through the feeding cavity and the discharging cavity.

As the preferable technical scheme, the cover plate is provided with a guide chute corresponding to the first liquid supply driving assembly and the second liquid supply driving assembly, and a linkage plate in the first liquid supply driving assembly and the second liquid supply driving assembly penetrates through the guide chute and extends out to the upper end face of the cover plate, and a driving cylinder in the first liquid supply driving assembly and the second liquid supply driving assembly is arranged on the top face of the cover plate.

As a preferable technical scheme, when the first liquid supply driving assembly is in an ejection state, the second liquid supply driving assembly is in a retraction state, and the first liquid supply driving assembly and the second liquid supply driving assembly are in an alternate working state.

The invention discloses a metal copper electroplating method, which comprises a metal copper electroplating device and specifically comprises the following steps of:

s1, designing an electroplating bath, placing electroplating solutions with different component addition compositions in the electroplating bath, and presetting a feeding and discharging cavity at the top of the electroplating bath;

s2, arranging a group of first liquid supply driving components and second liquid supply driving components in the electroplating bath, wherein the first liquid supply driving components and the second liquid supply driving components are symmetrically arranged;

s3, arranging a supporting base in the electroplating cavity, wherein a telescopic supporting rod is arranged at the bottom of the supporting base, and the supporting base can lift up and down and rotate circumferentially along the supporting telescopic rod;

s4, a supporting groove is formed in the supporting base, a first liquid spraying hole is formed in one side of the supporting groove, a second liquid spraying hole is formed in the other side of the supporting groove, one side of the supporting groove is connected with the first liquid supply driving assembly through a first liquid supply hose, and the other side of the supporting groove is connected with the second liquid supply driving assembly through a second liquid supply hose;

s5, when the first liquid supply driving assembly performs ejection and the second liquid supply driving assembly performs retraction, the second liquid spraying Kong Penye and the first liquid spraying hole keep a static state, the sprayed electroplating liquid enables the metal copper to be electroplated to lean against one side of the first liquid spraying hole, and at the moment, the bottom of the metal copper to be electroplated and the bottom of the supporting groove are obliquely supported and form a line contact point;

s6, when the second liquid supply driving assembly performs ejection, the first liquid supply driving assembly performs retraction, the first liquid spraying hole sprays liquid, the second liquid spraying hole keeps a static state, the sprayed electroplating liquid enables the metal copper to be electroplated to lean against one side of the second liquid spraying hole, at the moment, the bottom of the metal copper to be electroplated and the bottom of the supporting groove are obliquely supported and form a line contact point, and through reciprocating swing of the metal copper to be electroplated, the bottom of the metal copper to be electroplated is in alternating contact with the electroplating liquid, so that non-shielding contact is realized;

s7, when the first liquid supply driving assembly and the second liquid supply driving assembly continuously and alternately perform ejection and retraction actions, the whole supporting base and the metal copper to be electroplated are in a circumferential reciprocating rotation state and are continuously in a lifting motion state, so that various components in the electroplating liquid are uniform, the metal copper to be electroplated is fully contacted with the electroplating liquid, and the electroplating efficiency is improved.

The beneficial effects of the invention are as follows: according to the invention, through the synergistic effect of the first liquid supply driving component and the second liquid supply driving component, the first driving sliding block and the second driving sliding block can move in the directions away from each other, and the alternating motion not only enables the supporting base and the metal copper to be electroplated to do circular reciprocating motion, but also realizes the up-and-down lifting motion, and the composite motion greatly increases the contact area and the contact frequency of the metal copper to be electroplated and the electroplating liquid, and realizes the efficient and non-shielding electroplating process, thereby obviously improving the electroplating efficiency;

in the electroplating device, the metal copper to be electroplated continuously swings in a reciprocating manner, and the movement mode enables the bottom of the metal copper to form a line contact point with the bottom surface of the supporting groove, so that each part of the metal copper to be electroplated can be alternately contacted with electroplating liquid, the contact dead zone is effectively eliminated by the contact mode of full coverage, and the uniformity and the comprehensiveness of an electroplated layer are ensured;

the invention realizes the full-contact electroplating of the metal copper to be electroplated, thereby greatly reducing the need of post-plating, improving the overall efficiency of the electroplating process and reducing the production cost and time consumption;

the invention realizes simplified control of complex actions through a simple structure, optimizes the structure of electroplating equipment, and improves the convenience and production efficiency of operation.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention with the cover plate removed;

