CN117693249A - Display panel, manufacturing method thereof and display device - Google Patents

Abstract

The embodiment of the application provides a display panel, a manufacturing method thereof and a display device. The display panel includes: the color film comprises a substrate base plate, a color film layer and a light-emitting device layer. The light-emitting device layer is positioned on one side of the substrate and comprises a plurality of light-emitting units which are arranged in an array manner; the color film layer is positioned on one side of the light-emitting device layer far away from the substrate and comprises a plurality of color resistance layers, the color resistance layers correspond to the light-emitting units one by one, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers; wherein: and in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate. According to the embodiment of the application, the overlapping area arranged between the adjacent color resistance layers can shield scattered light emitted by the adjacent light emitting units, so that the problem of cross color between pixels of the micro display is solved, and the display effect of the display panel is improved.

Description

Display panel, manufacturing method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.

Background

The micro display device refers to a smaller-sized display that can be used in an augmented Reality (Augmented Reality, AR) and Virtual Reality (VR) device, and is the most important development direction of the next-generation display technology. The Micro display device mainly includes Micro LEDs (Micro Light-Emitting diodes), micro OLEDs (Micro Organic Light-Emitting diodes), and the like.

A common technical route of the micro display device is to realize full color display through a white light device and color filtering, and color cross-over is easy to occur between sub-pixels due to the extremely tiny pixels of the micro display device. In the conventional display field, a Black Matrix (BM) is generally used to block the cross color problem between pixels, but in a micro display, a Black Matrix with a narrow line width is easily dropped, and it is difficult to realize a light shielding effect, so that cross color is easily generated between pixels.

Disclosure of Invention

Aiming at the defects of the prior art, the application provides a display panel, a manufacturing method thereof and a display device, and solves the technical problem that cross color is easy to occur among pixels in the prior art.

In order to solve the above problems, the embodiments of the present application mainly provide the following technical solutions:

In a first aspect, embodiments of the present application provide a display panel, including:

a substrate base;

the light-emitting device layer is positioned on one side of the substrate and comprises a plurality of light-emitting units which are arranged in an array manner;

the color film layer is positioned on one side of the light-emitting device layer far away from the substrate and comprises a plurality of color resistance layers, the color resistance layers correspond to the light-emitting units one by one, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers; wherein: and in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate.

Optionally, the orthographic projection of the chamfer structure on the substrate overlaps with the orthographic projection of the overlapping region on the substrate; the orthographic projection of the undercut structure on the substrate overlaps with the orthographic projection of the overlap region on the substrate.

Optionally, the orthographic projection of the chamfer structure on the substrate falls within the orthographic projection of the overlap region on the substrate; the orthographic projection of the undercut structure on the substrate falls within the orthographic projection of the overlap region on the substrate.

Optionally, the color film layer includes a plurality of first color resists, a plurality of second color resists, and a plurality of third color resists, where the colors of the first color resists, the second color resists, and the third color resists are different; the edge of the first color resistance layer far away from the substrate is provided with a chamfer structure, and the edge of the second color resistance layer near the substrate is provided with an undercut structure; at the overlapping position of the first color resistance layer and the second color resistance layer, the second color resistance layer covers the first color resistance layer; the third color resistance layer covers the first color resistance layer at the overlapped position of the third color resistance layer and the first color resistance layer; and at the overlapped position of the third color resistance layer and the second color resistance layer, the third color resistance layer covers the second color resistance layer, and the third color resistance layer fills the undercut structure of the second color resistance layer.

Optionally, the first color resistance layer is red color resistance, the second color resistance layer is green color resistance, and the third color resistance layer is blue color resistance; or the first color resistance layer is red color resistance, the second color resistance layer is blue color resistance, and the third color resistance layer is green color resistance; or the first color resistance layer is green color resistance, the second color resistance layer is blue color resistance, and the third color resistance layer is red color resistance; or the first color resistance layer is green color resistance, the second color resistance layer is red color resistance, and the third color resistance layer is blue color resistance; or the first color resistance layer is blue color resistance, the second color resistance layer is red color resistance, and the third color resistance layer is green color resistance; or the first color resistance layer is blue color resistance, the second color resistance layer is green color resistance, and the third color resistance layer is red color resistance.

Optionally, the chamfer structure is a chamfer, and an angle formed between a tangent line of the chamfer and one surface of the first color resistance layer, which is close to the substrate, is 0-85 degrees; the undercut structure is arc-shaped, and an included angle between a tangent line of the arc shape and the substrate base plate is 30-60 degrees;

the width of the color resistance layer along the direction parallel to the upper surface of the substrate is 5 micrometers-6 micrometers; the thickness of the color resistance layer along the direction vertical to the upper surface of the substrate base plate is 1 micrometers-1.4 micrometers; the overlapping area of the color resistance layer is 0.35-1 micrometer in width along the direction parallel to the upper surface of the substrate.

