CN117715370A - Integrated form integrative cooling plate - Google Patents

Abstract

The invention provides an integrated cooling plate, which comprises a main shell and a runner plate assembly, wherein an accommodating space is arranged in the main shell, and a runner groove is formed in one side surface of the main shell; the runner plate assembly is arranged on the runner groove and forms a closed runner of the main shell; the runner plate assembly outside the main shell is provided with a first module, and the accommodating space inside the main shell is provided with a second module. According to the invention, the accommodating space extruded below the cooling plate flow channel is used as a cavity for filling and sealing the capacitor, so that the assembly gaps of the capacitor shell and the capacitor shell are reduced; screw fixing points are eliminated, and compared with a thin plate design and a three-dimensional splicing design, the deformation resistance of the system is greatly improved; meanwhile, the cooling plate and the large capacitor are integrally encapsulated, the gap of the system is compressed, and the overall strength and the heat exchange performance of the system are improved, so that the problem of balance among cost, reliability, compactness and overall rigidity of the cooling plate when the cooling plate is used as a bearing and radiating unit of the power module IGBT is solved.

Description

Integrated form integrative cooling plate

Technical Field

The invention relates to the technical field of thermal management, in particular to an integrated cooling plate.

Background

With the continuous development of new energy automobile markets, manufacturers are increasingly demanding power density improvement of inverters. Meanwhile, with the continuous declining price of new energy automobiles, the control of the inverter cost is also becoming more and more strict. For the inverter itself, the cooling plate acts as a carrying and heat dissipating unit for the first module (IGBT), the reliability and compactness design of which is the design core for the whole inverter product.

The current IGBT cooling plate designs in the market often use the cooling plate as a separate component, and subsequently make structural connection with the second module and other components such as the three-phase copper bar by bolting. The problem with this design approach is that the assembly space between the different components needs to be reserved. In addition, the design space occupation and the production tact of screw fixation do not have sufficient competitiveness in the current high-competition market environment. At present, the design thought of IGBT cooling plate mainly includes sealing washer assembled water-cooling plate structure and punching press board brazing type water-cooling plate structure.

In the sealing ring assembled water cooling plate structure, the whole IGBT cooling plate is divided into an upper layer structure and a lower layer structure, and please refer to fig. 1. The water cooling plate base plate is a die casting, and has the function of forming the basic trend of a water channel, and the external water pipe connector can lead cooling liquid to the bridge and the client; the sealing ring bracket is an injection molding piece, the upper side and the lower side of the sealing ring bracket are provided with mounting sealing rings, and the sealing performance of the whole flow channel is ensured through the compression of the sealing rings; the cooling plate is made of copper, is formed by adopting a cold extrusion process, and is used for bearing the first module and providing a heat dissipation path of the first module; the IGBT pressing plate is a stamping part; finally, the assembly is fixed by screwing. The design has the characteristics of excellent and reliable heat dissipation effect. However, because the structural design adopts various complex processes such as die casting, stamping, injection molding, extrusion and the like, the raw material cost and the die cost of the whole product are high. Moreover, the mounting and matching of different components can cause a plurality of problems such as lifting of the production takt.

In a stamped sheet brazed water cooled sheet structure: referring to fig. 2, the design concept of the cooling plate is to braze several layers of plate-shaped punched aluminum pieces in a laminated manner to form a closed cooling liquid flow channel. The upper cover plate is a flat plate and mainly used for bearing the IGBT module and providing a heat exchange path for the IGBT module; the reinforcing plate and the spoiler are arranged in the water channel, and the main function of the reinforcing plate and the spoiler is to improve the heat exchange coefficient of the whole flow channel, especially the heat dissipation function area of the IGBT; at the same time, the overall rigidity of the cooling plate is enhanced. The runner plate is manufactured by a deep drawing process of an aluminum plate, and forms the basic trend of the water channel; the function of the support plate is to increase the rigidity of the entire cooling plate. Simultaneously, a gluing radiating surface is provided for the large second modules (the cooling plates are fixed between the large second modules by screwing); the water pipe joint is formed through forging or machining process, and is integrated with the runner plate through brazing, so that a customized structure and an interface of an internal cooling liquid loop can be provided. The tightness of the cooling plate is ensured by a brazing process. The cooling plate is fixed with the three-phase copper bar assembly, the large second module, the shell and other internal components in a screw driving mode.

