CN117822096A - Coil positioning method and semiconductor process equipment - Google Patents

Coil positioning method and semiconductor process equipment Download PDF

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Publication number
CN117822096A
CN117822096A CN202211182819.5A CN202211182819A CN117822096A CN 117822096 A CN117822096 A CN 117822096A CN 202211182819 A CN202211182819 A CN 202211182819A CN 117822096 A CN117822096 A CN 117822096A
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China
Prior art keywords
heating coil
thermal field
axial direction
distance
center
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CN202211182819.5A
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Chinese (zh)
Inventor
杨凯翼
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Priority to CN202211182819.5A priority Critical patent/CN117822096A/en
Publication of CN117822096A publication Critical patent/CN117822096A/en
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Abstract

The application discloses a coil positioning method and semiconductor process equipment, and relates to the field of semiconductors. The coil positioning method comprises the following steps: acquiring initial relative positions of the heating coils and the thermal field; moving the heating coil in the axial direction, and recording a first distance between the center of the heating coil and a reference position when the first end of the heating coil moves to the first end of the thermal field; moving the heating coil in the axial direction, and recording a second distance between the center of the heating coil and the reference position when the second end of the heating coil moves to the second end of the thermal field; obtaining the distance difference between the center of the heating coil and the center of the thermal field according to the first distance, the second distance and the axial distances of the two ends of the heating coil; the heating coil is moved according to the relative position and distance difference of the current heating coil and the thermal field, so that the center of the heating coil is aligned with the center of the thermal field. The coil moving device can solve the problem that a manual operation mode cannot accurately move the coil to the middle position of the thermal field.

Description

Coil positioning method and semiconductor process equipment
Technical Field
The application belongs to the technical field of semiconductors, and particularly relates to a coil positioning method and semiconductor process equipment.
Background
The silicon carbide crystal growing furnace is one equipment for preparing silicon carbide crystal with Physical Vapor Transport (PVT), and through loading silicon carbide powder into crucible and heating in heat field at over two thousand deg.c to gasify the powder and deposit on seed crystal inside the crucible, long time growth to form silicon carbide crystal.
Common heating methods of silicon carbide crystal growth furnaces include induction heating and resistance heating, wherein the induction heating is widely applied. The induction heating is to wind a coil around a thermal field, apply an alternating voltage to the coil by an induction power supply, excite an alternating electromagnetic field to act on the thermal field, generate an induction current and heat the thermal field. The coil serves as a termination for the heating module and has an important role in the quality of crystal growth, so how to use the coil efficiently and reduce hardware errors is critical.
At present, the coil of the silicon carbide crystal growth furnace can be lifted by a motor, and in order to uniformly couple the energy emitted by the coil to the whole thermal field, an operator needs to control the upper coil and the lower coil to respectively move to the middle positions of the two thermal fields after loading the thermal fields each time, taking a double-coil large-size crystal growth furnace as an example. However, the coil cannot be accurately moved to the middle position of the thermal field by a manual operation mode, so that uneven temperature distribution in the thermal field is caused, and the quality of a semiconductor product is affected.
Disclosure of Invention
The embodiment of the application aims to provide a coil positioning method and semiconductor process equipment, which at least can solve the problems that a manual operation mode cannot accurately move a coil to a middle position of a thermal field and the like.
In order to solve the technical problems, the application is realized as follows:
the embodiment of the application provides a positioning method of a coil, which is applied to semiconductor process equipment and comprises the following steps:
acquiring initial relative positions of heating coils and thermal fields of the semiconductor process equipment;
moving the heating coil in an axial direction, recording a first distance between a center of the heating coil and a reference position when a first end of the heating coil is moved to a position of the first end of the thermal field in the axial direction;
continuing to move the heating coil in the axial direction, recording a second distance between the center of the heating coil and the reference position when the second end of the heating coil moves to a position of the second end of the thermal field in the axial direction;
obtaining a distance difference between the center of the heating coil and the center of the thermal field according to the first distance, the second distance and the distances of the two ends of the heating coil in the axial direction;
The heating coil is moved according to the current relative position of the heating coil and the thermal field and the distance difference so that the center of the heating coil and the center of the thermal field are aligned in the axial direction.
The embodiment of the application also provides semiconductor process equipment, which comprises: a heating coil, a process chamber, a thermal field, a first position detection element, and a second position detection element;
the heating coil is arranged outside the process chamber and is movable in the axial direction of the process chamber;
the first position detection element is arranged at a first end of the heating coil in the axial direction, the second position detection element is arranged at a second end of the heating coil in the axial direction, the first position detection element is used for determining the position of the first end of the heating coil, and the second position detection element is used for determining the position of the second end of the heating coil;
the heating coil is positioned by adopting the positioning method of the coil.
In this embodiment of the present application, when the heating coil moves in the axial direction, a distance difference between the center of the heating coil and the center of the thermal field may be obtained, and the position of the heating coil is adjusted in combination with the relative position of the heating coil and the thermal field, so that the center of the heating coil and the center of the thermal field are aligned in the axial direction, thereby positioning the heating coil in the axial direction is achieved, and positioning accuracy in the axial direction is ensured. Based on the arrangement, the embodiment of the application can automatically position the heating coil in the axial direction, so that the energy fed into the thermal field can be ensured to be uniformly distributed in the axial direction, and the quality of semiconductor products can be improved; meanwhile, compared with a manual operation mode, the embodiment of the application can automatically execute the positioning function of the heating coil in the axial direction, so that the labor cost and the time cost can be saved, the efficiency and the stability are improved, and the personnel risk is reduced.
