CN1177741C - Support structure for package - Google Patents
Support structure for package Download PDFInfo
- Publication number
- CN1177741C CN1177741C CNB011120533A CN01112053A CN1177741C CN 1177741 C CN1177741 C CN 1177741C CN B011120533 A CNB011120533 A CN B011120533A CN 01112053 A CN01112053 A CN 01112053A CN 1177741 C CN1177741 C CN 1177741C
- Authority
- CN
- China
- Prior art keywords
- plane
- side plate
- base plate
- support structure
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/107—Grooves, ribs, or the like, situated on opposed walls and between which the articles are located
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Buffer Packaging (AREA)
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packages (AREA)
Abstract
A support structure for packaging is provided for containing, storing and transporting electronic components like liquid crystal modules. The structure includes a bottom plate (2) and first and second side plates (1, 1) provided at respective sides of the bottom plate. Side surfaces (4, 4) of the bottom plate (2) constitute first inclined planes slanted at a first degree. End surfaces (5, 5) of the first and second side plates (1, 1) on the bottom plate side constitute second inclined planes slanted at a second degree. The first and second degrees are selected such that, when the first and second side plates (1, 10) are erected to cause the first inclined plane (4) and the second inclined plane (5) to closely contact with each other, the first and second side plates (1, 1) are prevented from being bent inwards more than 90 degrees.
Description
Technical field
The present invention relates generally to support structure for package, relates in particular to a kind of support structure for package that is used to hold, store and transport the electronic component that resembles Liquid Crystal Module and so on.
Background technology
Japanese patent application publication No. 175582/96 and 226867/97 has disclosed by the made traditional packing bearer frame of synthetic resin cystosepiment.Under any situation, be equipped with base plate and the setting side plate that is firmly held under the specific upright state therein, to form packaging bearer frame or supporting structure.The groove shape that packaged object is fixed on a plurality of parts that are formed at base plate and side plate plugs in the groove.
A kind of supporting structure that is mainly used in the packing Liquid Crystal Module traditionally is to be provided with by the made base plate of synthetic resin cystosepiment and the form of side plate, and its latus inframedium extends from the relative side of base plate, and they are folding and erect through hinge.On base plate and side plate, be provided with to separate along the bearing of trend of hinge and use protuberance, the interval that has defined therebetween is to hold corresponding packaged object.
Yet this type of supporting structure has such fault of construction, and promptly side plate may bend inwards and surpass 90 degree.At the whereabouts of packing, it presents not enough intensity and buffering characteristic, and bigger impact can be passed to packaged object.Therefore, it be not suitable for packing such as Liquid Crystal Module, need the fabulous damping characteristics and the electronic component of safety.
Another defective of traditional support structure for package is, it lack be used to resist top board with respect under normal bearing state with the side plate side travel of packaged object closed contact or the funtion part of sinking.Therefore, when packing fell, the top board and the side plate that support packaged object impacted each self-absorption, so just may partly bigger impact be passed to packaged object.
In addition, especially under the situation that will pack objects of small quantity, this structure lacks the ability that these objects is remained on firmly the fixed position.Therefore, it should not be used as and resemble Liquid Crystal Module and so on, needs fabulous damping characteristics and be fixed the package of electronic component on the throne capitally.
Summary of the invention
The present invention has solved the problems referred to above.One object of the present invention is to provide a kind of improved support structure for package, and it can be gained in strength and can not weaken its damping characteristics, thereby guarantees splendid damping characteristics and safety.This supporting structure is contained in the packing object, and can reduce the impact that passes to packaged object when packing falls.
Another object of the present invention is to provide a kind of improved support structure for package, and it helps package handling, and can adopt the countermeasure that prevents from therefrom to produce dust.
One aspect of the invention provides a kind of made by synthetic resin, support structure for package of being used to hold electronic component.This support structure for package is provided with base plate and side plate.Base plate supports electronic component from the below.First and second side plates stretch out and erect from the opposite side of base plate respectively, so that be used as from the supporting part of two-side supporting electronic component.Each self-forming of the end face of base plate is with first inclined-plane of first angle tilt.Each self-forming of end face of first and second side plates on the base plate both sides is with second inclined-plane of second angle tilt.This first angle and second angle are chosen to be: when first and second side plates are erect so that first and second inclined-planes when fitting tightly each other, can prevent that this first and second side plate from bending inwards and surpass 90 degree.
