CN117727527A - Magnetic semi-fluid composition and inductor - Google Patents
Magnetic semi-fluid composition and inductor Download PDFInfo
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- CN117727527A CN117727527A CN202311798241.0A CN202311798241A CN117727527A CN 117727527 A CN117727527 A CN 117727527A CN 202311798241 A CN202311798241 A CN 202311798241A CN 117727527 A CN117727527 A CN 117727527A
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- Prior art keywords
- magnetic
- anhydride
- powder
- fluid composition
- silane
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- 239000012530 fluid Substances 0.000 title claims abstract description 76
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 239000006247 magnetic powder Substances 0.000 claims abstract description 50
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 45
- 239000002270 dispersing agent Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 238000004381 surface treatment Methods 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims description 40
- -1 polyoxyethylene Polymers 0.000 claims description 38
- 239000007822 coupling agent Substances 0.000 claims description 25
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 21
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 18
- 238000005266 casting Methods 0.000 claims description 16
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 14
- 150000008064 anhydrides Chemical class 0.000 claims description 14
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- 229910000519 Ferrosilicon Inorganic materials 0.000 claims description 8
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 claims description 7
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 7
- 125000000129 anionic group Chemical group 0.000 claims description 7
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 4
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 claims description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 claims description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 claims description 3
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 claims description 3
- PBODPHKDNYVCEJ-UHFFFAOYSA-M 1-benzyl-3-dodecyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCN1C=C[N+](CC=2C=CC=CC=2)=C1C PBODPHKDNYVCEJ-UHFFFAOYSA-M 0.000 claims description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 3
- RUFZNDNBXKOZQV-UHFFFAOYSA-N 2,3-dihydro-1h-pyrrolo[1,2-a]benzimidazole Chemical compound C1=CC=C2N(CCC3)C3=NC2=C1 RUFZNDNBXKOZQV-UHFFFAOYSA-N 0.000 claims description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 claims description 3
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 claims description 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 3
- RJIQELZAIWFNTQ-UHFFFAOYSA-N 2-phenyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.C1=CNC(C=2C=CC=CC=2)=N1 RJIQELZAIWFNTQ-UHFFFAOYSA-N 0.000 claims description 3
- BKCCAYLNRIRKDJ-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1CCN=C1C1=CC=CC=C1 BKCCAYLNRIRKDJ-UHFFFAOYSA-N 0.000 claims description 3
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 3
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 3
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 claims description 3
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 claims description 3
- ZPZDIFSPRVHGIF-UHFFFAOYSA-N 3-aminopropylsilicon Chemical compound NCCC[Si] ZPZDIFSPRVHGIF-UHFFFAOYSA-N 0.000 claims description 3
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 3
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 claims description 3
- RDKXOOCTKMIEGS-UHFFFAOYSA-N [SiH4].NC(O)=O Chemical compound [SiH4].NC(O)=O RDKXOOCTKMIEGS-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 3
- 125000005907 alkyl ester group Chemical group 0.000 claims description 3
- 150000005215 alkyl ethers Chemical class 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 3
- 150000003863 ammonium salts Chemical class 0.000 claims description 3
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 3
- 125000002091 cationic group Chemical group 0.000 claims description 3
- LJQOTKFLOZZVML-UHFFFAOYSA-N chloryl chlorate Chemical compound O=[Cl](=O)O[Cl](=O)=O LJQOTKFLOZZVML-UHFFFAOYSA-N 0.000 claims description 3
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 125000005375 organosiloxane group Chemical group 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 3
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 claims description 3
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 claims description 3
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 3
- 229940082004 sodium laurate Drugs 0.000 claims description 3
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 claims description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 3
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000005270 trialkylamine group Chemical group 0.000 claims description 3
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002383 tung oil Substances 0.000 claims description 3
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 239000005007 epoxy-phenolic resin Substances 0.000 claims description 2
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- 229920002050 silicone resin Polymers 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
- 239000011863 silicon-based powder Substances 0.000 claims 1
- 238000004512 die casting Methods 0.000 abstract description 11
- 239000000696 magnetic material Substances 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 57
- 238000003756 stirring Methods 0.000 description 17
- 229910002796 Si–Al Inorganic materials 0.000 description 13
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 12
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- 238000012986 modification Methods 0.000 description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
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- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
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- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Soft Magnetic Materials (AREA)
Abstract
The invention discloses a magnetic semi-fluid composition and an inductor adopting the magnetic semi-fluid composition. The magnetic semi-fluid composition comprises the following components in percentage by mass: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent. In combination with the specific embodiment, the magnetic semi-fluid composition has lower viscosity and higher fluidity compared with the traditional magnetic semi-fluid, so that the inductor magnetic core can be prepared by curing after pouring without die casting. Compared with the traditional scheme, the magnetic semi-fluid composition does not need die casting when preparing an inductance magnetic core, and the problems that insulation layers on the surfaces of soft magnetic materials and/or coils are damaged and the coils are broken due to the fact that high pressure is applied to the magnetic semi-fluid composition and/or the coils are avoided.
