CN117757423A - High-flame-retardance heat-insulation organic silicon pouring sealant and preparation method thereof - Google Patents
High-flame-retardance heat-insulation organic silicon pouring sealant and preparation method thereof Download PDFInfo
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- 239000000565 sealant Substances 0.000 title claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 38
- 239000010703 silicon Substances 0.000 title claims abstract description 38
- 238000009413 insulation Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 229920002545 silicone oil Polymers 0.000 claims abstract description 61
- 239000003063 flame retardant Substances 0.000 claims abstract description 60
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 58
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 56
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 46
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000004965 Silica aerogel Substances 0.000 claims abstract description 35
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical class NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000001257 hydrogen Substances 0.000 claims abstract description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 18
- 239000003112 inhibitor Substances 0.000 claims abstract description 18
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 36
- 238000006243 chemical reaction Methods 0.000 claims description 32
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 15
- 238000005070 sampling Methods 0.000 claims description 15
- 238000007599 discharging Methods 0.000 claims description 14
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical group [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 12
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 11
- 150000008301 phosphite esters Chemical class 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 claims description 9
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 9
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 8
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052794 bromium Inorganic materials 0.000 claims description 8
- 238000012986 modification Methods 0.000 claims description 8
- 230000004048 modification Effects 0.000 claims description 8
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 7
- XOWDQAHYPSENAC-UHFFFAOYSA-N 1,4-dibromobutane-2,3-diol Chemical compound BrCC(O)C(O)CBr XOWDQAHYPSENAC-UHFFFAOYSA-N 0.000 claims description 6
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 6
- 238000006011 modification reaction Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- WXWLPWLXYPBXLZ-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane;platinum Chemical compound [Pt].C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 WXWLPWLXYPBXLZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 4
- JQZGUQIEPRIDMR-UHFFFAOYSA-N 3-methylbut-1-yn-1-ol Chemical group CC(C)C#CO JQZGUQIEPRIDMR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004964 aerogel Substances 0.000 claims description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000005587 bubbling Effects 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 238000001879 gelation Methods 0.000 claims description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 3
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 11
- 239000011324 bead Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910021392 nanocarbon Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- HAGWNYFOCBMZDP-UHFFFAOYSA-N Br.OP(O)O Chemical compound Br.OP(O)O HAGWNYFOCBMZDP-UHFFFAOYSA-N 0.000 description 1
- BXQOGTHSKFRGDV-UHFFFAOYSA-N C(CC)[Si](OCC)(OCC)C.[O] Chemical compound C(CC)[Si](OCC)(OCC)C.[O] BXQOGTHSKFRGDV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention relates to a high flame-retardant heat-insulating organic silicon pouring sealant, which comprises the following preparation raw materials in parts by mass: the component A comprises the following components: 100-110 parts of vinyl-terminated silicone oil, 15-25 parts of hydrophobic flame-retardant silica aerogel, 18-25 parts of hydrophobic modified melamine cyanurate, 0.1-0.5 part of platinum catalyst and 1-3 parts of color paste; the component B comprises: 100-110 parts of vinyl-terminated silicone oil, 10-15 parts of hydrophobic flame-retardant silica aerogel, 15-20 parts of hydrophobic modified melamine cyanurate, 0.1-0.2 part of addition inhibitor and 7-10 parts of hydrogen-containing silicone oil; the preparation method is characterized by comprising the preparation of the double-component addition system. The finally prepared organosilicon pouring sealant product is uniformly dispersed, has excellent heat insulation and flame retardance, is excellent in boiling resistance and durability, and has better economic value.
Description
Technical Field
The invention belongs to the field of organic silicon, and particularly relates to a high-flame-retardance heat-insulation organic silicon pouring sealant and a preparation method thereof.
