CN117810092A - Package structure and method for manufacturing the same - Google Patents

Package structure and method for manufacturing the same Download PDF

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Publication number
CN117810092A
CN117810092A CN202211165051.0A CN202211165051A CN117810092A CN 117810092 A CN117810092 A CN 117810092A CN 202211165051 A CN202211165051 A CN 202211165051A CN 117810092 A CN117810092 A CN 117810092A
Authority
CN
China
Prior art keywords
packaging
face
package
region
conducting body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211165051.0A
Other languages
Chinese (zh)
Inventor
傅志杰
李泽杰
吴明锦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Original Assignee
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongqisheng Precision Electronics Qinhuangdao Co Ltd, Avary Holding Shenzhen Co Ltd filed Critical Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Priority to CN202211165051.0A priority Critical patent/CN117810092A/en
Publication of CN117810092A publication Critical patent/CN117810092A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The application provides a manufacturing method of a packaging structure, which comprises the following steps: the first packaging component comprises a first packaging substrate, a first electronic element, a first conducting body and a second conducting body, wherein the first packaging substrate is divided into a first area and a second area surrounding the first area, the first electronic element is arranged in the first area, the first conducting body and the second conducting body are arranged in the first packaging substrate at intervals, the end face of the first conducting body is exposed in the first area, and the end face of the second conducting body is exposed in the second area. The second region is divided to form a connection portion including a second conductive body. The connecting part is arranged in the first area, so that one end face of the second conducting body is connected with the end face of the first conducting body. And a second packaging component is arranged at the connecting part and is connected with the other end face of the second conducting body. In addition, the application also provides a packaging structure.

