CN117757221A - Epoxy resin system, epoxy resin material, preparation method of epoxy resin system and IV-type hydrogen storage cylinder - Google Patents
Epoxy resin system, epoxy resin material, preparation method of epoxy resin system and IV-type hydrogen storage cylinder Download PDFInfo
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- CN117757221A CN117757221A CN202211131972.5A CN202211131972A CN117757221A CN 117757221 A CN117757221 A CN 117757221A CN 202211131972 A CN202211131972 A CN 202211131972A CN 117757221 A CN117757221 A CN 117757221A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 141
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 141
- 239000000463 material Substances 0.000 title claims abstract description 72
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 21
- 239000001257 hydrogen Substances 0.000 title claims abstract description 21
- 238000003860 storage Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title abstract description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 57
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- UIRFWOOIGULZQN-UHFFFAOYSA-L [Ru](Cl)Cl.C1(=CC=CC=C1)C([P](C1CCCCC1)(C1CCCCC1)C1CCCCC1)[P](C1CCCCC1)(C1CCCCC1)C1CCCCC1 Chemical compound [Ru](Cl)Cl.C1(=CC=CC=C1)C([P](C1CCCCC1)(C1CCCCC1)C1CCCCC1)[P](C1CCCCC1)(C1CCCCC1)C1CCCCC1 UIRFWOOIGULZQN-UHFFFAOYSA-L 0.000 claims abstract description 20
- 239000007822 coupling agent Substances 0.000 claims abstract description 18
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims description 44
- 230000009477 glass transition Effects 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 8
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 6
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 6
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 5
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- -1 glycidyl ester Chemical class 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 4
- 239000004917 carbon fiber Substances 0.000 abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 3
- 230000004048 modification Effects 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 28
- 238000005452 bending Methods 0.000 description 22
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- XEHUIDSUOAGHBW-UHFFFAOYSA-N chromium;pentane-2,4-dione Chemical compound [Cr].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O XEHUIDSUOAGHBW-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000005543 nano-size silicon particle Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004046 wet winding Methods 0.000 description 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- HYZQBNDRDQEWAN-LNTINUHCSA-N (z)-4-hydroxypent-3-en-2-one;manganese(3+) Chemical compound [Mn+3].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O HYZQBNDRDQEWAN-LNTINUHCSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 description 1
- MKBBSFGKFMQPPC-UHFFFAOYSA-N 2-propyl-1h-imidazole Chemical compound CCCC1=NC=CN1 MKBBSFGKFMQPPC-UHFFFAOYSA-N 0.000 description 1
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 description 1
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 description 1
- 229920001153 Polydicyclopentadiene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 1
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920000587 hyperbranched polymer Polymers 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011415 microwave curing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Epoxy Resins (AREA)
Abstract
The invention relates to the field of carbon fiber epoxy resin modification and preparation, and discloses an epoxy resin system, an epoxy resin material, a preparation method thereof and an IV-type hydrogen storage cylinder, wherein the epoxy resin system comprises a component A, a component B and a component C, and the component A comprises the following components in parts by weight: 100 parts of glycidyl epoxy resin, 10-20 parts of dicyclopentadiene material, 5-20 parts of reactive diluent, 0.5-3 parts of rheological agent and 0.5-3 parts of coupling agent; component B comprises: 100 parts of curing agent and 1-5 parts of accelerator; component C comprises: phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene; wherein, in the component C, the weight ratio of the phenylmethylene bis (tricyclohexylphosphorus) ruthenium dichloride to the toluene is (1-3): 1, a step of; the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002).
Description
Technical Field
The invention relates to the field of carbon fiber epoxy resin modification and preparation, in particular to an epoxy resin system, an epoxy resin material, a preparation method thereof and an IV-type hydrogen storage cylinder.
