CN117783825A - Vehicle-gauge-level image processing chip test system - Google Patents
Vehicle-gauge-level image processing chip test system Download PDFInfo
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Abstract
The invention relates to a vehicle-gauge image processing chip test system. The system comprises: the system comprises a chip test console, an image input device, a chip test device, a to-be-tested vehicle-standard image processing chip and a test result display screen; the to-be-tested vehicle-gauge image processing chip is arranged in the chip testing device; the image input device collects the video data set and sends the video data set to the chip testing device; the chip testing device receives the digital signals, performs functional operation according to the digital signals through the to-be-tested vehicle-mounted image processing chip, performs electrical testing through the chip testing device, and sends electrical testing results to the testing result display screen and the testing chip testing console. Through setting up chip testing arrangement, can provide the operational environment who is close real operating mode when the rule level image processing chip of awaiting measuring moves, can verify the function of awaiting measuring rule level image processing chip when awaiting measuring rule level image processing chip moves, improve the flexibility of test.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a vehicle-gauge image processing chip testing system.
Background
With the rise of the internet of things and artificial intelligence technology, the whole information industry has increasingly larger demand for integrated circuits and higher quality requirements for integrated circuit products, the integrated circuit industry comprises links such as chip design, chip manufacturing and chip packaging test, the integrated circuit chip needs to be subjected to strict detection after the packaging process is finished so as to ensure the quality of the products, the functional detection of the chip is an essential important link, and the functional detection of the chip has direct influence on the quality of the IC products and subsequent use links. The vehicle-gauge chip is a chip which has technical standards reaching the vehicle-gauge level and can be applied to automobile control, wherein the vehicle-gauge image processing chip is widely applied. The existing vehicle-mounted image processing chip testing method aims at testing the reliability and durability of the vehicle-mounted control chip.
However, the conventional testing mode for the vehicle-mounted image processing chip is often a reliability and durability test for the vehicle-mounted control chip, and the testing flexibility is lacking.
Disclosure of Invention
Based on the above, in order to solve the above technical problems, a vehicle-gauge image processing chip test system is provided, which can improve the test flexibility and test the related electrical performance while the chip operates normally.
A vehicle-level image processing chip test system, the system comprising: the system comprises a chip test control console, an image input device, a chip test device, a to-be-tested vehicle-mounted image processing chip and a test result display screen, wherein the image input device, the chip test device, the to-be-tested vehicle-mounted image processing chip and the test result display screen are connected with the chip test control console; the to-be-tested vehicle-mounted standard image processing chip is arranged in the chip testing device; wherein,
the chip test control console is used for respectively controlling the image input device, the chip test device and the test result display screen to run;
the image input device is used for collecting a video data set, processing the video data set into a digital signal and sending the digital signal to the chip testing device;
the chip testing device is used for receiving the digital signals, performing functional operation according to the digital signals through the to-be-tested vehicle-mounted image processing chip, performing electrical testing through the chip testing device, and sending electrical testing results to the testing result display screen and the testing chip testing console;
and the test result display screen is used for displaying the electrical test result.
In one embodiment, the chip testing device includes an image processing chip socket to be tested, a contrast image processing chip module, and a chip testing probe station, wherein:
the image processing chip socket to be tested is used for installing the vehicle-mounted image processing chip to be tested;
the contrast image processing chip module is used for installing a tested vehicle-level image processing chip;
the chip test probe station is used for respectively carrying out electrical test on the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and comparing electrical test results to obtain the test results.
In one embodiment, the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip are further used for executing an image processing function when the to-be-tested vehicle-standard image processing chip performs an electrical test.
In one embodiment, the chip test probe station comprises a probe station and a probe rod, wherein the probe rod is fixedly arranged on the probe station; the probe seat is provided with a three-way adjusting knob for controlling the probe rod to move in three directions;
and the probe rod is respectively clicked onto the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and electrical performance parameters are collected.
In one embodiment, the probe rod is used for detecting electrical performance of the to-be-tested vehicle-gauge image processing chip, acquiring test electrical performance parameters of the to-be-tested vehicle-gauge image processing chip in functional operation, and transmitting the test electrical performance parameters to the chip test console;
the probe rod is also used for acquiring tested electrical performance parameters of the tested vehicle-level image processing chip in function operation and transmitting the tested electrical performance parameters to the chip test console;
the chip test console is further configured to compare the tested electrical performance parameter with the tested electrical performance parameter to obtain the electrical test result.
