CN117711841A - Casting mold and casting method for shell-free capacitor - Google Patents
Casting mold and casting method for shell-free capacitor Download PDFInfo
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- CN117711841A CN117711841A CN202311777883.2A CN202311777883A CN117711841A CN 117711841 A CN117711841 A CN 117711841A CN 202311777883 A CN202311777883 A CN 202311777883A CN 117711841 A CN117711841 A CN 117711841A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 86
- 238000005266 casting Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000011282 treatment Methods 0.000 claims abstract description 26
- 238000000465 moulding Methods 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000005498 polishing Methods 0.000 claims description 11
- 238000012360 testing method Methods 0.000 claims description 9
- 244000137852 Petrea volubilis Species 0.000 claims description 8
- 238000009489 vacuum treatment Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000008595 infiltration Effects 0.000 claims description 6
- 238000001764 infiltration Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 239000004745 nonwoven fabric Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000007781 pre-processing Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001502 supplementing effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to the technical field of capacitor manufacturing, and provides a casting mold and a casting method of a shell-less capacitor, wherein the casting mold comprises a bottom plate, two first side plates and two second side plates, the two first side plates and the two second side plates are surrounded to form a rectangular mold frame, and the first side plates and the second side plates are locked and fixed through a plurality of first fasteners penetrating the first side plates and being inserted into the thickness surfaces of the second side plates; the bottom plate is fixed to the bottom of the rectangular mold frame by a plurality of second fasteners and a plurality of third fasteners inserted into the thickness faces thereof, so that the rectangular mold frame forms a five-sided mold having openings. The die is formed in a mode that the side faces of the side plates are locked, so that the heads of the fasteners are positioned on the side faces of the die, and the die is convenient to disassemble and assemble; and the first side plate, the second side plate and the bottom plate form a five-sided die with an opening, so that the molding condition of the die is conveniently observed when the die is poured, and timely glue supplementing treatment is facilitated.
Description
Technical Field
The invention relates to the technical field of capacitor manufacturing, in particular to a casting mold and a casting method for a shell-free capacitor.
Background
The size of the die is customized according to the outline size of the capacitor, the die is used for ensuring that the outline size of the capacitor meets the technical requirements, and meanwhile, the embedded prefabricated member and the capacitor are combined into a whole through epoxy resin, so that the overall consistency of the capacitor is improved.
Capacitors that need to be encased with a metal can are generally referred to as cased capacitors, such as metal-can capacitors, and, in contrast, capacitors that are cast once with high temperature epoxy are referred to as dry caseless capacitors.
The bottom plate and the side plate are connected in the current shell-less capacitor die in a bottom up locking mode, so that the side plate can be locked only after the bottom plate is required to be raised after a product is overturned, the operation is difficult, the die adopts a six-face die mode, a large number of air holes are easily formed in a pouring surface after pouring molding, epoxy resin is solidified and contracted, sink marks are formed, and the six-face die is in a fully-closed mode, so that repairing cannot be observed in the solidifying process.
Disclosure of Invention
The invention solves the problem of how to more conveniently disassemble and assemble the die and observe the pouring molding condition.
In order to solve the problems, the invention provides a shell-less capacitor pouring die, which comprises a bottom plate, two first side plates and two second side plates, wherein the two first side plates and the two second side plates are surrounded to form a rectangular die frame, and the first side plates and the second side plates are locked and fixed through a plurality of first fasteners penetrating through the first side plates and being inserted into the thickness surfaces of the second side plates; the bottom plate is fixed to the bottom of the rectangular mold frame by a plurality of second fasteners and a plurality of third fasteners inserted into the thickness faces thereof, so that the rectangular mold frame forms a five-sided mold having an opening.
Optionally, a plurality of first through holes are formed in edges of two sides of the first side plate, the first through holes are uniformly distributed along the height direction of the first side plate, first locking holes corresponding to the first through holes one to one are formed in the side surface of the second side plate, which is attached to the first side plate, of the second side plate, and the first fastener penetrates through the corresponding first through holes and is matched with the corresponding first locking holes to fix the first side plate in a locking mode.