Description
Technical Field
The invention relates to the field of magnetic electronic components, in particular to a magnetic semi-fluid composition and an inductor.
Background
An inductance is a component that can convert electric energy into magnetic energy and store the magnetic energy; the characteristic of preventing the passage of the alternating current and allowing the smooth passage of the direct current is that the higher the frequency is, the higher the coil impedance is. The inductance of the inductor is mainly determined by the number of turns (turns) of the coil, the winding mode, whether the magnetic core exists or not, the material of the magnetic core and the like. The inductor is used for stabilizing the current in the circuit and achieving the effect of filtering noise, and the inductor is similar to the capacitor in that the capacitor is used for storing and releasing electric energy in the circuit to regulate the stability of the current, and compared with the capacitor which is used for storing electric energy in the form of an electric field (charge), the inductor is used for achieving the effect of a magnetic field.
In the production process of the inductor, the soft magnetic material is used as a magnetic core raw material to play an important role.
Because the fluidity of the soft magnetic material is poor, in order to ensure the compact structure of the prepared magnetic structure, the inductor is generally prepared by adopting a die-casting integrated forming process, and the prepared integrated inductor has the advantages of firmness, magnetic circuit sealing, good magnetic shielding performance, good EMI performance and the like, and also has the characteristics of low loss and low impedance, and is suitable for high-power and high-current circuits.
However, when the soft magnetic material is used to prepare the inductor by adopting the die-casting integrated molding process, a high pressure needs to be applied to the soft magnetic material and/or the coil, in the process, the insulating layer on the surface of the soft magnetic material and/or the coil is damaged, and in the case of a thinner wire, the problem of wire breakage is easy to occur.
Disclosure of Invention
Based on this, it is necessary to provide a magnetic semi-fluid composition that can solve the above-mentioned problems.
In addition, it is also necessary to provide an inductor employing the magnetic semi-fluid composition described above.
A magnetic semi-fluid composition comprising, in mass percent: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent.
In one embodiment, the surface-treated soft magnetic powder has a mass percentage of 92% to 98%, and the total mass percentage of the resin, the curing agent, and the dispersing agent is 4% to 8%.
In one embodiment, the resin is selected from at least one of epoxy, phenol, naphthol, silicone, modified epoxy, phenolic, and polyimide;
the curing agent is at least one selected from amine curing agents, imidazole curing agents and anhydride curing agents;
the dispersant is at least one selected from anionic dispersants and nonionic dispersants.
In one embodiment, the amine curing agent is selected from at least one of trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyl dimethylamine, 2,4, 6-tris (dimethylaminomethyl) phenol, 1, 8-diazabicyclo [5.4.0] undecene and the like, preferably 4-dimethylaminopyridine and 1, 8-diazabicyclo [5.4.0] undecene;
the imidazole curing agent is selected from 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2 '-methylimidazolyl- (1') ] -ethyl-s triazine, 2, 4-diamino-6- [2 '-undecylimidazolyl- (1') ] -ethyl-s triazine, 2, 4-diamino-6- [2 '-methyl-4' -undecylimidazole- (1 ') ] -ethyl-s triazine, and 2, 4-diamino-6- [2' -methyl-4 '-methyl-2' -undecylidine ] -ethyl-s triazine At least one of 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline;
the anhydride curing agent is at least one selected from phthalic anhydride, 4-methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, polysebacic anhydride, chloric anhydride, tetrabromophthalic anhydride, tetrachlorophthalic anhydride, diphenyl ether tetracarboxylic dianhydride, tung oil anhydride, methylnadic anhydride, cyclopentanetetraoic dianhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride;
the anionic dispersing agent is at least one selected from sodium dodecyl benzene sulfonate, sodium laurate and ammonium salt of polyoxyethylene alkyl ether sulfate;
the nonionic dispersant is at least one selected from the group consisting of an organosiloxane-based dispersant, acetylene glycol (acetyleneglycol), polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkylphenyl ether, polyoxyethylene alkylamine, and polyoxyethylene alkylamide.
