CN117854549A

CN117854549A - Unified solid state drive housing design

Info

Publication number: CN117854549A
Application number: CN202311271176.6A
Authority: CN
Inventors: S·R·亚拉古恩塔; K·S·G·阿米斯; D·N·苏卜哈希
Original assignee: Micron Technology Inc
Current assignee: Micron Technology Inc
Priority date: 2022-10-04
Filing date: 2023-09-28
Publication date: 2024-04-09
Also published as: US20240114660A1

Abstract

Example embodiments relate to a unified solid state drive SSD housing design that can be adapted for use with different printed circuit board assemblies PCBA. The SSD housing design includes a three-piece construction including a top housing, a bottom housing, and an intermediate structure. The bottom housing is coupled to the top housing to form a housing for a PCBA having NAND devices and a controller. The intermediate structure is coupled to the PCBA and positioned within the housing between the top housing and the bottom housing. The intermediate structure includes a plurality of heat sinks that transfer heat from the NAND device and a controller heat sink that transfers heat from the controller, whereby the type and location of the heat sink can be changed for different PCBAs without having to change the top or bottom housing. The top housing may include vents that allow air to flow therethrough.

Description

Unified solid state drive housing design

Technical Field

The subject matter disclosed herein relates generally to Solid State Drive (SSD) housing designs, and more particularly to a reusable SSD housing design that can be used with any Printed Circuit Board Assembly (PCBA) design.

Background

Currently, U.2 and U.3 Solid State Drive (SSD) enclosures are each designed to work efficiently for specific Printed Circuit Board Assembly (PCBA) designs and drive capacity. If critical component locations change (e.g., due to wiring constraints in the electrical design of higher performance or various capacity drives), these SSD housings would have to be redesigned to accommodate new component locations and/or to operate efficiently for higher thermal performance.

Conventional enclosure design methods have a detrimental effect on product lifecycle and have a number of drawbacks. For example, most conventional SSD housings are manufactured using die cast manufacturing methods that typically require a minimum of eight to ten weeks of lead time to develop. Thus, any redesign or modification of SSD enclosures would require additional lead time and increase enclosure infrequent engineering (NRE) costs, product costs, and time to market. Still further, die casting manufacturing may also result in a heavier housing.

Disclosure of Invention

In one aspect, the present disclosure provides a solid state drive comprising: a Printed Circuit Board Assembly (PCBA) having a plurality of NAND (NAND) devices and a controller; and a housing design, comprising: a top housing; a bottom housing coupled to the top housing to form a housing for the PCBA; and an adjustable intervening structure coupled to the PCBA and positioned between the top housing and the bottom housing within the housing, the adjustable intervening structure comprising a plurality of heat sinks for transferring heat from the NAND device, and a controller heat sink for transferring heat from the controller.

In another aspect, the present disclosure provides a housing design comprising: a top housing; a bottom housing coupled to the top housing to form a housing for a Printed Circuit Board Assembly (PCBA) having a plurality of NAND (NAND) devices and a controller; and an adjustable intervening structure coupled to the PCBA and positioned between the top housing and the bottom housing within the housing, the adjustable intervening structure comprising a plurality of heat sinks for transferring heat from the NAND device, and a controller heat sink for transferring heat from the controller.

In another aspect, the present disclosure provides a method for constructing a solid state drive, the method comprising: obtaining a Printed Circuit Board Assembly (PCBA) having a plurality of NAND (NAND) devices and a controller; creating an adjustable inter-medium structure, the creating the adjustable inter-medium structure comprising thermally connecting a plurality of heat sinks to the NAND device and thermally connecting a controller heat sink to the controller; thermally connecting the controller heat sink to a top housing; and coupling a bottom housing to the top housing to form a housing for the PCBA.

Drawings

Some embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings.

Fig. 1A and 1B are diagrams illustrating a conventional Solid State Drive (SSD) housing.

FIG. 1C is a diagram illustrating an expanded view of components associated with a conventional SSD housing.

Fig. 2A and 2B are diagrams illustrating a unified SSD housing design, according to some example embodiments.

Fig. 3A is a diagram illustrating a top perspective view of a unified SSD housing design with a top surface removed to show a Printed Circuit Board Assembly (PCBA) having intermediate structures coupled thereto, according to some example embodiments.

