CN117836361A - Curable composition - Google Patents
Curable composition Download PDFInfo
- Publication number
- CN117836361A CN117836361A CN202280053742.3A CN202280053742A CN117836361A CN 117836361 A CN117836361 A CN 117836361A CN 202280053742 A CN202280053742 A CN 202280053742A CN 117836361 A CN117836361 A CN 117836361A
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- CN
- China
- Prior art keywords
- curable composition
- change material
- phase change
- weight
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- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 206
- 238000000034 method Methods 0.000 claims abstract description 52
- 239000012782 phase change material Substances 0.000 claims description 132
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- HOWGUJZVBDQJKV-UHFFFAOYSA-N docosane Chemical compound CCCCCCCCCCCCCCCCCCCCCC HOWGUJZVBDQJKV-UHFFFAOYSA-N 0.000 claims description 30
- 238000002844 melting Methods 0.000 claims description 28
- 230000008018 melting Effects 0.000 claims description 28
- 238000002156 mixing Methods 0.000 claims description 28
- 229920002050 silicone resin Polymers 0.000 claims description 22
- 239000012188 paraffin wax Substances 0.000 claims description 19
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 230000001747 exhibiting effect Effects 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- FNAZRRHPUDJQCJ-UHFFFAOYSA-N henicosane Chemical compound CCCCCCCCCCCCCCCCCCCCC FNAZRRHPUDJQCJ-UHFFFAOYSA-N 0.000 claims description 6
- BJQWYEJQWHSSCJ-UHFFFAOYSA-N heptacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCC BJQWYEJQWHSSCJ-UHFFFAOYSA-N 0.000 claims description 6
- HMSWAIKSFDFLKN-UHFFFAOYSA-N hexacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC HMSWAIKSFDFLKN-UHFFFAOYSA-N 0.000 claims description 6
- LQERIDTXQFOHKA-UHFFFAOYSA-N nonadecane Chemical compound CCCCCCCCCCCCCCCCCCC LQERIDTXQFOHKA-UHFFFAOYSA-N 0.000 claims description 6
- YKNWIILGEFFOPE-UHFFFAOYSA-N pentacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC YKNWIILGEFFOPE-UHFFFAOYSA-N 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- FIGVVZUWCLSUEI-UHFFFAOYSA-N tricosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCC FIGVVZUWCLSUEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 4
- 239000000194 fatty acid Substances 0.000 claims description 4
- 229930195729 fatty acid Natural products 0.000 claims description 4
- 150000004665 fatty acids Chemical class 0.000 claims description 4
- POOSGDOYLQNASK-UHFFFAOYSA-N tetracosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC POOSGDOYLQNASK-UHFFFAOYSA-N 0.000 claims description 4
- 239000005639 Lauric acid Substances 0.000 claims description 3
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- TWJNQYPJQDRXPH-UHFFFAOYSA-N 2-cyanobenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1C#N TWJNQYPJQDRXPH-UHFFFAOYSA-N 0.000 claims description 2
- 229910002706 AlOOH Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 235000021360 Myristic acid Nutrition 0.000 claims description 2
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Natural products CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910001593 boehmite Inorganic materials 0.000 claims description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 2
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 235000019809 paraffin wax Nutrition 0.000 claims 2
- 235000019271 petrolatum Nutrition 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 58
- 230000008569 process Effects 0.000 abstract description 16
- 238000004880 explosion Methods 0.000 abstract description 12
- 230000002159 abnormal effect Effects 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 description 101
- 238000001723 curing Methods 0.000 description 73
- -1 heptenyl Chemical group 0.000 description 33
- 239000002245 particle Substances 0.000 description 33
- 239000000945 filler Substances 0.000 description 32
- 230000008859 change Effects 0.000 description 23
- 238000002360 preparation method Methods 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 15
- 239000012071 phase Substances 0.000 description 14
- 230000007704 transition Effects 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 13
- 229920005862 polyol Polymers 0.000 description 13
- 150000003077 polyols Chemical class 0.000 description 13
- 238000004132 cross linking Methods 0.000 description 12
- 238000004382 potting Methods 0.000 description 12
- 125000003342 alkenyl group Chemical group 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000113 differential scanning calorimetry Methods 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000013329 compounding Methods 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 229910004283 SiO 4 Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920005573 silicon-containing polymer Polymers 0.000 description 4
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical class Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
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- 238000007542 hardness measurement Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NDJKXXJCMXVBJW-UHFFFAOYSA-N heptadecane Chemical compound CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
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- 230000007062 hydrolysis Effects 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- IGGUPRCHHJZPBS-UHFFFAOYSA-N nonacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCC IGGUPRCHHJZPBS-UHFFFAOYSA-N 0.000 description 2
- ZYURHZPYMFLWSH-UHFFFAOYSA-N octacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC ZYURHZPYMFLWSH-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
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- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
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- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JXTPJDDICSTXJX-UHFFFAOYSA-N triacontane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC JXTPJDDICSTXJX-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
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- 235000021355 Stearic acid Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
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- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
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- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- SKSLQVWNRUWRAQ-UHFFFAOYSA-N icosa-1,3,5,7,9-pentaene Chemical compound CCCCCCCCCCC=CC=CC=CC=CC=C SKSLQVWNRUWRAQ-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
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Abstract
The present application relates to curable compositions and uses thereof. When the curable composition of the present application is applied to a product that generates heat during a driving or maintenance process, a curable composition that can be used as a material capable of handling heat can be provided. The curable composition of the present application is applied to a product in which a plurality of heat generating elements are integrated, whereby it can efficiently process heat generated by the elements while maintaining a uniform temperature of the product. Furthermore, even when abnormal heat, explosion or fire occurs in any one of the plurality of elements, application of the curable composition of the present application to such products allows the influence of such heat, explosion or fire on other adjacent elements to be prevented or minimized. The curable composition of the present application can also perform such functions stably for a long period of time.
Description
Technical Field
Cross Reference to Related Applications
The present application claims priority based on korean patent application No. 10-2021-013411 filed on 8 th 10 of 2021 and korean patent application No. 10-2022-0128215 filed on 6 th 10 of 2022, the disclosures of which are incorporated herein by reference in their entireties.
Technical Field
The present application relates to curable compositions and uses thereof.
Background
The importance of techniques for handling the heat generated by the products is increasing. One of representative methods for treating heat is a method of discharging heat generated from a product to the outside using a material having excellent thermal conductivity or dissipating the generated heat using a cooling medium or the like.
However, handling heat in a product constituted by a heat generating element (heat generating element) is a difficult problem.
For example, a battery module or battery pack includes a plurality of battery cells or a plurality of battery modules positioned adjacent to each other. Therefore, heat generated in any one of the battery cells or the battery modules may affect other adjacent elements, and may cause problems such as chain fire or chain explosion in some cases.
In such products, it is necessary to prevent heat, explosion, combustion, or the like generated in any one element from affecting other adjacent elements.
Depending on the product, a uniform temperature must be maintained throughout the drive or maintenance process. Therefore, in the product constituted by a plurality of heat generating elements together as above, the following technique is required: the entire temperature of the product can be uniformly maintained during the driving or maintenance process, and abnormal heat or explosion or combustion occurring in any one of the heating elements can be handled without being propagated to other elements, if possible.
Disclosure of Invention
Technical problem
The present application relates to curable compositions and uses thereof. When the curable composition of the present application is applied to a product that generates heat during a driving or maintenance process, a curable composition that can be used as a material capable of handling heat can be provided. The curable composition of the present application is applied to a product in which a plurality of heat-generating elements are integrated, whereby it can efficiently process heat generated by the elements while maintaining a uniform temperature of the product. Furthermore, even when abnormal heat, explosion or fire occurs in any one of the plurality of elements, application of the curable composition of the present application to such products allows the influence of such heat, explosion or fire on other adjacent elements to be prevented or minimized. The curable composition of the present application can also perform such functions stably for a long period of time. The present application may also provide a cured body formed from such a curable composition, or the use of the curable composition or the cured body.
Technical proposal
In the physical characteristics mentioned in the present specification, unless otherwise specified, the physical characteristics in which temperature affects the physical characteristics are physical characteristics measured at room temperature.
In the present specification, the term room temperature is a natural temperature without heating or cooling, which means, for example, any temperature in the range of about 10 ℃ to 30 ℃, for example, a temperature of about 15 ℃, about 18 ℃, about 20 ℃, about 23 ℃, or about 25 ℃. In addition, unless otherwise indicated in the specification, the units of temperature are in ℃.
In the physical properties mentioned in the present specification, when the pressure affects the result, the relevant physical properties are physical properties measured at normal pressure unless otherwise specified. The term normal pressure is a natural pressure without pressurization and depressurization, and is generally about 1 atmosphere (about 700mmHg to 800mmHg or so) and is called normal pressure.
Among the physical properties mentioned in the present specification, when humidity affects the result, the relevant physical properties are physical properties measured without particular control of humidity at room temperature and normal pressure unless otherwise specified.
The present application relates to curable compositions. The term curable composition is a curable composition. Curing is a phenomenon in which a composition hardens by physical and/or chemical reactions.
The curable composition may be of an energy beam curing type, a moisture curing type, a heat curing type, or a room temperature curing type, or a mixed curing type in which two or more types of the above curing methods are applied.
The curable composition may be cured by the following method: a method of irradiating the composition with an energy beam (e.g., ultraviolet rays) in the case of an energy beam curing type; a method of maintaining the composition under a proper humidity in the case of a moisture-curable type; a method of applying appropriate heat to the composition in the case of thermosetting; or a method of maintaining the curable composition at room temperature in the case of a room temperature curing type; and in the case of the hybrid curing type, two or more of the above methods may be applied simultaneously or in stages to cure the curable composition. In one example, the curable composition of the present application may be at least room temperature curable. For example, the curable composition of the present application can be cured in a state maintained at room temperature without separate energy beam irradiation and heat application.