Optionally, at least two third through holes are formed in the bottom edge of the first side plate, at least two second through holes are formed in the bottom edge of the second side plate, and third locking holes corresponding to the third through holes and the second through holes respectively are formed in the thickness surface of the bottom plate;
the first side plate and the bottom plate are locked and fixed through a plurality of third fasteners penetrating through the third through holes and inserted into the third locking holes; the second side plate and the bottom plate are locked and fixed through a plurality of second fasteners penetrating through the second through holes and inserted into the third locking holes.
Optionally, the upper surface of the bottom plate is provided with an electrode accommodating structure and a positioning structure, the electrode accommodating structure comprises electrode grooves which are equal to the number of the electrodes of the capacitor, and the depth of the electrode grooves is higher than that of the electrodes of the capacitor by 1mm;
the positioning structure comprises at least one positioning protrusion, the positioning protrusion is positioned between the adjacent electrode grooves, and the positioning protrusion is matched with the bottom groove of the capacitor in shape and size.
Optionally, the height of the first side plate and the second side plate is greater than or equal to 10mm relative to the height of the capacitor, and a mark is arranged at a position of 10mm higher than the capacitor on the inner side of the first side plate and/or the second side plate.
Optionally, a surface of the first side plate, the second side plate and the bottom plate, which is close to one side of the capacitor, is a molding surface, the molding surface is processed with a chamfer smaller than C0.5, and the non-molding surfaces of the first side plate, the second side plate and the bottom plate are processed with chamfers of C0.5 or C1-C2.
Compared with the prior art, the shell-free capacitor pouring die has the following beneficial effects:
the first side plate, the second side plate and the bottom plate form a die in a mode of locking the side surfaces of the first fastening piece, the third fastening piece and the second fastening piece, so that the heads of the fastening pieces are positioned on the side surfaces of the die, and the die is convenient to disassemble and assemble; and the first side plate, the second side plate and the bottom plate form a five-sided die with an opening, so that the molding condition of the die is conveniently observed when the die is poured, and timely glue supplementing treatment is facilitated.
In order to solve the above problems, the present invention further provides a method for casting a capacitor without shell, which is based on the casting mold for capacitor without shell, and includes the following steps:
step 1: preprocessing the first side plate, the second side plate and the bottom plate before assembling;
step 2: the first fastening piece is matched with the side face of the second side plate, the first side plate is fixed, the first side plate and the second side plate are surrounded to form a rectangular die frame, the bottom plate is arranged at the bottom of the rectangular die frame, and the bottom plate is fixed from the side face through the third fastening piece and the second fastening piece to form a five-face die with an opening;
step 3: placing the capacitor in a cavity of the die, positioning the capacitor through the positioning structure, and enabling an electrode of the capacitor to pass through an electrode groove on the surface of the bottom plate;
step 4: and filling high-temperature epoxy resin into the mold, transferring the mold into a vacuum box for vacuum treatment, taking out the mold after the vacuum treatment, and demolding after the high-temperature epoxy resin is solidified.
Optionally, in the step 1, the pretreatment includes chamfering treatment and surface treatment;
the chamfering treatment is used for forming chamfering smaller than C0.5 on the molding surfaces of the first side plate, the second side plate and the bottom plate, and forming chamfering of C0.5 or C1-C2 on the non-molding surfaces;
the surface treatment comprises the steps of sequentially carrying out rough grinding, fine grinding and polishing on the first side plate, the second side plate and the bottom plate.
Optionally, 60-100 meshes of sand paper is adopted for rough grinding, 400-600 meshes of sand paper is adopted for fine grinding, and diamond grinding paste is adopted for polishing;
after the rough grinding, the fine grinding and the polishing, the surface roughness Ra of the die is less than 0.08 mu m.
Optionally, before the step 3, performing size detection treatment, leakage test treatment and release agent infiltration treatment on the assembled pentahedral mold;
the dimension detection processing comprises the step of detecting the appearance dimension of the die by using a measuring scale and a micrometer;
the leakage test treatment comprises the steps of injecting liquid into the mold, and placing the mold in an oven with the temperature of 100 ℃ for leakage test;
the demolding and infiltration treatment comprises the steps of smearing a demolding agent on the molding surfaces of the first side plate, the second side plate and the bottom plate, heating the demolding agent at the temperature of 100 ℃ to enable the demolding agent to infiltrate into the molding surface of the mold, and wiping the demolding agent which is not infiltrated into the mold by using non-woven fabrics.