Fig. 3B is a diagram illustrating a bottom perspective view of a unified SSD housing design with a bottom surface removed to show the PCBA enclosed therein, according to some example embodiments.

Fig. 4 is a diagram illustrating a top perspective view of a unified SSD housing design with a top surface removed to show a PCBA having an alternative intermediate structure coupled thereto, according to some example embodiments.

Fig. 5 is a flowchart of a method of manufacturing an SSD using a unified SSD housing design, according to some example embodiments.

Detailed Description

The following description describes systems, methods, techniques, and articles of manufacture that illustrate example embodiments of the present subject matter. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide an understanding of various embodiments of the subject matter. It will be apparent to one skilled in the art that embodiments of the present subject matter may be practiced without some or other of these specific details. Examples merely typify possible variations. Structures (e.g., structural components) are optional and may be combined or sub-divided, and operations (e.g., in a process, algorithm, or other function) may be varied in sequence or combined or sub-divided, unless explicitly stated otherwise.

Example embodiments relate to a unified or universal SSD housing design or assembly (also referred to herein as a "unified SSD housing" or "unified housing") that is thermally efficient and suitable for use with a variety of PCBA, drive capacities and capabilities. Unified SSD housing designs are "universal" or "unified" in that at least a portion can be reused for different component locations and thermal requirements, which avoids housing redesign work and lead time manufacturing issues. In particular, the top housing component and the bottom housing component, which form the housing or shell, may be reused with different PCBAs having different components and different component positions. I.e. the top housing component and the bottom housing component are unchanged. Instead of changing the design of the housing, an intermediate design structure (also referred to herein as an "intermediate structure") is positioned within the housing, which intermediate design structure can be customized according to the components on the PCBA and their location. In example embodiments, the intermediate design structure includes a plurality of heat sinks that may be configured to different components on the PCBA. In some embodiments, the intermediate design structure may utilize a general purpose or off-the-shelf heat sink. Thus, example embodiments are thermally efficient for any PCBA component placement and thermal requirements.

In example embodiments, unifying SSD housing designs reduces design complexity (e.g., simplifies design). In particular, example embodiments reuse a common or unified housing to minimize design and manufacturing lead times (e.g., time to market due to adaptability to multiple drive capacities). Example embodiments may also reduce development and tooling time and costs by eliminating the die casting process.

The reusable unified SSD housing design also provides technical advantages in improving overall drive thermal performance. For example, the intermediate design structure is thermally efficient and helps to reduce the weight of the hot solution. The weight of SSDs can also be reduced by manufacturing the housing using a stamping method rather than using die casting. Still further, the unified SSD housing design can address overheating problems in the event of fan failure due to low flow impedance. Due to the intermediate design structure, the unified SSD housing works efficiently for all airflow conditions (including low fan speeds or fan failures), as will be discussed further below.

Another technical advantage of the unified SSD housing design is that the unified SSD housing design provides improved thermal isolation and thermal balance between the controller and the NAND devices. Some example embodiments disconnect the NAND from the controller thermal ground layer to prevent heating problems due to, for example, application Specific Integrated Circuits (ASICs). These and other advantages are discussed in further detail below.

Fig. 1A and 1B are diagrams illustrating a conventional or prior art Solid State Drive (SSD) housing 100. The conventional SSD housing 100 is a two-piece construction that includes a top housing component 102 and a bottom housing component 104 that are coupled together to form the SSD housing 100. The top housing assembly 102 includes a plurality of fins 106 extending perpendicularly from a top surface of the top housing assembly 102. The plurality of fins serves as a heat sink. Thus, the plurality of fins 106 is also referred to as a top heat sink. The plurality of fins 106 facilitate heat transfer from the conventional SSD housing 100 to the external environment. In various cases, heat is also transferred through the bottom housing assembly 104.

