CN117804620A - Manufacturing method of temperature acquisition device - Google Patents
Manufacturing method of temperature acquisition device Download PDFInfo
- Publication number
- CN117804620A CN117804620A CN202311849569.0A CN202311849569A CN117804620A CN 117804620 A CN117804620 A CN 117804620A CN 202311849569 A CN202311849569 A CN 202311849569A CN 117804620 A CN117804620 A CN 117804620A
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- Prior art keywords
- carrier
- butt joint
- joint structure
- sensing element
- acquisition device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 34
- 210000001503 joint Anatomy 0.000 claims abstract description 30
- 238000005452 bending Methods 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 230000001680 brushing effect Effects 0.000 claims abstract description 3
- 238000003032 molecular docking Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a manufacturing method of a temperature acquisition device, which has the advantages of convenience in welding a temperature sensing element and effectively avoiding cold joint. The manufacturing method of the temperature acquisition device comprises the following steps: injection molding the lower end of the metal terminal to the lower carrier, and enabling the top surface of the mounting end of the metal terminal to be flush with the top surface of the lower carrier; bending the connecting end of the metal terminal to form an upper butt joint structure, so that the upper butt joint structure is arranged above the lower butt joint structure of the connecting end; brushing solder paste on the mounting end, and attaching a temperature sensing element on the mounting end for welding; testing functions; covering the second upper carrier on the lower carrier to make the temperature sensing element in the second upper carrier in insulation arrangement; the flexible circuit board is inserted between the upper butt joint structure and the lower butt joint structure, and the first upper carrier is covered on the lower carrier.
Description
Technical Field
The invention relates to the field of processing of temperature acquisition devices, in particular to a manufacturing method of a temperature acquisition device.
Background
The battery pack is the most important component of an electric vehicle. In order to ensure the safety and reliability of the new energy battery pack, the temperature information of the new energy battery pack needs to be acquired and monitored. In the prior art, a temperature acquisition device is generally used for adopting the temperature of a battery pack, and the temperature acquisition device comprises an insulating carrier, a temperature sensor and a connecting terminal, wherein the temperature sensor and the connecting terminal are arranged on the insulating carrier, and the connecting terminal is electrically connected with the temperature sensor. The installation of connecting terminal on insulating carrier is unstable, and temperature sensor and connecting terminal usually adopt welded mode to be connected, need take some tin modes, and the course of working is comparatively troublesome, also appears the condition of rosin joint easily.
Therefore, there is a need for a method for manufacturing a temperature acquisition device that is convenient for welding temperature sensing elements and effectively avoids cold joint, so as to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a manufacturing method of a temperature acquisition device which is convenient for welding a temperature sensing element and effectively avoids cold joint.
In order to achieve the above object, the manufacturing method of the temperature acquisition device of the present invention comprises the following steps:
s1: injection molding the lower end of the metal terminal to the lower carrier, and enabling the top surface of the mounting end of the metal terminal to be flush with the top surface of the lower carrier;
s2: bending the connecting end of the metal terminal to form an upper butt joint structure, so that the upper butt joint structure is arranged above the lower butt joint structure of the connecting end;
s3: brushing solder paste on the mounting end, and attaching a temperature sensing element on the mounting end for welding;
s4: testing functions;
s5: covering the second upper carrier on the lower carrier to make the temperature sensing element in the second upper carrier in insulation arrangement;
s6: the flexible circuit board is inserted between the upper butt joint structure and the lower butt joint structure, and the first upper carrier is covered on the lower carrier.
Preferably, before step S1, step S01 is further included: and bending the front end of the lower butt joint structure downwards, so that the front end of the lower butt joint structure is embedded into the lower carrier.
Preferably, in step S01, the upper butt joint structure is further bent into a wave-shaped structure.
Preferably, in step S01, a convex hull structure is punched at the rear end of the lower butt joint structure.
Preferably, between step S1 and step S01, step S02 is further included: and electroplating the whole metal terminal.
Preferably, in step S2, the upper docking structure on the same plane as the lower docking structure is turned over by 180 ° so that the upper docking structure is disposed directly above the lower docking structure.
Preferably, in step S5, the temperature sensing element is glued to the second upper carrier to realize insulation by injecting glue into the structural through hole of the second upper carrier.
Preferably, in step S3, the temperature sensing element is soldered to the mounting end by means of reflow soldering.
