CN117701206A - Electrolyte-resistant hot melt adhesive with high bonding strength and preparation method thereof - Google Patents
Electrolyte-resistant hot melt adhesive with high bonding strength and preparation method thereof Download PDFInfo
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- CN117701206A CN117701206A CN202311751548.5A CN202311751548A CN117701206A CN 117701206 A CN117701206 A CN 117701206A CN 202311751548 A CN202311751548 A CN 202311751548A CN 117701206 A CN117701206 A CN 117701206A
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- hot melt
- melt adhesive
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 95
- 239000003792 electrolyte Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 42
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 35
- 229920001971 elastomer Polymers 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000001993 wax Substances 0.000 claims description 85
- -1 cyclic olefins Chemical class 0.000 claims description 66
- 239000004743 Polypropylene Substances 0.000 claims description 37
- 229920001155 polypropylene Polymers 0.000 claims description 37
- 239000004698 Polyethylene Substances 0.000 claims description 32
- 229920000573 polyethylene Polymers 0.000 claims description 23
- 229920001568 phenolic resin Polymers 0.000 claims description 22
- 239000005011 phenolic resin Substances 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 21
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 18
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 150000002978 peroxides Chemical class 0.000 claims description 14
- 239000003208 petroleum Substances 0.000 claims description 12
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 11
- 229910001416 lithium ion Inorganic materials 0.000 claims description 11
- 150000008064 anhydrides Chemical class 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 238000004073 vulcanization Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000004711 α-olefin Substances 0.000 claims description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 4
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 claims description 4
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 claims description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 4
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 150000001925 cycloalkenes Chemical class 0.000 claims description 3
- 229920001519 homopolymer Polymers 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
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- 239000004200 microcrystalline wax Substances 0.000 claims description 3
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 3
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- 239000004576 sand Substances 0.000 claims description 3
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 claims description 2
- 150000004053 quinones Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 30
- 229920000098 polyolefin Polymers 0.000 abstract description 16
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 238000001035 drying Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract description 3
- 230000035699 permeability Effects 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000000084 colloidal system Substances 0.000 abstract 1
- 239000012943 hotmelt Substances 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 238000007789 sealing Methods 0.000 description 14
- 239000011888 foil Substances 0.000 description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000007599 discharging Methods 0.000 description 9
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 102100024452 DNA-directed RNA polymerase III subunit RPC1 Human genes 0.000 description 1
- 101000689002 Homo sapiens DNA-directed RNA polymerase III subunit RPC1 Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000004209 oxidized polyethylene wax Substances 0.000 description 1
- 235000013873 oxidized polyethylene wax Nutrition 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the technical field of hot melt adhesives, and particularly relates to an electrolyte-resistant hot melt adhesive with high adhesive strength and a preparation method thereof. The electrolyte-resistant hot melt adhesive with high bonding strength comprises 100 mass percent (5-400): (30-1200): (5-400): (0.1-200) of polyolefin resin, polyisobutylene rubber, tackifying resin, wax and vulcanizing agent. The key point of the invention is that polyisobutylene rubber with a large amount of substituted methyl in the molecular structure is introduced into the polyolefin hot melt adhesive, and a vulcanizing agent is added, so that a cross-linked structure is formed among polyisobutylene molecules, the diffusion effect and gas permeability of the molecular substances of the hot melt adhesive are reduced, and the electrolyte corrosion resistance and the air tightness of the polyolefin hot melt adhesive are improved. In addition, the compound wax is introduced into a hot melt colloid system, so that the bonding strength of the compound wax to a base material can be improved. Thus obtaining the polyolefin hot melt adhesive which has the advantages of high bonding strength, short surface drying time, good air tightness and electrolyte resistance.
Description
Technical Field
The invention belongs to the technical field of hot melt adhesives, and particularly relates to an electrolyte-resistant hot melt adhesive with high adhesive strength and a preparation method thereof.