Background
Hydrogen storage is a bridge connecting hydrogen production and hydrogen utilization, and plays an irreplaceable role in hydrogen energy development. In high-pressure hydrogen storage equipment, hydrogen storage cylinders, in particular IV-type hydrogen storage cylinders, are becoming research hotspots worldwide due to the characteristics of light weight, fatigue resistance and the like. Wherein, the resin is an indispensable part of the composite material, and the selection and development of the resin need to consider the use condition and the production process of the hydrogen storage cylinder. For IV type hydrogen storage cylinder, because its inner bag is plastics, high curing temperature can lead to inside lining deformation destruction, can only adopt medium low temperature solidification, and the temperature difference that the gas cylinder is filled fast and is discharged and lead to simultaneously requires the resin to have higher temperature resistance.
In the prior art, the toughening modification of a resin matrix is achieved by adding synthetic rubber, thermoplastic resin, nano particles and the like.
The resin matrix for low-cost medium-temperature curing wet winding and a domestic carbon fiber composite material (Wei Cheng and the like, fiber composite materials, 2017, 34:3-8) are disclosed to prepare a low-cost epoxy resin matrix suitable for domestic T700 carbon fiber wet winding, wherein the tensile strength of a casting body can reach 90MPa, the bending strength is more than 130MPa, but the elongation at break is only 2.2%, and the toughness of a reaction resin system is poor.
CN103045144a discloses a preparation method of epoxy gas cylinder adhesive, which adopts organosilicon modified epoxy resin, glycidyl ether type and polyether type toughening agent anhydride and accelerator to prepare the epoxy gas cylinder adhesive, the elongation at break is more than 4%, but the vitrification temperature is only 102 ℃.
CN111484706a discloses a microwave curing mode, toughening of imide epoxy resin by carboxyl-terminated hyperbranched polymer, and selection of low-viscosity cardanol modified amine curing agent and imidazole ionic liquid accelerator to adjust the pot life and curing reaction activity of the resin system, so that the problems of the resin system for the existing composite gas cylinder are solved, but the industrial application value is low due to the reasons of raw material sources, high production cost, complex operation and the like.
In view of the foregoing, there is a need to develop an epoxy resin system suitable for a type iv hydrogen storage cylinder that exhibits excellent toughness, heat resistance, bending strength, tensile strength, and the like.
Disclosure of Invention
The invention aims to solve the problem that an epoxy resin system in the prior art is poor in toughness, heat resistance, bending strength and tensile strength, and provides an epoxy resin system, an epoxy resin material, a preparation method thereof and an IV-type hydrogen storage cylinder.
In order to achieve the above object, the present invention provides in a first aspect an epoxy resin system, wherein the system comprises a component a, a component B and a component C, wherein, in parts by weight,
component A comprises: 100 parts of glycidyl epoxy resin, 10-20 parts of dicyclopentadiene material, 5-20 parts of reactive diluent, 0.5-3 parts of rheological agent and 0.5-3 parts of coupling agent;
component B comprises: 100 parts of curing agent and 1-5 parts of accelerator;
component C comprises: phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene;
wherein, in the component C, the weight ratio of the phenylmethylene bis (tricyclohexylphosphorus) ruthenium dichloride to the toluene is (1-3): 1, a step of;
wherein the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002).
The second aspect of the present invention provides a method for preparing an epoxy resin material, comprising the steps of:
s1, mixing 100 parts by weight of glycidyl type epoxy resin, 10-20 parts by weight of dicyclopentadiene material, 5-20 parts by weight of reactive diluent, 0.5-3 parts by weight of rheological agent and 0.5-3 parts by weight of coupling agent at a first temperature, and cooling to obtain a component A;
s2, mixing 100 parts by weight of curing agent and 1-5 parts by weight of accelerator at a second temperature to obtain a component B;
s3, mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene according to the weight ratio of (1-3): 1, mixing to obtain a component C;
s4, the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002) mixing at a third temperature to obtain an epoxy resin system;
s5, curing the epoxy resin system obtained in the step S4 to obtain the epoxy resin material.
The third aspect of the invention provides an epoxy resin material prepared by the method.
The invention provides an IV-type hydrogen storage cylinder, wherein the IV-type hydrogen storage cylinder is made of the epoxy resin material.