Preferably, in step S6, before the flexible circuit board is inserted, the two sides of the flexible circuit board are cut with the clamping notch, and the middle part of the flexible circuit board is provided with the avoidance notch.
Preferably, in step S6, a locking through hole is also cut in the middle of the flexible circuit board, so that the second positioning protrusion of the first upper carrier is snapped into the locking through hole when the first upper carrier is cap-mounted to the lower carrier.
Compared with the prior art, in the invention, in the step S1, the top surface of the installation is flush with the top surface of the lower carrier, so that the tin paste can be coated on the installation end in the step S3, and after the temperature sensing element is installed, the temperature sensing element can be directly welded on the installation end. In the prior art, the temperature sensing element is welded at the mounting end in a tin spot mode, and the temperature sensing element has the risk of cold joint. Furthermore, the lower end of the metal terminal is injected to the lower carrier, so that the lower end of the metal terminal is combined with the lower carrier more tightly. In contrast, the metal terminals in the prior art are separately produced from the lower carrier, and the metal terminals are mounted on the lower carrier by punching and mounting, so that the connection is not tight enough, and the metal terminals are likely to be loosened. In addition, the temperature sensing element is arranged in the second upper carrier in an insulating way, so that the waterproof insulation of the temperature sensing element is effectively ensured, and the temperature sensing element can normally function.
Drawings
Fig. 1 is a perspective view of the lower end of the metal terminal when the lower carrier is injection-molded (step S1).
Fig. 2 is a perspective view of bending the connection end of the metal terminal to form an upper butt structure (step S2).
Fig. 3 is a perspective view of the mounting end to which solder paste is applied and the temperature sensing element is soldered (step S3).
Fig. 4 is a perspective view of the second upper carrier cap mounted to the lower carrier (step S5).
Fig. 5 is a perspective view of a flexible circuit board inserted between an upper docking structure and a lower docking structure.
Fig. 6 is a perspective view of the first upper carrier being capped to the lower carrier.
Fig. 7 is an exploded perspective view of the temperature acquisition device.
Fig. 8 is a perspective view of the temperature sensing element when connected to the metal terminal.
Fig. 9 is a perspective view of the first upper carrier.
Detailed Description
In order to describe the technical content and constructional features of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
The invention discloses a manufacturing method of a temperature acquisition device 100, and the structure of the temperature acquisition device 100 is different from the prior art. As shown in fig. 7, 8 and 9, the temperature acquisition device 100 of the present invention includes a lower carrier 12, a first upper carrier 13, a second upper carrier 14, a temperature sensing element 20 and a metal terminal 30. The metal terminal 30 includes a connection end 31 at a front end and a mounting end 32 at a rear end. The connection end 31 includes an upper docking structure 311 located above and a lower docking structure 312 located below, and a convex hull structure 3121 is formed on the lower docking structure 312 in a protruding manner. The lower carrier 12 is provided with a lower clamping protrusion 122 and a partition plate 120, the lower carrier 12 is also provided with a second positioning notch 125, and the lower clamping protrusion 122, the partition plate 120 and the second positioning notch 125 are formed along with injection molding. The first upper carrier 13 is provided with an upper snap-fit projection 132 and a second positioning projection 133. And the second upper carrier 14 is formed with a structural through hole 141, and the structural through hole 141 is substantially circular.
The manufacturing method of the temperature acquisition device 100 solves the problem of complex processing in the welding process, optimizes the manufacturing process and is beneficial to improving the production and assembly efficiency. Specifically, the manufacturing method of the temperature acquisition device 100 of the present invention includes the following steps:
s1: injection molding the lower end of the metal terminal 30 to the lower carrier 12 with the top surface of the mounting end 32 of the metal terminal 30 flush with the top surface of the lower carrier 12, as shown with reference to fig. 1;
s2: bending the connection end 31 of the metal terminal 30 to form an upper butt joint structure 311, and arranging the upper butt joint structure 311 above a lower butt joint structure 312 of the connection end 31, as shown in fig. 2;
s3: the mounting end 32 is coated with solder paste, and the temperature sensing element 20 is attached to the mounting end 32 for welding, as shown in fig. 3;
s4: testing functions;
s5: covering the second upper carrier 14 on the lower carrier 12, so that the temperature sensing element 20 is arranged in the second upper carrier 14 in an insulating manner, as shown with reference to fig. 4;
s6: the flexible circuit board 200 is inserted between the upper docking structure 311 and the lower docking structure 312, and the first upper carrier 13 is capped onto the lower carrier 12, as shown with reference to fig. 5 and 6.
