CN117790426A - Chip packaging structure and manufacturing method - Google Patents
Chip packaging structure and manufacturing method Download PDFInfo
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- CN117790426A CN117790426A CN202410204995.7A CN202410204995A CN117790426A CN 117790426 A CN117790426 A CN 117790426A CN 202410204995 A CN202410204995 A CN 202410204995A CN 117790426 A CN117790426 A CN 117790426A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 108
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 179
- 238000003860 storage Methods 0.000 claims abstract description 59
- 230000017525 heat dissipation Effects 0.000 claims description 28
- 238000004140 cleaning Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 43
- 239000000428 dust Substances 0.000 abstract description 18
- 239000002245 particle Substances 0.000 abstract description 18
- 239000007788 liquid Substances 0.000 abstract description 12
- 238000009434 installation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
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Abstract
The invention relates to a chip packaging structure and a manufacturing method, belongs to the technical field of chip packaging, and solves the problems that in the prior art, the sealing performance of the chip packaging structure is low, and tiny particles such as gas, liquid or dust are easy to enter the packaging structure. The invention comprises a packaging main body, a sealing cover and a sealing mechanism, wherein the sealing cover is hinged with the packaging main body, and the sealing mechanism is arranged on the packaging main body; the sealing mechanism comprises a gas storage cavity, a piston member and a sealing air bag, the gas storage cavity is communicated with the sealing air bag, and the piston member is arranged in the gas storage cavity; the sealing cover is provided with a sealing groove and a piston top plate, and the sealing groove and the piston top plate are respectively arranged opposite to the sealing air bag and the piston piece; and filling the sealing airbag into the sealing groove after inflating. The invention realizes that the sealed airbag after inflation is filled into the whole sealing groove to form multi-layer sealing, improves the sealing property of the packaging structure and can effectively prevent tiny particles such as gas, liquid or dust from entering the packaging structure.
Description
Technical Field
The present disclosure relates to chip packaging technology, and more particularly, to a chip packaging structure and a method for manufacturing the same.
Background
When the chip is used, the chip needs to be packaged, the existing packaging structure is basically metal, ceramic or glass, and the sealing effect is achieved by filling silicone oil into the chip, but the silicone oil can react with packaging materials in the long-term use process to cause corrosion of the packaging materials, so that the surface or gap of the packaging structure is leaked, the integral sealing performance is affected, and tiny particles such as gas, liquid or dust cannot be effectively prevented from entering the packaging structure.
Disclosure of Invention
In view of the above analysis, the present invention is directed to a chip package structure and a manufacturing method thereof, so as to solve the problem that in the prior art, the sealing performance of the chip package structure is not high, and tiny particles such as gas, liquid or dust are easy to enter the package structure.
The aim of the invention is mainly realized by the following technical scheme:
the chip packaging structure comprises a packaging main body, a sealing cover and a sealing mechanism, wherein the sealing cover is hinged with the packaging main body, and the sealing mechanism is arranged on the packaging main body; a packaging cavity is formed in the packaging main body, and an installation table is arranged in the packaging cavity; the sealing mechanism comprises a gas storage cavity, a piston member and a sealing airbag, wherein the gas storage cavity is arranged on the inner wall of the packaging cavity, and a through groove is formed in the side wall of the gas storage cavity; the piston piece comprises a piston plate and a top plate strip, the piston plate is slidably arranged in the gas storage cavity, and the top plate strip penetrates through the through groove and stretches into the packaging cavity; the sealing air bag is arranged on the end face of the side wall of the packaging cavity and is communicated with the air storage cavity; the sealing device is characterized in that a sealing groove and a piston top plate are arranged on the sealing cover and correspond to the sealing air bag and the piston piece respectively, the piston top plate can be inserted into the sealing cavity to be in contact with the top plate strip, the piston top plate is used for pushing the piston plate to slide in the air storage cavity, and gas in the air storage cavity is extruded into the sealing air bag to enable the sealing air bag to be inflated and expanded, and the sealing air bag is filled into the sealing groove to seal the sealing cavity.
Further, the sealing cover is also provided with a gear and a plurality of air flow pipelines, and air outlet holes of the air flow pipelines are positioned in the sealing groove.
The cleaning mechanism comprises a hollow plate, a swinging rod, an air bag top plate and an air storage air bag, wherein the hollow plate, the air bag top plate and the air storage air bag are all arranged on a sealing cover, and the air bag top plate is contacted with the air storage air bag; the gas storage air bags are provided with a plurality of gas outlet pipes, and the gas outlet pipes are arranged corresponding to the gas flow pipelines; the air outlet pipe is connected with the air flow pipeline; the hollow plate is connected with the air bag top plate through the swinging rod and is used for pushing the air bag top plate to extrude the air storage air bag, so that gas stored in the air storage air bag is blown out from the air outlet hole of the air flow pipeline, and the surface of the sealed air bag is purged.
Further, a first toothed plate is arranged on the hollow plate and is connected with the gear in a meshed manner.
Further, the chip clamping device also comprises a fixing mechanism, wherein the fixing mechanism is arranged on the mounting table and comprises a limiting device and a clamping device, the limiting device is used for preventing the chip from being separated from the mounting groove, and the clamping device is used for clamping the chip; the limiting device is connected with the clamping device and can be linked.
