CN117805967A - Hybrid plasma waveguide, temperature sensor and electronic device - Google Patents

Hybrid plasma waveguide, temperature sensor and electronic device Download PDF

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Publication number
CN117805967A
CN117805967A CN202311605364.8A CN202311605364A CN117805967A CN 117805967 A CN117805967 A CN 117805967A CN 202311605364 A CN202311605364 A CN 202311605364A CN 117805967 A CN117805967 A CN 117805967A
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waveguide
metal layer
layer
electric field
temperature
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韩云奇
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Suzhou Metabrain Intelligent Technology Co Ltd
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Suzhou Metabrain Intelligent Technology Co Ltd
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Priority to CN202311605364.8A priority Critical patent/CN117805967A/en
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1226Basic optical elements, e.g. light-guiding paths involving surface plasmon interaction
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/12135Temperature control
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/12138Sensor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The invention provides a mixed plasma waveguide, a temperature sensor and electronic equipment, wherein the mixed plasma waveguide is used for detecting the temperature of a liquid medium; a hybrid plasma waveguide comprising: a substrate layer, a buffer layer, a waveguide layer, and a metal layer; the buffer layer covers the substrate layer, and the waveguide layer covers the buffer layer; the waveguide layer includes a base portion and a boss portion; the protruding part comprises a first part, a second part and a third part, and the second part is positioned between the first part and the third part; the metal layer is coated on the surface of the second subsection; the electric field distribution of the protruding part changes along with the temperature change of the liquid medium contacted by the metal layer. The mixed plasma waveguide, the temperature sensor and the electronic equipment provided by the invention do not need to meet the cold end compensation requirement or overcome the self-heating problem, more accurately acquire the temperature of the liquid cooling medium, particularly more accurately acquire the temperature of the liquid medium in the liquid cooling equipment, and have the advantages of simple structure, simple preparation process and strong universality.

Description

Hybrid plasma waveguide, temperature sensor and electronic device
Technical Field
The invention relates to the technical field of semiconductors, in particular to a mixed plasma waveguide, a temperature sensor and electronic equipment.
Background
Conventional temperature sensors in the related art include Thermocouples (TCs), resistance temperature detectors (Resistive Temperature Detector, RTDs), thermistors, and the like.
Thermocouple is fragile, has low cost, good durability and wide applicable temperature range advantage, but it needs Cold Junction Compensation (CJC) in order to realize linearization to carry out temperature monitoring, and the degree of accuracy is low, difficult control. Although the accuracy of the resistance temperature detector is higher, the resistance temperature detector generally needs to be calibrated by compensating a test line during operation, and measurement errors caused by self-heating generated during operation cannot be avoided. The thermistor needs to be linearized and errors can be measured due to the self-heating belt during operation.
When the traditional temperature sensor is used for collecting the temperature of the liquid cooling medium in the related technology, the cold end compensation requirement of the thermocouple is difficult to meet or the self-heating problem of the resistance temperature detector and the thermistor is overcome, so that the traditional temperature sensor in the related technology is difficult to accurately collect the temperature of the liquid cooling medium.
Disclosure of Invention
The invention provides a mixed plasma waveguide, a temperature sensor and electronic equipment, which are used for solving the defect that the traditional temperature sensor in the prior art is difficult to accurately collect the temperature of a liquid cooling medium and realizing more accurate collection of the temperature of the liquid medium.
The invention provides a mixed plasma waveguide which is used for detecting the temperature of a liquid medium;
the buffer layer covers the substrate layer, and the waveguide layer covers the buffer layer;
the waveguide layer comprises a base part and a protruding part, and the protruding part is arranged on one side of the waveguide layer, which is away from the buffer layer;
the convex part comprises a first part, a second part and a third part, the second part is positioned between the first part and the third part, and the widths and the heights of the first part, the second part and the third part are equal; the metal layer is coated on the surface of the second subsection;
the electric field distribution of the convex part changes along with the temperature change of the liquid medium contacted by the metal layer.
According to the hybrid plasma waveguide provided by the invention, the thickness of the metal layer and the length of the second subsection are obtained after simulation calculation based on a finite difference time domain method; the side surface of the metal layer coats the side surface of the protruding part; the top surface of the metal layer coats the top surface of the protruding part; the thickness of the metal layer includes a side thickness of the metal layer and a top thickness of the metal layer.
According to the hybrid plasma waveguide provided by the invention, the width of the protruding part is obtained after simulation calculation based on a finite difference time domain method.
According to the hybrid plasma waveguide provided by the invention, the thickness of the metal layer is obtained based on the following steps:
taking the thickness of the metal layer and the length of the second subsection as independent variables, and performing simulation calculation on the electric field distribution and the light transmittance of the waveguide layer based on the finite difference time domain method to obtain a first simulation calculation result, wherein the first simulation calculation result comprises the metal layers with different thicknesses and the second subsection with different lengths, and the electric field distribution and the light transmittance of the corresponding protruding part;
taking the light transmittance meeting the requirement that the protruding part is zero and the surface plasmon polariton excited by the metal layer as a screening condition, and screening the first simulation calculation result to obtain the value range of the thickness of the metal layer and the value range of the length of the second subsection;
whether the metal layer excites surface plasmon polaritons is determined based on electric field distribution of the protruding portion.