In the present invention, in step S1, the top surface of the mounting end 32 is flush with the top surface of the lower carrier 12, so that in step S3, the mounting end 32 may be coated with solder paste, and after the temperature sensing element 20 is mounted, the temperature sensing element 20 may be directly soldered to the mounting end 32. In the prior art, the temperature sensing element 20 is soldered to the mounting end 32 by means of spot soldering, and there is a risk of cold soldering of the temperature sensing element 20. Moreover, the present invention allows the lower end of the metal terminal 30 to be more tightly coupled with the lower carrier 12 by injection molding the lower end of the metal terminal 30 to the lower carrier 12. In contrast, the metal terminals of the prior art are produced separately from the lower carrier 12, and the metal terminals are mounted on the lower carrier by punching and mounting, so that the connection is not tight enough and the metal terminals may be loosened. In addition, the temperature sensing element 20 is arranged in the second upper carrier 14 in an insulating manner, so that the waterproof insulation of the temperature sensing element 20 is effectively ensured, and the temperature sensing element 20 can normally function.
After the lower end of the metal terminal 30 is injection molded to the lower carrier 12, the mounting end 32 and the lower docking structure 312 are injection molded to the lower carrier 12, but the upper docking structure 311 is not.
In step S4, the function test means that the metal terminal 30 is energized to detect whether the temperature sensing element 20 is energized and operates normally.
Preferably, in the present invention, the temperature sensing element 20 is a temperature sensor for monitoring temperature change, and can be applied as an NTC thermistor, a PTC thermistor, or even a fuse according to practical needs, which is not limited thereto. After the flexible circuit board 200 is inserted into the upper docking structure 311 and the lower docking structure 312, the flexible circuit board 200 is electrically connected with the upper docking structure 311 and the lower docking structure 312, respectively, and at this time, the flexible circuit board 200 is electrically connected with the connection end 31, so that a temperature signal detected by the temperature sensor is led out through the flexible circuit board 200.
As shown in fig. 1 and 8, before step S1, step S01 is further included: the front end of the lower docking structure 312 is bent downward so that the front end of the lower docking structure 312 is embedded in the lower carrier 12 by injection molding, which makes the lower docking structure 312 more firmly combined with the lower carrier 12. In addition, in step S01, the upper docking structure 311 is bent into a wave-shaped structure, which enables the upper docking structure 311 to have multi-point contact with the flexible circuit board 200, and also enables the upper docking structure 311 to be elastically arranged, and to be elastically pressed on the flexible circuit board 200, thereby improving reliability and stability of electrical contact.
As mentioned above, the front end of the lower docking structure 312 is injection molded into the lower carrier 12, and the rear end of the lower docking structure 312 is exposed on the top surface of the lower carrier 12, so as to enhance the stability and reliability of the connection between the lower docking structure 312 and the flexible circuit board 200, and in step S01, the method further includes punching the convex hull structure 3121 at the rear end of the lower docking structure 312, and enhancing the stability of the electrical connection by utilizing the characteristic that the contact area between the convex hull structure 3121 and the flexible circuit board 200 is large.
In addition, between step S1 and step S01, step S02 is further included: the metal terminals 30 are integrally subjected to the plating treatment, which makes the metal terminals 30 more conductive.
In step S2, the upper docking structure 311 that is in the same plane as the lower docking structure 312 is turned over by 180 ° (the upper docking structure 311 is turned over along the arrow beside it), so that the upper docking structure 311 is disposed directly above the lower docking structure 312. Before the upper butt joint structure 311 is formed by bending, the metal terminals 30 are approximately in the same plane, the lower butt joint structure 312 and the mounting end 32 are processed by punching, the lower carrier 12 is injected with the two upper butt joint structures 311, which are positioned at the left and right sides of the lower carrier 12, and after bending, the upper butt joint structure 311 is arranged above the lower carrier 12.
In step S5, glue is injected into the structural through holes 141 of the second upper carrier 14, so that the temperature sensing element 20 is glued to the second upper carrier 14 to realize insulation. After the second upper carrier 14 is covered on the lower carrier 12, the temperature sensing element 20 is arranged in the structural through hole 141, after glue injection, the glue solution fills the whole structural through hole 141, the glue solution seals the temperature sensing element 20, and after the glue solution is glued, the insulation treatment of the temperature sensing element 20 is realized. It should be noted that the glue is blanked for ease of illustration and description, but it should be understood that the glue is present and necessary.
