CN117835565A - Circuit board splitting method and device, electronic device and storage medium - Google Patents
Circuit board splitting method and device, electronic device and storage medium Download PDFInfo
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- CN117835565A CN117835565A CN202410251732.1A CN202410251732A CN117835565A CN 117835565 A CN117835565 A CN 117835565A CN 202410251732 A CN202410251732 A CN 202410251732A CN 117835565 A CN117835565 A CN 117835565A
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000003860 storage Methods 0.000 title claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 177
- 230000007246 mechanism Effects 0.000 claims abstract description 84
- 238000003698 laser cutting Methods 0.000 claims abstract description 46
- 238000007664 blowing Methods 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 238000007733 ion plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a circuit board splitting method and device, electronic equipment and a storage medium, and relates to the technical field of circuit board splitting. The method comprises the following steps: pre-cutting the connecting circuit board; acquiring the positions of each first connecting part and each second connecting part, and determining the shortest cutting path passing through each first connecting part and the laser cutting path between the frame and the circuit board unit; placing the connecting circuit board in the positioning groove, covering the cover plate, and placing the board separating jig on the sliding mechanism; the driving mechanism drives the cutting tool to cut the connected circuit boards once along the shortest cutting path, so that every two adjacent circuit board units are separated; the laser cutting mechanism performs secondary cutting on the connected circuit board according to the laser cutting path, so that the circuit board unit is separated from the frame. According to the circuit board dividing method provided by the embodiment of the invention, the cutting efficiency and the cutting precision can be improved.
Description
Technical Field
The present invention relates to the field of circuit board separation technologies, and in particular, to a circuit board separation method and apparatus, an electronic device, and a storage medium.
Background
In the prior art, in order to improve the production efficiency in the process of manufacturing a circuit board, a plurality of circuit board units are generally manufactured in one circuit board substrate, so as to obtain a connected circuit board including a plurality of circuit board units. After the manufacture of the connecting circuit board is completed, the connecting circuit board is further required to be divided into a plurality of circuit board units, namely, the connecting circuit board is divided. When the circuit board is split, a stamp hole is usually made or a V-cut is formed in advance at the edge of each circuit board unit, and then each circuit board unit is manually separated from the connecting circuit board along the stamp hole or the V-cut. However, by adopting the board separation mode, burrs are easily generated at the edge of the circuit board unit, and the speed of board separation is low, so that the requirement of high-efficiency mass production cannot be met.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a circuit board splitting method and device, electronic equipment and storage medium, which can improve the speed and quality of splitting.
On the one hand, the circuit board dividing method is applied to circuit board dividing equipment, the circuit board dividing equipment comprises a dividing jig and a cutting machine table, the dividing jig comprises a base and a cover plate, the base is provided with positioning grooves, each positioning groove comprises a plurality of fixing grooves distributed in an array, a cutting channel is arranged between two adjacent fixing grooves, and a dust collecting device communicated with the cutting channel is arranged at the bottom of each positioning groove; the positioning groove is used for placing a connecting piece circuit board, the connecting piece circuit board comprises a frame and a plurality of circuit board units which are arranged in the frame and distributed in an array, and the circuit board units are in one-to-one correspondence with the fixing grooves; the cover plate is covered on the base, and is provided with an avoidance groove matched with the cutting position of the connecting piece circuit board; the cutting machine table comprises a sliding mechanism, a cutting tool, a laser cutting mechanism, a driving mechanism for driving the cutting tool to move and cut, a hairbrush arranged on the outer side of the cutting tool and an air blowing mechanism; the circuit board separating method comprises the following steps:
pre-cutting the connecting piece circuit board, forming a first through groove between every two adjacent circuit board units, and forming a second through groove between the circuit board units and the frame; every two adjacent circuit board units are connected through a first connecting part positioned at one side of the first through groove, and the circuit board units are connected with the frame through a second connecting part positioned at one side of the second through groove;
acquiring the position of each first connecting part and each second connecting part, determining the shortest cutting path passing through each first connecting part according to the position of each first connecting part, and determining the laser cutting path between the frame and the circuit board unit according to the position of each second connecting part;
placing the connecting piece circuit board in the positioning groove, covering the cover plate, and placing the board dividing jig on the sliding mechanism;
after the sliding mechanism moves the connecting circuit board to a cutting position, the driving mechanism drives the cutting tool to cut the connecting circuit board once along the shortest cutting path, so that every two adjacent circuit board units are separated; in the process of one-time cutting, the hairbrush moves along with the cutting tool to clean the surface of the connecting piece circuit board;
the laser cutting mechanism performs secondary cutting on the connecting piece circuit board according to the laser cutting path so as to separate the circuit board unit from the frame;
the blowing mechanism blows the continuous circuit board, and impurities generated in the cutting process are blown into the dust collecting device through the cutting channel.