The curable composition of the present application may be a one-part curable composition or a two-part curable composition. One-component curable compositions are compositions in which the components required for curing are stored in a mixed state, and two-component curable compositions are compositions in which the components required for curing are stored in a physically separated state. Two-component curable compositions generally comprise a so-called main agent part and a curing agent part, and for curing the main agent part and the curing agent part are mixed. When the curable composition of the present application is a two-part curable composition, the curable composition may be a main agent part or a curing agent part of the two-part curable composition, or a mixture of a main agent part and a curing agent part.
The curable composition may form a cured body exhibiting latent heat in a predetermined temperature range. Latent heat is generally defined as the amount of heat required by a substance to cause a state change (phase change) without any temperature change. However, when the cured body of the present application exhibits latent heat, it is not always necessary to cause a change in the state of the whole. Latent heat of the cured body in the present application may occur during a state change of at least a part of the cured body or a component contained in the cured body.
In the present application, the case where the cured body exhibits latent heat in a predetermined temperature range means that the cured material exhibits an endothermic peak in a DSC (differential scanning calorimeter) analysis performed in the manner described in examples described below. The process of the cured body of the present application exhibiting latent heat is an isothermal process. Accordingly, the cured body may be applied to a product generating heat to control heat while uniformly maintaining the temperature of the product, and the influence of abnormal heat, explosion, and/or fire occurring in one product on other adjacent products may be minimized or prevented.
The lower limit of the latent heat exhibited by the cured body may be about 20J/g, 25J/g, 30J/g, 35J/g, 40J/g, 45J/g, 50J/g, 55J/g, 60J/g, 65J/g, 70J/g, 75J/g, 80J/g, 85J/g or 90J/g, and the upper limit thereof may also be about 200J/g, 195J/g, 190J/g, 185J/g, 180J/g, 175J/g, 170J/g, 165J/g, 160J/g, 155J/g, 150J/g, 145J/g, 140J/g, 135J/g, 130J/g, 125J/g, 120J/g, 115J/g, 110J/g, 105J/g, 100J/g, 95J/g, 90J/g, 85J/g, 80J/g, 75J/g, 70J/g, 65J/g, 60J/g, 55J/g, 45J/g or 40J/g. The latent heat exhibited by the cured body may be greater than or not less than any of the above-described lower limits, or may be less than or not greater than any of the above-described upper limits, or may be in the range of greater than or not less than any of the above-described lower limits to less than or not greater than any of the above-described upper limits. The cured body exhibiting such latent heat can perform excellent heat control functions in various applications, and in particular, can stably control heat in a battery module or a battery pack.
The temperature zone where the cured body exhibits latent heat can be controlled.
In the present specification, the latent heat region is a temperature region representing latent heat, which is a range from a temperature at a left start inflection point of an endothermic peak to a temperature at a right start inflection point of the endothermic peak in an endothermic region in which an endothermic peak of DSC (differential scanning calorimeter) analysis of an embodiment to be described below is determined. In the present specification, the temperature at the left start inflection point of the endothermic peak may also be referred to as a start temperature, and the temperature at the right start inflection point of the endothermic peak may also be referred to as an offset temperature.
In the endothermic region of DSC analysis, one, or two or more endothermic peaks may be determined, and even when a plurality of endothermic peaks are observed, a range from the temperature of the inflection point of the endothermic peak at the point where the first endothermic peak starts (latent heat region start temperature or start temperature) to the temperature of the inflection point of the endothermic peak at the point where the last endothermic peak ends (latent heat region end temperature or offset) is defined as a latent heat region.
The concepts of latent heat, latent heat zone, onset temperature and offset temperature are equally applicable to phase change materials.
The lower limit of the temperature of the latent heat zone may be about 0 ℃, 5 ℃, 10 ℃, 15 ℃, 20 ℃, 25 ℃, 27 ℃, or 30 ℃, and the upper limit thereof may be about 80 ℃, 78 ℃, 76 ℃, 74 ℃, 72 ℃, 70 ℃, 68 ℃, 66 ℃, 64 ℃, 62 ℃, 60 ℃, 58 ℃, 56 ℃, 54 ℃, 52 ℃, 50 ℃, 48 ℃, 46 ℃, 44 ℃, 42 ℃, or 40 ℃. The latent heat region may be in a range of more than or not less than any of the above lower limits to less than or not more than any of the above upper limits.
In the cured body, the width of the temperature region representing latent heat, i.e., the width of the latent heat region, can be adjusted. The width of the latent heat zone is a value obtained by subtracting the latent heat zone start temperature (start temperature) from the latent heat zone end temperature (offset temperature). The lower limit of the width of the latent heat region may be about 5 ℃, 10 ℃, 15 ℃, 20 ℃, 25 ℃, 30 ℃ or 35 ℃, and the upper limit thereof may be about 70 ℃, 65 ℃, 60 ℃, 55 ℃, 50 ℃, 45 ℃, 40 ℃, 35 ℃, 30 ℃ or 25 ℃. The width of the latent heat region of the latent heat exhibited by the cured body may be greater than or not less than any of the above-described lower limits, or may be less than or not greater than any of the above-described upper limits, or may be in the range of greater than or not less than any of the above-described lower limits to less than or not greater than any of the above-described upper limits.
In one example, the onset temperature of the latent heat zone in which the solidification body exhibits latent heat may be adjusted. In this case, the definition of the start temperature is the same as described above. The lower limit of the range in which the starting temperature exists may be about 10 ℃, 12 ℃, 14 ℃, 16 ℃, 18 ℃, 20 ℃, 22 ℃, 24 ℃, 26 ℃, or 28 ℃, and the upper limit thereof may be about 60 ℃, 58 ℃, 56 ℃, 54 ℃, 52 ℃, 50 ℃, 48 ℃, 46 ℃, 44 ℃, 42 ℃, 40 ℃, 38 ℃, 36 ℃, 34 ℃, 32 ℃, 30 ℃, 28 ℃, or 26 ℃. The starting temperature may be in the range of greater than or not less than any of the above lower limits to less than or not greater than any of the above upper limits.
In one example, the offset temperature of the latent heat region where the solidified body exhibits latent heat may be adjusted. In this case, the definition of the offset temperature is the same as described above. The lower limit of the range in which the offset temperature exists may be about 30 ℃, 32 ℃, 34 ℃, 36 ℃, 38 ℃, 40 ℃, 42 ℃, 44 ℃, 46 ℃, 48 ℃, or 50 ℃, and the upper limit thereof may be about 80 ℃, 78 ℃, 56 ℃, 74 ℃, 72 ℃, 70 ℃, 68 ℃, 66 ℃, 64 ℃, 62 ℃, 60 ℃, 58 ℃, 56 ℃, 54 ℃, 52 ℃, or 50 ℃. The offset temperature may be in the range of greater than or not less than any of the above lower limits to less than or not greater than any of the above upper limits.
The cured body having latent heat in the temperature range and region is applied to various heat-generating products (particularly, battery modules or battery packs, etc.), whereby the related products can be operated in a stable and uniform temperature range. Further, the cured body is applied to a product including a plurality of elements disposed adjacent to each other, whereby the temperature of the entire product can be uniformly maintained, and the influence of abnormal heat, fire, and/or explosion in any one element on other elements can be minimized or prevented. In particular, the cured body exhibiting latent heat characteristics is applied to a product (for example, a secondary battery cell, or a battery module or a battery pack including a plurality of cells) whose driving temperature must be maintained in a range of about 15 to 60 ℃, whereby heat can be effectively controlled.
The cured body of the present application can stably maintain such latent heat characteristics for a long period of time. In one example, the curable composition may comprise a so-called phase change material (phase change material, PCM) such that the cured body exhibits latent heat characteristics. As the phase change material, a material that absorbs heat while undergoing a phase transition from solid to liquid may be used. Since this material is converted into a liquid phase while exhibiting latent heat, it may be lost from the cured body. Thus, in this case, the latent heat feature may be lost over time. In the present application, even after the phase change material in the cured body is converted into a liquid phase, it is not lost in the cured body by selecting a curable resin component forming the cured body, adjusting the degree of crosslinking, adjusting the type and ratio of the phase change material, and/or adjusting the method for preparing the curable composition, and thus, such latent heat characteristics can be stably maintained for a long period of time.
For example, in the cured body of the present application, Δw of the following formula 1 may be controlled within a predetermined range.
[ 1]
ΔW＝100×(W f -W i )/W i
In formula 1, ΔW is the weight change rate (unit%) of the cured product, W f For the weight of the cured body measured after the cured body was kept at 80℃for 24 hours, and W i The weight of the cured body was determined to be the weight of the cured body before the cured body was kept at 80℃for 24 hours. Specific methods for measuring Δw in equation 1 are described in the examples section. Further, the weight (W in the above formula 1 f And W is i ) The units of (a) are not limited as long as the same units are applied to each other.
The upper limit of the weight change rate (Δw) may be about 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1.5%, 1% or 0.5%. The rate of change of weight may be less than any of the above upper limits, or be an upper limit or less. The lower limit of the weight change rate (Δw) is not particularly limited, since this means that the smaller the value thereof, the more stable the phase change material is kept in the solidified body. The lower limit of the weight change rate (Δw) may be, for example, about 0% or 0.5%. The weight change rate (Δw) may be in a range of more than or not less than any of the above lower limits to less than or not more than any of the above upper limits.
In the present application, such latent heat characteristics or weight change characteristics can be achieved without the application of so-called composite materials as phase change materials. Phase change materials exhibit endothermic characteristics that are capable of controlling heat, but generally have poor thermal conductivity. Therefore, it is not easy to transfer the heat to be treated to the phase change material. For this purpose, composite materials are known in which a material having high thermal conductivity (for example, graphite or carbon fiber) is compounded with a phase change material. Such a material may solve the problem of low thermal conductivity to some extent, which is a disadvantage of the phase change material, but is disadvantageous in terms of weight saving because it increases the density or specific gravity of the material. However, in the present application, the problem of reduced heat control efficiency due to low thermal conductivity, which is a disadvantage of the phase change material, can be solved without using the composite phase change material by selecting a curable resin component forming a cured body, adjusting the degree of crosslinking, adjusting the type and ratio of the phase change material, and/or adjusting a method for preparing the curable composition, and thus a lightweight material can be provided.