Compared with the prior art, the casting method of the shell-less capacitor has the same beneficial effects as the casting mold of the shell-less capacitor, and the description is omitted here.
Drawings
Fig. 1 is a schematic structural view of a casting mold for a capacitor without shell according to an embodiment of the present invention;
FIG. 2 is a side view of a monocoque capacitor casting mold in accordance with an embodiment of the present invention;
FIG. 3 is a front view of a monocoque capacitor casting mold in accordance with an embodiment of the present invention;
FIG. 4 is a bottom view of a monocoque capacitor casting mold in accordance with an embodiment of the present invention;
FIG. 5 is a top view of a base plate according to an embodiment of the present invention;
FIG. 6 is a side view of a base plate in an embodiment of the invention;
FIG. 7 is a front view of a second side panel according to an embodiment of the present invention;
FIG. 8 is a side view of a second side panel in an embodiment of the invention;
FIG. 9 is a side view of a first side panel according to an embodiment of the invention;
reference numerals illustrate:
1. a first side plate; 2. a second side plate; 3. a second fastener; 4. a first fastener; 5. a third fastener; 6. a bottom plate; 11. a first through hole; 12. a third through hole; 21. a first locking hole; 22. a second through hole; 61. a third locking hole; 62. an electrode groove; 63. positioning the protrusion.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
The Z-axis in the drawing represents the vertical direction, i.e., the up-down position, and the forward direction of the Z-axis (i.e., the arrow of the Z-axis points) represents the up direction, and the reverse direction of the Z-axis represents the down direction; the X-axis in the drawing represents the horizontal direction and is designated as the front-rear position, and the forward direction of the X-axis represents the front side and the reverse direction of the X-axis represents the rear side; the Y-axis in the drawing is shown in a left-right position, and the forward direction of the Y-axis represents the left side and the reverse direction of the Y-axis represents the right side; it should also be noted that the foregoing Z-axis, Y-axis, and X-axis are meant to be illustrative only and not indicative or implying that the apparatus or component in question must be oriented, configured or operated in a particular orientation, and therefore should not be construed as limiting the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, the descriptions of the terms "embodiment," "one embodiment," and the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or embodiment is included in at least one embodiment or illustrated embodiment of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same examples or implementations. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or implementations.
As shown in fig. 1 to 4, the embodiment of the invention provides a shell-less capacitor pouring mold, which comprises a bottom plate 6, two first side plates 1 and two second side plates 2, wherein the two first side plates 1 and the two second side plates 2 are surrounded to form a rectangular mold frame, and the first side plates 1 and the second side plates 2 are locked and fixed through a plurality of first fasteners 4 penetrating through the first side plates 1 and being inserted into the thickness surfaces of the second side plates 2; the bottom plate 6 is fixed to the bottom of the rectangular mold frame by a plurality of second fasteners 3 and a plurality of third fasteners 5 inserted into the thickness faces thereof, so that the rectangular mold frame forms a five-sided mold having openings.
It should be noted that, the capacitor casting mold generally has six faces, including four side plates, a top plate and a bottom plate, and casting openings are generally provided on the top plate for filling the mold with casting materials, whereas the shell-less capacitor is generally cast by epoxy resin.
Specifically, the "thickness surface" refers to a surface parallel to the thickness direction of the plate body, or a side surface of the plate body other than two surfaces having the largest area. In this embodiment, the first side plate 1, the second side plate 2 and the bottom plate 6 are made of P20 material, which is a pre-hardened steel material specially applied to an injection mold, and the hardness is between 28 HRC and 34 HRC.
According to the invention, the top of the die is formed into the opening by removing the top plate, so that the opening is used as a pouring opening, on one hand, the pouring condition of the capacitor in pouring can be observed, the capacitor is convenient to repair in time, and on the other hand, after the die is poured and molded, the molded capacitor can be directly demolded from the opening without dismantling the top plate.
