CN117852211A - Method and device for separating parts, storage medium and electronic equipment - Google Patents

Abstract

The application provides a method and device for part separation, a storage medium and electronic equipment, wherein the method comprises the following steps: obtaining associated parameters for dividing the basic part, wherein the associated parameters comprise: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes; dividing the basic part based on the dividing surface to obtain a divided sub-part blank; and processing the sub-part primitive according to the part parameters to obtain the target sub-part. According to the embodiment of the application, the efficiency of part separation can be improved, and the time cost is reduced.

Description

Method and device for separating parts, storage medium and electronic equipment

Technical Field

The application relates to the technical field of part design, in particular to a method and device for part separation, a storage medium and electronic equipment.

Background

With the development of industrialization, product design (e.g., body design) is gradually biased toward intelligence and specialization. Part overlap is important in product design as a conventional part handling approach.

Currently, existing parts need to be split before they are lapped. The existing part-by-part mode is manually designed by professional designers according to system prompt information or experience, and the process is tedious and requires a lot of time.

Therefore, how to provide a technical solution of an efficient method for separating parts is a technical problem to be solved.

Disclosure of Invention

An object of some embodiments of the present application is to provide a method, an apparatus, a storage medium, and an electronic device for part separation, by which efficiency and accuracy of part separation can be improved, and time and labor costs can be reduced.

In a first aspect, some embodiments of the present application provide a method of part-splitting, comprising: obtaining associated parameters for dividing the basic part, wherein the associated parameters comprise: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes; dividing the basic part based on the dividing surface to obtain a divided sub-part blank; and processing the sub-part primitive according to the part parameters to obtain the target sub-part.

According to the method, after the divided association parameters are obtained, the basic part is divided through dividing, so that a divided sub-part blank is obtained, and then the divided sub-part blank is subjected to trimming treatment, so that a target part corresponding to the basic part is obtained. The embodiment of the application can reduce the complexity of the part dividing step, improve the efficiency and accuracy of part dividing, and reduce the time and labor cost.

In some embodiments, the acquiring the associated parameters that segment the base part includes: determining the dividing plane in response to an input operation instruction of a user; and responding to the operation instruction of the user, and obtaining the part parameters.

According to the method and the device, the related parameters of the dividing surface and the parts can be obtained through related operation instructions of the user, and customized dividing requirements are provided for the user.

In some embodiments, the acquiring the associated parameters that segment the base part includes: responding to an operation instruction of a user, and acquiring a dividing point on a basic surface of the basic part; and generating the segmentation surface related to the segmentation point, wherein the segmentation surface is a tangent plane intersected with the basic part.

According to the embodiment of the application, the segmentation surface can be automatically generated through the segmentation points on the basic part, and the efficiency is high.

In some embodiments, the dividing the base part based on the dividing plane to obtain a divided sub-part prototype includes: taking the material thickness of the target component part as an offset; shifting the basic part in a first direction according to the offset to obtain a shifting surface, wherein the first direction is related to the lap joint mode; the intersection line of the dividing surface and the offset surface and the set angle are used as the sweeping parameters to sweep to obtain a sweeping surface; and processing the sweeping surface to obtain the primitive split sub-part corresponding to the target split part.

According to the method and the device, the offset face is obtained after the base part is offset in the first direction after the offset is determined, and then the sweep face is obtained based on the relation between the segmentation face and the offset face, so that an initial segmentation sub-part prototype can be obtained.

In some embodiments, the processing the primitive split sub-part according to the part parameters to obtain the target split part includes: and trimming the cross section of the rudiment of the divided sub-parts, and generating the target divided part matched with the material type and the material thickness of the part.

According to the method and the device, the target part meeting the part parameter requirements is generated by processing the section of the part blank, and the efficiency is high.

In some embodiments, the base part is divided into at least two sub-parts, and the two sub-parts are the target sub-part; wherein the method further comprises: determining the lap joint mode of each sub-part in the two divided sub-parts; and overlapping the two sub-parts according to the overlapping mode to obtain the target part.