Background
Filling and sealing, namely filling the liquid polyurethane compound into a device provided with an electronic element and a circuit in a mechanical or manual mode, and curing the liquid polyurethane compound into a thermosetting polymer insulating material with excellent performance under the normal temperature or heating condition; the liquid polyurethane compound used in this process is a pouring sealant. The pouring sealant is used for bonding, sealing, pouring and coating protection of electronic components. The pouring sealant is liquid before solidification, has fluidity, and the viscosity of the glue solution is different according to the material, performance and production process of the product. The pouring sealant can realize the use value after being completely cured, and can play roles of water proofing, moisture proofing, dust proofing, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance and vibration resistance after being cured. The electronic pouring sealant is very various, and is mainly three types of epoxy resin pouring sealant, organic silicon resin pouring sealant and polyurethane pouring sealant which are most commonly used in terms of material types, wherein the organic silicon pouring sealant is most widely applied due to better high temperature resistance. At present, in the products of pouring sealant, heat insulation and flame retardance are both directions of industry research and development, the existing products generally adopt hollow glass beads or hollow ceramic beads and the like as heat insulation fillers to achieve the function of realizing heat insulation, such as CN202211473481.9, CN201810005082.7 and the like, and although partial products adopt the aim of modifying the hollow glass beads to enhance the compatibility of the hollow glass beads, the use of the hollow glass beads still has the following problems, (1) the hollow glass beads are difficult to uniformly mix, and the hollow glass beads cannot be uniformly dispersed and are seriously agglomerated due to the poor compatibility of the hollow glass beads and components in the organic silicon pouring sealant; (2) Poor distribution continuity of the hollow glass beads in the pouring sealant, which results in poor heat insulation continuity of the pouring sealant, and poor heat insulation of the pouring sealant with low content of partial hollow glass beads, which results in reduced quality of the pouring sealant product; (3) Although some researches adopt a special modification mode to enhance the compatibility of the surface and the organic silicon component, the modification process is complex, the cost is high, and the large-scale industrialization is difficult. How to develop an organosilicon pouring sealant product with relatively simple process, low cost and excellent heat insulation and flame retardant effects is a problem which needs to be solved urgently by the industry.
Disclosure of Invention
Aiming at the problems, the invention develops a high flame-retardant heat-insulating organic silicon pouring sealant, which relates to a two-component addition system, and is prepared by preparing vinyl-terminated silicone oil (vinyl-terminated silicone oil containing bromine and phosphite groups), hydrophobic flame-retardant silica aerogel, hydrophobic modified melamine cyanurate and the like, and respectively mixing the vinyl-terminated silicone oil, the hydrophobic flame-retardant silica aerogel, the hydrophobic modified melamine cyanurate and the like with a catalyst, color paste, an inhibitor, hydrogen-containing silicone oil and the like on the basis of the two-component addition system. The finally prepared organosilicon pouring sealant product is uniformly dispersed, has excellent heat insulation and flame retardance, is excellent in boiling resistance and durability, and has better economic value.
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mass:
the component A comprises the following components: 100-110 parts of vinyl-terminated silicone oil, 15-25 parts of hydrophobic flame-retardant silica aerogel, 18-25 parts of hydrophobic modified melamine cyanurate, 0.1-0.5 part of platinum catalyst and 1-3 parts of color paste;
the component B comprises: 100-110 parts of vinyl-terminated silicone oil, 10-15 parts of hydrophobic flame-retardant silica aerogel, 15-20 parts of hydrophobically modified melamine cyanurate, 0.1-0.2 part of addition inhibitor and 7-10 parts of hydrogen-containing silicone oil.
Further, the vinyl-terminated silicone oil is a vinyl-terminated silicone oil containing bromine and phosphite ester groups; the hydrophobic flame-retardant silica aerogel is prepared by the reaction of raw materials including tetraethyl orthosilicate, ethyl triethoxysilane and 3, 5-di [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; the hydrophobically modified melamine cyanurate is melamine cyanurate modified by reaction of 3-glycidoxy propyl methyl diethoxy silane.
Further, the addition inhibitor is methylbutynol or 1-ethynyl cyclohexanol; the hydrogen-containing silicone oil is double-end low hydrogen-containing silicone oil with viscosity of 45-55mm 2 S, e.g. of the typeCX-350D from Guangdong silicon New Material technologies Co.
Further, the platinum catalyst is a platinum (0) -1, 3-divinyl-1, 3-tetramethyl disiloxane complex or a platinum (0) -1, 3-dimethyl-1, 3-diphenyl-1, 3-divinyl disiloxane complex; the color paste is self-made silica gel color paste and is prepared by mixing and dispersing 1000cps (25 ℃) end vinyl silicone oil and nano carbon black according to the mass ratio of 5:1.
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mole: 10-12 parts of tetraethyl orthosilicate; 14-18 parts of ethyl triethoxysilane; 3-4.5 parts of 3, 5-bis [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; 30-38 parts of ethanol; 15-20 parts of water; 25-30 parts of anhydrous methanol;
the components also comprise 20-25wt% of hydrochloric acid solution and 18-22wt% of concentrated ammonia water.