The design thought of the stamping plate brazing type water-cooling plate structure has the remarkable advantages of low raw material cost and simple and reliable connection form between cold plate components. But the disadvantages are also more obvious: the overall stiffness of the water-cooled panels is poor, particularly when the flat panels are subjected to bending loads, and stringent requirements are placed on their bending-resistant design.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, the integrated cooling plate provided by the invention has the advantages that the accommodating space extruded below the cooling plate runner is used as a cavity for filling and sealing the capacitor, so that the assembly gap of the capacitor shell and the capacitor shell is reduced; screw fixing points are eliminated, and compared with a thin plate design and a three-dimensional splicing design, the deformation resistance of the system is greatly improved; meanwhile, the cooling plate and the large capacitor are integrally encapsulated, the gap of the system is compressed, and the overall strength and the heat exchange performance of the system are improved, so that the problem of balance among cost, reliability, compactness and overall rigidity of the cooling plate when the cooling plate is used as a bearing and radiating unit of the power module IGBT is solved.

The invention provides an integrated cooling plate, which comprises a main shell and a runner plate assembly, wherein an accommodating space is arranged in the main shell, and a runner groove is formed in one side surface of the main shell; the runner plate assembly is arranged on the runner groove and forms a closed runner of the main shell; the runner plate assembly outside the main shell is provided with a first module, and the accommodating space inside the main shell is provided with a second module.

In an embodiment of the invention, a potting adhesive is disposed in the accommodating space to fixedly connect the second module and the main housing.

In an embodiment of the invention, the first module is a power module, and the second module is a capacitor.

In an embodiment of the invention, the flow channel groove has a concave structure on the surface of the main housing, and the main housing forms a protrusion in the accommodating space through the concave structure of the flow channel groove.

In an embodiment of the present invention, the runner groove is provided with an interface end extending to protrude from the surface of the main housing, and the interface end is provided with a water channel interface penetrating through the runner groove.

In an embodiment of the invention, the runner plate assembly includes a runner cover plate, an end baffle and a spoiler, wherein the runner cover plate is arranged on the main shell and seals the upper surface of the runner groove; the end baffle is arranged between the main shell and the runner cover plate and seals the side surface of the runner groove between the main shell and the runner cover plate; the spoiler is arranged in the runner groove.

In an embodiment of the invention, a window communicating with the accommodating space is formed on the main housing.

In one embodiment of the present invention, the plurality of windows are disposed on the same side of the surface of the main housing.

In an embodiment of the invention, the window and the runner groove are disposed on the same side surface of the main housing.

In an embodiment of the invention, the interface ends of the window and the runner groove are respectively located on different sides of one side surface of the main housing.

In an embodiment of the present invention, the main housing is further provided with a mounting angle, the mounting angle is disposed on a side surface of the main housing in a circumferential direction of the flow channel groove, and an orientation of the mounting angle is opposite to a surface of the main housing on which the flow channel groove is disposed.

In an embodiment of the invention, solder is disposed between the main housing, the mounting angle, the spoiler, the end baffle and the runner cover plate, and the solder is connected between the main housing, the mounting angle, the spoiler, the end baffle and the runner cover plate in a pre-fixing manner before being welded.

In an embodiment of the invention, the solder comprises a solder layer, solder paste and a solder sheet, wherein the solder layer is arranged on the surface of the runner cover plate facing to one side of the main shell; solder paste is coated on the surfaces of the two sides of the end cover plate facing the runner cover plate and the main shell; the solder sheet is arranged on the surface of the main shell, which is respectively contacted with the spoiler and the mounting angle.

In an embodiment of the invention, the main housing is further provided with a second structural member, and the second structural member and the runner groove are located on a same side surface or a different side surface of the main housing.