In one embodiment, the system further comprises a server; the server is provided with a plurality of first Ethernet interfaces, the test chip test control console, the contrast image processing chip module, the chip test probe station and the image processing chip socket to be tested are all provided with second Ethernet interfaces, and the first Ethernet interfaces are communicated with the second Ethernet interfaces in a connecting way.
In one embodiment, the server has a software control program stored thereon;
the chip test control console receives and runs the software control program through the first Ethernet interface and the second Ethernet interface, and sends a test start signal to the image processing chip socket to be tested, the contrast image processing chip module and the chip test probe station;
and the chip test control console receives a state signal returned by the chip test probe station by running the software control program, and receives the test results returned by the image processing chip socket to be tested and the contrast image processing chip module.
In one embodiment, the server is further configured to generate a test report according to the test result, and send the test report to the test result display screen.
In one embodiment, the system further comprises a light sensing module; the light sensing module is respectively connected with the image input device and the chip testing device and is used for acquiring the video data set from the image input device and converting the video data set into digital signals which can be identified by the chip testing device.
In one embodiment, the light sensing module comprises a light sensing lens and an audio/video encoding/decoding chip; the light sensing lens is connected with the audio/video encoding/decoding chip, wherein:
the light sensing lens is used for collecting the video data set and transmitting the video data set to the audio/video coding/decoding chip;
the audio/video encoding/decoding chip is used for converting the video data set into a digital signal which can be identified by the chip testing device.
According to the vehicle-gauge-level image processing chip testing system, the chip testing device is arranged, so that an operating environment close to a real working condition can be provided when the vehicle-gauge-level image processing chip to be tested operates, the function of the vehicle-gauge-level image processing chip to be tested can be verified while the vehicle-gauge-level image processing chip to be tested operates, and the testing flexibility is improved.
Drawings
FIG. 1 is a block diagram of a vehicle-mounted image processing chip test system in one embodiment;
FIG. 2 is a block diagram of a system for testing a vehicle-level image processing chip in accordance with another embodiment;
FIG. 3 is a block diagram of a system for testing a vehicle-level image processing chip in accordance with another embodiment;
FIG. 4 is a block diagram of a system for testing a vehicle-level image processing chip in accordance with yet another embodiment;
fig. 5 is an internal structural diagram of a server in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe ethernet interfaces, but these ethernet interfaces are not limited by these terms. These terms are only used to distinguish a first ethernet interface from another ethernet interface. For example, a first ethernet interface may be referred to as a second ethernet interface, and similarly, a second ethernet interface may be referred to as a first ethernet interface, without departing from the scope of the present application. Both the first ethernet interface and the second ethernet interface are ethernet interfaces, but they are not the same ethernet interface.
In one embodiment, as shown in fig. 1, there is provided a vehicle-gauge image processing chip test system, comprising: the chip test control console 100, an image input device 200, a chip test device 300, a to-be-tested vehicle-standard image processing chip 400 and a test result display screen 500 which are connected with the chip test control console 100; the vehicle-gauge image processing chip 400 to be tested is installed in the chip test device 300; wherein,
the chip test console 100 is used for controlling the operation of the image input device 200, the chip test device 300 and the test result display screen 500 respectively;
the image input device 200 is used for collecting a video data set, processing the video data set into a digital signal and sending the digital signal to the chip testing device 300;
the chip testing device 300 is used for receiving the digital signal, performing functional operation according to the digital signal through the to-be-tested vehicle-level image processing chip 400, performing electrical test through the chip testing device 300, and sending an electrical test result to the test result display screen 500 and the test chip test console 100;
and a test result display screen 500 for displaying the electrical test result.
The chip test console 100 may be used for controlling the operation of the whole system, and the chip test console 100 may be connected to the image input device 200, the chip test device 300, the to-be-tested vehicle-standard image processing chip 400, and the test result display screen 500, respectively.