The preparation method of the high-flame-retardance heat-insulation organic silicon pouring sealant and the hydrophobic flame-retardance silica aerogel comprises the following steps:
A. adding ethanol and water with the formula amount into a reaction kettle, uniformly stirring, adding tetraethyl orthosilicate and ethyl triethoxysilane with the formula amount, uniformly stirring, heating to 60-65 ℃ and preserving heat, adding hydrochloric acid solution, adjusting the pH to 4-5, and then carrying out heat preservation reaction;
B. sampling and detecting, when the content of the free tetraethyl orthosilicate and the ethyl triethoxysilane is lower than 1wt%, indicating that the hydrolysis is basically completed, adding ammonia water solution at the moment, adjusting the pH of the solution to 8-9, continuing to keep the temperature and stirring uniformly, discharging, and placing the materials in a baking oven at 60-65 ℃ for standing to enable the materials to be fully gelled (for example, 12 h);
C. after gelation is completed, adding n-hexane with equal mass into the system for replacement for 2-3 times to remove water, and then adding anhydrous methanol and 3, 5-bis [ (trimethylsilyl) oxy ] with formula amount]The mixed solution of the base-1, 2, 4-triazine carries out hydrophobic modification treatment on the silicon dioxide aerogel for 1-2h, then the silicon dioxide aerogel is fully dried in a vacuum oven, the methanol solvent is removed and recovered, the vacuum degree is controlled between-0.093 and-0.096 Mpa, and the drying temperature isDischarging when the methanol content is lower than 0.5wt% at 100-110deg.C, and grinding to obtain organosilicon flame-retardant hydrophobically modified silica aerogel micropowder (specific surface area of 800-1000 m) 2 /g)。
The preparation method of the hydrophobically modified melamine cyanurate comprises the following steps: adding cyanuric acid and melamine in a molar ratio of 1:1 into an ethanol solution, fully salifying at 50-55 ℃ for 1-2h, adding 3-glycidoxypropyl methyl diethoxysilane with the melamine molar weight of 0.6-0.7 times after the neutralization is completed, heating to 90-95 ℃ for modification reaction, sampling and detecting, when the epoxy equivalent of a reactant of the system reaches 5000-5200g/mol, indicating that the modification reaction is completed, discharging, fully drying in a vacuum oven, controlling the vacuum degree to be-0.095 Mpa to-0.098 Mpa, and controlling the drying temperature to be 85-90 ℃; when the volatile matter is lower than 0.5%, grinding and sieving to obtain 300-350 mesh micropowder.
The high-flame-retardance heat-insulation organic silicon pouring sealant is prepared by copolymerizing D4, a phosphite ester intermediate and tetramethyl tetravinyl cyclotetrasiloxane, wherein the molar parts of the preparation raw materials are as follows: 10-12 parts of D4;6-7 parts of 1, 4-dibromo-2, 3-butanediol; 2-2.5 parts of phosphorus trichloride; 15-20 parts of n-butyl ether; 1.5-2 parts of tetramethyl tetravinyl cyclotetrasiloxane; the catalyst is tetramethyl ammonium hydroxide, and the dosage is 0.1-0.2% of the mass of D4.
The vinyl-terminated silicone oil is bromine-and phosphite-containing vinyl-terminated silicone oil, and the preparation method comprises the following steps:
A. adding 1, 4-dibromo-2, 3-butanediol and n-butyl ether in the formula amount into a reaction kettle, heating to 50-55 ℃, fully stirring for dissolution, then cooling to 10-15 ℃, then dropwise adding phosphorus trichloride in the formula amount for grafting reaction to prepare phosphite ester, and simultaneously introducing nitrogen for bubbling to remove hydrogen chloride gas generated in the system; the dripping time is controlled to be 0.5-1h, and the heat preservation reaction is continued after the dripping is finished;
B. sampling and detecting, when the content of the free phosphorus trichloride is lower than 0.5wt%, indicating that the phosphite reaction is basically completed, adding the formula amount of D4, and heating to 110-115 ℃ for chain extension polymerization reaction;
C. sampling and detecting, adding tetramethyl tetravinyl cyclotetrasiloxane with a formula amount to carry out end-capping polymerization reaction when the viscosity of the polymer reaches 250-300 mPas, stopping the reaction when the viscosity of the polymer reaches 330-380 mPas, heating to 135-138 ℃ to decompose tetramethyl ammonium hydroxide to remove the catalyst, and simultaneously starting a high vacuum system to remove the solvent and small molecular substances, wherein the vacuum degree is controlled to be-0.098 Mpa to-0.099 Mpa;
D. sampling and detecting, when the volatile matter is lower than 0.5wt%, releasing vacuum and stopping reaction, and then discharging at high temperature for later use.