Another aspect of the present invention provides a kind of made by synthetic resin, support structure for package of being used to hold electronic component.This support structure for package is provided with base plate, side plate and top board.Base plate supports electronic component from the below.First and second side plates stretch out and erect from the respective side of base plate, so that be formed for from the supporting part of two-side supporting electronic component.First side plate has the outer face that forms first inclined-plane.Second side plate has the outer face that forms second inclined-plane.When first and second side plates were erect, top board was used as a lid.This top board has the 4th inclined-plane that is used to fit tightly the 3rd inclined-plane on first inclined-plane and is used to fit tightly second inclined-plane.The first and the 3rd inclined-plane is respectively equipped with recess and protuberance, so that they can be connected recess and the chimeric of protuberance by this.The second and the 4th inclined-plane is respectively equipped with recess and protuberance, so that they can be connected recess and the chimeric of protuberance by this.
Description of drawings
Describe in detail in conjunction with the drawings after the present invention, above-mentioned and other purpose, characteristics, aspect and advantage of the present invention will become and must come into plain view more.
Fig. 1 is the birds-eye view of support structure for package of the present invention when being in deployed condition.
Fig. 2 A and 2B are that line A-A and the B-B in Fig. 1 carries out side cross sectional view respectively.
Fig. 3 is that the line C-C in Fig. 1 carries out side cross sectional view.
Fig. 4 is the enlarged drawing of the part D among Fig. 2.
Fig. 5 is the block diagram of support structure for package of the present invention when being in deployed condition.
How the supporting structure that Fig. 6 shows among Fig. 5 folds.
Fig. 7 is the block diagram of support structure for package of the present invention when being in folded state.
Fig. 8 A, 8B and 8C are respectively birds-eye view, front cross sectional view and the sectional views that is used for top board of the present invention.
Fig. 9 is the block diagram of this top board.
Figure 10 is the exploded drawings of support structure for package of the present invention.
Figure 11 A, 11B, 11C and 11D are all cutaway views when support structure for package of the present invention is in assembled state.
Figure 12 is the block diagram that is used for side plate of the present invention.
Figure 13 A, 13B and 13C are respectively birds-eye view, front cross sectional view and the sectional views of this side plate.
The specific embodiment
The support structure for package of first embodiment of the invention is made by synthetic resin solid slab or cystosepiment, and this synthetic resin can be the polyolefin resin that comprises polystyrene type, polypropylene and polyethylene terephthalate or any other synthetic resin with appropriate rigidity and elasticity and stronger restoring force.This structure has a barrier functionality part on each end face of its base plate, so that prevent corresponding side plate around folding between the line between himself and the base plate and when erectting, bending inwards surpasses 90 degree.This structure is formed into: when falling when being assembled into packed state, impact can not passed to packaged object.It has guaranteed splendid damping characteristics, and can prevent that the bottom is impaired.
The support structure for package of second embodiment of the invention have by be formed in normal bearing state with the contacted side plate of packaged object on recess and be formed on the another kind of barrier functionality part that protuberance provided on the top board.This part makes top board and side plate leak-tight joint together, thereby prevents that top board is with respect to side plate side travel or sinking.Therefore, can prevent that the impact when packing falls from passing to packaged object.
The support structure for package of these embodiment can be used for packing the electronic component that resembles Liquid Crystal Module and so on.Specifically, side surface is around erectting with 90 degree between the line between himself and the base plate.The end face of base plate fits tightly on the corresponding end-faces of each side plate, thereby prevents that the side plate bending from surpassing 90 degree.In this state, the groove shape that is inserted on a plurality of parts that are formed on side plate of packaged object plugs among the groove.At last, be formed at the protuberance and the recess tabling that is formed at the side plate that contacts packaged object of top board.
According to the support structure for package of first embodiment, the end face of the side plate on the end face of top board and the base plate both sides fits tightly.So, formed the strong design that a kind of impact when preventing from packing fallen passes to packaged object.This structure presents splendid damping characteristics, and can keep enough holding and bearing strength, falls repeatedly to bear it, prevents from too much impact is passed to packaged object.
According to the support structure for package of second embodiment, in the normal bearing state of structure with on the contacted side plate of packaged object, be provided with recess, on top board, then be provided with protuberance, thereby guarantee tight engagement between side plate and the top board.Therefore, the impact in the time of can absorbing the packing whereabouts equably by whole supporting structure, thus prevent to give packaged object with the impact localized delivery.