Further, the limiting device comprises a guide post, a moving sleeve, a limiting plate and a second reset spring, wherein the guide post is fixedly arranged on the bottom surface of the packaging cavity; the movable sleeve passes through the mounting table and then is sleeved with the guide post, and the movable sleeve slides along the axial direction of the guide post; the second reset spring is sleeved on the guide post, one end of the second reset spring is fixedly connected with the bottom surface of the packaging cavity, and the other end of the second reset spring is fixedly connected with the movable sleeve; the limiting plate is sleeved on the movable sleeve and is rotationally connected with the movable sleeve.
Further, a spiral groove is formed in the moving sleeve, a guide block is arranged on the limiting plate, and the guide block is inserted into the spiral groove and slides in the spiral groove.
Further, the clamping device comprises a first clamping component and a second clamping component, and the first clamping component and the second clamping component are oppositely arranged; the first clamping assembly and the second clamping assembly comprise a flexible plate in an arc shape, and a first fixing frame and a second fixing frame which are respectively arranged at two ends of the flexible plate, wherein the two ends of the flexible plate can respectively slide in the first fixing frame and the second fixing frame.
Further, the device also comprises a heat dissipation mechanism, wherein the heat dissipation mechanism is arranged on the sealing cover in a penetrating way and is correspondingly arranged with the mounting table; the heat dissipation mechanism comprises a heat conduction plate, an inner cylinder, a plurality of heat conduction rods, a heat dissipation frame and a second toothed plate, and the heat dissipation frame is fixedly installed on the outer wall of the sealing cover in a sealing way; the inner cylinder can be slidably arranged on the sealing cover in a penetrating way; the heat conducting plate is arranged at one end of the inner cylinder; the heat conducting rods are arranged in the inner cylinder; one end of the heat conducting rod is fixedly connected with the heat conducting plate, and the other end of the heat conducting rod penetrates into the heat radiating frame; the outer wall surface of the inner barrel is provided with a second toothed plate, the second toothed plate and the first toothed plate are oppositely arranged on two sides of the gear, and the second toothed plate is meshed with the gear.
Further, the device also comprises a sealing cover fixing device, wherein the sealing cover fixing device comprises a clamping plate and an elastic piece; the clamping plate is arranged on the packaging main body and hinged with the packaging main body; one end of the elastic piece is fixedly connected with one end of the clamping plate, the other end of the elastic piece is fixedly connected with the packaging main body, and the other end of the clamping plate is provided with a clamping hook.
The technical scheme of the invention can at least realize one of the following effects:
(1) The invention discloses a chip packaging structure which comprises a packaging main body, a sealing cover and a sealing mechanism, wherein the sealing cover is hinged with the packaging main body; the sealing mechanism comprises a gas storage cavity, a piston member and a sealing air bag, wherein the gas storage cavity and the sealing air bag are arranged on the packaging main body, the gas storage cavity is communicated with the sealing air bag, and the piston member is arranged in the gas storage cavity; the sealing cover is provided with a sealing groove and a piston top plate, and the sealing groove and the piston top plate are respectively arranged opposite to the sealing air bag and the piston piece; the sealing airbag is filled into the sealing groove after being inflated and is used for sealing the buckled packaging main body and the sealing cover; the inflated sealing air bag can be filled in gaps between two sides of the sealing air bag and two sides of the sealing groove to form double linear sealing, so that external gas, liquid or dust and other tiny particles can be effectively prevented from entering the packaging cavity; meanwhile, the cross section of the sealing groove is arc-shaped, and the inflated sealing air bag is filled in the whole sealing groove and can be closely attached to the inner wall of the sealing groove, so that the sealing groove is filled in the whole sealing groove to form a surface sealing area, the path length of tiny particles such as gas, liquid or dust entering the packaging cavity is increased, and the tiny particles such as external gas, liquid or dust can be effectively prevented from entering the packaging cavity; the packaging structure is filled into the whole sealing groove through the inflated sealing air bag to form multi-layer sealing, so that the sealing performance of the packaging structure is improved, and tiny particles such as gas, liquid or dust can be effectively prevented from entering the packaging structure.
(2) The cleaning mechanism comprises a hollow plate, a swinging rod, an air bag top plate and an air storage air bag, wherein the hollow plate is slidably arranged on a sealing cover and is correspondingly arranged with a mounting table; the air bag top plate and the air storage air bag are both arranged on the sealing cover, and the air bag top plate is contacted with the air storage air bag; the air bag top plate is connected with the air bag accommodating cavity in a sliding manner; the gas storage air bags are provided with a plurality of gas outlet pipes, and the gas outlet pipes are correspondingly arranged with the gas flow pipelines on the sealing covers; the air outlet pipe is communicated with the air flow pipeline, and the air outlet hole of the air flow pipeline is arranged opposite to the sealing air bag; one end of the swinging rod is hinged with the hollow plate, and the other end of the swinging rod is hinged with the air bag top plate; when the sealing cover is buckled, the hollow plate drives the air bag top plate to extrude the air storage air bag, and the air storage air bag is extruded and then is blown out from the air outlet hole of the air flow pipeline, so that the surface of the sealing air bag is purged, particles such as dust remained on the surface of the sealing air bag are removed, the sealing air bag can be prevented from being damaged by the particles such as dust remained on the surface of the sealing air bag when the sealing cover is closed, and poor sealing of the packaging structure is caused, and the sealing performance of the packaging structure is affected.