The preparation method of the high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following steps of:
(1) And (3) preparation of the component A: in a dynamic mixer, for example, under the vacuum condition of-0.1 MPa, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel, hydrophobic modified melamine cyanurate, platinum catalyst and color paste at high speed according to the formula of the component A, and cooling and discharging to obtain the component A;
(2) And (3) preparation of a component B: in a dynamic mixer, under the vacuum condition of-0.1 MPa, according to the formula of the component B, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel and hydrophobic modified melamine cyanurate at high speed, and cooling to room temperature; then adding an addition inhibitor and hydrogen-containing silicone oil into a power mixer under the room temperature condition, for example, under the vacuum condition of-0.1 MPa, and uniformly mixing to obtain a component B;
(3) And uniformly mixing the component A and the component B, thus obtaining the high flame-retardant heat-insulating organic silicon pouring sealant.
The beneficial effects are that:
the invention relates to a high flame-retardant heat-insulating organic silicon pouring sealant, which comprises the following preparation raw materials in parts by mass: the component A comprises the following components: 100-110 parts of vinyl-terminated silicone oil, 15-25 parts of hydrophobic flame-retardant silica aerogel, 18-25 parts of hydrophobic modified melamine cyanurate, 0.1-0.5 part of platinum catalyst and 1-3 parts of color paste; the component B comprises: 100-110 parts of vinyl-terminated silicone oil, 10-15 parts of hydrophobic flame-retardant silica aerogel, 15-20 parts of hydrophobic modified melamine cyanurate, 0.1-0.2 part of addition inhibitor and 7-10 parts of hydrogen-containing silicone oil; the preparation method is characterized by comprising the preparation of the double-component addition system. The vinyl-terminated silicone oil is vinyl-terminated silicone oil containing bromine and phosphite ester groups; the hydrophobic flame-retardant silica aerogel is prepared by the reaction of raw materials including tetraethyl orthosilicate, ethyl triethoxysilane and 3, 5-di [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; the hydrophobically modified melamine cyanurate is melamine cyanurate modified by 3-glycidol ether oxypropyl methyl diethoxy silane reaction. The product of the invention firstly uses the synthesized modified hydrophobic flame-retardant silica aerogel as a heat insulation component, and because the organosilicon flame-retardant organosilicon modification treatment is adopted, the product has excellent compatibility with other raw materials of organosilicon pouring sealant, such as vinyl-terminated silicone oil containing bromine and phosphite ester groups, not only is uniformly dispersed, but also has better heat insulation performance and flame retardant performance after molding. In order to realize high-efficiency environment-friendly flame retardant performance, the invention specially prepares vinyl-terminated silicone oil containing bromine and phosphite ester groups, has high phosphorus content and good flame retardant performance, and additionally adds melamine cyanurate salt subjected to reaction modification treatment of 3-glycidoxypropyl methyl diethoxy silane as an auxiliary heat insulation flame retardant component, the melamine salt can participate in the reaction of organosilicon raw materials in pouring sealant, and finally prepared organosilicon pouring sealant products overcome the defects that the traditional products are difficult to disperse uniformly, influence the heat insulation, lasting flame retardance and other performances of the final products.
Detailed Description
The invention is further illustrated below with reference to examples. It should be noted that, without conflict, the embodiments and technical features of the embodiments in the present application may be combined with each other. It is noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless otherwise indicated. The use of the terms "comprising" or "includes" and the like in this disclosure is intended to cover a member or article listed after that term and equivalents thereof without precluding other members or articles.