FIG. 3 is a schematic view of the internal structure of the present invention;

FIG. 4 is a top view of the present invention;

FIG. 5 is a schematic diagram showing a front view of the copper metal to be electroplated according to the present invention in operation;

FIG. 6 is an enlarged view of a portion of FIG. 5 at A;

FIG. 7 is a schematic diagram II of the front view of the copper metal to be electroplated of the present invention in operation;

FIG. 8 is an enlarged view of a portion of the invention at B in FIG. 7;

FIG. 9 is a schematic view of the structure of the support base of the present invention;

FIG. 10 is a schematic view of a first liquid supply driving assembly according to the present invention;

reference numerals illustrate:

1. an electrolytic cell; 2. a second driving cylinder; 3. a first driving cylinder; 4. metallic copper to be electroplated; 5. a controller; 6. a linkage plate; 7. a guide chute; 8. a feeding and discharging cavity; 9. a cover plate; 10. an electroplating cavity; 11. a drive rail; 12. a first drive liquid supply rod; 13. a first liquid inlet and outlet pipe; 14. a first drive slide; 15. a first liquid supply hose; 16. a support fixing block; 17. a support base; 18. a rotating bearing; 19. a telescopic support rod; 20. a support groove; 21. a second liquid supply hose; 22. a second drive slider; 23. a second liquid inlet and outlet pipe; 24. a second driving liquid supply rod; 25. a first line contact point; 26. a second line contact point; 27. a liquid spraying hole; 28. a liquid supply channel; 29. driving a piston; 30. a liquid inlet and outlet cavity; 31. a pipette.

Detailed Description

All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. That is, each feature is one example only of a generic series of equivalent or similar features, unless expressly stated otherwise.

As shown in fig. 1 to fig. 4, the high-efficiency metal copper electroplating device of the invention comprises an electrolytic tank 1, wherein an electroplating cavity 10 is arranged in the electrolytic tank 1, an electroplating liquid is arranged in the electroplating cavity 10, metal copper 4 to be electroplated is placed in the electroplating cavity 10 for electroplating, a controller 5 is arranged outside the electrolytic tank 1, and electric control of each component is performed through the controller 5;

as shown in fig. 9, the electroplating device further comprises a supporting base 17, the bottom of the supporting base 17 is rotatably provided with a telescopic supporting rod 19, the upper end of the supporting base 17 is provided with a supporting groove 20, the metal copper 4 to be electroplated is placed in the supporting groove 20, during electroplating, the bottom of the metal copper 4 to be electroplated is supported in the supporting groove 20, and the electroplating liquid is contacted with all sides of the metal copper to finish electroplating;

the plating equipment further comprises a first liquid supply driving component and a second liquid supply driving component which are respectively arranged at two sides of the supporting base 17 and are used for driving the supporting base 17 and the metal copper 4 to be plated to do reciprocating circular motion, and the supporting base 17 and the metal copper 4 to be plated can be enabled to do up-and-down lifting motion by taking a telescopic supporting rod 19 at the bottom as a rotation center, when the first liquid supply driving component and the second liquid supply driving component act, the supporting base 17 is enabled to do circular motion continuously, meanwhile, as the first liquid supply driving component and the second liquid supply driving component are arranged at the upper position of the supporting base 17, when the first liquid supply driving component and the second liquid supply driving component move to the most far end of the supporting base 17, the whole supporting base 17 can ascend, when the first liquid supply driving component and the second liquid supply driving component are close to each other, the supporting motion is lowered by the height, so long as the first liquid supply driving component and the second liquid supply driving component act continuously and reciprocally, the supporting base 17 can achieve circular motion and the up-and-down lifting motion, and the metal copper to be placed in the supporting base 17 can be placed in the circumference, namely, the stirring mechanism is replaced by the circular motion, and the stirring mechanism is arranged at the lower circumference of the metal copper to be stirred, and the stirring mechanism is placed in the circumference of the supporting base 17, and the metal copper is placed in the stirring mechanism, and the stirring mechanism is replaced by the stirring mechanism;

