CN117844250A - Organic silicon heat conduction wave-absorbing material and preparation method thereof - Google Patents
Organic silicon heat conduction wave-absorbing material and preparation method thereof Download PDFInfo
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- 239000011358 absorbing material Substances 0.000 title claims abstract description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims description 13
- 239000000843 powder Substances 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 32
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 21
- 239000011159 matrix material Substances 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 239000011258 core-shell material Substances 0.000 claims abstract description 15
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 52
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 52
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 52
- -1 polydimethylsiloxane Polymers 0.000 claims description 47
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 30
- 238000002156 mixing Methods 0.000 claims description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 239000001257 hydrogen Substances 0.000 claims description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000011863 silicon-based powder Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000003490 calendering Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000011049 filling Methods 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 4
- 229920002545 silicone oil Polymers 0.000 abstract description 4
- 239000000945 filler Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002521 macromolecule Polymers 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000002464 physical blending Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The organic silicon heat-conducting wave-absorbing material comprises a high polymer matrix material and heat-conducting wave-absorbing powder materials, wherein the heat-conducting wave-absorbing powder materials are uniformly dispersed among the high polymer matrix material; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the carbon-based material accounts for 60-90% of the heat-conducting wave-absorbing powder material in parts by mass, and the silicon carbide accounts for 10-40%. The powder with the core-shell structure taking the carbon-based material as the core and the silicon carbide as the shell is beneficial to improving the compatibility of the powder and the silicone oil and improving the filling quantity of the powder, thereby improving the dual functions of heat conduction and wave absorption.
Description
Technical Field
The invention belongs to the field of wave-absorbing materials, and particularly relates to a heat-conducting wave-absorbing material and a preparation method thereof.
Background
Along with the improvement of power and integration level of electronic equipment, the power density in the system is higher and higher, a large amount of waste heat is generated in the running process of the equipment, and the heat conduction silicone rubber is generally required to conduct redundant heat to the external low-temperature environment, so that the overheating of devices is avoided. Meanwhile, the problems of electromagnetic pollution, information leakage and the like of electronic equipment are increasingly serious, and a large number of electronic components can emit electromagnetic radiation to the outside when working, so that electromagnetic interference is caused to surrounding equipment. Because the internal space of the electronic equipment is narrow, the heat conduction wave-absorbing material with heat conduction and wave-absorbing functions becomes the most effective means for solving the problems of high-efficiency heat dissipation and electromagnetic compatibility of the electronic equipment.
Aiming at the problems, products such as an organosilicon heat-conducting wave-absorbing gasket, a heat-conducting wave-absorbing coating and the like appear on the market, and the heat-dissipating capability of electronic equipment is expected to be enhanced, and meanwhile, electromagnetic interference is reduced. However, the traditional organic silicon heat conduction wave-absorbing material is to add heat conduction filler and wave-absorbing agent into organic silicon matrix to realize the dual functions of heat conduction and electromagnetic wave absorption. Since the filler is filled with a polymer matrix such as rubber, the amount of the heat conductive filler and the amount of the wave absorbing filler are in a relationship of the heat conductive filler and the wave absorbing filler, and the performance is also the same, so that the cooperative improvement of the two performances is difficult to realize.
The carbon-based material generally has better heat conduction and electric conduction performance, is a filling material for preparing a heat conduction wave-absorbing material with good heat conduction, but the carbon-based material has poor compatibility with organic silicon, has small filling quantity, and is difficult to obtain ideal heat conduction and wave-absorbing dual functions. In addition, although the carbon-based material has good electrical conductivity, the surface of the carbon-based material is smooth, so that good surface impedance matching is difficult to obtain, and the application of the carbon-based material on the heat-conducting and wave-absorbing material is limited.
Disclosure of Invention
The invention aims to solve the technical problems that the compatibility of carbon-based materials and organic silicon is poor, and good surface impedance matching is difficult to obtain, and the defects in the background art are overcome.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the organic silicon heat conduction wave-absorbing material is characterized by comprising a high polymer matrix material and heat conduction wave-absorbing powder materials, wherein the heat conduction wave-absorbing powder materials are uniformly dispersed among the high polymer matrix material; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the carbon-based material accounts for 60-90% of the heat-conducting wave-absorbing powder material in parts by mass, and the silicon carbide accounts for 10-40%.
The silicon carbide shell improves the impedance matching of the interface of the carbon-based material, improves the absorption of the material to electromagnetic waves, and is beneficial to guiding more electromagnetic waves to enter the interior of the material for loss.