According to the method and the device, the target part is obtained by overlapping the sub-parts according to the determined overlapping mode, so that automatic overlapping treatment of the part can be achieved, and efficiency is high.

In a second aspect, some embodiments of the present application provide a part-in-part apparatus comprising: the parameter acquisition module is used for acquiring associated parameters for dividing the basic part, wherein the associated parameters comprise: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes; the initial segmentation module is used for carrying out segmentation processing on the basic part based on the segmentation surface to obtain a segmented sub-part prototype; and the component processing module is used for processing the split sub-part primitive according to the part parameters to obtain the target component part.

In some embodiments, the parameter acquisition module is configured to: determining the dividing plane in response to an input operation instruction of a user; and responding to the operation instruction of the user, and obtaining the part parameters.

In a third aspect, some embodiments of the present application provide a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs a method according to any of the embodiments of the first aspect.

In a fourth aspect, some embodiments of the present application provide an electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor, when executing the program, can implement a method according to any of the embodiments of the first aspect.

In a fifth aspect, some embodiments of the present application provide a computer program product comprising a computer program, wherein the computer program, when executed by a processor, is adapted to carry out the method according to any of the embodiments of the first aspect.

Drawings

In order to more clearly illustrate the technical solutions of some embodiments of the present application, the drawings that are required to be used in some embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort to a person having ordinary skill in the art.

FIG. 1 is a system diagram of a part kit provided in some embodiments of the present application;

FIG. 2 is one of the flow charts of the method of part-splitting provided in some embodiments of the present application;

FIG. 3 is a schematic illustration of a component location provided by some embodiments of the present application;

FIG. 4 is one of the offset direction schematics provided in some embodiments of the present application;

FIG. 5 is a second flowchart of a method for part separation provided in some embodiments of the present application;

FIG. 6 is a second schematic diagram of the offset direction provided in some embodiments of the present application;

FIG. 7 is a preview of output results provided by some embodiments of the present application;

FIG. 8 is a block diagram of an apparatus for component parts provided in some embodiments of the present application;

fig. 9 is a schematic diagram of an electronic device according to some embodiments of the present application.

Detailed Description

The technical solutions in some embodiments of the present application will be described below with reference to the drawings in some embodiments of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.

In the related art, the number of parts is generally reduced as much as possible in the early stage of the vehicle body design, but the split operation is required in the later analysis stage to meet the molding requirement. In the part dividing mode before part overlap joint, professional designers firstly need to select dividing positions step by step according to system prompts, offset each surface, trim surfaces, chamfer angles, trimming and other steps to obtain overlap joint surfaces, and the whole dividing process is tedious and takes a long time. Furthermore, with the development of industrialization, the vehicle body design needs to be more intelligent and specialized, and the time cost is also reduced to the greatest extent, and it is obvious that the existing part-by-part mode cannot meet the requirements of the intelligence, the specialization and the cost.

In view of this, some embodiments of the present application provide a method for dividing a part, where the method may divide a base part by related parameters of the division of the base part to obtain a divided sub-part primitive, and then process the divided sub-part primitive to obtain a divided part corresponding to a final base part. The process of the embodiment of the application can be realized through software processing, and the command of operating the three-dimensional software by a designer is integrated to a software layer, so that the professional designer is liberated; meanwhile, the intelligent operation mode reduces the requirement on personnel skills, avoids error occurrence, improves the efficiency and accuracy of part separation, and reduces the time and labor cost.

The overall composition of the system of part components provided in some embodiments of the present application is described below by way of example in conjunction with fig. 1.

As shown in fig. 1, some embodiments of the present application provide a system diagram of a part kit, the part kit system comprising: and a terminal 100. User 200 (which may be a professional designer or a non-professional designer) may select the base part to be segmented and some or all of the associated parameters on terminal 100. After acquiring the basic part and the associated parameters, the terminal 100 may divide the basic part by the associated parameters to obtain a primitive of a primitive divided sub-part obtained by initial division. Thereafter, the terminal 100 may perform processing operations such as automatic trimming, chamfering, expanding thickness, etc. on the rudiment of the sub-part to obtain the target sub-part of the base part.