Background
The lithium ion battery has the advantages of high voltage, high specific energy, multiple times of recycling, long storage time and the like, and is widely applied to portable electronic equipment, large and medium-sized electric equipment such as electric automobiles, electric bicycles, electric tools and the like. In recent years, with the rise of electric vehicles, the cylindrical lithium ion battery is driven to be widely used in the field of new energy electric vehicles. And the new energy electric vehicle has higher requirements on the service life and safety of the lithium ion battery. The quality of the tightness of the battery is important to the service life and the safety of the battery. At present, a cylindrical lithium ion battery generally adopts a mechanical sealing mode, namely, a metal battery shell and a battery cover are tightly pressed and sealed together by means of mechanical external force, and then a plastic sealing ring clamped between the metal battery shell and the metal cover is a key part for guaranteeing the tightness of the battery. However, the conventional sealing ring cannot increase the sealability of the battery when the mechanical seal and the battery are abused and heated, and cannot effectively prevent corrosion of a circuit board and electronic components caused by leakage of electrolyte, so that short circuit is easily generated inside the battery. Therefore, there is an urgent need to develop a technology that has a simple structure and can ensure the tightness of the seal between the cylindrical lithium ion battery case and the battery cover and increase the tightness of the battery when the battery is abused and heated, so as to effectively prevent the corrosion of the circuit board and the electronic components caused by the leakage of the electrolyte, and avoid the short circuit in the battery, thereby remarkably improving the service performance and the safety of the cylindrical lithium ion battery.
The hot melt adhesive has the characteristics of 100% of solid content, no solvent, environmental protection, no toxicity and quick solidification, and is widely applied to the encapsulation of lithium ion batteries and electronic device elements. However, the existing polyolefin hot melt adhesive has the problems of reduced adhesion to a substrate and poor air tightness when immersed in an electrolyte, so that how to prepare the electrolyte-resistant hot melt adhesive with high adhesion strength is critical.
Disclosure of Invention
One of the purposes of the invention is to provide a hot melt adhesive with high bonding strength, short surface drying time, good air tightness and electrolyte resistance, aiming at the problems of reduced bonding force to a substrate and poor air tightness caused by soaking the polyolefin hot melt adhesive in electrolyte in the prior art.
Specifically, the electrolyte-resistant hot melt adhesive with high bonding strength provided by the invention contains 100 mass percent (5-400): (30-1200): (5-400): (0.1-200) of polyolefin resin, polyisobutylene rubber, tackifying resin, wax and vulcanizing agent.
In a preferred embodiment, the polyolefin resin is contained in an amount of 5 to 60 parts by weight, the polyisobutylene rubber is contained in an amount of 5 to 20 parts by weight, the tackifying resin is contained in an amount of 20 to 60 parts by weight, the wax is contained in an amount of 5 to 20 parts by weight, and the vulcanizing agent is contained in an amount of 0.1 to 10 parts by weight.
In a preferred embodiment, the polyolefin resin is at least one of homopolymers and copolymers of α -olefins and cycloolefins.
In a preferred embodiment, the alpha-olefin is selected from at least one of ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene and 4-methyl-1-pentene.
In a preferred embodiment, the cyclic olefin is at least one of cyclobutene, cyclopentene, and cyclohexene.
In a preferred embodiment, the polyolefin resin has a number average molecular weight of 500 to 20000g/mol.
In a preferred embodiment, the polyolefin resin has a softening point of 70℃to 170 ℃.
In a preferred embodiment, the polyisobutene rubber has a number average molecular weight of 10000 ~ 1000000g/mol.
In a preferred embodiment, the tackifying resin is selected from at least one of C5 petroleum resins, C9 petroleum resins, dicyclopentadiene DCPD resins, coumarone-indene resins, styrene series resins, condensation resins, hydrocarbon petroleum resins, and hydrogenated petroleum resins.
In a preferred embodiment, the tackifying resin has a softening point of from 100 ℃ to 140 ℃.
In a preferred embodiment, the wax is selected from at least one of paraffin wax, microcrystalline wax, polyethylene wax, polypropylene wax, and sand rope wax.
In a preferred embodiment, the wax is a mixture of polyethylene wax and polypropylene wax.
In a preferred embodiment, the mass ratio of the polyethylene wax to the polypropylene wax is 1 (0.3 to 0.5).
In a preferred embodiment, the polypropylene wax contains at least an anhydride modified polypropylene wax.
In a preferred embodiment, the polyethylene wax contains at least an anhydride modified polyethylene wax.
In a preferred embodiment, the wax has a softening point of 120 ℃ to 170 ℃.
In a preferred embodiment, the vulcanizing agent is selected from at least one of sulfur, peroxides, phenolic resins, and quinones.
In a preferred embodiment, the vulcanizing agent is a mixture of peroxide and phenolic resin.
In a preferred embodiment, the mass ratio of the peroxide to the phenolic resin is 1 (0.5 to 1.5).
The second object of the invention is to provide a preparation method of the electrolyte-resistant hot melt adhesive with high bonding strength, which comprises the following steps:
s1, melting and mixing polyolefin resin, polyisobutylene rubber, tackifying resin and wax to obtain a premix;
s2, carrying out a vulcanization reaction on the premix obtained in the step S1 and a vulcanizing agent to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
In a preferred embodiment, the conditions of melt mixing include a temperature of 160 to 230℃and a stirring speed of 300 to 500rpm for a period of 1 to 5 hours.