Through the technical scheme, the epoxy resin material obtained by the invention has better toughness, heat resistance, bending strength and tensile strength. The elongation at break of the epoxy resin material reaches 7.3%, the glass transition temperature is 125-165 ℃, the tensile strength is above 90MPa, the tensile modulus is above 3.35GPa, the bending strength is above 130MPa, and the bending modulus is above 3.95GPa.
Detailed Description
The endpoints and any values of the ranges disclosed herein are not limited to the precise range or value, and are understood to encompass values approaching those ranges or values. For numerical ranges, one or more new numerical ranges may be found between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point value, in combination with each other, and are to be considered as specifically disclosed herein.
The first aspect of the present invention provides an epoxy resin system, wherein the system comprises a component A, a component B and a component C, wherein, in parts by weight,
component A comprises: 100 parts of glycidyl epoxy resin, 10-20 parts of dicyclopentadiene material, 5-20 parts of reactive diluent, 0.5-3 parts of rheological agent and 0.5-3 parts of coupling agent;
component B comprises: 100 parts of curing agent and 1-5 parts of accelerator;
component C comprises: phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene;
wherein, in the component C, the weight ratio of the phenylmethylene bis (tricyclohexylphosphorus) ruthenium dichloride to the toluene is (1-3): 1, a step of;
wherein the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002).
In some embodiments of the present invention, the epoxy resin system is selected according to the specific weight parts, so that the epoxy resin material with high heat resistance, high toughness and high strength can be obtained. In the component a, preferably, the weight parts of the dicyclopentadiene material may be any of 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, and a range of any two of the above values.
In some embodiments of the present invention, preferably, the dicyclopentadiene material is a polydicyclopentadiene resin-reactive monomer. Wherein the dicyclopentadiene material has a purity of more than 99wt%, i.e. wherein the dicyclopentadiene content is more than 99wt%. When mixing, the dicyclopentadiene material is liquid, is easy to mix with epoxy resin, has good toughening effect on the epoxy resin material, and is easy and convenient to operate.
In some embodiments of the present invention, preferably, the reactive diluent may be 5 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 18 parts, 20 parts, and any value in the range of any two values recited above.
In some embodiments of the present invention, preferably, the reactive diluent is selected from at least one of polypropylene glycol diglycidyl ether (such as commercially available under the trade designation X-632), n-butyl glycidyl ether, and glycidyl methacrylate.
In the invention, the epoxy resin system contains the reactive diluent and the dosage, and can play a role in increasing toughness.
In some embodiments of the present invention, preferably, the rheology agent may be present in an amount of 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, and any value in the range of any two values recited above.
In some embodiments of the invention, preferably, the rheological agent comprises nano-silica and/or nano-titania. The nano filler can improve the toughness and heat resistance of the epoxy resin material while adjusting the viscosity of the epoxy resin system. Preferably, the rheology agent has an average particle size of 10-100nm.
In some embodiments of the present invention, preferably, the coupling agent may be present in an amount of 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, and any value in the range of any two values recited above.
In some embodiments of the present invention, preferably, the coupling agent may be one that can be used to improve the properties of the epoxy resin material, such as bending resistance, preferably selected from coupling agents KH-550 and/or KH-560.
In some embodiments of the present invention, preferably, the glycidyl type epoxy resin is selected from at least one of a glycidyl ether epoxy resin, a glycidyl ester epoxy resin, and a glycidyl amine epoxy resin.
Wherein the glycidyl ether epoxy resin includes, but is not limited to: at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol a type epoxy resin, novolac type epoxy resin, aliphatic glycidyl ether resin; preferably selected from bisphenol a type epoxy resins. The glycidyl ether epoxy resins are commercially available, including but not limited to epoxy resin E51 and/or epoxy resin E54.
The glycidyl ester epoxy resins include, but are not limited to: at least one of a diglycidyl 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid epoxy resin (such as commercially available under the trade designation TDE-85), a diglycidyl phthalate epoxy resin, and a diglycidyl hexahydrophthalate epoxy resin; preferably selected from diglycidyl 4, 5-epoxycyclohexane-1, 2-dicarboxylate epoxy resins; the glycidyl ester epoxy resins are commercially available.
