CN117803891A - Wafer inspection light source - Google Patents
Wafer inspection light source Download PDFInfo
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- CN117803891A CN117803891A CN202311845824.4A CN202311845824A CN117803891A CN 117803891 A CN117803891 A CN 117803891A CN 202311845824 A CN202311845824 A CN 202311845824A CN 117803891 A CN117803891 A CN 117803891A
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- 238000007689 inspection Methods 0.000 title claims abstract description 43
- 239000013307 optical fiber Substances 0.000 claims abstract description 59
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 239000011324 bead Substances 0.000 claims description 47
- 238000003491 array Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 43
- 230000000694 effects Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The application provides a wafer inspection light source, the wafer inspection light source includes: the device comprises an optical filter, a lens, a white light source and an optical fiber; an optical filter and a lens are arranged between the optical fiber and the white light source; the light beams emitted by the optical fibers form a three-color light source through the optical filters and the lenses, and finally form a four-color light source through combining the white light source, wherein the optical filters and the lenses are arranged at different positions and at different angles. According to the embodiment of the specification, corresponding components are arranged at different positions, the beam combination of the four-color light source is realized through adjusting angles, the wafer detection light sources in different forms are arranged, the wafer detection is carried out by adopting the wafer detection light sources of the embodiment of the specification, the complicated light source adjusting process is not needed, and the wafer detection efficiency is improved.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a wafer detection light source.
Background
Four-color light source wafer inspection is an optical imaging technique used for inspection and evaluation of semiconductor wafers. The technology mainly uses four different-color light sources with different wavelengths to illuminate the surface of a wafer, and then captures reflected or transmitted light signals through a corresponding optical system for analysis and judgment.
In practical applications, four-color light source wafer inspection systems typically use multiple light sources and are implemented by rapidly switching and adjusting the light sources of different wavelengths. In this way, when different wafers are inspected, the whole work flow is required to be performed again for each wafer inspection, and particularly, the light source is set by repeating the tedious setting steps.
Therefore, a new wafer inspection light source solution is needed.
Disclosure of Invention
In view of this, the present embodiments provide a wafer inspection light source.
The embodiment of the specification provides the following technical scheme:
the embodiment of the present disclosure provides a wafer inspection light source, including:
optical filter, lens, white light source, and optical fiber;
an optical filter and a lens are arranged between the optical fiber and the white light source;
the light beams emitted by the optical fibers pass through the optical filters and the lenses to form three-color light sources through different positions and different angles, and finally form four-color light sources by combining the white light sources.
The embodiment of the present disclosure further provides a wafer inspection light source, including:
four-color lamp bead arrays, lenses and optical fibers;
a lens is arranged between the optical fiber and the four-color lamp bead array;
the four-color lamp bead array comprises a lamp bead side wall and a lamp bead bottom; the bottom of the lamp bead is provided with a four-color lamp bead array, and four-color light beams are emitted, and the four-color light beams are focused through the lens and output to the optical fiber after changing the emitting angle by adjusting the angles of the side wall of the lamp bead and the bottom of the lamp bead.
The embodiment of the present disclosure further provides a wafer inspection light source, including:
optical fiber, lens, X prism and reflector;
the lens is arranged between the optical fiber and the X prism;
the reflector is arranged around the X prism;
the three-color parallel light sources emit light beams respectively, the light beams are converged on the lens after passing through the reflecting mirror and the X-prism, and the light beams are combined with white light in the optical fiber to finally form the four-color light source.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least:
the corresponding components are arranged at different positions, the beam combination of the four-color light source is realized through adjusting angles, the wafer detection light sources in different forms are arranged, the wafer detection light sources in the embodiment of the specification are adopted for wafer detection, the complicated light source adjusting process is not needed, and the wafer detection efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer inspection light source layout I according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a layout II of a wafer inspection light source according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a third wafer inspection light source layout according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a lens optical path in an embodiment of the present disclosure;
FIG. 5 is a schematic diagram showing the effect of multi-color convergence of a wafer inspection light source according to an embodiment of the present disclosure;
FIG. 6 is a schematic view of the optical path of the cemented lens in the example of the present specification;
FIG. 7 is a second schematic diagram showing the effect of multicolor convergence of the wafer inspection light source in the embodiment of the present disclosure;
FIG. 8 is a schematic view of a conventional single bead construction of the prior art;
FIG. 9 is a schematic diagram of another exemplary wafer inspection light source according to an embodiment of the present disclosure;
fig. 10 is a schematic structural view of another wafer inspection light source according to an embodiment of the present disclosure.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.