Preferably, the polymer matrix material comprises polydimethylsiloxane and/or vinyl-terminated polydimethylsiloxane, and the carbon-based material comprises one or more of graphite, graphite oxide, graphene, carbon nanotubes or carbon fibers.
Preferably, the heat-conducting wave-absorbing powder material comprises a spherical shape, a flaky shape and a fibrous shape, wherein the mass ratio of the spherical shape, the flaky shape and the fibrous shape is 100: (20-60) and (10-40).
The carbon-based materials with different forms determine the heat conduction wave-absorbing powder with different forms, and the compounding of the powder with different forms can increase the addition amount of the filler, thereby being beneficial to forming a more perfect heat conduction channel and improving the heat dissipation performance; and the scattering and loss of electromagnetic waves in the material can be increased, and the wave absorbing performance is improved.
Preferably, the formula of the organic silicon heat conduction wave-absorbing material comprises the following raw materials in parts by weight:
heat conducting wave absorbing powder: 50-800 parts;
polydimethyl siloxane: 40-80 parts;
vinyl terminated polydimethyl siloxane: 40-80 parts;
hydrogen-based polydimethyl siloxane: 0.5 to 20 parts.
The polydimethylsiloxane and the vinyl-terminated polydimethylsiloxane are high polymer matrix materials, and the heat conduction wave-absorbing powder is uniformly dispersed in the polymer matrix materials, so that the heat conduction and wave-absorbing functions are better exerted. The polydimethylsiloxane does not participate in the curing reaction, so that the self-adhesion of the surface of the heat conduction wave-absorbing material is improved, the surface thermal resistance is reduced, and the vinyl-terminated polydimethylsiloxane can react with the crosslinking agent hydrogen-based polydimethylsiloxane to form a crosslinking network, so that the material is endowed with good elasticity and toughness.
Preferably, the viscosity of the polydimethylsiloxane is 1000cps to 100000cps, the viscosity of the vinyl-terminated polydimethylsiloxane is 100cps to 50000cps, the vinyl content is 0.05 to 1.5% of the mass fraction of the vinyl-terminated polydimethylsiloxane, and the total content of the polydimethylsiloxane and the vinyl-terminated polydimethylsiloxane is 100 parts.
Preferably, the hydrogen content of the end group polydimethylsiloxane is 0.01-0.5% of the mass fraction of the hydrogen group polydimethylsiloxane, and the molar ratio Vi of vinyl groups to silicon hydrogen groups in the formula of the organosilicon heat-conducting wave-absorbing material is as follows: si-h=1: (0.3-1.5).
The silicone heat-conducting and wave-absorbing material of claim 4, wherein the formulation of the silicone heat-conducting and wave-absorbing material further comprises a silane coupling agent, a platinum complex catalyst, and an inhibitor; the silane coupling agent is used in an amount of 0.2-2 parts, the active platinum concentration in the platinum complex catalyst is 3000-5000 ppm, the ethynyl cyclohexanol is used in an amount of 0.1-1 part, and the ethynyl cyclohexanol is used in an amount of 0.01-0.5 part.
The silane coupling agent is used for modifying the surface of the heat-conducting wave-absorbing powder and increasing the compatibility of the filler and the silicone oil;
more preferably, the inhibitor comprises butynyl cyclohexanol and/or ethynyl cyclohexanol.
Under the same technical conception, the invention also provides a preparation method of the organic silicon heat conduction wave-absorbing material, which is characterized by comprising the following steps:
s1: mixing and stirring the raw materials of the high polymer matrix material and the heat-conducting wave-absorbing powder material;
s2: adding hydrogen-based polydimethylsiloxane and a catalyst, and continuously mixing and stirring under vacuum condition;
s3: discharging, calendaring, vulcanizing at high temperature to obtain the organosilicon heat-conducting wave-absorbing material.
Preferably, the preparation method of the heat-conducting wave-absorbing powder material comprises the following steps:
s1: placing the carbon-based material and silicon dioxide or silicon powder in a mixer according to a proportion and uniformly mixing;
s2: and (3) placing the mixture into a high-temperature furnace, heating to 1200-1600 ℃ under vacuum condition, fully reacting for 1-8 h, and cooling to obtain the heat-conducting wave-absorbing powder material with the core-shell structure.
Preferably, the mixing time in the step S1 is 1-3 h, the mixing temperature is 20-40 ℃, the mixing rotating speed is 30-80 r/min, and the dispersing rotating speed is 60-120 r/min; the vacuum degree in S2 is more than or equal to 0.09MPa, the time is 1-2 h, and the mixing rotating speed is 20-60 r/min; and the baking temperature in the step S3 is 100-140 ℃ and the time is 6-20 min.