In an embodiment of the invention, the main housing and/or the second structural member are integrally formed.

The beneficial effects of the invention are as follows:

1. according to the integrated cooling plate, the extrusion-molded accommodating space below the cooling plate flow channel is used as the cavity for filling and sealing the capacitor, so that the assembly gaps of the capacitor shell and the capacitor shell are reduced, and the space utilization rate is greatly improved; the extrusion shell can be designed in a thin wall mode, the design of a pattern draft angle and a larger round angle is not required to be reserved, and the space utilization rate can be effectively increased; the design of screw fixing points is canceled, the structure is simplified, the fixing position is flexible, and the design of platformization deformation is facilitated.

2. According to the integrated cooling plate, the main shell formed by extrusion of aluminum alloy and the parts formed by stamping are adopted as the cooling plate structure, and the integrated cooling plate is formed at one time by brazing, so that a plurality of complex processes of screwing, pressing, sealing rings and the like are reduced; the structure connection with the IGBT can be realized by cold spraying copper on the runner cover plate and then vacuum vapor phase welding; the extrusion cavity is utilized to directly realize the encapsulation and fixation with the capacitor core, and the installation mode of screw driving between the capacitor plastic shell and the cooling plate in the past is simplified.

3. According to the integrated type integrated cooling plate, the main shell is extruded to be integrally formed, and compared with a thin plate design and a three-dimensional splicing design, the deformation resistance of the system is greatly improved; meanwhile, the cooling plate and the large capacitor are integrally encapsulated, the gap of the system is compressed, and the integral strength is improved; the heat dissipation paths of the IGBT and the large capacitor are not provided with low-heat-conductivity-coefficient media (insulating films, plastic shells and the like), so that the heat exchange efficiency of the system is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art. In the drawings:

FIG. 1 is a schematic view of a prior art cooling plate structure of an assembled waterway design sealed by sealing rings;

FIG. 2 is a schematic diagram of a prior art cooling plate structure formed by stamping a stacked braze of plate-like structures;

FIG. 3 is a schematic view of an integrated cooling plate according to the present invention;

FIG. 4 is a schematic view of a part of an integrated cooling plate according to the present invention at another view angle;

FIG. 5 is a schematic view of a split structure of an integrated cooling plate according to the present invention;

fig. 6 is a schematic structural diagram of distribution of solder in an integrated cooling plate according to the present invention.

In the figure: 10. a first module; 20. a second module; 100. a main housing; 101. a window; 110. an accommodation space; 120. a flow channel groove; 130. an interface end; 131. a waterway interface; 200. a flow conduit plate assembly; 210. a runner cover plate; 220. an end baffle; 230. a spoiler; 300. a mounting angle; 400. a solder; 410. a solder layer; 420. solder paste; 430. a solder sheet; 500. and a second structural member.

Detailed Description

Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the invention is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the invention. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.

Please refer to fig. 3 to fig. 6. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.

Referring to fig. 3 to 5, the present invention provides an integrated cooling plate, which includes a main housing 100 and a runner plate assembly 200, wherein a receiving space 110 is provided in the main housing 100, and a runner groove 120 is provided on a side surface of the main housing 100; the flow channel plate assembly 200 is installed on the flow channel groove 120 and forms a closed flow channel of the main housing 100; the first module 10 is mounted on the flow field plate assembly 200 outside the main housing 100, and the second module 20 is mounted in the receiving space 110 inside the main housing 100.

Further, a potting adhesive is disposed in the accommodating space 110 to fixedly connect the second module 20 with the main housing 100.

Further, the first module 10 is a power module, and the second module 20 is a capacitor.

In the present embodiment, the first and second modules 10 and 20, which are heat sources, are installed at both sides of the flow field plate assembly 200, respectively, so as to be located in the receiving space 110 inside the main housing 100 at one side of the flow field plate assembly 200 and the surface of the flow field plate assembly 200, respectively. Wherein after the second module 20 is mounted in the accommodating space 110, the fixing between the second module 20 and the main housing 100 is achieved by injecting an epoxy potting adhesive with high thermal conductivity into the accommodating space 110.

