CN117835672A - Heat dissipation film, display module and display device - Google Patents

Abstract

The disclosure provides a heat dissipation film, a display module and a display device. The heat dissipation film includes: the functional layer is positioned between the metal layer and the bonding layer. The adhesive layer has charge conduction performance, and the functional layer has stress buffering performance. At least one side of the heat dissipation film, the edge of the at least one functional layer is retracted relative to the edge of the bonding layer, so that the metal layer is contacted with the bonding layer at the at least one side after the heat dissipation film is attached to the back film.

Description

Heat dissipation film, display module and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a heat dissipation film, a display module and a display device.

Background

In recent years, flexible display modules have been rapidly developed and widely used in various display products such as curved screen mobile phones, curved screen televisions, curved display screens, and the like. However, low gray scale display anomalies such as greenness and brightness occur soon after the curved display products are marketed, which hinders the wide range of market popularization. According to research, the surface of the protective layer (such as cover glass) may generate static electricity due to friction and the like in the use process of the display module, and the static electricity is conducted and accumulated in the back film, so that an electrostatic field is generated in the display module to influence the characteristics of the transistor, and the problem of abnormal low gray scale display may be caused.

Disclosure of Invention

In a first aspect of the present disclosure, there is provided a heat dissipation film for attaching to a back film of a display panel, the heat dissipation film comprising: the bonding layer is provided with charge conduction performance, and the functional layer is provided with stress buffering performance; at least one side of the heat dissipation film, the edge of at least one functional layer is retracted relative to the edge of the bonding layer, so that the metal layer is contacted with the bonding layer at the at least one side after the heat dissipation film is attached to the back film.

With reference to the first aspect of the present disclosure, in some embodiments, the functional layers include a plurality of functional layers, where the plurality of functional layers includes: the foam layer and the supporting layer are arranged in a stacked mode, the foam layer is arranged on one side, close to the metal layer, of the bonding layer, and the supporting layer is arranged on one side, far away from the bonding layer, of the foam layer; at least one side of the heat dissipation film, the edge of the supporting layer and the edge of the metal layer are retracted relative to the edge of the bonding layer.

In combination with the first aspect of the disclosure, in some embodiments, on at least one side of the heat dissipation film, along a direction perpendicular to the surface of the heat dissipation film, an edge of the support layer is flush with an edge of the metal layer, and an edge of the foam layer is flush with an edge of the adhesive layer.

With reference to the first aspect of the disclosure, in some embodiments, on at least one side of the heat dissipation film, an edge of the foam layer is retracted relative to an edge of the adhesive layer; the edge of the supporting layer and the edge of the metal layer are a first distance relative to the edge of the bonding layer, the edge of the foam layer is a second distance relative to the edge of the bonding layer, and the second distance is smaller than or equal to the first distance.

In combination with the first aspect of the present disclosure, in some embodiments, the first distance is greater than 150 microns and less than or equal to 250 microns.

In combination with the first aspect of the present disclosure, in some embodiments, the adhesive layer includes: the first bending part bends towards the metal layer relative to the first main body part to cover the side surface of the functional layer, and one end of the first bending part far away from the first main body part is in contact with the metal layer; alternatively, the metal layer includes: the second bending part bends towards the bonding layer relative to the second main body part to cover the side surface of the functional layer, and one end, far away from the second main body part, of the second bending part is in contact with the bonding layer.

In connection with the first aspect of the disclosure, in some implementationsIn an embodiment, the adhesive layer has a resistance of 10 ⁴ ～10 ⁵ Europe.

In combination with the first aspect of the disclosure, in some embodiments, the thickness of the adhesive layer is 25 to 35 micrometers in a direction perpendicular to the surface of the heat dissipation film.

In a second aspect of the present disclosure, there is provided a display module, including: a display panel; a back film disposed on a backlight side of the display panel; and a heat dissipation film provided in the first aspect of the present disclosure. The bonding layer of the heat dissipation film is attached to one side, far away from the display panel, of the back film, and the bonding layer of the heat dissipation film is in contact with the metal layer on at least one side of the heat dissipation film.

In combination with the second aspect of the disclosure, in some embodiments, the display panel has a curved side, at least one side of the heat dissipation film is a side opposite to the curved side, and the adhesive layer covers a side of the functional layer of the heat dissipation film and contacts the metal layer.

In combination with the second aspect of the disclosure, in some embodiments, the adhesive layer has an overflow portion that wraps around a side surface of the functional layer and is in contact with the metal layer, wherein the overflow portion is formed by the adhesive layer being pressed during the bonding process.

In combination with the second aspect of the present disclosure, in some embodiments, the functional layer of the heat dissipation film includes: the foam layer and the supporting layer are laminated; the edge of the supporting layer is retracted relative to the edges of the foam layer and the metal layer, and the overflow part coats the foam layer and the side surface of the supporting layer and is in contact with the metal layer.

In combination with the second aspect of the disclosure, in some embodiments, the adhesive layer has a lap portion, which is a portion beyond the other film layer edges of the heat dissipation film, the lap portion wraps around the side surface of the functional layer and is in contact with the metal layer.

In combination with the second aspect of the present disclosure, in some embodiments, the functional layer of the heat dissipation film includes: the foam layer and the supporting layer that range upon range of setting, the edge of supporting layer surpasss the edge of foam layer, the edge of metal layer surpasss the edge of supporting layer, overlap joint portion cladding foam layer and the side of supporting layer, with the metal layer contact.

In combination with the second aspect of the present disclosure, in some embodiments, at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the adhesive layer includes: the first bending part bends towards the metal layer relative to the first main body part to cover the side surface of the functional layer, and one end of the first bending part far away from the first main body part is in contact with the metal layer; the first main body part is attached to one side of the back film, which is far away from the display panel.

In combination with the second aspect of the present disclosure, in some embodiments, at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the metal layer includes: the second main body part is parallel to the connected functional layer, and the second bending part bends towards the bonding layer relative to the second main body part and coats the side surface of the functional layer. The adhesive layer includes: the first bonding area is an area bonded with the functional layer, the second bonding area is located outside the first bonding area, one side of the second bonding area is bonded with the back film, and the other side of the second bonding area is in contact with one end, far away from the second main body, of the second bending part.