In a preferred embodiment, the conditions for the vulcanization reaction include a temperature of 160 to 230℃and a stirring speed of 300 to 500rpm for a period of 1 to 2 hours.
The invention further provides application of the electrolyte-resistant hot melt adhesive with high bonding strength in packaging of a lithium ion battery shell and a battery cover and packaging of other electronic devices.
The inventor of the invention discovers that the main reason that the traditional polyolefin hot melt adhesive has poor electrolyte corrosion resistance is that: the traditional polyolefin hot melt adhesive mainly forms certain adhesive force on a base material through intermolecular interaction, and small molecular polymers in the polyolefin hot melt adhesive are greatly separated out along with the erosion of electrolyte after being soaked in the electrolyte, so that the intermolecular acting force of the polyolefin hot melt adhesive is destroyed, and the adhesive force on the base material is rapidly reduced.
The key point of the invention is that the polyisobutene rubber is introduced into the polyolefin hot melt adhesive, and the vulcanizing agent is added, so that a cross-linking structure is formed among polyisobutene molecules, the cohesive force of the polyolefin hot melt adhesive is further improved, meanwhile, as a great amount of substituted methyl exists in the polyisobutene molecular structure, the chain segment movement among molecules in the hot melt adhesive can be weakened, the diffusion effect and gas permeability of molecular substances are reduced, and the stability and the gas tightness of the corrosion effect of the polyolefin hot melt adhesive to chemical substances are improved. In addition, the wax is introduced into the polyolefin hot melt adhesive system, preferably, the mode of compounding the anhydride modified polyethylene wax and the polypropylene wax is adopted, so that the wettability of the hot melt adhesive to a base material can be improved while the integral fluidity of the hot melt adhesive is improved, and the adhesive strength of the hot melt adhesive is improved. In summary, the electrolyte-resistant hot melt adhesive with high bonding strength provided by the invention has excellent bonding performance on copper, aluminum and other base materials, and also has excellent electrolyte resistance. In addition, the electrolyte-resistant hot melt adhesive with high bonding strength provided by the invention has short surface drying time, and is beneficial to simplifying the production process and improving the production efficiency. In summary, the invention provides the polyolefin hot melt adhesive with high bonding strength, short surface drying time, good air tightness and electrolyte resistance, which can realize long-term effective packaging and bonding of the lithium ion battery shell and the battery cover and application in packaging of other electronic devices.
Detailed Description
The electrolyte-resistant hot melt adhesive with high bonding strength provided by the invention contains 100 mass percent (5-400): (30-1200): (5-400): (0.1-200) of polyolefin resin, polyisobutylene rubber, tackifying resin, wax and vulcanizing agent. Wherein the mass ratio of the polyolefin resin to the polyisobutylene rubber is 100 (5-400), such as 100:5, 100:10, 100:20, 100:30, 100:40, 100:50, 100:60, 100:80, 100:100, 100:150, 100:200, 100:250, 100:300, 100:350, 100:400 or any value therebetween; the mass ratio of the polyolefin resin to the tackifying resin is 100 (30-1200), such as 100:30, 100:100, 100:200, 100:500, 100:800, 100:1000, 100:1200 or any value between the two; the mass ratio of the polyolefin resin to the wax is 100 (5-400), such as 100:5, 100:10, 100:20, 100:30, 100:40, 100:50, 100:60, 100:80, 100:100, 100:200, 100:300, 100:400 or any value therebetween; the mass ratio of the polyolefin resin to the vulcanizing agent is 100 (0.1-200), such as 100:0.1, 100:0.8, 100:1, 100:20, 100:50, 100:80, 100:100, 100:150, 100:200 or any value therebetween.
In the present invention, the polyolefin resin is contained in an amount of 5 to 60 parts by weight, such as 5, 10, 15, 20, 22, 25, 28, 30, 32, 35, 38, 40, 42, 45, 48, 50, 52, 55, 58, 60 parts by weight or any value therebetween; the content of the polyisobutene rubber is 5 to 20 parts by weight, such as 5, 8, 10, 12, 15, 18, 20 parts by weight or any value between the two; the content of the tackifying resin is 20 to 60 parts by weight, such as 20, 25, 30, 35, 40, 45, 50, 55, 60 parts by weight or any value therebetween; the wax content is 5-20 parts by weight, such as 5, 8, 10, 12, 15, 18, 20 parts by weight or any value in between; the vulcanizing agent is contained in an amount of 0.1 to 10 parts by weight, such as 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 parts by weight or any value therebetween.