Drawings
Fig. 1 is a schematic step diagram of a coil positioning method disclosed in an embodiment of the present application;
FIG. 2 is a control flow diagram of a coil positioning method disclosed in an embodiment of the present application;
FIG. 3 is a first schematic view of an automatic positioning device for a heating coil in an axial direction according to an embodiment of the present application;
fig. 4 is a second schematic view of an automatic positioning device of a heating coil in an axial direction according to an embodiment of the present application;
FIG. 5 is a schematic view of a heating coil according to an embodiment of the present application in a position higher than the thermal field;
FIG. 6 is a schematic view of an automatic positioning device of a heating coil in a radial direction according to an embodiment of the present application;
FIG. 7 is a schematic view of a heating coil offset in a radial direction as disclosed in an embodiment of the present application;
fig. 8 is a schematic view of a process of adjusting the position of the heating coil in the radial direction according to the embodiment of the present application.
Reference numerals illustrate:
100-heating coils;
200-a process chamber;
300-thermal field;
410-a first position detection element; 411-transmitting end; 412-a receiving end; 420-a second position detecting element;
500-proximity switches;
610-a first distance detecting element; 620-a second distance detecting element; 630-third distance detection element.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The embodiments of the present application will be described in detail below with reference to the accompanying drawings by means of specific embodiments and application scenarios thereof.
Referring to fig. 1 to 8, an embodiment of the present application discloses a coil positioning method applied to semiconductor process equipment. Alternatively, the semiconductor processing apparatus may be a silicon carbide crystal growth furnace for performing a silicon carbide crystal growth process.
In some embodiments, the semiconductor process apparatus may include a heating coil 100, a process chamber 200, and a thermal field 300, wherein the thermal field 300 is disposed inside the process chamber 200, and the heating coil 100 is disposed outside the process chamber 200 to heat the process chamber 200 through the heating coil 100, thereby performing a semiconductor process within the process chamber 200.
Further, the heating coil 100 may reciprocate in an axial direction to achieve position adjustment, so that heat emitted from the heating coil 100 may be more uniformly coupled in the entire thermal field 300 within the process chamber 200 to improve the quality of semiconductor products.
Optionally, the semiconductor process apparatus may further include a lifting mechanism, and a lifting end of the lifting mechanism is connected to the heating coil 100 to drive the heating coil 100 to reciprocate in an axial direction through the lifting end, thereby achieving position adjustment. The lifting mechanism can adopt a combination mode of a motor, a screw rod and a sliding block, and can also adopt a mode of a linear motor, an air cylinder, a hydraulic cylinder and the like, so long as the lifting mechanism can drive the heating coil 100 to linearly reciprocate.
The coil positioning method disclosed by the embodiment of the application comprises the following steps:
s100, acquiring initial relative positions of a heating coil 100 and a thermal field 300 of semiconductor process equipment;
s200, moving the heating coil 100 in the axial direction, and recording a first distance between the center of the heating coil 100 and a reference position when the first end of the heating coil 100 moves to a position of the first end of the thermal field 300 in the axial direction;
s300, continuing to move the heating coil 100 in the axial direction, and recording a second distance between the center of the heating coil 100 and the reference position when the second end of the heating coil 100 moves to a position of the second end of the thermal field 300 in the axial direction;
s400, obtaining a distance difference between the center of the heating coil 100 and the center of the thermal field 300 according to the first distance, the second distance and the distances of the two ends of the heating coil 100 in the axial direction;
s500, moving the heating coil 100 according to the current relative position of the heating coil 100 and the thermal field 300 and the distance difference so that the center of the heating coil 100 is aligned with the center of the thermal field 300 in the axial direction. Here, the reference position may be a bottom end surface of the process chamber 200.
In the embodiment of the present application, a first distance from the center of the heating coil 100 to the reference position may be recorded when the first end of the heating coil 100 is opposite to the first end of the thermal field 300 in the axial direction, and a second distance from the center of the heating coil 100 to the reference position may be recorded when the second end of the heating coil 100 is opposite to the second end of the thermal field 300 in the axial direction. Based on this, the moving distance of the heating coil 100 in the axial direction can be obtained by the first distance and the second distance, and the sum of the moving distance of the heating coil 100 in the axial direction and the height of the heating coil 100 in the axial direction is the height of the thermal field 300 in the axial direction, that is, the distance between the first end and the second end of the heating coil 100, whereby the difference between the height of the center of the thermal field 300 in the axial direction and the height of the heating coil 100 in the axial direction can be obtained, which is the deviation value of the center of the heating coil 100 with respect to the center of the thermal field 300. Therefore, the center of the heating coil 100 and the center of the thermal field 300 can be aligned in the axial direction only by moving the heating coil 100 correspondingly in the axial direction according to the deviation value, thereby realizing the positioning of the heating coil 100 in the axial direction and ensuring the positioning accuracy in the axial direction.
Based on the above arrangement, the embodiment of the present application can automatically position the heating coil 100 in the axial direction, so as to ensure that the energy fed into the thermal field 300 is uniformly distributed in the axial direction, and further improve the quality of the semiconductor product; meanwhile, compared with a manual operation mode, the axial positioning function of the heating coil 100 can be automatically executed, so that labor cost and time cost can be saved, efficiency and stability are improved, and personnel risk is reduced.
In this embodiment, in the initial state, there are various relative positional relationships between the heating coil 100 and the thermal field 300, and optionally, the first end of the heating coil 100 is located above the second end of the heating coil 100, and the first end of the thermal field 300 is located above the second end of the thermal field 300. Various positional relationships of the two will be described in detail below.