In the present application, such latent heat characteristics or weight change characteristics may be achieved when using a so-called unpackaged phase change material (i.e. a non-packed phase change material) as the phase change material. That is, the phase change material is typically converted to a liquid during a phase transition process, wherein the phase change material converted to a liquid may easily leak from the solidified body. Therefore, in order to prevent the phase change material from leaking, a phase change material in which the phase change material is encapsulated with a material that does not become a liquid phase is generally used. However, in this case, the phase change material is encapsulated by a material different from the phase change material, so that it is not easy to stably secure the performance of the phase change material. In the present application, as described below, even when a non-encapsulated phase change material is used as the phase change material, the weight change characteristic can be exhibited by controlling the matrix of the solidified body.
In one example, the curable composition may include a non-encapsulated phase change material as the phase change material, and the lower limit of the content of the non-encapsulated phase change material may be about 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or 95 wt%, and the upper limit may be about 100 wt%, 99 wt%, 98 wt%, 97 wt%, 96 wt%, or 95 wt%, based on the weight of the total phase change material present in the curable composition or cured body. The non-encapsulated phase change material may be present in an amount greater than or not less than any of the above lower limits, or less than or not greater than any of the above upper limits, or in a range from greater than or not less than any of the above lower limits to less than or not greater than any of the above upper limits.
In one example, the cured body may have a density within a predetermined range. Such a density can be controlled in view of the possibility of providing a light material. For example, the lower limit of the density may be 0.5g/cm 3 、0.55g/cm 3 、0.6g/cm 3 、0.65g/cm 3 、0.7g/cm 3 、0.75g/cm 3 、0.8g/cm 3 、0.85g/cm 3 、0.9g/cm 3 、0.95g/cm 3 、1g/cm 3 、1.05g/cm 3 、1.1g/cm 3 Or 1.15g/cm 3 About, and its upper limit may be 2g/cm 3 、1.8g/cm 3 、1.6g/cm 3 、1.5g/cm 3 、1.45g/cm 3 、1.4g/cm 3 、1.35g/cm 3 、1.3g/cm 3 、1.25g/cm 3 、1.2g/cm 3 、1.15g/cm 3 、1.1g/cm 3 、1.05g/cm 3 、1g/cm 3 Or 0.95g/cm 3 Left and right. The density of the cured body may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
In this application, the hardness of the cured body can be adjusted. The hardness of the cured body is affected by the degree of crosslinking of the cured body. In general, when the degree of crosslinking is dense, the hardness increases, and conversely, the lower the degree of crosslinking, the lower the hardness measured. In the present application, in consideration of the holding efficiency of the phase change material held in the solidified body, the degree of crosslinking of the solidified body may be adjusted so as to exhibit an appropriate hardness. If the degree of crosslinking is too low and thus the hardness is too low, the phase change material may not be properly held in the cured body, and conversely, if the degree of crosslinking is too high and thus the hardness is too high, the performance of the phase change material may not be properly exhibited.
For example, the lower limit of the hardness of the cured body may be about 20, 25, 30, 35, 40, 45, 50, 55, 60, 70, or 80 in terms of shore OO hardness, or about 10, 15, 20, 25, 30, 35, 40, or 50 in terms of shore a hardness; the upper limit thereof may be about 90, 85, 80, 75, 70, 65 or 60 in terms of shore OO hardness, or about 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25 or 20 in terms of shore a hardness. The hardness of the cured body may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
As described above, the hardness of the cured body can be adjusted mainly by controlling the degree of crosslinking or the like, and such a method is known. In the present application, the molecular weight of the curable resin component forming the cured body and the degree of crosslinking of the resin component are controlled so that they may exhibit a hardness in the above-described range, whereby a network capable of stably holding the phase change material may be provided. Further, the hardness in the above range enables the cured body to stably fill a space having a complicated shape, and also can improve vibration resistance and impact resistance.
The curable composition of the present application may comprise a curable resin component. The term curable resin component includes within its scope components capable of forming a resin component after a curing reaction, as well as the case where it is a so-called resin component itself. Thus, the curable resin component may be a single molecule compound, an oligomer compound, or a polymer compound.
In the present application, as the curable resin component, a component having a weight average molecular weight (Mw) within a predetermined range may be used. The weight average molecular weight of the curable resin component affects the phase change material and the maintenance of the crosslinked structure. That is, even at the same or similar degree of crosslinking, if the weight average molecular weight of the curable resin component connecting the crosslinked structure is too low, leakage of the phase change material may occur, so that it may be necessary to ensure an appropriate level of weight average molecular weight. For example, the curable resin component may have a lower limit of weight average molecular weight of about 9,000g/mol, 10,000g/mol, 15,000g/mol, 20,000g/mol, or 25,000g/mol, and an upper limit of about 1,000,000g/mol, 900,000g/mol, 800,000g/mol, 700,000g/mol, 600,000g/mol, 500,000g/mol, 400,000g/mol, 300,000g/mol, 200,000g/mol, 100,000g/mol, 90,000g/mol, 80,000g/mol, 70,000g/mol, 60,000g/mol, 50,000g/mol, 40,000g/mol, or 30,000 g/mol. The curable resin component having such molecular weight characteristics can form a cured body network in which the phase change material can be stably held. In particular, as the resin component having the above molecular weight characteristics, a silicone resin component can be effectively used. The weight average molecular weight may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
There is no particular limitation on the type of curable resin component. In one example, the curable resin component may include a polyurethane component, a silicone resin component, an acrylic resin component, or an epoxy resin component. The polyurethane component, silicone resin component, acrylic resin component, or epoxy resin component may be polyurethane, silicone resin, acrylic resin, or epoxy resin, or may be a component that forms polyurethane, silicone resin, acrylic resin, or epoxy resin by a curing reaction. The specific type of the applicable curable resin component is not particularly limited, and a curable resin component exhibiting the molecular weight characteristics and/or hardness characteristics as described above may be selected and used among known polyurethane components, silicone resin components, acrylic resin components or epoxy resin components, and the hardness of the final cured product may also be controlled by controlling the degree of crosslinking of the resin component.
For example, when the curable resin component is a silicone resin component, the component is an addition curable silicone resin component, which may include (1) a polyorganosiloxane containing two or more alkenyl groups in the molecule, and (2) a polyorganosiloxane containing two or more silicon-bonded hydrogen atoms in the molecule. The compounds may form a cured product by an addition reaction in the presence of a catalyst (e.g., a platinum catalyst).
(1) The polyorganosiloxane contains at least two alkenyl groups. At this time, specific examples of the alkenyl group include vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, and the like, and the aforementioned vinyl group is generally applied, but is not limited thereto. In the polyorganosiloxane (1), the bonding position of the alkenyl group is not particularly limited. For example, alkenyl groups may be bonded to the ends of the molecular chain and/or to side chains of the molecular chain. In addition, in the polyorganosiloxane (1), the types of substituents that may be contained in addition to the above alkenyl groups may include: alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl; aryl groups such as phenyl, tolyl, xylyl, or naphthyl; aralkyl groups such as benzyl or phenethyl; and halogen substituted alkyl groups such as chloromethyl, 3-chloropropyl or 3, 3-trifluoropropyl; etc., and the aforementioned methyl or phenyl is generally applied, but is not limited thereto.
(1) The molecular structure of the polyorganosiloxane is not particularly limited, and for example, it may also have any shape such as a linear, branched, cyclic, network, or partially branched linear structure. Generally, (1) a polyorganosiloxane having a linear molecular structure among such molecular structures is generally used, but not limited thereto.
More specific examples of the polyorganosiloxane (1) may include: dimethylsiloxane-methylvinylsiloxane copolymer terminated with trimethylsiloxane groups at both ends of the molecular chain, methylvinylsiloxane terminated with trimethylsiloxane groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer terminated with trimethylsiloxane groups at both ends of the molecular chain, dimethylpolysiloxane terminated with dimethylvinylsiloxane groups at both ends of the molecular chain, methylvinylpolysiloxane terminated with dimethylvinylsiloxane groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane copolymer terminated with dimethylvinylsiloxane groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer terminated with dimethylvinylsiloxane groups at both ends of the molecular chain, comprising R 1 2 SiO 2/2 Siloxane units represented by R 1 2 R 2 SiO 1/2 Siloxane units represented by SiO 4/2 Polyorganosiloxane copolymers containing siloxane units represented by R 1 2 R 2 SiO 1/2 Siloxane units represented by SiO 4/2 Polyorganosiloxane copolymers containing siloxane units represented by R 1 R 2 SiO 2/2 Siloxane units represented by R 1 SiO 3/2 Represented siloxane units or by R 2 SiO 3/2 The polyorganosiloxane copolymers of the siloxane units represented, and mixtures of two or more of the foregoing, are not limited thereto. Here, R is 1 Is a hydrocarbon group other than alkenyl group, which may specifically be: alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl; aryl groups such as phenyl, tolyl, xylyl, or naphthyl; aralkyl groups such as benzyl or phenethyl; halogen-substituted alkyl radicals, e.g. chloromethyl, 3-chloropropionA group or 3, 3-trifluoropropyl group; etc. Further, R herein 2 Alkenyl groups, which may specifically be vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, or the like.