As discussed previously, disadvantages of conventional SSD housing 100 are: it requires a specific design for each Printed Circuit Board Assembly (PCBA) so that a specific housing is created for each PCBA. Referring now to FIG. 1C, a diagram illustrating an expanded view of components within a conventional SSD housing 100 is shown. Between the top housing component 102 and the bottom housing component 104 is a PCBA 108 on which a plurality of components are mounted. The plurality of components includes various NAND devices 110 and controllers 112. If the components of the PCBA 108 change or the locations of the components change, the conventional SSD housing 100 would need to be redesigned. Redesign will result in delays in the manufacturing process, requiring several weeks or more of manufacturing and design effort.

Typically, the top housing component 102 and the plurality of fins 106 (e.g., top heat sink) are responsible for transferring heat from the NAND device 110 and the controller 112. Typically, the NAND device 110 and the controller 112 are thermally connected to the top heat sink in order to cause the top heat sink to dissipate heat therefrom. Specifically, heat from the NAND device 110 and the controller 112 is dissipated through the plurality of fins 106. In these conventional embodiments, because all components are thermally connected to the top heat sink, the controller 112 may cause the NAND device 110 to overheat such that the NAND device 110 cannot function properly at higher temperatures.

Further, conventional SSD housing 100 is typically manufactured, at least in part, by die casting. That is, the top housing component 102 and the bottom housing component 104 may be die cast. In some cases, the bottom housing assembly 104 may be stamped. Disadvantageously, the die cast material used for conventional SSD housing 100 typically has low thermal conductivity. In addition, die casting may result in thicker and heavier shells.

To address the shortcomings of conventional SSD housing 100, example embodiments provide a universal or unified SSD housing design that can be used with PCBA of any kind or design, such as any Printed Circuit Board (PCB) variant. By using a unified SSD housing, manufacturing or redesign downtime is not incurred. Reuse of SSD housings also provides the additional benefit of reduced manufacturing costs. Additional advantages are discussed further below.

Fig. 2A and 2B are diagrams illustrating a unified or generic SSD housing design 200, according to some example embodiments. The unified SSD housing design 200 includes a three-piece construction that includes a top housing component 202 (also referred to herein as a "top housing") and a bottom housing component 204 (also referred to herein as a "bottom housing") that are coupled together to form a housing for the PCBA between the top housing 202 and the bottom housing 204, as well as an intermediate structure (not shown). In example embodiments, the top housing 202 and the bottom housing 204 are standard for any PCBA configuration and do not change if any PCBA components change or the position of the PCBA components change.

Unlike the conventional top housing assembly 102, the top housing 202 has a flat top surface 206 (e.g., no external heat sink). Similarly, the bottom housing 204 has a flat bottom surface 208. By having a flat top surface 206 and a flat bottom surface 208, the top housing 202 and bottom housing 204 may be manufactured using a stamping process rather than the die casting process used in conventional SSD housing 100. The advantage of using the stamping method is that the overall weight of the unified SSD housing design 200 and SSD will be lighter. This is due to the use of lighter materials (e.g. aluminum) and to having a thinner thickness (e.g. 1mm thick) achieved by using a stamping method instead of the conventional die casting method.

In an example embodiment, the top housing 202 includes a plurality of vents 210 on a front surface 212 and a rear surface (not shown). The plurality of vents 210 allow air to flow through the housing or shell of the unified SSD housing design 200. Thus, unified SSD housing design 200 allows air to pass over top surface 206, bottom surface 208, and through the interior of the housing. Advantageously, passing air through the interior of the housing cools the PCBA, intermediate structure, and small components that are not or cannot be connected to the bottom housing 204 and/or the top housing 202. These subassemblies can be critical to the design, and air passing over the subassemblies transfers heat from the subassemblies so that the subassemblies do not need to dissipate heat. In some embodiments, the bottom housing 204 may also include vents.

Fig. 3A is a diagram illustrating a top perspective view of an example embodiment of a unified SSD housing design 200 with top surface 206 removed to show a Printed Circuit Board Assembly (PCBA) 302 having intermediate structures coupled thereto. The intermediate structure shown in fig. 3A includes a heat sink 304 that transfers heat from critical components (e.g., NAND devices and controllers) without modifying the main SSD housing (e.g., top housing 202 and bottom housing 204). In some embodiments, the heat sink 304 is reusable (e.g., general purpose or off-the-shelf). In other embodiments, the heat sink 304 is customized according to the critical components of the PCBA 302.