In the wafer defect detection, four light sources with different colors and different wavelengths are used for irradiating the surface of the wafer, and then reflected or transmitted light signals are captured through a corresponding optical system for analysis and judgment. The prior art adopts the following working procedures: light source selection, light source illumination, optical system setting, light signal capturing, image processing and analysis, defect detection and judgment and the like. In the practical use process, a plurality of light sources are generally adopted in the steps of lighting the light sources and setting the optical system, and the light source irradiation is realized by switching and adjusting different wavelengths. Therefore, the steps of switching and adjusting different wavelengths are repeated for each wafer inspection, resulting in low wafer inspection efficiency.
Based on this, the embodiment of the present specification proposes a wafer inspection light source scheme: through setting up the part and the setting of angle of adjustment of different positions, form the wafer detection light source of a kind of four-color light source of gathering, need not the step of repeated loaded down with trivial details switching and adjusting different wavelength in actual wafer detection process. According to the wafer detection light source, four-color light source convergence can be achieved without complex operation, and then wafer detection is achieved.
The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
Fig. 1-3 show that the wafer inspection light source provided in the present specification includes an optical filter, a lens, a white light source and an optical fiber. Wherein the white light source is a high brightness white light source. The device comprises an optical filter, a lens, a white light source and an optical fiber; an optical filter and a lens are arranged between the optical fiber and the white light source; the light beam emitted by the optical fiber forms a three-color light source through the optical filter and the lens, and finally forms a four-color light source by combining a white light source; wherein the optical filter and the lens are arranged at different positions and at different angles. Specifically, a clear aperture with the optical fiber outlet of 6mm or 10mm is adopted, the light source emits light at an angle of 60 degrees, and the diameter of the light outlet is 10mm. Four of which may include RGBW.
In some embodiments, the lens comprises a cemented lens group; the cemented lens group is arranged at the emergent position of the optical filter beam; the optical filter and the cemented lens group are sequentially arranged between the optical fiber and the white light source.
As shown in fig. 1, before the motor-driven color wheel filter is arranged in the cemented lens group, the motor-driven color wheel filter and the cemented lens group are arranged between the optical fiber and the high-brightness white light source. The embodiments of the present specification not only form a four-color light source, but also achieve a compact layout of the components using a cemented lens group.
In some embodiments, the lens comprises a first lens, a second lens; the first lens and the second lens are sequentially arranged between the optical fiber and the white light source. The first lens and the second lens are respectively arranged at different positions.
As shown in fig. 2 and 3, the embodiments of the present description employ a split lens group, such as a lens including a first lens and a second lens; and the first lens and the second lens are respectively arranged at different positions. As shown in fig. 2, the motor-driven color wheel filter is disposed between the first lens and the second lens. As shown in fig. 3, the motor-driven color wheel filter is disposed before the first lens and the second lens.
In some embodiments, the first lens, the filter, and the second lens in the wafer inspection light source are disposed in sequence between the optical fiber and the white light source.
As shown in fig. 2, the optical filter, the first lens and the second lens are sequentially disposed between the optical fiber and the white light source, so that the area of the optical filter can be fully utilized to form the three-color light source.
In some embodiments, the filter, the first lens and the second lens in the wafer inspection light source are disposed in sequence between the optical fiber and the white light source.
As shown in fig. 3, the optical filter, the first lens and the second lens are sequentially disposed between the optical fiber and the white light source. Therefore, the positions of the lenses can be freely adjusted, and only the fact that the second lens gathers to the focal length of the optical fiber is considered as long as parallel light beams are kept between the two lenses, so that relatively large-distance arrangement is realized.
In some embodiments, the first lens and the second lens are respectively clamped and fixed by a jackscrew, and the jackscrew is further used for adjusting the pitching angle of the first lens or the second lens.
As shown in fig. 2 and 3, the first lens and the second lens are respectively clamped and fixed by using a jackscrew, and the jackscrew is also used for adjusting the pitching angle of the first lens or the second lens so as to enable the lens to be coaxial with other components. Specifically, the jackscrew is propped against the shaft of the lens, and the pitch angle of the lens is adjusted to be coaxial with other components by adjusting a fastener with the position of the shaft sleeve changed in the using process of the jackscrew. The adjusting angle of the jackscrew is 45-90 degrees, and 120 degrees can be also adjusted.
The corresponding light paths of the three-color light sources are formed as shown in fig. 4 regardless of the lens arrangement shown in fig. 2 or 3. The first lens, the second lens and the optical filter realize three-color light sources, and the four-color light sources are finally formed by combining the white light sources, and the four-color effect distribution is shown in fig. 5.
The color wheel filter comprises a broadband and a narrowband, and is specifically limited according to imaging effects.