In addition curable silicone compositions, (2) polyorganosiloxanes may be used to crosslink (1) the polyorganosiloxane. In the polyorganosiloxane (2), the bonding position of the hydrogen atom is not particularly limited, and for example, it may be bonded to the terminal and/or side chain of the molecular chain. Further, in the (2) polyorganosiloxane, the type of substituent which may be contained in addition to the silicon-bonded hydrogen atom is not particularly limited, and for example, it may include an alkyl group, an aryl group, an aralkyl group, or a halogen-substituted alkyl group or the like as mentioned in the (1) polyorganosiloxane, and the aforementioned methyl group or phenyl group is generally applied, but is not limited thereto.
(2) The molecular structure of the polyorganosiloxane is not particularly limited, and for example, it may also have any shape such as a linear, branched, cyclic, network, or partially branched linear structure. Generally, (2) a polyorganosiloxane having a linear molecular structure among such molecular structures is generally used, but not limited thereto.
(2) More specific examples of the polyorganosiloxane may include: methyl hydrogen polysiloxane end-capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methyl hydrogen copolymer end-capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylhydrosiloxane-methylphenyl siloxane copolymer end-capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylphenyl siloxane copolymer end-capped with dimethylhydrosiloxane groups at both ends of the molecular chain, and methylphenyl polysiloxane end-capped with dimethylhydrosiloxane groups at both ends of the molecular chain, comprising R 1 3 SiO 1/2 Siloxane units represented by R 1 2 HSiO 1/2 Siloxane units represented by SiO 4/2 Polyorganosiloxane copolymers containing siloxane units represented by R 1 2 HSiO 1/2 Siloxane units represented by SiO 4/2 Polyorganosiloxane copolymers containing siloxane units represented by R 1 HSiO 2/2 Siloxane units represented by R 1 SiO 3/2 Represented by siloxane units or by HSiO 3/2 The polyorganosiloxane copolymers of the siloxane units represented, and mixtures of two or more of the foregoing, are not limited thereto. Here, R is 1 Is a hydrocarbon group other than alkenyl group, which may specifically be: alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl; aryl groups such as phenyl, tolyl, xylyl, or naphthyl; aralkyl groups such as benzyl or phenethyl; halogen substituted alkyl groups such as chloromethyl, 3-chloropropyl or 3, 3-trifluoropropyl; etc.
(2) The content of the polyorganosiloxane is not particularly limited as long as it is contained to such an extent that proper curing can be achieved. For example, (2) the polyorganosiloxane may be contained in such an amount that 0.5 to 10 silicon-bonded hydrogen atoms are present with respect to one alkenyl group contained in the above-mentioned (1) polyorganosiloxane. Within this range, curing can be sufficiently performed, and heat resistance can be ensured.
The addition curable silicone resin component may also contain platinum or a platinum compound as a catalyst for curing. The specific type of such platinum or platinum compound is not particularly limited. The ratio of the catalyst may also be adjusted to a level that achieves proper cure.
In another example, the silicone resin component is a condensation curable silicone resin component, which may include: such as (a) alkoxy-containing silicone polymers; and (b) a hydroxyl-containing silicone polymer.
(a) The siloxane polymer may be, for example, a compound represented by the following formula 1.
[ 1]
R 1 a R 2 b SiO c (OR 3 ) d
In formula 1, R 1 And R is 2 Each independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, R 3 Represents alkyl, wherein if a plurality of R's are each present 1 、R 2 And R is 3 They may be the same or different from each other, and a and b each independently represent a number of 0 or more and less than 1, a+b represents a number of more than 0 and less than 2, c represents a number of more than 0 and less than 2, d represents a number of more than 0 and less than 4, and a+b+c× 2+d is 4.
In the definition of formula 1, the monovalent hydrocarbon may be, for example, an alkyl group having 1 to 8 carbon atoms, a phenyl group, a benzyl group, a tolyl group, or the like, wherein the alkyl group having 1 to 8 carbon atoms may be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, or the like. In addition, in the definition of formula 1, the monovalent hydrocarbon group may be substituted with, for example, a known substituent such as halogen, amino, mercapto, isocyanate, glycidyl, glycidoxy or ureido.
In the definition of formula 1, R 3 Examples of the alkyl group of (a) may include methyl, ethyl, propyl, isopropyl, butyl, or the like. In the alkyl group, a methyl group, an ethyl group, or the like is generally used, but is not limited thereto.
In the polymers of formula 1, branched or tertiary cross-linked siloxane polymers may be used. Furthermore, in such a (a) siloxane polymer, hydroxyl groups may be retained within a range not impairing the purpose, specifically, within a range not inhibiting dealcoholization reaction.
(a) The siloxane polymer can be produced, for example, by hydrolyzing and condensing a polyfunctional alkoxysilane or a polyfunctional chlorosilane or the like. Those of ordinary skill in the art can readily select the appropriate multifunctional alkoxysilane or chlorosilane depending on the desired (a) siloxane polymer, and can also readily control the conditions of the hydrolysis and condensation reactions in which it is used. Meanwhile, in producing the (a) siloxane polymer, an appropriate monofunctional alkoxysilane may also be used in combination according to purposes.
As the Silicone polymer (a), for example, a commercially available organosiloxane polymer such as X40-9220 or X40-9225,GE Toray Silicone XR31-B1410, XR31-B0270 or XR31-B2733 of Shin-Etsu Silicone, or the like can be used.
As the (b) hydroxyl group-containing siloxane polymer included in the condensation curable silicone composition, for example, a compound represented by the following formula 2 may be used.
[ 2]
In formula 2, R 4 And R is 5 Each independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, wherein if a plurality of R's are each present 4 And R is 5 They may be the same or different from each other, and n represents an integer of 5 to 2,000.
In the definition of formula 2, a specific type of monovalent hydrocarbon group may include, for example, the same hydrocarbon group as in the case of formula 1.
(b) The siloxane polymer can be produced, for example, by hydrolyzing and condensing dialkoxysilanes and/or dichlorosilanes. One of ordinary skill in the art can readily select the appropriate dialkoxysilane or dichlorosilane depending on the desired (b) siloxane polymer, and can also readily control the conditions of the hydrolysis and condensation reaction in which it is used. As the silicone polymer (b), for example, a commercially available bifunctional organosiloxane polymer such as XC96-723, YF-3800 or YF-3804 of GE Toray Silicone can be used.
The addition-curable or condensation-curable silicone composition described above is one example of a silicone resin component used in the present application.
In another example, if the curable resin component is a polyurethane component, the component may comprise at least a polyol and a polyisocyanate. Here, the polyol is a compound containing at least two hydroxyl groups, and the polyisocyanate is a compound containing at least two isocyanate groups. These compounds may each be a single molecule compound, an oligomer compound or a polymer compound.
There is no great limitation on the type of polyol that can be used, and for example, a known polyether polyol or polyester polyol can be used. Here, as the polyether polyol, known is: polyalkylene glycols in which the alkylene glycol moiety has 1 to 20, 1 to 16, 1 to 12, 1 to 8, or 1 to 4 carbon atoms, such as polypropylene glycol or polyethylene glycol, or polyols based on ethylene oxide/propylene oxide copolymers, PTME (poly (tetramethylene glycol)), PHMG (poly (hexamethylene ether glycol)), and the like. Further, as the polyester polyol, there is known: polyols synthesized from dibasic acids and diols such as polyester polyols or polycaprolactone polyols (obtained by ring-opening polymerization of cyclic lactones) containing dibasic acid units and diol units, and the like. Further, in addition to such polyols, it is also known that: hydrocarbon-based polyols such as carbonate-based polyols, vegetable polyol castor oil, HTPB (hydroxyl-terminated polybutadiene) or HTPIB (hydroxyl-terminated polyisobutylene).
In the present application, an appropriate kind may be selected and used among the above-known polyols.
As the polyisocyanate, an appropriate kind may be selected and used among known aromatic or aliphatic polyisocyanate compounds.
The lower limit of the content of the curable resin component in the curable composition may be about 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt% or 80 wt%, and the upper limit thereof may be about less than 100 wt%, 95 wt%, 90 wt%, 85 wt%, 80 wt%, 75 wt%, 70 wt%, 65 wt%, 60 wt% or 55 wt%, based on the total weight of the curable composition. The content may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits. The content is based on the total weight of the curable composition, provided that when the curable composition comprises a filler and/or a solvent, it is a ratio based on the total weight of the curable composition excluding the filler and the solvent.
The curable composition may contain a so-called Phase Change Material (PCM) to ensure the above-mentioned latent heat characteristics. Phase change materials are well known as materials that absorb or release heat during phase transition. The phase transition process is an isothermal process.
The phase transition in which the phase change material absorbs or releases heat may be a solid-to-solid phase transition, a solid-to-liquid phase transition, a solid-to-gas phase transition, or a liquid-to-gas phase transition. The phase change reaction (solid-solid, solid-liquid solid- →gas, liquid- →gas) can be endothermic. Materials having a phase transition from solid to liquid are advantageous in terms of efficiency, but such materials become liquid phase after the phase transition, making it difficult to keep in the cured body. However, the cured body of the present application exhibits the above weight change rate, and thus a material that undergoes a phase transition from solid to liquid can be applied. Thus, the phase change material used in the present application may be a material in which a phase transition occurs between a solid phase and a liquid phase, and may be a material in which a phase transition reaction from the solid phase to the liquid phase may be an endothermic reaction.
The melting point of the phase change material used in the present application may be within a predetermined range. For example, the lower limit of the melting point may be about 20 ℃, 25 ℃, 30 ℃, 35 ℃, 40 ℃, 45 ℃ or 50 ℃, and the upper limit may be about 100 ℃, 95 ℃, 90 ℃, 85 ℃, 80 ℃, 75 ℃, 70 ℃, 65 ℃, 60 ℃, 55 ℃, 50 ℃, 45 ℃ or 40 ℃. The melting point may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
The lower limit of the content of the phase change material having the above-described melting point among all phase change materials included in the curable composition of the present application in order to ensure proper temperature control characteristics may be about 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt% or 95 wt%, and the upper limit thereof may be about 100 wt%, 99 wt%, 98 wt%, 97 wt%, 96 wt% or 95 wt%. The content may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
In another example, the curable composition may also contain only a phase change material having a melting point within the above range as the phase change material.