The first relative positional relationship between the heating coil 100 and the thermal field 300 is: the heating coil 100 is located outside the range of the thermal field 300. Here, it should be noted that, in consideration of the movement range of the heating coil 100, in the embodiment of the present application, when the heating coil 100 is located outside the range of the thermal field 300, the heating coil 100 may be located entirely above the thermal field 300, and at this time, the center of the heating coil 100 may be brought close to the center of the thermal field 300 by moving down the heating coil 100, and finally, the centers of the two may be aligned in the axial direction to achieve the axial positioning.
The second relative positional relationship between the heating coil 100 and the thermal field 300 is: the first end of the heating coil 100 is located outside the range of the thermal field 300 and the second end of the heating coil 100 is located within the range of the thermal field 300. In practice, the upper end of the heating coil 100 is located at least partially outside the range of the thermal field 300 and the lower end is located at least partially within the range of the thermal field 300 such that the center of the heating coil 100 is located a distance above the center of the thermal field 300. In this manner, axial positioning may be achieved by moving the heating coil 100 downward such that the center of the heating coil 100 gradually approaches the center of the thermal field 300 from top to bottom, eventually aligning the centers of the two in the axial direction.
The third relative positional relationship between the heating coil 100 and the thermal field 300 is: the first end of the heating coil 100 is located within the thermal field 300 and the second end of the heating coil 100 is located outside the thermal field 300. In practice, the upper end of the heating coil 100 is at least partially located within the thermal field 300 and the lower end is at least partially located outside the thermal field 300 such that the center of the heating coil 100 is located a distance below the center of the thermal field 300. In this manner, axial positioning may be achieved by moving the heating coil 100 upward such that the center of the heating coil 100 gradually approaches the center of the thermal field 300 from bottom to top, eventually aligning the centers of the two in the axial direction.
The fourth relative positional relationship between the heating coil 100 and the thermal field 300 is: the heating coil 100 is located within the thermal field 300. In this case, the heating coil 100 is located in the range of the thermal field 300, and at this time, it is further necessary to determine a specific axial direction, for example, above or below, between the center of the heating coil 100 and the center of the thermal field 300, so as to correspondingly adjust the position of the heating coil 100 according to the specific direction, and finally align the centers of the two in the axial direction to achieve the axial positioning.
Based on the above, the embodiments of the present application can correspondingly adjust the position of the heating coil 100 according to the relative positions of the heating coil 100 and the thermal field 300, so that the heating coil 100 moves correspondingly, and finally, the center of the heating coil 100 and the center of the thermal field 300 are aligned in the axial direction, so as to realize axial positioning, and ensure the positional accuracy of the heating coil 100 in the axial direction.
For various relative positional relationships between the heating coil 100 and the thermal field 300, the embodiments of the present application provide corresponding adjustment manners, which are specifically as follows:
the first adjustment mode is as follows: in the case where the heating coil 100 is located outside the range of the thermal field 300, moving the heating coil 100 in the axial direction, when the first end of the heating coil 100 moves to be opposite to the first end of the thermal field 300, recording the distance between the center of the heating coil 100 and the reference position as a first distance; continuing to move the heating coil 100 in the axial direction, when the second end of the heating coil 100 moves to be opposite to the second end of the thermal field 300, the distance between the center of the recording heating coil 100 and the reference position is the second distance.
For example, in an initial case, the heating coil 100 may be positioned above the thermal field 300, the heating coil 100 is moved downward, the second end of the heating coil 100 first enters the thermal field 300, the heating coil 100 is moved downward continuously, and the first distance H is recorded when the first end of the heating coil 100 is moved to be opposite to the first end of the thermal field 300 1 The method comprises the steps of carrying out a first treatment on the surface of the Continuing to move the heating coil 100 downward, recording a second distance H when the second end of the heating coil 100 moves to be opposite to the second end of the thermal field 300 2 。
The height of the heating coil 100 in the axial direction is set to L, and thus the height of the thermal field 300 in the axial direction is set to H 1 -H 2 +L, and accordingly, the height of the center of the heating coil 100 in the axial direction is L/2, and the height of the center of the thermal field 300 in the axial direction is (H 1 -H 2 +L)/2. Finally, the heating coil 100 moves upward (H 1 -H 2 ) The distance of/2 is such that the center of the heating coil 100 is aligned with the center of the thermal field 300 in the axial direction, and thus, positioning of the heating coil 100 in the axial direction can be achieved.
The second adjustment mode is as follows: moving the heating coil 100 in the axial direction in a case where the first end of the heating coil 100 is located outside the range of the thermal field 300 and the second end of the heating coil 100 is located within the range of the thermal field 300, when the first end of the heating coil 100 is moved to be opposite to the first end of the thermal field 300, recording that the distance between the center of the heating coil 100 and the reference position is the first distance; continuing to move the heating coil 100 in the axial direction, when the second end of the heating coil 100 moves to be opposite to the second end of the thermal field 300, the distance between the center of the recording heating coil 100 and the reference position is the second distance.
It should be noted that, compared with the first adjustment mode, the second adjustment mode omits the moving process of the second end located above the thermal field 300 because the second end is located within the thermal field 300, and other adjustment processes are substantially the same as those of the first adjustment mode, which is not described herein.