The mixing and dispersing speed is not too fast, so that the structural damage of the heat-conducting wave-absorbing powder is prevented.
Compared with the prior art, the invention has the beneficial effects that:
(1) The powder with the core-shell structure taking the carbon-based material as the core and the silicon carbide as the shell is beneficial to improving the compatibility of the powder and the silicone oil and improving the filling quantity of the powder, thereby improving the dual functions of heat conduction and wave absorption.
(2) After the silicon carbide shell is coated on the surface of the carbon-based material, the insulating property of the carbon-based material is effectively improved, the impedance matching of a material interface is improved, and the absorption and the guiding of more electromagnetic waves into the powder body are facilitated to be lost.
(3) The silicon carbide shells have better wave absorption performance and heat conduction performance, the powder of the core-shell structures with different forms is uniformly dispersed in the silicone oil macromolecules to be mutually stacked, and the silicon carbide shells are mutually contacted, so that a more perfect heat conduction channel is formed, and the heat conduction is improved; and the scattering and loss of electromagnetic waves in the material can be increased, and the wave absorbing performance is improved.
Detailed Description
The present invention will be described more fully hereinafter with reference to the preferred embodiments for the purpose of facilitating understanding of the present invention, but the scope of the present invention is not limited to the following specific embodiments.
Unless defined otherwise, all technical and scientific terms used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the scope of the present invention.
Unless otherwise specifically indicated, the various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or may be prepared by existing methods.
Example 1
The organic silicon heat-conducting wave-absorbing material comprises a high polymer matrix material and heat-conducting wave-absorbing powder materials, wherein the heat-conducting wave-absorbing powder materials are uniformly dispersed among the high polymer matrix material; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the carbon-based material accounts for 80% and the silicon carbide accounts for 20% in parts by mass.
The raw materials and the proportions thereof are as follows:
60 parts of 2000cps polydimethylsiloxane; 40 parts of 500cps terminal vinyl polydimethylsiloxane; 4 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.1 percent; the mass ratio of the spherical, flaky and fibrous powder is 100:40: 300 parts of heat-conducting wave-absorbing powder; the method comprises the steps of carrying out a first treatment on the surface of the 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst, wherein the concentration of active platinum in the platinum complex catalyst is 5000ppm; butynylcyclohexanol 0.02 parts.
The preparation method of the organic silicon heat conduction wave-absorbing material comprises the following steps:
the preparation method of the heat conduction wave-absorbing split comprises the following steps:
(1) Placing the carbon-based material and silicon dioxide or silicon powder in a mixer according to a proportion and uniformly mixing;
(2) And (3) placing the mixture in a high-temperature furnace, heating to 1300 ℃ under vacuum condition, fully reacting the carbon-based material with silicon dioxide or silicon powder for 6 hours, and cooling to obtain powder with a core-shell structure.
S1, placing polydimethylsiloxane, vinyl-terminated polydimethylsiloxane, heat-conducting wave-absorbing powder, a silane coupling agent and ethynyl cyclohexanol in a double planetary mixer according to a proportion, wherein the mixing speed is 50r/min, the dispersing speed is 80r/min, and the mixing time is 2h;
s2, cooling to normal temperature, adding hydrogen-based polydimethylsiloxane and platinum complex catalyst, vacuumizing and continuously mixing, wherein the vacuum degree is 0.1MPa, the time is 1h, and the mixing rotating speed is 40r/min;
and S3, discharging and calendaring to 2mm, vulcanizing by a baking oven at 120 ℃ for 12min to obtain the organosilicon heat-conducting wave-absorbing material.
Example 2
The organic silicon heat-conducting wave-absorbing material comprises a high polymer matrix material and heat-conducting wave-absorbing powder materials, wherein the heat-conducting wave-absorbing powder materials are uniformly dispersed among the high polymer matrix material; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the heat-conducting wave-absorbing powder material comprises 70% of the carbon-based material and 30% of the silicon carbide in parts by mass.
The raw materials and the proportions thereof are as follows:
60 parts of 2000cps polydimethylsiloxane; 40 parts of 500cps terminal vinyl polydimethylsiloxane; 4 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.1 percent; the mass ratio of the spherical, flaky and fibrous powder is 100:40: 600 parts of heat-conducting wave-absorbing powder; 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst; butynylcyclohexanol 0.02 parts.
A method for preparing an organosilicon heat-conducting wave-absorbing material, which is the same as in example 1.