Optionally, a non-light-emitting region is included between adjacent light-emitting units; the orthographic projection of the overlapping region on the light emitting device layer is located in the non-light emitting region.

Optionally, the display panel further includes an encapsulation layer and a driving circuit layer; the packaging layer is positioned between the light-emitting device layer and the color film layer; the driving circuit layer is positioned on one side of the light emitting device layer, which is close to the substrate.

Optionally, the display panel further includes a flat layer and an electron microscope layer; the flat layer is positioned at one side of the color film layer far away from the substrate base plate; the electron microscope layer is located on one side of the flat layer far away from the substrate, the electron microscope layer comprises a plurality of prisms which are arranged in an array mode, the prisms are arranged in one-to-one correspondence with the light emitting units, orthographic projections of junctions of adjacent prisms on the substrate are located in the overlapping area, and the junctions of the adjacent prisms are staggered with the central line of the overlapping area.

In a second aspect, embodiments of the present application provide a display device, including: the display panel described in the first aspect.

In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:

providing a substrate base plate;

manufacturing a light-emitting device layer on one side of a substrate, wherein the light-emitting device layer comprises a plurality of light-emitting units which are arranged in an array manner; manufacturing a color film layer on one side of the light-emitting device layer far away from the substrate, wherein the color film layer comprises a plurality of color resistance layers, the color resistance layers correspond to the light-emitting units one by one, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers; wherein: and in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate.

Optionally, before the color film layer is formed on the side, away from the substrate, of the light emitting device layer, the method further includes:

manufacturing a packaging layer on one side of the light-emitting device layer far away from the substrate base plate;

after the color film layer is manufactured on one side of the light-emitting device layer far away from the substrate, the method further comprises the following steps:

manufacturing a flat layer on one side of the color film layer far away from the substrate base plate;

and manufacturing an electron microscope layer on one side of the flat layer, which is far away from the substrate, wherein the electron microscope layer comprises a plurality of prisms which are arranged in an array, the prisms are arranged in one-to-one correspondence with the light emitting units, orthographic projections of the junctions of adjacent prisms on the substrate are positioned in the overlapping area, and the junctions of adjacent prisms are staggered with the central line of the overlapping area.

Optionally, the fabricating a color film layer on a side of the light emitting device layer away from the substrate includes:

coating a first color resistance material on one side of the packaging layer far away from the substrate, exposing the first color resistance material by positive exposure, developing to form a plurality of first color resistance layers, and forming a chamfer structure at the edge of the first color resistance layer far away from the substrate;

Coating a second color resistance material on one side of the packaging layer far away from the substrate, exposing the second color resistance material by adopting negative exposure, developing to form a plurality of second color resistance layers, wherein the second color resistance layers at least cover partial areas of the chamfer structures, and the edges of the second color resistance layers close to the substrate form undercut structures;

and coating a third color resistance material on one side of the packaging layer far away from the substrate, exposing the third color resistance material by adopting zero value exposure, developing to form a plurality of third color resistance layers, wherein the third color resistance layers at least cover part of areas of the chamfer structures, cover part of the second color resistance layers, and fill the undercut structures.

The beneficial technical effects that technical scheme that this application embodiment provided brought include:

the display panel in the embodiment of the application comprises the color film layer, the color film layer comprises a plurality of color resistance layers, the colors of adjacent color resistance layers are different, and an overlapping area exists in the adjacent color resistance layers, and because the overlapping area is arranged between the adjacent color resistance layers, the overlapping area comprises an upper color resistance layer and a lower color resistance layer with different colors, scattered light emitted by adjacent light emitting units can be filtered, the problem of light string position among pixels is weakened, the overlapping color resistance is adopted to replace BM, the problems that the BM structure is weak in adhesive force with the lower film layer and easy to fall off are solved, the color gamut of the display panel is improved, the stability of a shading structure is increased, the light leakage probability of the display panel is reduced, and the product quality and the reliability are improved; in addition, in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer close to the substrate, so that the adhesive force of an overlapping area between the adjacent color resistances can be further enhanced.

The foregoing description is merely an overview of the technical solutions of the embodiments of the present application, and may be implemented according to the content of the specification, so that the technical means of the embodiments of the present application can be more clearly understood, and the following specific implementation of the embodiments of the present application will be more clearly understood.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the alternative embodiments. The drawings are only for purposes of illustrating alternative embodiments and are not to be construed as limiting the embodiments of the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

FIG. 1 is a schematic diagram of a color cross theory of a display panel in the prior art;

fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram of an arrangement structure of a color resist layer of a display panel according to an embodiment of the present disclosure;

Fig. 6 is a schematic diagram of a first color resist layer structure in a display panel according to an embodiment of the disclosure;

fig. 7 is a schematic structural diagram of a first color resist layer and a second color resist layer in a display panel according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a first color resist layer, a second color resist layer and a third color resist layer in a display panel according to an embodiment of the present disclosure;

fig. 9 is a schematic diagram of a positional relationship between a color resist layer and a prism of a display panel according to an embodiment of the present disclosure;

fig. 10 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

fig. 11 is a physical diagram of a display panel according to an embodiment of the present application.