The intermediate structure heat sink 304 includes fin structures that transfer heat to the top housing 202. The primary end 306 of the heat sink 304 is connected to the top housing 202 (e.g., the top surface 206 of the top housing 202). For example, the primary end 306 may be connected to the top surface 206 via welding or adhesive bonding. The secondary side (e.g., opposite the primary side 306) of the heat sink 304 contacts the critical components, for example, using a thermal interface material (e.g., thermal paste, thermal adhesive, thermal gap filler, thermal pad, thermal tape, phase change material).

In an example embodiment, the intermediate structure (e.g., heat sink 304) is a stamped metal structure. Using the stamping method, the intermediate structure can be manufactured in less time and at lower cost. The intermediate structure may be manufactured, for example, using aluminum or copper. The materials used, as well as the dimensions of the heat sink 304, depend on the design requirements and the critical components from which heat is to be transferred. Thus, the intermediate structure can be customized for each PCB variant and drive capacity without changing the top housing 202 and the bottom housing 204.

The plurality of vents 210 on the front surface 212 and the rear surface 308 are more clearly shown in fig. 3A. The plurality of vents 210 allow airflow through the SSD housing and across the PCBA 302 and the heat sink 304. This ensures that heat is removed from the PCB surface, PCBA components and heat sink 304, and that there is no stagnant heated air within the SSD housing. Thus, the airflow may provide sufficient cooling for small components (e.g., power Management Integrated Circuits (PMICs), memories, inductors, capacitors). Advantageously, this avoids the use of thermal interface materials to connect the gadgets to the heat sink 304 and avoids the need for additional heat sinks dedicated to these gadgets.

Fig. 3B is a diagram illustrating a bottom perspective view of the unified SSD housing design 200 with the bottom surface 208 removed to show the bottom of the PCBA 302 enclosed therein, according to some example embodiments. It can be seen that portions of various components (e.g., NAND device 310) are shown. In some cases, the NAND device 310 may be thermally connected (e.g., via a thermal interface material) to the bottom housing 204 (e.g., the bottom surface 208) to transfer heat from the NAND component 310 to the bottom housing 204.

The embodiment shown in fig. 3A includes a heat sink 304 thermally connected to the top housing 202. Typically, the controller has the highest heat concentration. The heat may potentially be transferred through the heat sink 304 to other components, such as the NAND device 310. Thus, the heat sink that transfers heat from the NAND device can be advantageously disconnected from the heat sink that transfers heat from the controller.

Fig. 4 is a diagram illustrating a top perspective view of unified SSD housing design 200 with top surface 206 removed to show PCBA 402 with an alternative intermediate structure coupled thereto, according to some example embodiments. In some embodiments, the intermediate structure of fig. 4 may use an off-the-shelf and/or custom heat sink 404. For example, a standard or off-the-shelf heat sink 404 may be used for individual critical components of PCBA 402, such as NAND devices. The use of off-the-shelf heat sinks 404 is generally less expensive and requires little time in the manufacturing process. Alternatively, the heat sink 404 may be manufactured using an extrusion or stamping process.

The controller heat sink 406 is configured to transfer heat from a controller or other high power component (e.g., ASIC). In some embodiments, the controller heat sink 406 is connected or welded to the top housing 202 (e.g., the top surface 206). Thus, a portion of the heat from the controller is transferred to the top housing 202 and dissipated through the top housing 202. Another portion of the heat may be transferred through the air, which flows through the SSD housing via a plurality of vents 210 in the top housing 202.

Unlike the embodiment of fig. 3A, the heat sink 404 for the NAND device (or other critical component other than the controller) is isolated (e.g., disconnected) from the top housing 202, while the controller heat sink 406 is thermally connected to the top housing 202. By isolating the heat sink 404 that dissipates heat from the NAND device from the top housing 202 (e.g., not connecting the heat sink 404 to the top housing 202), the NAND device will not be transferred any heat from the controller or controller heat sink 406. In these embodiments, air flowing through the plurality of vents 210 cools the heat sink 404, dissipating heat from the NAND device or other critical components.