Specifically, the chip test console 100 may send information about the start of the test to the image input device 200 and the chip test device 300, where the image input device 200 may take the collected video image set as input, and the to-be-tested vehicle-standard image processing chip 400 performs image processing according to the input video image set, and in this process, the chip test device 300 may perform an electrical performance test on the to-be-tested vehicle-standard image processing chip 400; the chip test console 100 may send the test result to the test result display screen 500, where the test result display screen 500 may be provided with a plurality of test result display screens, and each manager may view the test result through each test result display screen 500.
In this embodiment, by setting the chip testing device 300, an operating environment close to a real working condition can be provided when the to-be-tested vehicle-standard image processing chip 400 operates, and the function of the to-be-tested vehicle-standard image processing chip 400 can be verified while the to-be-tested vehicle-standard image processing chip 400 operates, so that the testing flexibility is improved.
In one embodiment, as shown in fig. 2, the chip testing apparatus 300 includes an image processing chip socket 310 to be tested, a comparative image processing chip module 320, and a chip testing probe stage 330, wherein: the image processing chip socket 310 to be tested is used for installing a vehicle-mounted standard image processing chip to be tested; a contrast image processing chip module 320 for mounting a tested vehicle-standard image processing chip; the chip test probe station 330 is configured to perform electrical tests on the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and compare electrical test results to obtain test results.
The chip socket 310 is responsible for carrying the vehicle-mounted image processing chip to be tested, and the chip socket can adsorb chips with various specifications and provide a plurality of adjustable test pins and probe seats, and the chip socket to be tested comprises the chip socket to be tested, basic circuit components such as basic amplifying circuits, digital-to-analog conversion, power supplies, various indicator lamps and the like, and assists the vehicle-mounted image processing chip to be tested to complete image processing functions and electrical property verification. The image processing chip socket to be tested should be provided with an interface for receiving an instruction from the test chip console, transmitting the result of function execution to the display screen for display through a digital signal after executing the function, and transmitting the test result back to the chip test console through the Ethernet. The image processing chip socket to be tested needs to be provided with an Ethernet interface for receiving the instruction of the chip test console and transmitting the test data back to the chip test console through the Ethernet.
The tested vehicle-gauge image processing chip installed in the comparative image processing chip module 320 is generally a certified vehicle-gauge image processing chip or other chips with functions similar to those of the chip to be tested, and is used for performing performance comparison with the vehicle-gauge image processing chip to be tested. The comparison chip module needs to be provided with an interface for receiving the instruction of the chip test console and transmitting the test data back to the chip test console through the Ethernet.
In one embodiment, the to-be-tested vehicle-level image processing chip and the tested vehicle-level image processing chip are also used for executing the image processing function when the electrical test is performed.
The vehicle-mounted standard image processing chip to be tested and the tested vehicle-mounted standard image processing chip can also execute the operations related to the images such as target detection, target identification, distortion correction, white balance and the like when the tested vehicle-mounted standard image processing chip is subjected to electrical test.
In one embodiment, the chip test probe station comprises a probe seat and a probe rod, wherein the probe rod is fixedly arranged on the probe seat; the probe seat is provided with a three-way adjusting knob for controlling the probe rod to move in three directions; the probe rods are respectively clicked onto the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and the electrical performance parameters are collected.
In one embodiment, the probe rod is used for detecting electrical properties of the vehicle-gauge image processing chip to be tested, acquiring test electrical property parameters of the vehicle-gauge image processing chip to be tested when the function is running, and transmitting the test electrical property parameters to the chip test console; the probe rod is also used for acquiring tested electrical performance parameters of the tested vehicle-level image processing chip in the functional operation process and transmitting the tested electrical performance parameters to the chip test console; the chip test console is also used for comparing the tested electrical performance parameters with the tested electrical performance parameters to obtain an electrical test result.
Specifically, the probe rod is arranged on the chip test probe platform, and the probe rod is mainly used for providing a test platform for the electrical parameter test of the semiconductor chip, and can complete the parameter detection of voltage, current, resistance, capacitance-voltage characteristic curves and the like of the integrated circuit by matching with the test control platform and an external measuring instrument. The specific actuating mechanism comprises a probe seat and a probe rod, wherein the probe seat is provided with an X-Y-Z three-way adjusting knob, and the probe rod fixed on the probe seat is controlled to move in three directions, so that a good point of a probe can be positioned on a point to be tested, and a signal detected by the probe can be transmitted to a chip testing device connected with the probe rod through a cable on the probe rod, thereby obtaining parameters of electrical performance.