In a third aspect of the present disclosure, there is provided a display device including: the display module provided in the second aspect.

In the heat dissipation film, the display module and the display device provided by some embodiments of the present disclosure, the adhesive layer with the charge conduction characteristic is provided, and at least one side of the heat dissipation film is configured to shrink the edge of at least one functional layer between the adhesive layer and the metal layer relative to the edge of the adhesive layer, so that after the heat dissipation film is attached to the back film, the metal layer contacts with the adhesive layer at least one side of the heat dissipation film, thereby enabling static charges accumulated in the back film to be conducted to the metal layer through the adhesive layer, and the static charges are released, so that accumulation of static charges on the back film is effectively reduced, electrostatic field generated in the display module is reduced, and low gray scale display abnormality of curved surface display products is facilitated to be improved.

The foregoing disclosure is merely an overview of the technical solutions provided by some embodiments of the present disclosure, and in order to make the technical means of the embodiments of the present disclosure more clear, the embodiments of the present disclosure may be implemented according to the content of the specification, and in order to make the embodiments of the present disclosure more understandable, the following details of the embodiments of the present disclosure are given below.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings that are required to be used in the description of the embodiments will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are of some embodiments of the present disclosure and that other drawings may be derived from these drawings without undue effort.

Fig. 1 illustrates a schematic structure of an exemplary display module;

FIG. 2 illustrates a schematic view of a target side structure of a heat dissipation film in accordance with some embodiments of the present disclosure;

FIG. 3 illustrates a schematic view of a target side structure of a heat dissipation film according to further embodiments of the present disclosure;

FIG. 4 illustrates a schematic view of a target side structure of a heat dissipation film in accordance with further embodiments of the present disclosure;

FIG. 5 illustrates a schematic view of a target side structure of a heat dissipation film in accordance with further embodiments of the present disclosure;

FIG. 6 illustrates a schematic view of a target side structure of a heat dissipation film in accordance with further embodiments of the present disclosure;

FIG. 7 is a schematic illustration showing the attachment of the heat dissipation film and the back film shown in FIG. 2;

fig. 8 illustrates a partial structure schematic view of a display module according to some embodiments of the present disclosure;

FIG. 9 illustrates a schematic plan view of a display panel according to some embodiments of the present disclosure;

FIG. 10 is a micrograph of a display module using the heat sink film of FIG. 2;

fig. 11 is a partial structure diagram illustrating a display module according to other embodiments of the present disclosure;

fig. 12 is a partial structure view illustrating a display module according to still other embodiments of the present disclosure;

fig. 13 illustrates a partial structure schematic view of a display module according to still other embodiments of the present disclosure; and

fig. 14 illustrates a schematic structure of a display device according to some embodiments of the present disclosure.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It should be noted that the term "plurality" appearing herein includes two or more cases. "at least one" includes one or more than one case. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. "up", "down", "left", "right" and the like are used only to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

The terms "parallel", "perpendicular", "equal" as used herein include the stated case as well as the case that is similar to the stated case, the range of which is within an acceptable deviation as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate or intervening layers may also be present between the layer or element and the other layer or substrate in an exemplary embodiment of the disclosure.

Fig. 1 shows a schematic structure of an exemplary display module. As shown in fig. 1, the display module may include a display panel PNL, a back film BL, a heat dissipation film SL, and the like. The back film BL is arranged on the backlight side of the display panel PNL, and the heat dissipation film SL is attached on one side of the back film BL far away from the display panel PNL. The organic film materials of the display module, such as the OLED mobile phone module, are all polar materials, for example, the substrate of the back film SL, such as PET (Polyethylene Terephthalate ), is a strong polar material, has a polarization-standing effect, and acts together with the power signal line Vss, so that the fringe electric field E of the product is strong. In addition, for curved display products, after the 3D Lamination (3D-Lamination) process of the display module is completed, the external film material such as the back film BL of the display panel PNL generally exceeds the edge of the display panel PNL, so that the dielectric constant of the edge position of the display module is increased, and the strength of the fringe electric field E is further increased, so that the electric charges in the substrate of the display panel PNL are pushed to the gate of the transistor, the channel of the transistor is opened, and the abnormal region is brighter during low-gray-scale display. Due to the stable retention characteristics of the substrate of the back film BL after polarization, the electric field still exists even if the static charge Q on the surface of the cover glass CG in the later stage is eliminated.

Therefore, the inventor releases the accumulated charges in the back film by changing the film layer structure of the heat dissipation film, so as to reduce the electrostatic field in the display module and improve the problem of abnormal low gray scale display (such as brightness and greenness) of the curved surface display product. The heat dissipation film, the display module and the display device provided in some embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

Some embodiments of the present disclosure provide a heat dissipation film for attaching to a back film of a display panel. In some embodiments, the display panel may be a flexible display panel having at least one curved side. Taking the application to a curved screen cell phone as an example, two opposite long sides of the display panel may be curved sides. The heat dissipation film can play a role in heat dissipation and stress buffering of the display panel. In some embodiments, the heat dissipation film may be a Super Clean Foam (SCF) composite film.

The heat dissipation film has a multilayer laminated structure. In some embodiments, the heat dissipation film may include: the functional layer is positioned between the metal layer and the bonding layer. The functional layer has a stress buffering performance and can buffer external stress and impact applied to the display panel. The number of the functional layers may be one or more. When the display panel is used, the heat dissipation film is attached to the back film arranged on the backlight side of the display panel through the adhesive layer, and the adhesive layer and the back film are made of flexible materials, so that stamping is avoided, and attaching quality is guaranteed.