In one embodiment, the surface-treated soft magnetic powder is a coupling agent surface-treated soft magnetic powder;
in the soft magnetic powder subjected to the surface treatment of the coupling agent, the mass ratio of the coupling agent to the soft magnetic powder is 1-8: 100.
in one embodiment, the soft magnetic powder is at least one of ferrosilicon powder, ferrosilicon chromium powder, ferrosilicon aluminum powder, nickel iron powder, ferrocobalt powder, ferrite powder, amorphous alloy powder and nanocrystalline alloy powder;
the coupling agent is a silane coupling agent.
In one embodiment, the silane coupling agent is selected from at least one of vinyl silane, methacryloxy silane, epoxy silane, mercapto silane, amino silane, ureido silane, amido silane, aminocarboxylate silane, aminopropyl silane, aryl silane, and cationic silane.
An inductor comprising a coil and a magnetic core, said magnetic core being made by casting, curing and shaping the magnetic semi-fluid composition according to any one of claims 1 to 7.
In one embodiment, the inductor further comprises a housing, the coil and the magnetic core being disposed within the housing.
In one embodiment, the magnetic semi-fluid composition is cast, cured and formed at a curing temperature of 80 ℃ to 150 ℃;
the coil is integrally located inside the magnetic core.
The magnetic semi-fluid composition comprises the following components in percentage by mass: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent. In combination with the specific embodiment, the magnetic semi-fluid composition has lower viscosity and higher fluidity compared with the traditional magnetic semi-fluid, so that the inductor magnetic core can be prepared by curing after pouring without die casting.
Compared with the traditional scheme, the magnetic semi-fluid composition can be used for preparing the inductance magnetic core only by pouring and curing, and the problem that insulation layers on the surfaces of soft magnetic materials and/or coils are damaged and the coils are broken due to the fact that high pressure is applied to the magnetic semi-fluid composition and/or the coils is not needed to be used for die casting.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
fig. 1 is a schematic structural diagram of an inductor according to an embodiment.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention discloses a magnetic semi-fluid composition in an embodiment, which comprises the following components in percentage by mass: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent.
After the soft magnetic powder is subjected to surface treatment, the interfacial affinity of the powder, the mixture of the resin, the curing agent and the dispersing agent can be improved, the dispersibility and the filling uniformity of the powder are improved, the fluidity of the magnetic semi-fluid is improved, the density of a finished product of the magnetic semi-fluid after curing is improved, and the inductance value of the inductor is improved.
The curing agent is used to cure the resin at high temperature, and the dispersing agent can improve the dispersibility of the magnetic semi-fluid composition.
The curing agent generally includes a resin curing agent having a function of curing a high-temperature resin and a curing accelerator having a function of accelerating a curing speed of the high-temperature resin. The curing accelerator may be used alone, and is usually used in combination with a resin curing agent.
The magnetic semi-fluid composition comprises the following components in percentage by mass: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent. In combination with the specific embodiment, the magnetic semi-fluid composition has lower viscosity and higher fluidity compared with the traditional magnetic semi-fluid, so that the inductor magnetic core can be prepared by curing after pouring without die casting.
Compared with the traditional scheme, the magnetic semi-fluid composition can be used for preparing the inductance magnetic core only by pouring and curing, and the problem that insulation layers on the surfaces of soft magnetic materials and/or coils are damaged and the coils are broken due to the fact that high pressure is applied to the magnetic semi-fluid composition and/or the coils is not needed to be used for die casting.