Reference numerals illustrate:

1-a substrate base; a 2-light emitting layer; 21-an anode; 3-packaging layer; 4-color film layer; 5-a planarization layer; 6-an electron microscope layer; 61-prism;

11-a driving circuit layer; 12-a light emitting device layer;

121-a light emitting unit; 122-non-light emitting region;

41-a first color resist layer; 42-a second color resist layer; 43-third color resist layer;

44-overlap region; 441-a first overlap region; 442-a second overlap region; 443 third overlap region.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It should be understood that the term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.

It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Taking a silicon-based OLED Micro-display (i.e. Micro OLED) as an example, the Micro-display has the characteristics of self-luminescence, thin thickness, light weight, large visual angle, high luminous efficiency and the like, can realize ultra-high resolution, has pixel density (Pixels Per Inch, PPI) of over 3000, has the advantages of low power consumption, convenient carrying and the like, and is particularly suitable for near-eye display equipment such as AR, VR and the like.

In the related art for micro display, a common technical route is to match a white light device with a Color Filter (CF) to realize full Color display. However, since the micro display device has ultra-high PPI, the pixels are extremely small, and a single pixel is only a few micrometers in size. At a small pixel resolution, cross color tends to occur between sub-pixels. In the conventional display field, a light shielding BM is generally used to block the color cross problem between pixels, but in a micro display, a BM with a narrower line width easily falls off, so that a light shielding effect is difficult to realize, and color cross easily occurs between pixels.

Fig. 1 is a schematic view of a partial cross-sectional structure of a display panel of the related art, and as shown in fig. 1, the display panel includes: the light-emitting device comprises a substrate base plate 1, an anode 21, a light-emitting layer 2, a packaging layer 3, a color film layer 4 and a flat layer 5; the plurality of anodes 21 are arranged in an array, the area of the anodes 21 is the area of the light-emitting area of the display panel, the area between the anodes 21 is the non-light-emitting area, the color film layer 4 comprises a plurality of color resistance layers, such as a red color resistance layer 41, a green color resistance layer 42 and a blue color resistance layer 43, the positions of the color resistance layers are arranged in one-to-one correspondence with the positions of the anodes 21, and the orthographic projection of one color resistance layer on the substrate 1 covers one anode 21.

As shown in fig. 1, the light emitted by the light emitting layer 2 is white light, the white light emits red light after passing through the red color resist layer 41, emits green light after passing through the green color resist layer 42, and emits blue light after passing through the blue color resist layer 43, and in the actual display process, the light emitted by the pixel edge (i.e. the anode edge) passing through the light emitting layer 2 is incident into the adjacent color resist layer of the pixel, so that color mixing caused by color cross is generated, and the display effect of the display panel is reduced; for example, in fig. 1, light emitted from the edge of the anode corresponding to the green color blocking layer 42 through the light emitting layer 2 enters the blue color blocking layer 43, and light emitted from the edge of the anode corresponding to the blue color blocking layer 43 through the light emitting layer 2 enters the green color blocking layer 42, and color mixing occurs near the interface between the green color blocking layer 42 and the blue color blocking layer 43.

In order to solve the problem of cross color of the adjacent pixels, the inventor of the application finds that, in a micro display device, a sub-pixel size of several micrometers is generally required, and when the BM is arranged between different sub-pixels to shield scattered light emitted by the adjacent sub-pixels, the width of the BM needs to be extremely narrow, and the contact area between the extremely narrow BM and a lower film layer (such as a packaging layer) is too small, so that the adhesion stability is poor, and the BM is easy to fall off, thereby generating the problems of light leakage and the like. The BM is arranged in the micro display device to solve the problem of cross color, which not only increases the process cost, but also increases the probability of BM falling off, and seriously affects the display quality of the display.

In order to solve the above problems in the related art, an embodiment of the present application provides a display panel and a manufacturing method thereof, so as to solve the technical problem that color cross easily occurs between pixels in the related art.