At least one side of the heat dissipation film, the edge of at least one functional layer is retracted relative to the edge of the bonding layer, so that the metal layer is contacted with the bonding layer after the heat dissipation film is attached to the back film. Because the heat dissipation film is attached to the back film through the bonding layer, the bonding layer has charge conduction characteristic, the bonding layer is in contact with the metal layer, electrostatic charges accumulated in the back film can be conducted to the metal layer, the metal layer can be grounded in the display device and is connected with the product shell through a conductive structure, and electrostatic charges can be released, so that the electrostatic fields in the display module are reduced, and the problem of abnormal low gray scale display of a curved surface display product is solved. In addition, the dielectric constant of the functional layer of the heat dissipation film is usually larger, and at least one functional layer is contracted, so that the strength of the fringe electric field is reduced. Compared with the modes of coating conductive liquid and the like, the conductive liquid realizes the conduction and release of charges, does not need to add equipment and additional processes, and has lower cost; compared with the method that the metal layer of the heat dissipation film is directly contacted with the back film, the method is beneficial to reducing stamping and ensuring laminating quality.

It should be noted that, the "at least one side of the heat dissipation film" may be one side, two sides, three sides, four sides, or the like of the heat dissipation film, and may be set according to the needs of the actual product. In some embodiments, the above-described "at least one side" may also be determined according to the adapted display panel shape and the number of curved sides. For example, the display panel with the heat dissipation film adapted is square, and includes a first side, a second side, a third side and a fourth side that are adjacent in sequence, where the first side and the third side are opposite to each other and are both curved sides of the display panel. Correspondingly, the heat dissipation film is also a square film, at least one side is two sides, and the two sides are opposite sides which are respectively matched with the first side and the third side. For convenience of explanation, the above-described "at least one side of the heat dissipation film" will be hereinafter referred to as the target side of the heat dissipation film.

In some embodiments, the heat dissipation film is used for curved screen display products, and the display panel has a curved side, and the target side may be a side of the heat dissipation film opposite to the curved side. When the 3D bonding process of the display module is performed, the target side of the heat dissipation film is bent along with the bending side of the display panel. After the 3D bonding process of the display module is completed, the bonding layer of the heat dissipation film is contacted with the metal layer at the target side, namely, the conduction of electrostatic charge can be realized between the bonding layer and the metal layer.

In some embodiments, the functional layer may include a foam layer (foam) disposed on a side of the adhesive layer proximate the metal layer. For example, polyurethane (PU) or other suitable materials may be used for the foam layer. In some embodiments, the foam layer may have a resistance of about 10 ¹⁰ The thickness may be about 80 microns.

In some embodiments, the functional layers between the adhesive layer and the metal layer may include, in addition to the foam layer described above: a supporting layer arranged on the foamThe side of the layer close to the metal layer plays a role in supporting and resisting impact. In some embodiments, the support layer may be black to enhance the integral black effect of the product. In some embodiments, the support layer may be a black PI (Polyimide) layer or other suitable support layer materials may also be used. In some embodiments, the resistance of the support layer may be about 10 ¹⁰ The thickness may be about 40 microns. Of course, in other embodiments, other functional layers may be further included between the adhesive layer and the metal layer, which is not limited in this disclosure according to actual needs.

In some embodiments, the adhesive layer may be an adhesive mesh (EMBO), or other suitable adhesive material. The grid glue can reduce bubbles generated when the foam layer and the display panel are mutually adhered, so that the connection strength between the heat dissipation film and the display panel is enhanced. Of course, the unused heat dissipation film may further include a protective film (also referred to as a bottom protective film), where the protective film is attached to a side of the adhesive layer away from the metal layer, so as to protect the adhesive layer. When in use, the protective film needs to be stripped firstly and then attached to the back film of the display panel.

It will be appreciated that the adhesive layer of conventional heat dissipation films is typically made of a relatively high resistance material, with a resistance of about 10 ⁹ Europe, is basically considered to be insulating and does not have electrostatic charge conduction properties. In some embodiments, the adhesive layer may be made of a material having relatively low resistance and adhesive properties, for example, a material having relatively low resistance (e.g., a resistance of about 10 ⁴ Europe), or a low-resistance adhesive layer can be formed by adding conductive materials such as carbon nanotubes or metal nanoparticles to the adhesive layer material of the conventional heat dissipation film, so that the adhesive layer has charge conduction characteristics. In some embodiments, the adhesive layer may have a resistance of 10 ⁴ ～10 ⁵ Europe, e.g. can be 10 ⁴ Europe or 10 ⁵ Europe, etc.

In some embodiments, the thickness of the adhesive layer may be 25 to 35 microns in a direction perpendicular to the surface of the heat sink film, e.g., may be 25 microns, 30 microns, 35 microns, or the like. The thickness of the bonding layer of the traditional heat dissipation film is about 50-70 micrometers, and the impedance of the bonding layer can be further reduced by reducing the thickness of the bonding layer, so that the charge conduction performance of the bonding layer is improved, and the accumulated static charges in the back film can be conducted to the metal layer to be released better.

The metal layer has heat dissipation performance and electric conduction performance. In some embodiments, the material of the metal layer may include copper, which may be about 50 microns thick. Of course, in other embodiments, other suitable metallic materials, such as aluminum, may be used for the metallic layer, which is not limited by the present disclosure.

Fig. 2 illustrates a schematic view of a target side structure of a heat dissipation film according to some embodiments of the present disclosure. As shown in fig. 2, the heat dissipation film 100 may include an adhesive layer 110, a foam layer 121, a support layer 122, and a metal layer 130, which are sequentially stacked. Foam layer 121 and support layer 122 are both functional layers 120 of heat dissipation film 100. The adhesive layer 110 is located on the side of the foam layer 121 away from the metal layer 130, and the support layer 122 is located on the side of the foam layer 121 close to the metal layer 130. In some embodiments, the metal layer 130 and the support layer 122 may be bonded by a pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA).

In some embodiments, on the target side of the heat dissipation film 100, the edges of the support layer 122 and the edges of the metal layer 130 are recessed relative to the edges of the adhesive layer 110 such that the edges of the adhesive layer 110 extend beyond the edges of the support layer 122, as shown in fig. 2.

In the 3D curved surface lamination process, the target side of the heat dissipation film 100 may bend along with the bending side of the display panel 200, the heat dissipation film 100 receives the pressure applied by the back film 101, and each film layer may be staggered. The adhesive layer 110 is an adhesive layer, has a certain fluidity, and is likely to overflow when subjected to pressure. According to the structure of the heat dissipation film 100 shown in fig. 2, the overlapping of the adhesive layer 110 and the metal layer 130 can be realized by skillfully utilizing the staggered layers generated by each film layer of the heat dissipation layer and the glue overflow generated by the adhesive layer 110 under the extrusion action of the back film 101 and the foam layer 121.