Description

Package structure and method for manufacturing the same
Technical Field
The present disclosure relates to chip packaging, and more particularly, to a chip packaging structure and a method for manufacturing the same.
Background
A package on package (Package on Package, POP) is a main packaging method of an integrated circuit, which is to realize communication by disposing a Ball Grid Array (BGA) between an upper package structure and a lower package structure. However, the ball grid array has the problem of uneven height, and a part of the area of the upper packaging structure cannot be conducted with the lower packaging structure, so that poor packaging is finally caused.
Disclosure of Invention
In order to solve the problems in the background art, the present application provides a method for manufacturing a package structure.
In addition, it is also necessary to provide a package structure.
A manufacturing method of a packaging structure comprises the following steps:
providing a first packaging component, wherein the first packaging component comprises a first packaging substrate, a first electronic element, a first conducting body and a second conducting body, the first packaging substrate is divided into a first area and a second area surrounding the first area, the first electronic element is arranged on one side of the first area, the first conducting body and the second conducting body are arranged in the first packaging substrate at intervals, the end face of the first conducting body is exposed in the first area, and the end face of the second conducting body is exposed in the second area;
dividing at least a portion of the second region to form a connection portion, the connection portion including the second via;
the connecting part is arranged in the first area, the connecting part and the electronic element are arranged on the same side of the first area, and one end face of the second conducting body is connected with the end face of the first conducting body; and
and a second packaging component is arranged at the connecting part and is connected with the other end face of the second conducting body.
Further, before the step of dividing at least part of the second region to form the connection portion, the method further includes:
arranging an adhesive sheet on the first packaging substrate, wherein the adhesive sheet is connected with the first area and the second area;
the step of disposing the connecting portion in the first region includes:
and turning over the connecting part so that one end face of the second conducting body is connected with the end face of the first conducting body.
Further, before the step of dividing at least part of the second region to form the connection portion, the method further includes:
arranging a first conductive paste on the end face of the first conductive body, and arranging a second conductive paste on the end face of the second conductive body;
the step of disposing the connecting portion in the first region includes:
and pressing the connecting part and the first packaging substrate, so that the first conductive paste and the second conductive paste fill in a gap between the end face of the first conductive body and the end face of the second conductive body.
Further, the method further comprises the steps of:
and arranging a packaging body between the first packaging component and the second packaging component, wherein the packaging body wraps the first electronic element.
Further, the step of disposing a second package assembly on the connection portion includes:
a second packaging substrate is arranged on the connecting part and is connected with the other end face of the second conducting body; and
and arranging the second electronic element on the second packaging substrate.
Further, the second electronic component is electrically connected to the second package substrate, the second package substrate is electrically connected to the second conductive body, the second conductive body is electrically connected to the first conductive body, and the first conductive body is electrically connected to the first electronic component.
Further, the step of "dividing at least part of the second region to form a connection portion" includes:
the second region is divided to form an even number of connecting portions, and the connecting portions are arranged on one side of the first region at opposite intervals.
Further, the step of "dividing at least part of the second region to form a connection portion" includes:
at least part of the second region is divided by means of laser division to form the connection portion.
A package structure, comprising:
the first packaging assembly comprises a first packaging substrate, a first electronic element and a first conducting body, wherein the first electronic element is arranged on one side of the first packaging substrate, the first conducting body is arranged in the first packaging substrate, and the end face of the first conducting body is exposed;
the connecting part is arranged on the first packaging substrate and comprises a second conducting body, and one end face of the second conducting body is connected with the end face of the first conducting body;
the second packaging assembly is arranged on the connecting part, and the other end face of the second conducting body is connected with the second packaging assembly.
Further, the second package assembly includes a second package substrate and a second electronic component, the second package substrate is disposed between the second electronic component and the connection portion, the second electronic component is electrically connected to the second package substrate, the second package substrate is electrically connected to the second conductive body, the second conductive body is electrically connected to the first conductive body, and the first conductive body is electrically connected to the first electronic component.
Compared with the prior art, the manufacturing method of the packaging structure provided by the application is beneficial to improving the uniformity of the height of the connecting part, so that the reliability of the electric connection of the connecting part to the second packaging component is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a first package assembly according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of the first package assembly shown in fig. 1 after cutting the second region to form the connection portion.
Fig. 3 is a schematic cross-sectional view of a process of turning over the connection part shown in fig. 2.
FIG. 4 is a schematic cross-sectional view of the attachment portion of FIG. 2 inverted to the first region.
Fig. 5 is a schematic cross-sectional view illustrating a process of disposing a second insulating substrate on the connection portion shown in fig. 4.
Fig. 6 is a schematic cross-sectional view of the connection portion shown in fig. 5 after the insulating substrate is disposed.