Example 1
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mass:
the component A comprises the following components: 100 parts of vinyl-terminated silicone oil, 15 parts of hydrophobic flame-retardant silica aerogel, 18 parts of hydrophobically modified melamine cyanurate, 0.2 part of platinum catalyst and 1 part of color paste;
the component B comprises: 100 parts of vinyl-terminated silicone oil, 10 parts of hydrophobic flame-retardant silica aerogel, 15 parts of hydrophobically modified melamine cyanurate, 0.1 part of addition inhibitor and 7 parts of hydrogen-containing silicone oil;
the addition inhibitor is methylbutynol; the platinum catalyst is a platinum (0) -1, 3-divinyl-1, 3-tetramethyl disiloxane complex;
the hydrogen-containing silicone oil is double-end low hydrogen-containing silicone oil with viscosity of 45-55mm 2 Model CX-350D, available from Guangdong silicon New Material technologies Co., ltd;
the color paste is self-made silica gel color paste and is prepared by mixing and dispersing 1000cps (25 ℃) end vinyl silicone oil and nano carbon black according to a mass ratio of 5:1;
the vinyl-terminated silicone oil is bromine-and phosphite-group-containing vinyl-terminated silicone oil, and is obtained by copolymerizing D4, a phosphite intermediate and tetramethyl tetravinyl cyclotetrasiloxane, wherein the molar parts of the preparation raw materials are as follows: 12 parts of D4;7 parts of 1, 4-dibromo-2, 3-butanediol; 2.5 parts of phosphorus trichloride; 20 parts of n-butyl ether; 2 parts of tetramethyl tetravinyl cyclotetrasiloxane; the catalyst was tetramethyl ammonium hydroxide in an amount of 0.2% by mass of D4. The preparation method comprises the following steps:
A. adding 1, 4-dibromo-2, 3-butanediol and n-butyl ether in the formula amount into a reaction kettle, heating to 55 ℃, fully stirring for dissolution, then cooling to 15 ℃, then dripping phosphorus trichloride in the formula amount for grafting reaction to prepare phosphite ester, and simultaneously introducing nitrogen for bubbling to remove hydrogen chloride gas generated in the system; the dripping time is controlled to be 1h, and the heat preservation reaction is continued after the dripping is finished;
B. sampling and detecting, when the content of the free phosphorus trichloride is lower than 0.5wt%, indicating that the phosphite reaction is basically completed, adding D4 with the formula amount, and heating to 115 ℃ for chain extension polymerization reaction;
C. sampling and detecting, adding tetramethyl tetravinyl cyclotetrasiloxane with a formula amount to carry out end-capping polymerization reaction when the viscosity of the polymer reaches 250-300 mPas, stopping the reaction when the viscosity of the polymer reaches 330-380 mPas, heating to 138 ℃ to decompose tetramethyl ammonium hydroxide to remove the catalyst, and simultaneously starting a high vacuum system to remove the solvent and small molecular substances, wherein the vacuum degree is controlled at-0.099 MPa;
D. sampling and detecting, when the volatile matter is lower than 0.5wt%, releasing vacuum and stopping reaction, and then discharging at high temperature for later use.
The hydrophobic flame-retardant silica aerogel comprises the following raw materials in parts by mole: 12 parts of tetraethyl orthosilicate; 18 parts of ethyl triethoxysilane; 4.5 parts of 3, 5-bis [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; 38 parts of ethanol; 20 parts of water; 30 parts of absolute methanol; the components also comprise 25wt% of hydrochloric acid solution and 22wt% of concentrated ammonia water. The preparation method of the hydrophobic flame-retardant silica aerogel comprises the following steps:
A. adding ethanol and water with the formula amount into a reaction kettle, uniformly stirring, adding tetraethyl orthosilicate and ethyl triethoxysilane with the formula amount, uniformly stirring, heating to 65 ℃ and preserving heat, adding hydrochloric acid solution, adjusting the pH value to 4-5, and then carrying out heat preservation reaction;
B. sampling and detecting, when the content of the free tetraethoxysilane and the ethyl triethoxysilane is lower than 1wt%, indicating that the hydrolysis is basically completed, adding ammonia water solution at the moment, adjusting the pH of the solution to 8-9, continuing to keep the temperature and stirring uniformly, discharging, and placing the materials in a 65 ℃ oven for standing to fully gel (12 h);
C. after gelation is completed, adding normal hexane with equal mass into the system for replacement for 3 times to remove water in the system, then adding a mixed solution of anhydrous methanol and 3, 5-di [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine with a formula amount to carry out hydrophobic modification treatment on silica aerogel for 2 hours, then fully drying in a vacuum oven to remove and recycle methanol solvent, controlling the vacuum degree to be minus 0.096Mpa, controlling the drying temperature to be 100 ℃, discharging when the methanol content is lower than 0.5wt%, and grinding to obtain the organosilicon flame-retardant hydrophobic modified silica aerogel micro powder (with specific surface area of being
800-1000m 2 /g)。
The hydrophobic modified melamine cyanurate is modified by 3-glycidol ether oxygen propyl methyl diethoxy silane, and the preparation method comprises the following steps: adding cyanuric acid and melamine in a molar ratio of 1:1 into an ethanol solution, fully salifying at 55 ℃ for 2 hours, adding 3-glycidoxypropyl methyl diethoxysilane with the melamine molar weight of 0.7 times after the neutralization is completed, heating to 95 ℃ for modification reaction, sampling and detecting, indicating that the modification reaction is completed when the epoxy equivalent of a system reactant reaches 5000-5200g/mol, discharging, fully drying in a vacuum oven, controlling the vacuum degree to be-0.098 Mpa, and controlling the drying temperature to be 90 ℃; when the volatile matter is lower than 0.5%, grinding and sieving to obtain 300-350 mesh micropowder.