For convenience of description, the retracted distance of the support layer 122 and the metal layer 130 with respect to the adhesive layer 110 in fig. 2 is referred to as a first distance d1. The first distance D1 can be set according to the requirement of an actual product, and when the 3D lamination process is performed, the adhesive layer 110 and the metal layer 130 can be overlapped by the glue overflow of the adhesive layer 110 and the staggered layers of the film layers in the heat dissipation film 100, which is not limited in this disclosure. As verified by DOE (Design Of Experiment ), in some embodiments, the first distance d1 may be greater than 150 microns and less than or equal to 250 microns, e.g., may be 160 microns, 180 microns, 200 microns, 220 microns, 250 microns, etc.

In some embodiments, as shown in fig. 2, on the target side of the heat dissipation film 100, the edge of the support layer 122 is flush with the edge of the metal layer 130 in a direction perpendicular to the surface of the heat dissipation film 100 to facilitate processing.

In some embodiments, as shown in fig. 2, on the target side of the heat dissipation film 100, the edge of the foam layer 121 is flush with the edge of the adhesive layer 110, so that the adhesive layer 110 can be pressed by the back film 101 and the foam layer 121 from opposite sides during fitting, so that the adhesive layer 110 achieves a desirable overflow effect, and enough to be attached to the metal layer 130. In other embodiments, on the target side of the heat dissipation film 100, the edge of the foam layer 121 is also retracted relative to the edge of the adhesive layer 110, so that the blocking between the edge of the adhesive layer 110 and the metal layer 130 can be reduced, which is beneficial to making the portion of the edge of the adhesive layer 110 protruding from the functional layer 120 close to the metal layer 130 during bonding, so as to achieve overlap joint with the metal layer 130.

The edge of the foam layer 121 is retracted a second distance d2 from the edge of the adhesive layer 110. In some embodiments, the second distance d2 may be less than or equal to the first distance d1 described above. That is, the edges of the foam layer 121 may be flush with the edges of the support layer 122 and the metal layer 130, or may be located between the edges of the support layer 122 and the edges of the adhesive layer 110.

Fig. 3 illustrates a schematic view of a target side structure of the heat dissipation film 100 according to other embodiments of the present disclosure. As shown in fig. 3, on the target side of the heat dissipation film 100, the edges of the foam layer 121, the edges of the support layer 122, and the edges of the metal layer 130 are flush in the direction perpendicular to the surface of the heat dissipation film 100, i.e., the second distance d2 is equal to the first distance d1. The portion of the adhesive layer 110 beyond the edge of the metal layer 130 is thus substantially free of barriers on the side remote from the backing film 101 and can serve as a lap joint 114 to overlap the metal layer 130. When the 3D bonding process of the display module 10 is performed, each film layer on the target side of the heat dissipation film 100 may be staggered due to bending, so that the overlapping portion 114 of the adhesive layer 110 is close to the edge of the metal layer 130, and the adhesive layer 110 may be overlapped with the metal layer 130 by adding the flash generated by the pressed adhesive layer 110.

Fig. 4 illustrates a schematic view of a target side structure of the heat dissipation film 100 according to still other embodiments of the present disclosure. As shown in fig. 4, on the target side of the heat dissipation film 100, the edge of the foam layer 121 is retracted relative to the edge of the adhesive layer 110, the supporting layer 122 is flush with the edge of the metal layer 130, and is retracted relative to the edge of the foam layer 121, that is, the second distance d2 may be smaller than the first distance d1.

In other embodiments, the bonding layer 110 or the metal layer 130 may be shaped on at least one side of the heat dissipation film 100, so that the bonding layer 110 and the metal layer 130 in the heat dissipation film 100 overlap before bonding, which is beneficial to ensuring the reliability of the overlap between the bonding layer and the metal layer.

Fig. 5 illustrates a schematic view of a target side structure of the heat dissipation film 100 according to still other embodiments of the present disclosure. As shown in fig. 5, the adhesive layer 110 includes: the first main body 111 and the first bending portion 112 connected to the first main body 111. The first body portion 111 is parallel to the functional layer 120, such as the foam layer 121 described above. The first bending portion 112 bends toward the metal layer 130 with respect to the first body portion 111, and covers the side surfaces of the functional layers 120. One end of the first bending portion 112, which is far from the first body portion 111, is in contact with the metal layer 130. By profiled the adhesive layer 110, overlap of the adhesive layer 110 and the metal layer 130 is achieved to provide a release path for the electrostatic charge.

Fig. 6 illustrates a schematic view of a target side structure of the heat dissipation film 100 according to further embodiments of the present disclosure. As shown in fig. 6, the metal layer 130 includes: the second body 131 and the second bending part 132 connected to the second body 131. The second body portion 131 is parallel to the functional layer 120 such as the support layer 122 described above. The second bending portion 132 bends toward the adhesive layer 110 with respect to the second body portion 131, and covers the side surfaces of the functional layers 120. One end of the second bending portion 132 away from the second body portion 131 is in contact with the adhesive layer 110. By profiled the metal layer 130, overlap of the adhesive layer 110 and the metal layer 130 is achieved to provide a release path for the electrostatic charge.

As shown in fig. 5 and 6, the edges of the functional layers 120 (e.g., foam layer 121 and support layer 122) between the adhesive layer 110 and the metal layer 130 may be flush with respect to the metal layer 130 and the adhesive layer 110. In the embodiment corresponding to fig. 5, the metal layer 130 has a protruding portion 1301 protruding from the edge of the functional layer 120, and the first bending portion 112 of the adhesive layer 110 wraps the side surface of each functional layer 120, and contacts with the side of the protruding portion 1301 facing the adhesive layer 110. In the embodiment corresponding to fig. 6, the adhesive layer 110 may include a first adhesive region 1101 and a second adhesive region 1102, the first adhesive region 1101 being a region to be adhered to the functional layer 120, and the second adhesive region 1102 being a region other than the first adhesive region 1101. One side of the second bonding region 1102 is configured to bond with the back film 101, and the other side is in contact with an end of the second bending portion 132 remote from the second main body portion 131.