As the phase change material, a phase change material exhibiting latent heat within a predetermined range at a predetermined temperature region may be used.
For example, the phase change material may exhibit a lower limit of latent heat of about 100J/g, 110J/g, 120J/g, 130J/g, 140J/g, 150J/g, 160J/g, 170J/g, or 180J/g, and an upper limit of about 400J/g, 380J/g, 360J/g, 340J/g, 320J/g, 300J/g, 280J/g, 260J/g, 240J/g, 220J/g, 200J/g, 180J/g, or 160J/g. The latent heat may be greater than or not less than any of the above-described lower limits, or may be less than or not greater than any of the above-described upper limits, or may be in the range of greater than or not less than any of the above-described lower limits to less than or not greater than any of the above-described upper limits.
The lower limit of the temperature region in which the phase change material exhibits latent heat may be about 10 ℃, 15 ℃, 20 ℃, 25 ℃, 30 ℃, 35 ℃, 40 ℃, 45 ℃ or 50 ℃, and the upper limit may be about 100 ℃, 95 ℃, 90 ℃, 85 ℃, 80 ℃, 75 ℃, 70 ℃, 65 ℃, 60 ℃, 55 ℃, 50 ℃, 45 ℃ or 40 ℃. The temperature region exhibiting latent heat may be greater than or not less than any of the above-described lower limits, or may be less than or not greater than any of the above-described upper limits, or may be in the range of greater than or not less than any of the above-described lower limits to less than or not greater than any of the above-described upper limits.
The lower limit of the content of the phase change material having the above-described latent heat property among all phase change materials included in the curable composition of the present application in order to secure an appropriate temperature control characteristic may be about 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt% or 95 wt%, and the upper limit thereof may be about 100 wt%, 99 wt%, 98 wt%, 97 wt%, 96 wt% or 95 wt%. The content may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
In another example, the curable composition may include only a phase change material having the latent heat characteristics described above as the phase change material.
The desired solidified body may be formed by applying a phase change material as described above.
As the phase change material, a known material may be applied as long as it exhibits the above-described characteristics. As the phase change material, an inorganic material, an organic material, or a eutectic material is known. Among these materials, as a material having the above-described latent heat characteristics, an organic phase change material may be used.
As the organic phase change material, a fatty acid or paraffin-based material is known, and in this application, one or a mixture of two or more of the materials may be used.
Examples of the fatty acid include formic acid, n-octanoic acid, lauric acid, myristic acid, palmitic acid, and stearic acid.
In a suitable example, as phase change material, a paraffin-based material may be used. As paraffin-based phase change materials, n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-heneicosane, n-docosane, n-tricosane, n-pentacosane, n-hexacosane, n-heptacosane, n-octacosane, n-nonacosane, n-triacontane or other higher paraffins (paraffin C) 16 ～C 18 Paraffin C 13 ～C 24 RT 35HC, paraffin C 16 ～C 28 Paraffin C 20 ～C 33 Paraffin C 22 ～C 45 Paraffin C 22 ～C 50 Paraffin natural wax 811, paraffin natural wax 106, etc.).
In this application, suitable species may be selected and used in known paraffin-based materials.
In the present application, as the phase change material, paraffin wax having a melting point in the above range and a carbon number in the range of 10 to 30 may be used to achieve an appropriate effect. Such paraffin may be an alkane having the above carbon number.
In one example, as the paraffin-based material, one or more selected from n-nonadecane, n-docosane, n-eicosane, n-heneicosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, lauric acid, and myristic acid may be used.
The lower limit of the ratio of the phase change material in the curable composition may be, for example, about 20 parts by weight, 21 parts by weight, 22 parts by weight, 23 parts by weight, 24 parts by weight, or 25 parts by weight, and the upper limit thereof may be about 75 parts by weight, 74 parts by weight, 73 parts by weight, 72 parts by weight, 71 parts by weight, 70 parts by weight, 69 parts by weight, 68 parts by weight, 67 parts by weight, 66 parts by weight, 65 parts by weight, 64 parts by weight, 63 parts by weight, 62 parts by weight, 61 parts by weight, or 60 parts by weight, relative to 100 parts by weight of the curable resin component. The ratio may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits.
At this ratio, a desired temperature control performance can be ensured, and such performance can be stably maintained for a long period of time.
The curable composition may include a filler (e.g., a thermally conductive filler) as an optional additional component. Such a filler may compensate for the low thermal conductivity of the phase change material.
The heat conductive filler that can be used is not particularly limited, and for example, an inorganic filler such as aluminum hydroxide (Al (OH) 3 ) Magnesium hydroxide (Mg (OH) 2 ) Calcium hydroxide (Ca (OH) 2 ) Boehmite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN), boron Nitride (BN), silicon nitride (Si) 3 N 4 ) Silicon carbide (SiC), zinc oxide (ZnO), or beryllium oxide (BeO), but is not limited thereto. Can be obtained from the above-mentioned fillersOne or two or more are selected. When a low-density cured body is to be formed, a filler having a small specific gravity (for example, aluminum hydroxide or the like) may be selected among filler components.
Here, the shape of the filler is not particularly limited, and, for example, a spherical filler, a needle-shaped filler, a plate-shaped filler, or other amorphous filler may be used.
In one example, as the filler, a filler having an average particle diameter in the range of 10 μm to 200 μm may be used. The average particle diameter is the D50 particle diameter measured in the manner described in examples to be described below. By applying a filler having such a particle diameter, a desired effect can be ensured more effectively.
In another example, the filler may have a particle size of 15 μm or more, 20 μm or more, 25 μm or more, 30 μm or more, 35 μm or more, or 40 μm or more, or may also be 180 μm or less, 160 μm or less, 140 μm or less, 120 μm or less, 100 μm or less, 80 μm or less, 60 μm or less, or around 50 μm or less.
The amount of thermally conductive filler in the curable composition is adjusted according to the purpose. For example, in the curable composition, the thermally conductive filler may be contained in an amount of about 100 parts by weight or less with respect to 100 parts by weight of the curable resin component. In another example, the ratio may be 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, or 40 parts by weight or less, or may also be 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, or about 40 parts by weight or more.
In view of weight saving, the curable composition may further comprise a hollow filler as an optional additional component.
Weight saving may be facilitated by the use of hollow fillers.
For example, the D50 particle diameter (average particle diameter) of the filler may be in the range of 10 μm to 100 μm. In another example, the D50 particle size may be 12 μm or greater, 14 μm or greater, 16 μm or greater, 18 μm or greater, 20 μm or greater, 22 μm or greater, 24 μm or greater, 26 μm or greater, 28 μm or greater, 30 μm or greater, 32 μm or greater, 34 μm or greater, 36 μm or greater, 38 μm or greater, 40 μm or greater, 42 μm or greater, 44 μm or greater, 46 μm or greater, 48 μm or greater, 50 μm or greater, 52 μm or greater, 54 μm or greater, 56 μm or greater, or 58 μm or greater, or may be 98 μm or less, 96 μm or less, 94 μm or less, 92 μm or less, 90 μm or less, 88 μm or less, 86 μm or greater, 84 μm or greater, 82 μm or greater, 68 μm or less, 74 μm or greater, 74 μm or less, 70 μm or less, 74 μm or greater, 74 μm or less, or 70 μm or less.
The density of the hollow filler may be in the range of about 0.05g/ml to 1 g/ml. In another example, the density may be 0.01g/ml or greater, 0.15g/ml or greater, 0.2g/ml or greater, 0.25g/ml or greater, 0.3g/ml or greater, 0.35g/ml or greater, 0.4g/ml or greater, 0.45g/ml or greater, 0.5g/ml or greater, 0.55g/ml or greater, or 0.6g/ml or greater, or may also be 0.95g/ml or less, 0.9g/ml or less, 0.85g/ml or less, 0.8g/ml or less, 0.75g/ml or less, 0.7g/ml or less, 0.65g/ml or less, 0.6g/ml or less, 0.55g/ml or less, 0.5g/ml or less, 0.45g/ml or less, 0.9g/ml or less, 0.85g/ml or less, 0.8g/ml or less, 0.75g/ml or less, 0.3g/ml or less, 0.15g/ml or less, or 0.15g/ml or less.
Various types may be applied as the hollow filler without particular limitation as long as it has the particle diameter and/or density and can be uniformly mixed with the curable polyorganosiloxane component.
For example, as the hollow filler, a known organic filler, inorganic filler, or organic-inorganic mixed filler can be used. Even when the hollow filler is applied, organic particles in which the shell portion is made of an organic material, inorganic particles made of an inorganic material, and/or organic-inorganic particles made of an organic-inorganic material, or the like can be used. Such particles may be exemplified by acrylic particles such as PMMA (poly (methyl methacrylate)); epoxy particles; nylon particles; styrene particles and/or styrene/vinyl monomer copolymer particles, etc.; or inorganic particles such as silica particles, alumina particles, indium oxide particles, tin oxide particles, zirconium oxide particles, zinc oxide particles, and/or titanium dioxide particles, etc., but are not limited thereto.
In one example, as the hollow filler, particles in which the shell portion is made of a soda lime material (soda lime filler), particles in which the shell portion is made of a soda lime borosilicate material (soda lime borosilicate filler), cenosphere filler, or other silica particles may be used.
When the hollow filler is contained, the ratio is not particularly limited, and may be selected at an appropriate ratio within a range where a desired weight reduction is possible without impairing the physical properties of the cured body.
In addition to the above components, the curable composition may contain other necessary components. For example, the curable composition may contain, in addition to the above-described components, further additives such as a catalyst, a pigment or dye, a dispersant, a thixotropy imparting agent, a flame retardant, and the like, if necessary.