According to some embodiments of the invention, the number of the sliding mechanisms is two, and each sliding mechanism is used for placing one separating plate jig; the circuit board separating method further comprises the following steps:
after cutting of one of the connected circuit boards is completed, the corresponding sliding mechanism moves the cut connected circuit board to a blanking position;
and simultaneously, the other sliding mechanism moves the other connecting circuit board to a cutting position so as to cut the other connecting circuit board.
According to some embodiments of the invention, the circuit board separating device further comprises a board grinding mechanism; the laser cutting mechanism performs secondary cutting on the continuous circuit board according to the laser cutting path, and after the step of separating the circuit board unit from the frame, the laser cutting mechanism further comprises:
and the board grinding mechanism grinds each circuit board unit along the shortest cutting path and the laser cutting path to remove burrs at the edge of each circuit board unit.
According to some embodiments of the invention, a cushion pad is disposed on a surface of the cover plate facing the base, one side of the cover plate is hinged to one side of the base, and a buckle structure matched with the other side of the cover plate and the other side of the base are disposed.
According to some embodiments of the invention, the surface of the cutting tool is coated with a coating material having a low affinity with the material of the monolithic circuit board, the coating material being applied to the surface of the cutting tool by means of ion plating.
According to some embodiments of the invention, the acquiring the position of each of the first connection portion and the second connection portion, determining the shortest cutting path through each of the first connection portions according to the position of each of the first connection portions, specifically includes:
acquiring the coordinates of the center point of each first connecting part, and taking the coordinates of the center point of each first connecting part as a node;
and calculating the shortest path from any one node to the rest nodes through the Floyd algorithm to serve as the shortest cutting path.
According to some embodiments of the invention, each fixing groove is provided with a support column, and the connecting piece circuit board is provided with a positioning hole matched with the support column.
On the other hand, the circuit board separating device comprises a separating jig and a cutting machine table, wherein the separating jig comprises a base and a cover plate, the base is provided with positioning grooves, each positioning groove comprises a plurality of fixing grooves distributed in an array, a cutting channel is arranged between every two adjacent fixing grooves, and a dust collecting device communicated with the cutting channel is arranged at the bottom of each positioning groove; the positioning groove is used for placing a connecting piece circuit board, the connecting piece circuit board comprises a frame and a plurality of circuit board units which are arranged in the frame and distributed in an array, and the circuit board units are in one-to-one correspondence with the fixing grooves; the cover plate is covered on the base, and is provided with an avoidance groove which is matched with the cutting path of the connecting piece circuit board; the cutting machine table comprises a sliding mechanism, a cutting tool, a laser cutting mechanism, a driving mechanism for driving the cutting tool to move and cut, a hairbrush arranged on the outer side of the cutting tool and an air blowing mechanism; the circuit board splitting device is used for executing the circuit board splitting method.
On the other hand, the electronic device according to the embodiment of the invention includes:
a memory for storing program instructions;
and the processor is used for calling the program instructions stored in the memory and executing the circuit board splitting method according to the obtained program instructions.
On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer-executable instructions for causing a computer to execute the circuit board splitting method described in the above embodiment.
