CN117748078A - Flexible banded low-temperature superconducting coaxial line interconnection system - Google Patents
Flexible banded low-temperature superconducting coaxial line interconnection system Download PDFInfo
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- CN117748078A CN117748078A CN202311815901.1A CN202311815901A CN117748078A CN 117748078 A CN117748078 A CN 117748078A CN 202311815901 A CN202311815901 A CN 202311815901A CN 117748078 A CN117748078 A CN 117748078A
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- 238000005259 measurement Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000001914 filtration Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 66
- 239000004020 conductor Substances 0.000 claims description 19
- 230000000712 assembly Effects 0.000 claims description 18
- 238000000429 assembly Methods 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 13
- 238000005057 refrigeration Methods 0.000 claims description 9
- 229910001275 Niobium-titanium Inorganic materials 0.000 claims description 5
- RJSRQTFBFAJJIL-UHFFFAOYSA-N niobium titanium Chemical compound [Ti].[Nb] RJSRQTFBFAJJIL-UHFFFAOYSA-N 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 6
- 238000009529 body temperature measurement Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910020012 Nb—Ti Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
The invention discloses a flexible banded low-temperature superconducting coaxial line interconnection system which comprises a multi-core airtight microwave interconnection module positioned on a room temperature layer and is used for being connected with a quantum computing measurement and control system. And the infrared filtering module is positioned below the 20mK layer and used for being connected with the chip packaging box. And the strip line microwave interconnection module is positioned in the environment of the refrigerator system and has a temperature range of 20 mK-300K layers and is used for connecting the multi-core airtight microwave interconnection module and the infrared filtering module. The invention realizes high-density microwave measurement and control links from the adapter plate of the room temperature measurement and control integrated machine to the quantum computer chip packaging box in an overall layout, realizes multi-core overall insertion, simplifies the assembly and disassembly processes, improves the reliability of connection points, and effectively improves the stability and reliability of signal transmission.
Description
Technical Field
The invention relates to the technical field of superconducting quantum computing systems, in particular to a flexible banded low-temperature superconducting coaxial line interconnection system.
Background
The ultra-low temperature microwave interconnection system for superconducting quantum computation is suitable for an ultra-low temperature environment close to absolute zero, has the characteristics of airtight seal, high transmission channel density, modularization, low radio frequency transmission loss, excellent effect and the like, is applied to microwave transmission interconnection for superconducting quantum computation, is used as a quantum measurement and control link crossing a plurality of working temperature areas, and interconnects a quantum computation chip and the quantum computation measurement and control system in an environment supporting system.
Although the number of bits of the quantum computing chip is greatly increased, the volume of a diluting refrigerator which can be practically used in China cannot be synchronously increased, and how to improve the interconnection line density becomes an urgent need.
In the existing microwave interconnection system, in order to increase the channel density and the quantum computation scale, a single-channel integrated microwave interconnection system is generally adopted. However, there are still problems with such microwave interconnect systems. For example, the link volume is large, the channel density is small, etc.; the room temperature layer and the low temperature layer have more connection points and low reliability, and are easy to break or distort signals; meanwhile, the assembling and disassembling processes are complex, and the maintenance and upgrading are not facilitated.
Disclosure of Invention
In order to solve the technical problems in the background art, the invention provides a flexible banded low-temperature superconducting coaxial line interconnection system.
The invention adopts the following technical scheme: a flexible tape-like cryogenic superconducting coaxial line interconnect system comprising:
the multi-core airtight microwave interconnection module is positioned on the room temperature layer and is used for being connected with the quantum computing measurement and control system;
the infrared filter module is positioned below the 20mK layer and used for being connected with the chip packaging box;
and the strip line microwave interconnection module is positioned in the environment of the refrigerator system and has a temperature range of 20 mK-300K layers and is used for connecting the multi-core airtight microwave interconnection module and the infrared filtering module.