The first bending portion 112 and the second bonding region 1102 have bonding performance, and the first bending portion 112 contacts with the protruding portion 1301, or, one end of the second bending portion 132 away from the second main body portion 131 contacts with the second bonding region 1102, so that bonding of the two can be achieved, so as to ensure stability of the charge releasing path. In some embodiments, a conductive adhesive or a conductive cloth may be further coated at the bonding position to further improve the stability of the charge release path.

In some embodiments, the dimensions of the heat sink film 100 are slightly smaller than the dimensions of the backing film 101. Fig. 7 shows a schematic illustration of the attachment of the heat dissipation film 100 and the back film 101 shown in fig. 2. As shown in fig. 7, before the 3D bonding process, the edge of the adhesive layer 110 is shrunk compared to the edge of the back film 101, and the shrinking distance D may be greater than 0 and less than 300 micrometers, for example, may be 100 micrometers, 200 micrometers, 250 micrometers, or the like. The smaller the retraction distance D of the heat dissipation film 100 compared to the back film 101, the easier the film layers of the heat dissipation film 100 are contacted with each other when the 3D bonding process is performed on the display module 10.

Fig. 8 illustrates a partial structure schematic diagram of the display module 10 according to some embodiments of the present disclosure. As shown in fig. 8, some embodiments of the present disclosure further provide a display module 10, the display module 10 including: the display panel 200, the back film 101 and the heat dissipation film 100 provided in any of the above embodiments.

It should be noted that, in addition to the above structure, the display module 10 may further include other materials such as the protective layer 220 and the polarizer 210 (POL) shown in fig. 8, which may be determined according to the needs of the actual product. The protective layer 220 is disposed on the light emitting side of the display panel 200, and the polarizer 210 may be disposed between the display panel 200 and the protective layer 220. In some embodiments, the protective layer 220 may be Cover Glass (Cover Glass), which may be adhered to the side of the polarizer 210 away from the display panel 200 through the transparent optical paste 211 (Optically Clear Adhesive, OCA). Of course, in other embodiments, other materials such as transparent resin material, PET (Polyethylene terephthalate ) and the like may be used for the protective layer 220, which is not limited by the present disclosure. Taking cover glass as an example, when the cover glass is applied to curved surface display products, the cover glass is 3D cover glass. At least one side of the cover glass is bent, and the lamination of each layer of the display module 10 is realized through a 3D lamination process.

Fig. 9 illustrates a schematic plan view of a display panel 200 according to some embodiments of the present disclosure. As shown in fig. 9, the display panel 200 may include a display area AA and a non-display area SA disposed at least at one side of the display area AA. The display area AA includes a plurality of pixels arranged in an array, each pixel including a plurality of sub-pixels, each sub-pixel being capable of displaying a single color, e.g., red sub-pixel displaying red, green sub-pixel displaying green, and blue sub-pixel displaying blue. The brightness (gray scale) of the sub-pixels of different colors in each pixel can be adjusted, and display of multiple colors can be realized through color combination and superposition, thereby realizing full-color display of the display panel 200.

In some embodiments, the plurality of sub-pixels includes three sub-pixels, which are a first sub-pixel, a second sub-pixel, and a third sub-pixel, respectively, and the emission colors of the different sub-pixels are different. For example, the first subpixel may be a red subpixel, the second subpixel may be a green subpixel, and the third subpixel may be a blue subpixel. Of course, in other embodiments, each pixel may also include other numbers of sub-pixels, such as four sub-pixels, which may be set according to the actual application scenario, and this disclosure is not limited thereto.

In some embodiments, the display panel 200 is a flexible display panel, for example, may be an organic light emitting diode (Organic Light Emitting Diode, OLED) display panel or a quantum dot organic light emitting diode (Quantum Dot Light Emitting Diodes, QLED), which is specifically set according to the needs of the actual application scenario, and the disclosure is not limited thereto.

In some embodiments, the display panel 200 may include: a back plate and a display structure layer laminated on the back plate. In some embodiments, the side of the back plate away from the display structure layer may be the backlight side of the display panel 200, and the side of the display structure layer away from the back plate is the light emitting side of the display panel 200.

In some embodiments, the back plate may include: a substrate and a pixel driving layer disposed on the substrate. Of course, other structures may be further included in the back panel, specifically designed according to the needs of the actual product, for example, the back panel may further include a fingerprint identification circuit, etc., which is not limited in this disclosure.

In some embodiments, the substrate base may be a flexible substrate. The flexible substrate may include, for example, a PET substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) substrate, a PI substrate, or the like. The substrate may have a single-layer structure or a multi-layer structure. For example, the substrate base may include at least one flexible substrate and at least one buffer layer, the flexible substrate and the buffer layer being alternately stacked.

The pixel driving layer is used for forming a plurality of pixel driving circuits distributed in an array. The pixel driving circuit may include a plurality of electronic components such as transistors and capacitors. For example, the pixel driving circuits may each include three transistors and one capacitor, constituting 3T1C (i.e., one driving transistor, two switching transistors, and one capacitor). It is also possible to include more than three transistors and at least one capacitor, such as 4T1C (i.e., one driving transistor, three switching transistors, and one capacitor), 5T1C (i.e., one driving transistor, four switching transistors, and one capacitor), or 7T1C (i.e., one driving transistor, six switching transistors, and one capacitor), etc. The transistor may be a thin film transistor (Thin Film Transistor, TFT for short), a field effect transistor (metal oxide semiconductor, MOS for short), or other switching devices with the same characteristics.

It is understood that the transistor may include a control electrode, a first electrode, and a second electrode. Wherein the control electrode is a gate of a transistor, one of a source and a drain of a first electrode is a source and a drain of a transistor, and the second electrode is the other of the source and the drain of the transistor. Since the source and drain of a transistor may be symmetrical in structure, the source and drain may be indistinguishable in structure, and the source of the transistor may be referred to as a first pole or a second pole.