The circuit board splitting method and device, the electronic equipment and the storage medium have at least the following beneficial effects: firstly, pre-cutting the connecting circuit board, so that the difficulty in separating the connecting circuit board is reduced, and the board separation efficiency is improved; then, cutting the connected circuit boards for one time according to the shortest cutting path by using a cutting tool, so that the circuit board units are mutually separated, and the cutting speed can be improved and the production efficiency can be improved because the shortest cutting path is calculated in advance; finally, the laser cutting mechanism is utilized to cut the frame and the circuit board unit, and the connection part of the frame and the circuit board unit contains copper, so that the cutting difficulty is relatively high, and the cutting precision can be improved by adopting a laser cutting mode. Therefore, the laser cutting device utilizes the cutting tool to perform mechanical cutting, utilizes the laser cutting mechanism to perform laser cutting, and can achieve both cutting efficiency and cutting precision. In addition, the surface of the circuit board unit is cleaned through the hairbrush and the blowing mechanism, so that the surface of the circuit board unit can be ensured to be clean.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a circuit board separating device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a board separating jig according to an embodiment of the invention;
FIG. 3 is a schematic view illustrating an internal structure of a cutting table according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a circuit board with a connecting piece according to an embodiment of the present invention;
FIG. 5 is a flow chart showing steps of a circuit board splitting method according to an embodiment of the present invention;
reference numerals:
the board dividing jig 100, the base 110, the positioning groove 111, the fixing groove 112, the cutting channel 113, the cover plate 120, the avoiding groove 121, the cutting machine 200, the sliding mechanism 210, the cutting tool 220, the driving mechanism 230, the brush 240, the blowing mechanism 250, the connecting circuit board 300, the frame 310, the circuit board unit 320, the first through groove 330, the first connecting part 340, the second through groove 350 and the second connecting part 360.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are set for convenience of illustration only, and the order between the steps is not limited in any way, and the execution order of the steps in the embodiments may be adaptively adjusted according to the understanding of those skilled in the art.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," "third," and "fourth" and the like in the description and in the claims and drawings are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In the prior art, in order to improve the production efficiency in the process of manufacturing a circuit board, a plurality of circuit board units are generally manufactured in one circuit board substrate, so as to obtain a connected circuit board including a plurality of circuit board units. After the manufacture of the connecting circuit board is completed, the connecting circuit board is further required to be divided into a plurality of circuit board units, namely, the connecting circuit board is divided. When the circuit board is split, a stamp hole is usually made or a V-cut is formed in advance at the edge of each circuit board unit, and then each circuit board unit is manually separated from the connecting circuit board along the stamp hole or the V-cut. However, by adopting the board separation mode, burrs are easily generated at the edge of the circuit board unit, and the speed of board separation is low, so that the requirement of high-efficiency mass production cannot be met.
Therefore, the embodiment of the invention provides a circuit board splitting method, equipment, electronic equipment and storage medium, wherein the circuit board splitting method, the equipment, the electronic equipment and the storage medium are used for pre-cutting the connected circuit board, so that the difficulty in splitting the connected circuit board is reduced, and the splitting efficiency is improved; then, cutting the connected circuit boards for one time according to the shortest cutting path by using a cutting tool, so that the circuit board units are mutually separated, and the cutting speed can be improved and the production efficiency can be improved because the shortest cutting path is calculated in advance; finally, the laser cutting mechanism is utilized to cut the frame and the circuit board unit, and the connection part of the frame and the circuit board unit contains copper, so that the cutting difficulty is relatively high, and the cutting precision can be improved by adopting a laser cutting mode. Therefore, the laser cutting device utilizes the cutting tool to perform mechanical cutting, utilizes the laser cutting mechanism to perform laser cutting, and can achieve both cutting efficiency and cutting precision. In addition, the surface of the circuit board unit is cleaned through the hairbrush and the blowing mechanism, so that the surface of the circuit board unit can be ensured to be clean.
The circuit board splitting method, the circuit board splitting device, the electronic equipment and the storage medium according to the embodiment of the invention are described in detail below with reference to the accompanying drawings.
In one aspect, as shown in fig. 1 to 4, an embodiment of the present invention provides a circuit board splitting device, where the circuit board splitting device includes a splitting jig 100 and a cutting machine 200, the splitting jig 100 includes a base 110 and a cover plate 120, the base 110 is provided with a positioning slot 111, the positioning slot 111 includes a plurality of fixing slots 112 distributed in an array, a cutting channel 113 is provided between two adjacent fixing slots 112, and a dust collecting device (not shown) communicating with the cutting channel 113 is provided at the bottom of the positioning slot 112; the positioning groove 112 is used for placing the connecting circuit board 300, the connecting circuit board 300 comprises a frame 310 and a plurality of circuit board units 320 which are arranged in the frame 310 and distributed in an array, and the circuit board units 320 are in one-to-one correspondence with the fixing grooves 112; the cover plate 120 is covered on the base 110, and the cover plate 120 is provided with an avoidance groove 121 which is matched with the cutting position of the connecting piece circuit board 300; the cutter station 200 includes a slide mechanism 210, a cutter 220, a laser cutting mechanism, a driving mechanism 230 for driving the cutter 220 to move and cut, a brush 240 disposed outside the cutter 220, and an air blowing mechanism 250.