In the invention, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, like reference numerals being used to designate like parts throughout the drawings;
FIG. 1 is a schematic diagram of a package structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a package body according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a package body according to an embodiment of the present invention;
FIG. 4 is a schematic view of a structure of a cover according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a closure in accordance with an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 7 is a schematic view of a sweeping mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic view of a moving sleeve according to an embodiment of the present invention;
FIG. 9 is a schematic structural view of a limiting plate according to an embodiment of the present invention;
FIG. 10 is a schematic view of a clamping device according to an embodiment of the present invention;
fig. 11 is a partial enlarged view of a in fig. 6.
Reference numerals:
1-packaging a main body; 11-a mounting table; 111-mounting slots; 112-a first through hole; 113-an arc-shaped groove; 114-arc through grooves;
2-capping; 21-sealing the groove; 22-piston top plate; 23-mounting bosses; 231-gear mounting slots; 24-gear; 25-an air bag accommodating cavity; 251-air flow duct; 26-heat dissipation through holes;
3-a sealing mechanism; 31-an air storage cavity; 32-a piston member; 321-a piston plate; 322-top panel; 33-sealing the balloon; 34-a first return spring;
4-a cleaning mechanism; 41-hollow slab; 411-first toothed plate; 42-swinging rod; 43-airbag top plate; 44-a gas storage balloon; 441-an outlet pipe;
5-a fixing mechanism; 51-a limiting device; 511-guide posts; 512-moving sleeve; 5121-a stopper; 5122-helical groove; 513-limiting plates; 5131-a second via; 5132-guide block; 5133-T-shaped limiting block; 514-a second return spring; 52-clamping means; 521-flexible boards; 522-a first fixed frame; 523-a second fixed frame;
6-a heat dissipation mechanism; 61-a heat-conducting plate; 62-an inner cylinder; 63-a heat conducting rod; 64-a heat dissipation frame; 65-a second toothed plate;
7-a cover-closing fixing device; 71-clamping plates; 72-elastic member.
Detailed Description
The following detailed description of preferred embodiments of the invention is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the invention, are used to explain the principles of the invention and are not intended to limit the scope of the invention.
Example 1
In one embodiment of the invention, a chip packaging structure is disclosed, as shown in fig. 1, the chip packaging structure comprises a packaging main body 1, a sealing cover 2 and a sealing mechanism 3, wherein the packaging main body 1 is used for mounting a chip, the sealing cover 2 is hinged with the packaging main body 1, and the sealing cover 2 is buckled on the packaging main body 1 to package the chip mounted in the packaging main body 1; the sealing mechanism 3 is arranged on the packaging main body 1 and is used for sealing the buckled packaging main body 1 so as to prevent tiny particles such as gas, liquid or dust from entering the packaging main body 1 to pollute the chip, thereby improving the stability and the service life of the chip.
Preferably, as shown in fig. 2 and fig. 3, a packaging cavity with an opening at one side is provided in the packaging main body 1, a mounting table 11 is provided in the packaging cavity, a mounting groove 111 is provided on the mounting table 11, and the mounting groove 111 is used for embedding a chip; the side wall of the package main body 1 is provided with a first sealing surface, and the first sealing surface is an end face of the side wall of the package main body 1.
Preferably, as shown in fig. 4 and 5, the cover 2 is provided with a second sealing surface, and the second sealing surface is a region of the cover 2, which is in contact with the end surface of the side wall of the package main body 1; the second cover and the first cover can be closely attached; a sealing groove 21 is arranged on the second sealing surface, and the cross section of the sealing groove 21 is arc-shaped; the sealing cover 2 is also provided with a piston top plate 22, a mounting boss 23, a gear 24 and an air bag accommodating cavity 25, wherein the mounting boss 23 is arranged opposite to the mounting table 11 in the packaging main body 1; the mounting boss 23 is provided with a gear mounting groove 231, and the gear 24 is mounted in the gear mounting groove 231; the inner wall of the gear installation groove 231 is provided with a hollow plate guide groove and an inner cylinder guide groove, and the hollow plate guide groove and the inner cylinder guide groove are oppositely arranged at two sides of the gear 24; the chamber wall of the air bag accommodating chamber 25 is provided with a plurality of air flow pipes 251, and the air outlet holes of the air flow pipes 251 are located in the sealing groove 21.