According to the hybrid plasma waveguide provided by the invention, the width of the protruding part is obtained based on the following steps:
Taking the width of the protruding part as an independent variable, and carrying out simulation calculation on the effective refractive index of the protruding part based on the finite difference time domain method to obtain a second simulation calculation result, wherein the second simulation calculation result comprises the effective refractive indexes of the waveguide layers corresponding to the protruding parts with different widths;
based on the second simulation calculation result, determining the width of the protruding part corresponding to the zero-order transverse electric field mode in the protruding part and the width of the protruding part corresponding to the first-order transverse electric field mode in the protruding part as the minimum value and the maximum value of the value range of the width of the protruding part;
wherein whether the protrusion exhibits a zero-order transverse electric field mode and whether the protrusion exhibits a first-order transverse electric field mode is determined based on an effective refractive index of the protrusion.
According to the invention, the material of the metal layer comprises the following components: gold, platinum, and copper.
According to the mixed plasma waveguide provided by the invention, the material of the waveguide layer comprises silicon; the height of the protruding part is 120nm; the height of the base is 100nm.
According to the mixed plasma waveguide provided by the invention, the material of the buffer layer comprises silicon dioxide; the height of the buffer layer was 2 microns.
The present invention also provides a temperature sensor comprising: a hybrid plasmonic waveguide and an integrated circuit as claimed in any one of the above; the mixed plasma waveguide is electrically connected with the integrated circuit;
the integrated circuit is used for acquiring electric field distribution data of the protruding part of the waveguide layer in the mixed plasma waveguide and acquiring the temperature of the liquid medium contacted by the metal layer in the plasma waveguide based on the electric field distribution data.
The invention also provides various electronic devices, including: a liquid cooling device and a temperature sensor as described above; the temperature sensor is used for collecting the temperature of the liquid medium in the liquid cooling device.
The invention provides a mixed plasma waveguide, a temperature sensor and an electronic device, wherein the mixed plasma waveguide comprises: a substrate layer, a buffer layer, a waveguide layer, and a metal layer; the buffer layer covers the substrate layer, and the waveguide layer covers the buffer layer; the waveguide layer comprises a base part and a protruding part, and the protruding part is arranged on one side of the waveguide layer, which is away from the buffer layer; the convex part comprises a first part, a second part and a third part, the second part is positioned between the first part and the third part, and the widths and the heights of the first part, the second part and the third part are equal; the metal layer is coated on the surface of the second subsection; the electric field distribution of the waveguide layer changes along with the temperature change of the liquid medium contacted by the metal layer, and the mixed plasma waveguide provided by the invention does not need to meet the cold end compensation requirement or overcome the self-heating problem, can more accurately acquire the temperature of the liquid medium, and particularly can more accurately acquire the temperature of the liquid medium in the liquid cooling equipment, and has the advantages of simple structure, simple preparation process and strong universality.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a cross-sectional view of a hybrid plasmonic waveguide provided by the invention;
FIG. 2 is a top view of a hybrid plasmonic waveguide provided by the invention;
FIG. 3 is a plot of the width of a lobe versus the effective index of the lobe in a hybrid plasmon waveguide provided by the present invention;
FIG. 4 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention in an air medium at different wavelengths of incident light;
FIG. 5 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention under different wavelengths of incident light in a liquid medium;
FIG. 6 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a first temperature;
FIG. 7 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a second temperature;
FIG. 8 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a third temperature;
fig. 9 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a fourth temperature.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present application, the terms "first," "second," and the like are used for distinguishing between similar objects and not for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. In addition, in the description of the present application, "and/or" means at least one of the connected objects, and the character "/", generally means a relationship in which the front and rear associated objects are one kind of "or".
The conventional temperature sensor in the related art includes a Thermocouple (TC), a resistance temperature detector (Resistive Temperature Detector, RTD), a thermistor, and the like.
Thermocouples are low cost, extremely durable, operate over long distances, self-powered, and are of a wide variety of types to cover a wide range of temperatures, and therefore, can operate continuously in many different operating environments, including outdoors and in harsh factory environments.
However, since thermocouples are nonlinear, cold side compensation (CJC) is required to achieve linearization, and the voltage signal of the thermocouple is low, typically only tens to hundreds of millivolts, so that a sample specific way is required to eliminate noise and drift in low voltage environments. The accuracy of thermocouples is typically in the range of 1% -3%, depending on the wire alloy consistency and cold junction accuracy.
The resistance temperature detector (Resistive Temperature Detector, RTD) is a more accurate temperature sensor than a thermocouple. In a resistive temperature detector, the device resistance is proportional to temperature. The most common material for resistive temperature detectors is platinum, with some resistive temperature detectors made of other metals (e.g., nickel and copper). Different resistance temperature detectors are constructed, so that the temperature measurement range can be in a wider temperature range, such as-270 ℃ to +850 ℃.
However, when a test current flows through the resistance temperature detector, a measurement error occurs due to self-heating generated by the resistance temperature detector. In the case of measuring a low temperature (for example, lower than 0 ℃) with the resistance temperature detector, the heat generated by the resistance temperature detector may cause deviation in the measured temperature value. Moreover, if the test line is not compensated for the resistance temperature detector, more errors are introduced in the measurement.