Specifically, according to the circuit board separating apparatus of the embodiment of the present invention, when the integrated circuit board 300 is to be separated, the integrated circuit board 300 is first placed in the positioning groove 111 of the base 110, and at this time, each circuit board unit 320 on the integrated circuit board 300 is placed in the corresponding fixing groove 112. Then, the cover plate 120 is covered on the base 110, and the whole split plate jig 100 is placed on the sliding mechanism 210, and the sliding mechanism 210 drives the split plate jig 100 to the cutting position. After the board dividing jig 100 reaches the cutting position, the driving mechanism 230 drives the cutting tool 220 to cut the continuous circuit board 300 once according to a preset path, so that each circuit board unit 320 on the continuous circuit board 300 is separated from each other; then, the laser cutting mechanism performs secondary cutting on the integrated circuit board 300 such that the circuit board unit 320 and the frame 310 are separated from each other, thereby completing cutting of the integrated circuit board 300. The brush 240 is wrapped around the periphery of the cutter 220, and during the cutting process of the cutter 220, the brush 240 moves along with the cutter 220 to clean the surface of the circuit board unit 320, clean the impurities generated during the cutting process into the cutting channel 113, and enter the dust collecting device to collect the impurities. In addition, in the cutting process, the blowing mechanism 250 blows the whole integrated circuit board 300 to further clean the surface of the integrated circuit board 300, so that all impurities generated in the cutting process are blown into the dust collecting device, and the surface of each circuit board unit 320 is ensured to be clean.
On the other hand, the invention also provides a circuit board splitting method based on the circuit board splitting equipment of the embodiment of the above aspect, as shown in fig. 5, the method comprises the following steps:
step S100: pre-cutting the connection board 300, forming a first through slot 330 between each adjacent two of the circuit board units 320, and forming a second through slot 350 between the circuit board units 320 and the frame 310; each two adjacent circuit board units 320 are connected through a first connecting part 340 positioned at one side of the first through groove 330, and the circuit board units 320 are connected with the frame 310 through a second connecting part 360 positioned at one side of the second through groove 350;
specifically, as shown in fig. 4, in the process of manufacturing the monolithic circuit board 300, the monolithic circuit board 300 is pre-cut, such that a first through groove 330 is formed between every two adjacent circuit board units 320, and only the first connecting portion 340 connects between every two adjacent circuit board units 320, while a second through groove 350 is formed between the outermost circuit board unit 320 and the frame 310, and only the second connecting portion 360 connects between the circuit board unit 320 and the frame 310. Through such setting, can reduce the follow-up degree of difficulty that divides the board to the linking circuit board 300, when follow-up cutting the linking circuit board 300, only need cut first connecting portion 340 and second connecting portion 360 can, reduce the cutting degree of difficulty, promote cutting quality.
Step S200: acquiring the position of each of the first connection parts 340 and the second connection parts 360, determining a shortest cutting path passing through each of the first connection parts 340 according to the position of each of the first connection parts 340, and determining a laser cutting path between the frame 310 and the circuit board unit 320 according to the position of each of the second connection parts 360;
specifically, the integrated circuit board 300 is photographed by the image recognition device first, and the positions of the first connection parts 340 between the respective circuit board units 320 of the integrated circuit board 300 are recognized, and then the shortest cut path through all the first connection parts 340 is obtained by the operation. For example, the coordinates of the center point of each first connection part 340 may be first acquired, and the coordinates of the center point of each first connection part 340 may be taken as one node; and calculating the shortest path from any one node to the rest nodes through the Floyd algorithm to be used as the shortest cutting path. The shortest cutting path is only a cutting path for cutting the first connection portion 340 between the respective circuit board units 320. As shown in fig. 4, in the present example, a second connection part 360 and a second through groove 350 are further provided between the frame 310 and the outermost turn of the circuit board unit 320, and thus, it is also necessary to determine a laser cutting path, which is a cutting path for cutting the first connection part 340 between the frame 310 and the circuit board unit 320, according to the position of the second connection part 360 between the frame 310 and the circuit board unit 320.
Step S300: placing the connecting circuit board 300 in the positioning groove 111, covering the cover plate 120, and placing the board splitting jig 100 on the sliding mechanism 210;
specifically, the connection board 300 is placed in the positioning groove 111 of the base 110, and at this time, each circuit board unit 320 on the connection board 300 is placed in the corresponding fixing groove 112. When the cutting of the connection circuit board 300 is completed, each circuit board unit 320 falls into the corresponding fixing slot 112, so that the circuit board unit 320 can be conveniently taken out from the fixing slot 112.
