CN117754447A - Spherical grinding roller and grinding method for plano-convex quartz wafer - Google Patents
Spherical grinding roller and grinding method for plano-convex quartz wafer Download PDFInfo
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- CN117754447A CN117754447A CN202311817492.9A CN202311817492A CN117754447A CN 117754447 A CN117754447 A CN 117754447A CN 202311817492 A CN202311817492 A CN 202311817492A CN 117754447 A CN117754447 A CN 117754447A
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 239000010453 quartz Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims description 31
- 235000012431 wafers Nutrition 0.000 claims abstract description 101
- 239000004576 sand Substances 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 229910001141 Ductile iron Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229940095676 wafer product Drugs 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The spherical grinding roller of the plano-convex quartz wafer is provided with a cylinder assembly, a screen assembly, a fixed shaft and a bearing; the cylinder assembly comprises a cylinder and a mounting seat, the diameter of the cross section of the cylinder is matched with the spherical curvature radius of the plano-convex quartz wafer, the mounting seat is arranged at one end of the cylinder, and the mounting seat is of a sleeve structure which is axially communicated with the cylinder; the bearing is a radial ball bearing, the radial ball bearing is sleeved in the mounting seat, the outer ring of the bearing is assembled with the inner side wall of the mounting seat in an interference fit manner, and the fixed shaft is pressed in the inner ring of the bearing; the screen assembly is fixedly arranged on the fixed shaft, an included angle alpha=30-45 degrees with the axial section of the cylinder assembly, and the distance L=15-20 mm between the periphery of the screen assembly and the inner side wall of the cylinder. The invention realizes the grinding processing of batch quartz plano-convex wafer spherical surfaces, and achieves the purposes of ensuring the grinding quality of wafers, improving the production efficiency and reducing the processing cost.
Description
Technical Field
The invention relates to the technical field of quartz wafer processing equipment, in particular to a spherical grinding roller and a grinding method for a plano-convex quartz wafer.
Background
With the continuous improvement of the technology level, the quartz resonator and the quartz oscillator are increasingly widely applied, and the requirements on the stability of the quartz resonator and the quartz oscillator are also higher and smaller. The quartz plano-convex wafer is used as a core element of the quartz crystal with high stability, the breakage rate is high in the processing process, particularly, the grinding processing of the spherical surface (convex surface side) of the wafer is extremely easy to damage due to the fact that the edge of a product is extremely easy to damage, a single-chip processing technology is generally adopted at present, namely, the wafer is fixed on the hemispherical concave surface of the processing disc by means of a concave spherical processing disc by using external force, grinding sand is added, and the redundant part of one surface of the wafer is removed by the cutting action of the grinding sand, so that the spherical surface of the plano-convex wafer is formed. The production efficiency of the single-chip processing technology is very low, and the processing cost is greatly increased, so that the industrialized production of the plano-convex wafer is difficult to realize.
Disclosure of Invention
The invention provides a grinding roller and a grinding method for spherical surfaces of plano-convex quartz wafers, which realize the grinding processing of the spherical surfaces of large-batch quartz plano-convex wafers by optimizing the roller and a matched structure of the roller and a fixed screen, thereby achieving the aims of ensuring the grinding quality of the wafers, improving the production efficiency and reducing the processing cost.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a spherical grinding roller for plano-convex quartz wafers is provided with a cylinder assembly, a screen assembly, a fixed shaft and a bearing; the cylinder assembly comprises a cylinder body and an installation seat, wherein the cylinder body is a cylindrical cylinder body, the diameter of the cross section of the cylinder body is matched with the spherical curvature radius of the plano-convex quartz wafer, the installation seat connected with the rotary driving mechanism is arranged at one end of the cylinder body, and the installation seat is of a sleeve structure axially communicated with the cylinder body; the bearing is a radial ball bearing, the radial ball bearing is sleeved in the mounting seat, the outer ring of the bearing is assembled with the inner side wall of the mounting seat in an interference fit manner, and the fixed shaft is pressed in the inner ring of the bearing; the screen assembly is fixedly arranged on the fixed shaft, an included angle alpha=30-45 degrees with the axial section of the cylinder assembly, and the distance L=15-20 mm between the periphery of the screen assembly and the inner side wall of the cylinder.