In addition, the resistance value of the thermistor changes with a temperature change, similar to the resistance temperature detector. Compared with a resistance temperature detector, the sensitivity of the thermistor is higher, and the resistance value variation generated by the thermistor along with the temperature variation is more than that of the resistance temperature detector.
Similarly, since the thermistor is a semiconductor, the nonlinear characteristics of the thermistor also need to be linearized, and the thermistor is more likely to be misaligned at high temperatures. The thermistor also requires the use of a current source, and both the resistance temperature detector and the thermistor have self-heating characteristics.
When the traditional temperature sensor is used for collecting the temperature of the liquid cooling medium in the liquid cooling equipment in the related technology, the cold end compensation requirement of the thermocouple is difficult to meet or the self-heating problem of the resistance temperature detector and the thermistor is overcome, so that the traditional temperature sensor in the related technology is difficult to accurately collect the temperature of the liquid cooling medium in the electronic equipment.
Surface plasmon polaritons (Surface Plasmon Polaritons, SPPs for short) are a phenomenon in which electromagnetic waves generated on a metal surface interact with electron plasmon oscillations. When light is incident on the metal-medium interface, electromagnetic waves can interact with electrons due to the presence of free electrons in the metal, forming surface plasmon polaritons.
The surface plasmon polariton can overcome diffraction limit, and can limit an electromagnetic field to tens of nanometers or even a few nanometers, so that an optical field is strongly localized on a metal surface, light interacts with a nanoscale structure, and the localization effect has great potential in the manufacture of photonic chips, and can realize the integration of optical equipment and electrical equipment, particularly in the fields of optical detection and optical sensing.
In view of the above, the present invention provides a hybrid plasma waveguide and a temperature sensor based on the hybrid plasma waveguide. The mixed plasma waveguide provided by the invention is based on the physical characteristic that the refractive index of the liquid medium can be reduced along with the temperature rise of the liquid medium, the electric field distribution of the wave conductor in the mixed plasma waveguide is influenced by utilizing the surface plasma effect excited by the refractive index change caused by the temperature at the interface between the metal layer in the mixed plasma waveguide and the liquid medium, and further the temperature of the liquid medium is obtained by back-pushing calculation based on the electric field distribution of the wave conductor in the mixed plasma waveguide, so that the cold end compensation requirement is not required or the self-heating problem is overcome, the temperature of the liquid medium is more accurately obtained, and particularly the temperature of the liquid medium in liquid cooling equipment is more accurately obtained.
Fig. 1 is a cross-sectional view of a hybrid plasmonic waveguide provided by the invention. Fig. 2 is a top view of a hybrid plasmonic waveguide provided by the invention. As shown in fig. 1 and 2, a hybrid plasmonic waveguide 101 is used for detecting the temperature of a liquid medium, the hybrid plasmonic waveguide 101 includes: a substrate layer 102, a buffer layer 103, a waveguide layer 104, and a metal layer 105;
the buffer layer 103 covers the substrate layer 102, and the waveguide layer 104 covers the buffer layer 103;
the waveguide layer 104 comprises a base 106 and a protruding part 107, wherein the protruding part 107 is arranged on one side of the waveguide layer 104 facing away from the buffer layer 103;
the boss 107 includes a first section 201, a second section and a third section 202, the second section being located between the first section 201 and the third section 202, the first section 201, the second section and the third section 202 having equal widths and heights; the metal layer 105 is coated on the surface of the second subsection;
the electric field distribution of the protrusions 107 varies with the temperature of the liquid medium with which the metal layer 105 is in contact.
It will be appreciated that as the temperature of the liquid medium increases, the thermal movement of molecules in the liquid medium increases and the interaction forces between the molecules decrease, and therefore the refractive index of the liquid medium decreases as the temperature of the liquid medium increases.
Thus, where the present invention provides for the hybrid plasmonic waveguide 101 to be placed in a liquid medium, light may be transmitted through the liquid medium to impinge on the surface of the hybrid plasmonic waveguide 101.
Since the temperature change of the liquid medium may cause the refractive index change of the liquid medium, the refractive index change caused by the temperature at the interface between the metal layer 105 and the liquid medium in the hybrid plasmon waveguide 101 may cause the hybrid plasmon waveguide 101 to generate surface plasmon polaritons, which may affect the electric field distribution of the waveguide in the hybrid plasmon waveguide 101. Based on the electric field distribution of the waveguide in the plasma waveguide, the temperature of the liquid medium can be obtained by back-calculation.
It should be noted that the liquid medium in the embodiment of the present invention may include water.
As an alternative embodiment, the material of the metal layer 105 includes: gold, platinum, and copper.
Specifically, the metal layer 105 in the hybrid plasmon waveguide 101 plays a key role in achieving zero transmission and sensitivity, and the material constituting the metal layer 105 includes, but is not limited to, gold, platinum, or copper, as long as the structure thereof is designed so that it can achieve zero transmission and high sensitivity of light.
It should be noted that, different materials may be different when the coating process is selected, and gold, platinum or copper is preferred to form the metal layer 105 in the embodiment of the present invention, and may be achieved by conventional means when electroplating or electroless plating is used.