The glycidylamine epoxy resin includes, but is not limited to, 4' -diaminodiphenylmethane epoxy resin (such as commercially available under the trade designation AG 80).
In some embodiments of the present invention, one or more glycidyl type epoxy resins may be preferably selected, and suitable glycidyl type epoxy resins are adopted according to practical application requirements, so as to consider multiple indexes of the epoxy resin material, such as toughness, heat resistance, strength and the like. When two kinds of glycidyl type epoxy resins are selected, preferably, one of them is not less than 20 parts by weight. For example, in component A, 70 parts by weight of E51 epoxy resin and 30 parts by weight of TDE85.
In some embodiments of the present invention, in component B, preferably, the curing agent is selected from one of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylnadic anhydride; preferably selected from methyltetrahydrophthalic anhydride or methylhexahydrophthalic anhydride. The epoxy resin system contains the curing agent, and can play a role in adjusting viscosity.
In some embodiments of the present invention, preferably, the accelerator may be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, and any value in the range of any two values recited above.
In some embodiments of the present invention, preferably, the accelerator is selected from at least two of acetylacetonate metal salts, 2,4, 6-tris (dimethylaminomethyl) phenol, imidazole derivatives and triethanolamine.
Preferably, the acetylacetonate metal salts include, but are not limited to: at least one of chromium acetylacetonate, aluminum acetylacetonate, cobalt acetylacetonate, nickel acetylacetonate, copper acetylacetonate, zinc acetylacetonate, iron acetylacetonate, titanium acetylacetonate, manganese acetylacetonate, potassium acetylacetonate and zirconium acetylacetonate; more preferably chromium acetylacetonate.
Preferably, the imidazole derivative is selected from at least one of 2-ethyl-4-methylimidazole, 2-propylimidazole and diphenylimidazole.
In the invention, the epoxy resin system contains the accelerator and the dosage, and can play roles of accelerating the reaction speed and reducing the curing temperature. The accelerator can be two substances, and the addition amount of one substance in the component B is not more than 5 parts by weight. For example, it contains 3 parts of chromium acetylacetonate and 2 parts of triethanolamine as accelerators.
In some embodiments of the invention, in component C, preferably, the weight ratio of phenylmethylenebis (tricyclohexylphosphorus) ruthenium dichloride to toluene is (2-3): 1. according to the invention, phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride is selected, dicyclopentadiene in dicyclopentadiene material can be regulated and controlled to carry out ring-opening polymerization, and the ring-opening polymerization and the epoxy resin polymerization are carried out simultaneously, so that a semi-interpenetrating network structure is formed by the dicyclopentadiene material and the epoxy resin, and the toughness improvement effect is achieved.
In some embodiments of the present invention, the components of the epoxy resin system are preferably synthesized by prior art techniques or are commercially available.
In the invention, the component A, the component B and the component C are matched according to the weight ratio, so that the invention can play a role in improving the integral performance of the epoxy resin, namely toughness, heat resistance and strength.
The second aspect of the present invention provides a method for preparing an epoxy resin material, comprising the steps of:
s1, mixing 100 parts by weight of glycidyl type epoxy resin, 10-20 parts by weight of dicyclopentadiene material, 5-20 parts by weight of reactive diluent, 0.5-3 parts by weight of rheological agent and 0.5-3 parts by weight of coupling agent at a first temperature, and cooling to obtain a component A;
s2, mixing 100 parts by weight of curing agent and 1-5 parts by weight of accelerator at a second temperature to obtain a component B;
s3, mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene according to the weight ratio of (1-3): 1, mixing to obtain a component C;
s4, the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002) mixing at a third temperature to obtain an epoxy resin system;
s5, curing the epoxy resin system obtained in the step S4 to obtain the epoxy resin material.
In some embodiments of the invention, preferably, the first temperature is 40-100deg.C, the second temperature is 30-80deg.C, and the third temperature is 10-35deg.C. Preferably, the mixing time of component A is 30-150min; the mixing time of the component B is 30-150min; the mixing time of the component A, the component B and the component C is 30-60min.