Further, the multi-core airtight microwave interconnection module comprises a pair of first row of plug assemblies and a sealed microwave integration module connected with the pair of first row of plug assemblies;
one end of the first row of plug assemblies is connected with the sealed microwave integrated module, and the other end of the first row of plug assemblies is connected with the quantum computing measurement and control system;
the first row of plug assemblies comprise row plug housings and miniature radio frequency connectors arranged on the row plug housings;
the sealed microwave integrated module comprises a first attenuator module and a sealing flange;
the first attenuator module is assembled on the sealing flange;
the first attenuator module is connected with the miniature radio frequency connector.
Further, the strip line microwave interconnection module comprises a plurality of layers of interconnection modules which are sequentially connected end to end;
the multi-layer interconnection modules are respectively arranged on the cold discs of the 20 mK-300K refrigerating layers;
the interconnection module comprises a flexible strip line, a heat sink unit arranged on each layer of cold disc and a flexible strip low-temperature coaxial line assembly arranged in at least a 20mK refrigerating layer;
the flexible strip line sequentially passes through each refrigerating layer and heat sink units arranged on each refrigerating layer, the top end of the flexible strip line passes through a sealing flange to be connected with the first attenuator module, and the tail end of the flexible strip line is connected with the infrared filtering module;
the middle section of the flexible strip line is connected with the flexible strip low-temperature coaxial line component;
the flexible ribbon low-temperature coaxial line assembly comprises a second attenuator module and a high-density connector which are connected with each other;
the second attenuator module is assembled with the heat sink unit;
and in the refrigerating layer provided with the banded flexible low-temperature coaxial line component, one end of the flexible banded line is connected with the high-density connector, and the other end of the flexible banded line is connected with the second attenuator module to form a closed loop.
Further, the high-density connector comprises a plurality of rows of holes which are arranged in parallel; the plurality of rows of parallel arranged hole sites comprise a plurality of rows of single-row hole sites; a row of double row hole sites are arranged in a gap between every two rows of single row hole sites; the connection part of the flexible strip line and the high-density connector is provided with a plurality of groups of pin columns connected in the gap between the single row of hole sites and the double rows of hole sites; and leads with the number matched with that of the holes in the corresponding row are arranged at the two ends of each group of pin columns.
Further, the flexible strip line between the 3K refrigeration layers and the 300K refrigeration layers is integrally designed by adopting a Cu flexible strip line; the flexible strip line between the 20 mK-3K refrigerating layers adopts the integral design of the niobium-titanium superconducting flexible strip line.
Further, the flexible strip lines between the 20mK refrigeration layers and the 300K refrigeration layers are integrally designed by adopting niobium-titanium superconducting flexible strip lines.
Further, the flexible strip line includes upper and lower protective layers of the outermost layer, upper and lower shield layers of the sub-outer layer, upper and lower insulating layers, and a central conductor of the middle layer.
Further, the center conductors are uniformly distributed.
Further, the infrared filter connection module comprises an infrared filter; the infrared filter is connected with the chip packaging box through a pair of second row plug assemblies.
Further, the heat sink unit comprises two semicircular cold plates; the two are fixedly connected by adopting an elastic pressing structure; the flexible strip line is inserted in the pressing slot. Compared with the prior art, the invention has the advantages that:
the flexible banded low-temperature superconducting coaxial line interconnection system designed by the invention realizes a high-density microwave measurement and control link from the adapter plate of the room temperature measurement and control integrated machine to the quantum computer chip packaging box through the whole layout, realizes the multi-core whole insertion and combination, simplifies the assembly and disassembly processes, improves the reliability of connection points, and effectively improves the stability and reliability of signal transmission.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the flexible tape-like low-temperature superconducting coaxial line interconnection system of the present invention;
fig. 2 is a schematic diagram of another overall structure of the flexible tape-like low-temperature superconducting coaxial line interconnection system of the present invention;
fig. 3 is a schematic diagram of another overall structure of the flexible tape-like low-temperature superconducting coaxial line interconnection system of the present invention;
FIG. 4 is a schematic transverse view of the connection of the high density connector to the flexible strip line of the present invention;
FIG. 5 is a longitudinal schematic view of the connection between the high density connector and the flexible strip line of the present invention;
FIG. 6 is a cross-sectional view of a flexible strip line of the present invention;
fig. 7 is a schematic view of the overall structure of the flexible ribbon-shaped cryogenic coaxial cable assembly of the present invention;
FIG. 8 is a schematic diagram of a semicircular cold plate structure of a cold plate of the present invention.