Third adjustment mode: moving the heating coil 100 in the axial direction in a case where the first end of the heating coil 100 is within the range of the thermal field 300 and the second end of the heating coil 100 is outside the range of the thermal field 300, and recording a distance between the center of the heating coil 100 and the reference position as the second end of the heating coil 100 moves to be opposite to the second end of the thermal field 300 as a second distance; continuing to move the heating coil 100 in the axial direction, when the first end of the heating coil 100 moves to be opposite to the first end of the thermal field 300, the distance between the center of the recording heating coil 100 and the reference position is the first distance.
Illustratively, initially, the upper end of the heating coil 100 is located within the thermal field 300 and the lower end of the heating coil 100 is located outside the thermal field 300 such that the heating coil 100 is moved downward relative to the thermal field 300, moving the heating coil 100 upward until the second end of the heating coil 100 moves opposite the second end of the thermal field 300, at which point a second distance H is recorded 2 The method comprises the steps of carrying out a first treatment on the surface of the Continuing to move the heating coil 100 upward, recording a first distance H when a first end of the heating coil 100 moves to be opposite to a first end of the thermal field 300 1 。
The height of the heating coil 100 in the axial direction is set to L, and thus the height of the thermal field 300 in the axial direction is set to H 1 -H 2 +L, and accordingly, the height of the center of the heating coil 100 in the axial direction is L/2, and the height of the center of the thermal field 300 in the axial direction is (H 1 -H 2 +L)/2. Finally, the heating coil 100 moves downward (H 1 -H 2 ) The distance of/2 is such that the center of the heating coil 100 is aligned with the center of the thermal field 300 in the axial direction, and thus, positioning of the heating coil 100 in the axial direction can be achieved.
Fourth adjustment mode: in the case where the heating coil 100 is located within the range of the thermal field 300, moving the heating coil 100 along one side in the axial direction, when the first end of the heating coil 100 is moved to be opposite to the first end of the thermal field 300, recording the distance between the center of the heating coil 100 and the base position as a first distance; the heating coil 100 is moved along the other side of the axial direction, and when the second end of the heating coil 100 is moved to be opposite to the second end of the thermal field 300, the distance between the center of the recording heating coil 100 and the base position is the second distance.
Illustratively, in an initial situation, the heating coil 100 is entirely within the thermal field 300, in which case the heating coil 100 may be either up or down relative to the thermal field 300. The heating coil 100 may be moved upward first until a first end of the heating coil 100 moves opposite to a first end of the thermal field 300, at which time a first distance H is recorded 1 The method comprises the steps of carrying out a first treatment on the surface of the Conversely, the heating coil 100 is moved downward until the second end of the heating coil 100 is opposite to the second end of the thermal field 300, at which time a second distance H is recorded 2 。
The height of the heating coil 100 in the axial direction is set to L, and thus the height of the thermal field 300 in the axial direction is set to H 1 -H 2 +L, and accordingly, the height of the center of the heating coil 100 in the axial direction is L/2, and the height of the center of the thermal field 300 in the axial direction is (H 1 -H 2 +L)/2. Finally, the heating coil 100 moves upward (H 1 -H 2 ) The distance of/2 is such that the center of the heating coil 100 is aligned with the center of the thermal field 300 in the axial direction, and thus, positioning of the heating coil 100 in the axial direction can be achieved.
It should be noted that, in the fourth adjustment manner, the heating coil 100 may be moved downward first, so that the second end of the heating coil 100 is opposite to the second end of the thermal field 300, and the second distance H is recorded 2 The method comprises the steps of carrying out a first treatment on the surface of the And then upwardsMoving the heating coil 100 such that the first end of the heating coil 100 is opposite to the first end of the thermal field 300, and recording the first distance H 1 。
The height of the heating coil 100 in the axial direction is set to L, and thus the height of the thermal field 300 in the axial direction is set to H 1 -H 2 +L, and accordingly, the height of the center of the heating coil 100 in the axial direction is L/2, and the height of the center of the thermal field 300 in the axial direction is (H 1 -H 2 +L)/2. Finally, the heating coil 100 moves downward (H 1 -H 2 ) The distance of/2 is such that the center of the heating coil 100 is aligned with the center of the thermal field 300 in the axial direction, and thus, positioning of the heating coil 100 in the axial direction can be achieved.
In some embodiments, the process chamber 200 may be internally provided with a first thermal field and a second thermal field disposed at intervals in the axial direction, and correspondingly, the process chamber 200 is externally provided with a first heating coil and a second heating coil disposed at intervals in the axial direction, and the first heating coil is disposed corresponding to the first thermal field, and the second heating coil is disposed corresponding to the second thermal field, and at the same time, the first heating coil and the second heating coil may be reciprocally moved in the axial direction, respectively, so as to adjust the heat distribution of the first thermal field and the heat distribution of the second thermal field, respectively.
Based on the above arrangement, in the embodiment of the present application, the positioning method of the coil further includes:
moving a second heating coil of the semiconductor process equipment to a lower limit position;
axially positioning a first heating coil of the semiconductor processing apparatus such that a center of the first heating coil is aligned in an axial direction with a center of a first thermal field of the semiconductor processing apparatus;
the second heating coil is axially positioned such that a center of the second heating coil is aligned in an axial direction with a center of a second thermal field of the semiconductor processing apparatus.
It should be noted that, in this embodiment of the present application, the first heating coil may be preferentially axially positioned, and at this time, the second heating coil (the lower heating coil) is moved to the lower limit position, so that the distance between the second heating coil and the first heating coil is relatively large, so that the second heating coil may be prevented from interfering with the axial positioning process of the first heating coil. In addition, the specific principle and process of the axial positioning of the second heating coil are basically the same as those of the axial positioning of the first heating coil, and reference is specifically made to the above, and no further description is given here.
