CN117783755A - Power battery temperature simulation simulator and power battery temperature simulation method - Google Patents

Abstract

The invention relates to the technical field of battery function test, and discloses a power battery temperature simulation simulator and a power battery temperature simulation method, wherein the power battery temperature simulation simulator comprises a singlechip, a digital logic chip and a switch control circuit; the singlechip is connected with the digital logic chip and is used for converting the instruction into a corresponding resistance value after receiving the instruction and controlling the pin output corresponding to the digital logic chip; the digital logic chip is connected with the switch control circuit and is used for controlling the output of the switch control circuit under the control of the singlechip, so as to control the on and off of the relay and simulate the resistance values corresponding to different temperatures. The invention can simulate the resistance values corresponding to different temperatures so as to detect whether the BMS can play a role in protection at the corresponding temperature points, thereby judging the effectiveness of the protection function in the over-temperature environment, greatly ensuring that the power battery can block the loop in time when the power battery is over-temperature, and ensuring that the power battery is safer and more reliable.

Description

Power battery temperature simulation simulator and power battery temperature simulation method

Technical Field

The invention relates to the technical field of battery function test, in particular to a power battery temperature simulation simulator and a power battery temperature simulation method.

Background

Over-temperature protection is critical to the safety of the power cell, as excessive temperatures can lead to reduced cell performance and even dangerous situations.

At present, the existing power battery test board has a certain problem that the existing power battery test board does not perform corresponding test on over-temperature protection. Under normal temperature environment, the test boards can work normally, and test whether the protection function of the BMS (Battery Management System ) is normal. However, in a high temperature environment, whether the over-temperature protection of the BMS is effective cannot be verified by the existing test board.

Accordingly, improvements in the art are needed.

The above information is presented as background information only to aid in the understanding of the present disclosure and is not intended or admitted to be prior art relative to the present disclosure.

Disclosure of Invention

The invention provides a power battery temperature simulation simulator and a power battery temperature simulation method, which are used for solving the problems in the prior art.

In order to achieve the above object, the present invention provides the following technical solutions:

in a first aspect, the invention provides a power battery temperature simulation simulator, which comprises a singlechip U1, a digital logic chip U2 and a switch control circuit U3;

the singlechip U1 is connected with the digital logic chip U2 and is used for converting the instruction into a corresponding resistance value after receiving the instruction and controlling the pin output corresponding to the digital logic chip U2;

the digital logic chip U2 is connected with the switch control circuit U3 and is used for controlling the output of the switch control circuit U3 under the control of the singlechip, so that the on-off of the relay is controlled to simulate the resistance values corresponding to different temperatures.

Further, the power battery temperature simulation simulator also comprises an interface circuit;

the interface circuit is connected with the singlechip U1.

Further, in the power battery temperature simulation simulator, the interface circuit comprises a communication interface J1 and a level conversion chip U4;

the level conversion chip U4 is respectively connected with the communication interface J1 and the singlechip U1.

Further, in the power battery temperature simulation simulator, the switch control circuit U3 is a Darlington tube matrix.

In a second aspect, the present invention provides a power battery temperature simulation method implemented by using the power battery temperature simulation simulator according to the first aspect, where the method includes:

converting a resistance value corresponding to the temperature to be simulated into an instruction;

and sending the instruction to the power battery temperature simulation simulator so that the power battery temperature simulation simulator performs the following processing:

after receiving the instruction, the singlechip converts the instruction back to a corresponding resistance value and controls the pin output corresponding to the digital logic chip;

the digital logic chip controls the output of the switch control circuit under the control of the singlechip, thereby controlling the on and off of the relay to output a resistance value corresponding to the temperature to be simulated.

Further, in the power battery temperature simulation method, the step of converting the resistance value corresponding to the temperature to be simulated into the instruction includes:

multiplying the resistance value corresponding to the temperature to be simulated by 10 to obtain a product;

judging whether the product reaches 8 digits or not;

if not, supplementing at least one 0 in front of the product to reach 8 digits;

if so, starting from the back of the product, sending once every two digits for four times, and adding an ending symbol 45 after sending is finished, thereby completing the conversion of the instruction.

In a third aspect, the present invention provides a computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the power cell temperature simulation method according to the second aspect described above when executing the computer program.

In a fourth aspect, the present invention provides a storage medium containing computer executable instructions, wherein the computer executable instructions are executed by a computer processor to implement the power cell temperature simulation method according to the second aspect.

Compared with the prior art, the invention has the following beneficial effects:

the power battery temperature simulation simulator and the power battery temperature simulation method provided by the invention can simulate the resistance values corresponding to different temperatures so as to detect whether the BMS can play a role in protection at the corresponding temperature points, thereby judging the effectiveness of the protection function in the over-temperature environment, greatly ensuring that the power battery can block a loop in time when the power battery is over-temperature, and ensuring that the power battery is safer and more reliable.