Fig. 7 is a schematic cross-sectional view of a package structure according to an embodiment of the present application.
Fig. 8 is a schematic perspective view of a first package assembly provided with a second insulating substrate according to an embodiment of the present application.
Fig. 9 is a schematic perspective view of a first package assembly provided with a second insulating substrate according to another embodiment of the present application.
Fig. 10 is a top view of a package motherboard according to an embodiment of the present application.
Description of the main reference signs
Packaging structure 100
First package assembly 10
Packaging motherboard 101
Micro-connection structure 102
Second region 112
First insulating substrate 113
First conductive structure 114
First package substrate 11
First region 111
First electronic component 12
First conductive body 13
Second conductive body 14
First conductive paste 15
Second conductive paste 16
Adhesive sheet 17
Connection portion 20
Connection body 21
Buried conductive structure 22
Second package assembly 30
Second package substrate 31
Second insulating substrate 311
Second conductive structure 312
Package body 40
Thickness direction A
Height H1, H2
The following detailed description will further illustrate the application in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may be present.
Referring to fig. 1 to 10, an embodiment of the present application provides a method for manufacturing a package structure 100, including the steps of:
referring to fig. 1, a first package assembly 10 is provided. The first package assembly 10 includes a first package substrate 11, a first electronic component 12, a first conductive body 13, and a second conductive body 14.
Referring to fig. 10, the first package substrate 11 has a thickness direction a, along which the first package substrate 11 is divided into a first region 111 and a second region 112 surrounding the first region 111. That is, the first region 111 is a substantially central region, and the second region 112 is an edge region surrounding the first region 111, as viewed from the top down in the thickness direction a. The first package substrate 11 includes a first insulating substrate 113 and a first conductive structure 114 embedded in the first insulating substrate 113. The first conductive structure 114 is a multi-layer conductive circuit structure connected to each other, the first electronic component 12 is a chip, and the first conductive body 13 and the second conductive body 14 are conductive blind holes formed by multiple electroplating.
Referring to fig. 1, the first electronic component 12 is disposed on one side of the first region 111, and the first electronic component 12 is electrically connected to the first conductive structure 114.
Referring to fig. 1, the first conductive body 13 is substantially cylindrical, the first conductive body 13 is embedded in a central region of the first package substrate 11 along the thickness direction a, the first conductive body 13 is electrically connected to the first conductive structure 114, and two opposite end surfaces of the first conductive body 13 are exposed at two opposite surfaces of the first region 111.
Referring to fig. 1, the second conductive body 14 is substantially cylindrical, the second conductive body 14 is substantially embedded in an edge region of the first package substrate 11 along the thickness direction a, the second conductive body 14 is electrically connected to the first conductive structure 114, and two opposite end surfaces of the second conductive body 14 are exposed at two opposite surfaces of the second region 112 respectively.
Referring to fig. 2, the second region 112 at least partially including the second conductive body 14 is divided to obtain a connection portion 20. The connection portion 20 includes a connection body 21, a buried conductive structure 22, and the second conductive body 14. The connection body 21 is formed by dividing a portion of the first insulating substrate 113, and the buried conductive structure 22 is formed by dividing a portion of the first conductive structure 114.
Referring to fig. 2 and 9 together, in step S2, "dividing the second region 112" including at least part of the second conductive body 14 includes:
referring to fig. 9, a package mother board 101 is provided, wherein the package mother board 101 includes a plurality of first package assemblies 10 distributed in a matrix, each first package assembly 10 in the package mother board 101 is substantially square when seen from the thickness direction a, and a micro connection structure 102 is disposed between each first package assembly 10 and another adjacent first package assembly 10, and the micro connection structure 102 is disposed substantially at a corner of each first package substrate 11.
S21 referring to fig. 2, the second area 112 of each first package component 10 is cut by laser while avoiding the micro-connection structure 102, so that the micro-connection structure 102 can connect the plurality of first areas 111 together even if the second area 112 around the first areas 111 is completely cut, thereby facilitating batch cutting to obtain a plurality of cut first package components 10.
In this embodiment, before step S2, the method further includes:
s22, referring to fig. 2, a first conductive paste 15 is disposed on the surface of the first region 111, and the first conductive paste 15 contacts the end surface of the first conductive body 13; and disposing a second conductive paste 16 on the surface of the second region 112, wherein the second conductive paste 16 contacts and connects the end surface of the second conductive body 14.
S23 referring to fig. 2, an adhesive sheet 17 is disposed on one side of the first package substrate 11. The adhesive sheet 17 has one end connected to the first region 111 and the other end connected to the second region 112. That is, the adhesive sheet 17 adheres the first region and the second region 112 so that the divided portions of the second region 112 are not separated from the first region 111.
Referring to fig. 3 and 4, the connecting portion 20 is transferred to the upper portion of the first region 111, so that an end surface of the second conductive body 14 is connected to an end surface of the first conductive body 13, and the electrical connection between the connecting portion 20 and the first conductive body 13 is achieved. Wherein the connection portion 20 and the first electronic component 12 are disposed on the same side of the first region 111.
In this embodiment, in step S3, the step of "transferring the connection portion 20 to above the first area 111" specifically includes:
referring to fig. 3 and 4 together, the end of the connecting portion 20 facing away from the adhesive sheet 17 is turned outward by 180 degrees, so that the connecting portion 20 is inverted to the edge portion of the first region 111. Meanwhile, the first conductive paste 15 and the second conductive paste 16 fill in the gap between the connection portion 20 and the first region 111, so that the end face of the first conductive body 13 is electrically connected to the end face of the second conductive body 14.
Referring to fig. 3, 4 and 8, in the present embodiment, the number of the connection portions 20 is two, the two connection portions 20 are disposed at the edge of the first region 111 at opposite intervals, and the height H1 of the connection portion 20 is greater than the height H2 of the first electronic component 12 protruding from the first insulating substrate 113. In another embodiment of the present application, referring to fig. 9, the number of the connection portions 20 is four, and the four connection portions 20 are end to end and are surrounded on the edge of the first region 111. It will be appreciated that the number of the connection parts 20 may be set according to the profiles of the first and second regions 111 and 112, and preferably, the number of the connection parts 20 is an even number, and the even number of the connection parts 20 are disposed at opposite intervals, so as to smoothly support other components (e.g., the second package assembly 30).
Referring to fig. 4, 5 and 6, a second package assembly 30 is disposed at the connection portion 20, and the second package assembly 30 is connected to the second conductive body 14 to obtain the package structure 100.
In this embodiment, referring to fig. 4 to 6, the second package assembly 30 includes a second package substrate 31 and a second electronic component 32 connected to the second package substrate 31. The step S4 specifically comprises the following steps:
referring to fig. 5, the second package substrate 31 is disposed on the connection portion 20, and the first package substrate 11, the second package substrate 31, and the connection portion 20 disposed between the first package substrate 11 and the second package substrate 31 enclose a receiving space R, in which the first electronic component 12 is received. The second package substrate 31 includes a second insulating substrate 311 and a second conductive structure 312, and the second conductive structure 312 is embedded in the second insulating substrate 311. The second conductive structure 312 is electrically connected to an end surface of the second conductive body 14 facing away from the first conductive body 13.
Referring to fig. 6, an encapsulant (not shown) is injected into the accommodating space R, the encapsulant (not shown) fills the accommodating space R and encapsulates the first electronic component 12, the encapsulant is cured to form an encapsulant 40, and the encapsulant 40 can fix the first electronic component 12. It can be appreciated that a gap exists between the connection portion 20 and the second package substrate 31, and the encapsulant can be injected into the accommodating space R through the gap.
Referring to fig. 7, the second electronic component 32 is disposed on the second package substrate 31, and the second electronic component 32 is electrically connected to the second conductive structure 312. Specifically, a portion of the second conductive structure 312 exposes the second insulating substrate 311, the second electronic component 32 is disposed on a side of the second insulating substrate 311 away from the first insulating substrate 113, and the second electronic component 32 is electrically connected to the second conductive structure 312 through solder balls (not shown). The second electronic component 32 is a memory bank.
Compared to the prior art, the manufacturing method of the package structure 100 provided in the present application obtains the connection portion 20 by cutting the portion of the first insulating substrate 113 containing the second conductive body 14 (i.e. cutting the second region 112), the connection portion 20 can be stacked on the first region 111 in a flip manner, and the second conductive body 14 of the connection portion 20 is electrically connected to the first conductive body 13 of the first region 111, and the method has the following advantages:
and (one) uniformity of the height H1 of the connection portion 20, thereby improving reliability of electrical connection of the connection portion 20 to the second package assembly 30.
And (two) the connection portion 20 can serve to support the second package assembly 30, and has better stability than solder balls.
(III) is favorable for reducing the arrangement of the ball grid array, reducing the complexity of the packaging process and realizing the simplification of the packaging process
(IV) the first via 13 and the second via 14 are via holes formed by a multiple plating method, and the first via 13 and the second via 14 manufactured by this method have a high aspect ratio, thereby facilitating a reduction in the occupied surface area for conducting the connection portion 20 and the first region 111, and an increase in the routable density of the surface of the first region 111.
Referring to fig. 7, a package structure 100 is further provided. The package structure 100 includes a first package assembly 10, a connection portion 20, and a second package assembly 30. The first package assembly 10 includes a first package substrate 11, a first electronic component 12, and a first conductive body 13. The first electronic component 12 is disposed on one side of the first package substrate 11, the first conductive body 13 is disposed in the first package substrate 11, and an end surface of the first conductive body 13 is exposed. The connection portion 20 is disposed on the first package substrate 11, the connection portion 20 includes a second conductive body 14, and one end surface of the second conductive body 14 is connected to an end surface of the first conductive body 13. The second package assembly 30 is disposed at the connection portion 20, and the other end surface of the second conductive body 14 is connected to the second package assembly 30.
Referring to fig. 7, in the present embodiment, the second package assembly 30 includes a second package substrate 31 and a second electronic component 32. The second package substrate 31 is disposed between the second electronic component 32 and the connection portion 20. The second electronic component 32 is electrically connected to the second package substrate 31, the second package substrate 31 is electrically connected to the second conductive body 14, the second conductive body 14 is electrically connected to the first conductive body 13, and the first conductive body 13 is electrically connected to the first electronic component 12.
In addition, those skilled in the art will recognize that the foregoing embodiments are for illustration purposes only and are not intended to be limiting, as appropriate modifications and variations of the above embodiments are within the spirit and scope of the invention.