Preferably, as shown in fig. 6, the sealing mechanism 3 includes a gas storage cavity 31, a piston member 32, a sealing airbag 33, a sealing groove 21 arranged on the sealing cover 2, and a piston top plate 22, the gas storage cavity 31 is arranged on the inner wall of the packaging cavity in the packaging main body 1, and a through groove is arranged on the side wall of one side of the gas storage cavity 31 close to the chip mounting cavity; the piston member 32 comprises a piston plate 321 and a top plate strip 322 arranged on one side of the piston plate 321, the piston plate 321 is slidably arranged in the gas storage cavity 31, and the top plate strip 322 penetrates through the through groove and extends into the packaging cavity; a sealing structure, such as a sealing ring, is arranged on the circumferential surface of the piston plate 321, which is in contact with the inner wall of the gas storage cavity 31, and is used for sealing a gap between the contact surface of the piston plate 321 and the inner wall of the gas storage cavity 31; the sealing air bag 33 is arranged on the first sealing surface and is communicated with the air storage cavity 31; the seal groove 21 and the piston top plate 22 are respectively arranged corresponding to the seal air bag 33 and the piston member 32; when the sealing cover 2 is buckled, the piston top plate 22 is inserted into the packaging cavity to be in contact with the top plate strip 322, and applies pushing force to the top plate strip 322 to drive the piston plate 321 to move towards one side far away from the packaging cavity in the gas storage cavity 31, so that gas in the gas storage cavity 31 is extruded into the sealing air bag 33, and the sealing air bag 33 made of an elastically deformable material is inflated and filled into the sealing groove 21, so that the sealing of the packaging cavity is realized; compared with the prior art, the inflated sealing air bag 33 can be filled in gaps between the first sealing surfaces at two sides of the sealing air bag 33 and the second sealing surfaces at two sides of the sealing groove 21 to form double linear sealing, so that external gas, liquid or dust and other tiny particles can be effectively prevented from entering the packaging cavity; meanwhile, the cross section of the sealing groove 21 is arc-shaped, and the inflated sealing air bag 33 is filled in the whole sealing groove 21 and can be closely attached to the inner wall of the sealing groove 21, so that the sealing groove 21 is filled in the whole sealing groove 21 to form a surface sealing area, the path length of tiny particles such as gas, liquid or dust entering the packaging cavity is increased, and the tiny particles such as external gas, liquid or dust entering the packaging cavity can be effectively prevented; the packaging structure is filled into the whole sealing groove 21 through the inflated sealing air bag 33 to form multi-layer sealing, so that the sealing performance of the packaging structure is improved.
Preferably, the sealing mechanism 3 further includes a first return spring 34, one end of the first return spring 34 is fixedly connected with the other side of the piston plate 321, the other end of the first return spring is fixedly connected with a side wall of the air storage cavity 31, which is far away from the chip mounting cavity, the first return spring 34 is used for applying elastic thrust to the piston plate 321, so that the piston plate 321 always keeps a trend of restoring to an initial position, and after the extrusion force to the top plate strip 322 is removed, the first return spring 34 can drive the piston plate 321 to restore to the initial position, so that the air in the sealing air bag 33 flows back into the air storage cavity 31.
Preferably, the packaging structure is further provided with a cleaning mechanism 4, and the cleaning mechanism 4 is arranged on the sealing cover 2 and is used for cleaning tiny particles such as dust remained on the surface of the sealing air bag 33, so that the sealing air bag 33 is prevented from being damaged by the tiny particles such as dust, and the tightness of the packaging structure is further improved.
Preferably, as shown in fig. 7, the cleaning mechanism 4 comprises a hollow plate 41, a swinging rod 42, an air bag top plate 43 and an air storage air bag 44, wherein the hollow plate 41 is installed on an installation boss 23 on the cover 2 through a return spring and is arranged corresponding to the installation table 11; the air bag top plate 43 and the air storage air bag 44 are both arranged in the air bag accommodating cavity 25 of the sealing cover 2, and the air bag top plate 43 and the air storage air bag 44 are contacted; the air bag top plate 43 is in sliding connection with the air bag accommodating cavity 25; a plurality of air outlet pipes 441 are arranged on the air storage air bags 44, and the air outlet pipes 441 are correspondingly arranged with the air flow pipes 251 on the sealing cover 2 and are equal in number; the air outlet pipe 441 is communicated with the air flow pipeline 251, and an air outlet hole of the air flow pipeline 251 is arranged opposite to the sealing air bag 33; one end of the swing rod 42 is hinged with the hollow plate 41, and the other end is hinged with the air bag top plate 43; when the sealing cover 2 is buckled, the hollow plate 41 is tightly propped against the fixing mechanism 5 and is extruded by the fixing mechanism 5, then the air bag top plate 43 is pushed to slide in the air bag accommodating cavity 25 by the swinging rod 42 and the air storage air bag 44 is extruded, the air stored in the air storage air bag 44 is blown out from the air outlet hole of the air flow pipeline 251 after being extruded by the air storage air bag 44, and the surface of the sealing air bag 33 is purged, so that particles such as dust and the like remained on the surface of the sealing air bag 33 are removed, and the damage to the sealing air bag 33 caused by the particles such as dust and the like remained on the surface of the sealing air bag 33 when the sealing cover 2 is closed can be avoided, so that the sealing performance of the sealing structure is affected due to poor sealing of the sealing structure.
Preferably, the hollow plate 41 is provided with a first toothed plate 411, and the first toothed plate 411 is opposite to the gear 24 and is in meshed connection with the gear 24; the first toothed plate 411 is slidably connected to the hollow plate guide slot.
Preferably, the packaging structure further comprises a fixing mechanism 5, the fixing mechanism 5 is mounted on the mounting table 11, the fixing mechanism 5 comprises a limiting device 51 and a clamping device 52, the limiting device 51 is used for preventing the chip from being separated from the mounting groove 111, and the clamping device 52 is used for clamping the chip; the limiting device 51 is connected with the clamping device 52 and can be linked, and the chip can be clamped while being limited, so that the chip embedded in the mounting groove 111 can be further fixed, and the use stability of the chip is further improved.