In some embodiments, the pixel driving layer may include an active layer, a first Gate metal layer (Gate 1), a second Gate metal layer (Gate 2), a first metal wiring layer (SD 1), and a second metal wiring layer (SD 2), which are configured to form transistors, capacitors, and a plurality of signal lines for pixel driving in the pixel driving circuit. For example, the plurality of signal lines may include: the power signal line, the data signal line, the reset signal line, the scan signal line, the enable signal line, the initialization signal line, and the like are specifically referred to in the related art, and will not be described in detail herein. The pixel driving layer may further include an insulating layer that separates the layers. It should be noted that the above-listed film layers of the pixel driving layer are only illustrative, and in other embodiments, the pixel driving layer may include more or fewer film layers, for example, further metal wiring layers, which is specifically set according to the needs of the actual product, and the disclosure is not limited thereto.

In some embodiments, the display structure layer may include: a light emitting device layer and an encapsulation layer. The light emitting device layer stack is disposed on a side of the pixel driving layer remote from the substrate. The light emitting device layer may include: a pixel defining layer and a plurality of light emitting devices. The pixel defining layer has a plurality of pixel openings, one pixel opening defining a location of one light emitting device. For example, the light emitting device may be an OLED light emitting device or a QLED light emitting device, or the like.

Taking an OLED light emitting device as an example, the light emitting device may include a first electrode, a light emitting layer, and a second electrode sequentially stacked in a direction away from the substrate. Of course, the light emitting device may further include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the first electrode and the light emitting layer, at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the second electrode and the light emitting layer, which is not limited in this disclosure, particularly according to actual needs.

In some embodiments, the first electrode may be an anode and the second electrode may be a cathode. The anode may have a composite structure formed by sequentially stacking transparent conductive oxide thin films/metal thin films/transparent conductive oxide thin films. The material of the transparent conductive oxide film is, for example, any one of ITO (Indium tin oxide) and IZO (Indium zinc oxide Indium zinc oxide), and the material of the metal film is, for example, any one of gold (Au), silver (Ag), nickel (Ni), and platinum (Pt). For another example, the anode may have a single-layer structure, and the material of the single-layer structure may be ITO, IZO, au, ag, ni, pt.

Each pixel opening exposes a portion of an anode of a corresponding light emitting device, and at least a portion of the light emitting layer is located within the corresponding pixel opening and electrically connected to the corresponding anode.

For example, the cathodes of the respective light emitting devices may be electrically connected to each other in a unitary structure. For example, the material of the cathode may be any one of aluminum (Al), silver (Ag), and magnesium (Mg), or any one of a magnesium-silver alloy and an aluminum-lithium alloy.

The packaging layer is arranged on one side of the light-emitting device layer far away from the substrate base plate so as to protect the light-emitting device. In some embodiments, the display panel 200 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. For example, the first and second inorganic encapsulation layers may be fabricated using inorganic materials such as nitrides, oxides, oxynitrides, nitrates, carbides, or any combination thereof, and the fabrication process may be a chemical vapor deposition (Chemical Vapor Deposition, CVD) process, such as a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process. For example, the organic insulating layer may be made of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene, or other materials, and the preparation process may be an Ink Jet Printing (IJP) process. Of course, in other examples, other encapsulation methods may be used, such as inorganic thin film encapsulation may also be used, which is not limited by the present disclosure.

In some embodiments, the display structure layer may further include a color film layer, and the color film layer may be disposed on a side of the encapsulation layer away from the substrate. In some embodiments, the color film layer may include: the color filter comprises a first color filter unit, a second color filter unit and a third color filter unit. The first color filter unit, the second color filter unit and the third color filter unit are color filter units with different colors. The first color filter unit, the second color filter unit, and the third color filter unit may have different thicknesses, respectively, or the same thickness, or two of the thicknesses are the same, and the other thickness is different, which is not limited by the present disclosure.

In some embodiments, adjacent color filter units of the color film layer do not overlap each other, and the color film layer further includes a black matrix disposed between the adjacent color filter units to absorb ambient light, reduce ambient light reflection of the display panel 200, and realize that the screen is off-screen in a dark state. Of course, in other embodiments, the first color filter unit and the second color filter unit may have a first overlap region, the second color filter unit and the third color filter unit may have a second overlap region, and the third color filter unit and the first color filter unit may have a third overlap region. When two filter units with different colors overlap, the light transmittance of the overlapping area is lower, so that the display panel can be used as a black matrix, and the first overlapping area, the second overlapping area and the third overlapping area of the display panel 200 can be used as the black matrix, so that the effect of shading light is achieved, and no additional black matrix is required.

In some embodiments, the first color filter unit is a red filter unit, the second color filter unit is a green filter unit, and the third color filter unit is a blue filter unit.

In some embodiments, the display panel 200 may further include a touch layer for implementing a touch function. In some embodiments, the touch layer may be disposed between the encapsulation layer and the color film layer to realize an in-screen touch structure, which is beneficial to reduce the thickness of the display panel 200. Of course, in other embodiments, the touch layer may be disposed at other positions of the display panel 200, which is not limited in this disclosure.

The back film 101 is disposed on the backlight side of the display panel 200, for example, on the side of the substrate away from the pixel driving layer. The adhesive layer 110 of the heat dissipation film 100 is attached to the side of the back film 101 away from the display panel 200. On at least one side of the heat dissipation film 100, that is, the target side of the heat dissipation film 100 described above, the adhesive layer 110 of the heat dissipation film 100 is in contact with the metal layer 130.

For the heat dissipation film 100 provided in the above-mentioned different embodiments, the contact manner between the adhesive layer 110 and the metal layer 130 is slightly different. In some embodiments, the display panel 200 has a curved side, and the target side of the heat dissipation film 100 is a side opposite to the curved side. For example, the first side 201 and the third side 202 of the display panel 200 in fig. 9 are curved sides, and then the target side of the heat dissipation film 100 includes: just to the side of the first side 201 and just to the side of the third side 202. On the target side of the heat dissipation film 100, the adhesive layer 110 covers the side surfaces of the functional layers 120 of the heat dissipation film 100 and contacts the metal layer 130. In the heat dissipation film 100 provided in the embodiment corresponding to fig. 2, 3 and 4, the adhesive layer 110 and the metal layer 130 are in a non-contact state before the 3D bonding process, and the pressure applied by bending along with the bending side of the display panel 200 during bonding is skillfully utilized to achieve the contact between the adhesive layer 110 and the metal layer 130 on the target side.