Step S400: after the sliding mechanism 210 moves the continuous circuit board 300 to the cutting position, the driving mechanism 230 drives the cutting tool 220 to cut the continuous circuit board 300 once along the shortest cutting path, so that every two adjacent circuit board units 320 are separated; in the process of one-time cutting, the brush 240 moves along with the cutting tool 220 to clean the surface of the continuous circuit board 300;
specifically, when the board splitting jig 100 is placed on the sliding mechanism 210, the sliding mechanism 210 drives the board splitting jig 100 to the cutting position. When the board dividing jig 100 reaches the cutting position, the driving mechanism 230 drives the cutting tool 220 to cut the printed circuit board 300 once according to the pre-calculated shortest cutting path, so that the circuit board units 320 on the printed circuit board 300 are separated from each other. By cutting the continuous circuit board 300 according to the calculated shortest cutting path, the cutting time can be reduced and the production efficiency can be improved. Meanwhile, in the process of cutting by the cutting tool 220, since the brush 240 is wrapped around the periphery of the cutting tool 220, the brush 240 moves along with the cutting tool 220 to clean the surface of the circuit board 300, so as to clean the surface of the circuit board unit 320, clean the impurities generated in the cutting process into the cutting channel 113, enter the dust collecting device, and collect the impurities by the dust collecting device.
Step S500: the laser cutting mechanism performs secondary cutting on the continuous circuit board 300 according to the laser cutting path, so that the circuit board unit 320 is separated from the frame 310;
when the cutting tool 220 is cut, the first connection portions 340 between the respective circuit board units 320 are cut, and the respective circuit board units 320 are separated from each other, but since there is a connection between the outermost circuit board unit 320 and the frame 310, further cutting is required, so that the circuit board unit 320 is separated from the frame 310. For this, a laser cutting mechanism is used to perform laser cutting along the second connection portion 360 of the outermost circumference of the circuit board unit 320 such that the circuit board unit 320 is separated from the frame 310, thereby completing the cutting of the entire integrated circuit board 300.
Step S600: the continuous circuit board 300 is blown by the blowing mechanism 250, and foreign substances generated during the cutting process are blown into the dust collecting device through the cutting path 113.
In the whole cutting process, the blowing mechanism 250 blows the whole integrated circuit board 300, further cleans the surface of the integrated circuit board 300, ensures that all impurities generated in the cutting process are blown into the integrated device, and ensures the cleaning of the surface of each circuit board unit 320.
According to the circuit board splitting method provided by the embodiment of the invention, the connecting circuit board 300 is pre-cut, so that the difficulty in splitting the connecting circuit board 300 is reduced, and the splitting efficiency is improved; then, the cutting tool 220 is used to cut the continuous circuit board 300 once according to the shortest cutting path, so that the circuit board units 320 are separated from each other, and the cutting speed can be increased and the production efficiency can be improved because the shortest cutting path is calculated in advance; finally, the frame 310 and the circuit board unit 320 are cut by laser by using the laser cutting mechanism, and the connection part of the frame 310 and the circuit board unit 320 contains copper, so that the cutting difficulty is relatively high, and the cutting precision can be improved by adopting a laser cutting mode. Therefore, the present application makes use of the cutter 220 to perform mechanical cutting, and makes use of the laser cutting mechanism to perform laser cutting, so that both cutting efficiency and cutting accuracy can be achieved. In addition, the surface of the circuit board unit 320 is cleaned by the brush 240 and the blowing mechanism 250, so that the surface of the circuit board unit 320 can be ensured to be cleaned.
Further, as shown in fig. 1 and 2, in some embodiments of the present invention, the number of the sliding mechanisms 210 is two, and each sliding mechanism 210 is used for placing one split board fixture 100; the circuit board separating method of the embodiment of the invention further comprises the following steps:
after cutting of one of the connection boards 300 is completed, the corresponding sliding mechanism 210 moves the cut connection board 300 to a blanking position;
simultaneously, the other sliding mechanism 210 moves the other connecting circuit board 300 to the cutting position to cut the other connecting circuit board 300.
By arranging the two sliding mechanisms 210, two connecting circuit boards 300 can be cut alternately, and when one connecting circuit board 300 is cut and is subjected to blanking, the other connecting circuit board 300 can be cut, so that the production efficiency is improved.