The higher the content of the soft magnetic powder subjected to the surface treatment, the higher the viscosity of the magnetic semi-fluid, and the poorer the mechanical strength of the cured product. In the invention, the addition of the dispersing agent in the magnetic semi-fluid can reduce the viscosity. Therefore, even if the content of the magnetic powder is large, the increase in viscosity of the magnetic semi-fluid can be suppressed, and the mechanical strength of the cured product can be further improved.
The flowability parameters of the magnetic semi-fluids of the present invention are characterized by apparent viscosity. In general, the viscosity of the magnetic semi-fluid of the present invention ranges from 10PaS to 200PaS at 25 ℃.
Preferably, in the present embodiment, the surface-treated soft magnetic powder has a mass percentage of 92% to 98%, and the total mass percentage of the resin, the curing agent, and the dispersing agent is 4% to 8%.
The preferred viscosity range of the magnetic semi-fluid of the present invention is 20PaS to 100PaS at 25 ℃.
Preferably, in the present invention, the resin is at least one selected from the group consisting of epoxy resin, phenol resin, naphthol resin, silicone resin, modified epoxy resin, phenolic resin and polyimide.
Preferably, in the present invention, the curing agent is at least one selected from the group consisting of amine curing agents, imidazole curing agents and acid anhydride curing agents.
Specifically, the amine curing agent is at least one selected from the group consisting of trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4, 6-tris (dimethylaminomethyl) phenol, 1, 8-diazabicyclo [5.4.0] undecene and the like, preferably 4-dimethylaminopyridine and 1, 8-diazabicyclo [5.4.0] undecene.
Particularly preferred amine curing agents are at least one of 4-dimethylaminopyridine, 1, 8-diazabicyclo [5.4.0] undecene.
Specifically, the imidazole curing agent is selected from the group consisting of 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2' -methylimidazolyl- (1 ') ] -ethyl-s triazine, 2, 4-diamino-6- [2' -undecylimidazolyl- (1 ') ] -ethyl-s triazine, 2, 4-diamino-6- [2' -methyl-4 ' -imidazolyl- (1 ') ] -ethyl-s triazine, and 2, 4-diamino-6 ' -methyl-6 ' -imidazolyl- (1 ') ] -ethyl-s triazine, and 1-cyanoethyl-2 ' -methyl-2-3-d-n-methylimidazole At least one of 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline and 2-phenylimidazoline.
Particularly preferably, the imidazole curing agent is at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4, 5-dihydroxymethylimidazole.
Specifically, the anhydride curing agent is one or more selected from phthalic anhydride, 4-methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, glycerol trimellitate, polyazelaic anhydride, polysebacic anhydride, chloric anhydride, tetrabromophthalic anhydride, tetrachlorophthalic anhydride, diphenyl ether tetracarboxylic dianhydride, tung oil anhydride, methylnadic anhydride, cyclopentanetetraoic acid dianhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride. Preferably at least one of methyl hexahydrophthalic anhydride and 4-methyl tetrahydrophthalic anhydride.
Particularly preferably, the acid anhydride curing agent is at least one of methyl hexahydrophthalic anhydride and 4-methyl tetrahydrophthalic anhydride.
Preferably, in the present invention, the dispersant is at least one selected from anionic dispersants and nonionic dispersants.
In general, in the present invention, the dispersant is preferably an anionic dispersant.
The dispersant may be used singly or two or more kinds may be used in combination.
Specifically, the anionic dispersant is at least one selected from the group consisting of sodium dodecylbenzenesulfonate, sodium laurate and ammonium salts of polyoxyethylene alkyl ether sulfate.
Specifically, the nonionic dispersant is at least one selected from the group consisting of an organosiloxane-based dispersant, an acetylene glycol (acetyleneglycol), a polyoxyethylene alkyl ether, a polyoxyethylene alkyl ester, a polyoxyethylene sorbitan fatty acid ester, a polyoxyethylene alkylphenyl ether, a polyoxyethylene alkylamine, and a polyoxyethylene alkylamide.
Preferably, in the present embodiment, the soft magnetic powder subjected to the surface treatment is a soft magnetic powder subjected to a surface treatment with a coupling agent.
The soft magnetic powder subjected to the surface treatment of the coupling agent can be prepared by adopting dry modification treatment, and the dry modification treatment process is characterized in that particles are dispersed in a dry state, and the coupling agent is sprayed to enable the coupling agent to be adsorbed on the surfaces of the particles at a certain temperature to finish the surface modification treatment of the particles.