Preferably, the limiting device 51 includes four limiting components, which are a first limiting component, a second limiting component, a third limiting component and a fourth limiting component, and the circumferences of the first limiting component, the second limiting component, the third limiting component and the fourth limiting component are uniformly distributed on the circumference of the mounting groove 111, so that the chip embedded in the mounting groove 111 can be limited in more directions; the first limiting assembly, the second limiting assembly, the third limiting assembly and the fourth limiting assembly have the same structure, the first limiting assembly, the second limiting assembly, the third limiting assembly and the fourth limiting assembly all comprise a guide post 511, a movable sleeve 512, a limiting plate 513 and a second return spring 514, and the guide post 511 is fixedly arranged on the bottom surface of the packaging cavity; the moving sleeve 512 passes through the first through hole 112 arranged on the mounting table 11 and is sleeved on the guide column 511; the second return spring 514 is sleeved on the guide post 511, one end of the second return spring is fixedly connected with the bottom surface of the packaging cavity, the other end of the second return spring is fixedly connected with the movable sleeve 512, and the second return spring 514 is used for applying elastic thrust to the movable sleeve 512 so that the movable sleeve 512 always keeps a trend of returning to an initial position; the moving sleeve 512 slides along the axial direction of the guide post 511; the limiting plate 513 is sleeved on the movable sleeve 512 and is rotationally connected with the movable sleeve 512; when the sealing cover 2 is buckled, the hollow plate 41 is contacted with the movable sleeve 512, and pressure is applied to the movable sleeve, and the movable sleeve 512 moves along the guide column 511 towards the direction close to the bottom surface of the packaging cavity after being pressed, so that the limiting plate 513 is driven to rotate, and a part of the limiting plate 513 rotates to the upper part of the mounting groove 111, namely, a part of the limiting plate 513 is blocked above a chip embedded in the mounting groove 111, and further the chip is prevented from falling out of the mounting groove 111.
Preferably, as shown in fig. 8, the guide post 511 is provided with a limit chute, and the limit chute is arranged along the axial direction of the guide post 511; the moving sleeve 512 is provided with a limiting block 5121 and a spiral groove 5122, wherein the limiting block 5121 slides in the limiting sliding groove to limit the circumferential rotation of the moving sleeve 512, so that the moving sleeve 512 can only move along the axial direction of the guide post 511; the limiting plate 513 is provided with a second through hole 5131, and the limiting plate 513 is sleeved on the movable sleeve 512 through the second through hole 5131; the second through hole 5131 is provided with a guide block 5132, the guide block 5132 is inserted into the spiral groove 5122 and slides in the spiral groove 5122, and the guide block 5132 can slide along the spiral groove 5122 by pressing the moving sleeve 512, so as to drive the limiting plate 513 to rotate.
Preferably, as shown in fig. 9, the limiting plate 513 is further provided with a T-shaped limiting block 5133, the T-shaped limiting block 5133 is slidably connected with an arc-shaped slot 113 provided on the mounting table 11, and the arc-shaped slot 113 is used for limiting the rotation angle of the limiting plate 513, so as to ensure that the partial area of the limiting plate 513 rotating above the mounting slot 111 is maximum, thereby more effectively limiting the chip from falling out of the mounting slot 111; the arc-shaped groove 113 is coaxial with the first through hole 112, the cross section of the arc-shaped groove 113 is of a T shape, and the T-shaped limiting block 5133 is matched with the arc-shaped groove 113, so that the limiting plate 513 always keeps contact with the end face of the mounting table 11.
Preferably, the clamping device 52 includes two clamping assemblies, a first clamping assembly and a second clamping assembly, respectively, and the first clamping assembly and the second clamping assembly are disposed opposite to each other; the first clamping assembly is connected with the first limiting assembly and the second limiting assembly, the second clamping assembly is connected with the third limiting assembly and the fourth clamping limiting assembly, and the first clamping assembly and the second clamping assembly are driven to move relatively when the first limiting assembly, the second limiting assembly, the third limiting assembly and the fourth limiting assembly are driven to rotate, so that a chip installed in the mounting groove 111 is clamped, the chip is prevented from shaking in the mounting groove 111, and the chip measurement stability is improved.
Preferably, as shown in fig. 10, the first clamping assembly and the second clamping assembly have the same structure, and each of the first clamping assembly and the second clamping assembly includes a flexible board 521, and a first fixed frame 522 and a second fixed frame 523 respectively mounted at two ends of the flexible board 521, where two ends of the flexible board 521 can slide in the first fixed frame 522 and the second fixed frame 523 respectively; the flexible board 521 of the first clamping assembly and the flexible board 521 of the second clamping assembly move relatively, so that the chip can be effectively clamped and fixed; the flexible board 521 is arched, and can prevent the damage to the chip caused by external impact and vibration, thereby further improving the stability of chip measurement.