As an alternative embodiment, the material of the waveguide layer 104 comprises silicon; the height of the convex part 107 is 120nm; the height of the base 106 is 100nm.
Specifically, the waveguide layer 104 made of silicon has advantages of low loss, high refractive index, easy integration, and the like, and the boss 107 of the waveguide layer 104 serves as a core member, and its size plays a substantial role in the transmission effect, sensitivity, and the like of the hybrid plasma waveguide 101.
It should be noted that, in the embodiment of the present invention, the range of the height of the protrusion 107 and the range of the height of the base 106 may be determined based on a priori knowledge and/or actual conditions.
As an alternative embodiment, the material of the buffer layer 103 comprises silicon dioxide; the height of the buffer layer 103 is 2 microns.
In particular, the buffer layer 103 of the present invention may serve as a heat conduction and mechanical support and protection.
It should be noted that, in the embodiment of the present invention, the range of the height of the buffer layer 103 may be determined based on a priori knowledge and/or actual conditions.
It should be noted that, in the embodiment of the present invention, the mixed plasma waveguide 101 may be a Silicon-on-Insulator (SOI) structure, and in the embodiment of the present invention, the mixed plasma waveguide 101 may be prepared by the following steps.
Bonding: strictly cleaning two polished silicon wafers with high-quality thermal oxide layers with the surface of 1 mu m, bonding the silicon wafers in an ultra-clean environment by utilizing Van der Waals force, and annealing the silicon wafers at high temperature to improve the bonding strength of the silicon wafers;
and step two, back thinning: grinding and polishing the silicon wafer on one side of the bonded silicon wafer as a substrate and the silicon wafer on the other side to the required thickness to form a silicon single crystal film on an insulator, and then forming a bulge 107 by adopting acid etching;
third step metallization layer 105: a metal layer 105 is electroplated or electroless plated on the upper surface and sides of the boss 107 to yield the hybrid plasmonic waveguide 101.
In order to enhance the coating effect of the metal layer 105, the surface of the second portion may be acid-washed and then coated before the coating of the metal layer 105.
The mixed plasma waveguide in the embodiment of the invention comprises the following components: a substrate layer, a buffer layer, a waveguide layer, and a metal layer; the buffer layer covers the substrate layer, and the waveguide layer covers the buffer layer; the waveguide layer comprises a base part and a protruding part, and the protruding part is arranged on one side of the waveguide layer, which is away from the buffer layer; the convex part comprises a first part, a second part and a third part, the second part is positioned between the first part and the third part, and the widths and the heights of the first part, the second part and the third part are equal; the metal layer is coated on the surface of the second subsection; the electric field distribution of the waveguide layer changes along with the temperature change of the liquid medium contacted by the metal layer, and the mixed plasma waveguide provided by the invention does not need to meet the cold end compensation requirement or overcome the self-heating problem, can more accurately acquire the temperature of the liquid medium, and particularly can more accurately acquire the temperature of the liquid medium in the liquid cooling equipment, and has the advantages of simple structure, simple preparation process and strong universality.
As an alternative embodiment, the thickness of the metal layer 105 and the length of the second subsection are obtained by performing simulation calculation based on a finite difference time domain method; the side surface of the metal layer 105 covers the side surface of the protruding part 107; the top surface of the metal layer 105 coats the top surface of the protruding portion 107; the thickness of the metal layer 105 includes a side thickness of the metal layer 105 and a top thickness of the metal layer 105.
It can be appreciated that if the thickness of the metal layer 105 is too thin, the incident light is caused to directly penetrate the hybrid plasmon waveguide 101, and it is difficult for the metal layer 105 to excite the surface plasmon polaritons; while the thickness of the metal layer 105 is too thick to achieve zero transmission of the incident light in the boss 107, it can significantly affect the sensitivity of the hybrid plasmon waveguide 101 and cannot achieve sensing. Therefore, determining the thickness of the metal layer 105 is critical to the performance of the hybrid plasmonic waveguide 101.
In order to achieve high sensitivity of the hybrid plasmon waveguide 101 and zero transmission of incident light in the protruding portion 107, in the embodiment of the present invention, simulation calculation may be performed by using optical simulation software in combination with a finite difference time domain method to determine the thickness of the metal layer 105 and the length of the second subsection (the length of the metal layer 105).
The Finite Difference Time Domain (FDTD) method is a calculation method for solving a Maxwell equation set numerically and is used for simulating the propagation and interaction of electromagnetic waves in space and time. The finite difference time domain method is widely applied to numerical electromagnetic simulation methods in the fields of optics, electromagnetism and antennas.
The finite difference time domain method is based on a Maxwell equation set, and can discretize space and time into cells of finite size and time steps, and simulate the propagation process of electromagnetic waves by calculating the changes of electric fields and magnetic fields in each space-time cell. The basic idea is to approximate the differential form of the Maxwell's system of equations using the discrete differences in space and time of the electric and magnetic fields, thereby converting the fluctuation problem into a problem of differential equation solution. By the finite difference time domain method, complex electromagnetic wave propagation and interaction problems can be subjected to numerical simulation and analysis, including waveguide transmission characteristics, scattering problems, device response and the like.