Claims (10)

1. A method of manufacturing a package structure, comprising the steps of:
providing a first packaging component, wherein the first packaging component comprises a first packaging substrate, a first electronic element, a first conducting body and a second conducting body, the first packaging substrate is divided into a first area and a second area surrounding the first area, the first electronic element is arranged on one side of the first area, the first conducting body and the second conducting body are arranged in the first packaging substrate at intervals, the end face of the first conducting body is exposed in the first area, and the end face of the second conducting body is exposed in the second area;
dividing at least a portion of the second region to form a connection portion, the connection portion including the second via;
the connecting part is arranged in the first area, the connecting part and the electronic element are arranged on the same side of the first area, and one end face of the second conducting body is connected with the end face of the first conducting body; and
and a second packaging component is arranged at the connecting part and is connected with the other end face of the second conducting body.
2. The method of manufacturing of claim 1, wherein prior to the step of dividing at least a portion of the second region to form a connection further comprises:
arranging an adhesive sheet on the first packaging substrate, wherein the adhesive sheet is connected with the first area and the second area;
the step of disposing the connecting portion in the first region includes:
and turning over the connecting part so that one end face of the second conducting body is connected with the end face of the first conducting body.
3. The method of manufacturing of claim 1, wherein prior to the step of dividing at least a portion of the second region to form a connection further comprises:
arranging a first conductive paste on the end face of the first conductive body, and arranging a second conductive paste on the end face of the second conductive body;
the step of disposing the connecting portion in the first region includes:
and pressing the connecting part and the first packaging substrate, so that the first conductive paste and the second conductive paste fill in a gap between the end face of the first conductive body and the end face of the second conductive body.
4. The method of manufacturing of claim 1, further comprising the step of:
and arranging a packaging body between the first packaging component and the second packaging component, wherein the packaging body wraps the first electronic element.
5. The method of manufacturing of claim 1, wherein the second package assembly includes a second package substrate and a second electronic component connected to the second package substrate, and the step of disposing a second package assembly at the connection portion includes:
a second packaging substrate is arranged on the connecting part and is connected with the other end face of the second conducting body; and
and arranging the second electronic element on the second packaging substrate.
6. The method of claim 5, wherein the second electronic component is electrically connected to the second package substrate, the second package substrate is electrically connected to the second conductive body, the second conductive body is electrically connected to the first conductive body, and the first conductive body is electrically connected to the first electronic component.
7. The method of manufacturing of claim 1, wherein the step of dividing at least a portion of the second region to form a connection portion comprises:
the second region is divided to form an even number of connecting portions, and the connecting portions are arranged on one side of the first region at opposite intervals.
8. The method of manufacturing of claim 1, wherein the step of dividing at least a portion of the second region to form a connection portion comprises:
at least part of the second region is divided by means of laser division to form the connection portion.
9. A package structure, comprising:
the first packaging assembly comprises a first packaging substrate, a first electronic element and a first conducting body, wherein the first electronic element is arranged on one side of the first packaging substrate, the first conducting body is arranged in the first packaging substrate, and the end face of the first conducting body is exposed;
the connecting part is arranged on the first packaging substrate and comprises a second conducting body, and one end face of the second conducting body is connected with the end face of the first conducting body;
the second packaging assembly is arranged on the connecting part, and the other end face of the second conducting body is connected with the second packaging assembly.
10. The package structure of claim 9, wherein the second package assembly comprises a second package substrate and a second electronic component, the second package substrate is disposed between the second electronic component and the connection portion, the second electronic component is electrically connected to the second package substrate, the second package substrate is electrically connected to the second conductive body, the second conductive body is electrically connected to the first conductive body, and the first conductive body is electrically connected to the first electronic component.
CN202211165051.0A 2022-09-23 2022-09-23 Package structure and method for manufacturing the same Pending CN117810092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211165051.0A CN117810092A (en) 2022-09-23 2022-09-23 Package structure and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211165051.0A CN117810092A (en) 2022-09-23 2022-09-23 Package structure and method for manufacturing the same

Publications (1)

Publication Number Publication Date
CN117810092A true CN117810092A (en) 2024-04-02

Family

ID=90420536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211165051.0A Pending CN117810092A (en) 2022-09-23 2022-09-23 Package structure and method for manufacturing the same

Country Status (1)

Country Link
CN (1) CN117810092A (en)

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