In an example embodiment, the bottom of PCBA 402 in the embodiment of fig. 4 may be the same as shown in fig. 3B. Accordingly, various components (e.g., NAND devices) may be thermally connected to the bottom housing 204 (e.g., the bottom surface 208) to transfer heat from the components to the bottom housing 204.

The two embodiments of fig. 3A and 4 provide a universal or unified SSD housing design 200 having a top housing 202 and a bottom housing 204, the top housing 202 and the bottom housing 204 being reusable with different PCBAs having different components and different component locations. That is, the top housing 202 and the bottom housing 204 are generic and unchanged. Alternatively, the intermediate structure is configured or adapted according to different PCBA components and PCBA component positions. The intermediate structure includes a plurality of individual heat sinks that transfer heat from, for example, the NAND device and the controller. In one embodiment, the heat sink of the NAND device is connected to the top housing (e.g., the embodiment of FIG. 3A). In an alternative embodiment, the heat sink of the NAND device is isolated from (e.g., not connected to) the top housing (e.g., the embodiment of fig. 4). In both embodiments, the controller heat sink is thermally coupled to the top housing and transfers at least a portion of the heat from the controller through the top housing 202.

Fig. 5 is a flowchart of a method 500 of manufacturing an SSD using a unified SSD housing design, according to some example embodiments. In operation 502, top and bottom shells are manufactured. Because the top and bottom housings are not changed regardless of the PBCA, the top and bottom housings can be mass produced. In an example embodiment, the top and bottom housings are manufactured using a stamping process. In one embodiment, the material used to create the top and bottom shells is aluminum.

In operation 504, a PBCA to be housed within an SSD is obtained. Based on the design of the PBCA and critical components (e.g., NAND devices, controllers), a customized intermediate structure is created in operation 506. In example embodiments, the customized intermediate structure is created by thermally coupling a heat sink to critical components of the PBCA. For example, the heat spreader contacts the critical components via a thermal interface material (e.g., thermal paste, thermal adhesive, thermal gap filler, thermal pad, thermal tape, phase change material). In some cases, the heat sink is an off-the-shelf heat sink, while in other cases, the heat sink may be customized according to the size, shape, and heat output of the critical components. The heat sink may be manufactured using a stamping process.

In operation 508, an intermediate structure controller heat sink is connected to the top housing. For example, the controller heatsink may be connected to the top surface of the top housing via welding or adhesive bonding.

In operation 510, it is determined whether other heat sinks (e.g., heat sinks of a NAND device) are connected to the top housing. In the embodiment of fig. 3A, the other heat sinks are connected to the top housing, whereas the embodiment of fig. 4 does not connect the other heat sinks to the top housing. If other heat sinks are to be connected, then in operation 512 the other heat sinks are connected (e.g., via welding or adhesive bonding).

In operation 514, the bottom housing is coupled to the top housing to form a housing for the PCBA. For example, the bottom housing and the top housing may be coupled together using screws or other types of fasteners.

If the design of the PCBA changes, the same top and bottom housings may still be used (e.g., assuming that the dimensions of the PCBs are relatively the same). Any variation in the key components or their locations on the PCBA may be accommodated by changing the intermediate structure (e.g., changing the location of one or more heat sinks and/or one or more heat sinks). For example, the corresponding heat sink may be moved or replaced with other heat sinks that are more suitable for the new critical components.

Although example embodiments having NAND devices are discussed, alternative embodiments may include other devices in addition to NAND devices. For example, a PCBA housed in a housing design may include one or more Dynamic Random Access Memory (DRAM) devices or similar types of memory devices.

Throughout this specification, multiple examples may implement components, operations, or structures described as a single example. Rather, a single example may be implemented as multiple examples. The structures and functionality presented as separate components in the example configuration may be implemented as a combined structure or component. Similarly, the structures and functionality presented as a single component may be implemented as separate components. These and other variations, modifications, additions, and improvements fall within the scope of the subject matter herein.

In view of the above disclosure, various examples are set forth below. It should be noted that in the disclosure of this application, one or more features of the examples, alone or in combination, should be considered.