In this embodiment of the present application, the positioning method of the coil further includes:
Detecting a first space, a second space and a third space between the first position, the second position and the third position of the heating coil 100 and the outer wall of the quartz tube of the semiconductor process equipment respectively, wherein the projections of the first position, the second position and the third position on a projection plane perpendicular to the axial direction of the heating coil 100 are equal in distance from the axial line of the heating coil 100, and the three are positioned at different positions in the circumferential direction of the heating coil 100; specifically, on the projection surface, a line connecting the first position and the second position passes through the axis of the heating coil 100, a line connecting the third position and the axis of the heating coil 100 is perpendicular, and a line connecting the first position and the second position is perpendicular.
The positions of the heating coils 100 are adjusted in the radial direction of the quartz tube such that the first, second and third pitches are equal to the preset pitches, so that the center of the heating coils 100 is aligned with the center of the thermal field 300 in the radial direction of the quartz tube.
It should be noted that, after calibration, the heating coil 100 is radially coincident with the center of the thermal field 300, and at this time, the first distance d 1 Second distance d 2 And a third distance d 3 Equal to the preset distance d 0 The method comprises the steps of carrying out a first treatment on the surface of the When the center of the heating coil 100 is not radially coincident with the center of the thermal field 300, at least one of the first, second and third pitches may be changed in value to be not equal to the preset pitch, and at this time, the position of the heating coil 100 needs to be adjusted according to the actual offset condition. Radial positioning of the heating coil 100 is achieved by adjusting the position of the heating coil 100 in the radial direction so that the center thereof is aligned with the center of the thermal field 300 in the radial direction of the heating coil 100.
In order to adjust the relative positions of the center of the heating coil 100 and the center of the thermal field 300 in the radial direction so as to align the two centers, the positioning method of the coil in the embodiment of the present application further includes:
when the first interval is smaller than the preset interval and the second interval is larger than the preset interval, the heating coil 100 is moved along the direction from the second position to the first position, so that the first interval and the second interval are both equal to the preset interval.
When the first interval is greater than the preset interval and the second interval is less than the preset interval, the heating coil 100 is moved along the direction from the first position to the second position, so that the first interval and the second interval are both equal to the preset interval.
When the third interval is smaller than the preset interval, the heating coil 100 is moved in the direction from the thermal field 300 to the third position such that the third interval is equal to the preset interval.
When the third interval is greater than the preset interval, the heating coil 100 is moved in a direction from the third position to the thermal field 300 such that the third interval is equal to the preset interval.
Referring to fig. 6 to 8, the specific adjustment process is:
when d 1 ＜d 2 At this time, the heating coil 100 is moved in the first position direction (i.e., leftward) until d 1 ＝d 2 The method comprises the steps of carrying out a first treatment on the surface of the In contrast, when d 1 ＞d 2 At this time, the heating coil 100 is moved in the second position direction (i.e., rightward) until d 1 ＝d 2 . After this step is completed, the center of the heating coil 100 is located on the straight line where the third position is located.
When d 3 ＜d 0 At this time, the heating coil 100 moves the heating coil 100 in the third position direction (i.e., upward) until d 3 ＝d 0 The method comprises the steps of carrying out a first treatment on the surface of the In contrast, when d 3 ＞d 0 At this time, the heating coil 100 moves the heating coil 100 toward the thermal field 300 (i.e., downward) until d 3 ＝d 0 . After this step is completed, the center of the heating coil 100 is located on the line connecting the first position and the second position.
Judging whether the first interval, the second interval and the third interval meet d 1 ＝d 2 ＝d 3 ＝d 0 If it is full ofSufficient, positioning of the heating coil 100 in the radial direction is completed.
After the radial positioning is completed, the automatic positioning logic is finished, and a prompt signal is fed back to an operator to indicate that the next working procedure can be started.
In the embodiment of the application, through radial positioning of the heating coil 100, the center contact ratio of the heating coil 100 and the crucible can be corrected, the temperature distribution of the crucible in the radial direction is ensured to be uniform, and the crystal generation quality is improved.
Referring to fig. 1 to 8, based on the above-mentioned coil positioning method, the embodiment of the present application further discloses a semiconductor process apparatus, which includes a heating coil 100, a process chamber 200, a thermal field 300, a first position detecting element 410, and a second position detecting element 420; the thermal field 300 is disposed inside the process chamber 200, the heating coil 100 is disposed outside the process chamber 200 and is movable in the axial direction of the process chamber 200, the first position detecting element 410 is disposed at a first end of the heating coil 100 in the axial direction, and the second position detecting element 420 is disposed at a second end of the heating coil 100 in the axial direction; the first position detecting element 410 is used to determine the position of the first end of the heating coil 100, and the second position detecting element 420 is used to determine the position of the second end of the heating coil. In the embodiment of the present application, the heating coil 100 is positioned by using the positioning method of the coil.
Here, to detect the positional relationship between the heating coil 100 and the thermal field 300 in the axial direction, the semiconductor process apparatus may further include a first position detecting element 410 and a second position detecting element 420, wherein the first position detecting element 410 may be located at a first end of the heating coil 100, and the second position detecting element 420 may be located at a second end of the heating coil 100. Of course, there may be a fixed difference between the first position detecting element 410 and the first end of the heating coil 100, and in this case, the position of the first end of the heating coil 100 may be known by the position of the first position detecting element 410, and similarly, the position of the second end of the heating coil 100 may be known by the position of the second position detecting element 420.