In one embodiment, as shown in fig. 3, a vehicle-level image processing chip test system may further include a server 600; the server 600 is provided with a plurality of first ethernet interfaces, and the test chip test console 100, the comparison image processing chip module 320, the chip test probe station 330, and the image processing chip socket 310 to be tested are all provided with second ethernet interfaces, and the first ethernet interfaces are connected to and communicate with the second ethernet interfaces.
In one embodiment, a software control program is stored on a server; the chip test control console receives and runs a software control program through the first Ethernet interface and the second Ethernet interface, and sends a test start signal to the image processing chip socket to be tested, the contrast image processing chip module and the chip test probe station; the chip test control console receives a state signal returned by the chip test probe station through running a software control program, and receives test results returned by the image processing chip socket to be tested and the contrast image processing chip module.
The server needs to be provided with more than two Ethernet interfaces for respectively connecting the chip test probe station with the image processing chip to be tested and the contrast image processing chip module. Meanwhile, a corresponding software control program needs to be developed on the server, and the functions of the software control program may include: when the system is started, the chip test control console can send a pass signal to the image processing chip socket to be tested and the contrast image processing chip module through the Ethernet to indicate that the test is about to start; sending a start signal to a chip test probe station through the Ethernet to indicate that the probe station starts testing, and terminating the test through the stop signal when the test is finished; capable of receiving a status signal from the test probe station; the Ethernet signal transmitted back from the image processing chip socket to be tested and the contrast image processing chip module, namely the test result, can be received, and the test result can be recorded and analyzed.
In one embodiment, the server is further configured to generate a test report according to the test result, and send the test report to the test result display screen.
As shown in fig. 4, in one embodiment, a vehicle-level image processing chip test system may further include a light sensing module 700; the light sensing module 700 is respectively connected to the image input device 200 and the chip testing device 300, and is used for acquiring a video data set from the image input device 200 and converting the video data set into a digital signal which can be identified by the chip testing device 300. The image input device 200 is used for providing a recorded video data set, and the vehicle-level image processing chip generally uses a data set related to driving or parking; in this embodiment, the video data set needs to be recorded in advance according to the function running on the to-be-measured vehicle-gauge image processing chip.
In one embodiment, the light sensing module comprises a light sensing lens and an audio/video encoding/decoding chip; the light sense camera lens is connected with the audio/video coding/decoding chip, wherein: the light sensing lens is used for collecting a video data set and transmitting the video data set to the audio/video coding/decoding chip; the audio/video encoding/decoding chip is used for converting the video data set into a digital signal which can be identified by the chip testing device.
Specifically, the light sensing module is responsible for providing front image information of image processing, comprises a lens and an audio/video coding/decoding chip, and is provided with an Ethernet interface or a USB interface for receiving a control instruction from a chip test console; after the photosensitive chip and the optical lens of the camera in the photosensitive module receive the image signals output by the video, the photosensitive module converts the images into digital signals which can be processed by the image processing chip and transmits the digital signals to the contrast image processing chip module and the image processing chip socket to be tested through the Ethernet interface for image processing.
In one embodiment, a server is provided, the internal structure of which may be as shown in FIG. 5. The server includes a processor, memory, a network interface, and an input device connected by a system bus. Wherein the processor of the server is configured to provide computing and control capabilities. The memory of the server includes nonvolatile storage medium and internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface of the server is used for communicating with an external terminal through a network connection. The input device of the server can be a touch layer covered on a display screen, can be keys, a track ball or a touch pad arranged on a server shell, and can also be an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the structure shown in fig. 5 is merely a block diagram of a portion of the structure associated with the present application and is not limiting of the server to which the present application applies, and that a particular server may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
Those skilled in the art will appreciate that implementing all or part of the program processes in the above embodiments may be accomplished by way of computer programs stored in a non-transitory computer readable storage medium, which when executed, may comprise the procedures of the embodiments of the systems described above. Any reference to memory, storage, database, or other medium used in the various embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), memory bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. A vehicle-level image processing chip test system, the system comprising: the system comprises a chip test control console, an image input device, a chip test device, a to-be-tested vehicle-mounted image processing chip and a test result display screen, wherein the image input device, the chip test device, the to-be-tested vehicle-mounted image processing chip and the test result display screen are connected with the chip test control console; the to-be-tested vehicle-mounted standard image processing chip is arranged in the chip testing device; wherein,
the chip test control console is used for respectively controlling the image input device, the chip test device and the test result display screen to run;
the image input device is used for collecting a video data set, processing the video data set into a digital signal and sending the digital signal to the chip testing device;
the chip testing device is used for receiving the digital signals, performing functional operation according to the digital signals through the to-be-tested vehicle-mounted image processing chip, performing electrical testing through the chip testing device, and sending electrical testing results to the testing result display screen and the testing chip testing console;
and the test result display screen is used for displaying the electrical test result.