Further, in some embodiments of the present invention, the circuit board separating apparatus further includes a board grinding mechanism, and after the laser cutting mechanism performs secondary cutting on the connected circuit board 300 according to the laser cutting path to separate the circuit board units 320 from the frame 310, the board grinding mechanism grinds each circuit board unit 320 along the shortest cutting path and the laser cutting path, and removes burrs at an edge of each circuit board unit 320, thereby improving quality of the final circuit board unit 320.
Further, in some embodiments of the present invention, a cushion pad is disposed on a surface of the cover 120 facing the base 110, one side of the cover 120 is hinged to one side of the base 110, and a fastening structure is disposed on the other side of the cover 120 and the other side of the base 110. Because one side of the cover plate 120 is hinged to one side of the base 110, the cover plate 120 can be conveniently opened or closed, and when the connecting circuit board 300 is placed in the positioning groove 111, the cover plate 120 is covered and the cover plate 120 is fixed by using the fastening structure, so that the connecting circuit board 300 can be fixed, and the connecting circuit board 300 is prevented from shifting in the cutting process. Meanwhile, since the cover plate 120 is provided with the buffer pad on one surface facing the base 110, the buffer pad can play a role in buffering when the cover plate 120 is covered, and damage to the printed circuit board 300 is prevented.
Further, in some embodiments of the present invention, the surface of the cutting tool 220 is coated with a coating material having low affinity with the material of the monolithic circuit board 300, and the coating material is coated on the surface of the cutting tool 220 by means of ion plating. When the cutting tool 220 cuts the continuous circuit board 300, generated chips adhere to the surface of the cutting tool 220, and when the service life of the cutting tool 220 is long, the chips affect the cutting performance of the cutting tool 220, resulting in a short service life of the cutting tool 220. In this example, however, by coating the surface of the cutter 220 with a coating material having low affinity with the material of the monolithic circuit board 300, it is possible to suppress adhesion of chips to the surface of the cutter 220, thereby improving the performance of the cutter 220 and securing the hardness of the cutter 220.
Further, in some embodiments of the present invention, each fixing groove 112 is provided with a support post, and the connection board 300 is provided with a positioning hole adapted to the support post. By arranging the support columns in the fixing grooves 112 and arranging the positioning holes on the connecting circuit board 300, the positioning and fixing functions of the connecting circuit board 300 can be achieved through the cooperation of the support columns and the positioning holes.
On the other hand, the embodiment of the invention also provides electronic equipment, which comprises:
a memory for storing program instructions;
and the processor is used for calling the program instructions stored in the memory and executing the circuit board splitting method according to the obtained program instructions.
The processor may be implemented by a general central processing unit (Central Processing Unit, CPU), a microprocessor, an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, etc. for executing related programs, so as to implement the technical solutions provided by the embodiments of the present application;
the Memory may be implemented in the form of Read Only Memory (ROM), static storage, dynamic storage, or random access Memory (Random Access Memory, RAM). The memory may store an operating system and other application programs, and when the technical scheme provided in the embodiments of the present disclosure is implemented by software or firmware, relevant program codes are stored in the memory, and the processor invokes the circuit board splitting method for executing the embodiments of the present disclosure; the memory and the processor may be connected by a bus or the like.
On the other hand, the embodiment of the invention also provides a storage medium, wherein the storage medium is a computer readable storage medium, and the storage medium stores a computer program which realizes the circuit board splitting method when being executed by a processor.
The memory, as a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof. The apparatus embodiments described above are merely illustrative, in which the elements illustrated as separate components may or may not be physically separate, implemented to reside in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and/or processing capabilities described in connection with a particular device or component may be performed by any other device or component. In addition, while various exemplary implementations and architectures have been described in terms of embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.
Certain aspects of the present disclosure are described above with reference to block diagrams and flowchart illustrations of systems, methods, systems and/or computer program products according to example embodiments. It will be understood that one or more blocks of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, respectively, can be implemented by executing computer-executable program instructions. Also, some of the blocks in the block diagrams and flowcharts may not need to be performed in the order shown, or may not need to be performed in their entirety, according to some embodiments. In addition, additional components and/or operations beyond those shown in blocks of the block diagrams and flowcharts may be present in some embodiments.