The screen assembly comprises a screen and a screen fixing frame; the size of the mesh opening of the screen is smaller than the diameter of the quartz wafer to be ground, and the screen is arranged on the screen fixing frame; the screen fixing frame is sleeved on the fixing shaft, and is connected with the fixing shaft into a whole through a balancing weight and a locking screw which are assembled at one end of the fixing shaft.
Above-mentioned plano-convex quartz crystal wafer sphere grinds cylinder, balancing weight one end is the sleeve structure, and the suit is at the non-bearing cooperation end of fixed axle, assembles with the fixed axle through threaded connection structure, and the other end and the screen cloth fixed frame of balancing weight pass through locking screw fixed assembly.
Above-mentioned plano-convex quartz crystal wafer sphere grinds cylinder, the barrel adopts the nodular cast iron material evenly set up the pit that diameter size and degree of depth size are 1mm on the inner wall of barrel, adjacent two sets of pit intervals are 5mm.
The bearing retainer ring is arranged at the inner side end of the mounting seat of the cylinder body and used for preventing the grinding sand from damaging the bearing.
The spherical grinding roller for the plano-convex quartz wafer is characterized in that an external thread is arranged on the outer wall of the mounting seat, the cylinder body is connected with the rotary driving mechanism through a threaded connection structure, and the cylinder body is driven to rotate by the rotary driving mechanism.
The spherical grinding method for the plano-convex quartz wafers adopts the spherical grinding roller for the plano-convex quartz wafers to finish the spherical grinding operation of the batch plano-convex quartz wafers, and comprises the following specific operation steps:
a. relatively sticking two quartz wafers together;
b. placing hundreds of adhered quartz wafers and a proper amount of abrasive sand in a cylinder;
c. adjusting the assembly angle of the screen assembly to enable the screen assembly to meet the grinding process requirements;
d. starting a rotary driving mechanism of the grinding equipment, enabling a quartz wafer workpiece to be attached to the inner wall of the cylinder along with the rotation of the cylinder, and grinding the quartz wafer under the cooperation of grinding sand;
e. after grinding for a set time, stopping the operation of the grinding equipment, taking out the quartz wafer and the grinding sand from the cylinder, and sorting out the quartz wafer workpiece;
f. and (3) photoresist removing and cleaning the quartz wafers, and separating the two quartz wafers stuck together to obtain a plano-convex quartz wafer product.
In the above method for grinding spherical surface of plano-convex quartz wafer, in the step a, two quartz wafers are bonded together by anaerobic adhesive.
In the above method for grinding spherical surface of plano-convex quartz wafer, in the step b, the grinding sand number is gc#4000.
In the step c, the rotary driving mechanism drives the cylinder to rotate clockwise, the quartz wafer is attached to the inner wall of the cylinder under the action of centrifugal force, and the quartz wafer is ground under the cooperation of grinding sand; when the quartz wafers rotate to the left and right positions along with the cylinder, most quartz wafers turn over and fall back, part of quartz wafers are adhered to the inner wall of the cylinder until the position of about 11 points falls onto the screen, slide down along the inclined direction of the screen, return to the bottom of the cylinder from the gap between the screen and the inner wall of the cylinder, circulate the process until the grinding time is set, and enter the operation flow of the step d.
The invention discloses a plano-convex quartz wafer spherical grinding roller, wherein the curvature radius of the inner wall curved surface of a roller body is consistent with that of a quartz wafer spherical surface to be ground, when the quartz wafer grinding operation is carried out, hundreds of groups of quartz wafers can be ground simultaneously under the cooperation of grinding sand materials, after the grinding operation is finished, the quartz wafers are subjected to photoresist removal cleaning, and the two quartz wafers which are stuck together are separated, so that the batch processing of quartz flat lugs is realized. The invention also arranges the fixed shaft and the screen assembly in the cylinder body, and the screen assembly can be used for bearing the quartz wafers falling from high positions, thereby playing a role in absorbing collision capacity and buffering impact, and reducing the breakage rate of the quartz wafers. Experiments prove that the grinding operation is carried out on the spherical surface of the plano-convex quartz wafer by adopting the grinding device, the production efficiency is improved by more than 5 times, and the product yield is improved from about 70% to about 90%.