In some embodiments of the present application, the terminal 100 may be a mobile terminal or a non-portable computer terminal, which is not specifically limited herein.

The implementation of the component parts performed by the terminal 100 provided in some embodiments of the present application is described below by way of example in conjunction with fig. 2.

Referring to fig. 2, fig. 2 is a flowchart of a method for separating parts according to some embodiments of the present application, where the method for separating parts at least includes:

s210, acquiring associated parameters for dividing the basic part, wherein the associated parameters comprise: the part parameters of the parting plane and the target part include part material type, material thickness and overlap mode.

For example, in some embodiments of the present application, the terminal 100 may need to determine the base part and associated parameters for the part that is to be fragmented (i.e., split). The user 200 may select a base PART at a PART storage location of the terminal 100, and input the base PART to the CATIA end of the terminal 100, where the format of the base PART is PART format. Alternatively, the terminal 100 may obtain the base part by reading the part model selected by the user 200. It can be understood that the acquisition mode of the basic part can be flexibly selected according to the actual application scene, and the embodiment of the application is not limited to this.

Specifically, in some embodiments of the present application, S210 may include: determining the dividing plane in response to an input operation instruction of a user; and responding to the operation instruction of the user, and obtaining the part parameters.

For example, in some embodiments of the present application, the user 200 may directly input the part position (as a specific example of the division plane) on the operation interface of the terminal 100. The material type and material thickness of the target component part is then selected at the "stock thickness and material input" interface. For example, the base part is divided into a part 1 and a part 2 (as a specific example of the target divided part), and at this time, the material type and the material thickness of the part 1, and the material type and the material thickness of the part 2 need to be set. The number of target component parts may be one or more, and is not particularly limited herein.

In some embodiments of the present application, S210 may further include: responding to an operation instruction of a user, and acquiring a dividing point on a basic surface of the basic part; and generating the segmentation surface related to the segmentation point, wherein the segmentation surface is a tangent plane intersected with the basic part.

For example, in some embodiments of the present application, the user 200 may input the positions of two reference points (i.e. the dividing points) in the "division position input" operation interface, and then the terminal 100 may make a tangent plane perpendicular to the base plane with a straight line connecting the two reference points as a reference line, so as to automatically generate the dividing plane. As shown in the schematic diagram of the position of the split in fig. 3, the base part in fig. 3 is 301, and the split surface is 302. The upper surface of base part 301 is base surface 303.

S220, carrying out segmentation processing on the basic part based on the segmentation surface to obtain a segmented sub-part prototype.

For example, in some embodiments of the present application, after determining the part location, the part command is automatically invoked, and the base part is processed to obtain a part primitive (as a specific example of a split sub-part primitive).

In some embodiments of the present application, S220 may include: taking the material thickness of the target component part as an offset; shifting the basic part in a first direction according to the offset to obtain a shifting surface, wherein the first direction is related to the lap joint mode; the intersection line of the dividing surface and the offset surface and the set angle are used as the sweeping parameters to sweep to obtain a sweeping surface; and processing the sweeping surface to obtain the primitive split sub-part corresponding to the target split part.

For example, in some embodiments of the present application, taking the above-described division of the base part into part 1 and part 2 as an example, the material thickness (e.g., 1.5 mm) of part 2 (as one specific example of a target part-in-part) is taken as the offset. As shown in fig. 4, the base member was offset by 1.5mm in the arrow direction (as a specific example of the first direction) to obtain an offset surface. And then reading an intersecting line of the dividing surface and the offset surface, and scanning according to a set angle (for example, 45 degrees downwards based on the offset surface), so as to obtain a scanning surface, wherein the scanning surface is an inclined surface. And trimming the inclined plane, the offset plane and the basic plane to obtain the split embryonic form of the part 2 after the split. It should be noted that, for different target component parts and overlapping modes, the first direction and the set angle (or referred to as the sweep angle) may be adaptively adjusted, and the embodiments of the present application are not limited thereto. The intersecting line of the dividing plane and the offset plane may be a straight line, or may be a non-intersecting line such as an arc line or a curve line.