Such curable compositions may be solvent-based, aqueous or solvent-free, and may suitably be solvent-free.
As described above, the curable composition may be a one-part composition or a two-part composition, and in some cases, it may be a main agent part or a curing agent part of a two-part composition, or a mixture of a main agent part and a curing agent part.
Further, when the curable composition is a two-component composition, there is no particular limitation on the ratio of the main agent part and the other components in the curing agent part other than the curable resin component. For example, the phase change material and/or filler may be contained in both the main agent portion and the curing agent portion, or may be contained in the main agent portion and the curing agent portion, respectively.
The curable composition of the present application is suitable for various applications, and in particular, it is applied to heat-generating products, whereby it can be used as a material for controlling heat of the products.
In one example, to meet the latent heat characteristics, weight change rate, density, and/or hardness characteristics described above, a method for preparing the curable composition may be selected.
For example, the curable composition may be prepared by mixing the phase change material and the curable resin component in a state where the phase change material is melted. By this step, the desired curable composition can be provided more effectively.
Thus, the method for preparing the curable composition may include the step of mixing the melted phase change material and the curable resin component, and in particular, may include the step of melting the phase change material and mixing the melted phase change material and the curable resin component.
Here, the method of melting the phase change material is not particularly limited, and for example, the phase change material may be melted by maintaining it at a temperature of the melting point of the phase change material or higher.
In one example, the holding temperature of the phase change material may be a temperature 10 ℃ to 100 ℃ or more above the melting point of the phase change material. In another example, the temperature may be a temperature 15 ℃ or more, 20 ℃ or more, 25 ℃ or more, or 30 ℃ or more above the melting point of the phase change material, and/or a temperature 95 ℃ or less, 90 ℃ or less, 85 ℃ or less, 80 ℃ or less, 75 ℃ or less, 70 ℃ or less, 65 ℃ or less, 60 ℃ or less, 55 ℃ or less, 50 ℃ or less, 45 ℃ or less, 40 ℃ or less, 35 ℃ or less, or 30 ℃ or less below the melting point of the phase change material.
By preparing a curable composition by mixing a phase change material melted in this temperature range and a curable resin component, a curable composition having desired characteristics can be efficiently prepared. The temperature at which the melted phase change material and the curable resin component are mixed may be a temperature in the same range as the temperature at which the phase change material is melted, or a temperature lower than the temperature.
In one example, the mixing may be performed at a temperature 10 ℃ to 100 ℃ or more above the melting point of the phase change material. In another example, the temperature may be a temperature 15 ℃ or more, 20 ℃ or more, 25 ℃ or more, or 30 ℃ or more above the melting point of the phase change material, or a temperature 95 ℃ or less, 90 ℃ or less, 85 ℃ or less, 80 ℃ or less, 75 ℃ or less, 70 ℃ or less, 65 ℃ or less, 60 ℃ or less, 55 ℃ or less, 50 ℃ or less, 45 ℃ or less, 40 ℃ or less, 35 ℃ or less, or 30 ℃ or less below the melting point of the phase change material.
The present application also relates to a cured body of the curable composition described above. The method for curing the curable composition to obtain a cured body is not limited, and an appropriate curing method is applied according to the type of the curable composition. For example, it is possible to use: a method of irradiating the composition with an energy beam (e.g., ultraviolet rays) in the case of an energy beam curing type; a method of maintaining the composition under a proper humidity in the case of a moisture-curable type; a method of applying appropriate heat to the composition in the case of thermosetting; a method of maintaining the composition at room temperature in the case of a room temperature curing type; in the case of the hybrid curing type, a method of applying two or more curing methods; etc. As described above, in a suitable example, the curable composition may be room temperature curable.
The present application also relates to articles comprising the composition or cured body thereof. The curable composition of the present application or a cured body thereof can be effectively applied as a material for controlling heat of a heat generating component, a heat generating element or a heat generating product. Thus, the article may comprise a heat generating component or a heat generating element or a heat generating product. The term heat generating component, element or product means a component, element or product that generates heat during use, and the type thereof is not particularly limited. Representative heat generating components, elements or products include various electrical/electronic products including battery cells, battery modules or batteries, and the like.
The articles of the present application may include, for example, heat-generating components, elements, or products, as well as curable compositions (or two-component compositions) or cured bodies thereof present with heat-generating components and the like. In this case, as described above, the heat generating component, element or product may be a component, element or product having a suitable driving temperature in the range of about 15 ℃ to 60 ℃. That is, the curable composition of the present application may be used to be disposed adjacent to a heat generating component, element or product to uniformly maintain the driving temperature of the product within the above-described range.
The specific method of forming the article of the present application is not particularly limited, and if the curable composition or two-part composition of the present application or a cured body thereof is applied as a heat dissipating material, the article may be configured in various known methods.
In one example, the curable composition may be used as a potting material when constructing a battery module or battery pack. The potting material may be a material that covers at least a portion or all of the plurality of unit battery cells in the battery module or the battery pack while being in contact therewith. When the curable composition of the present application or the cured body thereof is applied as a potting material, it can control heat generated in the battery module or the battery cells of the battery pack, can prevent chain fire or explosion, etc., and can uniformly maintain the driving temperature of the module, the pack, or the battery cells. In the present application, a curable composition having excellent potting efficiency can be provided because viscosity or thixotropy is controlled to an appropriate level before curing, and a stable potting structure is formed after curing without generating unnecessary bubbles. In the present application, such curable compositions may be provided: it is possible to provide a battery module or a battery pack having high power while being lightweight compared to a volume by showing low density after curing. In the present application, curable compositions having excellent desired physical properties (including insulation, etc.) can also be provided.
In this case, regarding the battery-related technology, the curable composition may be applied as a heat-dissipating material for a battery module, a battery pack, or the like, or a heat-dissipating material for an OBC (on-board charger) of an automobile. Accordingly, the present application may also relate to a battery module, a battery pack, or an on-board charger (OBC) comprising the curable composition or a cured body thereof as a heat dissipation material. In the battery module, the battery pack, or the in-vehicle charger, the application position or the application method of the curable composition or the cured body is not particularly limited, and known methods may be applied. Further, the curable composition of the present application is not limited to the above-mentioned uses, and can be effectively applied to various uses requiring excellent heat dissipation characteristics, storage stability, and adhesion.
In another example related to the present application, the present application may relate to an electronic device or apparatus having a cured body of a curable composition.
The type of the electronic apparatus or device is not particularly limited, and for example, it may be exemplified by AVN (audio video navigation ) for an automobile, or an OBC (on-board charger) module, an LED module, or an IC chip for an electric automobile, and a computer or a mobile device including the same.
The cured body of the curable composition may radiate heat within the apparatus or device, and may impart durability against impact, insulation, and the like.
In one example, the curable composition may be used as a battery potting material.
The application also relates to a battery module applying the potting material. Such a battery module can exhibit high power while being light in weight compared to the same volume, wherein heat generated from battery cells or the like is appropriately controlled, and problems such as chain fire do not occur.
In one example, a battery module may include: a substrate; a plurality of battery cells disposed on the substrate; and a curable composition or a cured product thereof covering at least a part or all of the plurality of battery cells.
In the above-described structure, in one example, the curable composition or the cured product (potting material) thereof may cover the battery cells while being in contact with the entire surfaces of the plurality of battery cells (except the surfaces of the battery cells that are in contact with the substrate side) (the structure of fig. 1), or may be in contact with only the upper portions of the plurality of battery cells (the structure of fig. 2).
Fig. 1 and 2 are schematic views of such a battery module structure, and are views showing the structure including a substrate (10), a battery cell (20), and a potting material (30, a curable composition or a cured product thereof). The battery module may further include an adhesive material (40) for securing the battery cells (20) to the substrate (10), and in one example, the adhesive material (40) may be configured to have thermal conductivity.
The specific configuration of the battery module (e.g., the type of battery cell, the substrate, and/or the adhesive material) is not particularly limited as long as the curable composition or the cured product thereof is applied as the potting material, and known materials may be applied.
For example, a known pouch-shaped battery cell, a rectangular battery cell, or a cylindrical battery cell may be applied as the battery cell, and a known material may also be applied as the base or adhesive material.
The manufacturing method of the battery module is not particularly limited, and it may be formed, for example, by the steps of: the curable composition is cast onto the upper portions of the plurality of battery cells formed on the substrate and cured if necessary.
Since the curable composition of the present application has proper viscosity and thixotropic properties, it can be effectively filled between the battery cells disposed very adjacently, and can exhibit desired heat insulating and heat shielding properties, etc., after the potting material is formed.
For example, a product such as a battery module or a battery pack may be manufactured by a method comprising the steps of: the curable composition is melted by maintaining it at an appropriate temperature, and the curable composition melted in the above step is applied to a heat generating component.
Here, the temperature in the step of melting the curable composition may be determined according to specific application aspects. For example, when the heat-generating product is the above-described battery cell, battery module, or battery pack, the lower limit of the temperature in the melting step may be about 40 ℃ or 50 ℃, and the upper limit thereof may be about 80 ℃ or 70 ℃. The temperature may be greater than or not less than any of the above-mentioned lower limits, or may be less than or not greater than any of the above-mentioned upper limits, or may be in the range of greater than or not less than any of the above-mentioned lower limits to less than or not greater than any of the above-mentioned upper limits. If the temperature is too low, the fluidity of the curable composition deteriorates, or the curing rate of the curable composition after melting is too fast, so that the application may not be easy, whereas if the temperature is too high, damage to the heat-generating product occurs, or the phase-change material having a relatively low density in the curable composition migrates to the surface, so that uneven cured body may also be generated.
The method of applying the melted curable composition to the heat generating component is not particularly limited, and the curable composition may be applied by a known potting process or other process.
Further, if necessary, a step of curing the curable composition after application may be performed, wherein an appropriate method may be selected as the curing method according to the type of the curable composition.