In some embodiments of the present invention, preferably, the curing conditions of the epoxy resin system include: the curing temperature is 80-150 ℃ and the curing time is 1-6h; preferably, the curing temperature is 100-120 ℃ and the curing time is 2-4h.
The epoxy resin system obtained according to the scheme can be mixed at a lower temperature, the curing temperature is low, and the toughness, heat resistance and strength of the obtained epoxy resin material are higher.
The epoxy resin system has low activity at room temperature, high stability at room temperature and long application period, and when in curing, dicyclopentadiene material is subjected to high-efficiency ring-opening polymerization reaction, and forms a semi-interpenetrating network structure with the network structure of the epoxy resin for toughening, and meanwhile, the glass transition temperature of a cured product can be increased due to the alicyclic structure.
The third aspect of the invention provides an epoxy resin material prepared by the method.
In some embodiments of the invention, the epoxy material preferably has a glass transition temperature of 125-165 ℃.
The invention provides an IV-type hydrogen storage cylinder, wherein the IV-type hydrogen storage cylinder is made of the epoxy resin material.
The curing temperature of the epoxy resin system is suitable for an IV type hydrogen storage cylinder, so that the lining of the cylinder can be kept complete and is not deformed; the obtained epoxy resin material has temperature resistance so as to meet the temperature difference caused by rapid inflation and deflation of the gas cylinder.
The present invention will be described in detail by examples. In the following examples of the present invention,
tensile strength, tensile modulus and elongation at break were measured according to the method of GB/T1447-2005; flexural strength and flexural modulus were measured according to the method of GB/T1449-2005; the glass transition temperature (Tg) of the epoxy resin was measured by a Differential Scanning Calorimeter (DSC).
The following examples and comparative examples were conducted under conventional conditions or conditions recommended by the manufacturer, where specific conditions were not noted. The reagents or apparatus used were conventional products available commercially without the manufacturer's knowledge.
Example 1
(1) Mixing 100 parts by weight of E54 epoxy resin, 18 parts by weight of dicyclopentadiene material (with the purity of 99.3 wt%), 10 parts by weight of glycidyl methacrylate, 2.5 parts by weight of nano silicon dioxide and 3 parts by weight of coupling agent KH-550 at 60 ℃ for 100min, and cooling to obtain a component A;
(2) Mixing 100 parts by weight of methyltetrahydrophthalic anhydride, 3 parts by weight of chromium acetylacetonate and 2 parts by weight of triethanolamine at 80 ℃ for 150min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 2:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 20min at 15 ℃ according to the weight ratio of 1:0.85:0.0018 to obtain the epoxy resin system.
Curing the resin system obtained in the step (3) for 4 hours at 100 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Example 2
(1) 70 parts by weight of E51 epoxy resin, 30 parts by weight of TDE85, 15 parts by weight of dicyclopentadiene material (with the purity of 99.2 wt%), 10 parts by weight of n-butyl glycidyl ether, 0.5 part by weight of nano silicon dioxide and 1 part by weight of coupling agent KH-560 are stirred at 50 ℃ for 120min and mixed, and then the mixture is cooled to obtain a component A;
(2) Mixing 100 parts by weight of methyltetrahydrophthalic anhydride and 2 parts by weight of triethanolamine at 30 ℃ for 60min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 3:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 5min at 35 ℃ according to the weight ratio of 1:0.9:0.001 to obtain the epoxy resin system.
Curing the resin system obtained in the step (3) for 3 hours at 110 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Example 3
(1) 100 parts by weight of E51 epoxy resin, 20 parts by weight of dicyclopentadiene material (with the purity of 99.5 wt%), 15 parts by weight of polypropylene glycol diglycidyl ether X-632, 1 part by weight of nano titanium dioxide and 1.5 parts by weight of coupling agent KH-560 are stirred at 80 ℃ for 60 minutes and mixed, and then the mixture is cooled to obtain a component A;
(2) Mixing 100 parts by weight of methyl hexahydrophthalic anhydride and 4 parts by weight of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP 30) at 30 ℃ for 50min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 2:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 10min at 25 ℃ according to the weight ratio of 1:0.8:0.002 to obtain the epoxy resin system.