S230, processing the split sub-part primitive according to the part parameters to obtain the target split part.

For example, in some embodiments of the present application, the PART blank is trimmed, chamfered, and expanded to give PART 2 in the PART format (as a specific example of a target PART).

In some embodiments of the present application, S230 may include: and trimming the cross section of the rudiment of the divided sub-parts, and generating the target divided part matched with the material type and the material thickness of the part.

For example, in some embodiments of the present application, the boundaries of the part blank are processed, sharp corners are eliminated while the weld edge space is ensured, and finally, a rounded corner expansion thickness process (for example, the rounded corner defaults to 5mm, and the thickness direction of the material can be set as required) is performed, so as to obtain the target part that meets the above-set material type and thickness of the part 2.

Thereafter, in some embodiments of the present application, the base part may also be subjected to the re-dividing process in the same manner as the above-described operation principle to obtain the part 1. In the dividing process, the offset of the base part is the material thickness (for example, 2.0 mm) corresponding to the part 1, and finally the part 1 is obtained through cutting, rounding and expanding the material thickness (as another specific example of the target part).

It will be appreciated that when there are a plurality of target component parts, the order in which the component parts are automatically generated is not particularly limited herein. That is, the order in which the above parts 1 and 2 are produced is not limited.

In some embodiments of the present application, the base part is divided into at least two sub-parts, where the two sub-parts are target sub-part parts, and the method for part sub-parts may further include: determining the lap joint mode of each sub-part in the two divided sub-parts; and overlapping the two sub-parts according to the overlapping mode to obtain the target part.

For example, in some embodiments of the present application, the overlapped target part is obtained by determining the manner of overlap of the base part divided part 1 and part 2 (as a specific example of two sub-parts) and then automatically overlapping.

The specific process of part splitting provided in some embodiments of the present application is described below by way of example in conjunction with fig. 5.

Referring to fig. 5, fig. 5 is a flowchart of a method for separating parts according to some embodiments of the present application.

The above-described process is exemplarily set forth below.

S510, acquiring associated parameters for dividing the basic part, wherein the associated parameters comprise: the part parameters of the parting plane and the target part include part material type, material thickness and overlap mode.

For example, as a specific example, define a raw part (i.e., base part) stock thickness (i.e., material thickness) of 1.0mm, define part 1 stock thickness of 1.2mm after the part is separated, and part 2 stock thickness of 1.5mm.

S520, taking the material thickness of the target component part as the offset.

For example, as a specific example, the part 2 is targeted to be a split part, and the stock thickness of the part 2 is taken as an offset, i.e., 1.5mm.

And S530, shifting the basic part in the first direction according to the offset to obtain a shifting surface.

For example, as a specific example, as shown in fig. 6, the original component is shifted by 1.5mm in the shift direction (as a specific example of the first direction) in which the arrow points, and a shift surface is obtained.

S540, the intersection line of the dividing surface and the offset surface and the set angle are taken as the sweeping parameters for sweeping to obtain a sweeping surface.

For example, as a specific example, the sweep angle (i.e., the set angle) defaults to 45 degrees, and the sweep direction defaults to the lower right of the offset surface, resulting in a sweep surface.

S550, the sweep surface is processed to obtain the sub-part primitive corresponding to the target sub-part.

For example, as a specific example, the sweep surface and the offset surface and the base surface are trimmed to obtain a prototype of the component 1 (i.e., a split sub-component prototype).

S560, trimming the cross section of the rudiment of the split sub-part, and generating a target split part matched with the material type and the material thickness of the part.

For example, as a specific example, the boundary treatment of the embryonic form of the split 1 ensures the weld edge space and eliminates sharp corners. And (3) carrying out rounding expansion and thickness treatment, wherein the rounding defaults to 5mm, and the direction of the thickness defaults downwards to obtain the part 2 with the thickness of 1.5mm.