The preparation method of the high flame-retardant heat-insulating organic silicon pouring sealant comprises the following steps:
(1) And (3) preparation of the component A: in a power mixer, under the vacuum condition of minus 0.1MPa, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel, hydrophobic modified melamine cyanurate, a platinum catalyst and color paste at a high speed according to the formula of the component A, and cooling and discharging to obtain the component A;
(2) And (3) preparation of a component B: in a dynamic mixer, under the vacuum condition of minus 0.1MPa, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel and hydrophobic modified melamine cyanurate at high speed according to the formula of the component B, and cooling to room temperature; then adding an addition inhibitor and hydrogen-containing silicone oil into a power mixer under the room temperature condition and the vacuum condition of minus 0.1MPa, and uniformly mixing to obtain a component B;
(3) And uniformly mixing the component A and the component B, thus obtaining the high flame-retardant heat-insulating organic silicon pouring sealant.
Example 2
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mass:
the component A comprises the following components: 110 parts of vinyl-terminated silicone oil, 25 parts of hydrophobic flame-retardant silica aerogel, 25 parts of hydrophobically modified melamine cyanurate, 0.5 part of platinum catalyst and 3 parts of color paste;
the component B comprises: 110 parts of vinyl-terminated silicone oil, 15 parts of hydrophobic flame-retardant silica aerogel, 20 parts of hydrophobically modified melamine cyanurate, 0.2 part of addition inhibitor and 10 parts of hydrogen-containing silicone oil;
the addition inhibitor is 1-ethynyl cyclohexanol; the platinum catalyst is a platinum (0) -1, 3-dimethyl-1, 3-diphenyl-1, 3-divinyl disiloxane complex;
otherwise, the same as in example 1 was used.
Example 3
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mass:
the component A comprises the following components: 105 parts of vinyl-terminated silicone oil, 20 parts of hydrophobic flame-retardant silica aerogel, 20 parts of hydrophobically modified melamine cyanurate, 0.5 part of platinum catalyst and 2 parts of color paste;
the component B comprises: 105 parts of vinyl-terminated silicone oil, 12 parts of hydrophobic flame-retardant silica aerogel, 18 parts of hydrophobically modified melamine cyanurate, 0.2 part of addition inhibitor and 8 parts of hydrogen-containing silicone oil;
the addition inhibitor is methylbutynol; the platinum catalyst is a platinum (0) -1, 3-dimethyl-1, 3-diphenyl-1, 3-divinyl disiloxane complex;
otherwise, the same as in example 1 was used.
Example 4
The high-flame-retardance heat-insulation organic silicon pouring sealant comprises the following raw materials in parts by mass:
the component A comprises the following components: 108 parts of vinyl-terminated silicone oil, 15 parts of hydrophobic flame-retardant silica aerogel, 22 parts of hydrophobic modified melamine cyanurate, 0.3 part of platinum catalyst and 2 parts of color paste;
the component B comprises: 108 parts of vinyl-terminated silicone oil, 12 parts of hydrophobic flame-retardant silica aerogel, 18 parts of hydrophobically modified melamine cyanurate, 0.2 part of addition inhibitor and 9 parts of hydrogen-containing silicone oil.
The addition inhibitor is 1-ethynyl cyclohexanol; the platinum catalyst is a platinum (0) -1, 3-dimethyl-1, 3-diphenyl-1, 3-divinyl disiloxane complex;
otherwise, the same as in example 1 was used.
Comparative example 1
A common commercially available silicone potting adhesive, model CA2001, was purchased from Schneishi group Co., ltd, as comparative example 1.
Operating time: the A, B components in each example are uniformly mixed to obtain pouring sealant, and the pot life at 25 ℃ is tested according to GB/T7123.1-2002;
flame retardant properties: the flame retardant properties of the pouring sealant after curing were tested according to ANSI/UL 94-1985.
Breakdown voltage: breakdown voltage was tested according to GB/T1408.1-1999.