Wherein:
1-row inserts casing, 2-miniature radio frequency connector, 3-quantum calculation measurement and control system, 4-first attenuator module, 5-sealing flange, 6-cold dish, 7-heat sink unit, 8-flexible strip line, 9-high density connector, 10-second attenuator module, 11-infrared filter, 12-second row inserts subassembly, 13-chip packaging box, 14-semicircle cold plate, 15-spacing hole,
81-protective layer, 82-Ag/NbTi shielding layer, 83-insulating layer, 84-Ag/NbTi central conductor,
101-single row hole sites, 102-double row hole sites and 103-pin posts.
Detailed Description
In the following, in order to facilitate the understanding of the technical solutions of the present invention by a person skilled in the art, reference will be made to the accompanying drawings for further description. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention.
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the invention. It may be evident, however, that one or more embodiments may be practiced without these specific details. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
The temperature range of 20mK to 300K in the refrigerator system is generally classified into a 5-layer structure as shown in fig. 1, and the temperature range includes 20mK to 100mK, 100mK to 0.9K, 0.9K to 3K, 3K to 36K, and 36K to 300K.
Referring to fig. 1-3, the flexible tape-like low temperature superconducting coaxial line interconnection system of the present invention designs a link structure for the 5-layer structure. The whole structure comprises a multi-core airtight microwave interconnection module positioned on a room temperature layer and is used for being connected with the quantum computing measurement and control system 3. And the infrared filtering module is positioned below the 20mK layer and used for being connected with the chip packaging box. And the strip line microwave interconnection module is positioned in the environment of the refrigerator system and has a temperature range of 20 mK-300K layers and is used for connecting the multi-core airtight microwave interconnection module and the infrared filtering module.
The multi-core airtight microwave interconnection module comprises a pair of first row plug assemblies and a sealed microwave integration module connected with the pair of first row plug assemblies. One end of the first row of plug assemblies is connected with the sealed microwave integrated module, and the other end of the first row of plug assemblies is connected with the quantum computing measurement and control system. The first row of plug assemblies comprises a row of plug housings 1 and miniature radio frequency connectors 2 which are plugged on the row of plug housings 1. The extension socket housing 1 is generally provided with 40 channels. The sealed microwave integrated module comprises an attenuator module 4 and a sealing flange 5. The first attenuator module 4 is mounted on the sealing flange 5, and the first attenuator module 4 is connected to the miniature radio frequency connector 2. As shown in the figures, in practice, 2 40 channel attenuator modules 4 may be mounted in the sealing flange 5.
The strip line microwave interconnection module comprises a plurality of layers of interconnection modules which are connected end to end in sequence. The multi-layer interconnection module is sequentially arranged on the cold plate 6 of the 20 mK-300K refrigerating layer, and comprises a flexible strip line 8, a heat sink unit 7 arranged on each layer of cold plate 6 and a flexible strip-shaped low-temperature coaxial line assembly at least arranged in the 20mK refrigerating layer. The flexible strip line 8 sequentially passes through each refrigerating layer and the heat sink unit 7 arranged on each refrigerating layer, the top end of the flexible strip line passes through the sealing flange 5 to be connected with the first attenuator module 4, and the tail end of the flexible strip line is connected with the infrared filtering module. The middle section of the flexible strip line 8 is connected with a flexible strip cryocoaxial line assembly.
As shown in fig. 7, the flexible strip-shaped low-temperature coaxial line assembly includes a second attenuator module 10 and a high-density connector 9. The second attenuator module 10 is assembled with the heat sink unit 7 as shown in the drawing, and in the refrigerating layer provided with the strip-shaped flexible low-temperature coaxial line assembly, one end of the flexible strip line 8 is connected to the high-density connector 9, and the other end is connected to the second attenuator module 10, thereby forming a closed loop. In practice, the high-density connectors 9 may be provided in a pair, and the pair of high-density connectors 9 are connected to both sides of the second attenuator module 10. The flexible strip line 8 positioned on the 300K refrigeration layer cold plate is electrically connected with the first attenuator module 4 of the room temperature layer through the sealing flange 5, and the flexible strip line and the sealing flange are sealed and fixed together by adopting multiple combinations. The flexible strip line greatly improves the channel density of the quantum measurement and control link, the quantum computer scale is improved from hundred bits to kilobits, and the flexible strip line has a flat structure, a small size and excellent soft bending resistance, so that the flexible strip line enjoys greater flexibility in wiring.