Similarly, when the part 1 is obtained, the dividing position of the original part may be shifted to the direction of the part 2 by a preset value (for example, 5 mm), then the original part is divided and the sharp angle is removed according to the same processing operation as described above, and finally the part 1 is obtained by expanding the thickness of the material. Finally, outputting the part 1 and the part 2 shown in fig. 7 on an output result preview interface; the output is two PARTs in a PART format, and the output thickness and the output material correspond to the input thickness and the input material.

In addition, the fillet value can be flexibly set in the process of chamfering; parameters related to the lap joint mode (such as lap joint width) can be flexibly set. After the parts 1 and 2 are output, the data files related to the parts 1 and 2 are correspondingly stored, so that the related information of the parts 1 and 2 can be modified, adjusted, downloaded, exported and the like.

It should be noted that, the specific implementation process of S510 to S560 may refer to the method embodiments provided above, and in order to avoid repetition, a description is omitted here.

The method combines software and hardware, so that the parts are faster and more convenient in the design stage, the requirement of the design on the specialty is reduced, and the time cost and the personnel cost are saved. And the data designed by the software end can be modified in the software, so that the design is more reliable and convenient, the requirements of different users in the process of dividing the parts are easily met, and the adaptability is wider.

Referring to fig. 8, fig. 8 illustrates a block diagram of a component-divided apparatus provided in some embodiments of the present application. It should be understood that the apparatus for separating parts corresponds to the above method embodiments, and can perform the steps related to the above method embodiments, and specific functions of the apparatus for separating parts may be referred to the above description, and detailed descriptions are omitted herein as appropriate to avoid redundancy.

The apparatus of the part kit of fig. 8 includes at least one software functional module that can be stored in a memory in the form of software or firmware or cured in the apparatus of the part kit, the apparatus of the part kit comprising: the parameter obtaining module 810 is configured to obtain associated parameters for dividing the base part, where the associated parameters include: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes; an initial segmentation module 820, configured to perform segmentation processing on the base part based on the segmentation surface, so as to obtain a segmented sub-part prototype; and the component processing module 830 is configured to process the primitive split sub-part according to the part parameter to obtain the target component part.

In some embodiments of the present application, the parameter obtaining module 810 is configured to determine the segmentation plane in response to an input operation instruction of a user; and responding to the operation instruction of the user, and obtaining the part parameters.

In some embodiments of the present application, a parameter obtaining module 810 is configured to obtain a segmentation point on a base surface of the base part in response to an operation instruction of a user; and generating the segmentation surface related to the segmentation point, wherein the segmentation surface is a tangent plane intersected with the basic part.

In some embodiments of the present application, an initial segmentation module 820 is configured to take the material thickness of the target piece part as an offset; shifting the basic part in a first direction according to the offset to obtain a shifting surface, wherein the first direction is related to the lap joint mode; the intersection line of the dividing surface and the offset surface and the set angle are used as the sweeping parameters to sweep to obtain a sweeping surface; and processing the sweeping surface to obtain the primitive split sub-part corresponding to the target split part.

In some embodiments of the present application, a split processing module 830 is configured to trim a cross-section of the segmented sub-part blank and generate the target split part that matches the part material type and the material thickness.

In some embodiments of the present application, the base part is divided into at least two sub-parts, and the two sub-parts are the target split parts; the device for dividing the parts further comprises a lap joint module (not shown in the figure) for determining the lap joint mode between each of the two divided sub-parts; and overlapping the two sub-parts according to the overlapping mode to obtain the target part.

It will be clear to those skilled in the art that, for convenience and brevity of description, reference may be made to the corresponding procedure in the foregoing method for the specific working procedure of the apparatus described above, and this will not be repeated here.

Some embodiments of the present application also provide a computer readable storage medium having stored thereon a computer program, which when executed by a processor, may implement operations of the method corresponding to any of the above-described methods provided by the above-described embodiments.