And (3) curing the resin system obtained in the step (3) for 2 hours at 120 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Example 4
(1) 80 parts by weight of E51 epoxy resin, 20 parts by weight of AG80 epoxy resin, 10 parts by weight of dicyclopentadiene material (with the purity of 99.2 wt%), 20 parts by weight of polypropylene glycol diglycidyl ether X-632, 3 parts by weight of nano silicon dioxide and 2.5 parts by weight of coupling agent KH-560 are stirred at 100 ℃ for 30min and mixed, and then the mixture is cooled to obtain a component A;
(2) Mixing 100 parts by weight of methylnadic anhydride and 1 part by weight of 2-ethyl-4-methylimidazole at 50 ℃ for 60min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 1:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 15min at 18 ℃ according to the weight ratio of 1:0.85:0.002 to obtain the epoxy resin material.
Curing the resin system obtained in the step (3) at 80 ℃ for 6 hours to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Example 5
(1) 100 parts by weight of TDE85 epoxy resin, 16 parts by weight of dicyclopentadiene material (with the purity of 99.3 wt%), 5 parts by weight of n-butyl glycidyl ether, 1.5 parts by weight of nano titanium dioxide and 0.5 part by weight of coupling agent KH-550 are stirred at 40 ℃ for 150min and mixed, and then cooled to obtain a component A;
(2) Mixing 100 parts by weight of methylnadic anhydride, 2 parts by weight of diphenyl imidazole and 1 part by weight of triethanolamine at 60 ℃ for 30min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 2:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 30min at the temperature of 10 ℃ according to the weight ratio of 1:1:0.0016 to obtain the epoxy resin material.
And (3) curing the resin system obtained in the step (3) for 5 hours at 90 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Example 6
(1) 50 parts of E54 epoxy resin, 50 parts of TDE85, 12 parts of dicyclopentadiene (with the purity of 99.4 wt%), 7 parts of n-butyl glycidyl ether, 2 parts of nano silicon dioxide and 2 parts of coupling agent KH-550 are stirred and mixed for 80min at 70 ℃, and then the mixture is cooled to obtain a component A;
(2) Mixing 100 parts by weight of methylnadic anhydride, 2 parts by weight of chromium acetylacetonate and 2 parts by weight of triethanolamine at 70 ℃ for 120min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 2:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 15min at 20 ℃ according to the weight ratio of 1:0.95:0.0012 to obtain the epoxy resin material.
Curing the resin system obtained in the step (3) for 1 hour at 150 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
Comparative example 1
An epoxy resin material was prepared as in example 1, except that component C was not added, and component A and component B were mixed at 25℃for 10 minutes with stirring in a weight ratio of 1:0.85 to obtain an epoxy resin system. The results are shown in Table 1.
Comparative example 2
(1) 70 parts by weight of E51 epoxy resin, 30 parts by weight of TDE85, 26 parts by weight of dicyclopentadiene material (with the purity of 99.2 wt%), 10 parts by weight of n-butyl glycidyl ether, 0.5 part by weight of nano silicon dioxide and 1 part by weight of coupling agent KH-560 are stirred at 50 ℃ for 120min and mixed, and then the mixture is cooled to obtain a component A;
(2) Mixing 100 parts by weight of methyltetrahydrophthalic anhydride and 2 parts by weight of triethanolamine at 30 ℃ for 60min to obtain a component B; mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene at a weight ratio of 3:1 at normal temperature to obtain a component C;
(3) And stirring and mixing the component A, the component B and the component C for 5min at 35 ℃ according to the weight ratio of 1:0.9:0.001 to obtain the epoxy resin system.
Curing the resin system obtained in the step (3) for 3 hours at 110 ℃ to obtain an epoxy resin material, and measuring the tensile strength, tensile modulus, bending strength, bending modulus, elongation at break and glass transition temperature of the epoxy resin material, wherein the results are shown in table 1.