TABLE 1 application Property results for examples 1-4 and comparative example 1
As can be seen from Table 1, under the specific raw materials, the formula and the synthesis process of the invention, the prepared organic silicon pouring sealant product has excellent heat insulation and flame retardance, the prepared organic silicon pouring sealant product has smooth appearance after molding, good fineness, the construction time is basically more than 43min, the use is convenient, the heat conductivity coefficient is reduced to below 0.18W/m.K, the flame retardance grade reaches V0 grade, the breakdown voltage is basically 17kv/mm or more, the surface of the organic silicon pouring sealant is unchanged after boiling for 2 hours, and the organic silicon pouring sealant product is prepared from the special hydrophobic flame retardant raw materials such as hydrophobic flame retardant silica aerogel, hydrophobically modified melamine cyanurate, vinyl silicone oil containing bromine and phosphite ester base ends and the like, has good compatibility, excellent flame retardance, excellent heat insulation performance and excellent water boiling resistance, and has better economic value than the common commercial products (such as comparative example 1).
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the foregoing description is illustrative in nature and is not to be construed as limiting the scope of the invention as claimed.
Claims (10)
1. The high-flame-retardance heat-insulation organic silicon pouring sealant is characterized by comprising the following raw materials in parts by mass:
the component A comprises the following components: 100-110 parts of vinyl-terminated silicone oil, 15-25 parts of hydrophobic flame-retardant silica aerogel, 18-25 parts of hydrophobic modified melamine cyanurate, 0.1-0.5 part of platinum catalyst and 1-3 parts of color paste;
the component B comprises: 100-110 parts of vinyl-terminated silicone oil, 10-15 parts of hydrophobic flame-retardant silica aerogel, 15-20 parts of hydrophobically modified melamine cyanurate, 0.1-0.2 part of addition inhibitor and 7-10 parts of hydrogen-containing silicone oil.
2. The high flame-retardant and heat-insulating organic silicon pouring sealant according to claim 1, wherein the vinyl-terminated silicone oil is vinyl-terminated silicone oil containing bromine and phosphite groups; the hydrophobic flame-retardant silica aerogel is prepared by the reaction of raw materials including tetraethyl orthosilicate, ethyl triethoxysilane and 3, 5-di [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; the hydrophobically modified melamine cyanurate is melamine cyanurate modified by reaction of 3-glycidoxy propyl methyl diethoxy silane.
3. The high flame-retardant and heat-insulating silicone pouring sealant according to claim 1 or 2, wherein the addition inhibitor is methylbutynol or 1-ethynyl cyclohexanol; the hydrogen-containing silicone oil is double-end low hydrogen-containing silicone oil with viscosity of 45-55mm 2 /s。
4. A highly flame retardant, thermally insulating silicone potting adhesive as set forth in claim 1 or 2 wherein the platinum catalyst is a platinum (0) -1, 3-divinyl-1, 3-tetramethyldisiloxane complex or a platinum (0) -1, 3-dimethyl-1, 3-diphenyl-1, 3-divinyl disiloxane complex.
5. The high flame-retardant and heat-insulating organic silicon pouring sealant according to claim 1 or 2, wherein the hydrophobic flame-retardant silica aerogel comprises the following raw materials in parts by mole: 10-12 parts of tetraethyl orthosilicate; 14-18 parts of ethyl triethoxysilane; 3-4.5 parts of 3, 5-bis [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine; 30-38 parts of ethanol; 15-20 parts of water; 25-30 parts of anhydrous methanol; the components also comprise 20-25wt% of hydrochloric acid solution and 18-22wt% of concentrated ammonia water.
6. The high flame-retardant and heat-insulating organic silicon pouring sealant according to claim 5, wherein the preparation method of the hydrophobic flame-retardant silica aerogel comprises the following steps:
A. adding ethanol and water with the formula amount into a reaction kettle, uniformly stirring, adding tetraethyl orthosilicate and ethyl triethoxysilane with the formula amount, uniformly stirring, heating to 60-65 ℃ and preserving heat, adding hydrochloric acid solution, adjusting the pH to 4-5, and then carrying out heat preservation reaction;
B. sampling and detecting, when the content of the free tetraethoxysilane and the ethyl triethoxysilane is lower than 1wt%, indicating that the hydrolysis is basically completed, adding ammonia water solution at the moment, adjusting the pH of the solution to 8-9, continuing to keep the temperature and stirring uniformly, discharging, and placing the materials in a 60-65 ℃ oven for standing to enable the materials to be fully gelled;
C. after gelation is completed, adding normal hexane with equal mass into the system for replacement for 2-3 times to remove water in the system, then adding mixed liquid of anhydrous methanol and 3, 5-di [ (trimethylsilyl) oxy ] yl-1, 2, 4-triazine with formula amount to carry out hydrophobic modification treatment on silicon dioxide aerogel for 1-2 hours, then fully drying in a vacuum oven to remove and recycle methanol solvent, controlling the vacuum degree to be between-0.093 and-0.096 Mpa, controlling the drying temperature to be between 100 and 110 ℃, discharging when the methanol content is lower than 0.5wt%, and grinding to obtain the organosilicon flame-retardant hydrophobic modified silicon dioxide aerogel micro powder.