In some embodiments, the relative positions of the heating coil 100 and the thermal field 300, specifically, may be determined from the first position detecting element 410 and the second position detecting element 420:
the on-off state of each of the first position detecting element 410 and the second position detecting element 420 is determined. Specifically, when the thermal field 300 is not at the detection position of the first position detection element 410 or the detection position of the second position detection element 420, the first position detection element 410 or the second position detection element 420 assumes an on state; when the thermal field 300 enters the detection position of the first position detecting element 410 or the detection position of the second position detecting element 420, the first position detecting element 410 or the second position detecting element 420 assumes an off state. Therefore, the positions of the first position detecting element 410 and the second position detecting element 420 can be determined by the on-off states of the first position detecting element 410 and the second position detecting element 420, and the relative positions between the heating coil 100 and the thermal field 300 can be determined.
In some embodiments, the first position detecting element 410 and the second position detecting element 420 may be photoelectric correlation sensors, and the photoelectric correlation sensors may include a transmitting end 411 and a receiving end 412, where the transmitting end 411 and the receiving end 412 are oppositely disposed on the heating coil 100, and a connection line between the transmitting end 411 and the receiving end 412 passes through the thermal field 300; the transmitting end 411 and the receiving end 412 of the first position detecting element 410 are used to be turned on in the case that the first end of the heating coil 100 is located outside the range of the thermal field 300 and turned off in the case that the first end of the heating coil 100 is located within the range of the thermal field 300; likewise, the transmitting end 411 and the receiving end 412 of the second position detecting element are used to be turned on in the case where the second end of the heating coil 100 is located outside the range of the thermal field 300 and turned off in the case where the second end of the heating coil 100 is located within the range of the thermal field 300.
Based on the above-mentioned arrangement, when the thermal field 300 is not at the detection position of the first position detecting element 410 or the detection position of the second position detecting element 420, the transmitting end 411 and the receiving end 412 are not blocked, so that the photoelectric signal sent by the transmitting end 411 can be received by the receiving end 412, and at this time, the first position detecting element 410 or the second position detecting element 420 is in the on state; when the thermal field 300 enters the detection position of the first position detecting element 410 or the detection position of the second position detecting element 420, the transmitting end 411 and the receiving end 412 are blocked, so that the photoelectric signal sent by the transmitting end 411 cannot be received by the receiving end 412, and the first position detecting element 410 or the second position detecting element 420 is in an off state. Based on this, whether the thermal field 300 exists in the horizontal direction can be detected by the light correlation sensor.
The coil is considered to be offset in position due to factors such as torque, looseness and heating after long-time use, so that the temperature distribution in a thermal field is offset, and the flatness, surface stress and semiconductor properties of a product (such as silicon carbide crystal and the like) are affected. Therefore, the operator also needs to check whether the gap between the coil and the chamber is uniform or not regularly, if the distances between the coils at different positions and the chamber are not equal, the screws of the coil are required to be unscrewed, and the screws are required to be screwed down after the coils are manually adjusted to the proper positions so as to maintain the alignment degree of the center of the coil and the center of the thermal field in the radial direction of the coil. However, manual adjustment of the gap width between the coil and the chamber is inefficient, inconvenient to perform, low in accuracy, and risky to damage the module, the chamber, etc. due to improper operation.
Based on the above, referring to fig. 6 to 8, the semiconductor process apparatus in the embodiment of the present application may further include a first distance detecting element 610, a second distance detecting element 620, and a third distance detecting element 630, where the first distance detecting element 610, the second distance detecting element 620, and the third distance detecting element 630 are all disposed on the heating coil 100, and the projection of the first distance detecting element 610, the second distance detecting element 620, and the third distance detecting element 630 on the projection plane perpendicular to the axial direction of the heating coil 100 is equal to the distance of the axis of the heating coil 100.
In addition, the process chamber 200 may be a quartz tube, which is sleeved outside the thermal field 300 and is disposed coaxially with the thermal field 300.
Wherein the first distance detecting element 610 is used for detecting a first distance between a first position of the heating coil 100 and the quartz tube, the second distance detecting element 620 is used for detecting a second distance between a second position of the heating coil 100 and the quartz tube, and the third distance detecting element 630 is used for detecting a third distance between the heating coil 100 and the quartz tube. Alternatively, each distance detecting element may be a distance sensor for precisely measuring the distance between each position of the heating coil 100 and the quartz tube. Based on this, whether the center of the thermal field 300 is aligned in the radial direction with the center of the heating coil 100 can be judged by whether the distances from the respective distance detecting elements to the outer wall of the quartz tube are equal.
In order to facilitate adjusting the position of the heating coil 100, the embodiment of the present application designs an arrangement of three distance detecting elements, specifically, a connection line between the first distance detecting element 610 and the second distance detecting element 620 passes through the axis of the heating coil 100, a vertical connection line between the third distance detecting element 630 and the heating coil 100, and a connection line between the first distance detecting element 610 and the second distance detecting element 620 on the projection plane. Based on this, the optical path emitted by the first distance detecting element 610 and the optical path emitted by the second distance detecting element 620 are positioned on the same straight line and pass through the axis (or center) of the heating coil 100, while the optical path emitted by the third distance detecting element 630 is perpendicular to the optical paths emitted by the first distance detecting element 610 and the second distance detecting element 620, respectively, and also passes through the axis (or center) of the heating coil 100. Therefore, in the case that the heating coil 100 is not shifted, the first, second, and third pitches are all equal, and equal to the preset pitch; when the heating coil 100 is offset, at least one of the first, second, and third pitches is changed.