The invention also discloses a method for grinding the spherical surface of the plano-convex quartz wafer, which provides process guarantee for realizing the mass production process of the plano-convex quartz wafer by means of the spherical surface grinding roller of the plano-convex quartz wafer.
In summary, the invention realizes the grinding processing of the spherical surfaces of a large number of quartz plano-convex wafers simultaneously by the optimized design of the roller, the matched structure of the roller and the fixed screen and the grinding process method, and achieves the aims of ensuring the grinding quality of the wafers, improving the production efficiency and reducing the processing cost.
Drawings
FIG. 1 is a schematic view of the general structure of a spherical grinding roller for plano-convex quartz wafers according to the present invention;
FIG. 2 is a schematic view of the cross-sectional structure A-A of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a cartridge assembly;
FIG. 4 is a schematic view of a stationary shaft and screen assembly;
FIG. 5 is a view in the K-direction of FIG. 4;
fig. 6 is a schematic view of the working state of the spherical grinding roller of the plano-convex quartz wafer.
The reference numerals in the drawings are defined as follows:
1 is a cylinder assembly, 1-1 is a cylinder, 1-2 is a pit, 1-3 is a mounting seat, 1-4 is an external thread, and 1-5 is a bearing retainer ring;
2 is a screen assembly, 2-1 is a screen, 2-2 is a screen fixing frame, 2-3 is a balancing weight, and 2-4 is a locking screw;
3 is a fixed shaft;
4 is a bearing;
5 is a quartz wafer;
and 6 is grinding sand.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific examples.
Referring to fig. 1, 2 and 3, the invention provides a spherical grinding roller for plano-convex quartz wafers, which is provided with a cylinder assembly 1, a screen assembly 2, a fixed shaft 3 and a bearing 4; the cylinder assembly 1 comprises a cylinder 1-1 and a mounting seat 1-3, wherein the cylinder 1-1 is a cylindrical cylinder which is horizontally arranged, nodular cast iron is adopted, the diameter size of the cross section of the cylinder 1-1 is matched with the spherical curvature radius of a plano-convex quartz wafer, pits 1-2 with the diameter size and the depth size of 1mm are uniformly formed in the inner wall of the cylinder, the distance between two adjacent groups of pits 1-2 is 5mm, one end of the cylinder 1-1 is provided with the mounting seat 1-3 connected with a rotary driving mechanism, the mounting seat 1-3 is of a sleeve structure which is axially communicated with the cylinder 1-1, the outer wall of the mounting seat 1-3 is provided with external threads 1-4, the cylinder 1-4 is connected with the rotary driving mechanism through a threaded connection structure, and the cylinder 1-4 is driven by the rotary driving mechanism to rotate; the bearing 4 is a radial ball bearing, is sleeved in the mounting seat 1-3, the outer ring of the bearing 4 is assembled with the inner side wall of the mounting seat 1-3 in an interference fit manner, and the fixed shaft 3 is pressed in the inner ring of the bearing 4; the fixed shaft 3 axially penetrates through the cylinder body 1-4; the screen assembly 2 is fixedly arranged on the fixed shaft 3, an included angle alpha=30-45 degrees with the axial section of the cylinder assembly 1, the distance L=15-20 mm between the periphery of the screen assembly 2 and the inner side wall of the cylinder 1-1, the preferable value of the included angle alpha between the screen assembly 2 and the axial section of the cylinder assembly 1 is 30 degrees for products with flat lug diameters larger than 5.5mm, and the preferable distance L between the periphery of the screen assembly 2 and the inner side wall of the cylinder 1-1 is 20mm.
Referring to fig. 1, 4 and 5, the screen assembly 2 of the plano-convex quartz wafer spherical grinding roller comprises a screen 2-1, a screen fixing frame 2-2, a balancing weight 2-3 and a locking screw 2-4; the mesh size of the screen 2-1 is smaller than the diameter size of the quartz wafer 5 to be ground, and the screen 2-1 is arranged on the screen fixing frame 2-2; the screen fixing frame 2-2 is sleeved on the fixing shaft 3, and is connected with the fixing shaft into a whole through a balancing weight 2-3 and a locking screw 2-4 which are assembled at one end of the fixing shaft 3; one end of the balancing weight 2-3 is of a sleeve structure, the balancing weight is sleeved at the non-bearing matching end of the fixed shaft 3, the balancing weight is assembled with the fixed shaft through a threaded connection structure, and the other end of the balancing weight 2-3 is fixedly assembled with the screen fixing frame 2-2 through a locking screw 2-4.