as shown in fig. 9, a group of liquid spraying holes 27 are respectively formed at the two sides of the supporting base 17 near the top opening of the supporting groove 20, and the two groups of liquid spraying holes 27 are oppositely arranged, when the first liquid supply driving assembly and the second liquid supply driving assembly act, one group of liquid spraying holes 27 is in a liquid spraying state, and the other group of liquid spraying holes 27 is in a static liquid spraying state;

when one group of spray holes 27 is in a spray state, the metal copper 4 to be electroplated leans against one side of the support base 17 in a static spray state, and at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the support groove 20 are obliquely supported and form a line contact point.

Specifically, as shown in fig. 2, 3 and 10, the first liquid supply driving assembly includes a first driving cylinder 3, the output end of a cylinder rod of the first driving cylinder 3 is connected with a first driving slide block 14 through a linkage plate 6, two sides in the electrolytic tank 1 are respectively and fixedly provided with a driving guide rail 11, the first driving slide block 14 is slidably mounted on the driving guide rail 11, the first driving slide block 14 can reciprocate along the driving guide rail 11, the driving guide rail 11 is on one side close to the top of the electrolytic tank 1, the height of the driving guide rail 11 is higher than the height of the supporting base 17, and the relative movement of the first liquid supply driving assembly and the second liquid supply driving assembly can enable the supporting base 17 to rise due to the fact that the driving guide rail 11 is located at the upper end of the supporting base 17;

the first liquid supply driving assembly further comprises a first liquid inlet and outlet pipe 13 and a first driving liquid supply rod 12, one end of the first driving liquid supply rod 12 is provided with a driving piston 29, as shown in fig. 10, the driving piston 29 is movably and hermetically arranged in a liquid supply channel 28 in the first driving liquid supply rod 12, the other end of the first driving liquid supply rod 12 is fixedly connected with a supporting and fixing block 16, the bottom of the supporting and fixing block 16 is fixedly arranged on the driving guide rail 11, the first liquid inlet and outlet pipe 13 is communicated with a liquid inlet and outlet cavity 30 in the first driving slide block 14, the output end of the first driving slide block 14 is connected with a first liquid supply hose 15, the output end of the first liquid supply hose 15 is communicated with a first liquid spraying hole 27 in the supporting base 17, when the first driving slide block 14 is driven on the driving guide rail 11 through the first driving cylinder 3, and when the first liquid inlet and outlet pipe 13 is stretched relative to the first driving liquid supply rod 12, that is, when the first driving slide block 14 moves far away from the first driving liquid supply rod 12, the electroplating liquid in the electroplating cavity 10 can be sucked into the liquid supply channel 28 through the liquid suction pipe 31, otherwise, when the first driving air cylinder 3 drives the first liquid inlet and outlet pipe 13 to move towards the first driving liquid supply rod 12, the electroplating liquid in the liquid supply channel 28 is extruded by the driving piston 29, the electroplating liquid enters into the first liquid spraying hole 27 through the first liquid supply hose 15, the electroplating liquid is sprayed out of the first liquid spraying hole 27, so that the metal copper 4 to be electroplated is leaning to the side of the second liquid spraying hole 27, as shown in fig. 7, a second line contact point 26 is formed between the bottom of the metal copper 4 to be electroplated and the bottom of the supporting groove 20, and an included angle b is formed at the bottom of the metal copper 4 to be electroplated, due to the line contact, the electroplating liquid can enter into the included angle to be contacted with the bottom of the metal copper 4 to be electroplated, and the position of the line contact is removed, the rest positions are contacted with the electroplating liquid, so that the omnibearing electroplating contact is realized.