In the present invention, the type and amount of the polyolefin resin are not particularly limited, and may be at least one of homopolymers and copolymers of α -olefins and cycloolefins. Preferably, the polyolefin resin can be compounded by two resins with different number average molecular weights, different softening points and different viscosities, so that the integral fluidity can be improved, and the hot melt adhesive can be provided with enough bonding strength and certain electrolyte corrosion resistance. Specifically, the number average molecular weight of the polyolefin resin is preferably 500 to 20000g/mol, such as 500g/mol, 1000g/mol, 5000g/mol, 10000g/mol, 15000g/mol, 20000g/mol, or any value therebetween. The softening point of the polyolefin resin is preferably 70℃to 170℃such as 70℃100℃120℃150℃170℃or any value therebetween.
In the invention, the polyisobutene rubber has slow molecular chain movement and small free volume due to the existence of two substituted methyl groups in a molecular structure, thus generating low diffusion coefficient and gas permeability, and having excellent air tightness and acid and alkali resistance. The number average molecular weight of the polyisobutene rubber is preferably 10000 ~ 1000000g/mol, such as 10000g/mol, 50000g/mol, 100000g/mol, 200000g/mol, 500000g/mol, 800000g/mol, 1000000g/mol or any value in between.
In the invention, the tackifying resin is beneficial to enabling the hot melt adhesive to have proper viscosity and fluidity, reducing the operation difficulty of the hot melt adhesive in use and improving the bonding capability of the hot melt adhesive. Specifically, specific examples of the tackifying resin include, but are not limited to: at least one of C5 petroleum resin, C9 petroleum resin, dicyclopentadiene DCPD resin, coumarone-indene resin, styrene series resin, condensation resin, hydrocarbon petroleum resin and hydrogenated petroleum resin. Further, the softening point of the tackifying resin is preferably 100℃to 140℃such as 100℃110℃120℃130℃140℃or any value therebetween.
In the present invention, specific classes of the wax include, but are not limited to, at least one of paraffin wax, microcrystalline wax, polyethylene wax, polypropylene wax, and sand rope wax. Wherein the polyethylene wax may be an oxidized polyethylene wax and/or an anhydride modified polyethylene wax, and the polypropylene wax may be an oxidized polypropylene wax and/or an anhydride modified polypropylene wax. Preferably, the wax is preferably a mixture of polyethylene wax and polypropylene wax, in which case the overall flowability of the hot melt adhesive can be improved, and the adhesive strength of the hot melt adhesive to the substrate can be improved. Wherein the polyethylene wax at least contains anhydride modified polyethylene wax, and the polypropylene wax at least contains anhydride modified polypropylene wax. Further, the softening point of the wax is preferably 120℃to 170℃such as 120℃130℃140℃150℃160℃170℃or any value therebetween.
In the invention, the vulcanizing agent is used as a rubber crosslinking auxiliary agent, so that polyisobutylene rubber molecules can undergo a crosslinking reaction, linear molecules can form a three-dimensional network structure, and the stability of a hot melt adhesive structure and the electrolyte corrosion resistance are improved. Specific examples of the vulcanizing agent include, but are not limited to: at least one of sulfur, peroxide, phenolic resin and quinone is preferably a mixture of peroxide and phenolic resin. When the vulcanizing agent is a mixture of peroxide and phenolic resin, the peroxide is used as the initiator for the polymer reaction, and the phenolic resin is used as the polymer reaction crosslinking agent, so that the highly saturated polyisobutylene with medium and high molecular weight is vulcanized, because the mechanism of vulcanizing the polyisobutylene rubber by the peroxide is different from that of vulcanizing other saturated rubber. When the vulcanizing agent is a mixture of peroxide and phenolic resin, the mass ratio of peroxide to phenolic resin is preferably 1 (0.5-1.5), such as 1:0.5, 1:0.8, 1:1.0, 1:1.2, 1:1.5 or any value therebetween. The peroxide may be, for example, at least one of dicumyl peroxide, benzoyl peroxide, and di-t-butyl peroxide. The phenolic resin may be, for example, a tertiary butyl phenolic resin and/or a para-tertiary octyl phenolic resin. The quinone can be, for example, a para-quinone dioxime and/or a ditoluoyl para-quinone dioxime.