2. The vehicle-mounted image processing chip testing system according to claim 1, wherein the chip testing device comprises an image processing chip socket to be tested, a contrast image processing chip module, and a chip testing probe station, wherein:
the image processing chip socket to be tested is used for installing the vehicle-mounted image processing chip to be tested;
the contrast image processing chip module is used for installing a tested vehicle-level image processing chip;
the chip test probe station is used for respectively carrying out electrical test on the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and comparing electrical test results to obtain the test results.
3. The vehicle-level image processing chip test system of claim 2, wherein the vehicle-level image processing chip to be tested and the tested vehicle-level image processing chip are further configured to perform an image processing function when performing an electrical test.
4. The vehicle-mounted image processing chip testing system according to claim 2, wherein the chip testing probe station comprises a probe seat and a probe rod, and the probe rod is fixedly arranged on the probe seat; the probe seat is provided with a three-way adjusting knob for controlling the probe rod to move in three directions;
and the probe rod is respectively clicked onto the to-be-tested vehicle-standard image processing chip and the tested vehicle-standard image processing chip, and electrical performance parameters are collected.
5. The system for testing the vehicle-mounted image processing chip according to claim 4, wherein the probe rod is used for detecting electrical properties of the vehicle-mounted image processing chip to be tested, obtaining test electrical property parameters of the vehicle-mounted image processing chip to be tested during functional operation, and transmitting the test electrical property parameters to the chip test console;
the probe rod is also used for acquiring tested electrical performance parameters of the tested vehicle-level image processing chip in function operation and transmitting the tested electrical performance parameters to the chip test console;
the chip test console is further configured to compare the tested electrical performance parameter with the tested electrical performance parameter to obtain the electrical test result.
6. The vehicle-level image processing chip test system of claim 2, further comprising a server; the server is provided with a plurality of first Ethernet interfaces, the test chip test control console, the contrast image processing chip module, the chip test probe station and the image processing chip socket to be tested are all provided with second Ethernet interfaces, and the first Ethernet interfaces are communicated with the second Ethernet interfaces in a connecting way.
7. The vehicle-mounted image processing chip test system according to claim 6, wherein the server has a software control program stored thereon;
the chip test control console receives and runs the software control program through the first Ethernet interface and the second Ethernet interface, and sends a test start signal to the image processing chip socket to be tested, the contrast image processing chip module and the chip test probe station;
and the chip test control console receives a state signal returned by the chip test probe station by running the software control program, and receives the test results returned by the image processing chip socket to be tested and the contrast image processing chip module.
8. The vehicle-mounted image processing chip test system of claim 7, wherein the server is further configured to generate a test report based on the test result and send the test report to the test result display screen.
9. The vehicle-level image processing chip test system of claim 1, further comprising a light sensing module; the light sensing module is respectively connected with the image input device and the chip testing device and is used for acquiring the video data set from the image input device and converting the video data set into digital signals which can be identified by the chip testing device.
10. The vehicle-mounted image processing chip test system according to claim 9, wherein the light sensing module comprises a light sensing lens and an audio/video encoding/decoding chip; the light sensing lens is connected with the audio/video encoding/decoding chip, wherein:
the light sensing lens is used for collecting the video data set and transmitting the video data set to the audio/video coding/decoding chip;
the audio/video encoding/decoding chip is used for converting the video data set into a digital signal which can be identified by the chip testing device.
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| CN202311836027.XA CN117783825A (en) | 2023-12-28 | 2023-12-28 | Vehicle-gauge-level image processing chip test system |
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