Advantageous effects
Curable compositions and uses thereof may be provided. When the curable composition of the present application is applied to a product that generates heat during a driving or maintenance process, a curable composition that can be used as a material capable of handling heat can be provided. The application of the curable composition of the present application to a product in which a plurality of heat-generating elements are integrated makes it possible to efficiently process heat generated by these elements while maintaining a uniform temperature of the product. Furthermore, the curable composition of the present application is applied to such a product so that even when abnormal heat, explosion or fire occurs in any one of the plurality of elements, the influence of such heat, explosion or fire on other adjacent elements can be prevented or minimized. The curable composition of the present application can also stably perform the above functions for a long period of time. The present application may also provide a cured body formed from such a curable composition, or the use of the curable composition or cured body.
Drawings
Fig. 1 and 2 are schematic views of an exemplary battery module of the present application.
Fig. 3 is a graph showing DSC analysis results of the cured products of examples 1 to 3, respectively.
Detailed Description
Hereinafter, the present application will be described in detail by way of examples, but the scope of the present application is not limited by the following examples.
1. Measurement of latent heat
Latent heat was evaluated in the following manner. Samples of about 3mg to 5mg or so were loaded into a DSC (differential scanning calorimeter) apparatus (TA instruments, model Q200). After the temperature zone of the apparatus for evaluating latent heat was set to-20 to 200 ℃, the heat absorption zone was measured while the temperature was increased at a rate of about 10 ℃/min, and the endothermic peak determined in the heat absorption zone was integrated to calculate latent heat (unit: J/g). The temperature at the inflection point from the left side of the endothermic peak is the latent heat region start temperature (start temperature), and the temperature at the inflection point from the right side start point is the latent heat region end temperature (offset temperature), where the width of the latent heat region is a value obtained by subtracting the start temperature from the offset temperature.
In measuring the latent heat of the phase change material, the relevant phase change material is used as a sample.
In measuring the latent heat of the cured body, a sample is prepared by curing the curable composition. Specifically, a mixture was prepared by mixing a main agent part and a curing agent part of a curable composition in a volume ratio of 1:1, and the mixture was left in a room at 80 ℃ for about 1 hour, and then applied to an aluminum pan to a thickness of about 10mm with a syringe, and held at room temperature (about 25 ℃) for 24 hours to prepare a cured body.
2. Melting point assessment
The melting point of the phase change material is evaluated in the following manner. About 3mg to about 5mg of the phase change material was loaded into a DSC (differential scanning calorimeter) apparatus (TA instruments, model Q200). The temperature zone of the apparatus was set to-20 ℃ to 200 ℃ and the endothermic peak was determined while raising the temperature at a rate of about 10 ℃/min. The temperature at the peak of the endothermic peak is designated as the melting point of the phase change material.
3. Weight change (DeltaW)
The main agent part and the curing agent part of the curable composition were mixed in a volume ratio of 1:1 to prepare a mixture. The mixture was kept in the chamber at 80 ℃ for about 1 hour and applied to an aluminum pan with a syringe to a thickness of about 10 mm. The applied mixture was kept at room temperature (about 25 ℃) for 24 hours and cured to prepare a cured body. A sample (weight: W) was prepared by cutting the cured body into squares each having a width and a length of 1cm i Unit g). The sample was placed on a filter paper and this state was kept in the chamber at about 80℃for about 24 hours, and then taken out, and the weight (weight: W f Unit g). The weight change rate (Δw) is measured by substituting the weight measured in the above process into the following formula a. For each of the four samples formed from the same curable composition, the weight change rate was measured, and the average values are described in tables 1 and 2 below.
[ A ]
ΔW＝100×(W f -W i )/W i
4. Temperature control performance test
The mixture was prepared by mixing the main agent part and the curing agent part of the curable composition in a volume ratio of 1:1. The mixture was kept in the chamber at 80 ℃ for about 1 hour and applied to an aluminum pan with a syringe to a thickness of about 10 mm. The applied mixture was kept at room temperature (about 25 ℃) for 24 hours and cured to prepare a cured body. Subsequently, the cured body was cut into squares each having a width and a length of 3cm to prepare a sample. A type K thermocouple was attached to the hot plate, and the sample was tightly attached thereto and fixed with tape. Subsequently, the temperature of the hotplate was raised from room temperature to about 35 ℃ at the same rate of rise in about 2 minutes, and after maintaining the temperature of 35 ℃ for about 10 minutes, the temperature was raised to 73 ℃ at the same rate of rise in about 10 minutes. After maintaining the temperature at 73 ℃ for about 22 minutes, the temperature was measured with a type K thermocouple.
5. Hardness measurement
The mixture was prepared by mixing the main agent part and the curing agent part of the curable composition in a volume ratio of 1:1. The mixture was kept in the chamber at 80 ℃ for about 1 hour and applied to an aluminum pan with a syringe to a thickness of about 10 mm. The applied mixture was kept at room temperature (about 25 ℃) for 24 hours and cured to prepare a cured body. The hardness of the cured body was measured according to ASTM D2240 standard. In hardness measurement, an ASKER durometer instrument was used. The initial hardness was measured by applying a load of about 1.5kg to the sample surface in a flat state, and the hardness was evaluated by confirming a stable measured value after 15 seconds. The shore a or shore OO hardness was measured.
6. Measurement of Density
The density of the cured body was determined according to ASTM D792 using a gas densitometer apparatus (model name: BELPYCNO, manufacturer: microtricEL). The apparatus can be used to determine density measurements at room temperature from helium injection. The main agent part and the curing agent part prepared in examples or comparative examples were mixed at a volume ratio of 1:1, and the mixed state was maintained in a room at 80 ℃ for about 1 hour, and then the mixture was applied to a thickness of about 10mm on an aluminum pan using a syringe, and then maintained at room temperature (about 25 ℃) for about 24 hours to be cured, thereby preparing a cured body.
GPC (gel permeation chromatography)
Molecular weight characteristics were measured using GPC (gel permeation chromatography). The analyte material was placed in a 5mL vial and diluted in toluene to a concentration of about 5 mg/mL. Thereafter, the standard sample for calibration and the material to be analyzed were filtered through a syringe filter (pore size: 0.45 μm), and then measured. As an analysis procedure, chemStation of Agilent Technologies was used, and the weight average molecular weight (Mw) and the number average molecular weight (Mn) were each obtained by comparing the elution time of a sample with a calibration curve. The measurement conditions of GPC are as follows.
< GPC measurement conditions >
Instrument: agilent technologies series 1200
Column: 2PLgel mix B from Polymer laboratories was used
Solvent: toluene (toluene)
Column temperature: 40 DEG C
Sample concentration: 5mg/mL, 10. Mu.L infusion
Standard sample: polystyrene (Mp: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)
8. Particle size analysis of the filler
The particle size of the filler was measured according to ISO-13320 using a Marven MASTERSIZER 3000 apparatus and ethanol was used as solvent in the measurement. As the particle diameter of the filler, the D50 particle diameter was measured, which was regarded as the average particle diameter. D50 particle diameter is the particle diameter (median diameter) at which 50% by volume of the particle size distribution is accumulated, which is the particle diameter at the point where the accumulated value becomes 50% on the accumulation curve with 100% by total volume after the volume-based particle size distribution is obtained.
Example 1.
Preparation of the Main agent fraction
The main agent part of the curable composition was prepared using a silicone resin component (manufactured by KCC, SL 3000) as the curable resin component. The main agent (SL 3000A) of the silicone resin component was mixed with n-behenate (sigma Aldrich) having a melting point of about 44 ℃ as a phase change material to prepare a main agent portion. The weight average molecular weight (Mw) of the main agent (SL 3000A) is about 28,000 g/mol. Further, in DSC analysis, the phase change material exhibits latent heat of about 180J/g or so in a temperature range of 20 ℃ to 60 ℃. In the mixing, about 25 parts by weight of the phase change material is mixed with respect to 100 parts by weight of the main agent (SL 3000A). In preparing the main agent part, first, the phase change material is uniformly stirred (300 rpm) at a temperature of about 60 ℃ for 1 hour and melted, and the other components of the main agent part are mixed with the melted phase change material, and then further stirred at 500rpm for 2 hours. The mixing of the phase change material and the other components of the main agent part is performed at a temperature of around 60 ℃. After that, the mixture was stirred at 50rpm for 20 minutes in a vacuum atmosphere and defoamed to prepare a main agent part.
Preparation of the curative part
The curing agent part is prepared by mixing a curing agent (SL 3000B) of a silicone resin component (manufactured by KCC, SL 3000) in the main agent part and a phase change material. As the phase change material, the same material as in the preparation of the main agent portion is used. The weight average molecular weight (Mw) of the curing agent (SL 3000B) was about 28,000g/mol. In the mixing, about 25 parts by weight of the phase change material is mixed with respect to 100 parts by weight of the curing agent (SL 3000B). In preparing the curative portion, first, the phase change material is uniformly stirred (300 rpm) at a temperature of about 60 ℃ for 1 hour and melted, the other components of the curative portion are mixed with the melted phase change material, and further stirred at 500rpm for 2 hours. The mixing of the phase change material and the other components of the curative portion is performed at a temperature of about 60 c. After that, the mixture was stirred at 50rpm for 20 minutes in a vacuum atmosphere and defoamed to prepare a main agent part.
Curable composition
The curable composition was prepared by preparing the main agent part and the curing agent part in a volume ratio of 1:1. The curable composition is room temperature curable, which can be cured by holding the curable composition at room temperature for about 12 hours or more. Fig. 3 is a graph showing the result of DSC analysis of the cured body.
Example 2.