The preparation method of the electrolyte-resistant hot melt adhesive with high bonding strength comprises the following steps:
s1, melting and mixing polyolefin resin, polyisobutylene rubber, tackifying resin and wax to obtain a premix;
s2, carrying out a vulcanization reaction on the premix obtained in the step S1 and a vulcanizing agent to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
In the present invention, in step S1, the embodiment of melt mixing may specifically be: under the protection of inert gas, polyolefin resin, polyisobutylene rubber, tackifying resin and wax are preheated for a certain time at a certain temperature, and after most materials are melted, stirring is started to melt and mix until the materials are completely melted and uniformly mixed, so that the premix is obtained. Wherein the preheating temperature is preferably 160-230 ℃, such as 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃ or any value therebetween; the preheating time is preferably 20 to 30 minutes, such as 20 minutes, 22 minutes, 25 minutes, 28 minutes, 30 minutes or any value therebetween. The temperature of the melt mixing is preferably 160 to 230 ℃, such as 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃ or any value therebetween; the stirring speed is preferably 300 to 500rpm, such as 300rpm, 350rpm, 400rpm, 450rpm, 500rpm or any value therebetween; the time is preferably 1 to 5 hours, such as 1 hour, 1.5 hours, 2 hours, 2.2 hours, 2.5 hours, 2.8 hours, 3 hours, 3.2 hours, 3.5 hours, 3.8 hours, 4 hours, 4.5 hours, 5 hours or any value therebetween.
In the present invention, in step S2, the conditions for the vulcanization reaction include a temperature of preferably 160 to 230 ℃, such as 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃, or any value therebetween; the stirring speed is preferably 300 to 500rpm, such as 300rpm, 350rpm, 400rpm, 450rpm, 500rpm or any value therebetween; the time is preferably 1 to 2 hours, such as 1 hour, 1.2 hours, 1.5 hours, 1.8 hours, 2 hours or any value therebetween.
The present invention will be described in detail by way of specific examples.
The parts of the raw materials referred to in the following examples and comparative examples are parts by weight.
The raw materials involved in the following examples and comparative examples are as follows: the polyolefin resin is selected from at least one of VESTOPLAST 703, VESTOPLAST 704, VESTOPLAST 708 and VESTOPLAST 750; polyisobutylene rubber is available from basf as at least one of B10, B12, B15, B30, B50, B80; escorez, a tackifying resin available from Exxon Mobil TM 5340. IsmanAt least one of Eastotac H-130W, regalite R1125 from Isman; wax is purchased from at least one of Licocene pp 6102, licocene pp 7502, licocene pp MA6452, licocene pp MA 7452, licocene PE MA 4351, and LICOWAX PE 130 of Craine; phenolic resin Santa Clatt, inc., santa Clark, USA, trade name R7522E.
Example 1 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, firstly preheating 15 parts of polyolefin resin VESTOPLAST 703, 8 parts of polyolefin resin VESTOPLAST 708, 12 parts of polyisobutylene rubber B15, 50 parts of tackifying resin Eastotac H-130W, 5 parts of polypropylene wax Licocene pp 6102 and 5 parts of maleic anhydride modified polypropylene wax Licocene pp MA6452 for 25min at 190 ℃, stirring at 400rpm for 3H after most of materials are melted until the materials are completely melted and uniformly mixed, thus obtaining a premix;
s2, under the protection of inert gas, adding 2 parts of tert-butyl peroxide and 3 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 2 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, firstly preheating 28 parts of polyolefin resin VESTOPLAST 704, 15 parts of polyisobutylene rubber B50, 40 parts of tackifying resin Eastotac R1125, 8 parts of polypropylene wax Licocene pp 7502 and 4 parts of maleic anhydride modified polypropylene wax Licocene pp MA 7452 for 30min at 190 ℃, stirring at 500rpm for 2h after most of materials are not melted until the materials are completely melted and uniformly mixed, thus obtaining a premix;
s2, under the protection of inert gas, adding 5 parts of tert-butyl peroxide into the premix obtained in the step S1, continuously stirring at 170 ℃ and a rotation speed of 500rpm for 2 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 3 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1、Under the protection of inert gas, 18 parts of polyolefin resin VESTOPLAAST 704, 7 parts of polyolefin resin VESTOPLAAST 750, 10 parts of polyisobutylene rubber B30 and 50 parts of tackifying resin Escorez are firstly mixed TM 5340. 3 parts of maleic anhydride modified polypropylene wax Licocene pp MA6452 and 9 parts of polyethylene wax LICOWAX PE 130 are preheated at 190 ℃ for 25min, and after most of the materials are molten, the materials are stirred for 2h at a rotating speed of 300rpm until the materials are completely molten and uniformly mixed, so as to obtain a premix;