Specifically, when the cooling plate structure is applied to a new energy automobile, as shown in fig. 3, the first module 10 may be a power module IGBT, and the second module 20 may be a corresponding chip capacitor, and the cooling plate structure is used as a carrying and heat dissipating unit of the power module IGBT, the reliability and compactness of the function are realized by the main housing 100 structure and the closed flow channel formed by the flow channel groove 120 and the flow channel plate assembly 200. Compared with the existing sealing ring assembled water-cooling plate structure and stamping plate brazing water-cooling plate structure, the structure of the multi-layer plate stacking design is replaced by the design of the main shell 100 and the runner plate assembly 200, and the cavity of the extrusion molding main shell 100 below the runner of the cooling plate is used as the accommodating space 110 for capacitor encapsulation, so that the assembly gaps of a capacitor shell and the capacitor shell are reduced, the mode of screw connection and the like is replaced by the fixation of the capacitor of the second module 20, and the space utilization is greatly improved; meanwhile, the extruded main shell 100 can be designed in a thin wall mode, and the design of pattern draft and larger round angles is not required to be reserved, so that the space utilization rate can be effectively increased; is beneficial to the platform design and the product miniaturization design.

It should be noted that, the solution designed in this embodiment not only can be used as a cooling plate and a capacitor-encapsulated cavity of a power module, but also can be used as a heat dissipation and fixing structure of other modules; for example, the cooling plate structure is used directly as an outer housing of a new energy vehicle unit, or as a load bearing structure for certain components inside the unit.

Referring to fig. 3 to 5, in an embodiment, the flow channel groove 120 has a concave structure on the surface of the main housing 100, and the main housing 100 forms a protrusion inside the accommodating space 110 through the concave structure of the flow channel groove 120. The runner groove 120 is provided with a joint end 130 extending to protrude from the surface of the main housing 100, and the joint end 130 is provided with a water channel joint 131 penetrating through the runner groove 120.

Specifically, under the action of the closed flow channel formed by the flow channel groove 120 and the flow channel plate assembly 200, by providing the concave structure of the flow channel groove 120 protruding toward the inner accommodating space 110 on the main housing 100, on one hand, the assembled flow channel plate assembly 200 can be kept flush with the surface of the main housing 100, so that other parts can be further installed on the flow channel plate assembly 200 of the cooling plate structure and the surface of the main housing 100; on the other hand, the concave structure of the flow channel groove 120 protruding toward the inside of the accommodating space 110 increases the contact area with the epoxy potting adhesive therein, improving the heat exchanging performance with respect to the second module 20 in the accommodating space 110 inside the main housing 100. Meanwhile, a bending shape is formed on the surface of the corresponding side of the main housing 100, so that the thin-wall structural strength of the main housing 100 is increased.

Further, the junction end 130 extending to the outside of the main housing 100 along the channel groove 120 serves as an arrangement space of the water channel junction 131, so that in the closed channel formed by the channel plate assembly 200 and the channel groove 120, a heat exchange medium such as cooling water forms a relatively stable fluid state after passing through the water channel junction 131 to enter the region of the channel groove 120 for performing a corresponding heat exchange process.

In this way, the water channel connector 131 is formed at the connector end 130 of the flow channel groove 120, so that corresponding pipelines communicated with the water channel connector 131 can be arranged by using the thickness dimension of the side surface of the main casing 100, and the height dimension of the cooling plate structure is not additionally occupied, thereby facilitating miniaturization of the cooling plate structure.

Referring to fig. 5, in an embodiment, the runner plate assembly 200 includes a runner cover 210, an end baffle 220 and a spoiler 230, wherein the runner cover 210 is mounted on the main housing 100 and seals the upper surface of the runner groove 120; the end baffle 220 is installed between the main housing 100 and the flow path cover plate 210 and closes the side surface of the flow path groove 120 between the main housing 100 and the flow path cover plate 210; the spoiler 230 is installed in the runner groove 120.