In order to make the first liquid supply hose 15 only capable of discharging liquid and incapable of sucking liquid, in this embodiment, a one-way liquid discharge valve is installed on the first liquid supply hose 15, a liquid suction pipe 31 is disposed on a side of the first liquid inlet/outlet pipe 13, which is close to the first driving slider 14, and a one-way liquid inlet valve is installed on the liquid suction pipe 31, so that the liquid suction pipe 31 only can suck liquid and cannot discharge liquid through the liquid suction pipe 31 and the one-way liquid inlet valve;

the first liquid supply hose 15 is used for connecting the first driving slide block 14 and the supporting base 17, the electroplating liquid in the liquid inlet and outlet cavity 30 is input into the supporting base 17 through the first liquid supply hose 15 and is sprayed out from the first liquid spraying holes 27, the metal copper 4 to be electroplated is made to lean against one side of the second liquid spraying hole 27 group, and the first liquid supply hose 15 is used for connecting the driving slide block and the supporting base 17 and is used as liquid supply.

As shown in fig. 4, the second liquid supply driving assembly includes a second driving cylinder 2, an output end of a cylinder rod of the second driving cylinder 2 is connected with a second driving sliding block 22 through a linkage plate 6, and the second driving sliding block 22 is slidably mounted on the driving guide rail 11;

the second liquid supply driving assembly further comprises a second liquid inlet and outlet pipe 23 and a second driving liquid supply rod 24, one end of the second driving liquid supply rod 24 is provided with a driving piston 29, the driving piston 29 is movably and hermetically arranged in a liquid supply channel 28 in the second driving liquid supply rod 24, the other end of the second driving liquid supply rod 24 is fixedly connected with a supporting and fixing block 16, the bottom of the supporting and fixing block 16 is fixed on the driving guide rail 11, the second liquid inlet and outlet pipe 23 is communicated with a liquid inlet and outlet cavity 30 in the second driving slide block 22, the output end of the second driving slide block 22 is connected with a second liquid supply hose 21, the output end of the second liquid supply hose 21 is communicated with a second liquid spraying hole 27 in the supporting base 17, and the working principle of the second liquid supply driving assembly is similar to that of the first liquid supply driving assembly and is not described herein.

Similarly, a one-way liquid outlet valve is installed on the second liquid supply hose 21, a liquid suction pipe 31 is arranged on one side of the second liquid inlet and outlet pipe 23, which is close to the second driving sliding block 22, and a one-way liquid inlet valve is installed on the liquid suction pipe 31;

the second liquid supply hose 21 is used for connecting the second driving slide 22 and the supporting base 17, and the electroplating liquid in the liquid inlet and outlet cavity 30 is input into the supporting base 17 through the second liquid supply hose 21 and sprayed out from the second liquid spraying holes 27, and the metal copper 4 to be electroplated is made to lean against one side of the first liquid spraying holes 27 group, as shown in fig. 5. At this time, a first line contact point 25 is formed between the bottom of the metal copper 4 to be electroplated and the bottom of the supporting groove 20, and an included angle a is formed at the bottom of the metal copper 4 to be electroplated, as shown in fig. 6, due to the line contact, the electroplating solution can enter into the included angle to contact with the bottom of the metal copper 4 to be electroplated, except for the line contact position, the rest positions are all contacted with the electroplating solution to realize omnibearing electroplating contact, and since the bottom of the metal copper 4 to be electroplated is always alternately contacted by the first line contact point 25 and the second line contact point 26, the bottom of the metal copper 4 to be electroplated is always in a line contact state, so that the bottom can always contact with the electroplating solution, and electroplating is not needed in the later stage.

In order to enable the support base 17 to rotate, in this embodiment, a rotating bearing 18 is disposed at the bottom of the telescopic support rod 19, the rotating bearing 18 is embedded and installed in the bottom surface of the electroplating cavity 10, and the telescopic support rod 19 may be an antenna type telescopic rod structure, may be telescopic, and may also rotate through the rotating bearing 18 at the bottom.

As shown in fig. 1 and 2, a cover plate 9 is disposed on the top surface of the electrolytic tank 1, a feeding and discharging cavity 8 is disposed in the middle of the cover plate 9, and the metal copper 4 to be electroplated is fed or discharged through the feeding and discharging cavity 8.

The cover plate 9 is provided with a guide chute 7 corresponding to the first liquid supply driving assembly and the second liquid supply driving assembly, and a linkage plate 6 in the first liquid supply driving assembly and the second liquid supply driving assembly penetrates through the guide chute 7 and extends out to the upper end face of the cover plate 9, and a driving cylinder in the first liquid supply driving assembly and the second liquid supply driving assembly is mounted on the top face of the cover plate 9.