Optionally, the optical simulation software in the embodiment of the present invention may be a Lumerical MODE simulation software.
In particular, in order to maintain high sensitivity of the hybrid plasmon waveguide 101 while satisfying the purpose of zero transmission of incident light in the convex portion 107, the thickness of the metal layer 105 is divided into the side thickness of the metal layer 105 and the top surface thickness of the metal layer 105 without using the metal layer 105 of a fixed thickness, and by continuously simulation, the balance between high sensitivity and zero transmission is achieved by forming the metal layers 105 of different thicknesses on the side and upper surfaces of the convex portion 107, respectively.
As an alternative embodiment, the thickness of the metal layer 105 is obtained based on the following steps: taking the thickness of the metal layer 105 and the length of the second subsection as independent variables, and performing simulation calculation on the electric field distribution and the light transmittance of the waveguide layer 104 based on the finite difference time domain method to obtain a first simulation calculation result, wherein the first simulation calculation result comprises the metal layers 105 with different thicknesses and the second subsection with different lengths, and the electric field distribution and the light transmittance of the corresponding protruding part 107;
taking the light transmittance meeting the requirement that the protruding part 107 is zero and the surface plasmon polariton is excited by the metal layer 105 as a screening condition, and screening the first simulation calculation result to obtain a value range of the thickness of the metal layer 105 and a value range of the length of the second subsection;
wherein whether the metal layer 105 excites surface plasmon polaritons is determined based on electric field distribution of the protruding portion 107.
Specifically, in the embodiment of the present invention, the thickness of the metal layer 105 and the length of the second subsection are taken as independent variables, and the Lumerical MODE simulation software is combined with the finite difference time domain method, so as to perform simulation calculation on the electric field distribution and the light transmittance of the metal layer 105 with different thicknesses and the second subsection with different lengths, corresponding to the protruding portion 107, to obtain the light transmittance of the metal layer 105 with different thicknesses and the second subsection with different lengths, and the electric field distribution simulation diagram of the metal layer 105 with different thicknesses and the second subsection with different lengths, corresponding to the protruding portion 107, as the result of the first simulation calculation.
It should be noted that, after the first simulation calculation result is obtained, in the embodiment of the present invention, the thickness of the top surface of the metal layer 105 may be first determined based on the first simulation calculation result, then the length of the second portion may be determined, and finally the thickness of the side surface of the metal layer 105 may be determined.
When determining the top surface thickness of the metal layer 105 based on the first simulation calculation result, the top surface thickness of the metal layer 105 corresponding to the surface plasmon polariton excited by the metal layer 105 may be determined based on the electric field distribution simulation diagram of the waveguide layer 104 corresponding to the metal layer 105 with different top surface thicknesses.
For example: setting the thicknesses of the top surfaces of the metal layers 105 to be 10nm, 20nm, 30nm, 40nm and 50nm respectively, and obtaining simulation diagrams of the electric field distribution of the convex parts 107 corresponding to the metal layers 105 with the thicknesses of the top surfaces respectively, wherein the simulation diagrams of the electric field distribution of the convex parts 107 corresponding to the metal layers 105 with the thicknesses of the top surfaces can be obtained, and the fact that under the condition that the thicknesses of the top surfaces of the metal layers 105 are 10nm and 20nm, the incident light directly passes through the mixed plasma waveguide 101 and the surface plasma effect cannot be excited can be known; in the case where the top surface thickness of the metal layer 105 is 30nm and 40nm, although the metal layer 105 excites surface plasmon polaritons, a large amount of light passes through the hybrid plasmon waveguide 101 regardless of the length setting of the second section, and the light transmittance of the convex section 107 cannot be made zero; in the case where the thickness of the top surface thickness of the metal layer 105 is 50nm, the metal layer 105 excites surface plasmon polaritons, and the length of the second division may affect the light transmittance of the protruding portion 107.
As shown in fig. 1, the length of the second portion is measured along the length direction of the protrusion 107, and it is understood from the first simulation calculation result that as the length of the second portion increases, the light transmittance of the protrusion 107 decreases. In the embodiment of the invention, the length of the second subsection is preferably 2.3 μm according to the result of the first simulation calculation.
Similarly, by providing the electric field distribution simulation diagrams of the protrusions 107 corresponding to the metal layers 105 with different side thicknesses, it is known that as the side thickness of the metal layer 105 increases, the light transmittance of the protrusions 107 gradually decreases, and when the side thickness of the metal layer 105 increases to 100nm, the light transmittance of the protrusions 107 becomes almost zero. However, if the side thickness of the metal layer 105 increases without limitation, too thick a side of the metal layer 105 would be detrimental to the effect of the hybrid plasmonic waveguide 101 in a temperature sensor. According to the embodiment of the invention, the side thickness of the metal layer 105 can be preferentially selected to be 100nm according to the first simulation calculation result.
According to the embodiment of the invention, the thickness of the metal layer and the length of the second subsection are obtained by simulation calculation based on the finite difference time domain method, so that the thickness of the metal layer and the length of the second subsection can be more accurately and more efficiently determined under the constraint condition that the surface plasmon polariton is excited by the metal layer and the light transmittance of the protruding part is zero.