The light paths corresponding to the three-color light sources formed by combining the optical filters by adopting the cemented lens group shown in fig. 1 are shown in fig. 6. The resulting four color effect profile in combination with a white light source is shown in fig. 7.
In connection with the above embodiments, the lenses include spherical lenses including but not limited to plano-convex lens groups including but not limited to plano-convex lenses, biconvex lenses, plano-concave lenses, biconcave lenses, positive meniscus lenses, negative meniscus lenses, as long as the white light source end is satisfied to convert divergent 60 degree point light into parallel light beams, and then coupled and focused into light beams satisfying the clear aperture spot size of the optical fiber. The cemented lens group adopts achromatic double cemented lens, RGB light almost overlaps, aberration of light is reduced, etc.
The embodiment of the present disclosure provides a wafer inspection light source, as shown in fig. 9B, including: four-color lamp bead arrays, lenses and optical fibers; a lens is arranged between the optical fiber and the four-color lamp bead array. The four-color light beam is focused through a lens after changing the emergent angle from right to left and is output to the optical fiber. The side wall of the lamp bead is semi-surrounded with the bottom of the lamp bead, so that compared with the prior art, the side wall of the lamp bead is fully surrounded with the bottom of the lamp bead, and high risks such as heat dissipation and welding technology are reduced. In the embodiment of the specification, the side wall of the lamp bead and the bottom of the lamp bead can be adjusted relatively, and four-color light beams are output at the optical fiber end through the focusing lens by adjusting the angles of the side face of the lamp bead and the bottom of the lamp bead.
Wherein, the lens is a focusing large-diameter single lens, red, green, blue and white lamp beads are arranged in a four-color lamp bead array, and each lamp bead is distributed in an n×n mode, and is distributed in a 3×3 mode as shown in fig. 9A. Wherein the interval between the lamp beads is defined according to the specific situation. According to the output of the single lamp bead power and the actually measured brightness optical fiber outlet, the angle between the side face of the lamp bead and the bottom of the lamp bead is adjusted, and the diameter of the focusing lens covers the light mixing light spot.
As shown in fig. 8, the single lamp beads are arranged according to a specific array to meet the brightness requirement of the outlet end of the optical fiber by utilizing the power of the single lamp bead and the output power of the outlet of the optical fiber with actually measured brightness, and the diameter of the focusing lens covers the mixed light spot.
In some embodiments, the angular adjustment of the side wall of the lamp bead to the bottom of the lamp bead ranges from 90 ° to 150 °.
With the above embodiment, the RGBW is lightened by the electric control array lamp bead, the angle adjusting range between the side wall of the lamp bead and the bottom of the lamp bead is 90-150 degrees, so that the angle of the emergent light ray can be changed through the adjustment of the angle, and the emergent light ray is output to the light ray through the focusing large-diameter single lens after the adjustment of the emergent angle.
In some embodiments, a reflective material, such as a surface plated with Al or Ag or a foamed polyester material, is introduced into the bottom of the array beads to assist in angle adjustment, so as to satisfy the parallel light output after mixing the light of the array beads.
In some embodiments, the wafer inspection light source includes: optical fiber, lens, X prism and reflector; the lens is arranged between the optical fiber and the X prism; the reflecting mirror is arranged around the X prism; as shown in fig. 10, the three-color parallel light sources respectively emit light beams, the light beams are combined by changing the emitting angles after passing through the reflecting mirror and the X prism, and are converged on the optical fiber through the lens, and the light beams are combined with the white light in the optical fiber to finally form the four-color light source. Only the parallel light is required to be focused on the section of the optical fiber, and the optical fiber is not required to be focused on the section of the optical fiber to set a fixed angle.
As shown in fig. 10, the reflecting mirror is disposed around the X-prism, the lens is disposed between the optical fiber and the X-prism, the three-color parallel light sources such as RGB light sources respectively emit light beams, the emitted light beams pass through the reflecting mirror and the X-prism and then change the emitting angle to combine the light beams, and the combined light beams are input to the optical fiber through the focusing lens, and finally form the four-color light source by combining the white light in the optical fiber.
The RGB light sources in the embodiment of the present disclosure may be LED lamp box red light sources, green light sources, blue light sources, etc., and the embodiment of the present disclosure is not limited to the above examples. Red light: the wavelength of red light is generally 600-700 nanometers, and the red light can be used for detecting surface defects such as textures, foreign matters, dust, inserts and the like in wafer detection. Green light: the green light wavelength is typically between 500-600 nanometers and is suitable for detecting relatively fine surface defects such as pits, scratches, cracks, and the like. Blue light: blue light wavelengths are typically between 400-500 nanometers, and can be used to detect surface flatness and flatness, with good resolution for some fine surface structures and thin film defects. White light: the white light source provides a spectrum in a wide wavelength range, and can be used for comprehensively detecting surface defects and characteristics of the wafer. The different brightness percentages of RGB pass through the X prism beam combination light path design, and the four-color light source is finally formed by combining white light in the optical fiber after passing through the focusing lens.