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

The embodiment of the application provides a display panel, as shown in fig. 2, the display panel comprises a substrate 1, a light-emitting device layer 12 and a color film layer 4; the light emitting device layer 12 is located at one side of the substrate 1 and includes a plurality of light emitting units 121 arranged in an array; the color film layer 4 is located at one side of the light emitting device layer 12 far from the substrate 1 and comprises a plurality of color resistance layers, the color resistance layers are in one-to-one correspondence with the light emitting units 121, the colors of adjacent color resistance layers are different, and an overlapping region 44 exists in the adjacent color resistance layers; wherein: of the adjacent two color resist layers, a chamfer structure is provided at an edge of one color resist layer away from the substrate 1 (for example, a chamfer structure is provided at an edge of the first color resist layer 41 away from the substrate 1 as indicated by a straight line with an arrow in the drawing), and/or an undercut structure is provided at an edge of the other color resist layer close to the substrate 1 (for example, an undercut structure is provided at an edge of the second color resist layer 42 close to the substrate 1 as indicated by a straight line with an arrow in the drawing).

It should be noted that, in some embodiments, the light emitting unit 121 may be a Micro OLED, an Organic Light Emitting Diode (OLED), a Micro light emitting diode (Micro LED), a quantum dot organic light emitting diode (QD OLED), or other types of light emitting elements. Illustratively, in one embodiment of the present application, the light emitting unit is a Micro OLED, and the display panel is a Micro OLED display panel.

The display panel in the embodiment of the application comprises the color film layer 4, the color film layer 4 comprises a plurality of color resistance layers, the colors of adjacent color resistance layers are different, and an overlapping area exists in the adjacent color resistance layers, and because the overlapping area is arranged between the adjacent color resistance layers, the overlapping area comprises an upper color resistance layer and a lower color resistance layer which are different in color, scattered light emitted by adjacent light emitting units can be filtered, the problem of light serial positions among pixels is weakened, the overlapping color resistance is adopted to replace BM, the problems that the BM structure is weak in adhesive force and easy to fall off from the lower film layer are solved, and the overlapping area is arranged between the color resistance layers, so that the color gamut of the display panel is improved, the stability of a shading structure is increased, the light leakage probability of the display panel is reduced, and the product quality and the reliability are improved; in addition, in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer close to the substrate, so that the adhesive force of an overlapping area between the adjacent color resistances can be further enhanced.

In one embodiment, as shown in fig. 2, adjacent light emitting units 121 include a non-light emitting region 122 therebetween, and the orthographic projection of the overlapping region 44 on the light emitting device layer 12 is located in the non-light emitting region 122; since the arrangement of the overlapping region 44 corresponds to the arrangement of the light shielding structure, the display panel does not display at the position of the overlapping region 44, so that the orthographic projection of the overlapping region 44 on the light emitting device layer 12 is located in the non-light emitting region 122, and the crosstalk of adjacent pixels can be improved without affecting the display.

Of course, in the actual manufacturing process, the area of the overlapping region 44 formed by the manufacturing may be slightly larger than the area of the non-light-emitting region 122 due to the restrictions of the process conditions, the process parameters, etc., as long as the influence on the display is within the range acceptable to the user.

In a specific embodiment, as shown in fig. 2, the display panel in the embodiment of the present application further includes an encapsulation layer 3 and a driving circuit layer 11; the packaging layer 3 is positioned between the light-emitting device layer 12 and the color film layer 4; the driving circuit layer 11 is located on a side of the light emitting device layer 12 close to the substrate 1. In practical design, the specific arrangement manner of the encapsulation layer 3 and the driving circuit layer 11 in the embodiment of the present application is similar to that of the prior art, and the arrangement of the encapsulation layer 3 and the driving circuit layer 11 does not relate to the improvement point of the present application, and is not repeated here.

In a specific embodiment, as shown in fig. 9 and 11, the display panel in the embodiment of the present application further includes a flat layer 5 and an electron microscope layer 6, where the flat layer 5 is located on a side of the color film layer 4 away from the substrate 1; the electron microscope layer 6 is located at one side of the flat layer 5 far away from the substrate 1, and comprises a plurality of prisms 61 arranged in an array, the prisms 61 are arranged in one-to-one correspondence with the light emitting units 121, the orthographic projection of the junction (as shown by the straight line with the arrow in fig. 9) of the adjacent prisms 61 on the substrate 1 is located in the overlapping region, and the junction of the adjacent prisms 61 is staggered with the central line of the overlapping region.

Specifically, when the intersection of the adjacent prisms 61 is staggered from the center line of the overlapping region, crosstalk can be further prevented, and the viewing angle of the adjacent pixels can be adjusted, so that the display panel has a good display effect; and the junction of the adjacent prisms 61 and the central line of the overlapping area are staggered, so that the higher bulge formed at the center of the overlapping area can be avoided, and the effect of converging light rays by the prisms 61 is weakened.

In a specific embodiment, as shown in fig. 2, the orthographic projection of the chamfer structure on the substrate base plate 1 overlaps with the orthographic projection of the overlap region 44 on the substrate base plate 1; the orthographic projection of the undercut structure on the substrate base plate 1 overlaps with the orthographic projection of the overlap region 44 on the substrate base plate 1; by the arrangement mode, when the color resist layer is specifically manufactured, the adjacent color resist layers with overlapping areas are easier to manufacture, and the adhesion between the color resist layers at the overlapping positions is good.