Specifically, according to the concave structure of the runner groove 120, the runner plate assembly 200 is provided with two parts, namely a runner cover plate 210 and an end baffle 220, so as to form a closed runner with the runner groove 120. And the end baffle 220 is of a U-shaped structure, so that two sides of the end baffle 220 of the U-shaped structure extend to two sides of the end side of the adjacent runner groove 120, and the appearance of the end baffle 220 of the U-shaped structure is set to be plate-shaped, so that the strength of the thin-wall structure such as a sheet metal is improved. Meanwhile, the spoiler 230 is matched and arranged between the runner cover plate 210 and the runner groove 120, so that the structure of the runner cover plate 210 is not only suspended and fixed on the structure of the runner groove 120, but also the end baffle 220 and the spoiler 230 are utilized to support the whole runner cover plate 210, the strength of the runner plate assembly 200 is further enhanced, and the runner plate assembly 200 is convenient to be used as an installation foundation surface of other components.

In the embodiment of the invention, a scheme for integrating an IGBT cooling plate and a capacitor glue-pouring cavity of an inverter for a new energy vehicle is provided. As shown in fig. 5, it includes a flow channel cover 210, two end baffles 220, a spoiler 230, a main housing 100 and four mounting feet.

Further, the processing technology of each part comprises the following steps: the runner cover 210, the end baffle 220 and the spoiler 230 are formed by stamping; the main housing 100 and the mounting legs are formed into a desired shape by extrusion and machining. Finally, the parts are brazed for one time to form a closed cooling liquid flow passage and an open capacitor encapsulation cavity. Therefore, by eliminating the design of the screw fixing points, the structure is simplified, the fixing positions are flexible, the deformation design of the platform is facilitated, and the die cost of the main shell 100 is greatly reduced compared with that of the runner plate formed by die casting and stamping through extrusion molding; other components are formed by stamping, and the whole structure is simple in design and easy to form. The cooling plate structure is used for multiple purposes through one shell, so that the number of parts is effectively reduced, and the system cost is reduced.

Referring to fig. 3 and 5, in an embodiment, a window 101 is formed on the main housing 100 and is communicated with the accommodating space 110. Several windows 101 are provided on the same side of the surface of the main housing 100. The window 101 and the flow channel groove 120 are provided on the same side surface of the main housing 100. The window 101 and the interface end 130 of the flow channel 120 are respectively located on different sides of one side surface of the main housing 100.

In the above embodiment, the shape of the extruded main housing 100 can be adjusted according to the overall arrangement requirements of the first module 10, such as a power device, and the second module 20, such as a capacitor, and the relative positional relationship and connection fixing manner of the main housing 100 and other components, such as the second structural member 500, can also be adjusted according to the requirements.

Thus, the window 101 communicating with the accommodating space 110 is formed in the main housing 100, and is used as a channel for connecting the second module 20, such as a capacitor, to an external component. The opening position of the window 101 on the main housing 100 can be determined according to the layout position of the second module 20, such as a capacitor, in the internal accommodating space 110.

Further, when the opening position of the window 101 on the main housing 100 is disposed on the same side of the runner groove 120, on one hand, the strength of the surface of the corresponding side of the main housing 100, which is enhanced by the concave structure of the runner groove 120, can be utilized to compensate for the strength weakening of the main housing 100 after the window 101 is opened; on the other hand, the connection structure for leading out the second module 20, such as a capacitor, from the accommodating space 110 is conveniently arranged on the same side of the second module 20, such as a power device, outside the main housing 100, so that the connection structure of the corresponding first module 10, second structural member 500 and second module 20 on the cooling plate structure is conveniently designed and optimized uniformly, and the flatness of other surfaces of the main housing 100 in the cooling plate structure is maintained.

Referring to fig. 3 to 6, in an embodiment, the main housing 100 is further provided with a mounting angle 300, the mounting angle 300 is disposed on a side surface of the main housing 100 in a circumferential direction of the flow channel 120, and an orientation of the mounting angle 300 is opposite to a surface of the main housing 100 on which the flow channel 120 is disposed. By selecting the location at which the mounting angle 300 connects the main housing 100, the stability of the cooling panel structure and the corresponding connection is maintained while providing sufficient space for the assembled cooling panel structure and the first module 10 and the second machine component protruding thereon in the corresponding location of, for example, the vehicle structure.