In addition, the first fastening piece 4 is inserted into the side face (thickness face) of the second side plate 2, the second fastening piece 3 and the third fastening piece 5 are inserted into the side face of the bottom plate 6, so that the fastening pieces are horizontally arranged, the bottom is prevented from being penetrated and fixed into the bottom plate 6, and the operation is convenient.
Specifically, as shown in fig. 7, 8 and 9, a plurality of first through holes 11 are formed at two side edges of the first side plate 1, the plurality of first through holes 11 are uniformly distributed along the height direction of the first side plate 1, first locking holes 21 corresponding to the plurality of first through holes 11 one by one are formed on the side surface of the second side plate 2, which is attached to the first side plate 1, of the second side plate 2, and the first fastener 4 penetrates through the corresponding first through holes 11 and cooperates with the corresponding first locking holes 21 to fix the first side plate 1 in a locking manner.
The first fastening piece 4 is screwed into the corresponding first locking hole 21 through the first through hole 11, the first side plate 1 and the second side plate 2 are fixed by utilizing the locking action of the first fastening piece 4 and the first locking hole 21, and the first fastening piece 4 is inserted into the side surfaces of the left side and the right side of the second side plate 2, so that the second side plate 2 and the first side plate 1 are vertically distributed on one hand, and the head of the first fastening piece 4 is positioned on the side surface of the die on the other hand, and the disassembly and the assembly are convenient;
as shown in fig. 5 and 6, optionally, at least two third through holes 12 are formed at the bottom edge of the first side plate 1, at least two second through holes 22 are formed at the bottom edge of the second side plate 2, and third locking holes 61 corresponding to the third through holes 12 and the second through holes 22 respectively are formed on the thickness surface of the bottom plate 6;
the first side plate 1 and the bottom plate 6 are locked and fixed by a plurality of third fasteners 5 penetrating through the third through holes 12 and inserted into the third locking holes 61; the second side plate 2 and the bottom plate 6 are fastened by a plurality of second fasteners 3 penetrating the second through holes 22 and inserted into the third fastening holes 61. The third fastening piece 5 penetrates through the third through hole 12 and is matched in the corresponding third locking hole 61, so that the bottom plate 6 replaces the original bottom part penetrating mode by a lateral fastening mode, and the operation is simplified.
It should be further noted that, in this embodiment, the second fastening member 3, the first fastening member 4, and the third fastening member 5 are all bolts, and the third locking hole 61, the first through hole 11, and the first locking hole 21 are all threaded holes that can be screwed with the bolts, so that the side plates and the bottom plate 6 can be fixed when the fastening members are screwed into the corresponding threaded holes.
Referring to fig. 5 and 6, optionally, the upper surface of the bottom plate 6 has an electrode accommodating structure and a positioning structure, where the electrode accommodating structure includes electrode slots 62 with the same number as the electrodes of the capacitor, and in this embodiment, the electrode slots 62 are in a boss shape, and the depth of the electrode slots 62 is 1mm higher than that of the electrodes of the capacitor;
since the capacitor has the electrode and the electrode has the boss, it is necessary to pass the electrode of the capacitor through the electrode groove 62 on the surface of the bottom plate 6 at the time of pouring, to fit the mold into the shape of the capacitor, and to secure the sealing property of the mold.
Further, in order to better illustrate the present invention, in this embodiment, the height of the capacitor electrode is 5mm, the diameter of the electrode boss is 24mm, and correspondingly, the depth of the electrode groove 62 is 6mm±0.5mm, and the diameter is 24.3mm± (0 to +0.3 mm), so that the electrode of the capacitor can be completely inserted into the corresponding electrode groove 62, on one hand, interference between the electrode of the capacitor and the mold during installation of the capacitor is avoided, on the other hand, the tightness between the electrode boss of the capacitor and the surface of the electrode groove is ensured, and epoxy resin is prevented from leaking between the electrode of the capacitor and the electrode groove during injection of epoxy resin, thereby improving the tightness of the mold.
The positioning structure comprises at least one positioning protrusion 63, wherein the positioning protrusion 63 is positioned between the adjacent electrode grooves 62, and the positioning protrusion 63 is matched with the shape and the size of the bottom groove of the capacitor.