Accordingly, blocks of the block diagrams and flowchart illustrations support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions and program instruction means for performing the specified functions. It will also be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, can be implemented by special purpose hardware-based computer systems that perform the specified functions, elements or steps, or combinations of special purpose hardware and computer instructions.
Program modules, applications, etc. described herein may include one or more software components including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functions described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.
The software components may be encoded in any of a variety of programming languages. An exemplary programming language may be a low-level programming language, such as an assembly language associated with a particular hardware architecture and/or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler prior to execution by a hardware architecture and/or platform. Another exemplary programming language may be a higher level programming language that may be portable across a variety of architectures. Software components, including higher-level programming languages, may need to be converted to an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages include, but are not limited to, a macro language, a shell or command language, a job control language, a scripting language, a database query or search language, or a report writing language. In one or more exemplary embodiments, a software component containing instructions of one of the programming language examples described above may be executed directly by an operating system or other software component without first converting to another form.
The software components may be stored as files or other data storage constructs. Software components having similar types or related functionality may be stored together, such as in a particular directory, folder, or library. The software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. The circuit board separating method is characterized by being applied to circuit board separating equipment, wherein the circuit board separating equipment comprises a separating jig and a cutting machine table, the separating jig comprises a base and a cover plate, the base is provided with positioning grooves, each positioning groove comprises a plurality of fixing grooves distributed in an array, a cutting channel is arranged between every two adjacent fixing grooves, and a dust collecting device communicated with the cutting channel is arranged at the bottom of each positioning groove; the positioning groove is used for placing a connecting piece circuit board, the connecting piece circuit board comprises a frame and a plurality of circuit board units which are arranged in the frame and distributed in an array, and the circuit board units are in one-to-one correspondence with the fixing grooves; the cover plate is covered on the base, and is provided with an avoidance groove matched with the cutting position of the connecting piece circuit board; the cutting machine table comprises a sliding mechanism, a cutting tool, a laser cutting mechanism, a driving mechanism for driving the cutting tool to move and cut, a hairbrush arranged on the outer side of the cutting tool and an air blowing mechanism; the circuit board separating method comprises the following steps:
pre-cutting the connecting piece circuit board, forming a first through groove between every two adjacent circuit board units, and forming a second through groove between the circuit board units and the frame; every two adjacent circuit board units are connected through a first connecting part positioned at one side of the first through groove, and the circuit board units are connected with the frame through a second connecting part positioned at one side of the second through groove;
acquiring the position of each first connecting part and each second connecting part, determining the shortest cutting path passing through each first connecting part according to the position of each first connecting part, and determining the laser cutting path between the frame and the circuit board unit according to the position of each second connecting part;
placing the connecting piece circuit board in the positioning groove, covering the cover plate, and placing the board dividing jig on the sliding mechanism;
after the sliding mechanism moves the connecting circuit board to a cutting position, the driving mechanism drives the cutting tool to cut the connecting circuit board once along the shortest cutting path, so that every two adjacent circuit board units are separated; in the process of one-time cutting, the hairbrush moves along with the cutting tool to clean the surface of the connecting piece circuit board;
the laser cutting mechanism performs secondary cutting on the connecting piece circuit board according to the laser cutting path so as to separate the circuit board unit from the frame;
the blowing mechanism blows the continuous circuit board, and impurities generated in the cutting process are blown into the dust collecting device through the cutting channel.
2. The circuit board splitting method according to claim 1, wherein the number of the sliding mechanisms is two, and each sliding mechanism is used for placing one splitting jig; the circuit board separating method further comprises the following steps:
after cutting of one of the connected circuit boards is completed, the corresponding sliding mechanism moves the cut connected circuit board to a blanking position;
and simultaneously, the other sliding mechanism moves the other connecting circuit board to a cutting position so as to cut the other connecting circuit board.
3. The circuit board separation method according to claim 2, wherein the circuit board separation apparatus further comprises a board grinding mechanism; the laser cutting mechanism performs secondary cutting on the continuous circuit board according to the laser cutting path, and after the step of separating the circuit board unit from the frame, the laser cutting mechanism further comprises:
and the board grinding mechanism grinds each circuit board unit along the shortest cutting path and the laser cutting path to remove burrs at the edge of each circuit board unit.
4. The circuit board splitting method according to claim 1, wherein a buffer pad is arranged on one surface of the cover plate facing the base, one side of the cover plate is hinged to one side of the base, and a buckle structure matched with the other side of the cover plate and the other side of the base are arranged.