As shown in fig. 2 and 3, in step S3, the temperature sensing element 20 is welded to the mounting end 32 by means of reflow soldering, and the temperature sensing element 20 can be more stably connected to the mounting end 32.
As shown in fig. 5, 6, 7 and 9, in step S6, before the flexible circuit board 200 is inserted, the two sides of the flexible circuit board 200 are cut with the clamping notch 201, and the middle of the flexible circuit board 200 is provided with the avoiding notch 203. After the first upper carrier 13 is covered on the lower carrier 12, the upper clamping protrusions 132 and the lower clamping protrusions 122 are clamped into the clamping gaps 201, so that the positioning of the flexible circuit board 200 in the temperature acquisition device 100 is enhanced. And the partition 120 is inserted into the escape notch 203.
In addition, in step S6, a locking through hole 202 is also cut in the middle of the flexible circuit board 200, so that the second positioning protrusion 133 of the first upper carrier 13, which is covered on the lower carrier 12, is snapped into the locking through hole 202, which locks the flexible circuit board 200 on the first upper carrier 13, further enhancing the connection of the flexible circuit board 200 with the temperature acquisition device 100, preventing the temperature acquisition device 100 and the flexible circuit board 200 from being separated from each other.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The manufacturing method of the temperature acquisition device is characterized by comprising the following steps of:
s1: injecting the lower end of the metal terminal to a lower carrier, and enabling the top surface of the mounting end of the metal terminal to be flush with the top surface of the lower carrier;
s2: bending the connecting end of the metal terminal to form an upper butt joint structure, so that the upper butt joint structure is arranged above the lower butt joint structure of the connecting end;
s3: brushing solder paste on the mounting end, and attaching a temperature sensing element on the mounting end for welding;
s4: testing functions;
s5: covering a second upper carrier on a lower carrier, so that the temperature sensing element is arranged in the second upper carrier in an insulating way;
s6: and the flexible circuit board is inserted between the upper butt joint structure and the lower butt joint structure, and the first upper carrier is covered on the lower carrier.
2. The method for manufacturing a temperature acquisition device according to claim 1, further comprising step S01, before step S1: and bending the front end of the lower butt joint structure downwards, so that the front end of the lower butt joint structure is embedded into the lower carrier during injection molding.
3. The method according to claim 2, wherein in step S01, the upper butt joint structure is further folded into a wave-shaped structure.
4. The method according to claim 2, further comprising punching a convex hull structure at a rear end of the lower butt joint structure in step S01.
5. The method of manufacturing a temperature acquisition device according to claim 2, further comprising, between step S1 and step S01, step S02: and electroplating the whole metal terminal.
6. The method according to claim 1, wherein in step S2, the upper docking structure on the same plane as the lower docking structure is turned over by 180 ° so that the upper docking structure is located directly above the lower docking structure.
7. The method according to claim 1, wherein in step S5, the temperature sensing element is glued to the second upper carrier to realize insulation by injecting glue into the structural through hole of the second upper carrier.
8. The method of manufacturing a temperature acquisition device according to claim 1, wherein in step S3, the temperature sensing element is soldered to the mounting end by means of reflow soldering.
9. The method for manufacturing a temperature acquisition device according to claim 1, wherein in step S6, before the flexible circuit board is inserted, clamping notches are cut on two sides of the flexible circuit board, and an avoidance notch is formed in the middle of the flexible circuit board.
10. The method according to claim 9, wherein in step S6, a locking through hole is further cut in the middle of the flexible circuit board, so that the second positioning protrusion of the first upper carrier is snapped into the locking through hole when the first upper carrier is mounted on the lower carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311849569.0A CN117804620A (en) | 2023-12-28 | 2023-12-28 | Manufacturing method of temperature acquisition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311849569.0A CN117804620A (en) | 2023-12-28 | 2023-12-28 | Manufacturing method of temperature acquisition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117804620A true CN117804620A (en) | 2024-04-02 |
Family
ID=90419641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311849569.0A Pending CN117804620A (en) | 2023-12-28 | 2023-12-28 | Manufacturing method of temperature acquisition device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117804620A (en) |
-
2023
- 2023-12-28 CN CN202311849569.0A patent/CN117804620A/en active Pending
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