Referring to fig. 6, in an embodiment, a solder 400 is disposed between the main housing 100, the mounting angle 300, the spoiler 230, the end baffle 220 and the runner cover 210, and the solder 400 is connected between the main housing 100, the mounting angle 300, the spoiler 230, the end baffle 220 and the runner cover 210 by a pre-fixing method before welding.

Further, the solder 400 includes a solder layer 410, solder paste 420 and a solder sheet 430, wherein the solder layer 410 is disposed on a surface of the runner cover 210 facing the main housing 100; solder paste 420 is coated on both side surfaces of the end cap plate facing the flow path cover plate 210 and the main housing 100; the solder sheet 430 is disposed on surfaces of the main housing 100 that contact the spoiler 230 and the mounting angle 300, respectively.

When assembling each part of the cooling plate structure, the reasonable matching of the type and the adding mode of the brazing filler metal 400 in the brazing process determines the reliability of the product. Specifically, as shown in fig. 6, the runner cover plate 210 is a plate with a brazing filler metal 400 composite layer, and the lower surface of the runner cover plate is provided with a brazing filler metal layer 410 to realize welding with the spoiler 230; the upper and lower sides of the end shield 220 are required to be automatically coated with the solder paste 420 by a robot arm, and the solder paste 420 having excellent fluidity automatically fills the gap between the end shield 220 and the flow channel of the main housing 100 in a molten state according to the principle of capillary action; the welding between the spoiler 230 and the runner of the main housing 100 is accomplished by the solder sheet 430; similarly, the bonding between the mounting feet and the side walls of the main housing 100 is also accomplished by the addition of solder tabs 430.

Before the brazing process starts, the different solders 400 are required to be added to proper positions, and the parts to be welded are pre-fixed by means of laser dotting pre-fixing (mounting feet), tool clamping and the like. Finally, the cooling plate assembly is fixed through one-time furnace feeding welding. Further, the materials of the constituent parts of the cooling plate structure can be changed according to the requirements. The brazing scheme can be adjusted according to the process requirements.

Referring to fig. 3, in an embodiment, the main housing 100 is further provided with a second structural member 500, and the second structural member 500 and the runner groove 120 are located on the same side surface or different side surfaces of the main housing 100. The main housing 100 and/or the second structural member 500 are of unitary molded construction.

In particular, in the solution of the above embodiment, other functional structures may be added to the cooling plate structure. For example, structures such as fixed posts, heat dissipation bosses and the like are additionally arranged in a brazing mode, a laser welding mode, a riveting mode, an adhesive mode and the like. Or the fixing structure and the shell are directly formed at one time through integral extrusion.

Further, FIG. 3 illustrates the interface relationship between the brazed cooling plate structure and the associated components, wherein the second structural member 500, such as a three-phase copper bar assembly, may be affixed to the cooling plate by laser welding; the second module 20, such as a large capacitor, is placed in the main housing 100 and encapsulated in the accommodating space 110, and is fixed with the main housing 100 of the cooling plate structure through epoxy potting adhesive; the waterway interface 131 and the window 101 of the capacitor copper bar welding process are required to perform machining and perforating on specific positions of the extruded main shell 100.

In summary, according to the integrated cooling plate provided by the invention, the accommodating space 110 formed by extrusion below the cooling plate flow channel is used as the cavity for filling and sealing the capacitor, so that the assembly gaps of the capacitor shell and the capacitor shell are reduced, and the space utilization is greatly improved; the design of screw fixing points is canceled, the structure is simplified, the fixing position is flexible, and the design of platformization deformation is facilitated. Compared with a thin plate design and a three-dimensional splicing design, the deformation resistance of the system is greatly improved; meanwhile, the cooling plate and the large capacitor are integrally encapsulated, the gap of the system is compressed, and the integral strength is improved; the heat dissipation paths of the IGBT and the large capacitor are not provided with low-heat-conductivity-coefficient media (insulating films, plastic shells and the like), so that the heat exchange performance of the system is improved.