As shown in fig. 4, which is a transverse schematic diagram of the connection relationship between the high-density connector and the flexible strip line, the high-density connector 9 of the present invention includes a plurality of rows of parallel hole sites, the plurality of rows of parallel hole sites includes a plurality of rows of single row hole sites 101, a row of double row hole sites 102 is disposed in the gap between each two rows of single row hole sites 101, a plurality of groups of pin columns 103 connected in the gap between the single row hole sites 101 and the double row hole sites 102 are disposed at the connection position of the flexible strip line 8 and the high-density connector 9, and leads corresponding to the number of the holes of the corresponding rows are disposed at two ends of each group of pin columns 103.
In the specific implementation, as shown in fig. 1-4, the flexible strip line 8 between the two layers has 80 paths, and is led out from the sealed microwave integrated module or the heat sink unit microwave integrated module in a pressing way, and one part is two. Each layer 40 is connected with the lower heat sink unit 7 after being welded and pressed with the high-density connector 9. As shown in FIG. 4, in the implementation, the holes 1 to 10 and the holes 31 to 40 are single-row holes, the first flexible strip line inner conductor on the left is 0.5mm away from the end face of the flexible strip line, and the 3 rd flexible strip line inner conductor on the left is in the same plane with the holes 1 to 10. The 18 th flexible strip line inner conductor on the left side is on the same plane with the 11 th to 20 th hole sites. The left side two flexible strip line inner conductors are distributed from the left side of a No. 1 hole site and are respectively connected with a No. 2 hole site and a No. 3 hole site, the third flexible strip line inner conductor is connected with a No. 1 hole site, the fourth flexible strip line inner conductor to the seventeenth flexible strip line inner conductor are respectively connected with a No. 4 hole site to a No. 17 hole site, the 18 th flexible strip line inner conductor is connected with a No. 20 hole site, and the 19 flexible strip line inner conductors and the 20 flexible strip line inner conductors are distributed from the right side of the No. 20 hole site and are respectively connected with the 19 hole site and the 18 hole site. The arrangement of the holes 21 and 40 is the same as that of the holes 1 to 20, so that the conductors in the flexible strip line are uniformly distributed.
In addition, as shown in fig. 5, in this embodiment, when the flexible strip line is assembled with the high-density connector, the lower board is provided with a threaded limiting hole 15 along the connector arrangement position, after the high-density connector 9 and the flexible strip line 8 are assembled and locked, the lower board is locked and pressed on the flexible strip line again through a vertical screw, so that the high-density connector 9 and the inner conductor of the flexible strip line 8 are ensured to be in good contact, and the channel yield is realized.
In some embodiments, the flexible strip line 8 between 3K and 300K refrigeration layers is integrally designed with Cu flexible strip lines, and the flexible strip line 8 between 20mK and 3K refrigeration layers is integrally designed with Nb-Ti superconducting flexible strip lines.
In some embodiments, the flexible strip line 8 between the 20mK and 300K refrigerating layers is integrally designed by adopting a niobium-titanium superconducting flexible strip line.
As shown in fig. 6, which is a cross-sectional view of the flexible strip line, the flexible strip line 8 includes an upper and lower outermost protective layer 81, an upper and lower secondary protective layer 82, an upper and lower insulating layer 83, and a central conductor 84 of one intermediate layer, and when the flexible strip line is embodied, the gap between the central conductors 84 is 0.93 to 0.97mm. In a specific design, the total width of the flexible strip line 8 reaches 38-39mm, and the flexible strip line can smoothly pass through holes of phi 40mm or more of a large cold plate of a refrigerator.