TABLE 1
As can be seen from the results in Table 1, the epoxy resin material obtained by the technical scheme of the invention has better toughness, strength and heat resistance. As can be seen from the data of examples 1-3, the epoxy resin materials obtained in the preferred embodiments have high overall properties, i.e., better compromise of tensile strength, flexural strength, elongation at break. In the comparative example 1, the component C is not contained, the dicyclopentadiene is difficult to undergo ring-opening polymerization reaction, and a semi-interpenetrating network structure is difficult to be formed for toughening, so that the obtained epoxy resin material has low elongation at break; comparative example 2 is different in the amount of dicyclopentadiene material compared to example 2, and thus, the tensile strength, bending strength and glass transition temperature of the epoxy resin material are low.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, a number of simple variants of the technical solution of the invention are possible, including combinations of the individual technical features in any other suitable way, which simple variants and combinations should likewise be regarded as being disclosed by the invention, all falling within the scope of protection of the invention.
Claims (10)
1. An epoxy resin system, characterized in that the system comprises a component A, a component B and a component C, wherein, in parts by weight,
component A comprises: 100 parts of glycidyl epoxy resin, 10-20 parts of dicyclopentadiene material, 5-20 parts of reactive diluent, 0.5-3 parts of rheological agent and 0.5-3 parts of coupling agent;
component B comprises: 100 parts of curing agent and 1-5 parts of accelerator;
component C comprises: phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene;
wherein, in the component C, the weight ratio of the phenylmethylene bis (tricyclohexylphosphorus) ruthenium dichloride to the toluene is (1-3): 1, a step of;
wherein the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002).
2. The epoxy resin system of claim 1, wherein the glycidyl type epoxy resin is selected from at least one of a glycidyl ether epoxy resin, a glycidyl ester epoxy resin, and a glycidyl amine epoxy resin.
3. The epoxy resin system according to claim 1 or 2, wherein the reactive diluent is selected from at least one of polypropylene glycol diglycidyl ether, n-butyl glycidyl ether and glycidyl methacrylate.
4. An epoxy resin system according to any of claims 1-3, wherein the rheological agent comprises nano-silica and/or nano-titania.
5. The epoxy resin system of any one of claims 1-4, wherein the coupling agent comprises a silane coupling agent;
preferably, the curing agent is selected from one of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride and methyl nadic anhydride;
preferably, the accelerator is selected from at least one of acetylacetonate metal salt, 2,4, 6-tris (dimethylaminomethyl) phenol, imidazole derivative and triethanolamine;
preferably, the dicyclopentadiene material has a purity of greater than 99wt%.
6. A method for preparing an epoxy resin material, the method comprising the steps of:
s1, mixing 100 parts by weight of glycidyl type epoxy resin, 10-20 parts by weight of dicyclopentadiene material, 5-20 parts by weight of reactive diluent, 0.5-3 parts by weight of rheological agent and 0.5-3 parts by weight of coupling agent at a first temperature, and cooling to obtain a component A;
s2, mixing 100 parts by weight of curing agent and 1-5 parts by weight of accelerator at a second temperature to obtain a component B;
s3, mixing phenyl methylene bis (tricyclohexylphosphorus) ruthenium dichloride and toluene according to the weight ratio of (1-3): 1, mixing to obtain a component C;
s4, the weight ratio of the component A to the component B to the component C is 1: (0.8-1): (0.001-0.002) mixing at a third temperature to obtain an epoxy resin system;
s5, curing the epoxy resin system obtained in the step S4 to obtain the epoxy resin material.
7. The method of claim 6, wherein the first temperature is 40-100 ℃, the second temperature is 30-80 ℃, and the third temperature is 10-35 ℃;
preferably, the mixing time of the component A is 30-150min, the mixing time of the component B is 30-150min, and the mixing time of the component A, the component B and the component C is 30-60min.
8. The method of claim 6 or 7, wherein the curing conditions of the epoxy resin system comprise: the curing temperature is 80-150 ℃ and the curing time is 1-6h; preferably, the curing temperature is 100-120 ℃ and the curing time is 2-4h.
9. An epoxy resin material produced by the production method according to any one of claims 6 to 8;
preferably, the glass transition temperature of the epoxy resin material is 125-165 ℃.
10. A type iv hydrogen storage cylinder, characterized in that it is made of the epoxy resin material according to claim 9.
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