s2, adding 3 parts of tert-butyl peroxide into the premix obtained in the step S1 under the protection of inert gas, continuously stirring at 170 ℃ and a rotating speed of 300rpm for 1h, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 4 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, firstly preheating 27 parts of polyolefin resin VESTOPLAST 703, 12 parts of polyisobutylene rubber B50, 45 parts of tackifying resin Eastotac H-130W, 9 parts of polypropylene wax Licocene pp 6102 and 3 parts of maleic anhydride modified polypropylene wax Licocene pp MA 7452 for 25min at 190 ℃, stirring for 3H at 400rpm after most of materials are not melted until the materials are completely melted and uniformly mixed, thus obtaining a premix;
s2, under the protection of inert gas, adding 4 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 5 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, firstly preheating 25 parts of polyolefin resin VESTOPLAST 708, 15 parts of polyisobutylene rubber B10, 45 parts of tackifying resin Regalite R1125, 3 parts of maleic anhydride modified polypropylene wax Licocene pp MA 7452 and 7 parts of polyethylene wax LICOWAX PE 130 for 25min at 190 ℃, stirring at 400rpm for 3h after most of materials are not melted until the materials are completely melted and uniformly mixed, thus obtaining a premix;
s2, under the protection of inert gas, adding 3 parts of tert-butyl peroxide and 2 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 6 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, 25 parts of polyolefin resin VESTOPLAAST 750, 15 parts of polyisobutylene rubber B12 and 45 parts of tackifying resin Escorez are firstly mixed TM 5340. 7 parts of polypropylene wax Licocene pp 6102 and 3 parts of maleic anhydride modified polypropylene wax Licocene pp MA6452 are preheated at 190 ℃ for 25min, and after most of the materials are molten, the materials are stirred for 3h at 400rpm until the materials are completely molten and uniformly mixed, so as to obtain a premix;
s2, under the protection of inert gas, adding 5 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 7 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, 5 parts of polyolefin resin VESTOPLAAST 708, 3 parts of polyolefin resin VESTOPLAAST 750, 17 parts of polyisobutylene rubber B15 and 60 parts of tackifying resin Escorez are firstly mixed TM 5340. 3 parts of maleic anhydride modified polyethylene wax Licocene PE MA 4351 and 3 parts of polyethylene wax LICOWAX PE 130 are preheated at 190 ℃ for 25min, and after most of the materials are molten, the materials are stirred for 3h at 400rpm until the materials are completely molten and uniformly mixed, so as to obtain a premix;
s2, under the protection of inert gas, adding 6 parts of tert-butyl peroxide and 3 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 8 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
S1, under the protection of inert gas, 30 parts of polyolefin is firstly mixedResin VESTOPLAAST 708, 26 parts of polyolefin resin VESTOPLAAST 750, 5 parts of polyisobutylene rubber B15, 20 parts of tackifying resin Escorez TM 5340. 6 parts of maleic anhydride modified polyethylene wax Licocene PE MA 4351 and 12 parts of LICOWAX PE 130 are preheated at 190 ℃ for 25min, and are stirred for 3h at a rotating speed of 400rpm after most of the materials are not molten until the materials are completely molten and are uniformly mixed, so as to obtain a premix;
s2, under the protection of inert gas, adding 1 part of tert-butyl peroxide into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
Example 9 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
The hot melt adhesive was prepared according to the method of example 1, except that the same parts by weight of maleic anhydride modified polyethylene wax Licocene PE MA 4351 was used instead of polypropylene wax Licocene pp 6102, and the remaining conditions were the same, to obtain an electrolyte-resistant hot melt adhesive with high adhesive strength.
Example 10 preparation of electrolyte-resistant Hot melt adhesive with high adhesive Strength
A hot melt adhesive was prepared according to the method of example 3, except that the same parts by weight of polypropylene wax Licocene pp 6102 was used instead of maleic anhydride modified polypropylene wax Licocene pp MA6452, and the remaining conditions were the same, to obtain an electrolyte-resistant hot melt adhesive with high adhesive strength.
Comparative example 1 preparation of reference hot melt adhesive
A hot melt adhesive was prepared in the same manner as in example 1 except that the polyisobutylene rubber B15 was replaced with the same weight part of the polyolefin resin VESTOPLAST 708, and the other conditions were the same as in example 1, and the specific steps were as follows:
s1, under the protection of inert gas, firstly preheating 15 parts of polyolefin resin VESTOPLAST 703, 20 parts of polyolefin resin VESTOPLAST 708, 50 parts of tackifying resin Eastotac H-130W, 5 parts of polypropylene wax Licocene pp 6102 and 5 parts of polypropylene wax Licocene pp MA6452 for 25min at 190 ℃, stirring at 400rpm for 3H after most of materials are not melted until the materials are completely melted and uniformly mixed, thus obtaining a premix;
s2, under the protection of inert gas, adding 2 parts of tert-butyl peroxide and 3 parts of phenolic resin R7522E into the premix obtained in the step S1, continuously stirring at 170 ℃ and 400rpm for 1.5 hours, discharging the obtained product into an aluminum foil packaging bag, and sealing to obtain the reference hot melt adhesive.