Some embodiments of the present application further provide a computer program product, where the computer program product includes a computer program, where the computer program when executed by a processor may implement operations of a method corresponding to any of the foregoing methods provided by the foregoing embodiments.

As shown in fig. 9, some embodiments of the present application provide an electronic device 900, the electronic device 900 comprising: memory 910, processor 920, and a computer program stored on memory 910 and executable on processor 920, wherein processor 920 may implement a method as in any of the embodiments described above when the program is read from memory 910 and executed by processor 920 via bus 930.

The processor 920 may process the digital signals and may include various computing structures. Such as a complex instruction set computer architecture, a reduced instruction set computer architecture, or an architecture that implements a combination of instruction sets. In some examples, the processor 920 may be a microprocessor.

Memory 910 may be used for storing instructions to be executed by processor 920 or data related to execution of instructions. Such instructions and/or data may include code to implement some or all of the functions of one or more modules described in embodiments of the present application. The processor 920 of embodiments of the present disclosure may be configured to execute instructions in the memory 910 to implement the methods shown above. Memory 910 includes dynamic random access memory, static random access memory, flash memory, optical memory, or other memory known to those skilled in the art.

The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Claims (10)

1. A method of component-parts, comprising:

obtaining associated parameters for dividing the basic part, wherein the associated parameters comprise: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes;

dividing the basic part based on the dividing surface to obtain a divided sub-part blank;

and processing the sub-part primitive according to the part parameters to obtain the target sub-part.

2. The method of claim 1, wherein the obtaining the associated parameters that segment the base part comprises:

determining the dividing plane in response to an input operation instruction of a user;

and responding to the operation instruction of the user, and obtaining the part parameters.

3. The method according to claim 1 or 2, wherein the obtaining of the associated parameters for segmenting the base part comprises:

responding to an operation instruction of a user, and acquiring a dividing point on a basic surface of the basic part;

and generating the segmentation surface related to the segmentation point, wherein the segmentation surface is a tangent plane intersected with the basic part.

4. The method according to claim 1 or 2, wherein the dividing the base part based on the dividing plane to obtain a divided sub-part embryonic form includes:

taking the material thickness of the target component part as an offset;

shifting the basic part in a first direction according to the offset to obtain a shifting surface, wherein the first direction is related to the lap joint mode;

the intersection line of the dividing surface and the offset surface and the set angle are used as the sweeping parameters to sweep to obtain a sweeping surface;

and processing the sweeping surface to obtain the primitive split sub-part corresponding to the target split part.

5. The method according to claim 1 or 2, wherein said processing said segmented sub-part blank according to said part parameters to obtain said target segmented part comprises:

and trimming the cross section of the rudiment of the divided sub-parts, and generating the target divided part matched with the material type and the material thickness of the part.

6. The method of claim 1 or 2, wherein the base part is divided into at least two sub-parts, the two sub-parts being the target sub-part; wherein the method further comprises:

determining the lap joint mode of each sub-part in the two sub-parts;

and overlapping the two sub-parts according to the overlapping mode to obtain the target part.

7. A device for separating parts, comprising:

the parameter acquisition module is used for acquiring associated parameters for dividing the basic part, wherein the associated parameters comprise: part parameters of the dividing surface and the target part, wherein the part parameters comprise part material types, material thicknesses and lap joint modes;

the initial segmentation module is used for carrying out segmentation processing on the basic part based on the segmentation surface to obtain a segmented sub-part prototype;

and the component processing module is used for processing the split sub-part primitive according to the part parameters to obtain the target component part.

8. The apparatus of claim 7, wherein the parameter acquisition module is to:

determining the dividing plane in response to an input operation instruction of a user;

and responding to the operation instruction of the user, and obtaining the part parameters.

9. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon a computer program, wherein the computer program when run by a processor performs the method according to any of claims 1-6.

10. An electronic device comprising a memory, a processor, and a computer program stored on the memory and running on the processor, wherein the computer program when run by the processor performs the method of any one of claims 1-6.