In this embodiment, the number of the positioning protrusions 63 is three, and the positioning protrusions 63 are matched with the grooves on the surface of the capacitor, so as to play a role in positioning.
The height of the first side plate 1 and the second side plate 2 is 10mm or more with respect to the height of the capacitor, and marks are provided at positions 10mm higher than the capacitor inside the first side plate 1 and/or the second side plate 2. In this embodiment, the marks are graduation marks. In order to better illustrate the invention, the height of the capacitor is 645mm, and correspondingly, the height of the mold is 655mm or more than 655mm, in the embodiment, 660mm is adopted as the height of the mold, when the epoxy resin is injected into the mold, the scale marks are used as the standard, and the epoxy resin has the shrinkage rate, and the height of the capacitor after shrinkage is still within the corresponding technical requirement range through the heightened arrangement of the mold.
It should be further noted that when the height of the mold is 655mm, the mark may be the top surface of the mold, and the epoxy resin is injected based on the top surface of the mold. Further, after the epoxy resin is injected, the mold is placed into a vacuum box for treatment, and the pressure in the vacuum box is continuously reduced, so that the air in the epoxy resin can continuously upwards emerge to bring the epoxy resin out, and the surface of the mold is prevented from being polluted during vacuum treatment through the design of heightening the mold.
Optionally, the surfaces of the first side plate 1, the second side plate 2 and the bottom plate 6 near the capacitor are molded surfaces, the molded surfaces are processed with chamfers smaller than C0.5, and the non-molded surfaces of the first side plate 1, the second side plate 2 and the bottom plate 6 are processed with chamfers of C0.5 or C1-C2.
Since the first side plate 1, the second side plate 2 and the bottom plate 6 are customized according to the shape of the capacitor, and are generally rectangular, chamfering is performed on the surfaces of the first side plate 1, the second side plate 2 and the bottom plate 6, and the following effects are obtained: the first is convenient to mould transport, and its second is in order to protect personal safety, prevents to scratch personnel in the handling, and thirdly avoids the fracture problem that brings because of stress concentration, and fourth is if first curb plate 1, second curb plate 2 are not chamfer, and each limit is right-angle limit, if meet the condition that the edge has the burr, then lead to unable complete locking between first curb plate 1 and the second curb plate 2, causes the condition of leaking glue (epoxy easily.
Another embodiment of the present invention provides a method for casting a capacitor without shell, which is based on the casting mold for capacitor without shell, and includes the following steps:
step 1: pre-processing the first side plate 1, the second side plate 2 and the bottom plate 6 before assembling;
step 2: the first side plate 1 is fixed by matching the first fastening piece 4 with the side surface of the second side plate 2, the first side plate 1 and the second side plate 2 are surrounded into a rectangular mold frame, the bottom plate 6 is arranged at the bottom of the rectangular mold frame, and the bottom plate 6 is fixed from the side surface through the third fastening piece 5 and the second fastening piece 3 to form a five-sided mold with an opening;
step 3: placing the capacitor in a cavity of a die, positioning the capacitor through a positioning structure, and enabling electrodes of the capacitor to pass through an electrode groove on the surface of the bottom plate 6;
step 4: filling high-temperature epoxy resin into the mold, transferring the mold into a vacuum box for vacuum treatment, taking out the mold after the vacuum treatment, and demolding after the high-temperature epoxy resin is solidified.
Optionally, in step 1, the pretreatment includes a chamfering treatment and a surface treatment;
the chamfering treatment is used for chamfering the molding surfaces of the first side plate 1, the second side plate 2 and the bottom plate 6 to be smaller than C0.5, and chamfering the non-molding surfaces to be C0.5 or C1-C2;
the surface treatment includes sequentially performing rough grinding, finish grinding, and polishing treatments on the first side plate 1, the second side plate 2, and the bottom plate 6.
Further, the rough grinding adopts 60-100 meshes of sand paper for grinding, the fine grinding adopts 400-600 meshes of sand paper for grinding, and the polishing adopts diamond grinding paste for polishing; in this embodiment, 80 mesh sand paper is adopted in the rough grinding, and 450 mesh sand paper is adopted in the finish grinding, avoids the surface of first curb plate 1 and second curb plate 2 to have the burr, leads to unable complete locking between first curb plate 1 and the second curb plate 2, and in the vacuum treatment process, epoxy leaks through the gap department of first curb plate 1 and second curb plate 2.