The display module 10 shown in fig. 8 employs the heat dissipation film 100 shown in fig. 2. As shown in fig. 8, the adhesive layer 110 has an overflow portion 113, and the overflow portion 113 covers the side surface of each functional layer 120 and contacts the metal layer 130. The overflow portion 113 is formed by pressing the adhesive layer 110 during the bonding process. The functional layer 120 between the adhesive layer 110 and the metal layer 130 includes: foam layer 121 and support layer 122 are laminated. Before lamination, on the target side of the heat dissipation film 100, the metal layer 130 of the heat dissipation film 100 is flush with the support layer 122, the foam layer 121 is flush with the adhesive layer 110, and the support layer 122 and the metal layer 130 are retracted relative to the adhesive layer 110. When the adhesive layer 110 is adhered, the target side of the heat radiation mold is bent along with the bending side of the display panel 200, and the adhesive layer 110 is pressed by the back film 101 and the foam layer 121 to overflow from the edge and is moved closer to the metal layer 130 due to the bending, thereby achieving contact with the metal layer 130.

In addition, in the 3D curved surface lamination process, the target side of the heat dissipation film 100 is bent along with the bending side of the display panel 200, so that each film layer of the heat dissipation film 100 is staggered on the target side. As with the heat dissipation film 100 shown in fig. 2, after the target side is bent, the edges of the support layer 122 are retracted relative to the edges of the foam layer 121 and the metal layer 130, as shown in fig. 8. It should be noted that, before lamination, the supporting layer 122 of the heat dissipation film 100 and the metal layer 130 are flush on the target side, as shown in fig. 2; when the heat dissipation film 100 is attached, the target side of the heat dissipation film is bent along with the bending side of the display panel 200, and the originally flush supporting layer 122 and the metal layer 130 may be staggered, so that the edge of the metal layer 130 exceeds the edge of the supporting layer 122, and is more easily contacted with the overflow portion 113 of the adhesive layer 110.

Fig. 10 shows a microscopic view of the display module 10 using the heat dissipation film 100 shown in fig. 2. As shown in fig. 10, after the lamination, the adhesive layer 110 is pressed on the target side of the heat dissipation film 100 and overflows from the edge to overlap with the metal layer 130 beyond the edge of the support layer 122.

Fig. 11 is a schematic view showing a partial structure of a display module 10 according to other embodiments of the present disclosure, and the display module 10 shown in fig. 11 employs the heat dissipation film 100 shown in fig. 3. Since the foam layer 121, the support layer 122 and the metal layer 130 of the heat dissipation film 100 shown in fig. 3 are all retracted at the target side with respect to the adhesive layer 110, the adhesive layer 110 has the lap joint portion 114 at the target side, such as the portion exceeding the edges of the other film layers of the heat dissipation film 100 in fig. 3. As shown in fig. 11, the lap joint portion 114 of the adhesive layer 110 wraps the side surface of each functional layer 120 and contacts the metal layer 130. Before the heat dissipation film 100 is attached, the foam layer 121, the support layer 122, and the metal layer 130 are flush, as shown in fig. 3; after lamination, since the target side of the heat dissipation film 100 is bent along with the bending side of the display panel 200, the originally flush foam layer 121, the supporting layer 122 and the metal layer 130 may be staggered on the target side, so that the edge of the supporting layer 122 slightly exceeds the edge of the foam layer 121, and the edge of the metal layer 130 slightly exceeds the edge of the supporting layer 122, thereby further facilitating the overlapping of the overlapping portion 114 of the adhesive layer 110 and the metal layer 130.

In some embodiments, in addition to the overlap 114, there may be spillage of the adhesive layer 110 when squeezed during the 3D fit. The contact of the adhesive layer 110 with the metal layer 130 can be effectively achieved by the reserved overlap 114 and the overflow.

In other embodiments, the target side of the heat dissipation film 100 may include any one or more sides of the heat dissipation film 100, and the adhesive layer 110 of the heat dissipation film 100 contacts the metal layer 130 itself on at least one side of the heat dissipation film 100 without depending on the pressure applied to the side of the heat dissipation film 100 by bending along with the bending side of the display panel 200 during the bonding. In some embodiments, the target side of the heat dissipation film 100 may include a side opposite the curved side in order to better dissipate static charge accumulated on the curved side of the back film 101.

Fig. 12 is a schematic view showing a partial structure of a display module 10 according to still other embodiments of the present disclosure, and the display module 10 shown in fig. 12 employs the heat dissipation film 100 shown in fig. 5. As shown in fig. 12, the target side of the heat dissipation film 100 is a side facing the curved side of the display panel 200, and is in a curved state shown in fig. 12 after bonding. The first body 111 of the adhesive layer 110 is attached to a side of the back film 101 away from the display panel 200, and the first bending portion 112 covers the side of each functional layer 120 of the heat dissipation film 100, and contacts the protruding portion 1301 of the metal layer 130, thereby forming an electrostatic charge conduction path from the back film 101 to the metal layer 130. The static charge accumulated in the back film 101 can be transferred to the first main body 111 of the adhesive layer 110, then transferred to the metal layer 130 through the first bending portion 112 of the adhesive layer 110, and then released.

Fig. 13 illustrates a partial structure diagram of a display module 10 according to still other embodiments of the present disclosure, and the display module 10 illustrated in fig. 13 employs the heat dissipation film 100 illustrated in fig. 6. As shown in fig. 13, the target side of the heat dissipation film 100 is a side facing the curved side of the display panel 200, and is in a curved state shown in fig. 13 after bonding. The adhesive layer 110 of the heat dissipation film 100 includes: a first bonding area 1101 and a second bonding area 1102. The first adhesive region 1101 is a region to which the functional layer 120 of the heat dissipation film 100 is adhered, that is, one side of the first adhesive region 1101 is adhered to the back film 101, and the other side is adhered to the functional layer 120 adjacent to the adhesive layer 110. The second bonding area 1102 is located outside the first bonding area 1101, one side of the second bonding area 1102 is bonded to the back film 101, and the other side is in contact with the second bent portion 132 of the metal layer 130. The second bending portion 132 of the metal layer 130 wraps the supporting layer 122 and the side surface of the foam layer 121, and an end of the second bending portion 132 away from the second main body portion 131 contacts the second bonding region 1102, so as to form an electrostatic charge conduction path from the back film 101 to the metal layer 130.