As an alternative embodiment, the width of the convex portion 107 is obtained by performing simulation calculation based on a finite difference time domain method.
As shown in fig. 2, the width of the protrusion 107 may refer to the distance between two opposite sides of the second section when the metal layer 105 is coated on the two sides.
In order to achieve high sensitivity of the hybrid plasmonic waveguide 101 and zero transmission of incident light in the boss 107, in an embodiment of the invention, optical simulation software may be used to perform simulation calculation in combination with a finite difference time domain method to determine the width of the boss 107.
As an alternative embodiment, the width of the boss 107 is obtained based on the following steps: taking the width of the protruding part 107 as an independent variable, and performing simulation calculation on the effective refractive index of the protruding part 107 based on the finite difference time domain method to obtain a second simulation calculation result, wherein the second simulation calculation result comprises the effective refractive indexes of the waveguide layers 104 corresponding to the protruding parts 107 with different widths;
based on the second simulation calculation result, determining the width of the protruding portion 107 corresponding to the zero-order transverse electric field mode in the protruding portion 107 and the width of the protruding portion 107 corresponding to the first-order transverse electric field mode in the protruding portion 107 as the minimum value and the maximum value of the value range of the width of the protruding portion 107;
Wherein whether the protrusion 107 exhibits a zero-order transverse electric field mode and whether the protrusion exhibits a first-order transverse electric field mode is determined based on an effective refractive index of the protrusion 107.
Specifically, in the embodiment of the present invention, the width of the protruding portion 107 is taken as an independent variable, and the effective refractive index of the protruding portion 107 corresponding to the protruding portion 107 with different widths is calculated by adopting the Lumerical MODE simulation software and the finite difference time domain method, so as to obtain the effective refractive index of the protruding portion 107 corresponding to the protruding portion 107 with different widths as a second simulation calculation result.
The width of the protruding portion 107 may also be referred to as a waveguide width. In the embodiment of the invention, the effective refractive indexes of the convex parts 107 corresponding to the convex parts 107 with different widths can be represented in a curve form.
Wherein the effective refractive index (effective refractive index), generally denoted by the symbol neff, is a parameter describing the propagation characteristics of light in a medium. For optical devices such as complex waveguide structures or optical fibers, the refractive index of the medium may vary with spatial position, and the concept of effective refractive index needs to be introduced to describe the propagation behavior of light. The effective refractive index can be regarded as an equivalent refractive index, simplifying the complex structure to be similar to that of a uniform medium, thereby facilitating analysis and design. For waveguide structures, the effective refractive index may describe the propagation characteristics of the waveguide modes, such as the transmission loss, dispersion behavior, etc. of the optical modes.
FIG. 3 is a plot of the width of a lobe versus the effective index of the lobe in a hybrid plasmonic waveguide provided by the invention. As shown in fig. 3, when the width of the convex portion 107 is about 250nm, a zero-order transverse electric field mode (TE 0 mode) occurs in the convex portion 107. As the width of the convex portion 107 increases, a first-order transverse electric field mode (TE 1 mode) appears in the convex portion 107 in the case where the width of the convex portion 107 reaches about 560 nm.
In the optical waveguide, the zero-order transverse electric field mode (TE 0 mode) refers to a waveguide mode in which no electric field component exists in the propagation direction (longitudinal direction) and only the electric field component exists in the transverse direction (perpendicular to the propagation direction) in the waveguide cross section. The TE0 mode is a common waveguide mode, also commonly referred to as fundamental mode (fundamental mode).
The TE0 mode generally includes the following features: no electric field component is along the propagation direction, the electric field component of the TE0 mode is zero in the propagation direction (commonly referred to as the z direction), and the electric field variation is limited to the x and y directions in the waveguide cross section, which means that the TE0 mode has a transverse electric field distribution, and the electric field distribution along the propagation direction is zero; the low frequency lowest mode, TE0 mode, is typically the lowest frequency mode in the waveguide, which is determined by the structure and boundary conditions of the waveguide, and the cut-off frequency of the TE0 mode is relatively low for rectangular waveguides, and is therefore the dominant waveguide mode in the low frequency range; perpendicular polarization, TE0 mode is a perpendicular polarization mode, i.e., the vibration direction of the electric field is perpendicular to the waveguide cross section. In the TE0 mode the electric field may vibrate in the x-direction or the y-direction, while there is no electric field component in the z-direction (propagation direction).
In an optical waveguide, a first-order transverse electric field mode (TE 1 mode) refers to a waveguide mode in which there is one electric field component in the propagation direction (longitudinal direction) in the waveguide cross section, and also the electric field component in the transverse direction (perpendicular to the propagation direction). The TE1 mode is a higher order waveguide mode than the TE0 mode.
The TE1 mode generally includes the following features: the electric field component exists in the propagation direction, the electric field component of the TE1 mode exists in the x and y directions in the cross section of the waveguide, and also exists in the propagation direction (z direction), and the TE1 mode has the electric field distribution in the z direction and also has the transverse electric field distribution; the higher frequency mode, the higher the cutoff frequency of the TE1 mode relative to the TE0 mode, becomes more important in the high frequency range, the TE1 mode is typically the second mode in the waveguide, and the frequency is higher than the TE0 mode; vertical polarization: the TE1 mode is also a vertical polarization mode as is the TE0 mode, and the vibration direction of the electric field is perpendicular to the waveguide cross section. In the TE1 mode, the electric field can still vibrate in the x-direction or y-direction, while there is also an electric field component in the z-direction (propagation direction).