When the first liquid supply driving assembly is in an ejection state, the second liquid supply driving assembly is in a retraction state, and the first liquid supply driving assembly and the second liquid supply driving assembly are in an alternate working state.

As shown in fig. 1 to 10, the metal copper electroplating method of the present invention comprises a metal copper electroplating device, and specifically comprises the following steps:

firstly, designing an electroplating bath, placing electroplating solutions with different component addition compositions in the electroplating bath, and presetting a feeding and discharging cavity 8 at the top of the electroplating bath;

secondly, arranging a group of first liquid supply driving components and second liquid supply driving components in the electroplating bath, wherein the first liquid supply driving components and the second liquid supply driving components are symmetrically arranged;

thirdly, a supporting base 17 is arranged in the electroplating cavity 10, a telescopic supporting rod 19 is arranged at the bottom of the supporting base 17, and the supporting base 17 can lift up and down and rotate circumferentially along the supporting telescopic rod;

(IV) a supporting groove 20 is formed in the supporting base 17, a first liquid spraying hole 27 is formed in one side of the supporting groove 20, a second liquid spraying hole 27 is formed in the other side of the supporting groove 20, one side of the supporting groove 20 is connected with a first liquid supply driving assembly through a first liquid supply hose 15, and the other side of the supporting groove 20 is connected with a second liquid supply driving assembly through a second liquid supply hose 21;

(V) when the first liquid supply driving component performs ejection action and the second liquid supply driving component performs retraction action, the second liquid spraying hole 27 sprays liquid, the first liquid spraying hole 27 keeps a static state, the sprayed electroplating liquid enables the metal copper 4 to be electroplated to lean against one side of the first liquid spraying hole 27, and at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the supporting groove 20 are obliquely supported and form a line contact point;

when the second liquid supply driving assembly performs ejection action and the first liquid supply driving assembly performs retraction action, the first liquid spraying hole 27 sprays liquid, the second liquid spraying hole 27 keeps a static state, the sprayed electroplating liquid enables the metal copper 4 to be electroplated to lean against one side of the second liquid spraying hole 27, at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the supporting groove 20 are obliquely supported and form a line contact point, and through reciprocating swing of the metal copper 4 to be electroplated, alternating contact between the bottom of the metal copper 4 to be electroplated and the electroplating liquid is achieved, and non-shielding contact is achieved;

and (seventh), when the first liquid supply driving assembly and the second liquid supply driving assembly continuously and alternately perform ejection and retraction actions, the whole supporting base 17 and the metal copper 4 to be electroplated are in a circular reciprocating rotation state and continuously in a lifting motion state, so that various components in the electroplating liquid are uniform, the metal copper 4 to be electroplated is fully contacted with the electroplating liquid, and the electroplating efficiency is improved.

The foregoing is merely illustrative of specific embodiments of the present invention, and the scope of the invention is not limited thereto, but any changes or substitutions that do not undergo the inventive effort should be construed as falling within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims (10)

1. An efficient metallic copper electroplating apparatus, comprising:

the electroplating device comprises an electrolytic tank 1, wherein an electroplating cavity 10 is arranged in the electrolytic tank 1, electroplating liquid is arranged in the electroplating cavity 10, metal copper 4 to be electroplated is placed in the electroplating cavity 10 for electroplating, and a controller 5 is arranged outside the electrolytic tank 1;

the bottom of the supporting base 17 is rotatably provided with a telescopic supporting rod 19, the upper end of the supporting base 17 is provided with a supporting groove 20, and the metal copper 4 to be electroplated is placed in the supporting groove 20;

the first liquid supply driving assembly and the second liquid supply driving assembly are respectively arranged at two sides of the supporting base 17 and used for driving the supporting base 17 and the metal copper 4 to be electroplated to do reciprocating circular motion and enabling the supporting base 17 and the metal copper 4 to be electroplated to do up-and-down lifting motion by taking the telescopic supporting rod 19 at the bottom as a rotation center;

a group of liquid spraying holes 27 are respectively formed in the two sides of the support base 17 and close to the opening position of the top of the support groove 20, the two groups of liquid spraying holes 27 are oppositely arranged, and when the first liquid supply driving assembly and the second liquid supply driving assembly act, one group of liquid spraying holes 27 is in a liquid spraying state, and the other group of liquid spraying holes 27 is in a static liquid spraying state;

when one group of spray holes 27 is in a spray state, the metal copper 4 to be electroplated leans against one side of the support base 17 in a static spray state, and at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the support groove 20 are obliquely supported and form a line contact point.