Preparation of the Main agent fraction
As the curable resin component, a polyurethane component (manufactured by Lord, circalok 6410) was used. The main agent of the polyurethane component (manufactured by Lord, circalok 6410A) was mixed with the phase change material to prepare a main agent portion. As phase change materials, n-docosane (sigma Aldrich) used in example 1 and n-cyclopentadecane (C) having a melting point of about 53℃were used 25 Sigma Aldrich). In DSC analysis, paraffin wax (n-eicosapentaene (C) 25 ) A latent heat of about 175J/g or so is exhibited in a temperature range of 30 to 70 ℃. The mixing ratio of the main agent and paraffin wax at the time of mixing was 100:35:15 (Circalok 6410A: n-behenyl: n-eicosane).
Preparation of the curative part
The hardener part is prepared by mixing the hardener (Circalok 6410B) of the polyurethane component (Lord, circalok 6410) with the phase change material. As the phase change material, the same material as in the preparation of the main agent portion is used. The mixing ratio was 100:35:15 (Circalok 6410B: n-behenyl: n-eicosane) when mixed.
Curable composition
The curable composition was prepared by preparing the main agent part and the curing agent part in a volume ratio of 1:1. The curable composition is room temperature curable, which can be cured by holding the curable composition at room temperature for about 12 hours or more. Fig. 3 is a graph showing the result of DSC analysis of the cured body.
Example 3.
A curable composition was prepared in the same manner as in example 1 except that: aluminum hydroxide (ATH) (D50 particle size: about 50 μm, manufactured by Sigma Aldrich) was further compounded in preparing the main agent part and the curing agent part. In the preparation of the main agent part, the compounding weight ratio of the main agent (SL 3000A), n-docosane (sigma Aldrich) and aluminum hydroxide was set to 100:60:40 (main agent: n-docosane: ATH), and in the preparation of the curing agent part, the compounding weight ratio of the curing agent, the phase change material and aluminum hydroxide was set to 100:60:40 (curing agent: n-docosane: aluminum hydroxide). Fig. 3 is a graph showing the result of DSC analysis of the cured body.
Comparative example 1
A main agent part and a curing agent part and a curable composition were prepared in the same manner as in example 1, except that a phase change material was not compounded.
Comparative example 2.
A main agent part and a curing agent part and a curable composition were prepared in the same manner as in example 1 except that: in the preparation of the main agent part, the compounding weight ratio of the main agent (SL 3000A) and the phase change material was set to 100:80 (main agent: n-docosane), and in the preparation of the curing agent part, the compounding weight ratio of the curing agent and the phase change material was set to 100:80 (curing agent: n-docosane).
Comparative example 3.
A main agent part and a curing agent part and a curable composition were prepared in the same manner as in example 1 except that: in the preparation of the main agent part, the compounding weight ratio of the main agent (SL 3000A) and the phase change material was set to 100:17 (main agent: n-docosane), and in the preparation of the curing agent part, the compounding weight ratio of the curing agent and the phase change material was set to 100:17 (curing agent: n-docosane).
Comparative example 4.
Preparation of the Main agent fraction
The main agent part of the curable composition was prepared by mixing a silicone resin component (manufactured by damolychem, VP 100), the same phase change material (n-docosane) as used in example 1, and a catalyst (manufactured by damolychem, CP 101). The weight average molecular weight (Mw) of the resin component (VP 100) is about 6,000 g/mol. Mixing was carried out at a weight ratio of 100:0.5:25 (VP 100: CP101: n-behenyl). The mixing method was the same as in example 1.
Preparation of the curative part
The curing agent part was prepared using a silicone resin component (manufactured by daminochem, VP 100), a curing agent (manufactured by daminochem, FD 5020), and the same phase change material as in example 1. The silicone resin component (VP 100) has a weight average molecular weight (Mw) of about 6,000 g/mol. Mixing was carried out at a weight ratio of 100:3:25 (VP 100: FD5020: n-behenyl). The mixing method was the same as in example 1.
Curable composition
The curable composition was prepared by preparing the main agent part and the curing agent part in a volume ratio of 1:1. The curable composition is room temperature curable, which can be cured by holding the curable composition at room temperature for about 24 hours or more.
Comparative example 5.
Preparation of the Main agent fraction
The main agent part of the curable composition was prepared by mixing a silicone resin component (manufactured by damolychem, VP 1000), the same phase change material (n-docosane) as used in example 1, and a catalyst (manufactured by damolychem, CP 101). The weight average molecular weight (Mw) of the resin component (VP 1000) is about 28,000 g/mol. Mixing was carried out at a weight ratio of 100:0.5:25 (VP 1000: CP101: n-behenyl). The mixing method was the same as in example 1.
Preparation of the curative part
The curing agent part was prepared using a silicone resin component (manufactured by daminochem, VP 1000), a curing agent (manufactured by daminochem, FD 5020), and the same phase change material as in example 1. The silicone resin component (VP 1000) has a weight average molecular weight (Mw) of about 28,000 g/mol. Mixing was carried out at a weight ratio of 100:0.5:25 (VP 100: FD5020: n-behenyl). The mixing method was the same as in example 1.
Curable composition
The curable composition was prepared by preparing the main agent part and the curing agent part in a volume ratio of 1:1. The curable composition is room temperature curable, which can be cured by holding the curable composition at room temperature for about 24 hours or more.
Comparative example 6.
A main agent part and a curing agent part and a curable composition were prepared in the same manner as in example 1, except that in preparing the main agent part and the curing agent part, behenyl-1-ol (melting point about 72.5 ℃) was used as a phase change material instead of n-behenyl.
Comparative example 7.
A main agent part and a curing agent part and a curable composition were prepared in the same manner as in example 1, except that hexadecane (melting point about 18 ℃) was used as a phase change material instead of n-docosane in preparing the main agent part and the curing agent part.
The evaluation results of the above examples and comparative examples are summarized in tables 1 to 3 below. In the case of comparative example 7, curing of the curable composition did not proceed effectively, so that a cured body was not formed, and thus hardness, weight change, and temperature control properties could not be recognized.
TABLE 1
TABLE 2
TABLE 3
/>
Claims (18)
1. A curable composition comprising:
A curable resin component, and
the phase-change material is a phase-change material,
wherein the curable composition is configured to form a cured body exhibiting latent heat in the range of 20J/g to 200J/g,
wherein the latent heat has a starting temperature of 10 ℃ to 60 ℃ and
wherein the absolute value of Δw in the following formula 1 is 10% or less:
[ 1]
ΔW＝100×(W f -W i )/W i
Wherein W is f For the weight of the cured body measured after the cured body was kept at 80℃for 24 hours, and W i To the weight of the cured body before the cured body was held at 80 ℃ for 24 hours.
2. The curable composition of claim 1 wherein the latent heat region is from 15 ℃ to 40 ℃.
3. The curable composition of claim 1 or claim 2, wherein the cured body has a density of 0.5g/cm 3 To 2g/cm 3 Within a range of (2).
4. A curable composition according to any one of claims 1 to 3, wherein the cured body has a shore OO hardness of 40 or greater.
5. The curable composition of any one of claims 1 to 4, wherein the curable resin component has a weight average molecular weight of 9000g/mol or greater.
6. The curable composition of any one of claims 1 to 5, wherein the curable resin component is an acrylic resin component, a polyurethane component, a silicone resin component, or an epoxy resin component.
7. The curable composition of any one of claims 1 to 6, wherein the phase change material comprises a non-encapsulated phase change material.
8. The curable composition of any one of claims 1 to 7, wherein the phase change material comprises only phase change material having a melting point in the range of 30 ℃ to 60 ℃.
9. The curable composition of any one of claims 1 to 8, wherein the phase change material is one or more selected from fatty acids and paraffin waxes.
10. The curable composition of any one of claims 1 to 9, wherein the phase change material comprises a fatty acid or paraffin wax having a melting point in the range of 30 ℃ to 60 ℃ and a carbon number in the range of 10 to 30.
11. The curable composition of any one of claims 1 to 10, wherein the phase change material comprises one or more selected from n-nonadecane, n-docosane, n-eicosane, n-heneicosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, lauric acid, and myristic acid.
12. The curable composition according to any one of claims 1 to 11, wherein the phase change material is included in an amount of 20 parts by weight to 75 parts by weight of the phase change material relative to 100 parts by weight of the curable resin component.
13. The curable composition of any one of claims 1 to 12, further comprising one or more selected from the group consisting of: aluminum hydroxide (Al (OH) 3 ) Magnesium hydroxide (Mg (OH) 2 ) Calcium hydroxide (Ca (OH) 2 ) Boehmite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN), boron Nitride (BN), silicon nitride (Si) 3 N 4 ) Silicon carbide (SiC), zinc oxide (ZnO), and beryllium oxide (BeO).
14. A process for preparing a curable composition according to any one of claims 1 to 13 comprising mixing a melted phase change material and a curable resin component.
15. A cured body of the curable composition according to any one of claims 1 to 13.
16. An article of manufacture comprising:
heat generating assembly, and
the curable composition of any one of claims 1 to 13 present adjacent to the heat generating component.
17. An article of manufacture comprising:
heat generating assembly, and
the cured body of claim 14 present adjacent to the heat generating component.
18. A method for manufacturing an article comprising a heat-generating component, comprising:
melting the curable composition according to any one of claims 1 to 13 by maintaining the curable composition at a temperature in the range of 40 ℃ to 80 ℃; and
Applying a melted curable composition to the heat generating component.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2021-0134138 | 2021-10-08 | ||
| KR1020220128215A KR20230051094A (en) | 2021-10-08 | 2022-10-06 | Resin Composition |
| KR10-2022-0128215 | 2022-10-06 | ||
| PCT/KR2022/015189 WO2023059153A1 (en) | 2021-10-08 | 2022-10-07 | Curable composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117836361A true CN117836361A (en) | 2024-04-05 |
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|---|---|---|---|
| CN202280053742.3A Pending CN117836361A (en) | 2021-10-08 | 2022-10-07 | Curable composition |
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| Country | Link |
|---|---|
| CN (1) | CN117836361A (en) |
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2022
- 2022-10-07 CN CN202280053742.3A patent/CN117836361A/en active Pending
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