Example 3
An organosilicon heat-conducting wave-absorbing material, the organosilicon heat-conducting wave-absorbing material includes macromolecule matrix material and heat-conducting wave-absorbing powder material, the heat-conducting wave-absorbing powder material is dispersed among macromolecule matrix material evenly; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the heat-conducting wave-absorbing powder material comprises 60% of carbon-based material and 40% of silicon carbide in parts by mass.
The raw materials and the proportions thereof are as follows:
10000cps of polydimethylsiloxane 40 parts; 60 parts of 200cps end vinyl polydimethylsiloxane; 8 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.2 percent; the mass ratio of the spherical, flaky and fibrous powder is 100:60:10 parts of heat-conducting wave-absorbing powder; 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst; butynylcyclohexanol 0.02 parts.
A method for preparing an organosilicon heat-conducting wave-absorbing material, which is the same as in example 1.
Comparative example 1 spherical Heat conductive wave absorbing powder
60 parts of 2000cps polydimethylsiloxane; 40 parts of 500cps terminal vinyl polydimethylsiloxane; 4 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.1 percent; 300 parts of spherical heat-conducting wave-absorbing powder; 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst; butynylcyclohexanol 0.02 parts.
The preparation method is the same as in example 1.
Comparative example 2 physical blending of carbon-based materials and silicon carbide
60 parts of 2000cps polydimethylsiloxane; 40 parts of 500cps terminal vinyl polydimethylsiloxane; 4 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.1 percent; 600 parts of heat-conducting wave-absorbing powder formed by physically blending graphite and silicon carbide powder; 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst; butynylcyclohexanol 0.02 parts.
The preparation method is the same as in example 1.
Comparative example 3 physical blending of alumina and carbonyl iron powder
10000cps of polydimethylsiloxane 40 parts; 60 parts of 200cps end vinyl polydimethylsiloxane; 8 parts of hydrogen-based polydimethylsiloxane with the hydrogen content of 0.2 percent; 800 parts of heat-conducting wave-absorbing powder formed by physically blending aluminum oxide and carbonyl iron powder; 1 part of KH560 coupling agent; 0.1 part of platinum complex catalyst; butynylcyclohexanol 0.02 parts.
The preparation method is the same as in example 1.
Table 1 results of testing examples, comparative examples
It can be seen from the table that examples 1 to 3 are all implemented according to the characteristics of the technical scheme, and the prepared single-component heat-conducting wave-absorbing material has better heat-conducting and wave-absorbing properties, and the properties are different according to the different adding amounts of the heat-conducting wave-absorbing powder, wherein the heat-conducting coefficients are all above 3.5W/m.K, and the single-component heat-conducting wave-absorbing material has good heat-conducting properties. The electromagnetic wave reflectivity is more than 26dB, and the effective absorption width is more than 2.6GHz. In terms of technological performance, the examples 1-3 have lower hardness and good rebound resilience, have certain self-viscosity, are convenient to operate, and are not easy to cause bad phenomena such as oil seepage and the like at high and low temperatures in practical application. Compared with the embodiment 1, the comparative example 1 adopts spherical heat-conducting wave-absorbing powder, the electromagnetic wave reflectivity is reduced from-26 dB to-22 dB in performance, the effective absorption width is reduced from 2.8GHz to 2.1GHz, and the heat-conducting wave-absorbing filler mixing of different forms can improve the scattering and absorption of electromagnetic waves and improve the wave-absorbing performance. Compared with the embodiment 2, the wave-absorbing filler adopts the physical blending of graphite powder and silicon carbide powder, but not the technical scheme requirement and the carbon-based material and silicon carbide core-shell structure powder, and under the condition that the total filler consumption is equal, the product hardness is improved from 40 to 86, because the content of hydroxyl groups on the surface of the graphite is too much and the compatibility of the silicon oil is poor, the hardness of the prepared product is increased, the elasticity is reduced, and the powder with a core-shell structure is favorable for improving the compatibility of the powder to the silicon oil and improving the filling amount of the powder; the electromagnetic wave reflectivity is reduced from-28 dB to-19 dB, the effective absorption width is reduced from 2.6GHz to 2.0GHz, the wave absorption performance is obviously reduced, the graphite and silicon carbide core-shell structure powder is indicated, the impedance matching of a material interface is improved, and the absorption and guiding of more electromagnetic waves are facilitated, and the loss is carried out when more electromagnetic waves enter the material. Compared with the embodiment 3, the wave-absorbing filler is powder formed by physically blending common alumina and carbonyl iron powder, and under the condition that the total filler consumption is equal, the heat conductivity coefficient and the wave-absorbing performance are greatly different, which indicates that the alumina and the carbonyl iron powder are mutually influenced, the carbonyl iron powder cuts off the heat conduction path of the alumina, the alumina influences the wave-absorbing performance of the carbonyl iron powder, and the heat conduction performance and the wave-absorbing performance cannot be cooperated.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The organic silicon heat conduction wave-absorbing material is characterized by comprising a high polymer matrix material and heat conduction wave-absorbing powder materials, wherein the heat conduction wave-absorbing powder materials are uniformly dispersed among the high polymer matrix material; the heat-conducting wave-absorbing powder material is of a core-shell structure, a carbon-based material is used as an inner core, silicon carbide is used as an outer shell, and the carbon-based material accounts for 60-90% of the heat-conducting wave-absorbing powder material in parts by mass, and the silicon carbide accounts for 10-40%.