After rough grinding, fine grinding and polishing, the surface roughness Ra of the die is less than 0.08 mu m. The roughness measurement can be performed after polishing using a roughness meter.
Optionally, before the step 3, performing size detection treatment, leakage test treatment and release agent infiltration treatment on the assembled pentahedral mold;
the dimension detection processing comprises the steps of detecting the appearance dimension of the die by using a measuring scale and a micrometer;
the leakage test treatment comprises the steps of injecting liquid into a mold, and placing the mold in an oven with the temperature of 100 ℃ for leakage test;
the mold release infiltration treatment includes applying a mold release agent to molding surfaces of the first side plate 1, the second side plate 2, and the bottom plate 6, heating the mold release agent at a temperature of 100 ℃ to infiltrate the mold release agent into the molding surfaces of the mold, and wiping the mold release agent which has not infiltrated into the mold with a nonwoven fabric.
The release agent is a polymer structure substance which is repelled with epoxy resin molecules, and has the function of preventing the epoxy resin from being adhered to the mold after being cured, and the high-temperature heating is carried out at 100 ℃, in the embodiment, the heating time is 6 hours, in order to enable the release agent to permeate into the mold, the Brownian movement of the release agent molecules is facilitated by utilizing a heating mode, the permeation depth of the release agent is increased, meanwhile, the permeation time of the release agent is reduced, so that a durable diaphragm layer is formed on the inner surface of the mold, and the working procedure operation time is reduced; however, the release agent cannot completely infiltrate into the die, and the residual release agent is wiped by using non-woven fabrics, so that the appearance of the capacitor after pouring is prevented from being influenced.
Although the present disclosure is disclosed above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the disclosure.
Claims (10)
1. The casting mold for the capacitor without the shell is characterized by comprising a bottom plate (6), two first side plates (1) and two second side plates (2), wherein the two first side plates (1) and the two second side plates (2) are encircled to form a rectangular mold frame, and the first side plates (1) and the second side plates (2) are locked and fixed through a plurality of first fasteners (4) penetrating through the first side plates (1) and inserted into the thickness surfaces of the second side plates (2); the bottom plate (6) is fixed to the bottom of the rectangular mold frame by inserting a plurality of second fasteners (3) and a plurality of third fasteners (5) on the thickness surface thereof, so that the rectangular mold frame forms a five-sided mold with an opening.
2. The shell-less capacitor pouring die according to claim 1, wherein a plurality of first through holes (11) are formed in two side edges of the first side plate (1), the first through holes (11) are uniformly distributed along the height direction of the first side plate (1), first locking holes (21) corresponding to the first through holes (11) one by one are formed in the side surfaces of the second side plate (2) and the first side plate (1), and the first fastening pieces (4) penetrate through the corresponding first through holes (11) and are matched with the corresponding first locking holes (21) to fix the first side plate (1) in a locking mode.
3. The casting mold for the capacitor without shell according to claim 1, wherein the bottom edge of the first side plate (1) is provided with at least two third through holes (12), the bottom edge of the second side plate (2) is provided with at least two second through holes (22), and the thickness surface of the bottom plate (6) is provided with third locking holes (61) corresponding to the third through holes (12) and the second through holes (22) respectively;
the first side plate (1) and the bottom plate (6) are locked and fixed through a plurality of third fasteners (5) penetrating through the third through holes (12) and being inserted into third locking holes (61); the second side plate (2) and the bottom plate (6) are locked and fixed through a plurality of second fasteners (3) penetrating through the second through holes (22) and being inserted into the third locking holes (61).
4. A shell-less capacitor casting mould according to claim 3, characterized in that the upper surface of the base plate (6) is provided with electrode receiving structures and positioning structures, the electrode receiving structures comprise electrode grooves (62) which are equal to the number of the electrodes of the capacitor, and the depth of the electrode grooves (62) is 1mm higher than that of the electrodes of the capacitor;
the positioning structure comprises at least one positioning protrusion (63), wherein the positioning protrusion (63) is positioned between the adjacent electrode grooves (62), and the positioning protrusion (63) is matched with the shape and the size of the bottom groove of the capacitor.