5. The circuit board separation method according to claim 1, wherein the surface of the cutting tool is coated with a coating material having low affinity with the material of the joint circuit board, and the coating material is coated on the surface of the cutting tool by means of ion plating.
6. The circuit board splitting method according to claim 1, wherein the acquiring the position of each of the first connection portion and the second connection portion, determining the shortest cutting path through each of the first connection portions according to the position of each of the first connection portions, specifically comprises:
acquiring the coordinates of the center point of each first connecting part, and taking the coordinates of the center point of each first connecting part as a node;
and calculating the shortest path from any one node to the rest nodes through the Floyd algorithm to serve as the shortest cutting path.
7. The circuit board splitting method according to claim 1, wherein each of the fixing grooves is provided with a support column, and the connecting circuit board is provided with a positioning hole matched with the support column.
8. The circuit board separating device is characterized by comprising a separating jig and a cutting machine table, wherein the separating jig comprises a base and a cover plate, the base is provided with positioning grooves, each positioning groove comprises a plurality of fixing grooves distributed in an array, a cutting channel is arranged between every two adjacent fixing grooves, and a dust collecting device communicated with the cutting channel is arranged at the bottom of each positioning groove; the positioning groove is used for placing a connecting piece circuit board, the connecting piece circuit board comprises a frame and a plurality of circuit board units which are arranged in the frame and distributed in an array, and the circuit board units are in one-to-one correspondence with the fixing grooves; the cover plate is covered on the base, and is provided with an avoidance groove which is matched with the cutting path of the connecting piece circuit board; the cutting machine table comprises a sliding mechanism, a cutting tool, a laser cutting mechanism, a driving mechanism for driving the cutting tool to move and cut, a hairbrush arranged on the outer side of the cutting tool and an air blowing mechanism; the circuit board splitting apparatus for performing the circuit board splitting method of any of claims 1-7.
9. An electronic device, comprising:
a memory for storing program instructions;
a processor for calling program instructions stored in the memory and executing the circuit board splitting method according to any one of claims 1 to 7 according to the obtained program instructions.
10. A storage medium storing computer-executable instructions for causing a computer to perform the circuit board splitting method of any one of claims 1-7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410251732.1A CN117835565B (en) | 2024-03-06 | 2024-03-06 | Circuit board splitting method and device, electronic device and storage medium |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410251732.1A CN117835565B (en) | 2024-03-06 | 2024-03-06 | Circuit board splitting method and device, electronic device and storage medium |
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| CN117835565A true CN117835565A (en) | 2024-04-05 |
| CN117835565B CN117835565B (en) | 2024-05-17 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200250786Y1 (en) * | 2001-06-23 | 2001-10-19 | 플렌티 아이슬랜드(타이완) 코포레이션 | Improvement of an image manage ment system for PCB cutting machine |
| CN1603072A (en) * | 2003-09-29 | 2005-04-06 | 和椿科技股份有限公司 | System and method for generating cutting path automatically |
| US20070166884A1 (en) * | 2005-12-29 | 2007-07-19 | Siliconware Precision Industries Co., Ltd. | Circuit board and package structure thereof |
| CN112806104A (en) * | 2018-10-11 | 2021-05-14 | 昕诺飞控股有限公司 | PCB module of separable module |
| CN217943508U (en) * | 2022-06-13 | 2022-12-02 | 珠海和普创电子科技有限公司 | PCB (printed circuit board) splitting jig |
-
2024
- 2024-03-06 CN CN202410251732.1A patent/CN117835565B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200250786Y1 (en) * | 2001-06-23 | 2001-10-19 | 플렌티 아이슬랜드(타이완) 코포레이션 | Improvement of an image manage ment system for PCB cutting machine |
| CN1603072A (en) * | 2003-09-29 | 2005-04-06 | 和椿科技股份有限公司 | System and method for generating cutting path automatically |
| US20070166884A1 (en) * | 2005-12-29 | 2007-07-19 | Siliconware Precision Industries Co., Ltd. | Circuit board and package structure thereof |
| CN112806104A (en) * | 2018-10-11 | 2021-05-14 | 昕诺飞控股有限公司 | PCB module of separable module |
| CN217943508U (en) * | 2022-06-13 | 2022-12-02 | 珠海和普创电子科技有限公司 | PCB (printed circuit board) splitting jig |
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| CN117835565B (en) | 2024-05-17 |
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