It should be noted that, regarding whether the center of the thermal field 300 and the center of the heating coil 100 are aligned in the radial direction, and how to adjust the process, reference is made to the corresponding content in the above-mentioned positioning method of the coils, which is not repeated herein.
Referring to fig. 3, in some embodiments, the semiconductor process apparatus further includes a proximity switch 500, the proximity switch 500 being disposed between the heating coil 100 and the reference position, the proximity switch 500 being used to limit a moving range of the heating coil 100. Based on this, the proximity switch 500 may be triggered when the heating coil 100 moves to the vicinity of the proximity switch 500 so as to obtain the position of the heating coil 100.
Considering that one thermal field 300 may be loaded in the process chamber 200, and two thermal fields 300 may also be loaded, in this embodiment, it is necessary to determine the loading number of the thermal fields 300 and perform corresponding positioning logic according to the loading number of the thermal fields 300. The method comprises the following steps:
in the case that the heating coil 100 is located outside the range of the thermal field 300, the heating coil 100 is moved in the axial direction, and when both the first position detecting element 410 and the second position detecting element 420 are in the on state during the movement of the heating coil 100 to trigger the proximity switch 500, it is determined that the thermal field 300 corresponding to the heating coil 100 is not present in the process chamber 200, and the positioning of the heating coil 100 is stopped.
Specifically, if only one thermal field 300 is loaded in the process chamber 200, for example, only the second thermal field (lower thermal field) is loaded and the first thermal field (upper thermal field) is not loaded, as the first heating coil (upper heating coil) moves down, the first position detecting element 410 and the second position detecting element 420 are in the on state at all times, and are not switched to the off state, that is, as the first thermal field is not loaded, neither the first heating coil 410 nor the second position detecting element 420 is triggered (will not be turned off) in the movement stroke of the first heating coil until the first heating coil moves down to be close to the proximity switch 500 arranged at the upper end of the second heating coil, so that the proximity switch 500 is triggered.
Of course, it is also possible that only the first thermal field is loaded in the process chamber 200 and the second thermal field is not loaded, and the judgment logic is substantially the same as the above logic, and will not be described herein.
In summary, in the embodiment of the present application, a pair of photoelectric correlation sensors are respectively installed at the upper and lower ends of the heating coil 100, the positions of the upper and lower edges of the thermal field 300 are determined according to whether the pair of photoelectric correlation sensors receive the light signals of each other, and the middle position (i.e., the center) of the thermal field 300 is determined by calculation, and the heating coil 100 is automatically lifted, so that the center of the heating coil 100 is axially aligned with the center of the thermal field 300; and, 3 distance sensors are further installed in the horizontal direction of the heating coil 100 to detect the radial distance between the heating coil 100 and the quartz tube, and when the radial distances detected by the 3 distance sensors are not equal, the positions are automatically adjusted in two vertical directions of the horizontal plane by the heating coil 100 to achieve the equality of the three radial distances, thereby correcting whether the center of the heating coil 100 is radially aligned with the center of the thermal field 300.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims (11)

1. A method for positioning a coil applied to semiconductor processing equipment, the method comprising:
acquiring an initial relative position of a heating coil (100) and a thermal field (300) of the semiconductor process equipment;
-moving the heating coil (100) in an axial direction, -recording a first distance between a centre of the heating coil (100) and a reference position when a first end of the heating coil (100) is moved to a position of a first end of the thermal field (300) in the axial direction;
continuing to move the heating coil (100) in the axial direction, recording a second distance between the center of the heating coil (100) and the reference position when a second end of the heating coil (100) moves to a position of a second end of the thermal field (300) in the axial direction;
obtaining a distance difference between a center of the heating coil (100) and a center of the thermal field (300) according to the first distance, the second distance, and the distances of both ends of the heating coil (100) in the axial direction;
-moving the heating coil (100) according to the current relative position of the heating coil (100) and the thermal field (300) and the distance difference such that the center of the heating coil (100) is aligned with the center of the thermal field (300) in the axial direction.
2. The positioning method of a coil according to claim 1, characterized in that in case the heating coil (100) is located outside the thermal field (300) range or a first end of the heating coil (100) is located outside the thermal field (300) range, a second end of the heating coil (100) is located within the thermal field (300) range, the heating coil (100) is moved in the axial direction, the first distance being recorded when the first end of the heating coil (100) is moved to a position of the first end of the thermal field (300) in the axial direction;
continuing to move the heating coil (100) in the axial direction, recording the second distance when a second end of the heating coil (100) moves to a position of a second end of the thermal field (300) in the axial direction.
3. The positioning method of a coil according to claim 1, characterized in that in case that a first end of the heating coil (100) is located within the thermal field (300) and a second end of the heating coil (100) is located outside the thermal field (300), the heating coil (100) is moved in the axial direction, and the second distance is recorded when the second end of the heating coil (100) is moved to a position of the second end of the thermal field (300) in the axial direction;
Continuing to move the heating coil (100) in the axial direction, the first distance is recorded when a first end of the heating coil (100) moves to a position of a first end of the thermal field (300) in the axial direction.
4. The positioning method of a coil according to claim 1, characterized in that in a case where the heating coil (100) is located within the range of the thermal field (300), the heating coil (100) is moved along one side of the axial direction, the first distance being recorded when a first end of the heating coil (100) is moved to a position of a first end of the thermal field (300) in the axial direction;
-moving the heating coil (100) along the other side of the axial direction, -registering the second distance when the second end of the heating coil (100) is moved to a position of the second end of the thermal field (300) in the axial direction.