Comparative example 2 preparation of reference hot melt adhesive
Under the protection of inert gas, 15 parts of polyolefin resin VESTOPAST 703, 8 parts of polyolefin resin VESTOPAST 708, 12 parts of polyisobutylene rubber B15, 50 parts of tackifying resin Eastotac H-130W, 10 parts of polypropylene wax Licocene pp 6102 and 5 parts of polypropylene wax Licocene pp MA6452 are preheated at 190 ℃ for 25min, most of the materials are stirred at 400rpm for 3H after being melted, until the materials are completely melted and uniformly mixed, and the products are discharged into an aluminum foil packaging bag for sealing, thus obtaining the reference hot melt adhesive.
Comparative example 3 preparation of reference hot melt adhesive
A reference hot melt adhesive was prepared as in example 1, except that 10 parts of tackifying resin Escorez was used in step S1 TM 5340 instead of 5 parts of the polypropylene wax Licocene pp 6102 and 5 parts of the polypropylene wax Licocene pp MA6452, the remaining conditions were the same.
Test case
(1) Viscosity:
the hot melt adhesives prepared in the above examples and comparative examples were tested by using a BROOKFIELD viscometer, 20g of the hot melt adhesive was put into a heating sleeve at 180℃to melt, after the temperature was stabilized for 30 minutes, viscosity data at 10rpm was measured by using a No. 27 spindle, and the results are shown in Table 1.
(2) Surface drying time:
the hot melt adhesives prepared in the above examples and comparative examples were dispensed onto aluminum substrates at 180℃with an adhesive content of 0.3 g.+ -. 0.05g, and the results obtained were shown in Table 1 using the finger touch test, i.e., the time from finger touch until the adhesive was not drawn, was recorded as the tack free time.
(3) Adhesive strength:
the hot melt adhesive prepared in the above examples and comparative examples was dispensed on a square anodized aluminum (35.9 mm x 35.9 mm) substrate at 180 ℃ and a square adhesive tape with a bonding area of 1.5mm wide x 25mm long was controlled to be 0.15mm thick (copper wire control), then was rapidly lapped with another square anodized aluminum (50 mm x 50 mm) on a lapping jig, and finally was clamped with a dovetail clamp to prepare samples, each group being 5cps. The prepared sample was placed in a constant temperature and humidity room (25 ℃ C./55% RH) and allowed to stand for 2 hours, then the sample solidified for 2 hours was clamped to a tensile tester at a tensile rate of 5mm/min, and the obtained value was the bonding strength, and the obtained results are shown in Table 1.
(4) And (3) air tightness test:
the hot melt adhesives prepared in the above examples and comparative examples were sampled according to the preparation method of the thrust intensity test sample in (3), and placed in a constant temperature and humidity room (25 ℃ C./55% RH) for 2 hours with 3cps per group. The sample was then placed on an air tightness test apparatus, the pressure was gradually increased from 0 to 0.5MPa and then maintained for a certain period of time, during which the air tightness of the sample was observed, and the time for maintaining the air tightness was recorded. And (3) placing the prepared sample in an electrolyte steam environment at 85 ℃ for 8 days, taking out the sample after aging, wiping residual electrolyte on the sample with dust-free cloth, standing for 2 hours at room temperature, placing the sample on air tightness testing equipment, gradually increasing the pressure from 0 to 0.5MPa, keeping the pressure for a certain time, observing the air tightness of the sample during the time, and recording the time for keeping the air tightness. The results obtained are shown in Table 1.
TABLE 1
As shown in the test results of Table 1, the hot melt adhesive prepared by the embodiment of the invention has moderate viscosity, high bonding strength to metal, short surface drying time, contribution to simplifying the production process and improving the production efficiency, excellent electrolyte resistance, and can still maintain for 2 minutes under the pressure of 0.5Mpa after being corroded by electrolyte steam at 85 ℃ for 8 days, and still has reliable air tightness, thereby realizing long-term effective bonding and sealing of the top cover and the shell of the cylindrical battery cell of the lithium ion battery.