Example 1 is a Solid State Drive (SSD) comprising a housing design and a Printed Circuit Board Assembly (PCBA) having a plurality of NAND (NAND) devices and a controller. The housing design includes: a top housing; a bottom housing coupled to the top housing to form a housing for the PCBA; and an adjustable intermediate structure coupled to the PCBA and positioned within the housing between the top housing and the bottom housing. The tunable intermediate structure includes a plurality of heat sinks for transferring heat from the NAND device and a controller heat sink for transferring heat from the controller.

In example 2, the subject matter of example 1 can optionally include wherein one or more of the plurality of heat sinks are thermally connected to the top housing; and the controller heat sink is thermally connected to the top housing.

In example 3, the subject matter of any of examples 1-2 can optionally include, wherein the plurality of heat sinks are detachable from the top housing; and the controller heat sink is thermally connected to the top housing.

In example 4, the subject matter of any of examples 1-3 can optionally include wherein the top housing includes a plurality of vents positioned at a front surface and a rear surface of the top housing, the plurality of vents configured to allow air to flow through an interior of the housing.

In example 5, the subject matter of any of examples 1-4 can optionally include wherein the top housing and the bottom housing are manufactured using a stamping process.

In example 6, the subject matter of any of examples 1-5 can optionally include wherein the exterior top surface of the top housing is free of a heat sink and is planar.

In example 7, the subject matter of any of examples 1 to 6 can optionally include wherein the adjustable intermediate structure is configured for different PCBAs by changing a position of at least one of the plurality of heat sinks.

In example 8, the subject matter of any of examples 1 to 7 can optionally include wherein the adjustable intermediate structure is configured for different PCBAs by varying at least one of the plurality of heat sinks.

Example 9 is a housing design that includes a top housing, a bottom housing, and an adjustable intermediate structure. The bottom housing is coupled to the top housing to form a housing for a Printed Circuit Board Assembly (PCBA) having a plurality of NAND devices and a controller. An adjustable intermediate structure is coupled to the PCBA and positioned within the housing between the top housing and the bottom housing. The tunable intermediate structure includes a plurality of heat sinks for transferring heat from the NAND device and a controller heat sink for transferring heat from the controller.

In example 10, the subject matter of example 9 can optionally include wherein one or more of the plurality of heat sinks are thermally connected to the top housing; and the controller heat sink is thermally connected to the top housing.

In example 11, the subject matter of any of examples 9 to 10 can optionally include, wherein the plurality of heat sinks are detached from the top housing; and the controller heat sink is thermally connected to the top housing.

In example 12, the subject matter of any of examples 9-11 can optionally include, wherein the top housing includes a plurality of vents positioned at a front surface and a rear surface of the top housing, the plurality of vents configured to allow air to flow through an interior of the housing.

In example 13, the subject matter of any of examples 9 to 12 can optionally include wherein the top housing and the bottom housing are manufactured using a stamping process.

In example 14, the subject matter of any of examples 9 to 13 can optionally include, wherein the exterior top surface of the top housing is free of a heat sink and is planar.

In example 15, the subject matter of any of examples 9 to 14 can optionally include wherein the adjustable intermediate structure is configured for different PCBAs by changing a position of at least one of the plurality of heat sinks.

In example 16, the subject matter of any of examples 9-15 can optionally include wherein the adjustable intermediate structure is configured for different PCBAs by varying at least one of the plurality of heat sinks.

Example 17 is a method of constructing a Solid State Drive (SSD) using a unified SSD housing design. The method comprises the following steps: obtaining a Printed Circuit Board Assembly (PCBA) having a plurality of NAND (NAND) devices and a controller; creating an adjustable intermediate structure, the creating an adjustable intermediate structure comprising thermally connecting a plurality of heat sinks to the NAND device and thermally connecting a controller heat sink to the controller; thermally connecting the controller heat sink to the top housing; and coupling the bottom housing to the top housing to form a housing for the PCBA.

In example 18, the subject matter of example 17 can optionally include thermally connecting one or more of the plurality of heat sinks to the top housing.

In example 19, the subject matter of any of examples 17-18 can optionally include wherein the top housing includes a plurality of vents positioned at the front surface and the rear surface configured to allow air to flow through the interior of the housing.

In example 20, the subject matter of any of examples 17 to 19 can optionally include using the same top housing design as the top housing and the same bottom housing design as the bottom housing for a different PCBA having at least one different NAND device or different controller or having a different location of at least one of the plurality of NAND devices or controllers by creating a new intermediate structure customized according to the different PCBA.