Specifically, the preparation method of the soft magnetic powder subjected to the surface treatment of the coupling agent comprises the following steps: spraying the coupling agent solution into the soft magnetic powder in a stirring state by spraying, and fully stirring to obtain the soft magnetic powder subjected to the surface treatment of the coupling agent.
Wherein the stirring speed is 100 rpm-500 rpm, preferably 300rpm; the spraying pressure is 0.2 Mpa-0.8 Mpa, preferably 0.6Mpa; the stirring time is 30 min-120 min, preferably 60min.
Specifically, in the soft magnetic powder subjected to the surface treatment of the coupling agent, the mass ratio of the coupling agent to the soft magnetic powder is 1-8: 100.
more preferably, in the present embodiment, the mass ratio of the coupling agent to the soft magnetic powder is 3 to 6:100.
in this embodiment, the soft magnetic powder is preferably spherical soft magnetic powder.
Specifically, the soft magnetic powder is at least one of ferrosilicon powder, ferrosilicon chromium powder, ferrosilicon aluminum powder, nickel iron powder, ferrocobalt powder, ferrite powder, amorphous alloy powder and nanocrystalline alloy powder.
Preferably, the coupling agent is a silane coupling agent. The silane coupling agent is adopted to carry out surface treatment on the soft magnetic powder, so that the fluidity of the powder can be increased, the density of a finished product of the magnetic semi-fluid after solidification can be improved, and the inductance value of the inductor can be improved.
Specifically, the silane coupling agent is at least one selected from the group consisting of vinyl silane, methacryloxy silane, epoxy silane, mercapto silane, amino silane, ureido silane, amido silane, aminocarboxylate silane, aminopropyl silane, aryl silane, and cationic silane.
Referring to fig. 1, the invention also discloses an inductor according to an embodiment, which comprises a coil 10 and a magnetic core 20, wherein the magnetic core 20 is made by casting, curing and molding the magnetic semi-fluid composition.
In this embodiment, the coil is a flat coil or a round coil, and the outside of the coil is insulated. The insulating treatment can be in various modes such as coating, cladding, gluing, plastic dipping, electroplating and the like.
Referring to the drawings, in this embodiment, the inductor further includes a housing 30, and the coil 10 and the magnetic core 20 are disposed in the housing 30.
In another embodiment, the inductor may not include the case 30, and the coil 10 may be integrally provided inside the core 20.
In the present embodiment, the housing 30 is a plastic housing or an insulated metal housing. The insulating treatment can be in various modes such as coating, cladding, gluing, plastic dipping, electroplating and the like.
In this embodiment, the coil 10 is integrally located inside the magnetic core 20, and the coil 10 and the magnetic core 20 formed by solidification of the magnetic semi-fluid form a unitary structure.
Preferably, in the operation of casting, curing and forming the magnetic semi-fluid composition, the curing temperature is 80-150 ℃.
Preferably, the magnetic semi-fluid composition is cast cured to form a gradient heat cure. Specifically, gradient heat curing may be: curing at 80 ℃ for 0.5h, curing at 120 ℃ for 0.5h, and curing at 150 ℃ for 0.5h.
The inductor has the characteristics of high magnetic conductivity, high saturation current, excellent voltage resistance and the like, and can be widely applied to inverters such as photovoltaics, charging piles, air conditioners and the like.
The following are specific examples.
Wherein, the Fe-Si-Al magnetic powder is self-made powder, and the preparation process is as follows: the used gas atomized ferro-silicon aluminum powder (D50 diameter is 20 mu m, si content is 9.0-9.8%, al content is 5.0-5.8%) and purity is above 99%.
Wherein the insulating binder used in the insulating coating process comprises potassium dichromate, boric acid, acetone, mica powder (400 meshes), sodium silicate and Al 2 O 3 (400 meshes), zinc stearate and the like, and the raw materials are all analytically pure. The specific experimental process is as follows: mixing the gas atomization Fe-Si-Al powder according to the mass ratio of 3:1:1. Preparing a solution from potassium dichromate, boric acid and acetone according to the volume ratio of 5:1:100, adding a proper amount of the solution into the Fe-Si-Al powder, stirring for 0.5h at 65 ℃, and drying. And adding a proper amount of solution prepared from sodium silicate and pure ethanol, mica powder and Alzheimer 3 powder, uniformly mixing, and drying at 100 ℃.
