CN117866540A - High-temperature-resistant UV adhesive and preparation method thereof - Google Patents
High-temperature-resistant UV adhesive and preparation method thereof Download PDFInfo
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- CN117866540A CN117866540A CN202311795674.0A CN202311795674A CN117866540A CN 117866540 A CN117866540 A CN 117866540A CN 202311795674 A CN202311795674 A CN 202311795674A CN 117866540 A CN117866540 A CN 117866540A
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- adhesive
- high temperature
- resistant
- temperature resistant
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 33
- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000003085 diluting agent Substances 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000003381 stabilizer Substances 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims description 13
- 239000011259 mixed solution Substances 0.000 claims description 10
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 3
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 3
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000008859 change Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009472 formulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- -1 aromatic iron salt Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- IYLGZMTXKJYONK-ACLXAEORSA-N (12s,15r)-15-hydroxy-11,16-dioxo-15,20-dihydrosenecionan-12-yl acetate Chemical compound O1C(=O)[C@](CC)(O)C[C@@H](C)[C@](C)(OC(C)=O)C(=O)OCC2=CCN3[C@H]2[C@H]1CC3 IYLGZMTXKJYONK-ACLXAEORSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000241 respiratory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003463 sulfur Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high temperature resistant UV adhesive and a preparation method thereof, belonging to the technical field of adhesives, and comprising an oligomer, a photoinitiator, a reactive diluent, a tackifier, a stabilizer and a filler.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a high-temperature-resistant UV adhesive and a preparation method thereof
Background
With the development of medical technology and the improvement of medical level, various disposable or non-disposable medical consumables have been greatly developed, and these consumables generally include syringes, respiratory masks, laryngeal masks, catheters, blood separation cups, indwelling needles, and the like. The outstanding characteristics of these consumables are that the bonding of different materials is needed, the bearing of heavy load is needed, and the rapid assembly bonding can be realized instantaneously.
In the prior art, for certain medical device applications, the use of UV glue may have the following drawbacks:
1. since UV glue is mainly cured by means of ultraviolet rays, the high temperature resistance of UV glue is relatively poor without ultraviolet irradiation.
2. UV glue may undergo yellowing under high temperature conditions, affecting its color and transparency.
Disclosure of Invention
The invention provides a high temperature resistant UV adhesive and a preparation method thereof, which are used for solving the technical problems that the high temperature resistant performance of the UV adhesive is relatively poor and the color and the transparency of the UV adhesive are easily affected by yellowing in the prior art, and the invention comprises the following steps:
the first object of the invention is to provide a high temperature resistant UV adhesive, which is technically characterized by comprising, by weight, 35-75 parts of oligomer, 10-25 parts of photoinitiator, 1-5 parts of reactive diluent, 0.1-5 parts of tackifier, 0.1-3 parts of stabilizer and 0.1-5 parts of filler.
In order to better realize the technical scheme, the oligomer in the high-temperature-resistant UV adhesive formula system is at least one of methyl acrylate, methyl methacrylate and epoxy acrylate.
In order to better realize the technical scheme, the photoinitiator in the high-temperature-resistant UV adhesive formula system is at least one of aromatic iron salt, diaryl iodine salt and triaryl sulfur salt.
In order to better realize the technical scheme, the reactive diluent in the high-temperature-resistant UV adhesive formula system is at least one of isobornyl acrylate, ethoxyethoxyethyl acrylate and acryloylmorpholine.
In order to better realize the technical scheme, the tackifier in the high-temperature-resistant UV adhesive formula system is at least one of terpene resin, petroleum resin and rosin ester.
In order to better realize the technical scheme, the stabilizer in the high-temperature-resistant UV adhesive formula system is at least one of hydroquinone, p-methoxyphenol and p-benzoquinone.
In order to better realize the technical scheme, the filler in the high-temperature-resistant UV adhesive formula system is at least one of silicon oxide, titanium oxide and glass beads.
The second object of the invention is to provide a preparation method of high temperature resistant UV glue, which is technically characterized by comprising the following steps:
step one, uniformly mixing an oligomer and a reactive diluent to prepare a mixed solution A;
step two, adding a photoinitiator and a tackifier into the mixed solution A in the step one;
and thirdly, adding a stabilizer and a filler on the basis of the second step, and uniformly mixing to obtain the high-temperature-resistant UV adhesive.
Compared with the prior art, the high-temperature-resistant UV adhesive and the preparation method thereof can achieve the following
The beneficial effects are that:
the high temperature resistant UV adhesive comprises an oligomer, a photoinitiator, a reactive diluent, a tackifier, a stabilizer and a filler, wherein the oligomer has high temperature resistant performance in the formula system, the reactive diluent in the formula system plays a role of the diluent in the formula system, so that the UV adhesive has reactivity when reaching the required viscosity, and the UV adhesive is copolymerized with the oligomer to form a network structure when irradiated by light, thereby improving the photo-curing rate of the system and the mechanical property, and the photoinitiator absorbs ultraviolet rays and generates free radicals to initiate monomer polymerization and crosslinking chemical reaction.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below in connection with specific embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
A high temperature resistant UV gel comprises 55kg of oligomer, 17.5kg of photoinitiator, 3kg of reactive diluent, 2.6kg of tackifier, 1.5kg of stabilizer and 2.5kg of filler.
Further, the oligomer in this example is methyl acrylate.
Further, the photoinitiator in this embodiment is an iron salt of an arylmetallocene.
Further, the reactive diluent in this embodiment is isobornyl acrylate.
Further, the tackifier in this embodiment is a terpene resin.
Further, the stabilizer in this example is hydroquinone.
Further, the filler in this embodiment is silicon oxide.