Referring to fig. 6, the present invention further provides a spherical grinding method for plano-convex quartz wafers, wherein when the grinding operation of the quartz wafers 5 is performed, firstly, two quartz wafers 5 are relatively stuck together by anaerobic adhesive, and then hundreds of stuck quartz wafers 5 and a proper amount of grinding sand 6 (the grinding sand number is generally gc#4000) are placed in a cylinder 1-1 which is horizontally placed; the assembly angle of the screen assembly is adjusted by adjusting the screwing angle of the threaded connection mechanism of the balancing weight 2-3 and the fixed shaft 3, so that the screen assembly 2, the assembly block 2-3 and the fixed shaft are locked and fixed after the assembly angle meets the grinding process requirement; after the grinding equipment is started, the cylinder 1-1 is driven by the rotary driving mechanism to rotate clockwise, along with the rotation of the cylinder 1-1, a quartz wafer 5 workpiece is attached to the inner wall of the cylinder 1-1 under the action of centrifugal force, and the quartz wafer 5 is ground under the cooperation of the grinding sand 6. In the grinding process, when the workpiece of the quartz wafer 5 rotates to a position about 9 points along with the cylinder 1-1 (a position determined by referring to the clock disc surface on the cross section of the cylinder), the workpiece overturns and falls, but under the influence of the humidity and static electricity of the working environment, part of the quartz wafer 5 can be adhered to the cylinder wall until a falling phenomenon occurs at a position about 11 points, at the moment, the falling quartz wafer 5 can be received by the screen 2-1 and slides along the inclined direction of the screen 2-1, the gap between the screen 2-1 and the inner wall of the cylinder 1-1 returns to the bottom of the cylinder 1-1, one working cycle is completed, and then the action process is repeated, so that the next working process is started. After the grinding operation is finished, the quartz wafers can be subjected to photoresist removal and cleaning, and the two quartz wafers stuck together are separated to form a plano-convex quartz wafer product.
Claims (10)
1. A grinding roller and a grinding method for spherical surface of a plano-convex quartz wafer are characterized in that: the device is provided with a cylinder assembly (1), a screen assembly (2), a fixed shaft (3) and a bearing (4); the cylinder assembly (1) comprises a cylinder (1-1) and a mounting seat (1-3), wherein the cylinder (1-1) is a cylindrical cylinder, the cross section diameter of the cylinder (1-1) is matched with the spherical curvature radius of a plano-convex quartz wafer, one end of the cylinder (1-1) is provided with the mounting seat (1-3) connected with a rotary driving mechanism, and the mounting seat (1-3) is of a sleeve structure axially communicated with the cylinder (1-1); the bearing (4) is a radial ball bearing and is sleeved in the mounting seat (1-3), the outer ring of the bearing (4) is assembled with the inner side wall of the mounting seat (1-3) in an interference fit manner, and the fixed shaft (3) is pressed in the inner ring of the bearing (4); the screen assembly (2) is fixedly arranged on the fixed shaft (3), an included angle alpha=30-45 degrees with the axial section of the cylinder assembly (1), and the distance L=15-20 mm between the periphery of the screen assembly (2) and the inner side wall of the cylinder (1-1).
2. The spherical grinding roller and the grinding method for the plano-convex quartz wafer according to claim 1, wherein: the screen assembly (2) comprises a screen (2-1) and a screen fixing frame (2-2); the mesh size of the screen (2-1) is smaller than the diameter size of the quartz wafer (5) to be ground, and the screen (2-1) is arranged on the screen fixing frame (2-2); the screen fixing frame (2-2) is sleeved on the fixing shaft (3), and is connected with the fixing shaft into a whole through the balancing weight (2-3) and the locking screw (2-4) which are assembled at one end of the fixing shaft (3).