In order to avoid cross coupling and transmission loss in the hybrid plasmon waveguide 101, it is preferable in the embodiment of the present invention to perform temperature detection in the presence of only the zero-order transverse electric field mode in the convex portion 107.
Thus, the range of values for the width of the protrusion 107 in embodiments of the present invention may include 250nm and 560nm. Preferably, the width of the protrusion 107 may take a value of 530nm.
According to the embodiment of the invention, the width of the protruding part is obtained by carrying out simulation calculation based on a finite difference time domain method, the width of the protruding part corresponding to the zero-order transverse electric field mode in the protruding part and the width of the protruding part corresponding to the first-order transverse electric field mode in the protruding part are determined as the minimum value and the maximum value of the value range of the width of the protruding part, so that the phenomena of cross coupling, transmission loss and the like in the mixed plasma waveguide can be avoided, and the detection accuracy of the mixed plasma waveguide in the process of detecting the temperature of a liquid medium can be improved.
It should be noted that, in order to verify the temperature measurement effect of the mixed plasma waveguide 101 provided by the present invention, in the embodiment of the present invention, a test is performed on the mixed plasma waveguide 101.
Specifically, a liquid medium is added around the mixed plasmon waveguide 101, and the temperature of the liquid medium is changed to cause a change in the refractive index of the liquid medium, so that the feasibility of monitoring the temperature change of the liquid cooling medium in the mixed plasmon waveguide 101 is judged.
The mixed plasmon waveguide 101 was placed in an air medium and a liquid medium, respectively, and the transmittance of the mixed plasmon waveguide 101 under incident light of different wavelengths in different media was tested.
Fig. 4 is a graph showing the transmittance of the hybrid plasmonic waveguide provided by the invention under different wavelengths of incident light in an air medium. Fig. 5 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention under different wavelengths of incident light in a liquid medium.
As shown in fig. 4 and 5, the hybrid plasmonic waveguide 101 has little light transmission in an air medium, and in the case where the surface of the metal layer 105 of the hybrid plasmonic waveguide 101 is surrounded by a liquid medium, the hybrid plasmonic waveguide 101 has a large amount of light transmission.
Further, the mixed plasmon waveguide 101 was placed in liquid media of different temperatures, respectively, and the transmittance of the mixed plasmon waveguide 101 under incident light of different wavelengths in the liquid media of different temperatures was tested.
Fig. 6 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a first temperature. Fig. 7 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a second temperature. Fig. 8 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a third temperature. Fig. 9 is a graph of transmittance of a hybrid plasmonic waveguide provided by the invention at different wavelengths of incident light in a liquid medium at a fourth temperature.
As shown in fig. 4 and 5, the transmission intensity of the waveguide layer 104 increases by approximately 30% around 1550nm of the incident light wavelength.
As shown in fig. 6 and 7, both the shape of the transmittance curve and the peak point of the curve have changed, and the transmittance peak point has moved from about 1550nm to about 2000nm.
In summary, after the mixed plasmon waveguide 101 of the present invention is contacted with the liquid medium, the liquid medium excites surface plasmon polaritons on the surface of the metal layer 105, thereby affecting the transmission characteristics of the mixed plasmon waveguide 101. Therefore, in practical use, the change in the temperature of the liquid medium can be monitored by detecting the change in the electric field distribution of the protrusion 107 in the hybrid plasmon waveguide 101.
It should be noted that, the mixed plasma waveguide 101 provided by the present invention can work at the wavelength of 1550nm of the incident light, so as to realize the functions of a temperature sensor and a temperature detector.
Based on the foregoing of the embodiments, a temperature sensor includes: a hybrid plasmonic waveguide 101 and an integrated circuit as described in any of the above; the mixed plasma waveguide 101 is electrically connected with the integrated circuit;
the integrated circuit is configured to obtain electric field distribution data of the protruding portion 107 of the waveguide layer 104 in the hybrid plasmonic waveguide 101, and obtain, based on the electric field distribution data, a temperature of a liquid medium contacted by the metal layer 105 in the plasmonic waveguide.
Specifically, the integrated circuit in the embodiment of the invention can acquire the electric field distribution data of the protruding portion 107 of the waveguide layer 104 in the mixed plasma waveguide 101 in real time, and realize high-precision real-time monitoring of the temperature of the liquid medium based on the electric field distribution data.
It should be noted that, in the present invention, the connection between the hybrid plasmon waveguide 101 and the integrated circuit may be implemented by a conventional electrical connection method.
It should be noted that, in the embodiment of the present invention, the specific structure and the temperature measurement principle of the mixed plasma waveguide 101 may be referred to the content of each embodiment, and the description of the embodiment of the present invention is omitted.