Coupling agent KH-1771 and coupling agent KH-560 are available from Dow Corning, epoxy resin 828 and epoxy resin 2021P are available from Daicel, bisphenol F resin 830 is available from Hexion, curing agent 2P4MZ and curing agent 4-methyltetrahydrophthalic anhydride are available from Sitting chemical industry, and dispersant RS-710 is available from Toho chemical industry.
Example 1
1) Powder surface treatment:
(1) Adding 100g of Fe-Si-Al magnetic powder into a powder processor, and starting stirring at a stirring speed of 300rpm;
(2) Adding 5g of coupling agent KH-1771 into a spray container, starting spraying, and setting the spraying pressure to 0.6Mpa;
(3) Stirring for 60min to obtain the surface-treated magnetic powder.
2) Preparation of magnetic semi-fluid:
(1) 100g of surface-treated Fe-Si-Al magnetic powder, 4g of epoxy resin 828, 2g of bisphenol F resin 830, 1g of curing agent 2P4MZ and 1g of dispersing agent RS-710 are added into a stirrer with a dispersing disc, and fully and uniformly stirred;
(2) And grinding the stirred magnetic semi-fluid for 3 times by using a three-roller grinder to prepare the magnetic semi-fluid.
3) And (3) inductance preparation:
(1) Placing a coil into an inductor housing;
(2) Casting the prepared magnetic semi-fluid into an inductor shell, covering all coils, curing the cast integral structure at 80 ℃ for 0.5h, at 100 ℃ for 0.5h, and at 120 ℃ for 0.5h to obtain the high saturation current inductor.
Example 2
1) Powder surface treatment:
(1) Adding 100g of Fe-Si-Al magnetic powder into a powder processor, and starting stirring at a stirring speed of 300rpm;
(2) Adding 5g of coupling agent KH-1771 into a spray container, starting spraying, and setting the spraying pressure to 0.6Mpa;
(3) Stirring for 60min to obtain the surface-treated magnetic powder.
2) Preparation of magnetic semi-fluid:
(1) 100g of surface-treated Fe-Si-Al magnetic powder, 4g of epoxy resin 2021P, 2g of bisphenol F resin 830, 1g of curing agent 2P4MZ and 1g of dispersing agent RS-710 are added into a stirrer with a dispersing disc, and fully and uniformly stirred;
(2) And grinding the stirred magnetic semi-fluid for 3 times by using a three-roller grinder to prepare the magnetic semi-fluid.
3) And (3) inductance preparation:
(1) Placing the coil into a casting mold or an inductor housing;
(2) Casting the prepared magnetic semi-fluid into a grinding tool or an inductor shell, covering all coils, and curing the cast integral structure at 80 ℃ for 0.5h, at 100 ℃ for 0.5h and at 120 ℃ for 0.5h to obtain the high saturation current inductor.
Example 3
1) Powder surface treatment:
(1) Adding 100g of Fe-Si-Al magnetic powder into a powder processor, and starting stirring at a stirring speed of 300rpm;
(2) Adding 5g of coupling agent KH-1771 into a spray container, starting spraying, and setting the spraying pressure to 0.6Mpa;
(3) Stirring for 60min to obtain the surface-treated magnetic powder.
2) Preparation of magnetic semi-fluid:
(1) 100g of surface-treated Fe-Si-Al magnetic powder, 2g of epoxy resin 828, 1g of bisphenol F resin 830, 4g of curing agent 4-methyltetrahydrophthalic anhydride and 1g of dispersing agent RS-710 are added into a stirrer with a dispersing disc, and fully and uniformly stirred;
(2) And grinding the stirred magnetic semi-fluid for 3 times by using a three-roller grinder to prepare the magnetic semi-fluid.
3) And (3) inductance preparation:
(1) Placing the coil into a casting mold or an inductor housing;
(2) Casting the prepared magnetic semi-fluid into a grinding tool or an inductor shell, covering all coils, and curing the cast integral structure at 80 ℃ for 0.5h, at 120 ℃ for 0.5h and at 150 ℃ for 0.5h to obtain the high saturation current inductor.