Further, as shown in fig. 2, the orthographic projection of the chamfer structure on the substrate base plate 1 falls within the orthographic projection of the overlap region 44 on the substrate base plate 1; the orthographic projection of the undercut structure onto the substrate base plate 1 falls within the orthographic projection of the overlap region 44 onto the substrate base plate 1.

In an alternative embodiment, as shown in fig. 2, the color film layer 4 includes a plurality of first color resist layers 41, a plurality of second color resist layers 42, and a plurality of third color resist layers 43, where the colors of the first color resist layers 41, the second color resist layers 42, and the third color resist layers 43 are different; the edge of the first color resistance layer 41 far away from the substrate 1 is provided with a chamfer structure, and the edge of the second color resistance layer 42 near the substrate 1 is provided with an undercut structure; at the overlapping position of the first color resist layer 41 and the second color resist layer 42 (i.e., at the position of the first overlapping region 441), the second color resist layer 42 covers the first color resist layer 41; at the overlapping position of the third color resist layer 43 and the first color resist layer 41 (i.e., at the position of the third overlapping region 443), the third color resist layer 43 covers the first color resist layer 41; at the overlapping location of the third color resist layer 43 and the second color resist layer 42 (i.e., at the location of the second overlapping region 442), the third color resist layer 43 covers the second color resist layer 42, and the third color resist layer 43 fills the undercut structure of the second color resist layer 42.

Specifically, as shown in fig. 2, the third color resist layer 43 forms a first bump at the position of the second overlapping region 442, and the third color resist layer 43 forms a second bump at the position of the third overlapping region 443, and the width of the first bump and the width of the second bump may be equal or different in the horizontal direction, which may be obtained according to a specific process; since the undercut structure is arranged at the edge of the second color resist layer 42 close to the substrate 1, the undercut structure is easy to be filled with the third color resist layer 43, and the first protrusion can be better formed while filling, namely, the formation of the first protrusion is easier and the third color resist layer 43 is less likely to fall off due to the undercut structure; also, since the first color resist layer 41 is provided with a chamfer structure at the edge away from the substrate 1, the formation of the two projections can be made easier.

In the embodiment, the colors of the first color resist layer 41, the second color resist layer 42 and the third color resist layer 43 are different from each other, and in the embodiment, the first color resist layer 41 is blue color resist, the second color resist layer 42 is green color resist, and the third color resist layer 43 is red color resist; alternatively, in another embodiment, as shown in fig. 3, the first color resist layer 41 is a green color resist, the second color resist layer 42 is a blue color resist, and the third color resist layer 43 is a red color resist; alternatively, in yet another embodiment, as shown in fig. 4, the first color resist layer 41 is red, the second color resist layer 42 is green, and the third color resist layer 43 is blue; alternatively, in yet another embodiment, the first color resist layer 41 is red, the second color resist layer 42 is blue, and the third color resist layer 43 is green; alternatively, the first color resist layer 41 is a green color resist, the second color resist layer 42 is a red color resist, and the third color resist layer 43 is a blue color resist; alternatively, the first color resist layer 41 is a blue color resist, the second color resist layer 42 is a red color resist, and the third color resist layer 43 is a green color resist.

In a specific embodiment, as shown in fig. 2, 3 and 4, the chamfer structure of the first color resist layer 41 in the embodiment of the present application is a rounded corner, and an angle formed by a tangent line of the rounded corner and a surface (i.e. a horizontal surface) of the first color resist layer 41 near the substrate 1 is 0 ° to 85 °; the undercut structure of the second color resist layer 42 is arc-shaped, and the included angle between the tangent line of the arc and the substrate 1 is 30-60 degrees; when the included angle between the tangent line of the undercut structure and the substrate 1 is 30 to 60 degrees, the contact between the second color resistance layer 42 and the third color resistance layer 43 is better, the third color resistance layer 43 is prevented from peeling, and the weakening of the crosstalk prevention effect can be avoided.

In one embodiment, as shown in fig. 8, the width of the color resist layer (including the first color resist layer 41, the second color resist layer 42, and the third color resist layer 43) in the first direction is between 5 micrometers and 6 micrometers. The thickness of the color resist layer (including the first color resist layer 41, the second color resist layer 42, and the third color resist layer 43) in the second direction is between 1 micrometers and 1.4 micrometers. The overlapping regions of the color resist layer (including the first overlapping region 441, the second overlapping region 442, and the third overlapping region 443) have a width in the first direction of 0.35 micrometers to 1 micrometer.