Example of the present invention is described below with reference to accompanying drawings.
Fig. 1 is the birds-eye view of a kind of example of support structure for package of the present invention when being in deployed condition.
This support structure for package is made by synthetic resin solid slab integral body, and this synthetic resin can be the polyolefin resin that comprises polystyrene type, polypropylene and polyethylene terephthalate or any other synthetic resin with appropriate rigidity and elasticity and stronger restoring force.Fig. 2 A and 2B are respectively the cutaway views of this supporting structure of dissecing of line A-A in Fig. 1 and B-B.Fig. 3 is the cutaway view of this structure of dissecing of the line C-C in Fig. 1.Fig. 4 is the enlarged drawing of the circle part D among Fig. 2.Fig. 5 is the block diagram of this support structure for package.
See also Fig. 1,2A, 2B, 3,4 and 5, support structure for package is provided with base plate 2, first side plate 1 and second side plate 1.Base plate 2 is from below supporting electronic component (not shown).First side plate 1 and second side plate 1 stretch out from the respective side of base plate 2, and inwardly folding to become the supporting part that is used for from the two-side supporting electronic component.End face 4 each formation of base plate 2 are with first inclined-plane of first angle tilt.Corresponding end- faces 5,5 each formation of first and second side plates 1,1 on the base plate both sides are with second inclined-plane of second angle tilt.
First angle and second angle are chosen to be: when first and second side plates 1,1 inwardly folding so that first inclined-plane 4 and second inclined-plane 5 fit tightly each other, can prevent that this first and second side plate 1,1 from bending inwards and surpass 90 degree.
By with side plate 1,1 around between himself with base plate 2 between corresponding line 3 rolled over 90 and spent so that the end face 4,4 of the end face 5,5 of side plate 1,1 and base plate 2 fits tightly each other, thereby this support structure for package is assembled into packed state.Packaged object just is contained in this packing.
Fig. 6 is the block diagram of this support structure for package, and wherein first and second side plates 1,1 are in inwardly folding state.
Fig. 7 is the block diagram of this support structure for package when being in folded state.According to the present invention, the end face 4,4 of supporting structure base plate 2 and the corresponding end- faces 5,5 of first and second side plates 1,1 on the base plate both sides fit tightly.Base plate 2 and side plate 1,1 have constituted a space that falls at packing, so just become a kind of rugged construction that impact can not passed to packaged object.This structure presents the splendid damping characteristics at the packing whereabouts, and can keep enough holding and bearing strength, falls repeatedly to bear it.
Be in the state of erectting around corresponding line 3 works 90 degree at side plate 1,1, packaged object is inserted into the groove shape that is formed on the relative side plate 1,1 and plugs among the groove 6.Guarantee fixedlying positioning of packaged object like this, and improved its operation.
Fig. 8 A is the birds-eye view that is used for top board of the present invention.Fig. 8 B and 8C are respectively the top board cutaway views that line B-B in Fig. 8 A and A-A dissect.Fig. 9 is the block diagram of this top board.
See also Fig. 2 A, 2B, 7,8A, 8B and 8C, the outer face 5a of first side plate 1 forms first inclined-plane.The outer face 5b of second side plate 1 forms second inclined-plane.When first and second side plates 1,1 were erect, top board 9 was used for from top cover placed on it.The 4th inclined-plane 9b that top board 9 has the 3rd inclined-plane 9a that the first inclined-plane 5a with first side plate 1 fits tightly and fits tightly with the second inclined-plane 5b of second side plate 1.
The third and fourth inclined- plane 9a and 9b are equipped with protuberance 8.First inclined-plane 5a of first side plate 1 and the second inclined-plane 5b of second side plate 1 are equipped with recess 7.
See also Figure 10, packaged object 11 slides among the groove 6, and is covered from the top by top board 9.Meanwhile, because of protuberance 8 and recess 7 chimeric each other, so the first inclined-plane 5a and the 3rd inclined-plane 9a are fixed together.Similarly, the second inclined-plane 5b and the 4th inclined-plane 9b also are fixed together owing to protuberance 8 and the chimeric of recess 7.
According to this example of support structure for package, top board 9 not relatively side plate 1,1 move laterally.And it also can not sink under the inclined-plane of side plate 1,1.Therefore, top board 9 closely links to each other with side plate 1,1, and is fixed together firmly each other.