It is believed that the embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be used and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The detailed description is, therefore, not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

Furthermore, multiple examples may be provided for resources, operations, or structures described herein as a single example. In addition, boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and particular operations are illustrated in the context of specific illustrative configurations. Other allocations of functionality are contemplated and may fall within the scope of various embodiments of the present disclosure. Generally, structures and functionality presented as separate resources in an example configuration may be implemented as a combined structure or resource. Similarly, the structures and functionality presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within the scope of the embodiments of the disclosure as represented by the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. A solid state drive, comprising:

a printed circuit board assembly PCBA having a plurality of NAND devices and a controller; and

A housing design, comprising:

a top housing;

a bottom housing coupled to the top housing to form a housing for the PCBA; and

An adjustable intermediate structure coupled to the PCBA and positioned within the housing between the top housing and the bottom housing, the adjustable intermediate structure comprising a plurality of heat sinks for transferring heat from the NAND device, and a controller heat sink for transferring heat from the controller.

2. The solid state drive of claim 1, wherein:

one or more of the plurality of heat sinks are thermally connected to the top housing; and is also provided with

The controller heat sink is thermally coupled to the top housing.

3. The solid state drive of claim 1, wherein:

the plurality of heat sinks are removable from the top housing; and is also provided with

The controller heat sink is thermally coupled to the top housing.

4. The solid state drive of claim 1, wherein the top housing comprises a plurality of vents positioned in a front surface and a rear surface of the top housing, the plurality of vents configured to allow air to flow through an interior of the housing.

5. The solid state drive of claim 1, wherein the top housing and the bottom housing are manufactured using a stamping process.

6. The solid state drive of claim 1, wherein an exterior top surface of the top housing is free of heat sinks and is flat.

7. The solid state drive of claim 1, wherein the tunable inter-medium structure is configured for different PCBAs by changing a position of at least one heatsink of the plurality of heatsink.

8. The solid state drive of claim 1, wherein the tunable inter-medium structure is configured for different PCBAs by changing at least one heatsink of the plurality of heatsinks.

9. A housing design, comprising:

a top housing;

a bottom housing coupled to the top housing to form a housing for a printed circuit board assembly PCBA having a plurality of NAND devices and a controller; and

10. The housing design of claim 9, wherein:

The controller heat sink is thermally coupled to the top housing.

11. The housing design of claim 9, wherein:

The controller heat sink is thermally coupled to the top housing.

12. The housing design of claim 9, wherein the top housing comprises a plurality of vents positioned in a front surface and a rear surface of the top housing, the plurality of vents configured to allow air to flow through an interior of the housing.

13. The housing design of claim 9, wherein the top housing and the bottom housing are manufactured using a stamping process.

14. The housing design of claim 9, wherein an exterior top surface of the top housing is free of a heat sink and is flat.

15. The housing design of claim 9, wherein the adjustable inter-medium structure is configured for different PCBAs by changing a position of at least one of the plurality of heat sinks.

16. The housing design of claim 9, wherein the adjustable intervening structure is configured for different PCBAs by changing at least one of the plurality of heat sinks.

17. A method for constructing a solid state drive, the method comprising:

obtaining a printed circuit board assembly PCBA having a plurality of NAND devices and a controller;

creating an adjustable inter-medium structure, the creating the adjustable inter-medium structure comprising thermally connecting a plurality of heat sinks to the NAND device and thermally connecting a controller heat sink to the controller;

thermally connecting the controller heat sink to a top housing; and

A bottom housing is coupled to the top housing to form a housing for the PCBA.

18. The method as recited in claim 17, further comprising:

one or more of the plurality of heat sinks are thermally connected to the top housing.

19. The method of claim 17, wherein the top housing comprises a plurality of vents positioned in a front surface and a rear surface, the plurality of vents configured to allow air to flow through an interior of the housing.

20. The method of claim 17, further comprising using a same top housing design and a same bottom housing design as the top housing for a different PCBA having at least one different NAND device or a different controller or having a different location of at least one of the plurality of NAND devices or the controller by creating a new intermediate structure customized for the different PCBA.