Preferably, the first fixing frame 522 in the first clamping assembly passes through the arc-shaped through slot 114 corresponding to the first limiting assembly and is fixedly connected with the limiting plate 513 in the first limiting assembly, which is arranged on the mounting table 11; the second fixing frame 523 in the first clamping assembly passes through the arc-shaped through groove 114 which is arranged on the mounting table 11 and corresponds to the second limiting assembly, and is fixedly connected with the limiting plate 513 in the second limiting assembly; the first fixing frame 522 in the second clamping assembly passes through the arc-shaped through groove 114 which is arranged on the mounting table 11 and corresponds to the third limiting assembly, and is fixedly connected with the limiting plate 513 in the third limiting assembly; the second fixing frame 523 in the second clamping assembly passes through the arc-shaped through groove 114 corresponding to the fourth limiting assembly and is fixedly connected with the limiting plate 513 in the fourth limiting assembly, so that the limiting plate 513 is rotated in the direction of the mounting groove 111 and simultaneously drives the flexible plate 521 in the first clamping assembly and the flexible plate 521 in the second clamping assembly to move relatively, thereby clamping the chip, preventing the chip from being damaged by external impact and vibration, and improving the stability of chip measurement.
Preferably, the packaging structure further comprises a heat dissipation mechanism 6, wherein the heat dissipation mechanism 6 is arranged on the sealing cover 2 and corresponds to the mounting groove 111, and is used for dissipating heat generated by the chip, so that heat emitted by the chip is prevented from being accumulated in the packaging cavity and damaging the chip.
Preferably, as shown in fig. 11, the heat dissipation mechanism 6 includes a heat conduction plate 61, an inner cylinder 62, a plurality of heat conduction rods 63, a heat dissipation frame 64, and a second toothed plate 65, wherein the heat dissipation frame 64 is fixedly mounted on the heat dissipation through hole 26 of the cover 2 in a sealing manner; the heat dissipation through holes 26 penetrate through the cover 2 and the mounting boss 23 and correspond to the mounting grooves 111; the inner cylinder 62 is slidably arranged in the heat dissipation through hole 26 in a penetrating manner; the heat conducting plate 61 is arranged at one end of the inner cylinder 62; a plurality of heat conducting rods 63 are arranged in the inner cylinder 62, one end of each heat conducting rod 63 is fixedly connected with the heat conducting plate 61, and the other end penetrates into the heat dissipation frame 64; the outer wall surface of the inner cylinder 62 is provided with a second toothed plate 65, and the second toothed plate 65 is arranged opposite to the gear 24 and is meshed with the gear 24; the second toothed plate 65 and the first toothed plate 411 are oppositely arranged at two sides of the gear 24, and the second toothed plate 65 is in sliding connection with the inner cylinder guide groove; when the sealing cover 2 is buckled, the hollow plate 41 is extruded by the mounting table 11, the first toothed plate 411 drives the gear 24 to rotate, and synchronously drives the second toothed plate 65 to move in the direction opposite to the first toothed plate 411, and then drives the heat conducting plate 61 to move in the direction close to the chip mounting table 11, so that the heat conducting plate 61 is attached to the surface of the chip, at the moment, heat generated by the chip operation is absorbed by the heat conducting plate 61 and transferred to the heat dissipation frame 64 through the plurality of heat conducting rods 63, and the heat is dissipated to the outside through the heat dissipation frame 64, so that the temperature of the chip can be effectively reduced, errors caused by temperature change are reduced, and the accuracy and stability of measurement are improved.
Preferably, a plurality of heat transfer layers (shown in the drawing) are disposed in the heat dissipation frame 64, and the heat conducting rod 63 penetrates through the plurality of heat transfer layers and contacts with the heat transfer layers, so that heat can be more quickly transferred to the heat dissipation frame 64, and heat dissipation is accelerated; fins may also be provided on the outer surface of the heat dissipating frame 64 for faster heat dissipation to the outside.
Preferably, the packaging structure further comprises a sealing cover fixing device 7, wherein the sealing cover fixing device 7 is arranged on the packaging main body 1, so that the buckled sealing cover 2 can be conveniently and rapidly fixed; the cover fixing device 7 comprises a clamping plate 71, wherein the clamping plate 71 is arranged on the outer wall surface of the packaging main body 1, and the middle part of the clamping plate is hinged with the packaging main body 1; a clamping hook is arranged at one end, close to the sealing cover, of the clamping plate 71, and is used for hooking the sealing cover 2 when the sealing cover 2 is buckled on the packaging main body 1, so that the sealing cover 2 is fixed on the packaging main body 1; the cover fixing device 7 further comprises an elastic piece 72, one end of the elastic piece 72 is fixedly connected with the other end of the clamping plate 71, the other end of the elastic piece is fixedly connected with the outer wall surface of the packaging main body 1, the elastic piece 72 is used for applying elastic thrust to the clamping plate 71 so that the clamping hook always hooks the cover 2, and the cover 2 is kept to be fixed on the packaging main body 1 all the time after being buckled, so that the cover 2 is prevented from being automatically opened; the elastic member 72 may be an elastic sheet or a spring.
Example 2
The invention discloses a manufacturing method of a chip packaging structure, which comprises the following steps:
step 1: the chip is embedded into the mounting groove 111 of the package body 1;
step 2: the cover 2 is fastened to the package body 1.