3. The spherical grinding roller and the grinding method for the plano-convex quartz wafer according to claim 2, wherein: one end of the balancing weight (2-3) is of a sleeve structure, the balancing weight is sleeved at the non-bearing matching end of the fixed shaft (3), the balancing weight is assembled with the fixed shaft through a threaded connection structure, and the other end of the balancing weight (2-3) is fixedly assembled with the screen fixing frame (2-2) through a locking screw (2-4).
4. A plano-convex quartz wafer spherical grinding roller and a grinding method according to any one of claims 1 to 3, characterized in that: the cylinder body (1-1) is made of spheroidal graphite cast iron, pits (1-2) with the diameter size and the depth size of 1mm are uniformly formed in the inner wall of the cylinder body (1-1), and the distance between two adjacent sets of pits (1-2) is 5mm.
5. The spherical grinding roller and the grinding method for the plano-convex quartz wafer according to claim 4, wherein: and a bearing retainer ring (1-5) is arranged at the inner side end of the mounting seat of the cylinder body (1-1) and used for preventing the grinding sand (6) from damaging the bearing (4).
6. The spherical grinding roller and the grinding method for the plano-convex quartz wafer according to claim 5, wherein: an external thread (1-4) is arranged on the outer wall of the mounting seat (1-3), the cylinder (1-4) is connected with the rotary driving mechanism through a threaded connection structure, and the cylinder (1-4) is driven to rotate by the rotary driving mechanism.
7. A method for grinding spherical surface of plano-convex quartz wafer is characterized in that: the spherical grinding roller for the plano-convex quartz wafers is used for finishing the spherical grinding operation of batch plano-convex quartz wafers, and comprises the following specific operation steps:
a. relatively sticking two quartz wafers (5) together;
b. placing hundreds of adhered quartz wafers and a proper amount of abrasive sand (6) into a cylinder;
c. adjusting the assembly angle of the screen assembly (2) to enable the assembly angle to meet the grinding process requirements;
d. starting a rotary driving mechanism of the grinding equipment, attaching a quartz wafer (5) workpiece to the inner wall of the cylinder (1-1) along with the rotation of the cylinder (1-1), and grinding the quartz wafer (5) under the cooperation of a grinding sand material (6);
e. after grinding for a set time, the grinding equipment stops running, the quartz wafer (5) and the grinding sand (6) are taken out of the cylinder (1-1), and the quartz wafer (5) workpiece is sorted out;
f. and (3) photoresist removing and cleaning the quartz wafers (5), and separating the two quartz wafers stuck together to obtain a plano-convex quartz wafer product.
8. The method for spherical grinding of plano-convex quartz wafers according to claim 7, wherein: in the step a, two quartz wafers (5) are oppositely stuck together by using anaerobic adhesive.
9. The method for spherical grinding of plano-convex quartz wafers according to claim 7, wherein: in the step b, the abrasive sand number is gc#4000.
10. The spherical grinding method of a plano-convex quartz wafer according to claim 8 or 9, characterized in that: in the step c, the rotary driving mechanism drives the cylinder (1-1) to rotate clockwise, the quartz wafer (5) is attached to the inner wall of the cylinder (1-1) under the action of centrifugal force, and the quartz wafer (5) is ground under the cooperation of the grinding sand (6); when the quartz wafer (5) rotates to the left and right positions along with the cylinder (1-1), most of the quartz wafer (5) is turned back to fall, part of the quartz wafer (5) is adhered to the inner wall of the cylinder until the position of about 11 points is fallen onto the screen (2-1) and slides along the inclined direction of the screen (2-1), the gap between the screen (2-1) and the inner wall of the cylinder (1-1) returns to the bottom of the cylinder, the process is circulated until the grinding time is set, and the operation flow of the step d is entered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311817492.9A CN117754447A (en) | 2023-12-27 | 2023-12-27 | Spherical grinding roller and grinding method for plano-convex quartz wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311817492.9A CN117754447A (en) | 2023-12-27 | 2023-12-27 | Spherical grinding roller and grinding method for plano-convex quartz wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117754447A true CN117754447A (en) | 2024-03-26 |
Family
ID=90325402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311817492.9A Pending CN117754447A (en) | 2023-12-27 | 2023-12-27 | Spherical grinding roller and grinding method for plano-convex quartz wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117754447A (en) |
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2023
- 2023-12-27 CN CN202311817492.9A patent/CN117754447A/en active Pending
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