According to the above formulation, the preparation method of the high temperature resistant UV adhesive in the embodiment comprises the following steps:
step one, uniformly mixing an oligomer and a reactive diluent to prepare a mixed solution A;
step two, adding a photoinitiator and a tackifier into the mixed solution A in the step one;
and thirdly, adding a stabilizer and a filler on the basis of the second step, and uniformly mixing to obtain the high-temperature-resistant UV adhesive.
Example 2
A high temperature resistant UV gel comprises 35kg of oligomer, 10kg of photoinitiator, 1kg of reactive diluent, 0.1kg of tackifier, 0.1kg of stabilizer and 0.1kg of filler.
Further, the oligomer in this example is methyl methacrylate.
Further, the photoinitiator in this embodiment is a diaryliodonium salt.
Further, the reactive diluent in this example is ethoxyethoxyethyl acrylate.
Further, the tackifier in this embodiment is petroleum resin.
Further, the stabilizer in this example is p-methoxyphenol.
Further, the filler in this embodiment is titanium oxide.
According to the above formulation, the preparation method of the high temperature resistant UV adhesive in the embodiment comprises the following steps:
step one, uniformly mixing an oligomer and a reactive diluent to prepare a mixed solution A;
step two, adding a photoinitiator and a tackifier into the mixed solution A in the step one;
and thirdly, adding a stabilizer and a filler on the basis of the second step, and uniformly mixing to obtain the high-temperature-resistant UV adhesive.
Example 3
A high temperature resistant UV gel comprises 75kg of oligomer, 25kg of photoinitiator, 5kg of reactive diluent, 5kg of tackifier, 3kg of stabilizer and 5kg of filler.
Further, the oligomer in this embodiment is an epoxy acrylate.
Further, the photoinitiator in this embodiment is a triaryl sulfide salt.
Further, the reactive diluent in this example is and acryloylmorpholine.
Further, the tackifier in this embodiment is rosin ester.
Further, the stabilizer in this embodiment is p-benzoquinone.
Further, the filler in this embodiment is glass beads.
According to the above formulation, the preparation method of the high temperature resistant UV adhesive in the embodiment comprises the following steps:
step one, uniformly mixing an oligomer and a reactive diluent to prepare a mixed solution A;
step two, adding a photoinitiator and a tackifier into the mixed solution A in the step one;
and thirdly, adding a stabilizer and a filler on the basis of the second step, and uniformly mixing to obtain the high-temperature-resistant UV adhesive.
Test examples
The high temperature resistant UV glue prepared in examples 1-3 was compared with a commercially available UV glue (comparative example) from Tianjin new materials science and technology Co., ltd, and the performance test method and test results were as follows:
curing speed test: and under the irradiation of ultraviolet rays, counting the curing time of the UV adhesive.
And (3) adhesive strength test: on plastic materials, the adhesive strength of UV glue was tested.
High temperature resistance test: the adhesive property and appearance of the UV glue change in a high-temperature environment.
Light transmission performance test: the light transmittance of the UV glue after curing was measured using a spectrometer.
TABLE 1
| Curing time/s | Bond strength/psi | Adhesion and appearance at 150 DEG C | Transmittance/% | |
| Example 1 | 4 | 2400 | No change | 93 |
| Example 2 | 4 | 2200 | No change | 92 |
| Example 3 | 3 | 2500 | No change | 92 |
| Comparative example | 5 | 1800 | Change occurs | 92 |
The foregoing is merely exemplary of the present invention and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are to be included in the scope of the claims of the present invention.
Claims (8)
1. The high temperature resistant UV adhesive is characterized by comprising, by weight, 35-75 parts of an oligomer, 10-25 parts of a photoinitiator, 1-5 parts of a reactive diluent, 0.1-5 parts of a tackifier, 0.1-3 parts of a stabilizer and 0.1-5 parts of a filler.
2. The high temperature resistant UV glue of claim 1, wherein the oligomer is at least one of methyl acrylate, methyl methacrylate and epoxy acrylate.
3. The high temperature resistant UV gel of claim 1 wherein the photoinitiator is at least one of an arylferrocenium salt, a diaryliodonium salt, and a triarylthiolate salt.
4. The high temperature resistant UV gel of claim 1 wherein said reactive diluent is at least one of isobornyl acrylate, ethoxyethoxyethyl acrylate, and acryloylmorpholine.
5. The high temperature resistant UV glue of claim 1, wherein the tackifier is at least one of a terpene resin, a petroleum resin, and a rosin ester.
6. The high temperature resistant UV glue of claim 1, wherein the stabilizer is at least one of hydroquinone, p-methoxyphenol and p-benzoquinone.
7. The high temperature resistant UV gel of claim 1 wherein the filler is at least one of silica, titania and glass beads.
8. The preparation method of the high-temperature-resistant UV adhesive is characterized by comprising the following steps of:
step one, uniformly mixing an oligomer and a reactive diluent to prepare a mixed solution A;
step two, adding a photoinitiator and a tackifier into the mixed solution A in the step one;
and thirdly, adding a stabilizer and a filler on the basis of the second step, and uniformly mixing to obtain the high-temperature-resistant UV adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311795674.0A CN117866540A (en) | 2023-12-25 | 2023-12-25 | High-temperature-resistant UV adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311795674.0A CN117866540A (en) | 2023-12-25 | 2023-12-25 | High-temperature-resistant UV adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117866540A true CN117866540A (en) | 2024-04-12 |
Family
ID=90580379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311795674.0A Pending CN117866540A (en) | 2023-12-25 | 2023-12-25 | High-temperature-resistant UV adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117866540A (en) |
-
2023
- 2023-12-25 CN CN202311795674.0A patent/CN117866540A/en active Pending
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