In one specific embodiment, as shown in fig. 8, the length of the light emitting unit 121 in the first direction is 4.20 micrometers; the width of the non-light emitting region between two adjacent light emitting cells in the first direction is 1 μm. Of course, in practical applications, the widths of the light emitting units and the non-light emitting regions in the first direction may be set according to the requirements of the practical applications, which are not limited herein.

In this embodiment, as shown in fig. 5, the first color resist layer 41, the second color resist layer 42 and the third color resist layer 43 are regular hexagons sequentially arranged in the AA direction, and an overlapping region exists between two adjacent color resist layers. Of course, in some embodiments, the color resists (the first color resist 41, the second color resist 42, and the third color resist 43) may be any regular polygon or circle.

Based on the same inventive concept, embodiments of the present application provide a display device including the above display panel. The display device comprises the display panel, so that the display device has the same beneficial technical effects as the display panel. Therefore, the beneficial effects of the display device will not be repeated here.

In embodiments of the present application, the display apparatus includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable device, a navigation display device, and the like.

Based on the same inventive concept, the embodiment of the present application provides a method for manufacturing a display panel, a flow chart of the method is shown in fig. 9, and the method includes:

s101: providing a substrate base plate 10;

s102: manufacturing a light-emitting device layer 12 on one side of a substrate 10, wherein the light-emitting device layer 12 comprises a plurality of light-emitting units arranged in an array;

s103: and a color film layer 4 is manufactured on one side of the light-emitting device layer 12 far away from the substrate 1, the color film layer 4 comprises a plurality of color resistance layers, the color resistance layers are in one-to-one correspondence with the light-emitting units, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers.

Specifically, in the two adjacent color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate.

In a specific embodiment, before the color film layer is formed on the side of the light emitting device layer 12 away from the 1-substrate, the method further includes: manufacturing a packaging layer 3 on one side of the light-emitting device layer 12 away from the substrate 1; the specific manufacturing method of the encapsulation layer 3 is similar to the prior art, and will not be described here again.

Further, after the color film layer is manufactured on the side, far away from the substrate, of the light-emitting device layer, the method further comprises: manufacturing a flat layer on one side of the color film layer far away from the substrate base plate; and manufacturing an electron microscope layer on one side of the flat layer, which is far away from the substrate, wherein the electron microscope layer comprises a plurality of prisms which are arranged in an array, the prisms are arranged in one-to-one correspondence with the light emitting units, orthographic projections of junctions of adjacent prisms on the substrate are positioned in the overlapping area, and the junctions of the adjacent prisms are staggered with the central line of the overlapping area.

In a specific embodiment, the color film layer is manufactured on the side of the light emitting device layer 12 away from the substrate 1, and includes: coating a first color resistance material on one side of the packaging layer far away from the substrate, exposing the first color resistance material by positive exposure, developing to form a plurality of first color resistance layers, and forming a chamfer structure at the edge of the first color resistance layer far away from the substrate; coating a second color resistance material on one side of the packaging layer far away from the substrate, exposing the second color resistance material by adopting negative exposure, developing to form a plurality of second color resistance layers, wherein the second color resistance layers at least cover part of the area of the chamfer structure, and the edges of the second color resistance layers close to the substrate form an undercut structure; and coating a third color resistance material on one side of the packaging layer far away from the substrate, exposing the third color resistance material by adopting zero value exposure, developing to form a plurality of third color resistance layers, wherein the third color resistance layers at least cover part of areas of the chamfer structures, cover part of the second color resistance layers and fill the undercut structures.

The following describes in detail a specific manufacturing method of the color film layer in the embodiment of the application with reference to the accompanying drawings.

In a specific embodiment, the first color resist layer may be a blue color resist layer, the second color resist layer may be a green color resist layer, and the third color resist layer may be a red color resist layer.

Firstly, as shown in fig. 6, a blue resist material is coated on the upper surface of the encapsulation layer 3, and a positive exposure (for example, the exposure focal length (Focus) is selected to be 0-2) is adopted to expose the blue resist material, a plurality of blue resist layers (i.e., first color resist layers 41 in the figure) arranged in an array are formed after development, the shape of the blue resist layers is similar to a positive trapezoid structure, specifically, in a cross section perpendicular to the substrate 1, chamfer structures are respectively formed at two edges of the upper surface of the blue resist layers, in some embodiments, two edges of the upper surface of the blue resist layers are arc surfaces, and arc surfaces and tangent lines form a certain included angle with the bottom surface (i.e., with a horizontal plane) of the blue resist layers.