Compared with the prior art, the beneficial effects of the manufacturing method of the chip packaging structure provided by the invention are basically the same as those of the chip packaging structure provided by the invention, and are not repeated herein.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The chip packaging structure is characterized by comprising a packaging main body (1), a sealing cover (2) and a sealing mechanism (3), wherein the sealing cover (2) is hinged with the packaging main body (1), and the sealing mechanism (3) is arranged on the packaging main body (1);
a packaging cavity is formed in the packaging main body (1), and a mounting table (11) is arranged in the packaging cavity;
the sealing mechanism (3) comprises a gas storage cavity (31), a piston piece (32) and a sealing airbag (33), wherein the gas storage cavity (31) is arranged on the inner wall of the packaging cavity, and a through groove is formed in the side wall of the gas storage cavity (31); the piston piece (32) comprises a piston plate (321) and a top plate strip (322), the piston plate (321) is slidably arranged in the gas storage cavity (31), and the top plate strip (322) penetrates through the through groove and stretches into the packaging cavity; the sealing air bag (33) is arranged on the end face of the side wall of the packaging cavity and is communicated with the air storage cavity (31);
be equipped with seal groove (21) and piston roof (22) on closing cap (2), seal groove (21) and piston roof (22) correspond setting with sealed gasbag (33) and piston spare (32) respectively, piston roof (22) can insert in the encapsulation cavity and contact with top lath (322), piston roof (22) are used for promoting piston board (321) and slide in gas storage chamber (31), squeeze into in sealed gasbag (33) with the gas in gas storage chamber (31), make sealed gasbag (33) inflation to fill to seal that seals up the cavity in seal groove (21).
2. The chip packaging structure according to claim 1, wherein the sealing cover (2) is further provided with a gear (24) and a plurality of air flow pipelines (251), and air outlet holes of the air flow pipelines (251) are located in the sealing groove (21).
3. The chip packaging structure according to claim 2, further comprising a cleaning mechanism (4), wherein the cleaning mechanism (4) comprises a hollow plate (41), a swinging rod (42), an air bag top plate (43) and an air storage air bag (44), the hollow plate (41), the air bag top plate (43) and the air storage air bag (44) are all arranged on the sealing cover (2), and the air bag top plate (43) and the air storage air bag (44) are in contact; a plurality of air outlet pipes (441) are arranged on the air storage air bags (44), and the air outlet pipes (441) are arranged corresponding to the air flow pipelines (251); the air outlet pipe (441) is connected with the air flow pipeline (251); the hollow plate (41) is connected with the air bag top plate (43) through the swinging rod (42), the hollow plate (41) is used for pushing the air bag top plate (43) to extrude the air storage air bag (44), so that the air stored in the air storage air bag (44) is blown out from the air outlet hole of the air flow pipeline (251), and the surface of the sealed air bag (33) is purged.
4. A chip package structure according to claim 3, wherein the hollow plate (41) is provided with a first toothed plate (411), and the first toothed plate (411) is in meshed connection with the gear (24).
5. A chip package structure according to claim 4, further comprising a fixing mechanism (5), the fixing mechanism (5) being mounted on the mounting table (11), the fixing mechanism (5) comprising a limiting device (51) and a clamping device (52), the limiting device (51) being for preventing the chip from coming out of the mounting groove (111), the clamping device (52) being for clamping the chip; the limiting device (51) is connected with the clamping device (52) and can be linked.
6. The chip packaging structure according to claim 5, wherein the limiting device (51) comprises a guide post (511), a moving sleeve (512), a limiting plate (513) and a second return spring (514), and the guide post (511) is fixedly mounted on the bottom surface of the packaging cavity; the movable sleeve (512) passes through the mounting table (11) and then is sleeved with the guide column (511), and the movable sleeve (512) slides along the axial direction of the guide column (511); the second reset spring (514) is sleeved on the guide post (511), one end of the second reset spring (514) is fixedly connected with the bottom surface of the packaging cavity, and the other end of the second reset spring is fixedly connected with the movable sleeve (512); the limiting plate (513) is sleeved on the movable sleeve (512) and is rotationally connected with the movable sleeve (512).
7. The chip packaging structure according to claim 6, wherein the moving sleeve (512) is provided with a spiral groove (5122), the limiting plate (513) is provided with a guide block (5132), and the guide block (5132) is inserted into the spiral groove (5122) and slides in the spiral groove (5122).
8. The chip package structure according to claim 7, wherein the clamping device (52) includes a first clamping assembly and a second clamping assembly, the first clamping assembly and the second clamping assembly being disposed opposite each other; the first clamping assembly and the second clamping assembly comprise a flexible plate (521) which is arc-shaped, and a first fixing frame (522) and a second fixing frame (523) which are respectively arranged at two ends of the flexible plate (521), wherein the two ends of the flexible plate (521) can respectively slide in the first fixing frame (522) and the second fixing frame (523).