The invention has other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, taken in conjunction with the accompanying drawings and the detailed description, which illustrate certain principles of the invention.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic circuit diagram of a singlechip in a power battery temperature simulator according to an embodiment of the present invention;

FIG. 2 is a schematic circuit diagram of a digital logic chip and a switch control circuit in a power battery temperature simulator according to an embodiment of the present invention;

fig. 3 is a schematic flow chart of a power battery temperature simulation method according to a second embodiment of the present invention;

fig. 4 is a schematic structural diagram of a computer device according to a third embodiment of the present invention.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure. In addition, as one of ordinary skill in the art can appreciate, with technical development and new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

In the description of the present application, it is to be understood that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. Furthermore, any terminology used is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In addition, numerous specific details are set forth in the following detailed description in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements, and circuits have not been described in detail as not to unnecessarily obscure the present application.

The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.

Example 1

In view of the above-mentioned drawbacks of the prior art, the applicant has actively studied and innovated based on the fact that the design and manufacture of such products have been carried out for many years and in combination with the application of the theory, in order to hope to create a technology capable of solving the drawbacks of the prior art. After continuous research and design and repeated sample test and improvement, the invention with practical value is finally created.

Referring to fig. 1-2, an embodiment of the present invention provides a power battery temperature simulation simulator, which includes a single chip microcomputer U1, a digital logic chip U2 and a switch control circuit U3;

the singlechip U1 is connected with the digital logic chip U2 and is used for converting the instruction into a corresponding resistance value after receiving the instruction and controlling the pin output corresponding to the digital logic chip U2;

the digital logic chip U2 is connected with the switch control circuit U3 and is used for controlling the output of the switch control circuit U3 under the control of the singlechip, so that the on-off of the relay is controlled to simulate the resistance values corresponding to different temperatures.

It should be noted that the single-chip microcomputer U1 plays a vital role in the whole simulation simulator, and is connected with the digital logic chip U2 to receive various instructions. After receiving the instructions, the singlechip U1 can rapidly convert the instructions into corresponding resistance values. This conversion process is accurate and efficient, ensuring that the simulation simulator can operate as intended.

In order to realize the conversion and control functions, the singlechip U1 has strong processing capacity and high-efficiency algorithm. The method can rapidly calculate the corresponding resistance value according to different instructions, and realize accurate control of the resistance value by controlling the pin output corresponding to the digital logic chip U2. The control mode has high reliability and stability, and can ensure that the simulation simulator can normally operate under different conditions.

The digital logic chip U2 is another key component, which is connected to the switch control circuit U3. Under the control of the singlechip U1, the digital logic chip U2 can control the output of the switch control circuit U3. This control process is also critical because it determines the on and off states of the relay, thus simulating the resistance values corresponding to different temperatures.

To better understand this process, an explanation of the relevant concepts is needed. A relay is a common electrical control element that is capable of controlling the on-off state of a circuit in response to changes in an input signal. In the simulation simulator provided in this embodiment, the relay is used to control the on and off states of different resistors connected in series and/or parallel according to the output signal of the digital logic chip U2, so as to combine different resistors and simulate the resistance values at different temperatures.

In addition to the above functions, the simulation simulator has high flexibility and expandability. Through adjusting the parameter setting of the singlechip U1 and the digital logic chip U2, a user can customize and optimize the simulation simulator according to actual requirements. The flexibility enables the simulation simulator to be suitable for various temperature simulation scenes and can be widely applied to other fields needing simulation of resistance value change.

Referring again to fig. 1-2, in this embodiment, the temperature simulation simulator further includes an interface circuit;

the interface circuit is connected with the singlechip U1.

Optionally, the interface circuit includes a communication interface J1 and a level conversion chip U4;

the level conversion chip U4 is respectively connected with the communication interface J1 and the singlechip U1.

It should be noted that, in order to achieve stable and reliable signal transmission, the interface circuit generally includes a communication interface J1 and a level conversion chip U4. The communication interface J1 is used for transmitting digital signals, and the level conversion chip U4 is used for converting the digital signals into voltage or current signals suitable for transmission. By adopting the communication interface J1 and the level conversion chip U4, the interface circuit can realize more stable and reliable signal transmission, thereby ensuring the performance of the temperature simulation simulator.

For example, the communication interface J1 may be an RS232 communication interface, and the level conversion chip U4 may be a chip with a model number MAX232 c.

In this embodiment, the switch control circuit U3 may be a darlington tube matrix with a model of ULN2803A, the single chip microcomputer U1 may be a single chip microcomputer with a model of stc90C952RC, and the digital logic chip U2 may be a chip with a model of 74HC 574D.