Then, as shown in fig. 7, a green resist material is coated on the upper surface of the encapsulation layer 3, and a negative exposure (for example, the exposure focal length (Focus) is selected to be-1-0) is adopted to expose the green resist material, a plurality of green resists (namely, a second color resist 42 in the figure) are formed after development, the green resists at least cover partial areas of adjacent blue resist chamfer structures, specifically, the green resists are similar to inverted trapezoid structures in shape, an undercut structure is formed at the right lower corner of the green resists along the cross section vertical to the substrate 1, in some embodiments, the upper surface of the undercut structure is a plane or an arc surface, and the tangent line of the plane or the arc surface forms an included angle with the lower surface of the second color resist, and the included angle is 120-150 °; the horizontal distance from the leftmost vertex of the undercut structure to the rightmost point of the second color resist layer is 0.2 micrometers to 0.5 micrometers.

Finally, as shown in fig. 8, a red resist material is coated on the upper surface of the encapsulation layer 3, and a plurality of red resist layers (i.e., the third resist layer 43 in the figure) are formed after development by exposing the red resist material with zero value exposure (for example, the exposure focal length (Focus) value is selected to be 0), wherein the red resist layer covers at least a partial region of the chamfer structure of the blue resist layer and a partial region of the upper surface of the green resist layer, and fills the undercut structure formed by the green resist layer.

In another specific embodiment, the first color resist layer may be a red color resist layer, the second color resist layer may be a green color resist layer, and the third color resist layer may be a blue color resist layer. Firstly, coating a red color resistance material on the upper surface of a packaging layer 3, adopting positive exposure (for example, the value of exposure focal length (Focus) is selected to be 0-2) to the red color resistance material, and developing to form a plurality of red color resistance layers arranged in an array; then, a green resist material is coated on the upper surface of the encapsulation layer 3, and negative exposure (for example, exposure focal length (Focus) value is selected to be-1-0) is adopted on the green resist material, and a plurality of green resist layers are formed after development. Finally, a blue color resistance material is coated on the upper surface of the packaging layer 3, zero value exposure (for example, the value of exposure focal length (Focus) is selected to be 0) is adopted for the blue color resistance material, and a plurality of blue color resistance layers are formed after development.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

the display panel in the embodiment of the application comprises the color film layer, the color film layer comprises a plurality of color resistance layers, the colors of adjacent color resistance layers are different, and an overlapping area exists in the adjacent color resistance layers, and because the overlapping area is arranged between the adjacent color resistance layers, the overlapping area comprises an upper color resistance layer and a lower color resistance layer with different colors, scattered light emitted by adjacent light emitting units can be filtered, the problem of light string position among pixels is weakened, the overlapping color resistance is adopted to replace BM, the problems that the BM structure is weak in adhesive force with the lower film layer and easy to fall off are solved, the color gamut of the display panel is improved, the stability of a shading structure is increased, the light leakage probability of the display panel is reduced, and the product quality and the reliability are improved; in addition, in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer close to the substrate, so that the adhesive force of an overlapping area between the adjacent color resistances can be further enhanced.

Those of skill in the art will appreciate that the various operations, methods, steps in the flow, actions, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed in this application may be alternated, altered, rearranged, split, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for a person skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.

Claims (13)

1. A display panel, comprising:

a substrate base;

the light-emitting device layer is positioned on one side of the substrate and comprises a plurality of light-emitting units which are arranged in an array manner;

the color film layer is positioned on one side of the light-emitting device layer far away from the substrate base plate and comprises a plurality of color resistance layers, the color resistance layers are in one-to-one correspondence with the light-emitting units, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers; wherein:

and in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate.

2. The display panel of claim 1, wherein an orthographic projection of the chamfer structure on the substrate base plate overlaps an orthographic projection of the overlap region on the substrate base plate;

the orthographic projection of the undercut structure on the substrate base plate overlaps with the orthographic projection of the overlapping region on the substrate base plate.

3. The display panel of claim 2, wherein an orthographic projection of the chamfer structure on the substrate base plate falls within an orthographic projection of the overlap region on the substrate base plate;

The orthographic projection of the undercut structure on the substrate falls into the orthographic projection of the overlapping region on the substrate.

4. The display panel of claim 1, wherein the color film layer comprises a plurality of first color resist layers, a plurality of second color resist layers, and a plurality of third color resist layers, wherein the first color resist layers, the second color resist layers, and the third color resist layers are different in color;

a chamfer structure is arranged at the edge of the first color resistance layer far away from the substrate, and an undercut structure is arranged at the edge of the second color resistance layer near the substrate;

at the overlapping position of the first color resistance layer and the second color resistance layer, the second color resistance layer covers the first color resistance layer;

at the overlapping position of the third color resistance layer and the first color resistance layer, the third color resistance layer covers the first color resistance layer;

and at the overlapping position of the third color resistance layer and the second color resistance layer, the third color resistance layer covers the second color resistance layer, and the third color resistance layer fills the undercut structure of the second color resistance layer.