Figure 11 A and 11B are the line E-E in Figure 10 and the cutaway view of F-F support structure for package that dissect, when being in assembled state.Figure 11 C is the detail drawing of the circle part D among Figure 11 A.Figure 11 D is the enlarged drawing of the circle part E among Figure 11 A.
See also Figure 11 A, 11B, 11C and 11D, packaged object 11 inserts and remains in the groove 6.Be located at the protuberance 8,8 on the respective end of top board 9 and be located at recess 7,7 tablings on the respective side panels 1,1.Second inclined- plane 5,5 that is positioned at first inclined- plane 4,4 on the corresponding end-faces of base plate 2 and is located on the end face of corresponding side plate 1,1 on the base plate both sides fits tightly.
Figure 12 is the block diagram of side plate shown in Figure 10.Figure 13 A, 13B and 13C are respectively birds-eye view, front cross sectional view and the sectional views of this side plate.
According to support structure for package of the present invention, the setting side plate on base plate and its respective side is easy to fixed to one another and keeps it together, so that leicht fallen D/A and insert and take out packaged object safely.
In addition, because base plate and side plate be with the integral type processing and manufacturing, thereby number of parts is less.Because packaged object can be overlapped, therefore can advantageously reduce the cost of transportation of packaged object.Also can set less packaging space plot ratio, so that improve efficiency of storage.
Though described and illustrated the present invention in detail, should understand well, this is the usefulness in order to illustrate and to give an example just, can not constitute any restriction, and spirit of the present invention and scope are only limited by accessory claim.
Claims (2)
1. that made by synthetic resin, as to be used to hold electronic component support structure for package comprises:
Support the base plate (2) of described electronic component from the below; And
From the respective side of described base plate (2) stretch out and erect, being formed for from first side plate (1) and second side plate (1) of the supporting part of the described electronic component of two-side supporting,
It is characterized in that:
Described base plate (2) has the end face (4) of each self-forming with first inclined-plane of first angle tilt,
Described first and second side plates (1,1) have each self-forming with second inclined-plane of second angle tilt, be positioned at the end face (5) on the described base plate side, and
Described first angle and second angle are chosen to be, when described first and second side plates (1,1) are erect so that described first inclined-plane and second inclined-plane when fitting tightly each other, can prevent that this first and second side plate (1,1) from bending inwards and surpass 90 degree.
2. that made by synthetic resin, as to be used to hold electronic component support structure for package comprises:
Support the base plate (2) of described electronic component from the below;
From the respective side of described base plate (2) stretch out and erect, being formed for from first side plate (1) and second side plate (1) of the supporting part of the described electronic component of two-side supporting,
It is characterized in that:
Described first side plate (1) has the outer face (5a) that forms first inclined-plane, and
Described second side plate (1) has the outer face (5b) that forms second inclined-plane, and
Put first and second side plates (1 from top cover in described setting, 1) top board on (9), described top (9) has the 4th inclined-plane (9b) that is used to fit tightly the 3rd inclined-plane (9a) on described first inclined-plane (5a) and is used to fit tightly described second inclined-plane (5b)
Described first inclined-plane (5a) and the 3rd inclined-plane (9a) be by being located at a pair of recess (7) on the described first and the 3rd inclined-plane and chimeric being connected to each other of protuberance (8) separably respectively, and
Described second inclined-plane (5b) and the 4th inclined-plane (9b) are by being located at a pair of recess (7) on the described second and the 4th inclined-plane and chimeric being connected to each other of protuberance (8) separably respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP082070/2000 | 2000-03-23 | ||