7. The high-flame-retardant heat-insulating organic silicon pouring sealant according to claim 1 or 2, wherein the preparation method of the hydrophobically modified melamine cyanurate is as follows: adding cyanuric acid and melamine in a molar ratio of 1:1 into an ethanol solution, fully salifying at 50-55 ℃ for 1-2h, adding 3-glycidoxypropyl methyl diethoxysilane with the melamine molar weight of 0.6-0.7 times after the neutralization is completed, heating to 90-95 ℃ for modification reaction, sampling and detecting, when the epoxy equivalent of a reactant of the system reaches 5000-5200g/mol, indicating that the modification reaction is completed, discharging, fully drying in a vacuum oven, controlling the vacuum degree to be-0.095 Mpa to-0.098 Mpa, and controlling the drying temperature to be 85-90 ℃; when the volatile matter is lower than 0.5%, grinding and sieving to obtain 300-350 mesh micropowder.
8. The high-flame-retardance heat-insulation organic silicon pouring sealant according to claim 1 or 2, wherein vinyl-terminated silicone oil is obtained by copolymerizing D4, a phosphite ester intermediate and tetramethyl tetravinyl cyclotetrasiloxane, and the preparation raw materials comprise the following components in parts by mole: 10-12 parts of D4;6-7 parts of 1, 4-dibromo-2, 3-butanediol; 2-2.5 parts of phosphorus trichloride; 15-20 parts of n-butyl ether; 1.5-2 parts of tetramethyl tetravinyl cyclotetrasiloxane; the catalyst is tetramethyl ammonium hydroxide, and the dosage is 0.1-0.2% of the mass of D4.
9. The high flame-retardant and heat-insulating organic silicon pouring sealant according to claim 8, wherein the vinyl-terminated silicone oil is a vinyl-terminated silicone oil containing bromine and phosphite groups, and the preparation method comprises the following steps:
A. adding 1, 4-dibromo-2, 3-butanediol and n-butyl ether in the formula amount into a reaction kettle, heating to 50-55 ℃, fully stirring for dissolution, then cooling to 10-15 ℃, then dropwise adding phosphorus trichloride in the formula amount for grafting reaction to prepare phosphite ester, and simultaneously introducing nitrogen for bubbling to remove hydrogen chloride gas generated in the system; the dripping time is controlled to be 0.5-1h, and the heat preservation reaction is continued after the dripping is finished;
B. sampling and detecting, when the content of the free phosphorus trichloride is lower than 0.5wt%, indicating that the phosphite reaction is basically completed, adding the formula amount of D4, and heating to 110-115 ℃ for chain extension polymerization reaction;
C. sampling and detecting, adding tetramethyl tetravinyl cyclotetrasiloxane with a formula amount to carry out end-capping polymerization reaction when the viscosity of the polymer reaches 250-300 mPas, stopping the reaction when the viscosity of the polymer reaches 330-380 mPas, heating to 135-138 ℃ to decompose tetramethyl ammonium hydroxide to remove the catalyst, and simultaneously starting a high vacuum system to remove the solvent and small molecular substances, wherein the vacuum degree is controlled to be-0.098 Mpa to-0.099 Mpa;
D. sampling and detecting, when the volatile matter is lower than 0.5wt%, releasing vacuum and stopping reaction, and then discharging at high temperature for later use.
10. The method for preparing the high-flame-retardant heat-insulating organic silicon pouring sealant according to any one of claims 1 to 9, which is characterized by comprising the following steps:
(1) And (3) preparation of the component A: in a power mixer, under the vacuum condition, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel, hydrophobic modified melamine cyanurate, a platinum catalyst and color paste at a high speed according to the formula of the component A, and cooling and discharging to obtain the component A;
(2) And (3) preparation of a component B: in a dynamic mixer, under the vacuum condition, uniformly shearing and mixing vinyl-terminated silicone oil, hydrophobic flame-retardant silica aerogel and hydrophobic modified melamine cyanurate at high speed according to the formula of the component B, and cooling to room temperature; then adding an addition inhibitor and hydrogen-containing silicone oil in a power mixer under the room temperature condition and under the vacuum condition, and uniformly mixing to obtain a component B;
(3) And uniformly mixing the component A and the component B, thus obtaining the high flame-retardant heat-insulating organic silicon pouring sealant.
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