As shown in fig. 8, in the present embodiment, the heat sink unit 7 includes two semicircular cold plates 15. The two are fixedly connected by adopting an elastic pressing structure, and the flexible strip line is inserted in the pressing gap. The screws are locked to form pressure, so that the cold plate 15 is in good thermal contact with the flexible strip line, the temperature of the strip line is reduced, and in addition, the whole cold plate adopts an oxygen-free copper gold plating process.
In this embodiment, the infrared filter connection module includes an infrared filter 11 electrically connected to two paths of flexible strip lines located at the bottom of the 20mK refrigeration layer, the infrared filter 11 is plugged with the chip packaging box 13 through a pair of second socket assemblies 12, and the structure of the second socket assemblies 12 is the same as the overall structure of the first socket assembly.
In summary, the flexible banded low-temperature superconducting coaxial line interconnection system designed by the invention realizes a high-density microwave measurement and control link through the whole layout from the adapter plate of the room temperature measurement and control integrated machine to the quantum computer chip packaging box, thereby realizing the multi-core integral insertion and combination, simplifying the assembly and disassembly processes, improving the reliability of the connection point, and effectively improving the stability and reliability of signal transmission.
The above examples are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solution of the present invention should fall within the scope of protection defined by the claims of the present invention without departing from the spirit of the present invention.
Claims (10)
1. A flexible tape-like cryogenic superconducting coaxial line interconnect system, comprising:
the multi-core airtight microwave interconnection module is positioned on the room temperature layer and is used for being connected with the quantum computing measurement and control system (3);
the infrared filter module is positioned below the 20mK layer and used for being connected with the chip packaging box;
and the strip line microwave interconnection module is positioned in the environment of the refrigerator system and has a temperature range of 20 mK-300K layers and is used for connecting the multi-core airtight microwave interconnection module and the infrared filtering module.
2. The flexible tape-like low temperature superconducting coaxial line interconnect system of claim 1, wherein the multi-core hermetic microwave interconnect module includes a pair of first row socket assemblies and a hermetic microwave integrated module coupled to the pair of first row socket assemblies;
one end of the first row of plug assemblies is connected with the sealed microwave integrated module, and the other end of the first row of plug assemblies is connected with the quantum computing measurement and control system (3);
the first row of power strip assembly comprises a row of power strip shell (1) and a miniature radio frequency connector (2) arranged on the row of power strip shell (1);
the sealed microwave integrated module comprises a first attenuator module (4) and a sealing flange (5);
the first attenuator module (4) is mounted on a sealing flange (5);
the first attenuator module (4) is connected with the miniature radio frequency connector (2).
3. The flexible stripline low temperature superconducting coaxial line interconnection system of claim 2, wherein the stripline microwave interconnection module comprises a plurality of layers of interconnection modules connected end to end in sequence;
the multi-layer interconnection modules are respectively arranged on a cold disc (6) of a 20 mK-300K refrigerating layer;
the interconnection module comprises a flexible strip line (8), a heat sink unit (7) arranged on each layer of cold disc (6), and a flexible strip-shaped low-temperature coaxial line component arranged in at least a 20mK layer of refrigerating layer;
the flexible strip line (8) sequentially passes through each refrigerating layer and a heat sink unit (7) arranged on each refrigerating layer, the top end of the flexible strip line passes through the sealing flange (5) to be connected with the first attenuator module (4), and the tail end of the flexible strip line is connected with the infrared filtering module;
the middle section of the flexible strip line (8) is connected with a flexible strip low-temperature coaxial line component;
the flexible ribbon-shaped low-temperature coaxial line assembly comprises a second attenuator module (10) and a high-density connector (9) which are connected with each other;
the second attenuator module (10) is assembled with the heat sink unit (7);
and in the refrigerating layer provided with the banded flexible low-temperature coaxial line component, one end of the flexible banded line (8) is connected with the high-density connector (9), and the other end is connected with the second attenuator module (10) to form a closed loop.
4. A flexible tape-like low temperature superconducting coaxial wire interconnection system according to claim 3, wherein the high density connector (9) comprises a plurality of rows of holes arranged in parallel; the plurality of rows of parallel arranged hole sites comprise a plurality of rows of single-row hole sites (101); a row of double row hole sites (102) are arranged in a gap between every two rows of single row hole sites (101); a plurality of groups of pin columns (103) connected in a gap between the single row hole sites (101) and the double row hole sites (102) are arranged at the connection part of the flexible strip line (8) and the high-density connector (9); leads with the number matched with that of the holes of the corresponding row are arranged at the two ends of each group of pin columns (103).