In some embodiments, the reflecting mirror is disposed on the two-dimensional adjusting frame, and the pitch angle of the reflecting mirror can be adjusted to match with the X-prism to change the emergent angle for combining the three-color light beams.
In some embodiments, the focusing lens diameter is larger than the X-prism exit light spot. As shown in fig. 10, in the embodiment of the present disclosure, the X-prism is configured to combine the RGB outgoing beams, and the diameter of the focusing lens covers the RGB combined beam spot, that is, the diameter of the lens is larger than the diameter of the outgoing beam spot of the X-prism. Wherein the X-prism corresponds to the RGB light source and comprises a broadband and a narrowband, which are defined specifically according to the imaging effect.
The range of the clear aperture of the optical fiber in the embodiment of the specification is 2-20mm. The distance between the parts meets the focal length of the lens, so that the spot light beam is converted into a parallel beam, and then the parallel beam is focused on the section of the optical fiber port.
Compared with the prior art 4-color light source, the wafer detection light source of the embodiment of the specification is low in price, the required four-color light source can be realized by adjusting different positions of the components or different angles according to requirements, complex and complicated light source processes and wafer detection processes are not needed, and wafer detection efficiency and the like are improved.
The same and similar parts of the embodiments in this specification are all mutually referred to, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A wafer inspection light source, the wafer inspection light source comprising:
the device comprises an optical filter, a lens, a white light source and an optical fiber;
an optical filter and a lens are arranged between the optical fiber and the white light source;
the light beam emitted by the optical fiber forms a three-color light source through the optical filter and the lens, and finally forms a four-color light source by combining a white light source; wherein the optical filter and the lens are arranged at different positions or at different angles.
2. The wafer inspection light source of claim 1 wherein the lens comprises a cemented lens assembly; the cemented lens group is arranged at the light beam emergent position of the optical filter;
the optical filter and the cemented lens group are sequentially arranged between the optical fiber and the white light source.
3. The wafer inspection light source of claim 1 wherein the lens comprises a first lens, a second lens; the first lens and the second lens are respectively provided with different positions.
4. The wafer inspection light source of claim 3 wherein the first lens, the filter, and the second lens are disposed in the wafer inspection light source in sequence between the optical fiber and the white light source.
5. The wafer inspection light source of claim 3 wherein the optical filter, the first lens and the second lens are disposed in the wafer inspection light source in sequence between the optical fiber and the white light source.
6. The wafer inspection light source of claim 3 wherein the first lens and the second lens are held and fixed with a jackscrew, respectively, the jackscrew further being used to adjust a pitch angle of the first lens or the second lens.
7. A wafer inspection light source, the wafer inspection light source comprising:
four-color lamp bead arrays, lenses and optical fibers;
a lens is arranged between the optical fiber and the four-color lamp bead array;
the four-color lamp bead array comprises a lamp bead side wall and a lamp bead bottom; the bottom of the lamp bead is provided with a four-color lamp bead array, and four-color light beams are emitted, and the four-color light beams are focused through the lens and output to the optical fiber after changing the emitting angle by adjusting the angles of the side wall of the lamp bead and the bottom of the lamp bead.
8. The wafer inspection light source of claim 7 wherein the angular adjustment of the bead sidewall to the bead bottom is in the range of 90 ° to 150 °.
9. A wafer inspection light source, the wafer inspection light source comprising:
optical fiber, lens, X prism and reflector;
the lens is arranged between the optical fiber and the X prism;
the reflector is arranged around the X prism;
the three-color parallel light sources respectively emit light beams, the emergent angles are changed to combine the light beams after passing through the reflecting mirror and the X prism, the light beams are converged on the optical fiber through the lens, and the light beams are combined with the white light in the optical fiber to finally form the four-color light source.
10. The wafer inspection light source of claim 9 wherein the lens has a diameter greater than the diameter of the X-prism light spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311845824.4A CN117803891A (en) | 2023-12-28 | 2023-12-28 | Wafer inspection light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311845824.4A CN117803891A (en) | 2023-12-28 | 2023-12-28 | Wafer inspection light source |
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| CN117803891A true CN117803891A (en) | 2024-04-02 |
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| CN202311845824.4A Pending CN117803891A (en) | 2023-12-28 | 2023-12-28 | Wafer inspection light source |
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| CN (1) | CN117803891A (en) |
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- 2023-12-28 CN CN202311845824.4A patent/CN117803891A/en active Pending
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