Example 4
1) Powder surface treatment:
(1) Adding 100g of Fe-Si-Al magnetic powder into a powder processor, and starting stirring at a stirring speed of 300rpm;
(2) Adding 5g of coupling agent KH-560 into a spraying container, starting spraying, and setting the spraying pressure to 0.6Mpa;
(3) Stirring for 60min to obtain the surface-treated magnetic powder.
2) Preparation of magnetic semi-fluid:
(1) 100g of surface-treated Fe-Si-Al magnetic powder, 2g of epoxy resin 828, 1g of bisphenol F resin 830, 0.5g of curing agent 2P4MZ and 0.5g of dispersing agent RS-710 are added into a stirrer with a dispersing disc, and fully and uniformly stirred;
(2) And grinding the stirred magnetic semi-fluid for 3 times by using a three-roller grinder to prepare the magnetic semi-fluid.
3) And (3) inductance preparation:
(1) Placing the coil into a casting mold or an inductor housing;
(2) Casting the prepared magnetic semi-fluid into a grinding tool or an inductor shell, covering all coils, and curing the cast integral structure at 80 ℃ for 0.5h, at 120 ℃ for 0.5h and at 150 ℃ for 0.5h to obtain the high saturation current inductor.
Comparative example 1
1) Preparation of magnetic semi-fluid:
(1) 100g of non-surface-treated Fe-Si-Al magnetic powder, 4g of epoxy resin 828, 2g of bisphenol F resin 830, 1g of curing agent 2P4MZ and 1g of dispersing agent RS-710 are added into a stirrer with a dispersing disc, and fully and uniformly stirred;
(2) And grinding the stirred magnetic semi-fluid for 3 times by using a three-roller grinder to prepare the magnetic semi-fluid.
2) And (3) inductance preparation:
(1) Placing the coil into a casting mold or an inductor housing;
(2) Casting the prepared magnetic semi-fluid into a grinding tool or an inductor shell, covering all coils, and curing the cast integral structure at 80 ℃ for 0.5h, at 120 ℃ for 0.5h and at 150 ℃ for 0.5h to obtain the inductor.
Comparative example 2: die casting process for preparing inductor
Preparing a magnetic powder core: adding 0.3g zinc stearate into 100g Fe-Si-Al powder, mixing thoroughly, pressing into ring shape with pressure of 1.8X10 9 Pa。
Annealing: putting the pressed iron-silicon-aluminum powder core into a tube furnace, and adding the iron-silicon-aluminum powder core into N 2 Heat treatment is performed under an atmosphere. The heat treatment process parameters are as follows: heating to 200 ℃ from room temperature at a heating rate of 5 ℃/min, and preserving heat for 1h at 200 ℃; then heating to 700 ℃ at a heating rate of 5 ℃/min, preserving heat at 700 ℃ for 40min, and finally cooling with a furnace.
And (5) dipping the surface of the magnetic ring with insulating paint to obtain the inductor.
Test case
The magnetic semifluids prepared in examples 1 to 4 and the magnetic semifluid prepared in comparative example 1 were respectively subjected to viscosity tests, and the inductors prepared in examples 1 to 4, the inductor prepared in comparative example 1 and the inductor prepared in comparative example 1 were respectively subjected to Ls tests of 0A and 20A, and the test results are shown in table 1 below.
The viscosity test method comprises the following steps: the apparent viscosity at 25℃was measured using a rotational viscometer.
Inductance Ls test method: and (5) testing by an impedance tester.
TABLE 1
In combination with Table 1, it can be seen that the magnetic semi-fluids prepared in examples 1 to 4 have lower viscosity and higher fluidity than the magnetic semi-fluid prepared in comparative example 1.
Compared with the magnetic semi-fluid prepared in examples 1-3, the magnetic semi-fluid in example 4 still has better fluidity under the condition of increasing the powder content, can meet the casting process, and has higher Ls value.
The magnetic semi-fluid prepared in the comparative example 1 has high viscosity and poor fluidity, and the inductance Ls value obtained by pouring the magnetic semi-fluid prepared in the comparative example 1 is much lower.