5. The flexible strip-shaped low-temperature superconducting coaxial line interconnection system according to claim 4, wherein the flexible strip line (8) between 3K and 300K refrigerating layers is integrally designed by adopting a Cu flexible strip line; the flexible strip line (8) between the 20 mK-3K refrigerating layers adopts the integral design of the niobium-titanium superconducting flexible strip line.
6. The flexible strip-shaped low-temperature superconducting coaxial line interconnection system according to claim 4, wherein the flexible strip lines (8) between the 20 mK-300K refrigeration layers are all integrally designed by adopting niobium-titanium superconducting flexible strip lines.
7. The flexible tape-shaped low-temperature superconducting coaxial line interconnection system according to claim 5 or 6, wherein the flexible tape-shaped line (8) comprises an outermost upper and lower protective layer (81), a sub-outer upper and lower shield layer (82), an upper and lower insulating layer (83), and a central conductor (84) of one layer in between.
8. The flexible tape-like low temperature superconducting coaxial line interconnection system according to claim 7, wherein the center conductors (84) are uniformly distributed.
9. The flexible tape-like low temperature superconducting coaxial line interconnection system according to claim 8, wherein the infrared filter connection module comprises an infrared filter (11); the infrared filter (11) is connected with the chip packaging box (13) through a pair of second row plug assemblies (12).
10. Flexible tape-like low temperature superconducting coaxial line interconnection system according to claim 9, characterized in that the heat sink unit (7) comprises two semicircular cold plates (14); the two are fixedly connected by adopting an elastic pressing structure; the flexible strip line is inserted in the pressing slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311815901.1A CN117748078A (en) | 2023-12-27 | 2023-12-27 | Flexible banded low-temperature superconducting coaxial line interconnection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311815901.1A CN117748078A (en) | 2023-12-27 | 2023-12-27 | Flexible banded low-temperature superconducting coaxial line interconnection system |
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| Publication Number | Publication Date |
|---|---|
| CN117748078A true CN117748078A (en) | 2024-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311815901.1A Pending CN117748078A (en) | 2023-12-27 | 2023-12-27 | Flexible banded low-temperature superconducting coaxial line interconnection system |
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| CN (1) | CN117748078A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111191790A (en) * | 2018-10-29 | 2020-05-22 | 华为技术有限公司 | Quantum bit control device |
| CN116029383A (en) * | 2023-01-16 | 2023-04-28 | 合肥本源量子计算科技有限责任公司 | Direct current interconnection module for dilution refrigerator |
| CN116709638A (en) * | 2023-08-03 | 2023-09-05 | 合肥国家实验室 | Bus for superconducting quantum computer system |
| US20230409944A1 (en) * | 2021-10-14 | 2023-12-21 | Quantum Circuits, Inc. | Interface between Cryogenic Computational Hardware and Room Temperature Computational Hardware |
-
2023
- 2023-12-27 CN CN202311815901.1A patent/CN117748078A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111191790A (en) * | 2018-10-29 | 2020-05-22 | 华为技术有限公司 | Quantum bit control device |
| US20230409944A1 (en) * | 2021-10-14 | 2023-12-21 | Quantum Circuits, Inc. | Interface between Cryogenic Computational Hardware and Room Temperature Computational Hardware |
| CN116029383A (en) * | 2023-01-16 | 2023-04-28 | 合肥本源量子计算科技有限责任公司 | Direct current interconnection module for dilution refrigerator |
| CN116709638A (en) * | 2023-08-03 | 2023-09-05 | 合肥国家实验室 | Bus for superconducting quantum computer system |
Non-Patent Citations (1)
| Title |
|---|
| 汪冰等: "浅谈超导量子比特封装与互连技术的研究进展", 《电子与封装》, vol. 23, no. 10, 20 October 2023 (2023-10-20), pages 100207 - 3 * |
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