| JP2000082070A JP4097875B2 (en) | 2000-03-23 | 2000-03-23 | Packaging support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1319545A CN1319545A (en) | 2001-10-31 |
| CN1177741C true CN1177741C (en) | 2004-12-01 |
Family
ID=18598918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011120533A Expired - Fee Related CN1177741C (en) | 2000-03-23 | 2001-03-21 | Support structure for package |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20010027934A1 (en) |
| JP (1) | JP4097875B2 (en) |
| KR (1) | KR100475006B1 (en) |
| CN (1) | CN1177741C (en) |
| TW (1) | TW499384B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4097875B2 (en) * | 2000-03-23 | 2008-06-11 | シャープ株式会社 | Packaging support |
| TWM249927U (en) * | 2004-02-06 | 2004-11-11 | Au Optronics Corp | Cushion structure and paper sheet therefor |
| US20060260975A1 (en) * | 2005-01-21 | 2006-11-23 | Jane Donnelly | Packaging assembly |
| TWI284108B (en) * | 2005-02-17 | 2007-07-21 | Au Optronics Corp | Cushion structure |
| KR101185734B1 (en) | 2005-08-31 | 2012-09-26 | 엘지디스플레이 주식회사 | Packing container of liquid crystal display device module |
| US7735649B2 (en) * | 2006-05-05 | 2010-06-15 | Hewlett-Packard Development Company, L.P. | Packaging assembly for containing and displaying a product |
| KR100830412B1 (en) * | 2006-05-30 | 2008-05-20 | 한국유리공업주식회사 | Cushioning material for glass plates packaging |
| WO2010087550A1 (en) * | 2009-01-29 | 2010-08-05 | (주)우신특수포장 | Packaging box for panel product |
| TWI464096B (en) * | 2011-10-12 | 2014-12-11 | San Ho Paper & Carton Co Ltd | Solar panel crates |
| CN102700851B (en) * | 2012-07-02 | 2015-05-20 | 深圳市华星光电技术有限公司 | Packaging device for flat plate-shaped liquid crystal product |
| CN102941976A (en) * | 2012-12-13 | 2013-02-27 | 深圳市华星光电技术有限公司 | Packaging structure |
| KR102098306B1 (en) * | 2013-02-20 | 2020-04-08 | 삼성디스플레이 주식회사 | Apparatus for storing substrate |
| CN103264845B (en) * | 2013-04-08 | 2015-02-25 | 友达光电股份有限公司 | Packaging carton box |
| US20150047297A1 (en) * | 2013-08-13 | 2015-02-19 | Decor Grates Incorporated | Method and devices relating to product packaging and display |
| CN105035536B (en) * | 2015-09-09 | 2018-05-04 | 昆山亚比斯环保包装材料有限公司 | One kind buffering sheath |
| CN106672626B (en) * | 2017-01-17 | 2019-03-12 | 龙口科诺尔玻璃科技有限公司 | Suitable for different size of fold-line-shaped glass handling frame |
| US10898981B2 (en) * | 2018-12-19 | 2021-01-26 | Amada Holdings Co., Ltd. | Workpiece storage device and workpiece loading method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989872U (en) * | 1982-12-07 | 1984-06-18 | 積水化成品工業株式会社 | Cushioning packaging material |
| DE3539887A1 (en) * | 1985-11-11 | 1987-05-21 | Didier Werke Ag | MOUNTING FRAME FOR CATALYST PANELS |
| JP2579366B2 (en) * | 1989-06-06 | 1997-02-05 | オリンパス光学工業株式会社 | Endoscope |
| JP2594763Y2 (en) * | 1992-05-19 | 1999-05-10 | 鐘淵化学工業株式会社 | Cushioning material for packaging |
| KR0122053Y1 (en) * | 1992-12-04 | 1998-08-01 | 박경팔 | Conveyable tray |
| US5622262A (en) * | 1994-04-19 | 1997-04-22 | Outrigger, Inc. | High pressure air cushion for computer |
| JP2990330B2 (en) * | 1994-12-22 | 1999-12-13 | 積水化成品工業株式会社 | Supporting frame for packaging |
| JPH09226867A (en) * | 1996-02-29 | 1997-09-02 | Sekisui Plastics Co Ltd | Supporting frame for packaging |
| JP4097875B2 (en) * | 2000-03-23 | 2008-06-11 | シャープ株式会社 | Packaging support |
-
2000
- 2000-03-23 JP JP2000082070A patent/JP4097875B2/en not_active Expired - Lifetime
-
2001
- 2001-03-14 TW TW090105952A patent/TW499384B/en not_active IP Right Cessation
- 2001-03-21 KR KR10-2001-0014595A patent/KR100475006B1/en not_active IP Right Cessation
- 2001-03-21 CN CNB011120533A patent/CN1177741C/en not_active Expired - Fee Related
- 2001-03-23 US US09/814,830 patent/US20010027934A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010093063A (en) | 2001-10-27 |
| TW499384B (en) | 2002-08-21 |
| US20010027934A1 (en) | 2001-10-11 |
| CN1319545A (en) | 2001-10-31 |
| JP2001270581A (en) | 2001-10-02 |
| JP4097875B2 (en) | 2008-06-11 |
| KR100475006B1 (en) | 2005-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041201 Termination date: 20130321 |