The temperature sensor in the embodiment of the invention comprises the mixed plasma waveguide and the integrated circuit, wherein the integrated circuit is used for acquiring electric field distribution data of the protruding part of the waveguide layer in the mixed plasma waveguide, acquiring the temperature of the liquid medium contacted with the metal layer in the plasma waveguide based on the electric field distribution data, and acquiring the temperature of the liquid medium more accurately without meeting cold end compensation requirements or overcoming spontaneous heating problems, and particularly acquiring the temperature of the liquid medium in liquid cooling equipment more accurately.
Based on the content of the above embodiments, an electronic device includes: a liquid cooling device and a temperature sensor as described above; the temperature sensor is used for collecting the temperature of the liquid medium in the liquid cooling device.
Alternatively, the electronic device in the embodiment of the present invention may include a server.
The electronic equipment provided by the embodiment of the invention comprises the liquid cooling device and the temperature sensor, so that the temperature of the liquid medium in the liquid cooling equipment can be more accurately obtained based on the temperature sensor, and further, the working stability of the liquid cooling equipment can be ensured through monitoring the temperature of the liquid medium in the liquid cooling equipment, and the running stability and the safety of the electronic equipment can be improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A hybrid plasmonic waveguide, wherein the hybrid plasmonic waveguide is configured to detect a temperature of a liquid medium;
the hybrid plasma waveguide comprises: a substrate layer, a buffer layer, a waveguide layer, and a metal layer;
the buffer layer covers the substrate layer, and the waveguide layer covers the buffer layer;
the waveguide layer comprises a base part and a protruding part, and the protruding part is arranged on one side of the waveguide layer, which is away from the buffer layer;
the convex part comprises a first part, a second part and a third part, the second part is positioned between the first part and the third part, and the widths and the heights of the first part, the second part and the third part are equal; the metal layer is coated on the surface of the second subsection;
the electric field distribution of the convex part changes along with the temperature change of the liquid medium contacted by the metal layer.
2. The hybrid plasmonic waveguide of claim 1, wherein the thickness of the metal layer and the length of the second section are calculated by simulation based on a finite difference time domain method; the side surface of the metal layer coats the side surface of the protruding part; the top surface of the metal layer coats the top surface of the protruding part; the thickness of the metal layer includes a side thickness of the metal layer and a top thickness of the metal layer.
3. The hybrid plasmonic waveguide of claim 1, wherein the width of the boss is calculated by simulation based on a finite difference time domain method.
4. The hybrid plasmonic waveguide of claim 2, wherein the thickness of the metal layer is obtained based on the steps of:
taking the thickness of the metal layer and the length of the second subsection as independent variables, and performing simulation calculation on the electric field distribution and the light transmittance of the waveguide layer based on the finite difference time domain method to obtain a first simulation calculation result, wherein the first simulation calculation result comprises the metal layers with different thicknesses and the second subsection with different lengths, and the electric field distribution and the light transmittance of the corresponding protruding part;
taking the light transmittance meeting the requirement that the protruding part is zero and the surface plasmon polariton excited by the metal layer as a screening condition, and screening the first simulation calculation result to obtain the value range of the thickness of the metal layer and the value range of the length of the second subsection;
whether the metal layer excites surface plasmon polaritons is determined based on electric field distribution of the protruding portion.
5. A hybrid plasmonic waveguide according to claim 3, wherein the width of the boss is obtained based on the steps of:
taking the width of the protruding part as an independent variable, and carrying out simulation calculation on the effective refractive index of the protruding part based on the finite difference time domain method to obtain a second simulation calculation result, wherein the second simulation calculation result comprises the effective refractive indexes of the waveguide layers corresponding to the protruding parts with different widths;
based on the second simulation calculation result, determining the width of the protruding part corresponding to the zero-order transverse electric field mode in the protruding part and the width of the protruding part corresponding to the first-order transverse electric field mode in the protruding part as the minimum value and the maximum value of the value range of the width of the protruding part;
wherein whether the protrusion exhibits a zero-order transverse electric field mode and whether the protrusion exhibits a first-order transverse electric field mode is determined based on an effective refractive index of the protrusion.
6. The hybrid plasmonic waveguide of claim 1, wherein the material of the metal layer comprises: gold, platinum, and copper.
7. The hybrid plasmonic waveguide of claim 1, wherein the material of the waveguide layer comprises silicon; the height of the protruding part is 120nm; the height of the base is 100nm.
8. The hybrid plasma waveguide of any of claims 1 to 7, wherein the material of the buffer layer comprises silicon dioxide; the height of the buffer layer was 2 microns.
9. A temperature sensor, comprising: a hybrid plasmonic waveguide and integrated circuit as claimed in any one of claims 1 to 8; the mixed plasma waveguide is electrically connected with the integrated circuit;
the integrated circuit is used for acquiring electric field distribution data of the protruding part of the waveguide layer in the mixed plasma waveguide and acquiring the temperature of the liquid medium contacted by the metal layer in the plasma waveguide based on the electric field distribution data.
10. An electronic device, comprising: a liquid cooling device and a temperature sensor according to claim 9; the temperature sensor is used for collecting the temperature of the liquid medium in the liquid cooling device.
CN202311605364.8A 2023-11-28 2023-11-28 Hybrid plasma waveguide, temperature sensor and electronic device Pending CN117805967A (en)

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