9. The chip packaging structure according to claim 4, further comprising a heat dissipation mechanism (6), wherein the heat dissipation mechanism (6) is arranged on the cover (2) in a penetrating manner, and the heat dissipation mechanism (6) is arranged corresponding to the mounting table (11); the heat dissipation mechanism (6) comprises a heat conduction plate (61), an inner cylinder (62), a plurality of heat conduction rods (63), a heat dissipation frame (64) and a second toothed plate (65), and the heat dissipation frame (64) is fixedly installed on the outer wall of the sealing cover (2) in a sealing manner; the inner cylinder (62) can be slidably arranged on the sealing cover (2) in a penetrating way; the heat conducting plate (61) is arranged at one end of the inner cylinder (62); the heat conducting rods (63) are arranged in the inner cylinder (62); one end of the heat conducting rod (63) is fixedly connected with the heat conducting plate (61), and the other end of the heat conducting rod penetrates into the heat radiating frame (64); the outer wall surface of the inner cylinder (62) is provided with a second toothed plate (65), the second toothed plate (65) and the first toothed plate (411) are oppositely arranged on two sides of the gear (24), and the second toothed plate (65) is in meshed connection with the gear (24).
10. A chip package structure according to any one of claims 1 to 9, further comprising a cover fixing means (7), the cover fixing means (7) comprising a card plate (71) and an elastic member (72); the clamping plate (71) is arranged on the packaging main body (1) and hinged with the packaging main body (1); one end of the elastic piece (72) is fixedly connected with one end of the clamping plate (71), the other end of the elastic piece (72) is fixedly connected with the packaging main body (1), and the other end of the clamping plate (71) is provided with a clamping hook.
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| CN202410204995.7A CN117790426B (en) | 2024-02-26 | 2024-02-26 | Chip packaging structure and manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118156225A (en) * | 2024-05-09 | 2024-06-07 | 合肥中航天成电子科技有限公司 | Ceramic-metal integrated packaging structure |
| CN118335659A (en) * | 2024-06-13 | 2024-07-12 | 南通优睿半导体有限公司 | Double-sided chip packaging structure and packaging method thereof |
| CN118390543A (en) * | 2024-07-01 | 2024-07-26 | 中建八局第四建设有限公司 | Deep foundation pit supporting device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185344A (en) * | 1986-02-08 | 1987-08-13 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
| US5949132A (en) * | 1995-05-02 | 1999-09-07 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
| US6222259B1 (en) * | 1998-09-15 | 2001-04-24 | Hyundai Electronics Industries Co., Ltd. | Stack package and method of fabricating the same |
| US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
| CN103426834A (en) * | 2013-08-21 | 2013-12-04 | 中国工程物理研究院电子工程研究所 | Pressure stabilizing device for electronic sealing device |
| US20160042998A1 (en) * | 2014-08-07 | 2016-02-11 | Infineon Technologies Ag | Method of processing a substrate and a method of processing a wafer |
| CN109058780A (en) * | 2018-09-04 | 2018-12-21 | 珠海市德新合利电子科技有限公司 | A kind of LED light source encapsulating structure |
| CN208670620U (en) * | 2018-09-04 | 2019-03-29 | 珠海市德新合利电子科技有限公司 | A kind of LED light source encapsulating structure |
| CN110299327A (en) * | 2019-05-28 | 2019-10-01 | 淮南威凯机械设备有限公司 | A kind of multichip IC encapsulation |
| CN211858618U (en) * | 2020-02-17 | 2020-11-03 | 大连圣博达科技有限公司 | Diode module chip packaging device |
-
2024
- 2024-02-26 CN CN202410204995.7A patent/CN117790426B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185344A (en) * | 1986-02-08 | 1987-08-13 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
| US5949132A (en) * | 1995-05-02 | 1999-09-07 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
| US6222259B1 (en) * | 1998-09-15 | 2001-04-24 | Hyundai Electronics Industries Co., Ltd. | Stack package and method of fabricating the same |
| US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
| CN103426834A (en) * | 2013-08-21 | 2013-12-04 | 中国工程物理研究院电子工程研究所 | Pressure stabilizing device for electronic sealing device |
| US20160042998A1 (en) * | 2014-08-07 | 2016-02-11 | Infineon Technologies Ag | Method of processing a substrate and a method of processing a wafer |
| CN109058780A (en) * | 2018-09-04 | 2018-12-21 | 珠海市德新合利电子科技有限公司 | A kind of LED light source encapsulating structure |
| CN208670620U (en) * | 2018-09-04 | 2019-03-29 | 珠海市德新合利电子科技有限公司 | A kind of LED light source encapsulating structure |
| CN110299327A (en) * | 2019-05-28 | 2019-10-01 | 淮南威凯机械设备有限公司 | A kind of multichip IC encapsulation |
| CN211858618U (en) * | 2020-02-17 | 2020-11-03 | 大连圣博达科技有限公司 | Diode module chip packaging device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118156225A (en) * | 2024-05-09 | 2024-06-07 | 合肥中航天成电子科技有限公司 | Ceramic-metal integrated packaging structure |
| CN118335659A (en) * | 2024-06-13 | 2024-07-12 | 南通优睿半导体有限公司 | Double-sided chip packaging structure and packaging method thereof |
| CN118390543A (en) * | 2024-07-01 | 2024-07-26 | 中建八局第四建设有限公司 | Deep foundation pit supporting device |
| CN118390543B (en) * | 2024-07-01 | 2024-09-10 | 中建八局第四建设有限公司 | Deep foundation pit supporting device |
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| CN117790426B (en) | 2024-05-14 |
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