2. The efficient metallic copper electroplating apparatus according to claim 1, wherein: the first liquid supply driving assembly comprises a first driving air cylinder 3, the output end of an air cylinder rod of the first driving air cylinder 3 is connected with a first driving sliding block 14 through a linkage plate 6, driving guide rails 11 are fixedly arranged on two sides in the electrolytic tank 1 respectively, the first driving sliding block 14 is slidably arranged on the driving guide rails 11, the driving guide rails 11 are arranged on one side close to the top of the electrolytic tank 1, and the height of the driving guide rails 11 is higher than that of the supporting base 17;

the first liquid supply driving assembly further comprises a first liquid inlet and outlet pipe 13 and a first driving liquid supply rod 12, one end of the first driving liquid supply rod 12 is provided with a driving piston 29, the driving piston 29 is movably and hermetically arranged in a liquid supply channel 28 in the first driving liquid supply rod 12, the other end of the first driving liquid supply rod 12 is fixedly connected with a supporting and fixing block 16, the bottom of the supporting and fixing block 16 is fixed on the driving guide rail 11, the first liquid inlet and outlet pipe 13 is communicated with a liquid inlet and outlet cavity 30 in the first driving slide block 14, the output end of the first driving slide block 14 is connected with a first liquid supply hose 15, and the output end of the first liquid supply hose 15 is communicated with a first liquid spraying hole 27 in the supporting base 17.

3. The efficient metallic copper electroplating apparatus according to claim 2, wherein: a one-way liquid outlet valve is arranged on the first liquid supply hose 15, a liquid suction pipe 31 is arranged on one side of the first liquid inlet and outlet pipe 13, which is close to the first driving sliding block 14, and a one-way liquid inlet valve is arranged on the liquid suction pipe 31;

the first liquid supply hose 15 is used for connecting the first driving slide block 14 and the supporting base 17, and the electroplating liquid in the liquid inlet and outlet cavity 30 is input into the supporting base 17 through the first liquid supply hose 15 and sprayed out from the first liquid spraying holes 27, so that the metal copper 4 to be electroplated is leaning against one side of the second liquid spraying holes 27.

4. The efficient metallic copper electroplating apparatus according to claim 1, wherein: the second liquid supply driving assembly comprises a second driving air cylinder 2, the output end of an air cylinder rod of the second driving air cylinder 2 is connected with a second driving sliding block 22 through a linkage plate 6, and the second driving sliding block 22 is slidably arranged on the driving guide rail 11;

the second liquid supply driving assembly further comprises a second liquid inlet and outlet pipe 23 and a second driving liquid supply rod 24, one end of the second driving liquid supply rod 24 is provided with a driving piston 29, the driving piston 29 is movably and hermetically arranged in a liquid supply channel 28 in the second driving liquid supply rod 24, the other end of the second driving liquid supply rod 24 is fixedly connected with a supporting and fixing block 16, the bottom of the supporting and fixing block 16 is fixed on the driving guide rail 11, the second liquid inlet and outlet pipe 23 is communicated with a liquid inlet and outlet cavity 30 in the second driving slide block 22, the output end of the second driving slide block 22 is connected with a second liquid supply hose 21, and the output end of the second liquid supply hose 21 is communicated with a second liquid spraying hole 27 in the supporting base 17.

5. The efficient metallic copper electroplating apparatus according to claim 4, wherein: a one-way liquid outlet valve is arranged on the second liquid supply hose 21, a liquid suction pipe 31 is arranged on one side of the second liquid inlet and outlet pipe 23, which is close to the second driving sliding block 22, and a one-way liquid inlet valve is arranged on the liquid suction pipe 31;

the second liquid supply hose 21 is used for connecting the second driving slide block 22 and the supporting base 17, and the electroplating liquid in the liquid inlet and outlet cavity 30 is input into the supporting base 17 through the second liquid supply hose 21 and sprayed out from the second liquid spraying holes 27, so that the metal copper 4 to be electroplated is leaning against one side of the first liquid spraying hole 27 group.