Although the terms of a single chip microcomputer, a digital logic chip, a switch control circuit, an interface circuit and the like are used in the present application, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.

The power battery temperature simulation simulator provided by the invention can simulate the resistance values corresponding to different temperatures so as to detect whether the BMS can play a role in protection at the corresponding temperature points, thereby judging the effectiveness of the protection function in the over-temperature environment, greatly ensuring that the power battery can block a loop in time when the power battery is over-temperature, and ensuring that the power battery is safer and more reliable.

Example two

Referring to fig. 3, fig. 3 is a flow chart of a power battery temperature simulation method according to a second embodiment of the present invention, where the method is implemented by using the power battery temperature simulator according to the first embodiment. The method specifically comprises the following steps:

s201, converting a resistance value corresponding to the temperature to be simulated into a command.

In this embodiment, the step 201 may be further refined to include the following steps:

multiplying the resistance value corresponding to the temperature to be simulated by 10 to obtain a product;

judging whether the product reaches 8 digits or not;

if not, supplementing at least one 0 in front of the product to reach 8 digits;

if so, starting from the back of the product, sending once every two digits for four times, and adding an ending symbol 45 after sending is finished, thereby completing the conversion of the instruction.

In order to better understand the step of converting the resistance value into the command in the present embodiment, the following description is given by way of example:

temperature (temperature)	Corresponding resistance value	Multiplied by 10	Supplement 0	Transmitting
					25℃	100000	1000000	01000000	00，00，00，01，45
-11℃	572594.9	5725949	05725949	49，59，72，05，45
					137℃	2488.9	24889	00024889	89，48，02，00，45

S202, the instruction is issued to the power battery temperature simulation simulator, so that the power battery temperature simulation simulator performs the following processing:

after receiving the instruction, the singlechip converts the instruction back to a corresponding resistance value and controls the pin output corresponding to the digital logic chip;

the digital logic chip controls the output of the switch control circuit under the control of the singlechip, thereby controlling the on and off of the relay to output a resistance value corresponding to the temperature to be simulated.

The power battery temperature simulation method provided by the invention can simulate the resistance values corresponding to different temperatures so as to detect whether the BMS can play a role in protection at the corresponding temperature points, thereby judging the effectiveness of the protection function in the over-temperature environment, greatly ensuring that the power battery can block a loop in time when the power battery is over-temperature, and ensuring that the power battery is safer and more reliable.

Example III

Fig. 4 is a schematic structural diagram of a computer device according to a third embodiment of the present invention. Fig. 4 illustrates a block diagram of an exemplary computer device 12 suitable for use in implementing embodiments of the present invention. The computer device 12 shown in fig. 4 is merely an example and should not be construed as limiting the functionality and scope of use of embodiments of the present invention.

As shown in FIG. 4, the computer device 12 is in the form of a general purpose computing device. Components of computer device 12 may include, but are not limited to: one or more processors or processing units 16, a system memory 28, a bus 18 that connects the various system components, including the system memory 28 and the processing units 16.

Bus 18 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, and a local bus using any of a variety of bus architectures. By way of example, and not limitation, such architectures include Industry Standard Architecture (ISA) bus, micro channel architecture (MAC) bus, enhanced ISA bus, video Electronics Standards Association (VESA) local bus, and Peripheral Component Interconnect (PCI) bus.

Computer device 12 typically includes a variety of computer system readable media. Such media can be any available media that is accessible by computer device 12 and includes both volatile and nonvolatile media, removable and non-removable media.

The system memory 28 may include computer system readable media in the form of volatile memory, such as Random Access Memory (RAM) 30 and/or cache memory 32. The computer device 12 may further include other removable/non-removable, volatile/nonvolatile computer system storage media. By way of example only, storage system 34 may be used to read from or write to non-removable, nonvolatile magnetic media (not shown in FIG. 4, commonly referred to as a "hard disk drive"). Although not shown in fig. 4, a magnetic disk drive for reading from and writing to a removable non-volatile magnetic disk (e.g., a "floppy disk"), and an optical disk drive for reading from or writing to a removable non-volatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical media) may be provided. In such cases, each drive may be coupled to bus 18 through one or more data medium interfaces. Memory 28 may include at least one program product having a set (e.g., at least one) of program modules configured to carry out the functions of embodiments of the invention.

A program/utility 40 having a set (at least one) of program modules 42 may be stored in, for example, memory 28, such program modules 42 including, but not limited to, an operating system, one or more application programs, other program modules, and program data, each or some combination of which may include an implementation of a network environment. Program modules 42 generally perform the functions and/or methods of the embodiments described herein.