Fig. 14 shows a schematic structural diagram of a display device 1 according to some embodiments of the present disclosure. As shown in fig. 14, some embodiments of the present disclosure provide a display device 1, including the display module 10 provided in any of the above embodiments. In some embodiments, the display device 1 may be a curved screen display product, for example, may be a product or a component with a display function, such as a display, a television, a tablet computer, a notebook computer, a mobile phone, a digital photo frame, a navigator, etc. Of course, the display device 1 provided by the embodiments of the present disclosure is not limited to the above-listed types.

It should be noted that, the drawings of the embodiments of the present disclosure relate only to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design. The embodiments of the present disclosure and features in the embodiments may be combined with each other to arrive at a new embodiment without conflict.

While some embodiments of the present disclosure have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the disclosure.

Claims (17)

1. A heat dissipation film for attaching to a back film of a display panel, the heat dissipation film comprising: the bonding layer is provided with charge conduction performance, and the functional layer is provided with stress buffering performance;

at least one side of the heat dissipation film, the edge of at least one functional layer is retracted relative to the edge of the bonding layer, so that the metal layer is contacted with the bonding layer at the at least one side after the heat dissipation film is attached to the back film.

2. The heat dissipation film of claim 1, wherein the plurality of functional layers comprises: the foam layer and the supporting layer are arranged in a stacked mode, the foam layer is arranged on one side, close to the metal layer, of the bonding layer, and the supporting layer is arranged on one side, far away from the bonding layer, of the foam layer;

at least one side of the heat dissipation film, the edge of the supporting layer and the edge of the metal layer are retracted relative to the edge of the bonding layer.

3. The heat sink film of claim 2, wherein an edge of the support layer is flush with an edge of the metal layer and an edge of the foam layer is flush with an edge of the adhesive layer on at least one side of the heat sink film in a direction perpendicular to a surface of the heat sink film.

4. The heat sink film of claim 2 wherein the edges of the foam layer are recessed relative to the edges of the adhesive layer on at least one side of the heat sink film; the edge of the supporting layer and the edge of the metal layer are a first distance relative to the edge of the bonding layer, the edge of the foam layer is a second distance relative to the edge of the bonding layer, and the second distance is smaller than or equal to the first distance.

5. The heat spreading film of claim 4 wherein the first distance is greater than 150 microns and less than or equal to 250 microns.

6. The heat dissipation film according to claim 1, wherein the adhesive layer comprises: the first bending part bends towards the metal layer relative to the first main body part to cover the side surface of the functional layer, and one end of the first bending part far away from the first main body part is in contact with the metal layer; or,

the metal layer includes: the second bending part bends towards the bonding layer relative to the second main body part to cover the side surface of the functional layer, and one end, far away from the second main body part, of the second bending part is in contact with the bonding layer.

7. The heat dissipation film according to claim 1, wherein the adhesive layer has a resistance value of 10 ⁴ ～10 ⁵ Europe.

8. The heat dissipation film according to claim 1, wherein the thickness of the adhesive layer is 25 to 35 μm in a direction perpendicular to the surface of the heat dissipation film.

9. A display module, comprising:

a display panel;

a back film disposed on a backlight side of the display panel;

the heat dissipation film of any one of claims 1-8, wherein the adhesive layer of the heat dissipation film is attached to a side of the back film remote from the display panel, and the adhesive layer of the heat dissipation film is in contact with the metal layer on at least one side of the heat dissipation film.

10. The display module of claim 9, wherein the display panel has a curved side, at least one side of the heat dissipation film is a side opposite to the curved side, and the adhesive layer covers a side of the functional layer of the heat dissipation film and contacts the metal layer.

11. The display module of claim 10, wherein the adhesive layer has an overflow portion that covers a side surface of the functional layer and is in contact with the metal layer, wherein the overflow portion is formed by the adhesive layer being pressed during the bonding process.

12. The display module of claim 11, wherein the functional layer comprises: the foam layer and the supporting layer are laminated; the edge of the supporting layer is retracted relative to the edges of the foam layer and the metal layer, and the overflow part coats the foam layer and the side surface of the supporting layer and is in contact with the metal layer.

13. The display module of claim 10, wherein the adhesive layer has a lap joint portion, the lap joint portion is a portion beyond edges of other film layers of the heat dissipation film, and the lap joint portion wraps a side surface of the functional layer and is in contact with the metal layer.

14. The display module of claim 13, wherein the functional layer comprises: the foam layer and the supporting layer that range upon range of setting, the edge of supporting layer surpasss the edge of foam layer, the edge of metal layer surpasss the edge of supporting layer, overlap joint portion cladding foam layer and the side of supporting layer, with the metal layer contact.

15. The display module of claim 9, wherein at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the adhesive layer comprises: the first bending part bends towards the metal layer relative to the first main body part to cover the side surface of the functional layer, and one end of the first bending part far away from the first main body part is in contact with the metal layer;

The first main body part is attached to one side of the back film, which is far away from the display panel.

16. The display module of claim 9, wherein at least one side of the heat dissipation film is any one or more sides of the heat dissipation film, and the metal layer comprises: the second main body part is parallel to the connected functional layer, and the second bending part bends towards the bonding layer relative to the second main body part and covers the side surface of the functional layer;

the adhesive layer includes: the first bonding area is an area bonded with the functional layer, the second bonding area is located outside the first bonding area, one side of the second bonding area is bonded with the back film, and the other side of the second bonding area is in contact with one end, far away from the second main body, of the second bending part.

17. A display device, comprising: the display module of any one of claims 9-16.