5. The positioning method of a coil according to any one of claims 1 to 4, characterized in that the positioning method comprises:
moving a second heating coil of the semiconductor process equipment to a lower limit position;
axially positioning a first heating coil of the semiconductor processing apparatus such that a center of the first heating coil is aligned with a center of a first thermal field of the semiconductor processing apparatus in the axial direction;
The second heating coil is axially positioned such that a center of the second heating coil is aligned with a center of a second thermal field of the semiconductor processing apparatus in the axial direction.
6. The positioning method of a coil according to claim 1, characterized in that the positioning method comprises:
detecting a first space, a second space and a third space between a first position, a second position and a third position of the heating coil (100) and the outer wall of the quartz tube of the semiconductor process equipment respectively, wherein the projections of the first position, the second position and the third position on a projection plane perpendicular to the axial direction of the heating coil (100) are equal in distance from the axial line of the heating coil (100);
the position of the heating coil (100) is adjusted in the radial direction of the quartz tube such that the first pitch, the second pitch, and the third pitch are equal to a preset pitch, so that the center of the heating coil (100) and the center of the thermal field (300) are aligned in the radial direction of the quartz tube.
7. The positioning method of a coil according to claim 6, characterized in that the positioning method comprises:
When the first interval is smaller than the preset interval and the second interval is larger than the preset interval, moving the heating coil (100) along the direction from the second position to the first position so that the first interval and the second interval are equal to the preset interval;
when the first interval is larger than the preset interval and the second interval is smaller than the preset interval, moving the heating coil (100) along the direction from the first position to the second position so that the first interval and the second interval are equal to the preset interval;
moving the heating coil (100) in a direction from the thermal field (300) to the third position such that the third pitch is equal to the preset pitch when the third pitch is smaller than the preset pitch;
and when the third interval is larger than a preset interval, moving the heating coil (100) along the direction from the third position to the thermal field (300) so that the third interval is equal to the preset interval.
8. A semiconductor processing apparatus, comprising: a heating coil (100), a process chamber (200), a thermal field (300), a first position detection element (410) and a second position detection element (420), the thermal field (300) being disposed inside the process chamber (200), the heating coil (100) being disposed outside the process chamber (200) and being movable in an axial direction of the process chamber (200);
The first position detection element (410) is disposed at a first end of the heating coil (100) in the axial direction, the second position detection element (420) is disposed at a second end of the heating coil (100) in the axial direction, the first position detection element (410) is used for determining a position of the first end of the heating coil (100), and the second position detection element (420) is used for determining a position of the second end of the heating coil (100);
the heating coil (100) is positioned by the positioning method of the coil according to any one of claims 1 to 7.
9. The semiconductor processing apparatus of claim 8, wherein the first position detecting element (410) and the second position detecting element (420) are each a photo-correlation sensor, the photo-correlation sensor comprising a transmitting end (411) and a receiving end (412);
the transmitting end (411) and the receiving end (412) are oppositely arranged on the heating coil (100), and a connecting line of the transmitting end (411) and the receiving end (412) passes through the thermal field (300);
the transmitting end (411) and the receiving end (412) of the first position detecting element (410) are configured to be turned on when the first end of the heating coil (100) is located outside the range of the thermal field (300) and turned off when the first end of the heating coil (100) is located within the range of the thermal field (300);
The transmitting end (411) and the receiving end (412) of the second position detecting element (420) are configured to be turned on when the second end of the heating coil (100) is located outside the range of the thermal field (300) and turned off when the second end of the heating coil (100) is located within the range of the thermal field (300).
10. The semiconductor processing apparatus of claim 8, wherein the process chamber (200) is a quartz tube, the quartz tube being sleeved outside the thermal field (300) and coaxially arranged with the thermal field (300);
the semiconductor process equipment further comprises a first distance detection element (610), a second distance detection element (620) and a third distance detection element (630) which are respectively arranged on the heating coil (100), wherein the first distance detection element (610), the second distance detection element (620) and the third distance detection element (630) are projected on a projection plane perpendicular to the axial direction of the heating coil (100), and the distances from the axial line of the heating coil (100) are equal;
the first distance detecting element (610) is used for detecting a first distance between a first position of the heating coil (100) and the quartz tube, the second distance detecting element (620) is used for detecting a second distance between a second position of the heating coil (100) and the quartz tube, and the third distance detecting element (630) is used for detecting a third distance between a third position of the heating coil (100) and the quartz tube.
11. The semiconductor process apparatus of claim 8, further comprising a proximity switch (500), the proximity switch (500) being disposed between the thermal field (300) and a reference position, the proximity switch (500) being configured to limit a range of movement of the heating coil (100).
CN202211182819.5A 2022-09-27 2022-09-27 Coil positioning method and semiconductor process equipment Pending CN117822096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211182819.5A CN117822096A (en) 2022-09-27 2022-09-27 Coil positioning method and semiconductor process equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211182819.5A CN117822096A (en) 2022-09-27 2022-09-27 Coil positioning method and semiconductor process equipment

Publications (1)

Publication Number Publication Date
CN117822096A true CN117822096A (en) 2024-04-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211182819.5A Pending CN117822096A (en) 2022-09-27 2022-09-27 Coil positioning method and semiconductor process equipment

Country Status (1)

Country Link
CN (1) CN117822096A (en)

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