The computer device 12 may also communicate with one or more external devices 14 (e.g., keyboard, pointing device, display 24, etc.), one or more devices that enable a user to interact with the computer device 12, and/or any devices (e.g., network card, modem, etc.) that enable the computer device 12 to communicate with one or more other computing devices. Such communication may occur through an input/output (I/O) interface 22. Moreover, computer device 12 may also communicate with one or more networks such as a Local Area Network (LAN), a Wide Area Network (WAN) and/or a public network, such as the Internet, through network adapter 20. As shown, network adapter 20 communicates with other modules of computer device 12 via bus 18. It should be appreciated that although not shown in fig. 4, other hardware and/or software modules may be used in connection with computer device 12, including, but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, data backup storage systems, and the like.

The processing unit 16 executes various functional applications and data processing by running programs stored in the system memory 28, for example, implementing the power battery temperature simulation method provided by the embodiment of the present invention.

Example IV

A fourth embodiment of the present invention provides a computer-readable storage medium having stored thereon computer-executable instructions that, when executed by a processor, implement a power battery temperature simulation method as provided by all the inventive embodiments of the present application.

Any combination of one or more computer readable media may be employed. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

The computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, either in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, smalltalk, C ++ and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computer (for example, through the Internet using an Internet service provider).

In view of the foregoing, it will be evident to a person skilled in the art that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not explicitly described herein, those skilled in the art will appreciate that the present application is intended to embrace a variety of reasonable alterations, improvements and modifications to the embodiments. Such alterations, improvements, and modifications are intended to be proposed by this application, and are intended to be within the spirit and scope of the exemplary embodiments of this application.

Furthermore, certain terms in the present application have been used to describe embodiments of the present application. For example, "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. Thus, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined as suitable in one or more embodiments of the application.

It should be appreciated that in the foregoing description of embodiments of the present application, various features are grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the application. However, this is not to say that a combination of these features is necessary, and it is entirely possible for a person skilled in the art to extract some of them as separate embodiments to understand them at the time of reading this application. That is, embodiments in this application may also be understood as an integration of multiple secondary embodiments. While each secondary embodiment is satisfied by less than all of the features of a single foregoing disclosed embodiment.

Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Accordingly, the embodiments disclosed herein are by way of example only and not limitation. Those skilled in the art can adopt alternative configurations to implement the applications herein according to embodiments herein. Accordingly, embodiments of the present application are not limited to the embodiments precisely described in the application.

Claims (8)

1. The power battery temperature simulation simulator is characterized by comprising a singlechip (U1), a digital logic chip (U2) and a switch control circuit (U3);

the singlechip (U1) is connected with the digital logic chip (U2) and is used for converting the instruction into a corresponding resistance value after receiving the instruction and controlling the pin output corresponding to the digital logic chip (U2);

the digital logic chip (U2) is connected with the switch control circuit (U3) and is used for controlling the output of the switch control circuit (U3) under the control of the singlechip, so that the on-off of the relay is controlled to simulate the resistance values corresponding to different temperatures.

2. The power cell temperature simulation simulator of claim 1, further comprising an interface circuit;

the interface circuit is connected with the singlechip (U1).

3. The power cell temperature simulation simulator of claim 2, wherein the interface circuit comprises a communication interface (J1) and a level shift chip (U4);

the level conversion chip (U4) is respectively connected with the communication interface (J1) and the singlechip (U1).

4. The power cell temperature simulation simulator according to claim 1, characterized in that the switch control circuit (U3) is a darlington tube matrix.

5. A power cell temperature simulation method implemented by the power cell temperature simulation simulator according to any one of claims 1 to 4, characterized in that the method comprises:

converting a resistance value corresponding to the temperature to be simulated into an instruction;

and sending the instruction to the power battery temperature simulation simulator so that the power battery temperature simulation simulator performs the following processing:

after receiving the instruction, the singlechip converts the instruction back to a corresponding resistance value and controls the pin output corresponding to the digital logic chip;

the digital logic chip controls the output of the switch control circuit under the control of the singlechip, thereby controlling the on and off of the relay to output a resistance value corresponding to the temperature to be simulated.

6. The power cell temperature simulation method according to claim 5, wherein the step of converting a resistance value corresponding to a temperature to be simulated into a command includes:

multiplying the resistance value corresponding to the temperature to be simulated by 10 to obtain a product;

judging whether the product reaches 8 digits or not;

if not, supplementing at least one 0 in front of the product to reach 8 digits;

if so, starting from the back of the product, sending once every two digits for four times, and adding an ending symbol 45 after sending is finished, thereby completing the conversion of the instruction.

7. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the power cell temperature simulation method of any of claims 5-6 when the computer program is executed.

8. A storage medium containing computer executable instructions for execution by a computer processor to implement the power cell temperature simulation method of any one of claims 5-6.