In addition, the preparation method provided by the invention is simple, no solvent is used in the production process, no harmful substances are discharged, the preparation method belongs to the environment-friendly hot melt adhesive, and the preparation method is simple in operation process and low in equipment investment during use. Compared with the traditional polyolefin system adhesive, the hot melt adhesive provided by the invention has high adhesive property and electrolyte resistance, and meanwhile, the adhesive has low VOC, low odor and low atomization value, so that the hot melt adhesive can be applied to the fields of adhesion and encapsulation of storage battery shells, adhesion of automobile parts, encapsulation of other electronic devices and the like, and the application of the hot melt adhesive to the fields of adhesion of automobile parts and encapsulation of other electronic devices can be expanded.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.
Claims (10)
1. The electrolyte-resistant hot melt adhesive with high bonding strength is characterized by comprising 100 mass percent (5-400): 30-1200): 5-400): 0.1-200 of polyolefin resin, polyisobutylene rubber, tackifying resin, wax and vulcanizing agent.
2. The high adhesive strength electrolyte-resistant hot melt adhesive according to claim 1, wherein the polyolefin resin is contained in an amount of 5 to 60 parts by weight, the polyisobutylene rubber is contained in an amount of 5 to 20 parts by weight, the tackifying resin is contained in an amount of 20 to 60 parts by weight, the wax is contained in an amount of 5 to 20 parts by weight, and the vulcanizing agent is contained in an amount of 0.1 to 10 parts by weight.
3. The high bond strength electrolyte resistant hot melt adhesive of claim 1, wherein the polyolefin resin is at least one of homopolymers and copolymers of α -olefins and cyclic olefins;
preferably, the alpha-olefin is selected from at least one of ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene and 4-methyl-1-pentene;
preferably, the cycloolefin is at least one of cyclobutene, cyclopentene and cyclohexene;
preferably, the polyolefin resin has a number average molecular weight of 500 to 20000g/mol;
preferably, the softening point of the polyolefin resin is 70 to 170 ℃.
4. The high bond strength electrolyte resistant hot melt adhesive of claim 1 wherein the polyisobutylene rubber has a number average molecular weight of 10000 ~ 1000000g/mol.
5. The high adhesion strength electrolyte resistant hot melt adhesive of claim 1, wherein the tackifying resin is selected from at least one of C5 petroleum resin, C9 petroleum resin, dicyclopentadiene DCPD resin, coumarone-indene resin, styrene series resin, condensation resin, hydrocarbon petroleum resin, and hydrogenated petroleum resin; preferably, the softening point of the tackifying resin is 100 ℃ to 140 ℃.
6. The high bond strength electrolyte resistant hot melt adhesive of claim 1, wherein the wax is selected from at least one of paraffin wax, microcrystalline wax, polyethylene wax, polypropylene wax, and sand rope wax;
preferably, the wax is a mixture of polyethylene wax and polypropylene wax;
preferably, the mass ratio of the polyethylene wax to the polypropylene wax is 1 (0.3-0.5);
preferably, the polypropylene wax at least contains anhydride modified polypropylene wax;
preferably, the polyethylene wax at least contains anhydride modified polyethylene wax;
preferably, the wax has a softening point of 120 ℃ to 170 ℃.
7. The high bond strength electrolyte resistant hot melt adhesive of claim 1 wherein said vulcanizing agent is selected from at least one of sulfur, peroxides, phenolic resins and quinones;
preferably, the vulcanizing agent is a mixture of peroxide and phenolic resin;
preferably, the mass ratio of the peroxide to the phenolic resin is 1 (0.5-1.5).
8. The method for preparing the electrolyte-resistant hot melt adhesive with high adhesive strength according to any one of claims 1 to 7, comprising the steps of:
s1, melting and mixing polyolefin resin, polyisobutylene rubber, tackifying resin and wax to obtain a premix;
s2, carrying out vulcanization reaction on the premix obtained in the step S1 and a vulcanizing agent to obtain the electrolyte-resistant hot melt adhesive with high bonding strength.
9. The method for preparing an electrolyte-resistant hot melt adhesive with high adhesive strength according to claim 8, wherein the conditions of melt mixing comprise a temperature of 160-230 ℃, a stirring speed of 300-500 rpm and a time of 1-5 hours; the conditions of the vulcanization reaction comprise 160-230 ℃, stirring speed of 300-500 rpm and time of 1-2 h.
10. Use of the high bond strength electrolyte resistant hot melt adhesive of any one of claims 1 to 7 in lithium ion battery case and battery cover packaging and other electronic device packaging.
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