6. The efficient metallic copper electroplating apparatus according to claim 1, wherein: the bottom of the telescopic supporting rod 19 is provided with a rotating bearing 18, and the rotating bearing 18 is embedded and installed in the bottom surface of the electroplating cavity 10.

7. The efficient metallic copper electroplating apparatus according to claim 1, wherein: the top surface of the electrolytic tank 1 is provided with a cover plate 9, a feeding and discharging cavity 8 is arranged in the middle of the cover plate 9, and the metal copper 4 to be electroplated is fed or discharged through the feeding and discharging cavity 8.

8. The efficient metallic copper electroplating apparatus according to claim 7, wherein: the cover plate 9 is provided with a guide chute 7 corresponding to the first liquid supply driving assembly and the second liquid supply driving assembly, and a linkage plate 6 in the first liquid supply driving assembly and the second liquid supply driving assembly penetrates through the guide chute 7 and extends out to the upper end face of the cover plate 9, and a driving cylinder in the first liquid supply driving assembly and the second liquid supply driving assembly is mounted on the top face of the cover plate 9.

9. The efficient metallic copper electroplating apparatus according to claim 1, wherein: when the first liquid supply driving assembly is in an ejection state, the second liquid supply driving assembly is in a retraction state, and the first liquid supply driving assembly and the second liquid supply driving assembly are in an alternate working state.

10. A metallic copper electroplating method, characterized by comprising the metallic copper electroplating apparatus according to any one of claims 1 to 9, comprising the steps of:

s1, designing an electroplating bath, placing electroplating solutions with different component addition compositions in the electroplating bath, and presetting a feeding and discharging cavity 8 at the top of the electroplating bath;

s2, arranging a group of first liquid supply driving components and second liquid supply driving components in the electroplating bath, wherein the first liquid supply driving components and the second liquid supply driving components are symmetrically arranged;

s3, a supporting base 17 is arranged in the electroplating cavity 10, a telescopic supporting rod 19 is arranged at the bottom of the supporting base 17, and the supporting base 17 can lift up and down and rotate circumferentially along the supporting telescopic rod;

s4, a supporting groove 20 is formed in the supporting base 17, a first liquid spraying hole 27 is formed in one side of the supporting groove 20, a second liquid spraying hole 27 is formed in the other side of the supporting groove 20, one side of the supporting groove 20 is connected with a first liquid supply driving assembly through a first liquid supply hose 15, and the other side of the supporting groove 20 is connected with a second liquid supply driving assembly through a second liquid supply hose 21;

s5, when the first liquid supply driving assembly performs ejection and the second liquid supply driving assembly performs retraction, the second liquid spraying hole 27 sprays liquid, the first liquid spraying hole 27 keeps a static state, the sprayed electroplating liquid enables the metal copper 4 to be electroplated to lean against one side of the first liquid spraying hole 27, and at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the supporting groove 20 are obliquely supported and form a line contact point;

s6, when the second liquid supply driving assembly performs ejection and the first liquid supply driving assembly performs retraction, the first liquid spraying hole 27 sprays liquid, the second liquid spraying hole 27 keeps a static state, the sprayed electroplating liquid enables the metal copper 4 to be electroplated to lean against one side of the second liquid spraying hole 27, at the moment, the bottom of the metal copper 4 to be electroplated and the bottom surface of the supporting groove 20 are obliquely supported and form a line contact point, and through reciprocating swing of the metal copper 4 to be electroplated, alternating contact between the bottom of the metal copper 4 to be electroplated and the electroplating liquid is achieved, and non-shielding contact is achieved;

s7, when the first liquid supply driving assembly and the second liquid supply driving assembly continuously and alternately perform ejection and retraction actions, the whole supporting base 17 and the metal copper 4 to be electroplated are in a circular reciprocating rotation state and continuously in a lifting motion state, so that various components in the electroplating liquid are uniform, the metal copper 4 to be electroplated is fully contacted with the electroplating liquid, and the electroplating efficiency is improved.