In addition, compared with the die-casting inductor prepared in comparative example 2, the inductor prepared by casting the magnetic semi-fluid prepared in examples 1-4 has the obvious advantage that the reduction rate of Ls reduced by 0-20 ALs is far lower than that of the die-casting inductor prepared in comparative example 2.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A magnetic semi-fluid composition characterized by comprising, in mass percent: 85-98% of soft magnetic powder subjected to surface treatment, 1-15% of resin, 0.5-2% of curing agent and 0.5-5% of dispersing agent.
2. A magnetic semi-fluid composition according to claim 1, wherein the surface treated soft magnetic powder has a mass percentage of 92% to 98%, and the total mass percentage of the resin, the curing agent and the dispersing agent is 4% to 8%.
3. The magnetic semi-fluid composition according to claim 1, wherein the resin is at least one selected from the group consisting of epoxy resins, phenol resins, naphthol resins, silicone resins, modified epoxy resins, phenolic resins, and polyimides;
the curing agent is at least one selected from amine curing agents, imidazole curing agents and anhydride curing agents;
the dispersant is at least one selected from anionic dispersants and nonionic dispersants.
4. A magnetic semi-fluid composition according to claim 3, wherein the amine curing agent is selected from at least one of trialkylamines such as triethylamine, tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4, 6-tris (dimethylaminomethyl) phenol, 1, 8-diazabicyclo [5.4.0] undecene, and the like, preferably 4-dimethylaminopyridine and 1, 8-diazabicyclo [5.4.0] undecene;
the imidazole curing agent is selected from 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2 '-methylimidazolyl- (1') ] -ethyl-s triazine, 2, 4-diamino-6- [2 '-undecylimidazolyl- (1') ] -ethyl-s triazine, 2, 4-diamino-6- [2 '-methyl-4' -undecylimidazole- (1 ') ] -ethyl-s triazine, and 2, 4-diamino-6- [2' -methyl-4 '-methyl-2' -undecylidine ] -ethyl-s triazine At least one of 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline;
the anhydride curing agent is at least one selected from phthalic anhydride, 4-methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, polysebacic anhydride, chloric anhydride, tetrabromophthalic anhydride, tetrachlorophthalic anhydride, diphenyl ether tetracarboxylic dianhydride, tung oil anhydride, methylnadic anhydride, cyclopentanetetraoic dianhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride;
the anionic dispersing agent is at least one selected from sodium dodecyl benzene sulfonate, sodium laurate and ammonium salt of polyoxyethylene alkyl ether sulfate;
the nonionic dispersant is at least one selected from the group consisting of an organosiloxane-based dispersant, acetylene glycol (acetyleneglycol), polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkylphenyl ether, polyoxyethylene alkylamine, and polyoxyethylene alkylamide.
5. A magnetic semi-fluid composition according to any one of claims 1 to 4, wherein the surface-treated soft magnetic powder is a coupling agent surface-treated soft magnetic powder;
in the soft magnetic powder subjected to the surface treatment of the coupling agent, the mass ratio of the coupling agent to the soft magnetic powder is 1-8: 100.
6. the magnetic semi-fluid composition according to claim 5, wherein the soft magnetic powder is at least one of a ferro-silicon powder, a ferro-silicon-chromium powder, a ferro-silicon-aluminum powder, a nickel-iron powder, a ferro-cobalt powder, a ferrite powder, an amorphous alloy powder, and a nanocrystalline alloy powder;
the coupling agent is a silane coupling agent.
7. The magnetic semi-fluid composition of claim 6, wherein the silane coupling agent is selected from at least one of vinyl silane, methacryloxy silane, epoxy silane, mercapto silane, amino silane, ureido silane, amido silane, amino carboxylate silane, aminopropyl silane, aryl silane, and cationic silane.
8. An inductor comprising a coil and a magnetic core, said magnetic core being produced by casting, solidifying and molding the magnetic semi-fluid composition according to any one of claims 1 to 7.
9. The inductor of claim 8, further comprising a housing, the coil and the magnetic core each disposed within the housing.
10. The inductor according to claim 8 or 9, wherein the magnetic semi-fluid composition is cast cured at a curing temperature of 80 ℃ to 150 ℃ during the operation of casting the composition;
the coil is integrally located inside the magnetic core.
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| CN202311798241.0A CN117727527A (en) | 2023-12-25 | 2023-12-25 | Magnetic semi-fluid composition and inductor |
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