5. The display panel of claim 4, wherein the first color resist layer is a red color resist, the second color resist layer is a green color resist, and the third color resist layer is a blue color resist;

Or the first color resistance layer is red color resistance, the second color resistance layer is blue color resistance, and the third color resistance layer is green color resistance;

or the first color resistance layer is green color resistance, the second color resistance layer is blue color resistance, and the third color resistance layer is red color resistance;

or the first color resistance layer is green color resistance, the second color resistance layer is red color resistance, and the third color resistance layer is blue color resistance;

or the first color resistance layer is blue color resistance, the second color resistance layer is red color resistance, and the third color resistance layer is green color resistance;

or the first color resistance layer is blue color resistance, the second color resistance layer is green color resistance, and the third color resistance layer is red color resistance.

6. The display panel of claim 4, wherein the display panel comprises,

the chamfering structure is a chamfering angle, and an angle formed between a tangent line of the chamfering angle and one surface of the first color resistance layer, which is close to the substrate, is 0-85 degrees;

the undercut structure is arc-shaped, and an included angle between a tangent line of the arc shape and the substrate base plate is 30-60 degrees;

the width of the color resistance layer along the direction parallel to the upper surface of the substrate base plate is 5 micrometers-6 micrometers;

The thickness of the color resistance layer along the direction vertical to the upper surface of the substrate base plate is 1 micrometers-1.4 micrometers;

the overlapping area of the color resistance layer is 0.35-1 micrometer in width along the direction parallel to the upper surface of the substrate.

7. The display panel according to any one of claims 1 to 6, wherein,

a non-light-emitting area is arranged between adjacent light-emitting units;

the orthographic projection of the overlapped area on the light-emitting device layer is positioned in the non-light-emitting area.

8. The display panel of claim 1, further comprising an encapsulation layer and a driving circuit layer;

the packaging layer is positioned between the light-emitting device layer and the color film layer;

the driving circuit layer is positioned on one side of the light emitting device layer, which is close to the substrate base plate.

9. The display panel of claim 1, further comprising:

the flat layer is positioned at one side of the color film layer far away from the substrate base plate;

the electron microscope layer is located one side of the flat layer far away from the substrate base plate and comprises a plurality of prisms which are arranged in an array mode, the prisms are arranged in one-to-one correspondence with the light emitting units, orthographic projections of junctions of adjacent prisms on the substrate base plate are located in the overlapping area, and junctions of adjacent prisms are staggered with the central line of the overlapping area.

10. A display device, comprising: the display panel according to any of the preceding claims 1-9.

11. A method for manufacturing a display panel, comprising:

providing a substrate base plate;

manufacturing a light-emitting device layer on one side of the substrate, wherein the light-emitting device layer comprises a plurality of light-emitting units which are arranged in an array manner;

manufacturing a color film layer on one side of the light-emitting device layer far away from the substrate, wherein the color film layer comprises a plurality of color resistance layers, the color resistance layers are in one-to-one correspondence with the light-emitting units, the colors of adjacent color resistance layers are different, and overlapping areas exist in the adjacent color resistance layers; wherein: and in the adjacent two color resistance layers, a chamfer structure is arranged at the edge of one color resistance layer far away from the substrate, and/or an undercut structure is arranged at the edge of the other color resistance layer near the substrate.

12. The method of manufacturing according to claim 11, wherein before the step of manufacturing the color film layer on the side of the light emitting device layer away from the substrate, the method further comprises:

manufacturing a packaging layer on one side of the light-emitting device layer far away from the substrate base plate;

after the color film layer is manufactured on one side of the light emitting device layer away from the substrate base plate, the method further comprises:

Manufacturing a flat layer on one side of the color film layer far away from the substrate base plate;

and manufacturing an electron microscope layer on one side of the flat layer, which is far away from the substrate, wherein the electron microscope layer comprises a plurality of prisms which are arranged in an array, the prisms are arranged in one-to-one correspondence with the light emitting units, orthographic projections of the junctions of adjacent prisms on the substrate are positioned in the overlapping area, and the junctions of adjacent prisms are staggered with the central line of the overlapping area.

13. The method of claim 12, wherein fabricating a color film layer on a side of the light emitting device layer away from the substrate comprises:

coating a first color resistance material on one side of the packaging layer far away from the substrate, exposing the first color resistance material by positive exposure, developing to form a plurality of first color resistance layers, and forming a chamfer structure at the edge of the first color resistance layer far away from the substrate;

coating a second color resistance material on one side of the packaging layer far away from the substrate, exposing the second color resistance material by adopting negative exposure, developing to form a plurality of second color resistance layers, wherein the second color resistance layers at least cover partial areas of the chamfer structures, and the edges of the second color resistance layers close to the substrate form undercut structures;

And coating a third color resistance material on one side of the packaging layer far away from the substrate, exposing the third color resistance material by adopting zero value exposure, developing to form a plurality of third color resistance layers, wherein the third color resistance layers at least cover part of areas of the chamfer structures, cover part of the second color resistance layers, and fill the undercut structures.