5. The shell-less capacitor casting mould according to claim 1, characterized in that the height of the first side plate (1) and the second side plate (2) is greater than or equal to 10mm relative to the height of the capacitor, and that marks are provided at positions inside the first side plate (1) and/or the second side plate (2) that are 10mm higher than the capacitor.
6. The casting mold for capacitor without shell according to any one of claims 1 to 5, wherein a side surface of the first side plate (1), the second side plate (2) and the bottom plate (6) close to the capacitor is a molding surface, the molding surface is processed with a chamfer of less than C0.5, and the non-molding surfaces of the first side plate (1), the second side plate (2) and the bottom plate (6) are processed with a chamfer of C0.5 or C1-C2.
7. A method of casting a capacitor without shell, based on a casting mould for a capacitor without shell according to any one of claims 1 to 6, comprising the steps of:
step 1: pre-processing the first side plate (1), the second side plate (2) and the bottom plate (6) before assembling;
step 2: the first fastening piece (4) is matched with the side surface of the second side plate (2), the first side plate (1) is fixed, the first side plate (1) and the second side plate (2) are surrounded into a rectangular die frame, the bottom plate (6) is arranged at the bottom of the rectangular die frame, and the bottom plate (6) is fixed from the side surface through the third fastening piece (5) and the second fastening piece (3) to form a five-sided die with an opening;
step 3: placing the capacitor in a cavity of the die, positioning the capacitor through the positioning structure, and enabling electrodes of the capacitor to pass through electrode grooves on the surface of the bottom plate (6);
step 4: and filling high-temperature epoxy resin into the mold, transferring the mold into a vacuum box for vacuum treatment, taking out the mold after the vacuum treatment, and demolding after the high-temperature epoxy resin is solidified.
8. The method of casting a capacitor without shell according to claim 7, wherein in step 1, the pretreatment includes chamfering treatment and surface treatment;
the chamfering treatment is used for forming the forming surfaces of the first side plate (1), the second side plate (2) and the bottom plate (6) into chamfers smaller than C0.5, and forming the non-forming surfaces into chamfers of C0.5 or C1-C2;
the surface treatment comprises sequentially carrying out rough grinding, fine grinding and polishing treatment on the first side plate (1), the second side plate (2) and the bottom plate (6).
9. The method of casting a capacitor without shell according to claim 8, wherein the rough grinding is performed by 60-100 mesh sand paper, the finish grinding is performed by 400-600 mesh sand paper, and the polishing is performed by diamond grinding paste;
after the rough grinding, the fine grinding and the polishing, the surface roughness Ra of the die is less than 0.08 mu m.
10. The method of casting a capacitor without shell according to claim 7, wherein before said step 3, said assembled pentahedral mold is subjected to a size detection treatment, a leak test treatment and a release agent infiltration treatment;
the dimension detection processing comprises the step of detecting the appearance dimension of the die by using a measuring scale and a micrometer;
the leakage test treatment comprises the steps of injecting liquid into the mold, and placing the mold in an oven with the temperature of 100 ℃ for leakage test;
the demolding and infiltration treatment comprises the steps of smearing a demolding agent on molding surfaces of the first side plate (1), the second side plate (2) and the bottom plate (6), heating the demolding agent at the temperature of 100 ℃ to infiltrate the demolding agent into the molding surface of the mold, and wiping the demolding agent which does not infiltrate into the mold by using a non-woven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311777883.2A CN117711841A (en) | 2023-12-21 | 2023-12-21 | Casting mold and casting method for shell-free capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311777883.2A CN117711841A (en) | 2023-12-21 | 2023-12-21 | Casting mold and casting method for shell-free capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117711841A true CN117711841A (en) | 2024-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311777883.2A Pending CN117711841A (en) | 2023-12-21 | 2023-12-21 | Casting mold and casting method for shell-free capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117711841A (en) |
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2023
- 2023-12-21 CN CN202311777883.2A patent/CN117711841A/en active Pending
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