2. The silicone heat conducting and wave absorbing material of claim 1, wherein the polymer matrix material comprises polydimethylsiloxane and/or vinyl terminated polydimethylsiloxane, and the carbon-based material comprises one or more of graphite, graphite oxide, graphene, carbon nanotubes, or carbon fibers.
3. The silicone heat-conducting wave-absorbing material of claim 1, wherein the heat-conducting wave-absorbing powder material comprises a morphology of spheres, flakes and fibers, wherein the mass ratio of spheres, flakes and fibers is 100: 20-60: 10 to 40 percent.
4. The organic silicon heat-conducting wave-absorbing material as claimed in any one of claims 1 to 3, wherein the formula of the organic silicon heat-conducting wave-absorbing material comprises the following raw materials in parts by weight:
heat conducting wave absorbing powder: 50-800 parts;
polydimethyl siloxane: 40-80 parts;
vinyl terminated polydimethyl siloxane: 40-80 parts;
hydrogen-based polydimethyl siloxane: 0.5 to 20 parts.
5. The silicone heat conductive wave absorbing material of claim 4, wherein the polydimethylsiloxane viscosity is 1000cps to 100000cps, the vinyl terminated polydimethylsiloxane viscosity is 100cps to 50000cps, the vinyl content is 0.05 to 1.5% of the mass fraction of the vinyl terminated polydimethylsiloxane, and the total of the polydimethylsiloxane and the vinyl terminated polydimethylsiloxane is 100 parts.
6. The organic silicon heat-conducting wave-absorbing material as claimed in claim 4, wherein the hydrogen content of the hydrogen-based polydimethylsiloxane is 0.01-0.5% of the mass fraction of the hydrogen-based polydimethylsiloxane, and the molar ratio of vinyl groups to silicon hydrogen groups in the formula of the organic silicon heat-conducting wave-absorbing material is Vi: si-h=1: 0.3 to 1.5.
7. The silicone heat-conducting and wave-absorbing material of claim 4, wherein the formulation of the silicone heat-conducting and wave-absorbing material further comprises a silane coupling agent, a platinum complex catalyst, and an inhibitor; the silane coupling agent is used in an amount of 0.2-2 parts, the active platinum concentration in the platinum complex catalyst is 3000-5000 ppm, the ethynyl cyclohexanol is used in an amount of 0.1-1 part, and the ethynyl cyclohexanol is used in an amount of 0.01-0.5 part.
8. A method for preparing the organic silicon heat conduction wave-absorbing material as claimed in any one of claims 1 to 7, comprising the following steps:
s1: mixing and stirring the raw materials of the high polymer matrix material and the heat-conducting wave-absorbing powder material;
s2: adding hydrogen-based polydimethylsiloxane and a catalyst, and continuously mixing and stirring under vacuum condition;
s3: discharging, calendaring, vulcanizing at high temperature to obtain the organosilicon heat-conducting wave-absorbing material.
9. The preparation method of claim 8, wherein the preparation method of the heat-conducting wave-absorbing powder material comprises the following steps:
s1: placing the carbon-based material and silicon dioxide or silicon powder in a mixer according to a proportion and uniformly mixing;
s2: and (3) placing the mixture into a high-temperature furnace, heating to 1200-1600 ℃ under vacuum condition, fully reacting for 1-8 h, and cooling to obtain the heat-conducting wave-absorbing powder material with the core-shell structure.
10. The preparation method according to claim 8, wherein the mixing time in the step S1 is 1-3 hours, the mixing temperature is 20-40 ℃, the mixing rotating speed is 30-80 r/min, and the dispersing rotating speed is 60-120 r/min; the vacuum degree in S2 is more than or equal to 0.09MPa, the time is 1-2 h, and the mixing rotating speed is 20-60 r/min; and the baking temperature in the step S3 is 100-140 ℃ and the time is 6-20 min.
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