The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (15)

1. An integrated cooling plate, comprising:

a main housing (100), wherein an accommodating space (110) is arranged in the main housing (100), and a flow channel groove (120) is arranged on one side surface of the main housing (100);

a flow channel plate assembly (200), wherein the flow channel plate assembly (200) is arranged on the flow channel groove (120) and forms a closed flow channel of the main shell (100);

the runner plate assembly (200) outside the main shell (100) is provided with a first module (10), and the accommodating space (110) inside the main shell (100) is provided with a second module (20).

2. The cooling plate according to claim 1, characterized in that a potting compound is provided in the accommodation space (110) for fixedly connecting the second module (20) with the main housing (100).

3. The cooling plate according to claim 1 or 2, characterized in that the first module (10) is a power module and the second module (20) is a capacitor.

4. The cooling plate according to claim 1, wherein the flow channel groove (120) has a concave structure on the surface of the main housing (100), and the main housing (100) is formed with a protrusion inside the accommodation space (110) by the concave structure of the flow channel groove (120).

5. The cooling plate according to claim 4, wherein the runner groove (120) is provided with an interface end (130) extending to protrude from the surface of the main housing (100), and the interface end (130) is provided with a water channel interface (131) penetrating the runner groove (120).

6. The cooling plate according to claim 1, wherein the flow field plate assembly (200) comprises:

a flow passage cover plate (210), wherein the flow passage cover plate (210) is arranged on the main shell (100) and seals the upper surface of the flow passage groove (120);

an end baffle plate (220), wherein the end baffle plate (220) is arranged between the main shell (100) and the runner cover plate (210) and seals the side surface of the runner groove (120) between the main shell (100) and the runner cover plate (210);

and the spoiler (230) is arranged in the runner groove (120).

7. The cooling plate according to claim 5, characterized in that the main housing (100) is provided with a window (101) communicating with the accommodation space (110).

8. The cooling plate according to claim 7, characterized in that several of the windows (101) are provided on the same side of the surface of the main housing (100).

9. The cooling plate according to claim 8, wherein the window (101) and the flow channel groove (120) are provided on the same side surface of the main housing (100).

10. The cooling plate according to claim 9, wherein the window (101) and the interface end (130) of the flow channel groove (120) are located on different sides of a side surface of the main housing (100), respectively.

11. The cooling plate according to claim 6, wherein a mounting angle (300) is further provided on the main casing (100), the mounting angle (300) is provided on a side surface of the main casing (100) in a circumferential direction of the flow passage groove (120), and an orientation of the mounting angle (300) is opposite to a surface of the main casing (100) on which the flow passage groove (120) is provided.

12. The cooling plate according to claim 11, characterized in that a solder (400) is provided between the main housing (100), the mounting angle (300), the spoiler (230), the end baffle (220) and the runner cover plate (210), and that a connection is made between the main housing (100), the mounting angle (300), the spoiler (230), the end baffle (220) and the runner cover plate (210) by means of pre-fixing before the solder (400) is welded.

13. The cooling plate according to claim 12, wherein the solder (400) comprises:

a solder layer (410), wherein the solder layer (410) is arranged on the surface of the runner cover plate (210) facing the side of the main shell (100);

solder paste (420), the solder paste (420) is coated on two side surfaces of the end cover plate facing the runner cover plate (210) and the main shell (100);

and a solder sheet (430), wherein the solder sheet (430) is disposed on the surface of the main housing (100) that contacts the spoiler (230) and the mounting angle (300), respectively.

14. The cooling plate according to any one of claims 1-2 or 4-13, wherein a second structural member (500) is further provided on the main housing (100), the second structural member (500) being located on the same side surface or the different side surface of the main housing (100) as the flow passage groove (120).

15. The cooling plate according to claim 14, characterized in that the main housing (100) and/or the second structural member (500) are of one-piece construction.